A pre-cooling device

Abstract

The utility model relates to refrigeration equipment technical field discloses a device of pre -cooling, include: ice maker, be equipped with the pipeline of continuous bending setting in water cooling board, pre -cooling device includes first semiconductor refrigeration piece, first radiating aluminium material and first radiating fan, the cold face of first semiconductor refrigeration piece and the first end surface of water cooling board are pasted, and the hot face of first semiconductor refrigeration piece and first radiating aluminium material are pasted. The utility model realizes to the liquid pre -cooling before the ice making of ice maker, reduces liquid temperature to save the energy consumption of compressor, prolongs the service life of compressor.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a pre-cooling device. Background Technology

[0002] In the traditional refrigeration field, compression refrigeration systems dominate. Currently, the ice maker and cold chain equipment industries generally face the following technical challenges:

[0003] Conventional compressor refrigeration systems have significant thermal inertia during startup, resulting in a long time required for the water temperature to drop from room temperature to freezing point. Evaporator precooling methods suffer from low heat exchange efficiency and high energy consumption. They rely on chemical refrigerants such as Freon and require phase change heat absorption to achieve cooling, but the compression process consumes significant energy.

[0004] Therefore, improvements are needed. Utility Model Content

[0005] The technical problem solved by this utility model is to address the deficiencies in the prior art by providing a pre-cooling device to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a pre-cooling device, comprising: an ice maker, wherein the ice maker is provided with a water inlet pipe; a water-cooled plate, wherein the water-cooled plate is provided with a continuously curved pipe, the pipe being connected to the water inlet pipe; and a pre-cooling device, wherein the pre-cooling device includes a first semiconductor refrigeration chip disposed on a first end face of the water-cooled plate, a first heat dissipation aluminum material disposed on the first semiconductor refrigeration chip, and a first heat dissipation fan disposed on the first heat dissipation aluminum material; wherein the number of the first semiconductor refrigeration chips is one or more, the cold surface of the first semiconductor refrigeration chip is in contact with the first end face of the water-cooled plate, and the hot surface of the first semiconductor refrigeration chip is in contact with the first heat dissipation aluminum material.

[0007] Furthermore, there are two first semiconductor cooling chips, which are arranged adjacent to each other, and the first heat dissipation aluminum material is in contact with the hot surfaces of the two first semiconductors.

[0008] Furthermore, it includes a first bracket, which includes a first plate and a first leg connected to the first plate. The first leg is connected to the first end face of the water-cooled plate. The first plate has an opening corresponding to the position of the first cooling fan. The lower end face of the first plate presses against the first heat-dissipating aluminum material.

[0009] Furthermore, the pre-cooling device includes a second semiconductor refrigeration chip disposed on the second end face of the water-cooled plate, a second heat dissipation aluminum material disposed on the second semiconductor refrigeration chip, and a second heat dissipation fan disposed on the second heat dissipation aluminum material; wherein, the number of the second semiconductor refrigeration chips is one or more, the cold side of the second semiconductor refrigeration chip is in contact with the second end face of the water-cooled plate, and the hot side of the second semiconductor refrigeration chip is in contact with the second heat dissipation aluminum material.

[0010] Furthermore, it includes a second bracket, which includes a second plate and a second leg connected to the second plate. The second leg is connected to the second end face of the water-cooled plate. The second plate has an opening corresponding to the position of the second cooling fan. The lower end face of the second plate presses against the second heat-dissipating aluminum material.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] Shorten cooling time and improve cooling efficiency: The pre-cooling device of this utility model adopts a semiconductor cooling chip, which can start up quickly and generate cooling capacity, which directly acts on the water cooling plate, thereby rapidly reducing the temperature of the water in the inlet pipe. This effectively overcomes the thermal inertia problem during the start-up of traditional refrigeration systems, greatly shortens the time required for the water temperature to drop to the freezing point, and improves the overall cooling efficiency.

[0013] Extending compressor life: Traditional ice makers rely on chemical refrigerants such as Freon, achieving cooling through phase change heat absorption, but the compression process consumes significant energy. This invention employs semiconductor refrigeration technology, eliminating the need for compression and directly utilizing the Peltier effect of semiconductors to achieve cooling, thus reducing the high energy consumption associated with compression and lowering overall energy consumption. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the pre-cooling device and water-cooled plate structure.

[0016] Figure 3 This is a schematic diagram of the pre-cooling device and water-cooled plate structure.

[0017] Figure 4 This is an exploded structural diagram of the pre-cooling device and water-cooled plate.

[0018] Figure 5 This is a schematic diagram of the cross-sectional structure of the water-cooled plate.

[0019] Reference numerals: 1. Ice maker; 2. Water-cooled plate; 3. Pipe; 4. Pre-cooling device; 5. First semiconductor refrigeration chip; 6. First heat dissipation aluminum material; 7. First cooling fan; 8. First bracket; 9. First plate; 10. First leg; 11. Second semiconductor refrigeration chip; 12. Second heat dissipation aluminum material; 13. Second cooling fan; 14. Second bracket; 15. Second plate; 16. Second leg. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings.

[0021] The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "several" or "more than" means two or more, unless otherwise explicitly specified. In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In this application, unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. Moreover, "above," "over," and "on top" of a second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] In view of the technical problems described in the background art, as shown in the figure, a pre-cooling device is provided, comprising: an ice maker 1, wherein the ice maker 1 is provided with a water inlet pipe 3; a water-cooled plate 2, wherein the water-cooled plate 2 is provided with a continuously curved pipe 3, the pipe 3 being connected to the water inlet pipe 3; and a pre-cooling device 4, wherein the pre-cooling device 4 includes a first semiconductor cooling chip 5 disposed on a first end face of the water-cooled plate 2, a first heat dissipation aluminum material 6 disposed on the first semiconductor cooling chip 5, and a first cooling fan 7 disposed on the first heat dissipation aluminum material 6; wherein the number of the first semiconductor cooling chip 5 is one or more, the cold side of the first semiconductor cooling chip 5 is in contact with the first end face of the water-cooled plate 2, and the hot side of the first semiconductor cooling chip 5 is in contact with the first heat dissipation aluminum material 6.

[0023] This utility model discloses a pre-cooling device, mainly composed of an ice maker 1, a water-cooled plate 2, and a pre-cooling device 4. The ice maker 1 is equipped with a water inlet pipe 3 for introducing water to be cooled. The water-cooled plate 2 has continuously curved pipes 3 connected to the water inlet pipe 3, allowing water entering the ice maker 1 to flow through these pipes. The pre-cooling device 4 generates cooling energy and cools the water-cooled plate 2, thereby lowering the temperature of the water flowing through the pipes 3.

[0024] Ice maker 1 adopts the structure of commonly available ice-making equipment, and the diameter and material of its water inlet pipe 3 are selected according to actual needs. Ice maker 1 retains traditional ice-making systems, such as compressors, condensers, expansion valves, evaporators, and other components.

[0025] The water-cooled plate 2 is made of a metal material with good thermal conductivity, such as aluminum alloy. Aluminum alloy has the advantages of being lightweight and having a high thermal conductivity, which can quickly transfer the cooling energy generated by the semiconductor cooling chip to the water flowing through the pipe 3. The pipe 3 inside the water-cooled plate 2 is designed with continuous bends to increase the contact area between the water and the water-cooled plate 2 and improve the heat exchange efficiency. The specific bend shape can be optimized according to the size and shape of the water-cooled plate 2, for example, by using a spiral bend or a serpentine bend.

[0026] As an feasible technical solution, a pre-cooling device 4 is provided on the first end face of the water-cooled plate 2. The pre-cooling device 4 includes a first semiconductor cooling chip 5, a first heat-dissipating aluminum material 6, and a first cooling fan 7.

[0027] The number of first semiconductor cooling chips 5 is determined according to the cooling requirements and the size of the water-cooled plate 2, and in this embodiment, two chips are used. The two first semiconductor cooling chips 5 are arranged adjacent to each other on the first end face of the water-cooled plate 2, with their cold surfaces in close contact with the first end face of the water-cooled plate 2 to ensure efficient transfer of cooling energy to the water-cooled plate 2. The first semiconductor cooling chips 5 are selected from commercially available products with stable performance and high cooling efficiency, and their cooling power can be selected according to actual needs.

[0028] The first heat-dissipating aluminum material 6 is in contact with the hot surfaces of the two first semiconductor cooling chips 5, and is used to conduct away the heat generated by the semiconductor cooling chips. The first heat-dissipating aluminum material 6 adopts a finned structure to increase the heat dissipation area and improve heat dissipation efficiency. The spacing of the fins can be designed according to the heat dissipation requirements.

[0029] The first cooling fan 7 is mounted on the first heat-dissipating aluminum material 6 to accelerate airflow and dissipate heat from the aluminum material 6 into the surrounding environment. The model of the first cooling fan 7 is selected according to the heat dissipation requirements, and its airflow and air pressure must meet the heat dissipation requirements.

[0030] In a preferred embodiment, the present invention includes a first bracket 8, the first bracket 8 including a first plate 9 and a first leg 10 connected to the first plate 9, the first leg 10 being connected to the first end face of the water-cooled plate 2, the first plate 9 having an opening corresponding to the position of the first cooling fan 7, and the lower end face of the first plate 9 pressing the first heat-dissipating aluminum material 6.

[0031] The first support 8 includes a first plate 9 and a first leg 10. The first leg 10 is bolted to the first end face of the water-cooled plate 2 to ensure the stability of the first support 8. The first plate 9 has openings corresponding to the position of the first cooling fan 7 to ensure normal ventilation and heat dissipation of the first cooling fan 7. The lower end face of the first plate 9 presses against the first heat dissipation aluminum material 6, so that the first heat dissipation aluminum material 6 is in close contact with the hot surface of the first semiconductor cooling chip 5, thereby improving heat conduction efficiency.

[0032] The specific operating process is as follows: When the device starts working, the first semiconductor cooling chip 5 of the pre-cooling device 4 begins to operate, generating cooling energy using the Peltier effect of the semiconductor. This cooling energy is transferred to the water-cooled plate 2 through the cold surface. The water-cooled plate 2 then transfers the cooling energy to the water flowing through the pipe 3, lowering the water temperature. The heat generated by the first semiconductor cooling chip 5 is transferred to the first heat dissipation aluminum material 6 through the hot surface. The first cooling fan 7 accelerates airflow, dissipating the heat into the surrounding environment and ensuring the semiconductor cooling chip can operate continuously and stably. The water cooled by the water-cooled plate 2 then enters the ice maker 1 for ice making.

[0033] The above technical solution shortens the cooling time and improves the cooling efficiency: The pre-cooling device 4 of this utility model adopts a semiconductor cooling chip, which can start up quickly and generate cooling capacity, which directly acts on the water cooling plate 2, thereby quickly reducing the temperature of the water in the inlet pipe 3. This effectively overcomes the thermal inertia problem when the traditional refrigeration system starts up, greatly shortens the time required for the water temperature to drop to the freezing point, and improves the overall cooling efficiency.

[0034] Extending compressor life: Traditional ice makers rely on chemical refrigerants such as Freon, achieving cooling through phase change heat absorption, but the compression process consumes significant energy. This invention uses semiconductor refrigeration technology, eliminating the need for compression and directly utilizing the Peltier effect of semiconductors to achieve cooling, reducing the high energy consumption associated with compression and lowering overall energy consumption.

[0035] As shown in the figure, the pre-cooling device 4 includes a second semiconductor cooling chip 11 disposed on the second end face of the water-cooled plate 2, a second heat dissipation aluminum material 12 disposed on the second semiconductor cooling chip 11, and a second heat dissipation fan 13 disposed on the second heat dissipation aluminum material 12; wherein, the number of the second semiconductor cooling chip 11 is more than one, the cold side of the second semiconductor cooling chip 11 is in contact with the second end face of the water-cooled plate 2, and the hot side of the second semiconductor cooling chip 11 is in contact with the second heat dissipation aluminum material 12.

[0036] As a preferred technical solution, if further improvement in cooling efficiency is required, a second semiconductor cooling chip 11 can be provided on the second end face of the water-cooled plate 2. The number of second semiconductor cooling chips 11 can also be one or more, and in this embodiment, two can also be used. The two second semiconductor cooling chips 11 are arranged adjacent to each other, with their cold surfaces in contact with the second end face of the water-cooled plate 2 and their hot surfaces in contact with the second heat dissipation aluminum material 12.

[0037] The second heat dissipation aluminum material 12 has the same structure and material as the first heat dissipation aluminum material 6, adopting a finned structure and being tightly connected to the hot surface of the second thermoelectric cooler 11 for heat conduction. The second cooling fan 13 is mounted on the second heat dissipation aluminum material 12, and its model and performance requirements are consistent with the first cooling fan 7, used to accelerate the heat dissipation of the second heat dissipation aluminum material 12. The second bracket 14 includes a second plate 15 and a second leg 16. The second leg 16 is bolted to the second end face of the water-cooled plate 2. The second plate 15 has openings corresponding to the position of the second cooling fan 13. The lower end face of the second plate 15 presses against the second heat dissipation aluminum material 12, ensuring close contact between the second heat dissipation aluminum material 12 and the hot surface of the second thermoelectric cooler 11.

[0038] The above does not limit the technical scope of this utility model. Any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A pre-cooling device, characterized in that, include: An ice maker, wherein the ice maker is equipped with a water inlet pipe; A water-cooled plate, wherein a continuously curved pipe is provided inside the water-cooled plate, and the pipe is connected to the water inlet pipe; A pre-cooling device includes a first semiconductor refrigeration chip disposed on the first end face of the water-cooled plate, a first heat dissipation aluminum material disposed on the first semiconductor refrigeration chip, and a first heat dissipation fan disposed on the first heat dissipation aluminum material; wherein, the number of the first semiconductor refrigeration chips is one or more, the cold side of the first semiconductor refrigeration chip is in contact with the first end face of the water-cooled plate, and the hot side of the first semiconductor refrigeration chip is in contact with the first heat dissipation aluminum material.

2. The pre-cooling device according to claim 1, characterized in that: The number of the first semiconductor cooling chips is two, and the first semiconductor cooling chips are arranged adjacent to each other. The first heat dissipation aluminum material is in contact with the hot surface of the two first semiconductors.

3. The pre-cooling device according to claim 2, characterized in that: The first bracket includes a first plate and a first leg connected to the first plate. The first leg is connected to the first end face of the water-cooled plate. The first plate has an opening corresponding to the position of the first cooling fan. The lower end face of the first plate presses against the first heat-dissipating aluminum material.

4. The pre-cooling device according to claim 1, characterized in that: The pre-cooling device includes a second semiconductor refrigeration chip disposed on the second end face of the water-cooled plate, a second heat dissipation aluminum material disposed on the second semiconductor refrigeration chip, and a second heat dissipation fan disposed on the second heat dissipation aluminum material; wherein, the number of the second semiconductor refrigeration chips is one or more, the cold side of the second semiconductor refrigeration chip is in contact with the second end face of the water-cooled plate, and the hot side of the second semiconductor refrigeration chip is in contact with the second heat dissipation aluminum material.

5. The pre-cooling device according to claim 4, characterized in that: The device includes a second bracket, which includes a second plate and a second leg connected to the second plate. The second leg is connected to the second end face of the water-cooled plate. The second plate has an opening corresponding to the position of the second cooling fan. The lower end face of the second plate presses against the second heat-dissipating aluminum material.

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