A refrigeration appliance

Abstract

The utility model discloses a refrigeration equipment relates to refrigeration technical field. The refrigeration equipment includes the inner container, and the inner container surrounds and sets up to form the storage room, the refrigeration system is from the outside of the inner container to the storage room with the direct cooling mode and provides the cold quantity, the air supply module, the air supply module is located in the storage room. At least one air duct cover, cover is located in the inner container and with the inner container jointly defines the return air passage, the air duct cover includes the mainboard and from the mainboard to the direction of away from the mainboard and extends at least one vice board, the return air passage includes between the mainboard and the inner container and with the air supply module intercommunication main air duct, between the vice board and the inner container and with the storage room intercommunication sub air duct, wherein, at least a part of the sub air duct is along the direction of away from the main air duct and extends upwards or downwards, and by adopting the technology that the utility model provides, can effectively improve the heat exchange efficiency.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, and in particular to a refrigeration device. Background Technology

[0002] Refrigeration equipment primarily relies on natural air convection to radiate the cooling capacity of the evaporator. However, this direct cooling method can easily lead to uneven distribution of cooling capacity within larger refrigeration units. Specifically, denser cold air naturally settles at the bottom of the unit, while less dense warm air floats to the top, resulting in a significant vertical temperature difference. Consequently, the bottom layer of the unit becomes over-frozen, while the middle and upper layers fail to reach the required freezing temperature. This is especially true for refrigeration units with large openings, where a large influx of warm air rushes in and remains on the upper layers when items are retrieved, further exacerbating the vertical temperature difference. Utility Model Content

[0003] The purpose of this invention is to provide a refrigeration device that solves the problem that the limited cooling capacity carried by the circulation in the prior art cannot meet the temperature reduction rate requirements of various areas inside the cabinet.

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a refrigeration device, comprising an inner liner forming a storage compartment; a refrigeration system providing cooling capacity to the storage compartment from the outside of the inner liner via direct cooling; and an air supply module located within the storage compartment. At least one air duct cover is disposed over the inner liner and together with the inner liner defines a return air passage. The air duct cover includes a main plate and at least one secondary plate extending from the main plate in a direction away from the main plate. The return air passage includes a main air duct located between the main plate and the inner liner and communicating with the air supply module, and a sub-air duct located between the secondary plate and the inner liner and communicating with the storage compartment. At least a portion of the sub-air duct extends upward or downward in a direction away from the main air duct.

[0005] By adopting the above technical solution, at least a portion of the sub-air duct is made to have varying heights along a direction away from the main air duct, thereby increasing the contact span and heat exchange area between the return air duct and the inner liner surface in terms of height, thus improving the heat exchange efficiency.

[0006] Furthermore, the return air channel constructed by the aforementioned sub-ducts and main duct with elevation differences can further define the flow path of the cold air. Compared to sub-ducts where the height is the same at the end furthest from the main board and the end closest to the main board, the aforementioned sub-ducts with elevation differences can guide the cold airflow through their height variations to achieve directional airflow and reduce dead zones.

[0007] The duct cover and air supply module can construct a cold air circulation system within the storage room. Specifically, the sub-ducts are connected to the storage room, the main duct is connected to the air supply module, and the air supply module is connected to the storage room. This achieves efficient and uniform forced convection within the storage room, ensuring sufficient cooling capacity is evenly distributed to all areas requiring cooling. Compared to natural convection, this cold air circulation system effectively solves the problems of large temperature differences and easy frosting (common in direct cooling systems) in different areas of the storage room, thus achieving rapid cooling for each area.

[0008] In some implementations, the end of the sub-duct furthest from the main duct is higher than the end of the sub-duct closest to the main duct. Alternatively, the end of the sub-duct furthest from the main duct is lower than the end of the sub-duct closest to the main duct.

[0009] In some embodiments, the sub-duct includes a first end close to the main duct and a second end away from the main duct, wherein the angle between the line connecting the first end and the second end and the height direction of the inner liner is 65° to 85°.

[0010] In some implementations, the sub-duct is arc-shaped or straight.

[0011] In some embodiments, the duct cover includes at least two of the sub-plates, and the at least two sub-plates extend from the main plate in different directions away from the main plate; at least a portion of the sub-plates extends upward or downward in a direction away from the main duct.

[0012] In some embodiments, the two sub-plates are symmetrically arranged on both sides of the main plate; and / or, the included angle between two adjacent sub-plates is 130° to 170°.

[0013] In some embodiments, the sub-plate and / or the main plate are recessed inward along the thickness direction away from the inner liner to form a cavity, wherein one or more mounting holes are provided in the recess of the sub-plate and / or the main plate.

[0014] In some implementations, the air supply module defines an air supply channel communicating with the main air duct, wherein the height h of the return air channel and the height h of the air supply channel satisfy the following relationship: .

[0015] In some implementations, the motherboard is further provided with a tube protruding in the direction away from the inner liner on the side facing the air supply module, and the tube defines a main air outlet for connecting the air supply channel and the main air duct; wherein, the tube is provided with a limiting protrusion that can engage with the air supply module.

[0016] In some embodiments, the main board is provided with a mounting guide groove on the side away from the air supply module for engaging with the air supply module. The mounting guide groove is recessed or protruding along the direction of the main board away from the inner liner, wherein at least one of the contact surfaces between the mounting guide groove and the air supply module includes an inclined surface. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a refrigeration device according to an embodiment of the present invention; Figure 2 yes Figure 1 A diagram from another perspective; Figure 3 yes Figure 2 A partial sectional view of AA; Figure 4 This is a schematic diagram showing the connection between the air supply module and the duct cover plate according to an embodiment of the present invention; Figure 5 yes Figure 4 A partial schematic diagram of section B; Figure 6 This is another connection diagram of the air supply module and the air duct cover according to one embodiment of the present utility model; Figure 7 yes Figure 5 A diagram from another perspective; Figure 8 yes Figure 6 A magnified view of part C in the middle; Figure 9 This is a three-dimensional structural schematic diagram of a duct cover plate according to an embodiment of the present utility model; Figure 10 yes Figure 9 Side view; Figure 11 yes Figure 9 The main view; Figure 12 A front view of a duct cover plate according to another embodiment of the present invention; Figure 13 Front view of the duct cover plate of another embodiment of the present invention Figure 2 ; Figure 14 Front view of the duct cover plate of another embodiment of the present invention Figure 3 ; Explanation of reference numerals in the attached figures: 1. Inner liner; 10. Storage compartment; 2. Evaporator; 3. Air supply module; 30. Air supply duct; 31. Fan assembly; 32. Air outlet; 4. Duct cover; 40. Main board; 400. Pipe body; 401. Main air outlet; 402. Limiting protrusion; 403. Mounting guide groove; 404. Inclined surface; 41. Sub-plate; 42. Mounting hole; 5. Return air duct; 50. Main air duct; 51. Sub-air duct. Detailed Implementation

[0018] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a deep understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0019] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in during use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0020] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0021] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0022] Please see Figures 1 to 3 As shown, the refrigeration equipment provided in this application includes an inner liner 1 and a refrigeration system. The inner liner 1 forms a storage compartment 10; the refrigeration system provides cooling to the storage compartment 10 from the outside of the inner liner 1 (the side of the inner liner 1 facing away from the storage compartment 10) in a direct cooling manner.

[0023] For example, the refrigeration system includes a refrigeration circuit and a refrigerant. The refrigeration circuit consists of a compressor, a condenser, a throttling element, and an evaporator 2. The evaporator 2 is located on the outer wall of the inner liner 12 to deliver cooling capacity to the storage compartment 10 in a direct cooling manner.

[0024] Combination Figure 3 As shown, the evaporator 2 includes evaporator tubes arranged around the outside of the inner liner 1 (the side of the inner liner 1 facing away from the storage compartment 10). The evaporator tubes are arranged along the height of the inner liner 1 and are used to transfer cold energy to the storage compartment 10 by natural radiation.

[0025] See Figures 1 to 4 As shown, one or more air supply modules 3 are also installed in the storage room 10. The air supply module 3 can... Figure 1 Extending in the Y direction, it connects to the two liner walls of the inner liner 1 that are positioned opposite each other in this direction. When the storage compartment 10 has multiple air supply modules 3, the multiple air supply modules 3 extend along... Figure 1 The X-axis interval is set. Alternatively, the air supply module 3 can be set along... Figure 1 It extends in the X direction and connects with the two gallbladder walls of the inner liner 1 that are positioned opposite each other in this direction.

[0026] Furthermore, the refrigeration equipment includes at least one duct cover 4, which covers the inner liner 1 and together with the inner liner 1 defines a return air passage 5. The duct cover 4 includes a main plate 40 and at least one secondary plate 41 extending from the main plate 40 in a direction away from the main plate 40. The return air passage 5 includes a main air passage 50 located between the main plate 40 and the inner liner 1 and communicating with the air supply module 3, and a sub-air passage 51 located between the secondary plate 41 and the inner liner 1 and communicating with the storage compartment 10.

[0027] By connecting the air supply module 3 and the air duct cover plate 4, a cold air circulation system is constructed, in which the sub-air duct 51 is connected to the storage room 10, the main air duct 50 is connected to the air supply module 3, and the air supply module 3 is connected to the storage room 10. This system enables efficient and uniform forced convection within the storage room 10, ensuring that sufficient cooling capacity can be uniformly delivered to all cooling areas of the storage room 10.

[0028] For example, the duct cover plate 4 can be formed by bending, stamping or welding to create a recessed cavity on the side opposite to the inner liner 1. The recessed cavity and the wall of the inner liner 1 together define the main duct 50 and the sub-duct 51 that are interconnected.

[0029] Specifically, at least a portion of the main board 40 is recessed inward in the direction away from the inner liner 1 to form the main air duct 50; at least a portion of the secondary board 41 is recessed inward in the direction away from the inner liner 1 to form the sub-air duct 51.

[0030] In another possible embodiment, the inner liner 1 has a cavity matching the air duct cover 4 on the side away from the air duct cover 4, so that when the inner liner 1 is attached to the main board 40, it can define the main air duct 50 and when it is attached to the sub-board 41, it can define the sub-air duct 51.

[0031] It should be noted that, in the embodiments provided in this application, the main air duct 50 and the sub-air duct 51 are both... Figure 3 The concave structure of the central air duct cover 4 is defined by the surface of the inner liner 1, which provides greater installation flexibility and lower manufacturing cost. However, when the main air duct 50 and the sub-air duct 51 are defined by the concave structure of the inner liner 1 and the air duct cover 4, the same technical effect is achieved.

[0032] In order to fix the air duct cover 4 to the wall of the inner liner 1, in one specific embodiment, such as Figure 4 and Figure 5 As shown, one or more mounting holes 42 are provided in the recessed portion of the sub-plate 41 and / or the main plate 40. Exemplarily, the mounting holes 42 are arranged in the recessed portion ( Figure 5 (As shown in the shaded area), the air duct cover 4 is fixed to the wall of the inner liner 1 near its outer edge, for example, using pins, screws, or adhesive fasteners. This avoids the need for a flanged structure at the outer edge of the air duct cover 4. Furthermore, after the air duct cover 4 is fixed to the wall of the inner liner 1, it can be tightly arranged with other components (such as storage baskets, partitions, etc.).

[0033] See Figure 4 or Figure 6 As shown, the air supply module 3 includes, but is not limited to: a fan assembly 31, an air supply channel 30 connected to the main air outlet 401 of the air duct cover 4, and an air outlet 32 ​​connecting the storage room 10 and the air supply channel 30. When the fan assembly 31 is working, it can drive air from the return air channel 5 into the air supply channel 30, and then blow it out through the air outlet 32 ​​into the storage room 10.

[0034] Compared to traditional natural convection, the air supply module 3 uses a fan assembly 31 to drive air to circulate between the storage room 10, sub-air duct 51, main air duct 50, and air supply channel 30 to maintain temperature uniformity within the storage room 10. This effectively solves the problems of large temperature differences and easy frosting in different areas of the storage room 10 (direct cooling is prone to frosting), thus meeting the need for rapid cooling in various areas of the storage room 10.

[0035] Specifically, air in the storage compartment 10 flows into the sub-air duct 51 and exchanges heat with the wall of the inner liner 1 to become low-temperature air; the low-temperature air enters the air supply duct 30 through the main air duct 50 and finally flows back to the storage compartment 10 from the air supply duct 30. This cycle continues to ensure that the temperature of the storage compartment 10 is maintained within the set low-temperature range.

[0036] In one possible implementation, the air outlet 32 ​​along Figure 4 As shown in the Y direction, they are arranged on opposite sides of the air supply module 3 to direct air into the storage room 10 away from the air supply module 3. Figure 1 Air is supplied to both sides (as shown in the Y direction).

[0037] For example Figure 6 As shown, the air outlet 32 ​​is arranged along the Z direction at the top of the air supply module 3. The air duct cover 4 is connected to the air supply module 3 and is located on the side of the air supply module 3 away from the air outlet 32. This allows the air supply module 3 to drive the airflow from the relatively bottom (shown in the Z direction) of the storage compartment 10 into the sub-air duct 51 for heat exchange. After becoming cold air, it passes through the main air duct 50 and the air supply channel 30 in sequence and is blown out from the air outlet 32 ​​(relative top of the storage compartment 10), thereby effectively reducing the vertical temperature difference of the storage compartment 10.

[0038] To increase the airflow agitation within the storage compartment 10, the air outlet 32 ​​is elongated along the extension direction of the air supply module 3, forming a shape resembling... Figure 6 The diagram shows multiple arrays of through-holes.

[0039] In one specific implementation scheme, the cross-sectional layout of the evaporator tubes is as follows: Figure 3 As shown. By varying the height of the sub-duct 51 (at least a portion of which extends upward or downward away from the main duct 50), the number of evaporator tubes it can cross when extending upward or downward is the number that the highest point to the lowest point of the sub-duct 51 can cover.

[0040] Compared to the sub-duct 51 having the same height in both directions near and away from the main duct 50, the aforementioned height variation of the sub-duct 51 can reduce costs to some extent. Furthermore, without increasing additional manufacturing costs, the heat exchange area covered by the duct cover 4 within the inner liner 1 is increased.

[0041] In a specific application scenario, such as Figure 7 As shown, the air supply duct 30 is confined within the air supply module 3, and the height of the air supply duct 30 can be as follows: Figure 5 middle As shown, in the same direction (e.g.) Figure 1 (As shown in the Z-direction), the height of the return air duct 5 of the duct cover 4. This indicates the height difference between the lowest and highest points of the return air duct 5. The height of the air supply duct 30 of the aforementioned air supply module 3. Height of the aforementioned return air duct 30 Satisfying Relationship: .

[0042] By limiting the height of the return air duct 5 to less than half the height of the main air duct 50, the flow cross-sectional height of the return air duct 5 is smaller along the Z-direction than that of the main air duct 50. This dimensional ratio helps the airflow in the return air duct 5 to smoothly converge into the main air duct 50. This allows for a more uniform air supply environment within the main air duct 50, ensuring the stability of the airflow at the outlet of the main air duct 50.

[0043] The air supply module 3 may also include along Figure 4 The housing consists of two opposing housings that fasten together in the Y direction, thus defining the aforementioned air supply channel 30. The inner wall of the housing may have a protruding section such as... Figure 6 The diagram shows the air guiding structure and the volute housing for housing the aforementioned fan assembly 31. This application does not limit the specific internal air guiding structure; depending on actual air supply requirements, it can be configured to tilt along the X direction in the diagram from the volute housing towards the sides away from the volute housing.

[0044] In another possible implementation, the air supply duct 30 can be connected to multiple duct covers 4, that is, the air supply duct 30 can be connected to multiple return air ducts 5 to obtain a larger heat exchange area and meet the higher cooling rate requirements in the refrigeration equipment.

[0045] For example, such as Figure 4 or Figure 6 As shown, the main air duct 50 is symmetrically equipped with the aforementioned return air covers on both sides along the X direction. And as... Figure 1 As shown, the air duct cover 4 is installed on the wall of the inner liner 1 facing each other to ensure the heat exchange efficiency and convection intensity of the air supply module 3, so that the cold energy captured by the return air duct 5 can be evenly delivered by the air supply module 3 to each cooling area in the accommodating cavity.

[0046] like Figure 8 As shown, the motherboard 40 is also provided with a tube 400 protruding in the direction away from the inner liner 1 on the side facing the air supply module 3, and the tube 400 defines a main air outlet 401 for connecting the air supply channel 30 and the main air duct 50.

[0047] For example, the pipe body 400 can be integrally formed with the main board 40 and the sub-board 41 through processes such as stamping, welding, bending or extrusion molding. The pipe body 400 is at least partially embedded in the air supply module 3 to connect the return air channel 5 and the air supply channel 30, so as to prevent the cold air from leaking from the connection between the main board 40 and the air supply module 3.

[0048] The main board 40 and the sub-board 41 can be made of aluminum alloy with high thermal conductivity to ensure that the air duct cover 4 has high heat exchange efficiency.

[0049] In one embodiment, the pipe body 400 is provided with a limiting protrusion 402 that can engage with the air supply module 3. The limiting protrusion 402 is located on opposite sides of the pipe body 400 along the Y direction and is used to engage the pipe body 400 and the air supply module 3 to achieve precise positioning and installation between the duct cover 4 and the air supply module 3.

[0050] In another embodiment, the main board 40 has a mounting guide groove 403 on the side away from the air supply module 3 for engaging with the air supply module 3. The mounting guide groove 403 is recessed or protruding along the direction of the main board 40 away from the inner liner 1. This engagement method fixes the main board 40 and the air supply module 3, facilitating the installation and removal of the air duct cover 4 and the air supply module 3.

[0051] For example, at least one of the contact surfaces between the mounting guide groove 403 and the air supply module 3 includes an inclined surface 404. This allows the return air cover plate to be guided and positioned first through the inclined surface 404 when it mates with the air supply module 3, and then to engage with the mounting guide groove 403. That is, the duct cover plate 4 and the air supply module 3 can be installed in a sliding fit manner, further reducing the assembly difficulty of the two.

[0052] In another specific embodiment, the aforementioned limiting protrusion 402 cooperates with the mounting guide groove 403 to achieve mechanical interlocking between the air duct cover 4 and the air supply module 3, ensuring the installation stability of both.

[0053] The duct cover 4 also includes at least two sub-plates 41, and the at least two sub-plates 41 extend from the main plate 40 in different directions away from the main plate 40. Therefore, sub-ducts 51 extending in different directions can be formed, and the heat exchange effect can be adaptively adjusted according to the heat exchange requirements.

[0054] At least a portion of the sub-plate 41 extends upward or downward in a direction away from the main air duct 50, and the extension direction of the sub-plate 41 is consistent with the extension direction of the air duct, so as to save materials.

[0055] The two sub-plates 41 described above can be symmetrically arranged on both sides of the main plate 40 to construct sub-air ducts 51 symmetrically distributed on opposite sides of the main air duct 50. This achieves directional diversion of airflow within the return air duct 5, maintains the stability of the return air duct 5 during the return air process, and avoids eddies, flow deviations, or pressure unevenness that may occur due to asymmetrical fluids, thereby improving the overall return air efficiency of the return air duct 5.

[0056] Specifically, continue to combine Figure 7As shown, the two sub-plates 41 can be symmetrically arranged on both sides of the main plate 40 along the Y direction. The reason is that the temperature difference of the storage chamber 10 in the same horizontal (Y or X direction) extension direction is not large, so this design can obtain a more stable return air effect.

[0057] Based on the above, the air supply module 3 is located in the storage room 10, and both sides of the air supply module 3 are provided with air outlets 32 that supply air to the sides away from the air supply module 3. The air volume is larger at the end of the auxiliary plate 41 away from the air supply module 3 and smaller at the end closer to the air supply module 3, thereby ensuring the uniformity of airflow from the storage room 10 to the return air channel 5.

[0058] In addition to the two sub-boards 41 mentioned above, multiple other sub-boards 41 can be added, such as three or four. The multiple sub-boards 41 can be arranged around the outer ring of the main board 40 in a clockwise or counterclockwise direction to adjust the number of sub-boards 41 according to the actual needs of the scenario, so as to adapt to the structure or shape of the inner liner 1 of the refrigeration equipment.

[0059] In a specific application scenario, the included angle between two adjacent sub-plates 41 is 130° to 170°. At least one sub-plate 41 is inclined relative to the height of the inner liner 1 to guide the airflow obliquely upwards. That is, two adjacent sub-plates 41 form a "V" or "U" shaped airflow guiding structure, forcing the airflow to be guided obliquely to improve the uniformity of heat exchange within the sub-duct.

[0060] In one specific implementation, the sub-plate 41 is arc-shaped or straight-line shaped, or the main plate 40 is arc-shaped or straight-line shaped, to form a more smooth and aesthetically pleasing shape.

[0061] Furthermore, the aforementioned sub-duct 51 can be either curved or straight to achieve different airflow directions. Specifically, a curved sub-duct 51 can reduce the resistance of the cold airflow inside the return air duct 5; a straight sub-duct 51 is easier to manufacture and install than a curved one.

[0062] Furthermore, the aforementioned return air channel 5 can be arc-shaped or straight to achieve different airflow guidance methods. In this embodiment, when the return air channel 5 is straight, it can guide the cold airflow from bottom to top and evenly converge to the side where the main board 40 is located (i.e., the main air outlet 401). This allows the end of the defined return air channel 5 (the second end of the sub-channel 51 away from the main air outlet 50) to be closer to the extension direction of the inner liner 1 (along the direction of the main air outlet 401) than the first end of the sub-channel 51 (the first end of the sub-channel 51 close to the main air outlet 50). Figure 1 As shown in the Z direction, the air duct can be extended as a whole (from the return air duct 5 to the main air duct 50), thereby improving the temperature uniformity of the refrigeration equipment.

[0063] In this embodiment, if the return air duct 5 is arc-shaped, the arc-shaped return air duct 5 can guide the cold airflow to form a specific vortex and flow evenly from bottom to top to the side where the main board 40 is located (i.e., the main air outlet 401), and can make the end of the return air duct 5 closer to the extension direction of the inner liner 1 (along the direction of extension). Figure 1 (As shown in the Z direction) at the bottom end, thereby extending the air duct as a whole and exchanging heat in the area close to the bottom of the inner liner 1.

[0064] This application does not limit any of the above-mentioned arc-shaped structures, except Figure 9 , Figure 11 or Figure 14 In addition to the arc structure shown, the arc structure can also be represented as: the end of the return air channel 5 away from the motherboard 40 is at the same height as the beginning of the return air channel 5 near the motherboard 40, and any point in the middle between the end of the return air channel 5 away from the motherboard 40 and the end near the motherboard 40 is lower or higher than the beginning of the return air channel 5 near the motherboard 40, forming an arc-shaped structure or a wave-shaped structure, etc.

[0065] In one possible implementation, at least a portion of the sub-air duct 51 extends upward or downward in a direction away from the main air duct 50. That is, the sub-air duct 51 extends from the side near the main board 40 to the side away from the main board 40 with a change in elevation. This increases the longitudinal (height direction) contact span and contact area between the sub-air duct 51 and the surface of the inner liner 1, improves the heat exchange efficiency during a single airflow cycle, and reduces the vertical temperature difference of the storage compartment 10.

[0066] In one possible implementation, such as Figure 11 and Figure 12 As shown, the end of the sub-duct 51 that is away from the main duct 50 is lower than the end of the sub-duct 51 that is close to the main duct 50.

[0067] Specifically, such as Figure 11 As shown, any point midway between the first end of the sub-channel 51 furthest from the main channel 50 and the second end of the sub-channel 51 closest to the main channel 50 is lower than the second end of the sub-channel 51 closest to the main channel 50. Specifically, any point midway between the first end of the sub-channel 51 furthest from the main channel 50 can be determined by... Figure 12 As shown at point P, the second end of sub-duct 51 near the main duct 50 is... Figure 11 As shown at point M, there is a height difference H1 between point M and point P. Compared to the sub-duct 51, which has the same height at the first end far from the main duct 50 and the second end near the main duct 50, the span height can be increased to greater than H1, which means the heat exchange area is increased.

[0068] And in another possible embodiment, such as Figure 12 As shown, the first end of the sub-duct 51 that is furthest from the main duct 50 is Figure 11As shown at point N, the second end of the sub-duct 51 closest to the main duct 50 is... Figure 11 As shown at point M, there is a height difference H2 between point M and point N. Compared with the sub-duct 51, which has the same height at the first end far from the main duct 50 and the second end close to the main duct 50, the span height H2 can be increased, which means the heat exchange area is increased.

[0069] In some implementation schemes, combined Figure 12 As shown, the sub-duct 51 includes a first end close to the main duct 50 and a second end away from the main duct 50. The angle between the line connecting the first end and the second end and the height direction of the inner liner 1 is 65° to 85°. This angle is as follows... Figure 12 As shown in the middle angle α, angle α is used to measure the degree of bending of the sub-duct 51. When angle α is between 65° and 85°, the sub-duct 51 constructed by the adjacent two sub-plates 41 and the wall of the inner liner 1 can balance the directionality of the cold airflow and its flow resistance, so as to ensure that the required cold capacity is met while avoiding the wind pressure loss that may be caused by excessive angle.

[0070] In another possible implementation, such as Figure 13 and Figure 14 As shown, the end of the sub-duct 51 that is away from the main duct 50 is higher than the end of the sub-duct 51 that is close to the main duct 50.

[0071] In a specific implementation plan, such as Figure 13 As shown, the end of the sub-air duct 51 furthest from the main air duct 50 is higher than the end of the sub-air duct 51 closest to the main air duct 50. In this embodiment, the first end of the sub-air duct 51 furthest from the motherboard 40 may be... Figure 13 As shown at midpoint N, the second end of sub-air duct 51 near the mainboard 40 can be... Figure 13 As shown at midpoint M, point N has a height difference H3 with point M. Compared to the sub-duct 51, which has the same height at its first end far from the main duct 50 and its second end near the main duct 50, it can increase the span height H3, thus increasing the heat exchange area. Furthermore, it can guide the cold airflow from top to bottom and evenly converge to the main duct 50 (i.e., the main air outlet 401).

[0072] And in another possible embodiment, such as Figure 14 As shown, any point midway between the first end of the sub-duct 51 furthest from the main duct 50 and the second end of the sub-duct 51 closest to the main duct 50 can be determined by... Figure 14 As shown at midpoint P, the end of sub-air duct 51 closest to motherboard 40 is... Figure 14 As shown at point M, there is a height difference H4 between point M and point P. In this embodiment, compared to the sub-duct 51 having the same height at both ends away from and near the main board 40, the height can be increased to be greater than H4 to increase the heat exchange area.

[0073] The above description, based on the embodiments shown in the drawings, details the structure, features, and effects of this utility model. The above description is only a preferred embodiment of this utility model, but the scope of implementation of this utility model is not limited to what is shown in the drawings. Any changes made in accordance with the concept of this utility model, or modifications to equivalent embodiments, that do not exceed the spirit covered by the specification and drawings, shall be within the protection scope of this utility model.

Claims

1. A refrigeration device, characterized in that, include: The inner liner surrounds and forms a storage compartment; The refrigeration system provides cooling to the storage compartment from the outside of the inner liner in a direct cooling manner; An air supply module is located inside the storage room. At least one air duct cover is provided over the inner liner and together with the inner liner defines a return air passage. The air duct cover includes a main plate and at least one secondary plate extending from the main plate in a direction away from the main plate. The return air passage includes a main air duct located between the main plate and the inner liner and communicating with the air supply module, and a sub-air duct located between the secondary plate and the inner liner and communicating with the storage compartment. At least a portion of the sub-duct extends upward or downward in a direction away from the main duct.

2. The refrigeration equipment according to claim 1, characterized in that, The end of the sub-air duct that is furthest from the main air duct is higher than the end of the sub-air duct that is closest to the main air duct; Alternatively, the end of the sub-duct that is furthest from the main duct is lower than the end of the sub-duct that is closest to the main duct.

3. The refrigeration equipment according to claim 2, characterized in that, The sub-duct includes a first end close to the main duct and a second end away from the main duct, and the angle between the line connecting the first end and the second end and the height direction of the inner liner is 65° to 85°.

4. The refrigeration equipment according to claim 1, characterized in that, The sub-duct is either arc-shaped or straight.

5. The refrigeration equipment according to any one of claims 1 to 4, characterized in that, The duct cover includes at least two sub-plates, and the at least two sub-plates extend from the main plate in different directions away from the main plate; at least a portion of the sub-plates extends upward or downward in a direction away from the main duct.

6. The refrigeration equipment according to claim 5, characterized in that, The two sub-boards are symmetrically arranged on both sides of the main board; And / or, the included angle between two adjacent subplates is 1° to 170°.

7. The refrigeration equipment according to claim 1, characterized in that, The sub-plate and / or the main plate are recessed inward along the thickness direction away from the inner liner to form a cavity, wherein one or more mounting holes are provided in the recessed part of the sub-plate and / or the main plate.

8. The refrigeration equipment according to claim 1, characterized in that, The air supply module includes an air supply channel connected to the main air duct, wherein the height of the return air channel is... h 回风通道 Height of the air supply duct h 送风通道 The following relationship must be satisfied: 。 9. The refrigeration equipment according to claim 8, characterized in that, The motherboard is also provided with a tube protruding in the direction away from the inner liner on the side facing the air supply module, and the tube defines a main air outlet for connecting the air supply channel and the main air duct; wherein, the tube is provided with a limiting protrusion that can engage with the air supply module.

10. The refrigeration equipment according to claim 8, characterized in that, The main board is provided with a mounting guide groove on the side away from the air supply module for engaging with the air supply module. The mounting guide groove is recessed or protruding along the direction of the main board away from the inner liner. At least one of the contact surfaces between the mounting guide groove and the air supply module includes an inclined surface.

Images