Refrigerator

Abstract

The utility model relates to the field of household appliances, especially a refrigerator. The refrigerator comprises a freezing compartment, a deep cooling box and a semiconductor refrigeration device, the freezing compartment is internally structured with a freezing air duct, the freezing air duct is used for communicating with a refrigeration unit, and a first fan is installed in the freezing air duct; the deep cooling box is installed in the freezing compartment, and a deep cooling chamber is formed by being hollowly arranged in the deep cooling box; the semiconductor refrigeration device is connected with the deep cooling box and at least partially located in the deep cooling chamber; wherein, a wind passing opening is formed on the deep cooling chamber, the freezing air duct communicates with the deep cooling chamber through the wind passing opening, and a partition plate is installed at the wind passing opening, the partition plate is rotationally connected with the deep cooling box and is configured to rotate in response to the wind power of the first fan. The advantage lies in that the rotation partition plate is driven to open and close by the wind power of the second fan, so that the deep cooling chamber can close the wind passing opening through the partition plate when the preset temperature is reached, thereby maintaining the temperature.

Description

Technical Field

[0001] This utility model relates to the field of household appliances, and in particular to a refrigerator. Background Technology

[0002] Traditional refrigerators typically use mixed refrigerants to achieve deep cooling, which results in high noise levels and a minimum temperature that can only reach around -40 degrees Celsius, along with high power consumption. Some refrigerators use semiconductor cooling devices in the freezer compartment to further cool the deep cooling compartment, but the cooling efficiency is low, and cold air is prone to leakage due to air circulation between the deep cooling compartment and the freezer compartment, leading to poor cold retention. Utility Model Content

[0003] In view of the above-mentioned technical problems, this utility model provides a refrigerator.

[0004] A refrigerator includes: a freezer compartment with an internally constructed freezer air duct for communicating with a refrigeration unit, wherein a first fan is installed in the freezer air duct; a cryogenic chamber installed in the freezer compartment, the cryogenic chamber being hollow and forming a cryogenic room; and a semiconductor refrigeration device connected to the cryogenic chamber and at least partially located within the cryogenic room; wherein an air vent is provided on the cryogenic room, the freezer air duct communicates with the cryogenic chamber through the air vent, and a partition is installed at the air vent, the partition being rotatably connected to the cryogenic chamber and configured to rotate in response to the airflow of the first fan.

[0005] This design allows the freezer compartment to provide the cryogenic chamber with an initial low temperature, and through the primary fan and air vents, achieve efficient cooling inside the cryogenic chamber. When enhanced cooling is needed, the fan pushes open the partition to introduce cold air; when no air supply is required, the partition automatically closes due to gravity, creating physical isolation. This solves the problem of cold air loss caused by direct connection between the cryogenic chamber and the external space, significantly improving the insulation and energy efficiency of the cryogenic chamber. The semiconductor cooling components further cool the chamber on top of its already low temperature, thus creating the cryogenic environment within the cryogenic chamber.

[0006] In one embodiment, the partition is rotatably connected to the cryogenic chamber via a pivot or hinge.

[0007] In one embodiment, the partition is in a closed position under gravity in its natural state to isolate the cryogenic chamber from the refrigeration duct, and the partition is made of heat-insulating material.

[0008] In one embodiment, along the height direction of the refrigerator, the upper side of the partition is rotatably connected to the cryogenic chamber, and the partition rotates around the rotatable connection position on the upper side. The cryogenic chamber is provided with a limiting member that can abut against the partition and limit the maximum opening angle of the partition.

[0009] In one embodiment, the thermoelectric cooler includes a hot end and a cold end, the cold end being located inside the cryogenic chamber and the hot end being located outside the cryogenic chamber.

[0010] In one embodiment, the freezer compartment is further provided with a heat dissipation duct, which is connected to the cryogenic chamber, and the hot end is located in the heat dissipation duct, which is provided with a plurality of second fans.

[0011] In one embodiment, one end of the heat dissipation duct is connected to the cooling unit, and the other end has an opening. The second fan is located on the hot end near the cooling unit.

[0012] In one embodiment, the refrigerator includes a back panel, the refrigeration unit is installed on the side of the back panel away from the freezer compartment, the back panel has an air inlet that communicates with the heat dissipation duct, the air inlet is located at the upper end of the heat dissipation duct along the height direction of the refrigerator, and the opening is located at the lower end of the heat dissipation duct.

[0013] In one embodiment, the semiconductor cooling device further includes a heat dissipation structure connected to the hot end and located in the heat dissipation duct.

[0014] In one embodiment, the refrigerator further includes a control unit, which is capable of acquiring the temperature inside the freezer compartment and the temperature inside the cryogenic compartment, and controlling the operating power of the semiconductor refrigeration device and the rotation speed of the first fan based on the acquired temperature information.

[0015] Compared to existing technologies, this invention utilizes a cascaded cooling structure and a rotating baffle driven by a first fan to open and close. This allows the cryogenic chamber to maintain its temperature by closing the air vents through the baffle once the preset temperature has been reached. Furthermore, an independent heat dissipation duct is incorporated to cool the semiconductor cooling components, ensuring their operational efficiency. Attached Figure Description

[0016] Figure 1 A cross-sectional view of one embodiment of the refrigerator provided by this utility model;

[0017] Figure 2Another cross-sectional view of one embodiment of the refrigerator provided by this utility model;

[0018] Figure 3 A partial structural schematic diagram of one embodiment of the refrigerator provided by this utility model;

[0019] Figure 4 This is a structural schematic diagram of one embodiment of the cryogenic chamber and backplate provided by this utility model.

[0020] The symbols in the diagram represent the following meanings:

[0021] 100. Refrigerator; 10. Freezer compartment; 11. Refrigeration unit; 12. Freezer air duct; 20. Deep-cold cabinet; 21. Deep-cold compartment; 211. Air vent; 22. Heat dissipation air duct; 30. Semiconductor refrigeration component; 33. Second fan; 34. Heat dissipation structure; 40. Back panel. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] It should be noted that when a mechanism is referred to as being "fixed to" or "set on" another mechanism, it can be directly on the other mechanism or there may be an intervening mechanism. When a mechanism is considered to be "connected to" another mechanism, it can be directly connected to the other mechanism or there may be an intervening mechanism. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0027] Please see Figures 1-4 This invention provides a refrigerator 100 that achieves a deep-cold cooling effect in the deep-cold compartment 21 by using the initial low temperature of the freezer compartment 10 and the further cooling by the semiconductor cooling element 30. Furthermore, a first fan blows air into the deep-cold compartment 21 to improve cooling efficiency, and a rotating partition ensures cold insulation at the air vent 211.

[0028] The refrigerator 100 includes a freezer compartment 10, a cryogenic chamber 20, and a semiconductor cooling unit 30. The freezer compartment 10 has a freezer air duct 12 internally configured to communicate with the cooling unit 11. A first fan is installed in the freezer air duct 12. The cryogenic chamber 20 is installed inside the freezer compartment 10 and is hollow to form a cryogenic chamber 21. The semiconductor cooling unit 30 is connected to the cryogenic chamber 20 and is at least partially located inside the cryogenic chamber 21. An air vent 211 is provided on the cryogenic chamber 21. The freezer air duct 12 communicates with the cryogenic chamber 21 through the air vent 211. A partition is installed at the air vent 211 and is rotatably connected to the cryogenic chamber 20 and configured to rotate in response to the airflow of the first fan.

[0029] In this way, the freezer compartment 10 can provide the cryogenic chamber 20 with an initial low temperature, and through the first fan and air vents 211, achieve efficient cooling inside the cryogenic chamber 21. When enhanced cooling is needed, the fan pushes open the partition to introduce cold air; when no air supply is needed, the partition automatically closes due to gravity, forming a physical barrier. This solves the problem of cold loss caused by the direct connection between the cryogenic chamber 21 and the external space, significantly improving the insulation and energy efficiency of the cryogenic chamber 21. The semiconductor cooling component 30 further cools the chamber on top of the low temperature, thereby creating a cryogenic environment inside the cryogenic chamber 21.

[0030] Furthermore, the partition is rotatably connected to the cryogenic chamber 20 via a pivot or hinge. This rotatable connection between the partition and the cryogenic chamber 20 via a pivot or hinge is simple and reliable, ensuring the partition can rotate smoothly and stably in response to wind force. This achieves mechanical automation of the opening and closing function of the air vent 211, reducing the failure rate.

[0031] Because the partition can rotate freely, it remains in a closed position under gravity in its natural state, isolating the cryogenic chamber 21 from the refrigeration air duct 12. Furthermore, the partition is made of insulating material. Thus, the air vent 211 can be automatically sealed without additional power or complex control, effectively preventing the leakage of cold air from the cryogenic chamber 21. Simultaneously, the use of insulating material further reduces heat conduction through the partition itself. These dual measures significantly improve the insulation and energy efficiency of the cryogenic chamber 21.

[0032] Understandably, in other embodiments, the partition can also be rotated by a motor in response to its operating mode. When it needs to be opened, the motor controls the partition to rotate and open the air vent 211. When cryogenic cooling is complete, the partition is controlled to close.

[0033] Along the height of the refrigerator 100, the upper side of the shelf is rotatably connected to the cryogenic cabinet 20. The shelf rotates around the upper rotatable connection position. A limiter is provided on the cryogenic cabinet 20, which abuts against the shelf and limits the maximum opening angle of the shelf. In this way, setting the shelf to rotate on the upper side allows it to automatically reset and close under the action of gravity; the limiter prevents the shelf from opening too wide, avoiding structural damage, and allows for precise control of air intake, optimizing the cold air exchange efficiency.

[0034] To facilitate heat dissipation of the thermoelectric cooler 30, the thermoelectric cooler 30 includes a hot end and a cold end, with the cold end located inside the cryogenic chamber 21 and the hot end located outside the cryogenic chamber 21. This achieves physical isolation between the hot and cold ends. This arrangement allows the cooling energy generated by the cold end to be efficiently used for cooling the cryogenic chamber 21, while the heat generated by the hot end is promptly dissipated to the external space, preventing heat accumulation within the cryogenic chamber 21. This significantly improves the cooling efficiency of the thermoelectric cooler 30 and the temperature stability of the system. The heat from the hot end can be neutralized by the cooling energy generated by the cooling unit 11 corresponding to the freezer compartment 10 of the refrigerator 100, thus preventing overheating.

[0035] In this embodiment, the refrigeration unit 11 is configured as an evaporator, and the evaporator's cooling capacity can cool the freezer compartment 10 and the hot end of the semiconductor refrigeration unit 30.

[0036] The freezer compartment 10 is also equipped with a heat dissipation duct 22, which is connected to the cryogenic chamber 20. The hot end is located in the heat dissipation duct 22, and multiple second fans 33 are installed inside the heat dissipation duct 22. In this way, by constructing a dedicated heat dissipation duct 22 with second fans 33 for the hot end of the thermoelectric cooler 30, the second fans 33 accelerate airflow and can quickly dissipate the large amount of heat generated at the hot end, preventing the reduction in cooling efficiency caused by poor heat dissipation at the hot end, and ensuring that the thermoelectric cooler 30 can continuously and efficiently operate in its optimal state.

[0037] One end of the heat dissipation duct 22 is connected to the cooling unit 11, and the other end has an opening. The second fan 33 is located on the side of the hot end close to the cooling unit 11. In this way, the low-temperature return air of the cooling unit 11 itself or the environment is used as a cold source to pre-cool the heat dissipation duct 22, which improves the heat dissipation efficiency of the hot end of the semiconductor cooling device 30 and further ensures the low-temperature performance of the cryogenic chamber 21.

[0038] The refrigerator 100 includes a back panel 40, and a refrigeration unit 11 is installed on the side of the back panel 40 away from the freezer compartment 10. An air inlet is provided on the back panel 40, which communicates with a heat dissipation duct 22. Along the height of the refrigerator 100, the air inlet is located at the upper end of the heat dissipation duct 22, and the opening is located at the lower end of the heat dissipation duct 22. This allows heat to be expelled from the bottom of the refrigerator 100, preventing it from affecting the normal operation of the internal structure of the refrigerator 100.

[0039] The thermoelectric cooler 30 also includes a heat dissipation structure 34, which is connected to the hot end and located within the heat dissipation duct 22. Specifically, the heat dissipation structure 34 is provided with multiple heat dissipation fins to increase its contact area with the air within the heat dissipation duct 22. This increases the contact area between the hot end and the air, thereby significantly improving heat exchange efficiency. This allows the heat generated at the hot end to be transferred more quickly to the air flowing through the heat dissipation duct 22 and rapidly carried away, effectively preventing the hot end temperature from becoming too high and ensuring the performance and lifespan of the thermoelectric cooler 30.

[0040] In addition, the refrigerator 100 also includes a control unit. This control unit can acquire the temperatures within the freezer compartment 10 and the cryogenic compartment 21, and control the operating power of the semiconductor cooling element 30 and the speed of the first fan based on the acquired temperature information. By setting up a control unit to comprehensively monitor the temperatures of the freezer compartment 10 and the cryogenic compartment 21, and accordingly coordinate the control of the power of the semiconductor cooling element 30 and the speed of the first fan, intelligent and precise control of the entire system is achieved. This not only ensures that the cryogenic compartment 21 quickly and stably reaches and maintains the set ultra-low temperature, but also dynamically adjusts energy consumption according to actual cooling needs, avoiding energy waste and achieving a balance between high efficiency and energy saving.

[0041] Specifically, taking a target temperature of -50 degrees Celsius inside the cryogenic chamber 21 as an example, the entire refrigeration unit operates in the following modes:

[0042] Rapid cooling mode: If the temperature TS in the deep cold compartment 21 deviates from the temperature TD of the freezer compartment of the refrigerator 100, i.e. TS-TD>T1 (e.g. -22℃) or TS<T2 (e.g. -20℃), the flow area at the air vent 211 is opened to the maximum (in this embodiment, to increase the air volume of the first fan so that the partition is fully opened), and the power of the semiconductor cooling component 30 is adjusted to the highest level. The two work together to achieve rapid cooling of the deep cold compartment.

[0043] Energy-saving mode: When the temperature of the cryogenic chamber 21 is less than the target temperature TM-5 degrees (e.g., -65 degrees), the semiconductor cooling device 30 stops working, the first fan is turned off, and the partition is closed to keep the cryogenic chamber 21 cold.

[0044] The operating power of the semiconductor cooling device 30 is determined according to this formula:

[0045] Psemi=

-0.3(TS-TD) / 20+0.7(-20-TS) / 80

[0046] Here, Psemi-max refers to the maximum power of the semiconductor cooling device 30. The rotational speed of the second fan 33 is adjusted according to the change in semiconductor operating power and is set to be positively correlated.

[0047] Compared to existing technologies, this invention utilizes a cascaded cooling structure and employs a rotating partition driven by a first fan to open and close. This allows the cryogenic chamber 21 to maintain its temperature by closing the air vent 211 through the partition once the preset temperature has been reached. Furthermore, an independent heat dissipation duct 22 is provided to cool the semiconductor cooling component 30, ensuring its operational efficiency.

[0048] The refrigerator 100 can be controlled by a voice module, which is equipped with a controller, a voice receiving module, and a voice parsing module. The voice receiving module receives user commands, and the voice parsing module parses the commands. Based on the parsed commands, the controller controls the refrigerator 100 to perform corresponding operations, thereby realizing intelligent control of the refrigerator 100 and improving the user experience. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0049] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A refrigerator, characterized in that, include: The freezer compartment (10) has a freezer duct (12) inside, which is used to connect with the refrigeration unit (11), and a first fan is installed in the freezer duct (12); A cryogenic chamber (20) is installed inside the freezer compartment (10), and the cryogenic chamber (20) is hollow and forms a cryogenic chamber (21). A semiconductor cooling device (30) is connected to the cryogenic enclosure (20) and is at least partially located within the cryogenic chamber (21); The cryogenic chamber (21) has an air vent (211) on it. The refrigeration duct (12) is connected to the cryogenic chamber (21) through the air vent (211). A partition is installed at the air vent (211). The partition is rotatably connected to the cryogenic box body (20) and is configured to rotate in response to the wind force of the first fan.

2. The refrigerator according to claim 1, characterized in that, The partition is rotatably connected to the cryogenic chamber (20) via a pivot or hinge.

3. The refrigerator according to claim 1, characterized in that, The partition is in a closed position under gravity in its natural state to isolate the cryogenic chamber (21) from the refrigeration duct (12), and the partition is made of heat-insulating material.

4. The refrigerator according to any one of claims 1-3, characterized in that, Along the height direction of the refrigerator, the upper side of the partition is rotatably connected to the cryogenic chamber (20). The partition rotates around the rotatable connection position on the upper side. A limiting member is provided on the cryogenic chamber (20). The limiting member can abut against the partition and limit the maximum opening angle of the partition.

5. The refrigerator according to claim 1, characterized in that, The semiconductor cooling device (30) includes a hot end and a cold end, the cold end being located inside the cryogenic chamber (21) and the hot end being located outside the cryogenic chamber (21).

6. The refrigerator according to claim 5, characterized in that, The freezer compartment (10) is also equipped with a heat dissipation duct (22), which is connected to the cryogenic chamber (20), and the hot end is located in the heat dissipation duct (22). Multiple second fans (33) are provided in the heat dissipation duct (22).

7. The refrigerator according to claim 6, characterized in that, One end of the heat dissipation duct (22) is connected to the cooling unit (11), and the other end has an opening. The second fan (33) is located on the side of the hot end close to the cooling unit (11).

8. The refrigerator according to claim 7, characterized in that, The refrigerator includes a back panel (40), and the refrigeration unit (11) is installed on the side of the back panel (40) away from the freezer compartment (10). An air inlet is provided on the back panel (40), and the air inlet is connected to the heat dissipation duct (22). Along the height direction of the refrigerator, the air inlet is located at the upper end of the heat dissipation duct (22), and the opening is located at the lower end of the heat dissipation duct (22).

9. The refrigerator according to claim 6, characterized in that, The semiconductor cooling device (30) further includes a heat dissipation structure (34), which is connected to the hot end and located in the heat dissipation duct (22).

10. The refrigerator according to claim 1, characterized in that, The refrigerator also includes a control unit, which is capable of acquiring the temperature inside the freezer compartment (10) and the temperature inside the deep freezer compartment (21), and controlling the operating power of the semiconductor cooling device (30) and the speed of the first fan according to the acquired temperature information.

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