Heating chamber cooling device of vacuum magnetron sputtering machine

Abstract

The application relates to the technical field of vacuum magnetron sputtering equipment, in particular to a heating cavity cooling device of a vacuum magnetron sputtering machine, which comprises a cooling main body, a multistage flow channel assembly and a thermal isolation protection assembly. The multistage flow channel assembly realizes efficient flow of the cooling liquid through the main cooling channel, the branch cooling channel and the flow guide grooves on the flow distribution plate, so that local overheating is avoided; the thermal isolation protection assembly reduces heat radiation and conduction by using the heat insulation partition plate, the reflective film layer and the heat conduction gasket; and the heat dissipation fins enhance the heat dissipation capacity of the cooling main body. The application optimizes the cooling flow channel layout, enhances the thermal isolation performance, improves the device adaptability and provides a reliable guarantee for stable operation of the vacuum magnetron sputtering equipment.

Description

Technical Field

[0001] This utility model belongs to the technical field of vacuum coating equipment, specifically a cooling device for the heating chamber of a vacuum magnetron sputtering machine. Background Technology

[0002] With the development of vacuum magnetron sputtering technology, the heating chamber cooling device, as an important component, plays a crucial role in the stability and service life of the equipment. However, existing cooling devices still have some problems in practical use, especially in terms of efficient heat dissipation, structural design optimization, and preventing the impact of heat transfer on the control system, where there is still room for improvement.

[0003] A search revealed a cooling device for the heating chamber of a sputtering coating machine, publication number CN119287327B, published on June 3, 2025. This patent proposes a cooling device that isolates the high temperature of the heating chamber shell through a coolant flow channel. Specifically, the cooling device includes an inlet, an outlet, and a flow channel arranged around the center, through which coolant flows to achieve a cooling effect. However, this design has the following shortcomings: First, the coolant flow channel layout is relatively simple, providing only basic heat dissipation and failing to meet the demand for efficient heat dissipation under complex operating conditions; second, the device mainly relies on the combination of a baffle and coolant to isolate high temperatures, but its protection against heat transfer between the heating chamber and the control chamber is limited, potentially leading to performance degradation or even damage to the control circuit system under prolonged high-temperature conditions; finally, the design does not fully consider the adaptability of the cooling device under different load conditions, and may not be able to effectively control the temperature during high-power operation.

[0004] A search revealed a magnetron sputtering wafer processing apparatus with publication number CN118028754B, published on August 6, 2024. This patent proposes a dual-cooling-channel design, with channels located in the upper cavity and stage respectively, to specifically reduce the temperature of areas easily accessible to metal atoms. While this design improves cooling efficiency to some extent, it still has the following problems: First, the cooling channels are mainly concentrated in specific areas, failing to fully cover the critical high-temperature areas of the heating cavity, potentially leading to localized overheating; second, the cooling system design is relatively complex, increasing manufacturing costs and maintenance difficulty; third, the design does not explicitly address how to handle the effects of heat radiation and heat conduction between the heating cavity and the control cavity, which may pose a potential threat to the control system under high-temperature conditions.

[0005] The aforementioned problems indicate that existing heating chamber cooling devices still need improvement in terms of efficient heat dissipation, structural optimization, and preventing the impact of heat transfer on the control system. Therefore, this invention provides a heating chamber cooling device for a vacuum magnetron sputtering machine, aiming to overcome the shortcomings of existing technologies by optimizing the cooling channel layout, enhancing thermal isolation performance, and improving the adaptability of the device under different operating conditions, thereby providing a more reliable guarantee for the stable operation of vacuum magnetron sputtering equipment. Utility Model Content

[0006] This utility model relates to a cooling device for the heating chamber of a vacuum magnetron sputtering machine, comprising a cooling body (1), a multi-stage flow channel assembly (2), and a thermal isolation protection assembly (3). The multi-stage flow channel assembly (2) is installed inside the cooling body (1), and the thermal isolation protection assembly (3) is installed on one side of the outer wall of the cooling body (1).

[0007] The multi-stage flow channel assembly (2) includes a main cooling channel (201), a branch cooling channel (202), a flow divider (203), a guide groove (204), and a coolant circulation pump (205). The cooling body (1) is symmetrically provided with main cooling channels (201). The main cooling channels (201) are connected to each other by a flow divider (203). The flow divider (203) has multiple guide grooves (204). The two ends of the main cooling channel (201) are respectively connected to the branch cooling channel (202). The outlet end of the branch cooling channel (202) is connected to the coolant circulation pump (205). The coolant circulation pump (205) is fixedly installed on the bottom outer wall of the cooling body (1).

[0008] Preferably, heat dissipation fins (101) are evenly distributed on the inner wall of the top of the cooling body (1), the outer wall of the heat dissipation fins (101) is in contact with the outer wall of the main cooling channel (201), and the thickness of the heat dissipation fins (101) is 2mm to 3mm.

[0009] Preferably, the thermal insulation protection component (3) includes a heat insulation partition (301), a reflective film layer (302), a thermally conductive pad (303), and a fixing bracket (304). The outer wall of one side of the heat insulation partition (301) is coated with a reflective film layer (302), and the outer wall of the other side of the heat insulation partition (301) is fixedly connected to a thermally conductive pad (303). The outer wall of one side of the thermally conductive pad (303) is attached to the outer wall of the cooling body (1), and the heat insulation partition (301) is fixedly installed on the outer wall of one side of the cooling body (1) by the fixing bracket (304).

[0010] Preferably, an inlet (102) and an outlet (103) are provided on one side of the outer wall of the cooling body (1). The inlet (102) is located at the inlet end of the coolant circulation pump (205), and the outlet (103) is located at the outlet end of the main cooling channel (201).

[0011] Preferably, support feet (104) are symmetrically installed on the bottom outer wall of the cooling body (1), the height of the support feet (104) is adjustable, and the bottom of the support feet (104) is provided with anti-slip pads.

[0012] Preferably, the cross-sectional shape of the guide groove (204) is circular, the width of the guide groove (204) gradually decreases from the center of the diverter plate (203) to both sides, and the number of guide grooves (204) is 8 to 12.

[0013] Preferably, the thickness of the heat insulation partition (301) is 5mm to 8mm, the material of the reflective film layer (302) is aluminum foil, and the surface of the reflective film layer (302) is treated with anti-oxidation.

[0014] In this invention, the multi-stage flow channel assembly (2) achieves efficient flow of coolant within the heating chamber through the synergistic effect of the main cooling channel (201) and the branch cooling channels (202). The guide grooves (204) on the distributor plate (203) can evenly distribute the coolant to each area, avoiding local overheating. At the same time, the coolant circulation pump (205) provides power support for the circulation of coolant, ensuring continuous flow of coolant throughout the system.

[0015] The thermal isolation protection component (3) effectively blocks heat radiation and heat conduction between the heating cavity and the control cavity through the combination of the heat insulation partition (301) and the reflective film layer (302). The reflective film layer (302) can reflect some heat back to the heating cavity, reducing heat transfer to the outside; the thermally conductive pad (303) conducts the remaining heat out and disperses it to the outer wall of the cooling body (1), further reducing the impact of heat transfer on the control system.

[0016] The heat dissipation fins (101) enhance the heat dissipation capacity of the cooling body (1). They are closely attached to the outer wall of the main cooling channel (201) and can quickly absorb and dissipate heat, thereby improving the overall cooling efficiency.

[0017] The design of the inlet (102) and outlet (103) facilitates the input and output of coolant, ensuring the normal operation of the cooling system. The height-adjustable function of the support feet (104) allows the cooling device to adapt to different installation environments, while the anti-slip pads improve the stability of the device.

[0018] This invention overcomes the shortcomings of existing technologies by optimizing the cooling channel layout, enhancing thermal isolation performance, and improving the adaptability of the device under different operating conditions, thus providing a more reliable guarantee for the stable operation of vacuum magnetron sputtering equipment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a side view sectional view of the present invention. Figure 3 This is a schematic diagram of the front view sectional structure of this utility model.

[0020] The attached diagram is labeled as follows: 1. Cooling body; 2. Multi-stage flow channel assembly; 3. Thermal insulation and protection assembly; 101. Heat dissipation fins; 102. Liquid inlet; 103. Liquid outlet; 104. Support foot; 201. Main cooling channel; 202. Branch cooling channel; 203. Flow divider; 204. Flow guide groove; 205. Coolant circulation pump; 301. Heat insulation baffle; 302. Reflective film layer; 303. Thermal conductive pad; 304. Fixing bracket. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Specific implementation examples are given below.

[0023] like Figures 1 to 3 As shown, this utility model provides a cooling device for the heating chamber of a vacuum magnetron sputtering machine, which includes a cooling body 1, a multi-stage flow channel assembly 2, and a thermal isolation protection assembly 3. The cooling body 1 is the core load-bearing component of the entire device, and its interior is provided with a multi-stage flow channel assembly 2 for realizing the flow of coolant and heat exchange; a thermal isolation protection assembly 3 is installed on one outer wall of the cooling body 1 to reduce the impact of heat radiation and heat conduction on the surrounding environment.

[0024] In the internal structure of the cooling body 1, the main cooling channels 201 are symmetrically arranged along the longitudinal direction of the cooling body 1, and the main cooling channels 201 are connected by a flow divider 203. The flow divider 203 is a flat plate structure with multiple guide grooves 204 on its surface. The number of guide grooves 204 is 8 to 12, and its cross-sectional shape is trapezoidal, with the width gradually decreasing from the center of the flow divider 203 to both sides. The function of the flow divider 203 is to evenly distribute the coolant, ensuring that the coolant can cover the entire cooling area and avoid local overheating. The two ends of the main cooling channels 201 are connected to the branch cooling channels 202, and the outlet end of the branch cooling channels 202 is connected to the coolant circulation pump 205. The coolant circulation pump 205 is fixedly installed on the bottom outer wall of the cooling body 1 to provide power support for the circulation of coolant. The coolant enters the cooling body 1 through the inlet 102, and after passing through the main cooling channel 201 and the branch cooling channel 202, it is discharged from the outlet 103, forming a complete coolant circulation path.

[0025] The cooling body 1 has uniformly distributed heat dissipation fins 101 on its top inner wall. The thickness of the heat dissipation fins 101 is 2mm to 3mm, and their outer walls are tightly fitted to the outer wall of the main cooling channel 201. The design of the heat dissipation fins 101 increases the surface area of ​​the cooling body 1, thereby improving heat dissipation efficiency. When the coolant flows in the main cooling channel 201, it transfers heat to the heat dissipation fins 101, which then dissipate the heat to the surrounding environment through natural convection or forced convection, thus achieving effective heat transfer.

[0026] A thermal insulation protection component 3 is installed on one outer wall of the cooling body 1, and includes a heat insulation partition 301, a reflective film layer 302, a thermally conductive pad 303, and a fixing bracket 304. The heat insulation partition 301 has a thickness of 5mm to 8mm, and one outer wall of it is coated with a reflective film layer 302. The reflective film layer 302 is made of aluminum foil and its surface has undergone anti-oxidation treatment, which can effectively reflect some heat and reduce the impact of heat radiation on the surrounding environment. A thermally conductive pad 303 is fixed to the other outer wall of the heat insulation partition 301. One outer wall of the thermally conductive pad 303 is attached to the outer wall of the cooling body 1 to conduct and disperse residual heat to the outer wall of the cooling body 1. The heat insulation partition 301 is fixedly installed on one outer wall of the cooling body 1 by a fixing bracket 304, which is bolted for easy disassembly and maintenance.

[0027] A liquid inlet 102 and a liquid outlet 103 are provided on one outer wall of the cooling body 1. The liquid inlet 102 is located at the inlet end of the coolant circulation pump 205, and the liquid outlet 103 is located at the outlet end of the main cooling channel 201. Both the liquid inlet 102 and the liquid outlet 103 adopt a standard threaded interface design for easy connection with external coolant pipes. Support feet 104 are symmetrically installed on the bottom outer wall of the cooling body 1. The height of the support feet 104 can be adjusted by adjusting screws to adapt to the needs of different installation environments. The bottom of the support feet 104 is provided with anti-slip pads made of rubber, which can improve the stability of the device and prevent slippage or tipping during operation.

[0028] In practical applications, the cooling device of this invention cools the heating chamber of a vacuum magnetron sputtering machine through the following steps: First, external coolant enters the cooling body 1 through the inlet 102 and flows into the main cooling channel 201. As the coolant flows in the main cooling channel 201, it absorbs the heat transferred from the heating chamber to the cooling body 1. The guide grooves 204 on the distributor plate 203 evenly distribute the coolant to each area, ensuring that the coolant covers the entire cooling area and preventing localized overheating. Subsequently, the coolant flows through the branch cooling channel 202 to the coolant circulation pump 205, which provides power for the circulation of the coolant, enabling it to flow continuously and eventually be discharged from the outlet 103. During this process, the heat dissipation fins 101 are in close contact with the outer wall of the main cooling channel 201, enabling rapid absorption and dissipation of heat, thereby improving overall cooling efficiency.

[0029] Meanwhile, the thermal isolation protection component 3, through the combination of the thermal insulation partition 301 and the reflective film layer 302, effectively blocks heat radiation and heat conduction between the heating cavity and the control cavity. The reflective film layer 302 can reflect some heat back to the heating cavity, reducing heat transfer to the outside; the thermally conductive pad 303 conducts the remaining heat out and disperses it to the outer wall of the cooling body 1, further reducing the impact of heat transfer on the control system.

[0030] During installation and use, operators can adjust the height of the support feet 104 according to actual needs to ensure the cooling device is installed horizontally. Furthermore, the design of the inlet 102 and outlet 103 makes the input and output of coolant more convenient, ensuring the normal operation of the cooling system. The bolted connection of the fixing bracket 304 makes the installation and disassembly of the thermal isolation protection component 3 more flexible, facilitating subsequent maintenance and replacement.

[0031] As can be seen from the above specific embodiments, this utility model overcomes the shortcomings of the prior art by optimizing the cooling channel layout, enhancing thermal isolation performance, and improving the adaptability of the device under different operating conditions, thus providing a more reliable guarantee for the stable operation of vacuum magnetron sputtering equipment. To better enable those skilled in the art to fully understand and implement this utility model, the specific implementation principle of this utility model is further supplemented below with a specific application scenario.

[0032] During the operation of a vacuum magnetron sputtering device, the temperature of the heating chamber rises rapidly due to continuous operation. If the heat cannot be dissipated in time, it will directly affect the stability and service life of the equipment. In this case, the cooling device provided by this invention achieves efficient heat dissipation and thermal isolation protection through a series of steps, ensuring that heat transfer between the heating chamber and the control chamber is effectively suppressed.

[0033] First, after the coolant circulation pump 205 starts, external coolant enters the cooling body 1 through the inlet 102 and flows along the main cooling channel 201. In the main cooling channel 201, the coolant absorbs heat conducted from the heating chamber to the cooling body 1. Multiple guide channels 204 on the distributor plate 203 evenly distribute the coolant to various areas. Since the cross-sectional shape of the guide channels 204 is circular and the width gradually decreases from the center to both sides, this design effectively avoids localized excessively fast or slow flow rates during the coolant flow process, thus ensuring that the coolant covers the entire cooling area. During this process, the coolant not only directly absorbs heat through the main cooling channel 201 but also undergoes secondary heat transfer through the heat dissipation fins 101 that are tightly attached to the outer wall of the main cooling channel 201. The design of the heat dissipation fins 101 increases the surface area of ​​the cooling body 1, enabling it to dissipate heat to the surrounding environment through natural convection or forced convection, further improving the overall heat dissipation efficiency.

[0034] Subsequently, the coolant flows from the main cooling channel 201 into the branch cooling channel 202, and finally to the coolant circulation pump 205. The coolant circulation pump 205 provides the power for the continuous flow of coolant, enabling it to be discharged through the outlet 103, completing one full cooling cycle. During this process, the coolant flow rate and volume can be optimized through the adjustment function of the coolant circulation pump 205 to adapt to the heat dissipation requirements under different load conditions. For example, under high-power operating conditions, the coolant circulation pump 205 can increase the coolant flow rate to enhance the cooling effect; while under low-power operating conditions, the coolant circulation pump 205 can appropriately reduce the flow rate to save energy.

[0035] Meanwhile, the thermal isolation protection component 3, through the synergistic effect of the thermal insulation partition 301, the reflective film layer 302, and the thermally conductive pad 303, effectively blocks heat radiation and heat conduction between the heating cavity and the control cavity. The reflective film layer 302, coated on one outer wall of the thermal insulation partition 301, is made of aluminum foil and has undergone anti-oxidation treatment, which can reflect some heat back to the heating cavity and reduce heat transfer to the external environment. The thermally conductive pad 303 is fixed to the other outer wall of the thermal insulation partition 301 and is tightly attached to the outer wall of the cooling body 1, used to conduct and disperse the remaining heat to the outer wall of the cooling body 1. This design not only reduces the impact of heat radiation on the control cavity, but also avoids the problem of performance degradation of the control system caused by heat conduction.

[0036] During actual installation, operators can adjust the height of the support feet 104 according to specific working conditions to ensure the cooling device is installed horizontally. The height of the support feet 104 can be flexibly adjusted using adjusting screws, and the anti-slip pads at their bottoms are made of rubber, effectively preventing the device from sliding or tipping over during operation. Furthermore, both the inlet 102 and outlet 103 use standard threaded interfaces for easy and quick connection to external coolant pipes, ensuring the normal operation of the cooling system.

[0037] The mounting bracket 304 secures the heat insulation plate 301 to one outer wall of the cooling body 1 via bolts. This design makes the installation and disassembly of the heat insulation protection component 3 more convenient, facilitating subsequent maintenance and replacement. For example, if the reflective film layer 302 ages or is damaged after prolonged use, operators can quickly disassemble the mounting bracket 304 and replace the heat insulation plate 301, thereby restoring the performance of the heat insulation protection component 3.

[0038] As can be seen from the specific application scenarios described above, this invention achieves uniform distribution of coolant and efficient heat dissipation through the optimized design of the multi-stage flow channel component 2. Simultaneously, the synergistic effect of the thermal isolation protection component 3 effectively suppresses heat transfer between the heating chamber and the control chamber. Furthermore, the height-adjustable function of the support foot 104 and the convenient design of the inlet 102 and outlet 103 further enhance the adaptability and ease of use of the device. These improvements collectively overcome the shortcomings of existing technologies, providing a more reliable guarantee for the stable operation of vacuum magnetron sputtering equipment.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling device for the heating chamber of a vacuum magnetron sputtering machine, characterized in that, The cooling system includes a cooling body (1), a multi-stage flow channel assembly (2), and a thermal isolation protection assembly (3). The cooling body (1) is equipped with the multi-stage flow channel assembly (2), and the thermal isolation protection assembly (3) is installed on one side of the outer wall of the cooling body (1). The multi-stage flow channel assembly (2) includes a main cooling channel (201), a branch cooling channel (202), a flow divider (203), a guide groove (204), and a coolant circulation pump (205). The cooling body (1) is symmetrically equipped with main cooling channels (201). The main cooling channels (201) are connected to each other through the flow divider (203). The flow divider (203) has multiple guide grooves (204). The two ends of the main cooling channels (201) are connected to the branch cooling channels (202). The outlet end of the branch cooling channels (202) is connected to the coolant circulation pump (205). The coolant circulation pump (205) is fixedly installed on the bottom outer wall of the cooling body (1).

2. The cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 1, characterized in that, The cooling body (1) has heat dissipation fins (101) evenly distributed on the inner wall of its top end. The outer wall of the heat dissipation fins (101) is in contact with the outer wall of the main cooling channel (201). The thickness of the heat dissipation fins (101) is 2 mm to 3 mm.

3. The heating chamber cooling device for a vacuum magnetron sputtering machine according to claim 1, characterized in that, The thermal insulation protection component (3) includes a heat insulation partition (301), a reflective film layer (302), a thermally conductive pad (303), and a fixing bracket (304). The outer wall of one side of the heat insulation partition (301) is coated with a reflective film layer (302), and the outer wall of the other side of the heat insulation partition (301) is fixedly connected to a thermally conductive pad (303). The outer wall of one side of the thermally conductive pad (303) is attached to the outer wall of the cooling body (1), and the heat insulation partition (301) is fixedly installed on the outer wall of one side of the cooling body (1) by the fixing bracket (304).

4. The cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 1, characterized in that, The cooling body (1) has an inlet (102) and an outlet (103) on one side of its outer wall. The inlet (102) is located at the inlet end of the coolant circulation pump (205), and the outlet (103) is located at the outlet end of the main cooling channel (201).

5. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 1, characterized in that, Support feet (104) are symmetrically installed on the bottom outer wall of the cooling body (1). The height of the support feet (104) is adjustable, and the bottom of the support feet (104) is provided with anti-slip pads.

6. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 1, characterized in that, The cross-sectional shape of the guide channel (204) is circular, and the width of the guide channel (204) gradually decreases from the center of the diverter plate (203) to both sides. The number of guide channels (204) is 8 to 12.

7. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 3, characterized in that, The thickness of the heat insulation partition (301) is 5 mm to 8 mm, the material of the reflective film layer (302) is aluminum foil, and the surface of the reflective film layer (302) is treated with anti-oxidation.

8. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 1, characterized in that, The coolant circulation pump (205) is fixedly installed on the bottom outer wall of the cooling body (1) by bolt connection.

9. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 3, characterized in that, The fixed bracket (304) uses bolts to fix the heat insulation plate (301) to one side of the outer wall of the cooling body (1).

10. A cooling device for the heating chamber of a vacuum magnetron sputtering machine according to claim 4, characterized in that, Both the inlet (102) and outlet (103) adopt a standard threaded interface design.

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