Refrigeration assembly mounting structure for a refrigerator

Abstract

The utility model discloses a refrigeration assembly mounting structure of refrigerating machine, including cold jar, the refrigeration assembly of being located at the bottom of cold jar, refrigeration assembly includes semiconductor refrigeration piece and guide cold piece, and semiconductor refrigeration piece has refrigeration end and heating end, and one end of guide cold piece is in contact with the bottom heat transfer of cold jar, and the other end of guide cold piece is in contact with refrigeration end heat transfer, and the heating end is connected with the fin of radiating, and the fastener of making through the heat insulation material between the fin of radiating and guide cold piece fixed connection, make semiconductor refrigeration piece clamping fixed between the fin of radiating and guide cold piece.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a refrigeration component installation structure for a refrigeration machine. Background Technology

[0002] A Chinese patent with publication number CN215665234U discloses a household smart kitchen waste bin, including a bin body and a lid covering the bin body. The bin body has a heat insulation cavity and an inner liner inside the heat insulation cavity. A semiconductor cooling chip is provided at the bottom of the heat insulation cavity. The cold end of the semiconductor cooling chip is located inside the heat insulation cavity and in contact with the inner liner, while the hot end of the semiconductor cooling chip is located outside the heat insulation cavity. The bin body has a ventilation structure for dissipating heat from the hot end of the semiconductor cooling chip.

[0003] However, the aforementioned food waste bin has the following drawbacks: the semiconductor cooling chip of the food waste bin is embedded in the bottom of the inner liner, and the distance between its cooling end and heating end is small, which makes it easy for the heat from the heating end to be transferred to the cooling end, reducing the cold insulation performance of the inner liner, which urgently needs to be improved. Utility Model Content

[0004] The purpose of this invention is to provide a refrigeration component installation structure for a refrigeration machine, which can effectively reduce the impact of heat generated at the heating end on the cold storage performance of the cold container, thereby improving the refrigeration effect of the equipment.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a refrigeration component installation structure for a refrigerator, including a cold barrel and a refrigeration component disposed at the bottom of the cold barrel. The refrigeration component includes a semiconductor refrigeration chip and a heat-conducting component. The semiconductor refrigeration chip has a cooling end and a heating end. One end of the heat-conducting component contacts the bottom of the cold barrel for heat transfer, and the other end of the heat-conducting component contacts the cooling end for heat transfer. The heating end is connected to heat dissipation fins, and the heat dissipation fins are fixedly connected to the cooling conductor by fasteners made of heat insulation material, so that the semiconductor cooling chip is clamped and fixed between the heat dissipation fins and the cooling conductor.

[0006] By adopting the above technical solution, the heat of the cold bucket of this utility model can be transferred to the thermoelectric cooler through the heat-conducting component. The heat-conducting component increases the distance between the bottom of the cold bucket and the heating end of the thermoelectric cooler, effectively preventing the heat generated at the heating end from affecting the heat conduction efficiency of the cooling end. At the same time, the heat-conducting component and the heat dissipation fins of this utility model are connected by fasteners made of heat-insulating material, which can effectively prevent the heat on the heat dissipation fins from being transferred to the heat-conducting component through the fasteners, thus affecting the heat transfer effect of the heat-conducting component. Meanwhile, the fasteners clamp and fix the thermoelectric cooler in the gap between the heat-conducting component and the heat dissipation fins, which can improve the installation firmness of the thermoelectric cooler. Through the dual isolation effect of the heat-conducting component and the fasteners made of heat-insulating material, this utility model can effectively reduce the impact of the heat generated at the heating end on the cold bucket's cold preservation performance, thereby improving the cooling effect of the equipment.

[0007] A further feature of this invention is that the fastener includes a screw portion and a screw head, the screw head cooperates with the heat dissipation fin stop, the heat dissipation fin has an installation hole corresponding to the screw portion, the cooling guide has a lug, the lug has a threaded hole corresponding to the screw portion, and the screw portion passes through the installation hole and is threadedly connected to the threaded hole.

[0008] By adopting the above technical solution, the screw part of the fastener can be connected to the lug thread of the cooling component, ensuring that the entire cooling end of the thermoelectric cooler is in contact with the bottom surface of the cooling component. This not only achieves effective avoidance between the thermoelectric cooler and the fastener, but also improves the heat transfer efficiency between the thermoelectric cooler and the cooling component.

[0009] A further feature of this invention is that: an installation sleeve is inserted into the installation hole, the screw portion passes through the installation sleeve, and one end of the installation sleeve near the screwing head extends radially to form a stop portion, one end of the stop portion abuts against the heat dissipation fins, and the other end of the stop portion abuts against the screwing head.

[0010] By adopting the above technical solution, the mounting sleeve can prevent the fasteners from directly contacting the heat sink fins, thereby improving the connection strength between the fasteners and the heat sink fins.

[0011] A further feature of this invention is that the mounting sleeve has a through hole corresponding to the screw portion, the screw portion passes through the through hole, and the axis of the through hole is eccentrically set with respect to the axis of the mounting sleeve.

[0012] By adopting the above technical solution, the through hole is opened eccentrically relative to the mounting sleeve, preventing the mounting sleeve from rotating unexpectedly when the fastener rotates.

[0013] A further feature of this invention is that the heat dissipation fins include a heat-conducting plate and a fin portion integrally disposed on the heat-conducting plate. The fin portion has a clearance space for installing the fastener, and the clearance space communicates with the mounting hole.

[0014] A further feature of this invention is that the finned portion includes a plurality of heat dissipation fins distributed in parallel at the bottom of the heat-conducting plate, a heat dissipation gap is formed between adjacent heat dissipation fins, and a fan is provided at the bottom of the heat dissipation fins, wherein the air inlet or air outlet of the fan is connected to the lower opening of the heat dissipation gap.

[0015] By adopting the above technical solution, the heat on the heat sink fins can be carried away by the fan through the heat dissipation gap, thereby cooling the semiconductor heating end.

[0016] A further feature of this invention is that a positioning groove is formed on the surface of the heat-conducting plate away from the fin portion, and the semiconductor cooling chip is positioned and engaged with the positioning groove.

[0017] By adopting the above technical solution, the addition of positioning grooves can improve the installation stability of the semiconductor cooling chip on the heat sink fins.

[0018] A further feature of this invention is that: a heat insulation cotton is provided around the semiconductor cooling chip, the heat insulation cotton is used to isolate the heat between the cooling end and the heating end, and the fastener penetrates through the heat insulation cotton.

[0019] By adopting the above technical solution, the heat insulation cotton can prevent heat from the heating end from being transferred to the cooling end, thereby improving the cooling effect of the semiconductor cooling chip.

[0020] A further feature of this invention is that the bottom of the cold barrel is threadedly connected to the upper surface of the cooling guide by a number of screws.

[0021] By adopting the above technical solution, screws can be used to improve the tightness of the fit between the cold barrel and the upper surface of the heat-conducting component, thereby improving the heat transfer efficiency of the heat-conducting component to the cold barrel.

[0022] A further feature of this invention is that an insulation layer is filled between the cold barrel and the heat dissipation fins, and the heat-conducting component is wrapped in the insulation layer.

[0023] By adopting the above technical solution, the insulation layer can improve the thermal insulation performance between the cold barrel and the heat dissipation fins, thereby improving the cold barrel's cold retention capacity.

[0024] In summary, this utility model has the following beneficial effects: This invention employs a cooling conductor placed between the bottom of the cold storage container and the cooling end of the thermoelectric cooler, with heat dissipation fins connected to the bottom of the heating end of the thermoelectric cooler. This allows heat from the cold storage container to be transferred to the thermoelectric cooler via the cooling conductor. The cooling conductor increases the distance between the bottom of the cold storage container and the heating end of the thermoelectric cooler, effectively preventing heat generated at the heating end from affecting the heat conduction efficiency of the cooling end. Furthermore, the heat dissipation fins and the cooling conductor are fixedly connected by fasteners made of insulating material, which effectively prevents heat from the heat dissipation fins from being transferred to the cooling conductor through the fasteners, thus preventing it from affecting the heat transfer effect of the cooling conductor. At the same time, the fasteners clamp and fix the thermoelectric cooler in the gap between the cooling conductor and the heat dissipation fins, improving the installation firmness of the thermoelectric cooler. Through the dual isolation effect of the cooling conductor and the fasteners made of insulating material, this invention effectively reduces the impact of heat generated at the heating end on the cold storage performance of the cold storage container, thereby improving the cooling effect of the equipment. Attached Figure Description

[0025] Figure 1 This is an assembly diagram of the cold bucket, refrigeration components, heat dissipation fins and fan of this utility model.

[0026] Figure 2 This is a utility model Figure 1 Top view.

[0027] Figure 3 This is a utility model Figure 2 A sectional view of section AA in the middle.

[0028] Figure 4 This is a utility model Figure 3 A magnified view of a portion of region B in the middle.

[0029] Figure 5 This is a utility model Figure 1 Another sectional view.

[0030] Figure 6 This is a utility model Figure 5 A magnified view of a portion of region C.

[0031] Figure 7 This is an exploded view of the refrigeration component and heat sink fins of this utility model.

[0032] Figure 8 This is another exploded view of the refrigeration component and heat sink fins of this utility model.

[0033] In the diagram: 1. Refrigeration unit body; 11. Insulation layer; 2. Cold barrel; 21. Screw; 22. Temperature detection device; 3. Semiconductor refrigeration chip; 31. Refrigeration end; 32. Heating end; 4. Cooling conductor; 41. Lug; 411. Threaded hole; 5. Heat dissipation fins; 51. Heat conduction plate; 511. Mounting hole; 512. Mounting sleeve; 5121. Through hole; 5122. Stop part; 513. Positioning groove; 52. Fin part; 521. Clearance space; 522. Heat dissipation gap; 6. Fastener; 61. Screw part; 62. Tightening head; 7. Fan; 8. Insulation cotton. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings.

[0035] A refrigeration component mounting structure for a refrigerator, such as Figures 1-6 As shown, the device includes a cold bucket 2 and a refrigeration assembly located at the bottom of the cold bucket 2. The refrigeration assembly includes a semiconductor refrigeration chip 3 and a heat-conducting component 4. In this embodiment, at least two sets of refrigeration assemblies are provided, and multiple sets of refrigeration assemblies work together to cool the cold bucket 2. The semiconductor refrigeration chip 3 has a cooling end 31 and a heating end 32. One end of the heat-conducting component 4 contacts the bottom of the cold bucket 2 for heat transfer, and the other end of the heat-conducting component 4 contacts the cooling end 31 for heat transfer. The heating end 32 is connected to heat dissipation fins 5. The heat dissipation fins 5 and the heat-conducting component 4 are fixedly connected by fasteners 6 made of heat-insulating material, so that the semiconductor refrigeration chip 3 is clamped and fixed between the heat dissipation fins 5 and the heat-conducting component 4. In this embodiment, the fasteners 6 are plastic screws made of polymer heat-insulating material. The semiconductor refrigeration chip 3 is surrounded by heat insulation cotton 8, which is used to isolate the heat dissipation fins 3 from the bottom of the cold bucket 2. The heat between the cold end 31 and the heating end 32 is contained, and the fastener 6 penetrates the insulation cotton 8. The insulation cotton 8 can prevent the heat from the heating end 32 from being transferred to the cooling end 31, thereby improving the cooling effect of the semiconductor cooling chip 3. The bottom of the cold barrel 2 is connected to the upper surface of the cooling conductor 4 by several screws 21. The screws 21 can improve the tightness of the fit between the cold barrel 2 and the upper surface of the cooling conductor 4, thereby improving the heat transfer efficiency of the cooling conductor 4 to the cold barrel 2. A heat insulation layer 11 is filled between the cold barrel 2 and the heat dissipation fins 5, and the cooling conductor 4 is wrapped in the heat insulation layer 11. The heat insulation layer 11 can improve the heat insulation performance between the cold barrel 2 and the heat dissipation fins 5, thereby improving the cold retention capacity of the cold barrel 2. In addition, a temperature detection device 22 is attached to the top outer wall of the cold barrel 2 to detect the real-time temperature of the cold barrel 2.

[0036] like Figures 2-8As shown, the fastener 6 includes a screw portion 61 and a screw head 62. The screw head 62 cooperates with the stop of the heat dissipation fin 5. The heat dissipation fin 5 has a mounting hole 511 corresponding to the screw portion 61. The cooling component 4 has a lug 41, and the lug 41 has a threaded hole 411 corresponding to the screw portion 61. The screw portion 61 passes through the mounting hole 511 and is threadedly connected to the threaded hole 411, so that the screw portion 61 of the fastener 6 can be threadedly connected to the lug 41 of the cooling component 4, ensuring that the entire surface of the cooling end 31 of the thermoelectric cooler 3 is in contact with the bottom surface of the cooling component 4. This not only achieves effective avoidance between the thermoelectric cooler 3 and the fastener 6, but also improves the heat transfer efficiency between the thermoelectric cooler 3 and the cooling component 4. A mounting sleeve 512 is inserted into the mounting hole 511. The screw portion 61 passes through the mounting sleeve 512. The end of the mounting sleeve 512 near the screw head 62 extends radially to form a stop portion 5122. One end of the stop portion 5122 abuts against the heat dissipation fins 5, and the other end of the stop portion 5122 abuts against the screw head 62. The mounting sleeve 512 can prevent the fastener 6 from directly contacting the heat dissipation fins 5, thereby improving the connection between the fastener 6 and the heat dissipation fins 5. The mounting sleeve 512 has a through hole 5121 corresponding to the screw portion 61. The screw portion 61 passes through the through hole 5121, and the axis of the through hole 5121 is eccentrically set with the axis of the mounting sleeve 512, so that the through hole 5121 is eccentrically set relative to the mounting sleeve 512, preventing the mounting sleeve 512 from accidentally rotating when the fastener 6 rotates.

[0037] like Figures 1-8 As shown, the heat dissipation fin 5 includes a heat-conducting plate 51 and a fin portion 52 integrally formed on the heat-conducting plate 51. The fin portion 52 has a clearance space 521 for installing fasteners 6, and the clearance space 521 communicates with the mounting hole 511. The fin portion 52 includes a plurality of heat dissipation fins distributed in parallel on the bottom of the heat-conducting plate 51, and a heat dissipation gap 522 is formed between adjacent heat dissipation fins. A fan 7 is provided at the bottom of the heat dissipation fin 5. The air outlet of the fan 7 communicates with the lower opening of the heat dissipation gap 522. The fan 7 draws in external cold air and blows it toward the heat dissipation gap 522, thereby removing the heat on the heat dissipation fin 5 and cooling the semiconductor heating end 32. A positioning groove 513 is provided on the surface of the heat-conducting plate 51 away from the fin portion 52. The semiconductor cooling chip 3 is positioned and matched with the positioning groove 513. The addition of the positioning groove 513 can improve the installation stability of the semiconductor cooling chip 3 on the heat dissipation fin 5.

[0038] The basic working principle of this invention is as follows: a heat-conducting component 4 is provided between the bottom of the cold barrel 2 and the cooling end 31 of the semiconductor refrigeration chip 3; heat dissipation fins 5 are connected to the bottom of the heating end 32 of the semiconductor refrigeration chip 3, so that the heat of the cold barrel 2 can be transferred to the semiconductor refrigeration chip 3 through the heat-conducting component 4. The heat-conducting component 4 increases the distance between the bottom of the cold barrel 2 and the heating end 32 of the semiconductor refrigeration chip 3, effectively preventing the heat generated by the heating end 32 from affecting the heat conduction efficiency of the cooling end 31. In addition, a heat-insulating material is used between the heat dissipation fins 5 and the heat-conducting component 4. The fasteners 6, made of insulating material, are used for fixing and connecting the components. This effectively prevents heat from the heat sink fins 5 from being transferred to the heat conduction component 4 through the fasteners 6, thus avoiding any impact on the heat transfer effect of the heat conduction component 4. At the same time, the fasteners 6 clamp and fix the semiconductor cooling chip 3 in the gap between the heat conduction component 4 and the heat sink fins 5, thereby improving the installation firmness of the semiconductor cooling chip 3. Through the dual isolation effect of the heat conduction component 4 and the fasteners 6 made of insulating material, this utility model can effectively reduce the impact of the heat generated by the heating end 32 on the cold storage performance of the cold barrel 2, thereby improving the cooling effect of the equipment.

[0039] The above description is only a preferred embodiment of the present utility model. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of the present utility model patent application are included in the scope of the present utility model patent application.

Claims

1. A refrigeration component installation structure for a refrigerator, characterized in that: The device includes a cold barrel (2) and a refrigeration assembly disposed at the bottom of the cold barrel (2). The refrigeration assembly includes a semiconductor refrigeration chip (3) and a heat-conducting component (4). The semiconductor refrigeration chip (3) has a cooling end (31) and a heating end (32). One end of the heat-conducting component (4) contacts the bottom of the cold barrel (2) for heat transfer, and the other end of the heat-conducting component (4) contacts the cooling end (31) for heat transfer. The heating end (32) is connected to a heat dissipation fin (5), and the heat dissipation fin (5) is fixedly connected to the heat conduction component (4) by a fastener (6) made of heat insulation material, so that the semiconductor cooling chip (3) is clamped and fixed between the heat dissipation fin (5) and the heat conduction component (4).

2. The refrigeration component installation structure of a refrigerator according to claim 1, characterized in that: The fastener (6) includes a screw part (61) and a screw head (62). The screw head (62) is engaged with the heat dissipation fins (5). The heat dissipation fins (5) have a mounting hole (511) corresponding to the screw part (61). The cooling guide (4) has a lug (41). The lug (41) has a threaded hole (411) corresponding to the screw part (61). The screw part (61) passes through the mounting hole (511) and is threadedly connected to the threaded hole (411).

3. The refrigeration component installation structure of a refrigerator according to claim 2, characterized in that: An installation sleeve (512) is inserted into the mounting hole (511), and the screw part (61) passes through the installation sleeve (512). The end of the installation sleeve (512) near the screw head (62) extends radially to form a stop part (5122). One end of the stop part (5122) abuts against the heat dissipation fins (5), and the other end of the stop part (5122) abuts against the screw head (62).

4. The refrigeration component installation structure of a refrigerator according to claim 3, characterized in that: The mounting sleeve (512) has a through hole (5121) corresponding to the screw part (61), the screw part (61) passes through the through hole (5121), and the axis of the through hole (5121) is eccentrically set with respect to the axis of the mounting sleeve (512).

5. The refrigeration component installation structure of a refrigerator according to claim 2, characterized in that: The heat dissipation fins (5) include a heat-conducting plate (51) and a fin portion (52) integrally disposed on the heat-conducting plate (51). The fin portion (52) has a clearance space (521) for installing the fastener (6), and the clearance space (521) communicates with the mounting hole (511).

6. The refrigeration component installation structure of a refrigerator according to claim 5, characterized in that: The finned portion (52) includes a plurality of heat dissipation fins that are parallel to each other on the bottom of the heat-conducting plate (51), and a heat dissipation gap (522) is formed between adjacent heat dissipation fins. A fan (7) is provided at the bottom of the heat dissipation fins (5), and the air inlet or air outlet of the fan (7) is connected to the lower opening of the heat dissipation gap (522).

7. The refrigeration component installation structure of a refrigerator according to claim 5, characterized in that: The heat-conducting plate (51) has a positioning groove (513) on its surface away from the fin portion (52), and the semiconductor cooling chip (3) is positioned and engaged with the positioning groove (513).

8. The refrigeration component installation structure of a refrigerator according to claim 1, characterized in that: The semiconductor cooling chip (3) is surrounded by heat insulation cotton (8), which is used to isolate the heat between the cooling end (31) and the heating end (32), and the fastener (6) penetrates the heat insulation cotton (8).

9. The refrigeration component installation structure of a refrigerator according to claim 1, characterized in that: The bottom of the cold barrel (2) is threadedly connected to the upper surface of the cooling guide (4) by several screws (21).

10. The refrigeration component installation structure of a refrigerator according to claim 1, characterized in that: A heat insulation layer (11) is filled between the cold barrel (2) and the heat dissipation fins (5), and the heat conduction component (4) is wrapped in the heat insulation layer (11).

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