An embedded refrigerator

Abstract

The utility model discloses an embedded refrigerator, including the box body with the support foot of bottom and set up the refrigerating plant of box body, the backside surface recessed formation air guide recess in box body, be equipped with the air outlet in the top board of box body, the refrigerating plant vertical setting is in the backside surface of box body, including semiconductor refrigeration piece, radiator and with the refrigeration surface of semiconductor refrigeration piece links to each other's radiating cooler, is connected with the radiator fan below, and the fan entrance of radiator fan is located in the air guide recess, and the radiating mouth of radiator sets up to the air outlet upwards, forms the radiating structure of back air inlet and top air outlet. Let embedded refrigerator when installing to the cabinet, need not let the box body left and right sides and the cabinet between the larger radiating gap of reserving, let the gap between box body and cabinet be smaller and keep better the close degree, neither will influence the refrigeration performance of refrigerator, also will not influence the overall appearance between refrigerator and cabinet.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to an embedded refrigerator. Background Technology

[0002] Traditional built-in refrigerators typically employ a side-ventilation design. The recessed space within the cabinet for the refrigerator needs to be designed to be 5-10cm wider than the refrigerator itself. This ensures that a 5-10cm ventilation gap is left on both sides after the refrigerator is installed in the cabinet, allowing for airflow and preventing the compressor from overheating, which could affect efficiency and lifespan. However, the current side-ventilation structure of built-in refrigerators creates excessively large ventilation gaps between the sides of the refrigerator and the cabinet, impacting the overall appearance. Utility Model Content

[0003] This utility model aims to solve the limitations of traditional built-in refrigerators that use a two-sided heat dissipation structure. It proposes a built-in refrigerator with a heat dissipation structure that allows air to enter from the back and exit from the top. This structure provides stable and reliable heat dissipation and ensures that there is no large gap between the refrigerator and the cabinet after it is installed, thus avoiding any impact on the overall appearance.

[0004] This utility model proposes an embedded refrigerator, including a cabinet 1 with supporting feet 2 at the bottom and a refrigeration device 5 disposed on the cabinet 1. The back side of the cabinet 1 is recessed to form an air guide groove 11. An air outlet 13 is provided on the top plate of the cabinet 1. The refrigeration device 5 is vertically disposed on the back side of the cabinet 1 and includes a semiconductor cooling chip 51, a radiator 52 connected to the heat dissipation surface of the semiconductor cooling chip 51, and a cooler 54 connected to the cooling surface of the semiconductor cooling chip 51. A cooling fan 53 is connected below the radiator 52 to provide the radiator 52 with a bottom-up cooling airflow. The fan inlet 531 of the cooling fan 53 is located in the air guide groove 11. The heat dissipation port of the radiator 52 is set upward toward the air outlet 13, thereby forming a heat dissipation structure with air intake at the back and air outlet at the top.

[0005] In some preferred embodiments, the height difference between the support foot 2 and the bottom of the housing 1 forms an air intake channel; an air inlet 12 is provided on the bottom plate of the housing 1, which connects the air intake channel and the air guide groove 11.

[0006] In some preferred embodiments, the cooling device 5 includes a semiconductor cooling chip 51, a heat sink 52 connected to the heat dissipation surface of the semiconductor cooling chip 51, and a cooler 54 connected to the cooling surface of the semiconductor cooling chip 51. A cooling fan 53 is connected below the heat sink 52 to provide heat dissipation airflow from bottom to top to the heat sink 52, and the heat dissipation port of the heat sink 52 is arranged facing the air outlet 13.

[0007] In some preferred embodiments, the cooling fan 53 is a vortex fan; there are two cooling fans 53, which are connected side by side below the heat sink 52.

[0008] In some preferred embodiments, the radiator 52 includes a plurality of vertically spaced heat sinks 521, with heat dissipation channels formed between adjacent heat sinks 521 facing the cooling fan 53, and heat dissipation ports of the cooling device 5 formed at the top of the plurality of heat dissipation channels.

[0009] In some preferred embodiments, a cooling port 10 communicating with the interior of the housing 1 is provided in the air guide groove 11, and the cooling surface of the semiconductor cooling chip 51 and the radiator 54 are located in the cooling port 10.

[0010] In some preferred embodiments, a cooling fan 55 is provided inside the cooling port 10, and the cooling fan 55 is an axial fan.

[0011] In some preferred embodiments, a protective backplate 6 is installed on the outer side of the cooling device 5, and a through hole 61 is provided on the protective backplate 6 at the position corresponding to the fan inlet 531 of the cooling fan 53. Several auxiliary heat dissipation holes 62 are provided on the top of the protective backplate 6 near the top of the heat sink 52.

[0012] In some preferred embodiments, the air outlet 13 is composed of several through holes located at the top of the air guide groove 11; the box body 1 is provided with multiple pull-out storage drawers 3, and a door 4 is provided on one side of the box body 1, which is fixedly connected to the storage drawer 3 located at the bottom.

[0013] In some preferred embodiments, a control circuit board 7 is also provided inside the air guide groove 11, and a protective cover 8 is provided outside the control circuit board 7; the control circuit board 7 is located below the cooling device 5.

[0014] In some preferred embodiments, a water receiving tray 9 is also provided in the air guide groove 11. The water receiving tray 9 is located below the control circuit board 7, and the inside of the housing 1 is connected to the water receiving tray 9 through a drain pipe 15.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The built-in refrigerator of this application, by setting air guide grooves, ensures that cold air from the air intake channel is supplied to the refrigeration unit for heat dissipation through the air guide grooves, and the hot air generated by the refrigeration unit is discharged through the air outlet at the top of the cabinet. This creates a heat dissipation structure where the refrigeration unit receives air from the back, the air flows through the air guide grooves to dissipate heat, and then the hot air is discharged from the top of the cabinet. This heat dissipation structure allows the built-in refrigerator to be installed in a cabinet without requiring a large gap between the left and right sides of the cabinet and the cabinet, allowing for a smaller gap and better fit. This does not affect the refrigerator's cooling performance or the overall shape of the refrigerator and the cabinet. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the embedded refrigerator of this application.

[0018] Figure 2 This is one of the three-dimensional exploded structural diagrams of the embedded refrigerator of this application.

[0019] Figure 3 This is the second exploded three-dimensional structural diagram of the embedded refrigerator of this application.

[0020] Figure 4 This is the third three-dimensional exploded structural diagram of the embedded refrigerator of this application.

[0021] Figure 5 This is a schematic diagram of the refrigeration device.

[0022] Figure 6 This is a schematic diagram of the internal structure of the embedded refrigerator of this application. The dotted lines with arrows indicate the direction of airflow. Detailed Implementation

[0023] To further illustrate the technical means and effects adopted by this application to achieve its intended purpose, the specific implementation methods, structures, features, and effects according to this application are described in detail below with reference to the accompanying drawings and preferred embodiments. In the following description, different "an embodiment" or "an embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0024] This application discloses an embedded refrigerator. Compared with the traditional embedded refrigerator that usually adopts a two-sided heat dissipation structure, this application mainly improves the heat dissipation structure of the embedded refrigerator. The embedded refrigerator adopts a bottom air intake and top air exhaust heat dissipation structure, which makes heat dissipation stable and reliable. This is beneficial because after being embedded and installed in the cabinet, there will be no large reserved heat dissipation gap between the refrigerator and the cabinet, which will affect the overall appearance.

[0025] Combination Figures 1-6 As shown, the built-in refrigerator disclosed in this application includes a cabinet 1 with a support foot 2 at the bottom, a plurality of pull-out storage drawers 3 provided on the cabinet 1, and a door 4 fixedly connected to the bottom storage drawer 3, so that the door 4 can be pulled out relative to the cabinet 1 by means of the storage drawer 3 to open or close the door 4.

[0026] By utilizing the height difference between the support leg 2 and the bottom of the cabinet 1, an air intake channel is formed at the bottom of the cabinet 1. Even if the width of the installation slot reserved on the cabinet is basically the same as the width of the built-in refrigerator, after the built-in refrigerator is installed in the cabinet, it can use the air intake channel at the bottom of the cabinet 1 to draw in external cold air for heat dissipation. This avoids leaving too large a gap between the two sides of the cabinet 1 and the cabinet, which would affect the overall aesthetic appearance.

[0027] The back side of the cabinet 1 is recessed to form an air guide groove 11, and an air outlet 13 is provided on the top plate of the cabinet 1. A vertically arranged refrigeration device 5 is located in the air guide groove 11, which provides the refrigeration function required for refrigeration.

[0028] An air inlet 12 is provided on the bottom plate of the housing 1. The air inlet 12 is connected to the air intake channel at the bottom of the housing 1 so that cold air outside the housing 1 can enter the air guide groove 11 through the air intake channel and the air inlet 12.

[0029] By setting the air guide groove 11, even when the back side of the built-in refrigerator body 1 is completely abutting the mounting groove of the cabinet during installation, the air guide groove 11 can still ensure that the cold air from outside is supplied to the refrigeration unit 5 for heat dissipation. The hot air generated by the refrigeration unit 5 is then discharged through the air outlet 13 at the top of the body 1. This forms a structure in which air enters from the back side of the body 1, flows through the air guide groove 11 on the back of the body 1 to dissipate heat from the refrigeration unit 5, and then is discharged from the top of the body 1. This heat dissipation structure eliminates the need for a large heat dissipation gap between the left and right sides of the body 1 and the cabinet when the built-in refrigerator is installed in the cabinet. It allows for a smaller gap between the body 1 and the cabinet, maintaining a good fit, which does not affect the refrigeration performance of the refrigerator or the overall shape of the refrigerator and the cabinet.

[0030] In some preferred embodiments, an air inlet 12 is provided on the bottom plate of the housing 1, and the air inlet 12 is connected to the air intake channel at the bottom of the housing 1, so that cold air from outside the housing 1 can enter the air guide groove 11 through the air intake channel and the air inlet 12. By providing an air intake channel at the bottom, it can be ensured that the cold air from outside flows into the air guide groove 11 more effectively.

[0031] The cooling device 5 mainly includes a thermoelectric cooler 51, a heat sink 52 connected to the heat dissipation surface of the thermoelectric cooler 51, and a cooler 54 connected to the cooling surface of the thermoelectric cooler 51. A cooling fan 53 is connected below the heat sink 52 to provide upward airflow to the heat sink 52. The fan inlet 531 of the cooling fan 53 is located in the air guide groove 11, and the heat dissipation port of the heat sink 52 faces the air outlet 13. The entire cooling device 5 forms a heat dissipation structure with air intake at the back and air outlet at the top.

[0032] The air outlet 13 is composed of several through holes located at the top of the air guide groove 11.

[0033] After the cooling fan 53 is started, the cold air that enters the air guide groove 11 is drawn in through the air intake of the cooling fan 53 and sent to the heat sink 52. The cold air is accelerated to flow through the heat sink 52 and then discharged upward through the air outlet 13, realizing a heat dissipation structure with bottom air intake and top air exhaust.

[0034] The cooling fan 53 is typically configured as a vortex fan, which features low operating noise and utilizes centrifugal force to accelerate airflow, significantly improving the heat dissipation capacity of the radiator 52. For example, as shown in the attached diagram, there are two cooling fans 53, connected side by side below the radiator 52. The two vortex fans generate a large amount of accelerated airflow, which blows upward over the radiator 52 and is then discharged from the air outlet 13 at the top of the casing 1, ensuring that the cooling device 5 maintains stable and reliable cooling performance.

[0035] The radiator 52 includes several vertically spaced heat dissipation fins 521. Adjacent heat dissipation fins 521 form heat dissipation channels facing the cooling fan 53. The tops of the heat dissipation channels form heat dissipation openings of the radiator 52. Therefore, the tops of the heat dissipation channels are positioned facing the air outlet 13 on the top of the housing 1, allowing airflow to quickly blow from bottom to top through the heat dissipation channels of the cooling fan 53 and then exit from the air outlet 13. The smooth airflow helps to improve the heat dissipation performance of the radiator 52, thereby ensuring that the refrigeration device 5 has stable and reliable refrigeration performance.

[0036] A cooling port 10, which communicates with the interior of the housing 1, is provided within the air guide groove 11. Figure 4 As shown. The cooling surface of the semiconductor cooling chip 51 and the heat sink 54 are located inside the cooling port 10, so that the cold energy generated by the semiconductor cooling chip 51 can be quickly dissipated from the cooling port 10 to the inside of the cabinet 1 through the heat sink 54, thereby providing low-temperature refrigeration for the objects placed in each storage drawer 3 inside the cabinet 1.

[0037] A cooling fan 55 can even be installed inside the cooling port 10. The cooling fan 55 is generally an axial fan. The cooling fan 55 generates airflow inside the cabinet 1 and circulates over the surface of the heat sink 54, accelerating the cooling surface of the semiconductor cooling chip 51 to quickly and more evenly distribute the cooling energy into the cabinet 1, so as to obtain a better cooling effect.

[0038] In addition, after the refrigeration unit 5 is vertically fixed in the air guide groove 115, a protective back plate 6 is installed on the outer side of the refrigeration unit 5 to protect it. The protective back plate 6 is fixedly assembled with the back side of the cabinet 1. When the refrigerator is installed in a cabinet, the protective back plate 6 can protect the refrigeration unit 5 from being loosened or damaged by external objects, thereby improving the reliability of the refrigerator's operation.

[0039] A through hole 61 is provided on the protective backplate 6 at the fan inlet 531 of the cooling fan 53 to facilitate the intake of cool air from the air guide groove 115 into the fan inlet 531. In addition, several auxiliary heat dissipation holes 62 are provided on the top of the protective backplate 6 near the top of the heat sink 52, so that some of the hot air flowing through the heat sink 52 can also be discharged from the auxiliary heat dissipation holes 62 to ensure rapid heat dissipation.

[0040] Furthermore, a control circuit board 7 is also housed within the air guide groove 11, and a protective cover 8 is provided on the outside of the control circuit board 7. The control circuit board 7 is located below the cooling device 5. This structure allows cold air from outside the housing 1 to flow through the air intake channel, pass through the protective cover 8, and then pass through the heat dissipation grooves on the protective cover 8 to dissipate heat from the control circuit board 7 before being drawn upwards into the fan inlet 531 to further dissipate heat from the cooling device 5. This eliminates the need for an additional heat dissipation structure for the control circuit board 7, achieving low cost and ensuring reliable operation of the control circuit board 7.

[0041] Furthermore, a water collection tray 9 is provided in the air guide groove 11. The water collection tray 9 is located below the control circuit board 7, and the interior of the cabinet 1 is connected to the water collection tray 9 through the drain pipe 15, so that the excess condensate generated inside the cabinet 1 when the refrigerator is working can be discharged into the water collection tray 9 in a timely manner through the drain pipe 15.

[0042] Since the drip tray 9 is located below the control circuit board 7, on the one hand, even if water spills from the drip tray 9, it will not fall upwards onto the control circuit board 7 and damage it. On the other hand, when the refrigeration unit 5 is working, the cooling fan 53 draws in cold air from the air intake channel and flows through the drip tray 9 first, which can accelerate the evaporation of condensate in the drip tray 9 and prevent excessive condensate from overflowing into the cabinet, further improving the user experience.

[0043] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An embedded refrigerator, comprising a cabinet (1) with supporting feet (2) at the bottom and a refrigeration device (5) disposed on the cabinet (1), characterized in that: The back side of the box (1) is concave to form an air guide groove (11); An air outlet (13) is provided on the top plate of the box (1); The cooling device (5) is vertically arranged on the back side of the box (1), including a semiconductor cooling chip (51), a heat sink (52) connected to the heat dissipation surface of the semiconductor cooling chip (51), and a cooler (54) connected to the cooling surface of the semiconductor cooling chip (51). A cooling fan (53) is connected below the heat sink (52) to provide the heat sink (52) with a bottom-up cooling airflow. The fan inlet (531) of the cooling fan (53) is located in the air guide groove (11), and the heat dissipation port of the heat sink (52) is set upward toward the air outlet (13).

2. The built-in refrigerator according to claim 1, characterized in that: The height difference between the support foot (2) and the bottom of the box (1) forms an air inlet channel; an air inlet (12) is provided on the bottom plate of the box (1) to connect the air inlet channel and the air guide groove (11).

3. The built-in refrigerator according to claim 1, characterized in that: The cooling fan (53) is a vortex fan; there are two cooling fans (53), which are connected side by side below the heat sink (52).

4. The built-in refrigerator according to claim 1, characterized in that: The radiator (52) includes several vertically spaced heat sinks (521), and a heat dissipation channel is formed between adjacent heat sinks (521) facing the cooling fan (53). The top of the heat dissipation channel forms the heat dissipation port of the cooling device (5).

5. The built-in refrigerator according to claim 1, characterized in that: A cooling port (10) communicating with the inside of the box (1) is provided in the air guide groove (11), and the cooling surface of the semiconductor cooling chip (51) and the heat sink (54) are located in the cooling port (10).

6. The built-in refrigerator according to claim 5, characterized in that: A cooling fan (55) is provided inside the cooling port (10), and the cooling fan (55) is an axial flow fan.

7. The built-in refrigerator according to claim 2, characterized in that: A protective backplate (6) is installed on the outer side of the cooling device (5). A through hole (61) is provided on the protective backplate (6) corresponding to the fan inlet (531) of the cooling fan (53). Several auxiliary heat dissipation holes (62) are provided on the top of the protective backplate (6) near the top of the radiator (52).

8. The built-in refrigerator according to claim 1, characterized in that: The air outlet (13) is composed of several through holes located at the top of the air guide groove (11); the box (1) is provided with multiple pull-out storage drawers (3), and a door (4) is provided on one side of the box (1), which is fixedly connected to the storage drawer (3) located at the bottom.

9. The built-in refrigerator according to any one of claims 1-8, characterized in that: The air guide groove (11) is also provided with a control circuit board (7), and a protective cover (8) is provided on the outside of the control circuit board (7); the control circuit board (7) is located below the refrigeration device (5).

10. The built-in refrigerator according to claim 9, characterized in that: A water receiving tray (9) is also provided in the air guide groove (11). The water receiving tray (9) is located below the control circuit board (7), and the inside of the box (1) is connected to the water receiving tray (9) through the drain pipe (15).

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