Anaerobic high-temperature furnace for processing circuit board chips

Abstract

The utility model discloses an anaerobic high temperature furnace is used in circuit board chip processing, including furnace body, furnace body upper layer is as heating layer, furnace body lower layer is as control layer, and the side of furnace body is equipped with the console, is equipped with the muffle furnace in the heating layer, is equipped with the heater in the muffle furnace, is equipped with nitrogen gas inlet, argon gas inlet, gas detection port and temperature sensor on the back wall of muffle furnace, the top of furnace body upper layer is equipped with and communicates with the oxygen exhaust unit of muffle furnace inside, and the oxygen exhaust unit includes the protective cover and valve controller, and the protective cover is connected with the furnace body, and the inboard of protective cover is equipped with the electric control valve, and the electric control valve is electrically connected with valve controller, and the back of protective cover is equipped with the exhaust fan, and is equipped with oxygen concentration detector, main control unit in control layer, and the detection end of oxygen concentration detector is located in the gas detection port, and the back of console is equipped with nitrogen gas interface, argon gas interface, nitrogen pressure regulating valve and argon pressure regulating valve. The utility model can improve the accurate control to oxygen content, and further improve the equipment production efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of equipment for manufacturing circuit board chips, specifically an anaerobic high-temperature furnace for processing circuit board chips. Background Technology

[0002] An anaerobic high-temperature atmosphere furnace is a furnace in which an artificially prepared atmosphere of a certain composition is introduced into the furnace at a predetermined temperature to achieve a certain heat treatment purpose, such as gas carburizing, carbonitriding, and bright quenching.

[0003] In the heating and curing process of semiconductor wafers, such as those used in circuit board chips, high cleanliness and low oxygen concentration conditions are required within the atmosphere furnace to prevent contamination of the wafers and oxidation of the semiconductor materials on the circuit board chips. Existing anaerobic high-temperature atmosphere furnaces have revealed the following problems: the entire production cycle is long, requiring more than 8 hours. This excessively long cycle is due to the high oxygen content requirement of the internal cavity, which cannot exceed 30 ppm. However, existing furnaces cannot automatically detect the oxygen content. Therefore, the oxygen can only be slowly discharged after processing to achieve cooling and maintain the required oxygen content, ultimately leading to a long process time. Thus, existing high-temperature atmosphere furnaces cannot accurately and quickly control the internal oxygen content, resulting in excessively long production cycles and low work efficiency. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of this invention is to provide an anaerobic high-temperature furnace for circuit board chip processing to solve the problem mentioned in the background art that existing anaerobic high-temperature atmosphere furnaces cannot accurately and quickly control the internal oxygen content, resulting in excessively long production cycles and ultimately low work efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an anaerobic high-temperature furnace for circuit board chip processing, comprising a furnace body separated into upper and lower layers, the upper layer of the furnace body serving as a heating layer, and the lower layer of the furnace body serving as a control layer. A control panel is provided on the side of the furnace body. A muffle furnace is installed inside the heating layer, with a heater installed on each of the two sides inside the muffle furnace. A nitrogen inlet, an argon inlet, a gas detection port, and a temperature sensor are provided on the rear wall of the muffle furnace. An oxygen venting unit communicating with the interior of the muffle furnace is installed above the upper layer of the furnace body. The oxygen venting unit includes a protective cover and a valve controller. The furnace body is connected, and an electrically controlled valve is installed inside the protective cover. The electrically controlled valve is electrically connected to the valve controller. An exhaust fan is installed behind the protective cover. An oxygen concentration detector and a main controller are installed inside the control layer. The detection end of the oxygen concentration detector is located inside the gas detection port. A nitrogen interface, an argon interface, a nitrogen pressure regulating valve, and an argon pressure regulating valve are installed on the back of the control panel. A temperature controller electrically connected to a temperature sensor and a heater is installed on the front of the control panel. The main controller is electrically connected to the oxygen concentration detector, valve controller, exhaust fan, temperature sensor, argon pressure regulating valve, heater, and nitrogen pressure regulating valve.

[0006] Preferably, in order to achieve automatic detection of nitrogen flow rate, nitrogen pressure, argon flow rate, and argon pressure, and further ensure that the oxygen concentration of the final equipment meets the preset requirements, thereby achieving precise control of oxygen content and further improving the product qualification rate, the nitrogen inlet is connected to a nitrogen pressure regulating valve and a nitrogen interface through a nitrogen pipeline, and the argon inlet is connected to an argon pressure regulating valve and an argon interface through an argon pipeline. The front of the control panel is equipped with a nitrogen flow regulating valve and an argon flow regulating valve that are electrically connected to the main controller. The nitrogen flow regulating valve is connected to the nitrogen pipeline to regulate the incoming nitrogen flow rate, and the argon flow regulating valve is connected to the argon pipeline to regulate the incoming argon flow rate.

[0007] Preferably, for ease of operation, the front of the control panel is also equipped with a stop button, a start button, an oxygen concentration display, an argon pressure alarm indicator, an oxygen concentration alarm indicator, a nitrogen pressure alarm indicator, a fault alarm buzzer, and a three-color indicator light for working status, all electrically connected to the main controller.

[0008] Preferably, for ease of operation, protective cabinet doors are hinged to both the upper and lower layers of the furnace body. Four casters are provided at the bottom of the furnace body. A cooling system electrically connected to the main controller is provided inside the protective cabinet door. Cooling water inlet pipe and cooling water outlet pipe connected to the cooling system are provided on the side of the upper protective cabinet door. The main controller is electrically connected to the cooling system.

[0009] Preferably, in order to ensure that the equipment can only be started after the cabinet door is locked, and to further improve safety, a door lock detection sensor is provided on the upper and lower sides of the furnace body to detect whether the corresponding protective cabinet door is locked. The door lock detection sensor is electrically connected to the main controller.

[0010] This utility model also discloses a furnace body pipeline control system, including control pipelines for use in the anaerobic high-temperature furnace for circuit board chip processing. The control pipelines include a heater, a temperature sensor, an electrically controlled valve, an exhaust fan, a valve controller, an oxygen concentration detector, a main controller, a nitrogen pressure regulating valve, a nitrogen flow regulating valve, an argon flow regulating valve, a temperature controller, and an argon pressure regulating valve. The valve controller is connected to the electrically controlled valve, the temperature controller is electrically connected to the heater and the temperature sensor, and the main controller is connected to the valve controller, the exhaust fan, and the oxygen concentration detector. The oxygen concentration detector, nitrogen pressure regulating valve, argon pressure regulating valve, nitrogen flow regulating valve, and argon flow regulating valve are electrically connected. The argon pressure regulating valve and argon flow regulating valve are connected to the argon inlet of the anaerobic high-temperature furnace for circuit board chip processing via argon pipelines. The nitrogen pressure regulating valve and nitrogen flow regulating valve are connected to the nitrogen inlet of the anaerobic high-temperature furnace for circuit board chip processing via nitrogen pipelines. The oxygen concentration detector is also connected to the gas detection port of the anaerobic high-temperature furnace for circuit board chip processing.

[0011] Preferably, in order to achieve automatic cooling control, the control pipeline further includes a cooling control pipeline, which includes a water flow regulating valve and a water flow sensor. The water flow regulating valve and the water flow sensor are connected to the cooling water inlet pipe and the cooling water outlet pipe in the anaerobic high-temperature furnace for processing circuit board chips through a water flow pipeline.

[0012] Preferably, the control circuit performs the following control steps: S1. Place the product to be processed into the muffle furnace, close the cabinet door, press the start button, and the equipment will work according to the set requirements; S2. First, nitrogen is introduced into the muffle furnace to replace the internal air, and then argon is introduced for replacement. The oxygen concentration meter in the oxygen concentration detector is started by the main controller to measure the oxygen concentration value in real time to see if it reaches the preset requirement. If it does, proceed to the next step; if it does not, the valve controller is activated to drive the electric control valve and exhaust fan to open and quickly exhaust the internal air to replace the air until the oxygen concentration value reaches the preset requirement, then proceed to the next step. S3. The heater is started by controlling the temperature controller to start the heating operation, and the temperature sensor detects the temperature of the muffle furnace in real time. After the internal temperature of the muffle furnace is raised to the preset temperature, the product is carbonized. During the operation, if there is an error, the three-color indicator light of the working status is controlled by the main controller to light up to remind the user of the error.

[0013] Preferably, when nitrogen is introduced in step S2, the main controller controls the nitrogen pressure regulating valve to regulate the pressure and controls the nitrogen flow regulating valve to regulate the nitrogen input. When argon is introduced, the main controller controls the argon pressure regulating valve to regulate the pressure and controls the argon flow regulating valve to regulate the argon input.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This structure adopts an automatic oxygen content detection system added to the furnace body and combined with a rapid oxygen removal unit. Compared with the prior art, which cannot automatically detect oxygen content and can only achieve cooling and ensure that the oxygen content meets the requirements by slowly removing the internal oxygen after processing, thus resulting in a long process time, this structure design further realizes precise and rapid control of oxygen content, thereby improving the production efficiency of the equipment. Attached Figure Description

[0015] Figure 1 This is a front structural diagram of an anaerobic high-temperature furnace for processing circuit board chips in Embodiment 1 of this invention. Figure 2 for Figure 1 Reference diagram of the internal structure of the middle and upper layers; Figure 3 This is a schematic diagram of the right side structure of an anaerobic high-temperature furnace for processing circuit board chips in this embodiment 1 without an installed control panel. Figure 4 This is a schematic diagram of the back structure of an anaerobic high-temperature furnace for processing circuit board chips in Embodiment 1 of this invention. Figure 5 This is a schematic diagram of the exploded structure of an anaerobic high-temperature furnace for processing circuit board chips in Embodiment 1 without an installed control panel. Figure 6 This is a schematic diagram of the pipeline connection of a furnace body pipeline control system in Embodiment 1; Figure 7 This is a timing reference diagram for the air intake and exhaust of the control pipeline in Embodiment 1.

[0016] In the diagram: 1. Furnace body; 2. Control panel; 3. Muffle furnace; 30. Exhaust pipe; 302. Condenser pipe; 303. Cooling fan; 4. Heater; 5. Nitrogen inlet; 6. Argon inlet; 7. Gas detection port; 8. Temperature sensor; 9. Protective cover; 901. Protective cover body; 10. Electrically controlled valve; 10. Electrically controlled bracket; 101. Exhaust fan; 11. Oxygen concentration detector; 12. Main controller; 13. Nitrogen interface; 14. Argon interface; 15. Nitrogen pressure regulating valve; 16. Argon pressure regulating valve; 17. Nitrogen pipeline; 18. Argon pipeline; 19. Nitrogen flow regulating valve; 20. Argon flow regulating valve. 21. Valve; 22. Stop button; 23. Start button; 24. Oxygen concentration display; 25. Argon pressure alarm indicator; 26. Oxygen concentration alarm indicator; 27. Nitrogen pressure alarm indicator; 28. Fault alarm buzzer; 29. ​​Three-color indicator light for working status; 30. Protective cabinet door; 31. Moving pulley; 32. Cooling water inlet pipe; 33. Cooling drain pipe; 34. Cooling system; 35. Door lock detection sensor; 36. Valve controller; 37. Temperature controller; 38. Water flow pipeline; 39. Water flow regulating valve; 40. Water flow sensor; 41. Pressure detector. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0019] Example 1 Please see Figures 1-5As shown in this embodiment, an anaerobic high-temperature furnace for processing circuit board chips includes a furnace body 1 separated into upper and lower layers. The upper layer of the furnace body 1 serves as a heating layer, and the lower layer serves as a control layer. A control panel 2 is provided on the side of the furnace body 1. A muffle furnace 3 is provided inside the heating layer. A heater 4 is provided on both sides inside the muffle furnace 3. A nitrogen inlet 5, an argon inlet 6, a gas detection port 7, and a temperature sensor 8 are provided on the rear wall of the muffle furnace 3. An oxygen exhaust unit communicating with the interior of the muffle furnace 3 is provided above the upper layer of the furnace body 1. The oxygen exhaust unit includes a protective cover 9 and a valve controller 36. For ease of assembly, the protective cover 9 is constructed by splicing two protective cover bodies 901. The protective cover 9 is connected to the furnace body 1. An electrically controlled valve 10 is provided inside the protective cover 9. The electrically controlled valve 10 is fixed on an electrically controlled bracket 101, which is fixed inside the protective cover 9. Valve 10 is electrically connected to the valve controller 36. An exhaust fan 11 is provided behind the protective cover 9 (the exhaust fan 11 is located on the back of the protective cover 901). The exhaust fan 11 is fixed inside the fan dust cover 111, which is located on the back of the protective cover 901. An oxygen concentration detector 12 and a main controller 13 are provided in the control layer. The detection end of the oxygen concentration detector 12 is located inside the gas detection port 7. A nitrogen interface 14, an argon interface 15, a nitrogen pressure regulating valve 16, and an argon pressure regulating valve 17 are provided on the back of the control panel 2. A temperature controller 37, which is electrically connected to the temperature sensor 8 and the heater 4, is provided on the front of the control panel 2. The main controller 13 is electrically connected to the oxygen concentration detector 12, the valve controller 36, the exhaust fan 11, the temperature sensor 8, the argon pressure regulating valve 17, the heater 4, and the nitrogen pressure regulating valve 16. The main controller 13 is a PLC controller.

[0020] Preferably, in order to achieve automatic detection of nitrogen flow rate, nitrogen pressure, argon flow rate, and argon pressure, and further ensure that the oxygen content concentration of the final equipment meets the preset requirements, thereby achieving precise control of oxygen content and further improving the product qualification rate, the nitrogen inlet 5 is connected to the nitrogen pressure regulating valve 16 and the nitrogen interface 14 through the nitrogen pipeline 18, and the argon inlet 6 is connected to the argon pressure regulating valve 17 and the argon interface 15 through the argon pipeline 19. The front of the control panel 2 is also equipped with a nitrogen flow regulating valve 20 and an argon flow regulating valve 21 electrically connected to the main controller 13. The nitrogen flow regulating valve 20 is connected to the nitrogen pipeline 18 to regulate the incoming nitrogen flow rate, and the argon flow regulating valve 21 is connected to the argon pipeline 19 to regulate the incoming argon flow rate. The nitrogen pipeline 18 and the argon pipeline 19 are pre-embedded inside the furnace body 1.

[0021] Preferably, for ease of operation, the front of the control panel 2 is also provided with a stop button 22, a start button 23, an oxygen concentration display 24, a temperature controller 37, an argon pressure alarm indicator 25, an oxygen concentration alarm indicator 26, a nitrogen pressure alarm indicator 27, a fault alarm buzzer 28, and a three-color indicator light 29 for working status, which are electrically connected to the main controller 13. The three-color indicator light 29 for working status includes a fault indicator red light, a standby indicator yellow light, and a running indicator green light. Preferably, for ease of operation, protective cabinet doors 30 are hinged to both the upper and lower layers of the furnace body 1. Four movable casters 31 are provided at the bottom of the furnace body 1. A cooling system 34 electrically connected to the main controller 13 is provided inside the protective cabinet door 30. A cooling water inlet pipe 32 and a cooling drain pipe 33 connected to the cooling system 34 are provided on the side of the upper protective cabinet door 30. The main controller 13 is electrically connected to the cooling system 34.

[0022] As a preferred option, in order to ensure that the equipment can only be started after the cabinet door is locked, and to further improve safety, a door lock detection sensor 35 is provided on the upper and lower sides of the furnace body 1 to detect whether the corresponding protective cabinet door 30 is locked. The door lock detection sensor 35 is electrically connected to the main controller 13.

[0023] like Figure 6As shown, this embodiment also discloses a furnace body pipeline control system, including control pipelines for the anaerobic high-temperature furnace used for circuit board chip processing. The control pipelines include a heater 4, a temperature sensor 8, an electrically controlled valve 10, an exhaust fan 11, a valve controller 36, an oxygen concentration detector 12, a main controller 13, a nitrogen pressure regulating valve 16, a nitrogen flow regulating valve 20, an argon flow regulating valve 21, a temperature controller 37, and an argon pressure regulating valve 17. The valve controller 36 is connected to the electrically controlled valve 10. The temperature controller 37 is electrically connected to the heater 4 and the temperature sensor 8. The main controller 13 is electrically connected to the valve controller 36, the exhaust fan 11, the oxygen concentration detector 12, the nitrogen pressure regulating valve 16, the argon pressure regulating valve 17, the nitrogen flow regulating valve 20, and the argon flow regulating valve 21. The argon pressure regulating valve 17 and the argon flow regulating valve 21 are also connected. The regulating valve 21 is connected to the argon inlet 6 in the anaerobic high-temperature furnace for circuit board chip processing via the argon gas pipeline 19 to the argon gas interface 15. The nitrogen pressure regulating valve 16 and the nitrogen flow regulating valve 20 are connected to the nitrogen inlet 5 in the anaerobic high-temperature furnace for circuit board chip processing via the nitrogen pipeline 18 to the nitrogen interface 14. The oxygen concentration detector 12 is also connected to the gas detection port 7 in the anaerobic high-temperature furnace for circuit board chip processing. In order to achieve further cooling, the exhaust pipe 301 of the electric control valve 10 connected to the muffle furnace 3 is connected to a condenser pipe 302 for heat exchange. A cooling fan 303 is installed on the condenser pipe 302 to further improve the cooling effect when venting oxygen. Pressure detectors 41 are also installed on the argon gas pipeline 19 and the nitrogen gas pipeline 18 to detect the pressure of the corresponding pipeline.

[0024] Preferably, in order to achieve automatic cooling control, the control pipeline also includes a cooling control pipeline, which includes a water flow regulating valve 39 and a water flow sensor 40. The water flow regulating valve 39 and the water flow sensor 40 are connected between the cooling water inlet pipe 32 and the cooling drain pipe 33 in the anaerobic high-temperature furnace for circuit board chip processing through a water flow pipeline 38. A solid-state relay 371 is provided between the temperature controller 37 and the heater 4 to achieve automatic switching on demand.

[0025] like Figure 7 As shown, preferably, the control circuit performs the following control steps: S1. Place the product to be processed into the muffle furnace 3, close the cabinet door, and press the start button 23 (i.e., Figure 7 (SW in operation), the equipment works according to the set requirements; S2. First, nitrogen gas is introduced into the muffle furnace 3 to replace the internal air, and then argon gas is introduced for replacement (e.g., Figure 7As shown, since a large flow of argon gas is required during the replacement process, the argon gas flow regulating valve 21 is configured with two channels. During the replacement process, both argon gas flow regulating valves 21 are opened to quickly reduce the internal oxygen content. When the temperature rises, the lower argon gas flow regulating valve 21 is closed. The main controller 13 controls the oxygen concentration meter in the oxygen concentration detector 12 to start working and measure the oxygen concentration value in real time to see if it reaches the preset requirement. If it does, proceed to the next step. If it does not reach the preset requirement, the valve controller 36 is activated, which drives the electric control valve 10 and the exhaust fan 11 to open and quickly discharge the internal air to replace the air until the oxygen concentration value reaches the preset requirement, then proceed to the next step. S3. The heater 4 is started to work by the temperature controller 37 to carry out the heating operation, and the temperature of the muffle furnace 3 is detected in real time by the temperature sensor 8. After the internal temperature of the muffle furnace 3 is raised to the preset temperature, the product is carbonized. During the operation, if there is an error, the three-color indicator light 29 of the working status is controlled by the main controller 13 to light up to remind the user of the error.

[0026] Preferably, when nitrogen is introduced in step S2, the main controller 13 controls the nitrogen pressure regulating valve 16 to regulate the pressure and controls the nitrogen flow regulating valve 20 to regulate the nitrogen input. When argon is introduced, the main controller 13 controls the argon pressure regulating valve 17 to regulate the pressure and controls the argon flow regulating valve 21 to regulate the argon input.

[0027] This invention features a gas detection port 7 inside the muffle furnace 3, and an oxygen concentration detector 12. The detection end of the oxygen concentration detector 12 is located inside the gas detection port 7. An oxygen venting unit, communicating with the interior of the muffle furnace 3, is installed above the upper layer of the furnace body 1. This oxygen venting unit consists of a protective cover 9, a valve controller 36, an electric control valve 10, and an exhaust fan 11. During operation, nitrogen is first introduced into the muffle furnace 3 to replace the internal air, followed by argon for further replacement. The main controller 13 controls the oxygen concentration meter inside the oxygen concentration detector 12 to start working, measuring the oxygen concentration value in real time to see if it reaches the preset requirement. If it does, the temperature controller 37 controls the heater 4 to start working for heating, and the temperature sensor 8 monitors the temperature in real time. The temperature of the muffle furnace 3 is monitored. After the internal temperature of the muffle furnace 3 is raised to the preset temperature, the product is carbonized. If the temperature is not reached, the valve controller 36 is activated, which drives the electric control valve 10 and the exhaust fan 11 to quickly expel the internal air. This allows the oxygen content inside the muffle furnace 3 to be quickly controlled within the preset range of no more than 30 ppm, thereby further improving the processing efficiency of the equipment. Compared with existing technologies, this structure cannot automatically detect the oxygen content. Therefore, it can only achieve cooling and ensure that the oxygen content meets the requirements by slowly expelling the internal oxygen after processing, which ultimately leads to a longer process time. The design of this structure further realizes precise and rapid control of oxygen content, thereby improving the production efficiency of the equipment.

[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An anaerobic high-temperature furnace for processing circuit board chips, comprising a furnace body (1) separated into upper and lower layers, wherein the upper layer of the furnace body (1) serves as a heating layer and the lower layer of the furnace body (1) serves as a control layer, a control panel (2) is provided on the side of the furnace body (1), a muffle furnace (3) is provided inside the heating layer, and a heater (4) is provided on both sides inside the muffle furnace (3), characterized in that: The muffle furnace (3) is provided with a nitrogen inlet (5), an argon inlet (6), a gas detection port (7), and a temperature sensor (8) on its rear wall. An oxygen venting unit communicating with the interior of the muffle furnace (3) is provided on the upper part of the furnace body (1). The oxygen venting unit includes a protective cover (9) and a valve controller (36). The protective cover (9) is connected to the furnace body (1). An electric control valve (10) is provided inside the protective cover (9). The electric control valve (10) is electrically connected to the valve controller (36). An exhaust fan (11) is provided behind the protective cover (9). An oxygen concentration detector (12) is provided inside the control layer. The main controller (13) is located inside the gas detection port (7) of the oxygen concentration detector (12). The back of the control panel (2) is provided with a nitrogen interface (14), an argon interface (15), a nitrogen pressure regulating valve (16) and an argon pressure regulating valve (17). The front of the control panel (2) is provided with a temperature controller (37) that is electrically connected to the temperature sensor (8) and the heater (4). The main controller (13) is electrically connected to the oxygen concentration detector (12), the valve controller (36), the exhaust fan (11), the temperature sensor (8), the argon pressure regulating valve (17), the heater (4) and the nitrogen pressure regulating valve (16).

2. The anaerobic high-temperature furnace for circuit board chip processing according to claim 1, characterized in that: The nitrogen inlet (5) is connected to the nitrogen pressure regulating valve (16) and the nitrogen interface (14) respectively through the nitrogen pipeline (18). The argon inlet (6) is connected to the argon pressure regulating valve (17) and the argon interface (15) respectively through the argon pipeline (19). The front of the control panel (2) is provided with a nitrogen flow regulating valve (20) and an argon flow regulating valve (21) electrically connected to the main controller (13). The nitrogen flow regulating valve (20) is connected to the nitrogen pipeline (18) to regulate the flow of nitrogen entering the system. The argon flow regulating valve (21) is connected to the argon pipeline (19) to regulate the flow of argon entering the system.

3. The anaerobic high-temperature furnace for circuit board chip processing according to claim 2, characterized in that: The front of the control panel (2) is also equipped with a stop button (22), a start button (23), an oxygen concentration display (24), an argon pressure alarm indicator (25), an oxygen concentration alarm indicator (26), a nitrogen pressure alarm indicator (27), a fault alarm buzzer (28), and a three-color indicator light for working status (29).

4. The anaerobic high-temperature furnace for circuit board chip processing according to claim 3, characterized in that: The upper and lower layers of the furnace body (1) are hinged with protective cabinet doors (30). The bottom of the furnace body (1) is provided with four movable pulleys (31). A cooling system (34) electrically connected to the main controller (13) is provided on the inner side of the protective cabinet door (30). A cooling water inlet pipe (32) and a cooling drain pipe (33) connected to the cooling system (34) are provided on the side of the upper protective cabinet door (30). The main controller (13) is electrically connected to the cooling system (34).

5. The anaerobic high-temperature furnace for circuit board chip processing according to claim 4, characterized in that: The furnace body (1) is provided with a door locking detection sensor (35) on the upper and lower sides for detecting whether the corresponding protective cabinet door (30) is locked. The door locking detection sensor (35) is electrically connected to the main controller (13).

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