Fastener, loop heat pipe evaporator assembly, and loop heat pipe

Abstract

The utility model relates to a heat dissipation device technical field especially relates to a fastener, including the loop heat pipe evaporator subassembly of fastener and including the loop heat pipe evaporator subassembly's loop heat pipe. The fastener includes: the installation department, the outer sleeve is on the outer circumferential side of evaporator and is used for connecting with heat source module, the contact department is with the installation department and abuts against the one side of evaporator away from heat source module, and the contact department is equipped with the contact portion of the connecting compensator and the connecting portion of evaporator and avoids the avoiding mouth, the heat source module includes the chip, and the contact portion on the chip orthographic projection covers at least part of the grain in the chip, when the installation department is connected with heat source module, the contact portion presses evaporator to the chip, and the clamping force that is applied when the installation department is connected with heat source module is transmitted to at least part of the grain in the chip through the contact department and evaporator, makes evaporator and at least part of the grain in the chip keep thermal contact, realizes the heat source of evaporator and heat source module's location and keeps close contact, ensures the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a fastener, a loop heat pipe evaporator assembly including the fastener, and a loop heat pipe including the loop heat pipe evaporator assembly. Background Technology

[0002] A loop heat pipe consists of five basic components: an evaporator (including a capillary wick), a gas line, a condenser, a liquid line, and a compensator. These five parts are connected sequentially to form a closed loop, within which the working fluid circulates. The working principle of a loop heat pipe is as follows: the evaporator contacts a heat source, and the liquid working fluid vaporizes on the surface of the capillary wick within the evaporator, generating the driving force for the working fluid circulation. The vaporized working fluid enters the condenser along the gas line, where it releases heat and condenses into liquid working fluid. This liquid then flows along the liquid line to the compensator, and subsequently wets the capillary wick within the evaporator. The liquid working fluid is then heated and evaporates again, entering the next cycle. The evaporator and compensator constitute the evaporator assembly of the loop heat pipe.

[0003] Unlike the heat dealt with in the aerospace field, where the heat is only a few tens of watts, the heat pipes used in the civilian field deal with heat with a high heat flux density, which can be hundreds or even thousands of watts. Therefore, the material of the evaporator used to contact the heat source and absorb the heat needs to be changed from stainless steel to a material with a higher thermal conductivity (such as copper). In addition, the manufacturing process of the evaporator includes high-temperature annealing, which reduces the hardness and rigidity of the evaporator.

[0004] When loop heat pipes are used in civilian applications, they need to be installed and fixed in the equipment containing the heat source. After installation, the evaporator and the heat source will maintain thermal contact under the action of force. The existing installation and fixing method is to pass a first fastener through the mounting hole on the mounting part that houses the evaporator, the fixing hole on the heat source in the heat source module (if any), and the auxiliary hole on the mounting base plate in the heat source module, and then a second fastener cooperates with the first fastener to apply clamping force; or the auxiliary hole cooperates with the first fastener to apply clamping force. Because the applied clamping force generates a large pressure at the contact point between the fastener and the mounting part, about 0.7 MPa, and because the mounting part only contacts the periphery of the evaporator, the clamping force is applied to the corners of the evaporator, or at most to the periphery. The evaporator, with reduced rigidity, cannot maintain its own shape. That is, the corners or periphery of the evaporator will be closer to the heat source under the action of clamping force, while the middle of the evaporator will be further away from the heat source. As a result, the side of the evaporator closer to the heat source will become arched. Deformation leads to poor contact between the evaporator and the heat source, reducing the efficiency of heat transfer between them.

[0005] Especially when the heat source includes a chip, such as a laser module, GPU, or CPU, since the chip is the final product after packaging one or more dies, the dies are the heat source inside the chip, and the heat of the packaged part is diffused from the heat generated by the dies. Moreover, the dies are usually located in the middle of the chip. As a result, the deformation of the evaporator means that there are no dies in the chip area that is in thermal contact with the evaporator, which seriously weakens the heat conduction efficiency between the chip and the evaporator.

[0006] Furthermore, existing loop heat pipes suffer from a large temperature difference in heat transfer. Because the pressure and temperature of the evaporator are higher than those of the compensator during normal operation, a heat load leaks from the evaporator to the compensator, known as heat leakage. According to the working principle of the loop heat pipe, this heat leakage needs to be offset by increasing the subcooling of the liquid refrigerant returning from the condenser to maintain the thermal balance of the compensator. The greater the heat leakage, the greater the required subcooling of the returning liquid refrigerant, resulting in a large temperature difference between the hot and cold ends of the loop heat pipe, thus affecting its heat transfer performance. Utility Model Content

[0007] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide a fastener that can ensure that at least some of the crystals in the chip in the heat source module are kept in thermal contact when the loop heat pipe is installed and fixed by the fastener, so as to ensure the heat dissipation effect.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0009] This utility model provides a fastener for connecting a heat source module and maintaining thermal contact between one side of the evaporator of the loop heat pipe and the heat source module. The side of the evaporator away from the heat source module is connected to a compensator. The fastener includes: a mounting part, which is sleeved on the outer periphery of the evaporator and is used to connect with the heat source module; and a contact part, which is connected to the mounting part and abuts against the side of the evaporator away from the heat source module. The contact part is provided with a clearance opening to avoid the connection between the compensator and the evaporator. The heat source module includes a chip, and the orthographic projection of the contact part on the chip covers at least a portion of the chips within the chip.

[0010] Preferably, the contact portion has a hollow area, and the orthographic projection of the hollow area on the chip completely avoids the die inside the chip.

[0011] Preferably, the connecting portion is one end of the compensator, and the orthographic projection of one end of the compensator on the chip does not at least partially coincide with the die inside the chip, such that the orthographic projection of the contact portion on the chip covers at least a portion of the die inside the chip.

[0012] Preferably, the orthographic projection of one end of the compensator on the chip does not coincide with the die inside the chip, so that the orthographic projection of the contact portion on the chip covers all the dies inside the chip.

[0013] Preferably, the connection part is a branch pipe, which forms a gap between the compensator and the evaporator.

[0014] Preferably, the contact portion extends into the gap space, and the orthographic projection of the branch on the chip does not at least partially coincide with the die inside the chip, such that the orthographic projection of the contact portion on the chip covers at least a portion of the die inside the chip.

[0015] Preferably, the orthographic projection of the branch pipe on the chip does not coincide with the die inside the chip, so that the orthographic projection of the contact portion on the chip covers all the dies inside the chip.

[0016] Preferably, the space between the support columns for the compensator is provided.

[0017] Preferably, the evaporator is embedded inside the mounting section and held by the mounting section.

[0018] Preferably, the mounting part and the contact part are integrally formed parts or detachable separate parts.

[0019] Preferably, a boss is provided on the side of the contact portion facing the evaporator, and the contact portion abuts against the side of the evaporator away from the heat source module through the boss.

[0020] This utility model also provides a loop heat pipe evaporator assembly, including the fasteners described above.

[0021] This utility model also provides a loop heat pipe, including the loop heat pipe evaporator assembly as described above.

[0022] Compared with the prior art, this utility model has significant progress:

[0023] In this invention, the mounting part is connected to the heat source module and is subjected to a clamping force. A contact part is connected to the mounting part, and the clamping force is transmitted from the mounting part to the contact part. The evaporator and the chip are located in the space between the contact part and the heat source module. The contact part presses the evaporator against the chip, and the evaporator and chip maintain thermal contact under the clamping force. The chip pressed against and in thermal contact with the evaporator is the chip covered by the orthogonal projection of the contact part onto the chip. Since the orthogonal projection of the contact part onto the chip covers at least a portion of the chips within the chip, the evaporator maintains thermal contact with at least a portion of the chips within the chip in the heat source module, thus ensuring effective heat dissipation. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 1 of this utility model.

[0025] Figure 2 yes Figure 1 An explosion diagram.

[0026] Figure 3 yes Figure 1 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering part of the die within the chip.

[0027] Figure 4 yes Figure 1 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering all the dies within the chip.

[0028] Figure 5 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 2 of this utility model.

[0029] Figure 6 yes Figure 5 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering part of the die within the chip.

[0030] Figure 7 yes Figure 5 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering all the dies within the chip.

[0031] Figure 8 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 3 of this utility model.

[0032] Figure 9 yes Figure 8 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering part of the die within the chip.

[0033] Figure 10 yes Figure 8 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering all the dies within the chip.

[0034] Figure 11 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 4 of this utility model.

[0035] Figure 12 yes Figure 11 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering all the dies within the chip.

[0036] Figure 13 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 5 of this utility model.

[0037] Figure 14 yes Figure 13 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering all the dies within the chip.

[0038] Figure 15 This is a bottom view of the fastener in Embodiment Six of this utility model.

[0039] Figure 16 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 7 of this utility model.

[0040] Figure 17 yes Figure 16 A schematic diagram of the fastener and the die section, showing the orthographic projection of the contact portion onto the chip covering part of the die within the chip.

[0041] Figure 18 This is a schematic diagram of the structure of the loop heat pipe evaporator assembly with fasteners in Embodiment 8 of this utility model. The installation parts of the evaporator and fasteners are omitted in this figure.

[0042] Figure 19 This is a schematic diagram of the fastener and the grain in the loop heat pipe evaporator assembly with fastener in Embodiment 8 of this utility model. The diagram shows the orthogonal projection of the contact portion on the chip covering all the grains in the chip.

[0043] The reference numerals in the attached figures are explained as follows:

[0044] 1. Fasteners

[0045] 11 Installation Department

[0046] 111 mounting holes

[0047] 112 protrusions

[0048] 12 Contact Department

[0049] 13. Avoidance openings

[0050] 14. Perforation

[0051] 15. Hollowed-out area

[0052] 16 convex surfaces

[0053] 21 Evaporator

[0054] 22 Compensator

[0055] 23 Connecting parts

[0056] 24 branch pipes

[0057] 25 Interval Space

[0058] 26 Supporting columns

[0059] 3 chips

[0060] 31 grains Detailed Implementation

[0061] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. These embodiments are only used to illustrate this utility model and are not intended to limit it.

[0062] In the description of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0063] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0064] Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0065] Example 1

[0066] like Figures 1 to 4 The image shows a first embodiment of the fastener provided by this utility model.

[0067] In this embodiment, fastener 1 is used to connect the heat source module, ensuring that one side of the evaporator 21 of the loop heat pipe is in thermal contact with the heat source module and absorbs heat from the heat source module for heat dissipation. The heat source module includes a heat source and a mounting base plate. The mounting base plate is an assembly component located on the side of the heat source module away from the evaporator 21. The heat source is a component that generates heat, such as a laser module, GPU, or CPU, located on the side of the heat source module closer to the evaporator 21. Fastener 1 is connected to the mounting base plate, and a clamping force is applied to fastener 1. The evaporator 21 and the heat source are located in the space between fastener 1 and the mounting base plate. Fastener 1 presses the evaporator 21 against the heat source, and the evaporator 21 and the heat source maintain thermal contact under the action of the clamping force.

[0068] The fastener 1 in this embodiment includes a mounting part 11 and a contact part 12. The mounting part 11 is fitted onto the outer periphery of the evaporator 21 and connected to the heat source module. The contact part 12 is in contact with the mounting part 11 and abuts against the side of the evaporator 21 away from the heat source module. The mounting part 11 is connected to the mounting base plate. A clamping force is applied to the mounting part 11, which is transmitted from the mounting part 11 to the contact part 12. The evaporator 21 and the heat source are located in the space between the contact part 12 and the mounting base plate. The contact part 12 presses the evaporator 21 against the heat source, and the evaporator 21 and the heat source maintain thermal contact under the action of the clamping force.

[0069] It is worth mentioning that the contact part 12 and the evaporator 21 are rigidly connected by pressing against each other, which can prevent the evaporator 21 from shaking.

[0070] It should be noted that in this first embodiment... Figures 1 to 4 The contact portion 12 of the fastener 1 shown includes a portion extending from the mounting portion 11 toward the side of the evaporator 21 away from the heat source module and not in contact with the side of the evaporator 21 away from the heat source module, and a portion abutting against and contacting the side of the evaporator 21 away from the heat source module. It can be understood that the portion extending from the mounting portion 11 toward the side of the evaporator 21 away from the heat source module and not in contact with the side of the evaporator 21 away from the heat source module can be defined as part of the contact portion 12 or as part of the mounting portion 11.

[0071] The evaporator 21 of the loop heat pipe is connected to the compensator 22 on the side furthest from the heat source module. Both the evaporator 21 and the compensator 22 have internal cavities. The evaporator 21 has a capillary wick containing a liquid working fluid. When one side of the evaporator 21 contacts the heat source module and absorbs heat, the liquid working fluid vaporizes on the surface of the capillary wick. The resulting vapor is drawn out from the cavity of the evaporator 21 and enters the condenser along the vapor pipeline, where it condenses back into a liquid working fluid. This liquid is then introduced into the cavity of the compensator 22 through the liquid pipeline, and from there into the cavity of the evaporator 21, where it wets the capillary wick, thus entering the next cycle.

[0072] To avoid interference, the contact portion 12 is provided with a clearance opening 13 to avoid interference with the connection portion 23 of the evaporator 21 and the compensator 22. This ensures that when the contact portion 12 abuts against the side of the evaporator 21 away from the heat source module, it will not interfere with the compensator 22 connected to the side of the evaporator 21 away from the heat source module. The inner contour of the clearance opening 13 and the outer contour of the connection portion 23 can be fitted together or spaced apart. That is, the inner circumferential dimension of the clearance opening 13 can match the outer circumferential dimension of the connection portion 23 or be larger than the outer circumferential dimension of the connection portion 23.

[0073] In this first embodiment, the heat source in the heat source module includes chip 3, and the die 31 within chip 3 is the heat source. That is, the evaporator 21 and chip 3 are located in the space between the contact portion 12 and the mounting base plate. The contact portion 12 presses the evaporator 21 against the chip 3, and the evaporator 21 and chip 3 maintain thermal contact under the action of clamping force. The die 31 within chip 3 is what is known to those skilled in the art as a die.

[0074] In this first embodiment, the orthographic projection of the contact portion 12 onto the chip 3 covers at least a portion of the dies 31 within the chip 3. When the mounting portion 11 is connected to the heat source module, a clamping force is applied to the mounting portion 11, and the contact portion 12 contacts the mounting portion 11. The clamping force is transmitted from the mounting portion 11 to the contact portion 12. The evaporator 21 and the chip 3 are located in the space between the contact portion 12 and the heat source module. The contact portion 12 then presses the evaporator 21 against the chip 3 in the heat source module, maintaining thermal contact between the evaporator 21 and the chip 3. The chip 3 that is pressed against and maintains thermal contact is the chip 3 within the orthographic projection area of ​​the contact portion 12 onto the chip 3. Since the orthographic projection of the contact portion 12 onto the chip 3 covers at least a portion of the dies 31 within the chip 3, the evaporator 21 maintains thermal contact with at least a portion of the dies 31 within the chip 3, ensuring efficient heat conduction between the chip 3 and the evaporator 21.

[0075] It should be noted that in this first embodiment, when the chip 3 is packaged with a top cover, the die 31 inside the chip 3 is covered by the top cover. The evaporator 21 maintains thermal contact with at least some of the die 31 inside the chip 3 by pressing the evaporator 21 onto the chip 3 and at least some of the die 31 are present in the area of ​​the chip 3 that it is pressed onto, but the evaporator 21 does not directly press onto the die 31. When the chip 3 is packaged and the die 31 is exposed, the evaporator 21 maintains thermal contact with at least some of the die 31 inside the chip 3 by directly pressing the evaporator 21 onto at least some of the die 31.

[0076] In this first embodiment, a support is provided in the cavity of the evaporator 21 to increase structural strength. The support directly transmits the pressure exerted on the side of the evaporator 21 away from the heat source module by the contact portion 12 to the side of the evaporator 21 closest to the heat source module, thus ensuring that the side of the evaporator 21 closest to the heat source module is pressed firmly against the heat source module. At least one support is disposed in the cavity of the evaporator 21 at a position corresponding to the contact portion 12. Specifically, the orthographic projection of the contact portion 12 on the chip 2 covers the orthographic projection of at least one support on the chip 2, and this orthographic projection of the support on the chip 2 covers at least a portion of the grains 21 within the chip 2. This allows the support to transmit the pressure exerted by the contact portion 12 on the side of the evaporator 21 away from the heat source module to at least a portion of the grains 21 within the chip 2, thereby ensuring that the evaporator 21 maintains thermal contact with at least a portion of the grains 21 within the chip 2. The support can be a rigid material or a powder material.

[0077] In this first embodiment, preferably, the mounting part 11 has mounting holes 111. After the first fastener passes through the mounting hole 111, the fixing hole (if any) on the heat source in the heat source module, and the auxiliary hole on the mounting base plate in the heat source module, the second fastener cooperates with the first fastener to apply a clamping force; or the auxiliary hole cooperates with the first fastener to apply a clamping force. The mounting holes 111 on the mounting part 11 can be located at the four corners of the mounting part 11 or on the outer periphery of the mounting part 11. Preferably, the location of the mounting hole 111 on the mounting part 11 can be recessed from the side of the mounting part 11 away from the heat source module towards the heat source module to form a recessed hole. The mounting hole 111 is located in this recessed hole, thereby reducing weight.

[0078] In this first embodiment, the mounting part 11 and the contact part 12 can be integrally formed parts or detachably connected parts. The connection method between the mounting part 11 and the contact part 12 is not limited; for example, it can be a screw connection or welding. In this first embodiment, the assembly of the fastener 1 and the evaporator 21 can be completed simultaneously during the manufacturing process of the loop heat pipe evaporator assembly, or the fastener 1 and the evaporator 21 can be assembled after the loop heat pipe is prepared.

[0079] In this first embodiment, fastener 1 is preferably made of a rigid material to ensure connection strength.

[0080] In this first embodiment, the connection part 23 connecting the compensator 22 and the evaporator 21 is one end of the compensator 22, that is, one end of the compensator 22 is directly connected to the side of the evaporator 21 away from the heat source module. Therefore, the clearance port 13 on the contact part 12 avoids one end of the compensator 22.

[0081] Figure 3 and Figure 4It is a cross-sectional view of the fastener 1 and the die 31 obtained by selecting a longitudinal section in the die 31 area of ​​the chip 3. It can show the coverage of the die 31 in the chip 3 by the orthographic projection of the contact portion 12 on the chip 3 in the longitudinal section.

[0082] In the first embodiment of this example, see Figure 3 The orthographic projection of one end of the compensator 22 on the chip 3 does not coincide with the portion of the die 31 inside the chip 3, so that the orthographic projection of the contact portion 12 on the chip 3 covers part of the die 31 inside the chip 3. Thus, when the mounting portion 11 is connected to the heat source module and the contact portion 12 presses the evaporator 21 against the chip 3, the evaporator 21 and part of the die 31 inside the chip 3 maintain thermal contact under the clamping force applied when the mounting portion 11 is connected to the heat source module.

[0083] In the second embodiment of this first example, see Figure 4 The projection of one end of the compensator 22 onto the chip 3 is completely non-overlapping with the die 31 within the chip 3, ensuring that the projection of the contact portion 12 onto the chip 3 covers all the dies 31 within the chip 3. Therefore, when the mounting portion 11 is connected to the heat source module and the contact portion 12 presses the evaporator 21 against the chip 3, the evaporator 21 and all the dies 31 within the chip 3 maintain thermal contact under the clamping force applied when the mounting portion 11 is connected to the heat source module, achieving optimal heat conduction. This non-overlapping projection of one end of the compensator 22 onto the chip 3 can be achieved by adjusting the position of one end of the compensator 22 on the side of the evaporator 21 away from the heat source module (e.g., offsetting one end of the compensator 22 on the side of the evaporator 21 away from the heat source module) and adjusting the size of one end of the compensator 22.

[0084] It should be noted that the orthographic projection of the contact portion 12 onto the chip 3 covers a portion of the die 31 within the chip 3, meaning that at least one longitudinal section of the die 31 region within the chip 3 is as shown. Figure 3 The contact portion 12 shown is projected onto the chip 3 and covers the portion of the die 31. Other longitudinal sections can be as follows: Figure 3 The contact portion 12 shown can be projected onto the chip 3 and cover the portion of the die 31, or it can be as follows: Figure 4 The orthographic projection of the contact portion 12 onto the chip 3 shows that it covers the entire die 31. This means that any longitudinal section of the die 31 region within the chip 3 is as shown. Figure 4 The orthographic projection of the contact portion 12 shown on the chip 3 covers the entire die 31.

[0085] It should be noted that, Figure 3 and Figure 4The method is only used to show the coverage of the contact portion 12 on the chip 3 by the orthographic projection of the chip portion 31 on the longitudinal section of the chip 3, and does not limit the number or placement of the chips 31 in the chip 3.

[0086] Example 2

[0087] like Figures 5 to 7 The image shows a second embodiment of the fastener provided by this utility model. Embodiment two is basically the same as embodiment one, and the similarities will not be repeated. The difference lies in that, in this embodiment two, the connection part 23 connecting the compensator 22 and the evaporator 21 is a branch pipe 24. That is, the compensator 22 is connected to the side of the evaporator 21 away from the heat source module through the branch pipe 24. Therefore, the clearance opening 13 on the contact part 12 avoids the branch pipe 24. Since the branch pipe 24 forms a gap space 25 between the compensator 22 and the evaporator 21, allowing the contact part 12 to extend into it, it is easier to achieve the orthogonal projection of the contact part 12 onto the chip 3 covering at least a portion of the die 31 within the chip 3.

[0088] The compensator 22 is connected to the evaporator 21 via a branch pipe 24. The branch pipe 24 increases the heat transfer path from the evaporator 21 to the compensator 22, reducing the heat leakage from the evaporator 21 into the compensator 22 through the casing, thereby reducing the temperature difference in the loop heat pipe. Furthermore, since the port diameter of the branch pipe 24 can be designed to be smaller, the cross-sectional area of ​​the opening connecting the evaporator 21 and the compensator 22 can be further reduced, further increasing the heat transfer path from the evaporator 21 to the compensator 22 and further reducing the heat leakage from the evaporator 21 into the compensator 22 through the casing. Simultaneously, the reduced cross-sectional area of ​​the opening on the evaporator 21 results in a correspondingly smaller area of ​​the capillary wick covering the opening on the evaporator 21, further reducing the heat leakage from the evaporator 21 into the compensator 22 through the capillary wick. Therefore, by connecting the compensator 22 and the evaporator 21 with the branch pipe 24, heat leakage from the evaporator 21 to the compensator 22 can be effectively reduced, thereby reducing the heat transfer temperature difference in the loop heat pipe and ensuring heat transfer performance.

[0089] In the first embodiment of this second example, see Figure 6 The contact portion 12 extends into the space 25. The orthographic projection of the branch pipe 24 on the chip 3 does not coincide with the portion of the die 31 in the chip 3, so that the orthographic projection of the contact portion 12 on the chip 3 covers part of the die 31 in the chip 3. Thus, when the mounting portion 11 is connected to the heat source module and the contact portion 12 presses the evaporator 21 against the chip 3, the evaporator 21 and part of the die 31 in the chip 3 maintain thermal contact under the clamping force applied when the mounting portion 11 is connected to the heat source module.

[0090] In the second embodiment of this second example, see Figure 7The contact portion 12 extends into the spacer 25. The orthographic projection of the branch pipe 24 on the chip 3 does not coincide with the die 31 within the chip 3, ensuring that the orthographic projection of the contact portion 12 on the chip 3 covers all the dies 31 within the chip 3. Therefore, when the mounting portion 11 is connected to the heat source module and the contact portion 12 presses the evaporator 21 against the chip 3, the evaporator 21 and all the dies 31 within the chip 3 maintain thermal contact under the clamping force applied when the mounting portion 11 is connected to the heat source module, achieving optimal heat conduction. The fact that the orthographic projection of the branch pipe 24 on the chip 3 does not coincide with the dies 31 within the chip 3 can be achieved by positioning the branch pipe 24 at a position corresponding to the packaging portion of the chip 3 and / or the spacing between adjacent dies 31 within the chip 3, ensuring that the orthographic projection of the branch pipe 24 on the chip 3 completely avoids the dies 31 within the chip 3. Preferably, the branch pipe 24 is positioned at a position corresponding to the position closest to the die 31 outside the die 31 area within the chip 3. The branch pipe 24 is positioned at a location corresponding to the spacing between adjacent dies 31 within the chip 3, which can be achieved by reducing the port size of the branch pipe 24.

[0091] In this second embodiment, a branch pipe 24 is provided, and the compensator 22 is connected to the evaporator 21 through a branch pipe 24. Correspondingly, a clearance port 13 is provided on the contact part 12 to allow passage of a branch pipe 24.

[0092] Example 3

[0093] like Figures 8 to 10 The image shows a third embodiment of the fastener provided by this utility model. Embodiment three is basically the same as embodiment two, and the similarities will not be repeated. The difference is that in this embodiment three, there are multiple branch pipes 24, for example, two. The compensator 22 is connected to the evaporator 21 through multiple branch pipes 24, and the connection part 23 connecting the compensator 22 and the evaporator 21 is for all branch pipes 24. The contact part 12 may have multiple clearance ports 13. The number of clearance ports 13 can be the same as the number of branch pipes 24 and are arranged in a one-to-one correspondence, with one clearance port 13 clearing one branch pipe 24; the number of clearance ports 13 can also be different from the number of branch pipes 24, with one clearance port 13 clearing multiple branch pipes 24. Alternatively, there may be only one clearance port 13 on the contact part 12, with one clearance port 13 clearing all branch pipes 24.

[0094] Example 4

[0095] like Figure 11 and Figure 12The image shows the fourth embodiment of the fastener provided by this utility model. Embodiment four is basically the same as embodiment two, and the similarities will not be repeated. The difference lies in that, in this embodiment four, a support column 26 is provided within the gap 25 between the compensator 22 and the evaporator 21, and the support column 26 supports the compensator 22. When the branch pipe 24 is offset relative to the center of the compensator 22, the support column 26 and the branch pipe 24 are symmetrically arranged relative to the center of the compensator 22, allowing the compensator 22 to be supported evenly and stably by both the support column 26 and the branch pipe 24.

[0096] In this fourth embodiment, the support column 26 is disposed between the contact portion 12 and the compensator 22, that is, both ends of the support column 26 abut against the contact portion 12 and the compensator 22 respectively. Preferably, the support column 26 and the contact portion 12 are connected as a whole, thereby forming part of the fastener 1.

[0097] As in the implementation of Example 3, the aforementioned support column 26 can also be provided in the space 25 between the compensator 22 and the evaporator 21.

[0098] Example 5

[0099] like Figure 13 and Figure 14 The image shows the fifth embodiment of the fastener provided by this utility model. Embodiment five is basically the same as embodiment four, and the similarities will not be repeated. The difference is that in this embodiment five, the support column 26 is located between the evaporator 21 and the compensator 22, that is, the two ends of the support column 26 abut against the evaporator 21 and the compensator 22 respectively, and the contact part 12 is provided with a through hole 14 for the support column 26 to pass through, so as to avoid interference.

[0100] Example 6

[0101] like Figure 15 The image shows the sixth embodiment of the fastener provided by this utility model. Embodiment six is ​​basically the same as embodiment one, and the similarities will not be repeated. The difference lies in that, in embodiment six, the evaporator 21 is embedded inside the mounting part 11 and held by the mounting part 11, forming a rigid connection between the mounting part 11 and the evaporator 21 to prevent the evaporator 21 from shaking. Preferably, a protrusion 112 is provided on the inner peripheral side of the mounting part 11 facing the outer periphery of the evaporator 21. The protrusion 112 forms an interference fit with the evaporator 21, thus fixing the mounting part 11 and the evaporator 21 together to form a rigid connection. Of course, the mounting part 11 and the evaporator 21 can also be rigidly connected by other means (such as welding).

[0102] As in Embodiments 2 to 5, the evaporator 21 can also be embedded inside the mounting portion 11 and held by the mounting portion 11, and the aforementioned protrusion 112 can be provided on the inner peripheral side of the mounting portion 11 facing the outer peripheral side of the evaporator 21.

[0103] Example 7

[0104] like Figure 16 and Figure 17 The image shows the seventh embodiment of the fastener provided by this utility model. Embodiment seven is basically the same as embodiment one, and the similarities will not be repeated. The difference lies in that, in this embodiment seven, the contact portion 12 has a hollowed-out area 15, and the orthogonal projection of the hollowed-out area 15 onto the chip 3 completely avoids the contact grains 31 within the chip 3. Therefore, the hollowed-out area 15 on the contact portion 12 does not affect the orthogonal projection of the contact portion 12 onto the chip 3 covering at least a portion of the contact grains 31 within the chip 3, and also achieves weight reduction.

[0105] As in Embodiments 2 to 6, the aforementioned hollowed-out area 15 can also be provided on the contact portion 12.

[0106] Example 8

[0107] like Figure 18 and Figure 19 The image shows the eighth embodiment of the fastener provided by this utility model. Embodiment eight is basically the same as embodiment four, and the similarities will not be repeated. The difference lies in that, in this embodiment eight, a boss 16 is provided on the side of the contact portion 12 facing the evaporator 21. The contact portion 12 abuts against the side of the evaporator 21 away from the heat source module through the boss 16, pressing the evaporator 21 against the chip 3. The orthogonal projection of the boss 16 on the chip 3 coincides with the area of ​​the die 31 region excluding the orthogonal projection of the clearance opening 13 on the die 31. Multiple bosses 15 can be provided on the side of the contact portion 12 facing the evaporator 21 to accommodate situations where the die 31 within the chip 3 is relatively dispersed. One boss 15 can correspond to one or more die 31s. This reduces the contact area between the contact portion 12 and the evaporator 21, thereby increasing the pressure exerted on the evaporator 21 by the clamping force applied when the mounting portion 11 is connected to the heat source module through the contact portion 12. This further strengthens the tightness of the thermal contact between the evaporator 21 and at least some of the crystals 31 in the chip 3, and prevents the evaporator 21 from shaking.

[0108] As in the embodiments of Examples 1 to 3, 5 and 7, the aforementioned boss 16 can also be provided on the side of the contact portion 12 facing the evaporator 21.

[0109] Example 9

[0110] Based on the fastener of this utility model, embodiment nine of this utility model provides a loop heat pipe evaporator assembly.

[0111] The loop heat pipe evaporator assembly of this embodiment nine includes any one of the fasteners 1 in embodiments one to eight above, and also includes an evaporator 21 and a compensator 22. One side of the evaporator 21 is in contact with the heat source module, and the side of the evaporator 21 away from the heat source module is connected to the compensator 22. The compensator 22 can be directly connected at one end to the side of the evaporator 21 away from the heat source module, so that the connection part 23 connecting the compensator 22 and the evaporator 21 is one end of the compensator 22; or the compensator 22 can be connected to the side of the evaporator 21 away from the heat source module through a branch pipe 24, so that the connection part 23 connecting the compensator 22 and the evaporator 21 is the branch pipe 24. The mounting base plate of the heat source module is connected by fastener 1. Fastener 1 is clamped, and the evaporator 21 and the heat source of the heat source module are located in the space between fastener 1 and the mounting base plate. Fastener 1 presses the evaporator 21 against the heat source. The evaporator 21 and the heat source maintain thermal contact under the action of clamping force. Thus, the loop heat pipe evaporator assembly is installed and fixed on the heat source module to dissipate heat from the heat source module.

[0112] Example 10

[0113] Based on the loop heat pipe evaporator assembly of this utility model, Embodiment 10 of this utility model provides a loop heat pipe. The loop heat pipe of Embodiment 10 includes the loop heat pipe evaporator assembly of Embodiment 9 described above.

[0114] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A fastener for connecting a heat source module and maintaining thermal contact between one side of the evaporator (21) of a loop heat pipe and the heat source module, wherein the side of the evaporator (21) away from the heat source module is connected to a compensator (22), characterized in that, The fastener (1) includes: The mounting part (11) is fitted onto the outer periphery of the evaporator (21), and the mounting part (11) is used to connect to the heat source module; The contact part (12) is connected to the mounting part (11) and abuts against the side of the evaporator (21) away from the heat source module. The contact part (12) is provided with a clearance opening (13) to avoid the connection part (23) connecting the compensator (22) and the evaporator (21). The heat source module includes a chip (3), and the orthographic projection of the contact portion (12) on the chip (3) covers at least a portion of the grains (31) within the chip (3).

2. The fastener according to claim 1, characterized in that, The contact portion (12) is provided with a hollow area (15), and the orthographic projection of the hollow area (15) on the chip (3) completely avoids the grains (31) inside the chip (3).

3. The fastener according to claim 1, characterized in that, The connecting part (23) is one end of the compensator (22), and the orthographic projection of one end of the compensator (22) on the chip (3) does not at least partially coincide with the die (31) in the chip (3), so that the orthographic projection of the contact part (12) on the chip (3) covers at least part of the die (31) in the chip (3).

4. The fastener according to claim 3, characterized in that, One end of the compensator (22) is projected onto the chip (3) in a way that does not coincide with the die (31) inside the chip (3), so that the projection of the contact portion (12) onto the chip (3) covers all the dies (31) inside the chip (3).

5. The fastener according to claim 1, characterized in that, The connecting part (23) is a branch pipe (24), and the branch pipe (24) forms an interval space (25) between the compensator (22) and the evaporator (21).

6. The fastener according to claim 5, characterized in that, The contact portion (12) extends into the space (25), and the orthographic projection of the branch tube (24) on the chip (3) does not at least partially coincide with the die (31) in the chip (3), such that the orthographic projection of the contact portion (12) on the chip (3) covers at least a portion of the die (31) in the chip (3).

7. The fastener according to claim 6, characterized in that, The orthographic projection of the branch pipe (24) on the chip (3) does not coincide with the die (31) inside the chip (3), so that the orthographic projection of the contact portion (12) on the chip (3) covers all the dies (31) inside the chip (3).

8. The fastener according to claim 5, characterized in that, The space (25) is provided with a support column (26) to support the compensator (22).

9. The fastener according to claim 1, characterized in that, The evaporator (21) is embedded inside the mounting part (11) and held by the mounting part (11).

10. The fastener according to claim 1, characterized in that, The mounting part (11) and the contact part (12) are integrally formed parts or detachable parts.

11. The fastener according to claim 1, characterized in that, The contact portion (12) has a boss (16) on the side facing the evaporator (21), and the contact portion (12) abuts against the side of the evaporator (21) away from the heat source module through the boss (16).

12. A loop heat pipe evaporator assembly, characterized in that, Includes the fasteners as described in any one of claims 1 to 11.

13. A loop heat pipe, characterized in that, Includes the loop heat pipe evaporator assembly as described in claim 12.

Images