Strain signal sampling circuit, strain signal sampler and electronic device
Patent Information
- Application Number
- CN202522167280.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-14
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-10-14
AI Technical Summary
[0016]本实用新型的应变信号采样电路,在降低成本的同时,可以在宽温度范围内实现高精度采样。
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Figure CN224838820U_ABST
Abstract
Description
Technical Field
[0001] This utility model generally relates to the field of electronic circuit technology, and in particular to a strain signal sampling circuit, a strain signal sampler, and an electronic device. Background Technology
[0002] Strain signal sampling circuits are widely used in industrial testing, biomedicine, and robotics. With the increasing demand for strain signal sampling circuits, the technical problem this invention aims to solve is how to achieve high-precision sampling over a wide temperature range at a lower cost.
[0003] The content of the background section is merely the technology known to the inventor and does not necessarily represent the prior art in this field. Utility Model Content
[0004] In view of one or more of the problems existing in the prior art, the present invention provides a strain signal sampling circuit, a strain signal sampler and an electronic device, which can achieve high-precision sampling over a wide temperature range while reducing costs.
[0005] A first aspect of this invention provides a strain signal sampling circuit. The strain signal sampling circuit includes: a resistor bridge; a low-temperature drift resistor array connected to the resistor bridge; a switch connected to the resistor bridge and the low-temperature drift resistor array; and an analog-to-digital converter connected to the resistor bridge and the switch.
[0006] Optionally, the strain signal sampling circuit further includes a voltage source connected to the resistor bridge, which is adapted to provide a power supply voltage.
[0007] Optionally, the resistor bridge includes a first bridge arm, a second bridge arm, a third bridge arm, and a fourth bridge arm connected in series, wherein the common terminal of the first bridge arm and the third bridge arm is connected to the voltage source; and the common terminal of the second bridge arm and the fourth bridge arm is grounded.
[0008] Optionally, the common terminal of the first bridge arm and the third bridge arm, and the common terminal of the second bridge arm and the fourth bridge arm are connected to the low-temperature drift resistor array and the analog-to-digital converter; wherein the common terminal of the first bridge arm and the second bridge arm, and the common terminal of the third bridge arm and the fourth bridge arm are connected to the switch.
[0009] Optionally, the switch includes a first input terminal and a second input terminal, wherein the first input terminal is connected to the low-temperature drift resistor array; the second input terminal is connected to the common terminal of the first bridge arm and the second bridge arm, and the common terminal of the third bridge arm and the fourth bridge arm; the switch can be used to select either the first input terminal or the second input terminal; the switch includes a multiplexer.
[0010] Optionally, the first bridge arm includes a first resistor, the second bridge arm includes a second resistor, the third bridge arm includes a third resistor, and the fourth bridge arm includes a fourth resistor, wherein the first resistor and the fourth resistor include positive resistors; the second resistor and the third resistor include negative resistors; and at least one of the first resistor, the second resistor, the third resistor, or the fourth resistor has a variable resistance value.
[0011] Optionally, the strain signal sampling circuit further includes: multiple signal conditioning circuits, which are connected to the resistor bridge, the low-temperature drift resistor array, the switch, and the analog-to-digital converter.
[0012] Optionally, the plurality of signal conditioning circuits includes a first signal conditioning circuit, which is connected to the common terminal of the first bridge arm and the third bridge arm, the common terminal of the second bridge arm and the fourth bridge arm, the low-temperature drift resistor array, and the analog-to-digital converter.
[0013] Optionally, the plurality of signal conditioning circuits further include a second signal conditioning circuit, which is connected to the switch and the analog-to-digital converter.
[0014] A second aspect of this invention provides a strain signal sampler. The strain signal sampler includes a strain signal sampling circuit and a controller as described above, wherein the controller is connected to the strain signal sampling circuit.
[0015] A third aspect of this invention provides an electronic device. The electronic device includes the strain signal sampler described above.
[0016] The strain signal sampling circuit of this invention can achieve high-precision sampling over a wide temperature range while reducing costs. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the following description of the embodiments will be introduced as examples. The drawings described below are merely embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. The drawings are used to provide a further understanding of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain this utility model and do not constitute a limitation on this utility model. In the drawings: Figure 1 A schematic diagram of a strain signal sampling circuit according to some embodiments of the present invention is shown.
[0018] Figure 2 A schematic diagram of a strain signal sampling circuit according to some embodiments of the present invention is shown.
[0019] Figure 3A A schematic diagram of a strain signal sampler according to some embodiments of the present invention is shown.
[0020] Figure 3B A schematic diagram of a strain signal sampler according to some embodiments of the present invention is shown.
[0021] Figure 4 A schematic diagram of an electronic device according to some embodiments of the present invention is shown. Detailed Implementation
[0022] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.
[0023] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "coupling" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0026] The following provides many different embodiments or examples for implementing various structures of this invention. To simplify the invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0027] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.
[0028] This invention provides a strain signal sampling circuit. The strain signal sampling circuit includes a resistor bridge, a low-temperature drift resistor array, a switch, and an analog-to-digital converter. The low-temperature drift resistor array is connected to the resistor bridge. The switch connects the resistor bridge and the low-temperature drift resistor array. The analog-to-digital converter connects the resistor bridge and the switch. This strain signal sampling circuit can achieve high-precision sampling over a wide temperature range at low cost.
[0029] Figure 1 A schematic diagram of a strain signal sampling circuit according to some embodiments of the present invention is shown. Figure 1 As shown, the strain signal sampling circuit 10 includes a resistor bridge 11, a low-temperature drift resistor array 12, a switch 13, and an analog-to-digital converter (ADC) 14. The low-temperature drift resistor array 12 is connected to the resistor bridge 11. The switch 13 connects the resistor bridge 11 and the low-temperature drift resistor array 12. The analog-to-digital converter 14 connects the resistor bridge 11 and the switch 13.
[0030] In some embodiments, such as Figure 1 As shown, the strain signal sampling circuit 10 also includes a voltage source 15. The voltage source 15 is connected to the resistor bridge 11 and is adapted to provide a power supply voltage. For example, the voltage source 15 may include an AC voltage source or a DC voltage source, etc. For example, the voltage source 15 may provide a power supply voltage such as 5.5V or 12V. For example, the voltage source 15 may include a voltage conversion circuit, such as a DC-DC conversion circuit, an AC-DC conversion circuit, or a DC-AC conversion circuit, etc. Alternatively, the strain signal sampling circuit 10 may not include the voltage source 15 and may be powered by an external voltage source.
[0031] In some embodiments, the resistor bridge 11 can output an analog reference voltage and an analog measured voltage to the analog-to-digital converter 14. The analog-to-digital converter 14 can convert the analog reference voltage and the analog measured voltage into a digital reference voltage and a digital measured voltage and output them. This enables true proportional sampling, overcomes adverse effects such as power supply fluctuations and cable voltage drops, helps improve sampling accuracy, and saves space and cost. In some embodiments, a controller can be connected to the analog-to-digital converter 14 to determine the strain signal based on the digital reference voltage and the digital measured voltage.
[0032] In some embodiments, such as Figure 1 As shown, the resistor bridge 11 includes a first arm, a second arm, a third arm, and a fourth arm connected in series. The first arm includes a first resistor R1. The second arm includes a second resistor R2. The third arm includes a third resistor R3. The fourth arm includes a fourth resistor R4. In some embodiments, the common terminal P1 of the first and third arms is connected to a voltage source 15. The common terminal P2 of the second and fourth arms is grounded (GND).
[0033] In some embodiments, the first resistor R1 and the fourth resistor R4 may include positive resistors (upward arrow indicates positive). The second resistor R2 and the third resistor R3 may include negative resistors (downward arrow indicates negative). At least one of the first resistor R1, the second resistor R2, the third resistor R3, or the fourth resistor R4 has a variable resistance value. When an object is applied to the resistor bridge 11, the resistance value of at least one of the first resistor R1, the second resistor R2, the third resistor R3, or the fourth resistor R4 changes. The first resistor R1 and the fourth resistor R4 increase with increasing strain. The second resistor R2 and the third resistor R3 decrease with increasing strain. In this way, a resistor bridge input range with various sensitivities can be accommodated to adapt to strain signal sampling of various objects. For example, the input range of the resistor bridge 11 may include 2mV / V to 256mV / V, etc. For example, 2mV / V, 4mV / V, 8mV / V, 16mV / V, 32mV / V, 64mV / V, 128mV / V, 256mV / V, etc.
[0034] In some embodiments, such as Figure 1 As shown, the common terminal P1 of the first and third bridge arms, and the common terminal P2 of the second and fourth bridge arms, are connected to the cryogenic resistor array 12 and the analog-to-digital converter 14. The common terminal P3 of the first and second bridge arms, and the common terminal P4 of the third and fourth bridge arms, are connected to the switch 13. The switch 13 is connected to the cryogenic resistor array 12 and the analog-to-digital converter 14.
[0035] In some embodiments, switch 13 can be used to switch between resistor bridge 11 and low-temperature drift resistor array 12. In other words, switch 13 can be used to select either resistor bridge 11 or low-temperature drift resistor array 12. In some embodiments, strain signal sampling circuit 10 may include a normal mode and a calibration mode. When resistor bridge 11 is selected, strain signal sampling circuit 10 can operate in normal mode. When low-temperature drift resistor array 12 is selected, strain signal sampling circuit 10 can operate in calibration mode. Switching between resistor bridge 11 and low-temperature drift resistor array 12 allows strain signal sampling circuit 10 to switch between normal mode and calibration mode.
[0036] In some embodiments, in normal mode, the common terminal P1 of the first and third bridge arms, and the common terminal P2 of the second and fourth bridge arms, can output an analog reference voltage. The common terminal P3 of the first and second bridge arms, and the common terminal P4 of the third and fourth bridge arms, can output an analog measurement voltage. The analog-to-digital converter 14 can perform analog-to-digital conversion on the analog reference voltage and the analog measurement voltage. The controller can determine the strain signal based on the converted digital voltage.
[0037] In some embodiments, in calibration mode, the cryogenic drift resistor array 12 can be used to self-calibrate the error of the strain signal sampling circuit 10. The ratio of the cryogenic drift resistor array 12 can be factory-calibrated during manufacturing and stored in memory. During operation of the strain signal sampling circuit 10, when self-calibration is required, the controller can call the ratio of the cryogenic drift resistor array 12 to self-calibrate the error of the strain signal sampling circuit 10, thereby compensating for errors such as offset and gain errors caused by temperature changes in devices such as analog-to-digital converters, resistor bridges, and switches, thus achieving high-precision sampling over a wide temperature range. For example, the temperature coefficient (TCR) of the cryogenic drift resistor array can be ±2.0 ppm / °C, ±10.0 ppm / °C, etc. For example, the ratio of the cryogenic drift resistor array 12 can include 500:1, 125:1, 10:1, etc. For example, the wide temperature range can include -25°C to 60°C. For example, the memory can be internal to the strain signal sampling circuit 10, or it can be external to the strain signal sampling circuit 10, etc.
[0038] In some embodiments, switch 13 may be connected to a controller. The controller may control the operation of switch 13 to switch between the resistor bridge 11 and the low-temperature drift resistor array 12. In some embodiments, switch 13 may include an analog switch.
[0039] In some embodiments, switch 13 may include a first sub-switch and a second sub-switch. A controller may be connected to the control terminals of the first and second sub-switches. By controlling the on / off states of the first and second sub-switches, the controller can select either the resistor bridge 11 or the cryogenic resistor array 12. For example, by controlling the first sub-switch to be on and the second sub-switch to be off, the controller can select the resistor bridge 11. As another example, by controlling the first sub-switch to be off and the second sub-switch to be on, the controller can select the cryogenic resistor array 12.
[0040] In some embodiments, the first sub-switch and the second sub-switch may include at least one of a metal-oxide-semiconductor field-effect transistor (MOSFET), an insulated-gate bipolar transistor (IGBT), or an injection-enhanced gate transistor (IEGT), or other similar devices. The MOSFET may be a P-channel metal-oxide-semiconductor field-effect transistor (PMOS). Alternatively, the MOSFET may be an N-channel metal-oxide-semiconductor field-effect transistor (NMOS). Optionally, the MOSFET may be a silicon carbide (SiC) MOSFET, a gallium nitride (GaN) MOSFET, or other power devices, offering lower losses, higher efficiency, and superior performance. In practical applications, the specific configuration can be chosen based on requirements.
[0041] In some embodiments, switch 13 may include a multiplexer (MUX), which can save size and cost while achieving signal link switching. For example... Figure 1As shown, switch 13 includes a first input terminal 131 and a second input terminal 132. The first input terminal 131 is connected to the low-temperature drift resistor array 12. The second input terminal 132 is connected to the common terminal P3 of the first and second bridge arms, and the common terminal P4 of the third and fourth bridge arms. Switch 13 can be used to select either the first input terminal 131 or the second input terminal 132 to switch between the resistor bridge 11 and the low-temperature drift resistor array 12. For example, when switch 13 receives a first control signal, it can select the first input terminal 131, thus enabling the communication link where the low-temperature drift resistor array 12 is located. As another example, when switch 13 receives a second control signal, it can select the second input terminal 132, thus enabling the communication link where the resistor bridge 11 is located. In this way, by selecting either the first input terminal 131 or the second input terminal 132, the communication link can be switched between the low-temperature drift resistor array 12 and the resistor bridge 11.
[0042] In some embodiments, the strain signal sampling circuit 10 can switch between calibration mode and normal mode via either the first input terminal 131 or the second input terminal 132 of the selector switch 13. For example, the strain signal sampling circuit 10 can be switched to calibration mode via the first input terminal 131 of the selector switch 13. As another example, the strain signal sampling circuit 10 can be switched to normal mode via the second input terminal 132 of the selector switch 13.
[0043] Figure 2 A schematic diagram of a strain signal sampling circuit according to some embodiments of the present invention is shown. Figure 2 As shown, the strain signal sampling circuit 20 includes a resistor bridge 21, a low-temperature drift resistor array 22, a switch 23, an analog-to-digital converter 24, and multiple signal conditioning circuits 25. The resistor bridge 21 is the same as or similar to the resistor bridge 11. The low-temperature drift resistor array 22 is the same as or similar to the low-temperature drift resistor array 12. The switch 23 is the same as or similar to the switch 13. The first input terminal 231 is the same as or similar to the first input terminal 131. The second input terminal 232 is the same as or similar to the second input terminal 132. The analog-to-digital converter 24 is the same as or similar to the analog-to-digital converter 14. The multiple signal conditioning circuits 25 are connected to the resistor bridge 21, the low-temperature drift resistor array 22, the switch 23, and the analog-to-digital converter 24.
[0044] In some embodiments, such as Figure 2As shown, the plurality of signal conditioning circuits 25 include a first signal conditioning circuit 251. The first signal conditioning circuit 251 is located between the resistor bridge 21 and the analog-to-digital converter 24. The first signal conditioning circuit 251 is connected to the common terminal P1 of the first and third bridge arms, the common terminal P2 of the second and fourth bridge arms, the low-temperature drift resistor array 22, and the analog-to-digital converter 24. In some embodiments, the first signal conditioning circuit 251 may include a programmable gain amplifier (PGA) for adjusting the gain of the analog reference voltages output from the common terminals P1 and P2. In some embodiments, the first signal conditioning circuit 251 may include a filter circuit.
[0045] In some embodiments, such as Figure 2 As shown, the plurality of signal conditioning circuits 25 further includes a second signal conditioning circuit 252. The second signal conditioning circuit 252 is located between the switch 23 and the analog-to-digital converter 24. The second signal conditioning circuit 252 connects the switch 23 and the analog-to-digital converter 24. In some embodiments, the second signal conditioning circuit 252 may include a PGA for adjusting the gain of the analog measurement voltage output from the common terminal P3 of the first and second bridge arms, and the common terminal P4 of the third and fourth bridge arms. In some embodiments, the second signal conditioning circuit 252 may include a filter circuit.
[0046] In some embodiments, the controller can be connected to a first signal conditioning circuit 251 and / or a second signal conditioning circuit 252 to perform gain adjustment, filtering, and other operations on the analog reference voltage and / or analog measurement voltage. This facilitates high-precision sampling across multiple input ranges. Simultaneously, the low-temperature drift resistor array effectively suppresses temperature drift, eliminating the need for an analog-to-digital converter and signal conditioning circuit with extremely low temperature drift in the strain signal sampling circuit, further reducing costs. It should be noted that the gain amplification factors of the first signal conditioning circuit 251 and the second signal conditioning circuit 252 can be the same or different, depending on the actual requirements.
[0047] It should be noted that, Figure 2 Two signal conditioning circuits are illustrated as an example. Although not shown in the figure, the number of signal conditioning circuits may include three, four, or more. In practical applications, the number can be set according to requirements.
[0048] In some embodiments, in calibration mode, the controller can call the ratio of the low-temperature drift resistor array to self-calibrate the error of the strain signal sampling circuit, so as to compensate for the offset error and gain error of devices such as analog-to-digital converter, signal conditioning circuit, resistor bridge, and switch caused by temperature changes, thereby accurately determining the strain signal.
[0049] In some embodiments, before sampling, the strain signal sampling circuit can switch to calibration mode to calibrate any measurement errors present in the strain signal sampling circuit. Afterward, the strain signal sampling circuit switches to normal mode to measure the strain signal. In some embodiments, the strain signal sampling circuit can perform error calibration periodically.
[0050] This invention also provides a strain signal sampler. Figure 3A A schematic diagram of a strain signal sampler 30 according to some embodiments of the present invention is shown. Figure 3A As shown, the strain signal sampler 30 includes a strain signal sampling circuit 10 and a controller 32. The controller 32 is connected to the strain signal sampling circuit 10.
[0051] In some embodiments, the controller 32 may include control circuitry, drive circuitry, central processing unit (CPU), microcontroller unit (MCU), digital signal processor (DSP), graphics processing unit (GPU), accelerator, neural processing unit (NPU), tensor processing unit (TPU), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, gate devices, or transistor logic devices, or similar devices.
[0052] In some embodiments, the controller 32 is connected to the switch 13. The controller 32 can control the operating mode of the strain signal sampling circuit 10 by controlling the operation of the switch 13.
[0053] In some embodiments, switch 13 may include a first sub-switch and a second sub-switch. Controller 32 may be connected to the control terminals of the first and second sub-switches. By controlling the on / off state of the first and second sub-switches, controller 32 can select either resistor bridge 11 or cryogenic resistor array 12. For example, controller 32 can select resistor bridge 11 by controlling the first sub-switch to be on and the second sub-switch to be off, thus enabling strain signal sampling circuit 10 to operate in normal mode. As another example, controller 32 can select cryogenic resistor array 12 by controlling the first sub-switch to be off and the second sub-switch to be on, thus enabling strain signal sampling circuit 10 to operate in calibration mode.
[0054] In some embodiments, the controller 32 can send a control signal to the switch 13 to select either the first input terminal 131 or the second input terminal 132, thereby switching between the resistor bridge 11 and the low-temperature drift resistor array 12. For example, the controller 32 sends a first control signal to the switch 13, and upon receiving the first control signal, the switch 13 can select the first input terminal 131, thus enabling the communication link of the low-temperature drift resistor array 12, and causing the strain signal sampling circuit 10 to operate in calibration mode. As another example, the controller 32 sends a second control signal to the switch 13, and upon receiving the second control signal, the switch 13 can select the second input terminal 132, thus enabling the communication link of the resistor bridge 11, and causing the strain signal sampling circuit 10 to operate in normal mode.
[0055] In some embodiments, the controller 32 is also connected to the analog-to-digital converter 14. The controller 32 can determine the strain signal based on the digital signal output by the analog-to-digital converter 14.
[0056] Figure 3B A schematic diagram of a strain signal sampler 30 according to some embodiments of the present invention is shown. Figure 3B As shown, the strain signal sampler 30 includes a strain signal sampling circuit 20 and a controller 32. The controller 32 is connected to the strain signal sampling circuit 20.
[0057] In some embodiments, controller 32 is connected to switch 23, and by controlling the operation of switch 23, the operating mode of strain signal sampling circuit 20 can be controlled. This is the same as or similar to controller 32 being connected to switch 13, and by controlling the operation of switch 13, the operating mode of strain signal sampling circuit 10 can be controlled. In some embodiments, controller 32 is connected to analog-to-digital converter 24. Controller 32 can determine the strain signal based on the digital signal output by analog-to-digital converter 24. This is the same as or similar to determining the strain signal based on the digital signal output by analog-to-digital converter 14.
[0058] In some embodiments, the controller 32 is connected to multiple signal conditioning circuits 25. For example, the controller 32 is connected to a first signal conditioning circuit 251 and / or a second signal conditioning circuit 252 to perform gain adjustment, filtering, and other operations on the analog reference voltage and / or analog measurement voltage. This helps the strain signal sampler 30 achieve high-precision sampling across multiple input ranges.
[0059] In some embodiments, such as Figure 3A , 3BAs shown, the strain signal sampler 30 may further include a memory 33. The memory 33 may be coupled to at least one of the strain signal sampling circuits 10 / 20 or the controller 32. The memory 33 may be used for one or more information such as the resistance ratio of the low-temperature drift resistor array 12 / 22, sampling data, execution instructions, or program instructions. The controller 32 may recall one or more information such as the resistance ratio, sampling data, execution instructions, or program instructions stored in the memory 33 to control and / or compensate the operation of the strain signal sampling circuits 10 / 20.
[0060] In some embodiments, memory 33 may include random access memory (RAM) or non-volatile memory (NVM). Further, memory may include at least one of phase-change random access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), etc.
[0061] This utility model also provides an electronic device. Figure 4 A schematic diagram of an electronic device 40 according to some embodiments of the present invention is shown. The electronic device 40 includes a strain signal sampler 30. In some embodiments, the electronic device 40 may include an electronic scale, a pressure measuring device, an acceleration measuring device, a vibration monitoring device, a robot, a vehicle, or other similar equipment. In some embodiments, the electronic device 40 may include a display (not shown). The display can be used to display measurement information.
[0062] The strain signal sampler and electronic device of this invention, by adopting the strain signal sampling circuit as described above, can achieve high-precision sampling over a wide temperature range while reducing size and cost.
[0063] It should be noted that although several modules of the strain signal sampling circuit / strain signal sampler / electronic device are mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this utility model, the features and functions of two or more modules described above can be implemented in one module. Conversely, the features and functions of one module described above can be further divided and specified by multiple modules.
[0064] It should be noted that this utility model may include Figure 1-4 Any one or more features of any one or more embodiments. In other words, not all features shown in the figures need to be implemented simultaneously in the strain signal sampling circuit / strain signal sampler / electronic device of this invention.
[0065] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A strain signal sampling circuit, characterized in that, include: Resistor bridge; A low-temperature drift resistor array, wherein the low-temperature drift resistor array is connected to the resistor bridge; A switch, wherein the switch connects the resistor bridge and the low-temperature drift resistor array; and An analog-to-digital converter, which connects the resistor bridge and the switch.
2. The strain signal sampling circuit according to claim 1, characterized in that, Also includes: A voltage source connected to the resistor bridge is adapted to provide a power supply voltage.
3. The strain signal sampling circuit according to claim 2, characterized in that, The resistor bridge includes a first bridge arm, a second bridge arm, a third bridge arm, and a fourth bridge arm connected in series, wherein the common terminal of the first bridge arm and the third bridge arm is connected to the voltage source; and the common terminal of the second bridge arm and the fourth bridge arm is grounded.
4. The strain signal sampling circuit according to claim 3, characterized in that, The common terminal of the first bridge arm and the third bridge arm, and the common terminal of the second bridge arm and the fourth bridge arm are connected to the low-temperature drift resistor array and the analog-to-digital converter. The common terminal of the first bridge arm and the second bridge arm, and the common terminal of the third bridge arm and the fourth bridge arm are connected to the switch.
5. The strain signal sampling circuit according to claim 3, characterized in that, The switch includes a first input terminal and a second input terminal, wherein the first input terminal is connected to the low-temperature drift resistor array; the second input terminal is connected to the common terminal of the first bridge arm and the second bridge arm, and the common terminal of the third bridge arm and the fourth bridge arm; the switch can be used to select either the first input terminal or the second input terminal; the switch includes a multiplexer.
6. The strain signal sampling circuit according to claim 3, characterized in that, The first bridge arm includes a first resistor, the second bridge arm includes a second resistor, the third bridge arm includes a third resistor, and the fourth bridge arm includes a fourth resistor, wherein the first resistor and the fourth resistor include positive resistors; the second resistor and the third resistor include negative resistors; and at least one of the first resistor, the second resistor, the third resistor, or the fourth resistor has a variable resistance value.
7. The strain signal sampling circuit according to any one of claims 3-6, characterized in that, Also includes: Multiple signal conditioning circuits are connected to the resistor bridge, the low-temperature drift resistor array, the switch, and the analog-to-digital converter.
8. The strain signal sampling circuit according to claim 7, characterized in that, The plurality of signal conditioning circuits include a first signal conditioning circuit, which is connected to the common terminal of the first bridge arm and the third bridge arm, the common terminal of the second bridge arm and the fourth bridge arm, the low temperature drift resistor array, and the analog-to-digital converter.
9. The strain signal sampling circuit according to claim 7, characterized in that, The plurality of signal conditioning circuits further includes a second signal conditioning circuit, which is connected to the switch and the analog-to-digital converter.
10. A strain signal sampler, characterized in that, include: The strain signal sampling circuit as described in any one of claims 1-9; and A controller, which is connected to the strain signal sampling circuit.
11. An electronic device, characterized in that, Includes the strain signal sampler as described in claim 10.