sensor
Patent Information
- Application Number
- CN202521911332.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-05
AI Technical Summary
但是,现有的线束保持装置的结构相对复杂,安装较为繁琐,并且占用的空间也较大
[0018]由于采用了上述技术方案,本实用新型能够产生以下有益技术效果中的至少一个:
Smart Images

Figure CN224838969U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensor technology, and specifically to a sensor. Background Technology
[0002] A sensor is a device that converts collected physical signals (such as temperature, speed, magnetic force, color, etc.) into electrical signals. Sensors are widely used in various fields. When a sensor collects a physical signal, it transmits the signal to a processor or controller via a cable for further processing and analysis. Therefore, the cable is a crucial component of a sensor.
[0003] In existing sensors, due to spatial limitations and the need to avoid mutual interference, a wire harness holding device adapted for the cable is usually designed to fix and hold the wire harness leading from the cable within the sensor housing. However, existing wire harness holding devices are relatively complex in structure, cumbersome to install, and occupy a large amount of space.
[0004] Therefore, there is a need for a new type of sensor whose cable harness holding device can overcome at least one of the defects of the prior art. Utility Model Content
[0005] The purpose of this invention is to provide a novel sensor whose cable harness holding device has the advantages of simple design, convenient installation and small space occupation.
[0006] Therefore, the present invention proposes the following technical solution:
[0007] A sensor is characterized in that the sensor includes a cable, a circuit board, and a housing, the circuit board being assembled in the housing, the cable having multiple wire bundles extending from one end toward the circuit board, the wire bundles being electrically connected to the circuit board in an orientation perpendicular to the extension direction of the cable, wherein a wire bundle retainer is integrally formed on the wire bundles.
[0008] According to a specific embodiment of the present invention, the wire harness retainer includes a wire harness holding portion for fixing the wire harness, and an assembly portion for mounting the wire harness retainer to the housing.
[0009] According to a specific embodiment of the present invention, the wire harness retainer is integrally integrated onto the wire harness through an overmolding process.
[0010] According to a specific embodiment of the present invention, the wire harness holding part of the wire harness retainer is a columnar body.
[0011] According to a specific embodiment of the present invention, the assembly part of the wire harness retainer has a dovetail tenon structure, which is adapted to the dovetail groove provided on the housing.
[0012] According to a specific embodiment of the present invention, in a direction perpendicular to the plane of the circuit board, the height of the mounting portion is greater than the height of the wire harness holding portion.
[0013] According to a specific embodiment of the present invention, the wire harness retainer is injection molded from any of the following materials: epoxy resin, polyamide, polybutylene terephthalate, and polyphenylene sulfide.
[0014] According to a specific embodiment of the present invention, the assembly part is connected to the inner peripheral wall of the housing by an elastic snap-fit method, wherein the assembly part is made of elastic modified nylon.
[0015] According to a specific embodiment of the present invention, the assembly part is connected to the inner peripheral wall of the housing by an elastic snap fastener, wherein the inner peripheral wall is provided with a slot with a spring piece.
[0016] According to one specific embodiment of the present invention, the wire harness retainer is located adjacent to the circuit board.
[0017] This invention is applicable to various sensors, especially those in the automotive field, including but not limited to: engine management system sensors, such as crankshaft position sensors, camshaft position sensors, and intake pressure sensors; chassis and safety system sensors, such as wheel speed sensors, acceleration sensors, and tire pressure sensors; body and comfort system sensors, such as temperature and humidity sensors, light sensors, and rain sensors; driver assistance system (ADAS) sensors, such as camera sensors, millimeter-wave radar sensors, and lidar; and sensors specific to new energy vehicles, such as battery temperature sensors, current / voltage sensors, and motor position sensors.
[0018] By adopting the above technical solution, this utility model can produce at least one of the following beneficial technical effects:
[0019] 1) The wire harness retainer in this utility model is pre-molded integrally with the wire harness, thus simplifying the sensor assembly process;
[0020] 2) The wire harness retainer in this utility model has fewer components, and in particular, it does not require the use of cable ties, thus simplifying the structure and assembly of the sensor and saving costs;
[0021] 3) The space occupied by the wire harness retainer in the present invention is reduced in both directions parallel to and perpendicular to the circuit board plane, which is beneficial to the spatial arrangement of sensor components. Attached Figure Description
[0022] Figure 1a This is an exploded view of the components of a sensor based on existing technology;
[0023] Figure 1b This is a magnified schematic diagram of a sensor after assembly, based on existing technology.
[0024] Figure 2 This is an exploded view of the various components of a sensor according to an embodiment of the present invention;
[0025] Figure 3 yes Figure 2 A partially enlarged schematic diagram of an embodiment of the sensor shown after assembly; and
[0026] Figure 4 yes Figure 2 The illustrated embodiment of the sensor is shown in a partially cross-sectional enlarged view after assembly. Detailed Implementation
[0027] The technical solution of this utility model will be described in detail below with reference to the embodiments shown in the accompanying drawings. This description is given by way of example only and does not constitute a limitation on this utility model.
[0028] Most sensors in a car (from basic temperature and pressure sensors to high-end radar and cameras) are integrated into PCBs, or printed circuit boards (hereinafter referred to as "PCBs"), which provide the sensors with circuit connections, signal transmission, power supply support, and mechanical fixation.
[0029] Figure 1a An exploded schematic diagram of the various components of a sensor according to the prior art is shown. Figure 1b A partially enlarged schematic diagram of a sensor according to the prior art after assembly is shown. The sensor 1' includes a cable 11' (which is wrapped in insulating material in the figure), a circuit board 12', and a housing 13'. A cavity is formed in the housing 13' that conforms to the overall shape of the circuit board 12' for receiving the circuit board 12'. Various electronic components are mounted on the circuit board 12' for signal transmission, processing, and power supply. One end of the cable 11' (i.e., the end shown in the figure) is intended to connect to the circuit board 12', and the other end (i.e., the end not shown in the figure) can be connected to the sensor's signal input port. Thus, the signal acquired by the sensor is transmitted via the cable 11' to the circuit board 12' for processing.
[0030] like Figure 1a and 1bAs shown, cable 11' extends six wire bundles 111' at one end toward circuit board 12'. The ends of these wire bundles are exposed by removing the wrapping material to facilitate soldering to corresponding solder points on the circuit board, thereby achieving both mechanical and electrical connections between the wire bundles and the circuit board. For this connection purpose, after extending a certain distance along the extension direction of cable 11' (generally vertical in the figure), these wire bundles 111' typically need to be bent in the direction along the plane of the circuit board (generally horizontal in the figure) so that the ends of the wire bundles can be precisely aligned with and connected to the corresponding solder points on the circuit board. Therefore, cable 11' ultimately leads the wire bundles 111' onto the circuit board at a general 90° angle.
[0031] When connecting sensor cables to a circuit board, spatial constraints and the need to avoid mutual interference at the sensor's location typically require limiting and maintaining the wiring harness. Therefore, Figure 1a and 1b The prior art sensor shown also includes a hub 20' and cable ties 30'. The hub 20' includes three protective plates for surrounding the wire harnesses 111', which surround and confine the wire harnesses on the side of the wire harness facing the circuit board and on the adjacent sides. Furthermore, the hub 20' has a height substantially the same as the extension distance of the wire harnesses 111' along the extension direction of the cable 11'.
[0032] To accommodate the hub 20', the housing 13' has a hub receiving cavity 21'. Within this hub receiving cavity 21', there are wire harness slots 22', the same number as the wire harnesses 111', to accommodate each wire harness individually. Furthermore, cable ties 30' are wrapped around the top of the hub 20' to further limit and secure the wire harnesses, especially providing restraint on the side of the wire harnesses furthest from the circuit board.
[0033] As can be seen from the above description of existing sensors, their harness holding devices consist of multiple components, have a complex structure, and are cumbersome to install, resulting in high costs. Moreover, given the large size of the hub and the need to create a receiving cavity in the housing, it occupies a considerable amount of space, which may adversely affect the compact circuit layout of the sensor.
[0034] Figure 2 This is an exploded view of the various components of a sensor according to an embodiment of the present invention. Figure 3 yes Figure 2 The illustrated embodiment of the sensor is shown in a partially enlarged schematic diagram after assembly. (See attached image.) Figure 2 and 3As shown, a sensor 1 according to an embodiment of the present invention includes a cable 11 (which is wrapped in insulating material in the figure), a circuit board 12, and a housing 13. The housing 13 is designed to house the circuit board 12 and has a cavity adapted to the shape of the circuit board. One end of the cable 11 (i.e., the lower end shown in the figure) is designed to connect to the circuit board 12, and the other end (i.e., the upper end shown in the figure) is connected to the signal input port 50 of the sensor. Here, the basic form and function of the cable 11, the circuit board 12, and the housing are consistent with those described above. Figure 1a and 1b The basic principles are similar, so I will not repeat them here.
[0035] Cable 11 extends six wire bundles 111 at one end toward circuit board 12. The conductors 112 at the ends of these wire bundles 111 are exposed for easy soldering to corresponding solder points 122 on circuit board 12. The wire bundles 111 extend a certain distance along the extension direction of cable 11 (generally vertical in the figure) and then bend, extending at approximately 90° to the circuit board 12. It should be noted that the number of wire bundles 111 described herein is merely exemplary and not intended to be limiting.
[0036] In terms of constraining and holding the wire harness 111, this utility model adopts a structure different from the aforementioned prior art. Specifically, as follows: Figure 2 and 3 As shown, the sensor 1 according to this embodiment of the present invention includes a wire harness retainer 40, which is integrated with the wire harness 111. That is, the wire harness retainer 40 does not need to be mounted on the wire harness 111, but is pre-molded integrally with the wire harness 111. For example, the wire harness retainer 40 can be integrally integrated onto the wire harness 111 through an overmolding process. The wire harness retainer 40 is located adjacent to the circuit board 12.
[0037] In terms of materials, any material that can be injection molded can be used to form the wire harness retainer 40, including but not limited to epoxy resin, polyamide (PA), polybutylene terephthalate (PBT), and polyphenylene sulfide (PPS).
[0038] The wire harness retainer 40 comprises two parts: a wire harness holding part 401 and an assembly part 402. The wire harness holding part 401 is generally rectangular, and all wire harnesses 111 are embedded within this cuboid and neatly arranged in a row. Preferably, the two end faces of the cuboid perpendicular to the wire harness arrangement direction are rounded. This integrated structure of the wire harnesses 111 and the wire harness retainer 40 provides a stable constraint and retention for the wire harnesses 111. It should be noted that the shape of the wire harness holding part 401 is not limited to a cuboid; for example, it can be any form of columnar body, as long as it allows the wire harnesses 111 to be regularly embedded and arranged within it.
[0039] The assembly part 402 of the wire harness retainer is used to mount the wire harness retainer 40 onto the housing 13. Figure 2 and 3 As can be seen, the assembly part 402 adopts a dovetail joint structure; correspondingly, a dovetail groove 132 is formed on the inner peripheral wall of the housing 13 facing the wire harness retainer 40. Thus, the connection between the two can be achieved by the fitting of the dovetail joint and the dovetail groove. Figure 4 It shows Figure 2 The illustrated sensor embodiment is shown in a partially cross-sectional enlarged view after assembly, where the dovetail groove 132 on the inner peripheral wall of the housing is clearly visible. Preferably, in a direction perpendicular to the plane of the circuit board 12, the extension length of the dovetail (and corresponding dovetail groove) is greater than the extension length of the wire harness retainer 401, so as to more securely connect the wire harness retainer 40 in the housing and also to free up more usable space below the wire harness retainer 401. More generally, in a direction perpendicular to the plane of the circuit board 12, the height of the mounting portion 402 is greater than the height of the wire harness retainer 401, even if the mounting portion 402 is not a dovetail structure.
[0040] Those skilled in the art will understand that the connection between the wire harness retainer 40 and the housing can also be achieved in other ways. For example, the positions of the dovetail tenon and the dovetail groove can be interchanged; that is, the dovetail tenon can be set on the inner peripheral wall of the housing, and the dovetail groove can be set on the wire harness retainer 40. Alternatively, the connection can be achieved by a resilient snap-fit mechanism. For example, a snap-fit groove with a spring clip can be formed on the inner peripheral wall of the housing. Alternatively, the material of the wire harness retainer 40 can be selected to have slight elasticity so as to achieve a resilient snap-fit connection with the snap-fit groove on the inner peripheral wall of the housing. For example, the material of the wire harness retainer 40 can be modified nylon obtained by adding elastomer blending modification.
[0041] According to this invention, when assembling the sensor, the wire harness retainer 40 is pre-fixed to the wire harness 111 extending from the cable 11 by integral molding. Then, the exposed wires at the end of the wire harness are soldered to the corresponding solder points on the circuit board 12. The assembly part 402 of the wire harness retainer 40 is then installed onto the housing, for example, by engaging the dovetail tenon of the wire harness retainer 40 into a dovetail groove on the inner peripheral wall of the housing. Thus, on the one hand, the wire harness 111 is led out onto the circuit board 12 at an orientation of approximately 90° relative to the extension direction of the cable 11; on the other hand, the led-out wire harness 111 is well constrained and retained.
[0042] For example, refer to Figure 1a and 1bCompared to existing sensors, the sensor according to this invention uses a wire harness holder with fewer components, a simpler structure, easier assembly, and lower cost. Furthermore, as... Figure 3 As clearly shown, compared to the prior art, the wire harness retainer in this invention occupies less space in both directions parallel and perpendicular to the plane of the circuit board 12, which is advantageous for the spatial layout of various components of the sensor.
[0043] Although the present invention has been disclosed above with reference to preferred embodiments, it is not limited thereto. Any modifications and alterations made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined in the claims.
Claims
1. A sensor, characterized in that, The sensor includes a cable, a circuit board, and a housing. The circuit board is assembled in the housing. The cable has multiple wire bundles extending from one end toward the circuit board. The wire bundles are electrically connected to the circuit board in an orientation perpendicular to the extension direction of the cable. A wire bundle retainer is integrally formed on the wire bundles.
2. The sensor according to claim 1, characterized in that, The wire harness retainer includes a wire harness holding portion for securing the wire harness, and an assembly portion for mounting the wire harness retainer onto the housing.
3. The sensor according to claim 1 or 2, characterized in that, The wire harness retainer is integrally integrated onto the wire harness through an overmolding process.
4. The sensor according to claim 2, characterized in that, The wire harness retainer has a cylindrical wire harness holding part.
5. The sensor according to claim 2, characterized in that, The assembly part of the wire harness retainer has a dovetail tenon structure, which is adapted to the dovetail groove provided on the housing for installation.
6. The sensor according to claim 2, characterized in that, In a direction perpendicular to the plane of the circuit board, the height of the mounting portion is greater than the height of the wire harness holding portion.
7. The sensor according to claim 3, characterized in that, The wire harness retainer is injection molded from any of the following materials: epoxy resin, polyamide, polybutylene terephthalate, or polyphenylene sulfide.
8. The sensor according to claim 2, characterized in that, The assembly part is connected to the inner peripheral wall of the housing by an elastic snap-fit mechanism, wherein the assembly part is made of elastic modified nylon.
9. The sensor according to claim 2, characterized in that, The assembly part is connected to the inner peripheral wall of the housing by an elastic snap-fit, wherein the inner peripheral wall is provided with a snap-fit groove with a spring tab.
10. The sensor according to claim 1 or 2, characterized in that, The wire harness retainer is located adjacent to the circuit board.