A test module

Abstract

The utility model provides a kind of test module, it is related to test technical field.The test module includes shell and test component arranged in shell.Wherein, test component includes iTLA, flexible circuit board and main circuit board.Flexible circuit board one end is connected with iTLA electricity, other end is connected with main circuit board electricity, realize the signal transmission between iTLA and main circuit board.Main circuit board extends to shell outside, forms exposed connection area, for with test platform electric connection.Based on above structure, the utility model provides test module by shell to the effective encapsulation of iTLA, significantly improves its protection capability to environmental factors such as electrostatic, vibration, dust, enhances the stability and reliability of device;Meanwhile, by extending main circuit board to shell outside, it can be directly, quickly connected into automated test platform, realizes efficient, convenient batch testing, substantially improves test efficiency and production line compatibility.

Description

Technical Field

[0001] This utility model relates to the field of testing technology, and more specifically, to a testing module. Background Technology

[0002] In related technologies, iTLA (Integrated Tunable Laser Assembly) typically exists as an exposed PCBA board. The inventors' research revealed that, due to the lack of a protective casing, this structure is susceptible to environmental factors such as electrostatic discharge, vibration, and dust, leading to unstable device performance or even damage, resulting in low reliability. Furthermore, this structure cannot be directly adapted to the standardized testing platforms of test module production lines, making it difficult to achieve efficient and automated batch testing. Utility Model Content

[0003] The purpose of this invention is to provide a testing module that not only improves iTLA's environmental adaptability and operational reliability during transportation, storage, and testing, but also achieves standardized integration with automated testing production lines, significantly improving testing efficiency.

[0004] The embodiments of this utility model can be implemented as follows: In a first aspect, the present invention provides a test module, including a housing and a test component disposed within the housing; wherein the test component includes an iTLA, a flexible circuit board and a main circuit board, one end of the flexible circuit board being electrically connected to the iTLA and the other end being electrically connected to the main circuit board; the main circuit board extends outside the housing and is used for electrical connection with a test platform.

[0005] In an optional embodiment, the housing includes an upper shell and a lower shell, which cooperate with each other to form an inner cavity for accommodating the test component.

[0006] In an optional embodiment, one of the upper shell and the lower shell is provided with a snap-fit ​​part, and the other is provided with a snap-fit ​​groove that mates with the snap-fit ​​part.

[0007] In an optional implementation, a plurality of limiting blocks are provided inside the lower shell, and the limiting blocks are respectively disposed around the iTLA.

[0008] In an optional embodiment, the lower housing is further provided with a plurality of first pads and a plurality of second pads; wherein the first pads abut against the lower wall surface of the iTLA, and the second pads abut against the lower wall surface of the main circuit board.

[0009] In an optional implementation, the test module further includes a heat sink, and the upper housing is provided with a first mounting slot that matches the heat sink.

[0010] In an optional embodiment, the test module further includes a baffle and a first fastener. The baffle is disposed on the opening side of the first mounting groove and is connected to the upper shell through the first fastener to press the heat sink into the first mounting groove.

[0011] In an optional implementation, the test module further includes a card kit fitted around the outer periphery of the housing.

[0012] In an optional embodiment, the card kit includes a base and arms extending from both sides of the base, and each arm has a flange at the end away from the base, the flange being fastened to the bottom wall of the housing.

[0013] In an optional implementation, the portion of the main circuit board extending outside the housing is provided with gold fingers for electrical connection with the test platform.

[0014] The beneficial effects of the testing module provided in this embodiment of the present invention include: This invention provides a test module comprising a housing and test components housed within the housing. The test components include an iTLA (Integrated Telescope Array), a flexible circuit board, and a main circuit board. One end of the flexible circuit board is electrically connected to the iTLA, and the other end is electrically connected to the main circuit board, enabling signal transmission between the iTLA and the main circuit board. The main circuit board extends outside the housing, forming an exposed connection area for electrical connection to a test platform. Based on this structure, the test module provided by this invention effectively encapsulates the iTLA through the housing, significantly improving its protection against environmental factors such as electrostatic discharge, vibration, and dust, thus enhancing the stability and reliability of the device. Simultaneously, by extending the main circuit board outside the housing, it can be directly and quickly connected to an automated test platform, enabling efficient and convenient batch testing, and significantly improving testing efficiency and production line compatibility. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the test module provided in this embodiment; Figure 2 This is an exploded view of the test module provided in this embodiment; Figure 3 This is a schematic diagram showing the connection between ita, the flexible circuit board, and the main circuit board provided in this embodiment. Figure 4This is a schematic diagram of the upper shell structure provided in this embodiment; Figure 5 This is a schematic diagram of the lower shell provided in this embodiment.

[0017] Icons: 10-Test module; 100-Housing; 110-Upper housing; 111-Snap-fit ​​part; 113-Protrusion; 130-Lower housing; 131-Snap-fit ​​groove; 132-Limiting block; 133-First pad; 134-Second pad; 135-Second fastener; 136-Second mounting slot; 300-Test assembly; 310-iTLA; 330-Flexible circuit board; 350-Main circuit board; 410-Heat sink; 420-Baffle; 430-First fastener; 440-Light port sealing material; 450-Electrical port sealing material; 500-Card kit; 510-Base; 530-Arm; 550-Flange. Detailed Implementation

[0018] In related technologies, iTLA usually exists in the form of an exposed PCBA board, which lacks shell protection and is susceptible to environmental factors such as static electricity, vibration, and dust, resulting in unstable performance or even damage and poor reliability. At the same time, this structure is difficult to directly adapt to the standardized interfaces of the test production line, making it impossible to achieve efficient and automated batch testing.

[0019] To address the aforementioned issues, this invention provides a testing module that encapsulates the iTLA within a housing, achieving mechanical and environmental protection. Electrical connections to the iTLA are established via a flexible circuit board and a main circuit board, with the main circuit board extending outside the housing for direct connection to a testing platform. This enables standardized integration with automated testing production lines, significantly improving testing efficiency.

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] The following describes in detail the overall structure, working principle, and technical effects of the test module provided by this utility model through embodiments and in conjunction with the accompanying drawings.

[0027] Please see Figures 1 to 3 This utility model provides a test module 10, which not only improves the environmental adaptability and operational reliability of iTLA310 during transportation, storage and testing, but also realizes standardized docking with automated test production lines, significantly improving testing efficiency.

[0028] The test module 10 includes a housing 100 and a test component 300 disposed within the housing 100. The test component 300 includes an iTLA310, a flexible circuit board 330, and a main circuit board 350. By using the housing 100, this invention encapsulates the iTLA310, which was originally exposed and susceptible to environmental interference, within the housing 100, which possesses mechanical strength and protective capabilities. This effectively avoids damage caused by electrostatic discharge, vibration, shock, dust contamination, and other factors, significantly improving the device's environmental adaptability, operational stability, and lifespan during transportation, storage, and testing.

[0029] One end of the flexible circuit board 330 is electrically connected to the iTLA310, and the other end is electrically connected to the main circuit board 350, enabling signal transmission between the iTLA310 and the main circuit board 350. Specifically, one end of the flexible circuit board 330 can be connected to the output terminal of the iTLA310 by soldering or plugging, and the other end is connected to the corresponding interface area on the main circuit board 350 to complete the electrical interconnection. The main circuit board 350 extends outside the housing 100, forming an exposed connection area for electrical connection with the test platform, thereby achieving rapid and standardized docking with automated test production lines.

[0030] Based on the above, the test module 10 provided by this utility model effectively encapsulates the iTLA310 through the housing 100, significantly improving its protection against environmental factors such as static electricity, vibration, and dust during transportation, storage, and testing, and enhancing the stability and reliability of the device. At the same time, the flexible circuit board 330 is used to achieve a reliable electrical connection between the iTLA310 and the main circuit board 350, and the main circuit board 350 is extended to the outside of the housing 100, so that the test module 10 can be directly and quickly connected to the automated testing platform, realizing efficient and convenient batch testing, and greatly improving testing efficiency and production line compatibility.

[0031] Since the iTLA310 typically uses UART for communication, while optical module test platforms generally use the I²C standard protocol, the two communication protocols are incompatible. Therefore, the main circuit board 350 is equipped with a communication protocol conversion unit to realize bidirectional data communication conversion between the iTLA310 unit and the test platform.

[0032] Specifically, the communication protocol conversion unit includes a UART-I²C bridge circuit, or implements the protocol conversion function through a microcontroller (MCU) set on the main circuit board 350 to complete the data format conversion between UART and I²C.

[0033] Furthermore, in practical applications, the power supply bus of optical modules is usually 3.3V, while the power supply requirements of the iTLA310 unit include multiple power supplies, such as ±12V, 3.3V and 2.5V. Therefore, the main circuit board 350 is equipped with a voltage conversion unit to convert the externally input power supply voltage into one or more operating voltages required by the iTLA310 unit.

[0034] Furthermore, in an optional embodiment, the portion of the main circuit board 350 extending outside the housing 100 is provided with gold fingers (not shown), which are used for electrical connection with the test platform.

[0035] When test module 10 is inserted into the optical module test platform, it automatically receives power through the gold fingers and establishes an I²C communication link. Subsequently, the test platform sends control commands through this interface to achieve wavelength tuning and output power adjustment of the iTLA310, and completes protocol conversion and control operations related to the iTLA310 through the built-in circuit of the fixture. The data generated during the test can be stored in the EEPROM inside the fixture or uploaded to the production line management system for centralized processing.

[0036] Based on the above, the test module 10 provided by this utility model has good compatibility with standard test platforms, can realize automated batch testing, reduce manual dependence, significantly improve test efficiency and production line integration level, and is suitable for large-scale production environments.

[0037] Please refer to it again. Figure 2 The following will describe in detail the installation and fixing structure of the iTLA310 in the housing 100. The housing 100 includes an upper shell 110 and a lower shell 130, which cooperate with each other to form an inner cavity for accommodating the test assembly 300. Optionally, the lower shell 130 adopts a box-type structure with an inner cavity, while the upper shell 110 is a matching box cover structure, which facilitates assembly and together with the lower shell 130 forms a closed protective space.

[0038] To achieve a reliable connection and fixation between the upper shell 110 and the lower shell 130, one of the upper shell 110 and the lower shell 130 is provided with a snap-fit ​​part 111, and the other is provided with a snap-fit ​​groove 131 that mates with the snap-fit ​​part 111. The two shells achieve quick assembly and a secure connection of the shell 100 through snap-fit ​​engagement, without relying on additional fasteners such as screws. This not only reduces the number of parts but also simplifies the assembly process, improves production efficiency, and enhances structural compactness.

[0039] Furthermore, such as Figure 4 As shown, the bottom wall of the upper shell 110 extends downward to form a protrusion 113. After assembly, the protrusion 113 abuts against the inner sidewall of the lower shell 130, achieving lateral restraint and effectively preventing relative displacement between the upper shell 110 and the lower shell 130, thereby improving the stability and reliability of the connection of the shell 100. Optionally, there are two protrusions 113, located on both sides of the upper shell 110, and correspondingly abutting against the inner sidewalls of the lower shell 130 on both lateral sides.

[0040] Please refer to it again. Figure 4 To improve heat dissipation, the test module 10 also includes a heat sink 410, and the upper shell 110 is provided with a first mounting slot (not shown) that matches the heat sink 410. In actual assembly, the heat sink 410 is installed in the first mounting slot and positioned directly opposite the iTLA310 below to achieve good thermal contact and efficient heat conduction, thereby improving the overall thermal management capability of the module.

[0041] Furthermore, the test module 10 also includes a baffle 420 and a first fastener 430. The baffle 420 is disposed on the opening side of the first mounting groove and is connected to the upper shell 110 by the first fastener 430 (such as a screw or rivet) to press the heat sink 410 into the first mounting groove, effectively preventing it from falling off or shifting due to gravity or vibration impact.

[0042] Optionally, the heat sink 410 may be made of thermally conductive silicone pad, graphene thermally conductive sheet or metal-based thermally conductive material, which has good thermal conductivity and compression resilience and can fit tightly against the surface of iTLA310.

[0043] Please see Figure 5 The lower housing 130 is also provided with a plurality of first pads 133 and a plurality of second pads 134. The first pads 133 abut against the lower wall of the iTLA310 to provide structural support and buffer external vibration and impact; correspondingly, the second pads 134 abut against the lower wall of the main circuit board 350 to position and support the main circuit board 350.

[0044] Optionally, the lower wall of the iTLA310 is located on the same horizontal plane or approximately on the same horizontal plane as the lower wall of the main circuit board 350.

[0045] To ensure the stability of the iTLA310 within the test module 10 and to prevent displacement or loosening during transportation, vibration, or operation, a plurality of limiting blocks 132 are provided inside the lower shell 130. The limiting blocks 132 are respectively arranged around the iTLA310 to limit the iTLA310 circumferentially and to stably fix it inside the lower shell 130.

[0046] Furthermore, to enhance the structural stability of the main circuit board 350, the main circuit board 350 is connected to at least one second pad 134 via a second fastener 135 (such as a screw or rivet) to achieve mechanical reinforcement.

[0047] It should be noted that this application does not limit the specific shapes of the first pad 133, the second pad 134, and the limiting block 132.

[0048] To improve the protection performance of test module 10 in complex environments, please refer again. Figure 2To ensure the long-term stable operation of internal components (such as iTLA310, main circuit board 350, etc.), the test module 10 also includes optical port sealing material 440 and electrical port sealing material 450. Specifically, a second mounting groove 136 matching the optical port sealing material 440 is provided on the lower shell 130, and the optical port sealing material 440 is embedded in the second mounting groove 136. Two electrical port sealing materials 450 are provided, respectively arranged on the upper and lower sides of the main circuit board 350, and located in the periphery of the gold fingers, to seal and protect the electrical connection interface.

[0049] In addition, such as Figure 2 As shown, in order to further enhance the structural stability and mechanical strength of the upper shell 110 and the lower shell 130 in the assembled state, the test module 10 also includes a card kit 500, which is fitted on the outer periphery of the shell 100 and plays an external reinforcement role for the overall shell 100 structure.

[0050] Specifically, the card kit 500 has a square structure with a notch, including a base 510 and arms 530 extending from both sides of the base 510. Each arm 530 has a flange 550 at the end away from the base 510. The flange 550 is fastened to the bottom wall of the housing 100 to fix the card kit 500 to the outer periphery of the housing 100.

[0051] Based on the above, during assembly, the two arms 530 extend and cover the side walls of the housing 100, and the flanges 550 fasten to the outer surface of the bottom wall of the housing 100, forming an effective limit to prevent the card kit 500 from falling off due to vibration or external force during use. Furthermore, the inner contour dimension of the card kit 500 is slightly smaller than the outer contour dimension of the housing 100, so that the two form an interference fit after assembly, achieving tight fixation and maintaining a stable connection without the need for additional fasteners.

[0052] In summary, this utility model provides a test module 10, which includes a housing 100 and a test component 300 disposed within the housing 100. The test component 300 includes an iTLA 310, a flexible circuit board 330, and a main circuit board 350. One end of the flexible circuit board 330 is electrically connected to the iTLA 310, and the other end is electrically connected to the main circuit board 350, enabling signal transmission between the iTLA 310 and the main circuit board 350. The main circuit board 350 extends outside the housing 100, forming an exposed connection area for electrical connection with a test platform. Based on the above structure, the test module 10 provided by this utility model effectively encapsulates the iTLA 310 through the housing 100, significantly improving its protection against environmental factors such as electrostatic discharge, vibration, and dust, and enhancing the stability and reliability of the device. Simultaneously, by extending the main circuit board 350 outside the housing 100, it can be directly and quickly connected to an automated test platform, achieving efficient and convenient batch testing, and greatly improving testing efficiency and production line compatibility.

[0053] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A test module, characterized in that, The device includes a housing (100) and a test assembly (300) disposed within the housing (100); wherein the test assembly (300) includes an iTLA (310), a flexible circuit board (330) and a main circuit board (350), one end of the flexible circuit board (330) being electrically connected to the iTLA (310) and the other end being electrically connected to the main circuit board (350); the main circuit board (350) extends outside the housing (100) and is used for electrical connection with the test platform.

2. The test module according to claim 1, characterized in that, The housing (100) includes an upper shell (110) and a lower shell (130), the upper shell (110) and the lower shell (130) cooperating with each other to jointly enclose an inner cavity for accommodating the test component (300).

3. The test module according to claim 2, characterized in that, One of the upper shell (110) and the lower shell (130) is provided with a snap-fit ​​part (111), and the other is provided with a snap-fit ​​groove (131) that mates with the snap-fit ​​part (111).

4. The test module according to claim 2, characterized in that, The lower shell (130) is provided with a plurality of limiting blocks (132), which are respectively arranged around the iTLA (310).

5. The test module according to claim 2, characterized in that, The lower housing (130) is further provided with a plurality of first pads (133) and a plurality of second pads (134); wherein the first pads (133) abut against the lower wall of the iTLA (310), and the second pads (134) abut against the lower wall of the main circuit board (350).

6. The test module according to claim 2, characterized in that, The test module (10) also includes a heat sink (410), and the upper shell (110) is provided with a first mounting slot that matches the heat sink (410).

7. The test module according to claim 6, characterized in that, The test module (10) further includes a baffle (420) and a first fastener (430). The baffle (420) is disposed on the opening side of the first mounting groove and is connected to the upper shell (110) through the first fastener (430) to press the heat sink (410) into the first mounting groove.

8. The test module according to any one of claims 1 to 7, characterized in that, The test module (10) also includes a card kit (500) which is fitted around the outer periphery of the housing (100).

9. The test module according to claim 8, characterized in that, The card kit (500) includes a base (510) and arms (530) extending from both sides of the base (510), and each arm (530) has a flange (550) at one end away from the base (510), the flange (550) being fastened to the bottom wall of the housing (100).

10. The test module according to any one of claims 1 to 7, characterized in that, The portion of the main circuit board (350) extending outside the housing (100) is provided with gold fingers, which are used for electrical connection with the test platform.

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