A moisture-proof sealing structure of an ultramicro balance microelectronic assembly

Abstract

The application relates to a moisture-proof sealing structure of an ultramicro balance microelectronic assembly, and relates to the technical field of moisture-proof sealing of electronic assemblies, which comprises a mounting bottom plate for mounting the microelectronic assembly and a cover shell covering the microelectronic assembly, a sealing gasket is arranged between the cover shell and the mounting bottom plate, a plurality of fixing plates are arranged on the outer wall of the cover shell, a fixing bolt is arranged on any one of the fixing plates, a plurality of threaded holes corresponding in number and position to the fixing bolts are formed in the mounting bottom plate, and any one of the fixing bolts is arranged to pass through the fixing plate and be in threaded cooperation with the corresponding threaded hole. The application effectively realizes all-around moisture-proof sealing protection of the microelectronic assembly, and has the effects of improving the maintainability and service life of the equipment.

Description

Technical Field

[0001] This application relates to the field of moisture-proof sealing technology for electronic components, and in particular to a moisture-proof sealing structure for an ultra-micro balance microelectronic component. Background Technology

[0002] Ultra-micro balances play a crucial role in numerous fields, including modern scientific research and industrial production. They enable precise measurement of extremely small masses, providing strong support for the accuracy of scientific data and the precision of industrial production. With continuous technological advancements, the application scenarios for ultra-micro balances are becoming increasingly widespread, leading to ever-higher requirements for their measurement accuracy and stability. During the use of ultra-micro balances, the performance of their internal microelectronic components directly affects the overall measurement results, and the performance of these microelectronic components is highly susceptible to interference from external environmental factors.

[0003] Currently, in terms of moisture-proof sealing of microelectronic components in ultra-micro balances, potting compound is typically used to glue and fix the outer casing of the microelectronic component to the mounting base, thus forming a relatively sealed space. This method provides a certain degree of protection and can offer some moisture protection for the microelectronic component in relatively complex environments, enabling the microelectronic component to maintain a relatively stable operating state for a certain period of time.

[0004] However, the aforementioned method of using potting compound for moisture-proof sealing has significant drawbacks. While potting compound provides a good seal, the disassembly process is complex and may damage the microelectronic components when repairing them or replacing internal parts, increasing maintenance costs and difficulty, and thus requiring improvement. Utility Model Content

[0005] To address the problem of inconvenient disassembly caused by using potting compound for moisture-proof sealing, this application provides a moisture-proof sealing structure for microbalance microelectronic components.

[0006] This application provides a moisture-proof and sealing structure for a microbalance microelectronic component, which adopts the following technical solution: A moisture-proof and sealing structure for a micro-balance microelectronic component includes a mounting base plate for mounting the microelectronic component and a cover covering the microelectronic component. A sealing gasket is provided between the cover and the mounting base plate. Multiple fixing plates are provided on the outer wall of the cover, and each of the fixing plates is provided with a fixing bolt. The mounting base plate has multiple threaded holes corresponding to the number and position of the fixing bolts, and each of the fixing bolts passes through the fixing plate and forms a threaded engagement with the corresponding threaded hole.

[0007] By adopting the above technical solution, the mechanical connection method of fixing bolts and threaded holes is used to replace the traditional potting adhesive bonding. While ensuring that the cover and the mounting base plate fit tightly to achieve moisture prevention by compressing the sealing gasket, the disassembly process is greatly simplified. When it is necessary to repair or replace the microelectronic components inside the cover, the cover can be opened simply by loosening the fixing bolts. This avoids the problems of disassembly difficulties and component damage caused by the use of potting adhesive, significantly reducing maintenance costs and time, and improving the maintainability and service life of the equipment.

[0008] Preferably, the mounting base plate has a groove for placing a sealing gasket.

[0009] By adopting the above technical solution, a groove for placing the gasket is opened on the mounting base plate, which can provide precise positioning and accommodation space for the gasket, prevent the gasket from shifting or misaligning when installing the cover, and make the gasket evenly and reliably compressed in the preset position, thereby improving sealing stability and consistency and enhancing the overall moisture-proof sealing effect.

[0010] Preferably, the cover has a sealing auxiliary part on the side near the mounting base plate, and the sealing auxiliary part is fitted into the groove.

[0011] By adopting the above technical solution, the sealing auxiliary part on the cover and the groove on the mounting base plate form an embedded fit, making the connection between the cover and the mounting base plate tighter and more precise. This structure enhances the rigidity and stability of the overall structure through mechanical fitting, and at the same time can work together with the sealing gasket to form a double moisture barrier composed of "fitting surface" and "pressing surface", extending the intrusion path of external moisture and further improving the overall sealing and moisture-proof effect and reliability.

[0012] Preferably, a washer is provided between any of the fixing bolts and the fixing plate, and the outer surface of any of the washers is provided with anti-slip teeth.

[0013] By adopting the above technical solution, a washer with anti-slip teeth is set between the fixing bolt and the fixing plate, which can increase the friction between the bolt head and the fixing plate, effectively prevent the fixing bolt from loosening spontaneously when the equipment is used for a long time or subjected to vibration, ensure the stable and tight connection between the cover and the mounting base plate, and guarantee the long-term stability of the moisture-proof effect.

[0014] Preferably, the cover has multiple heat dissipation holes, and each of the heat dissipation holes is provided with a moisture-proof component.

[0015] By adopting the above technical solution, heat dissipation holes with moisture-proof components are opened on the housing, balancing the conflicting needs of sealing and heat dissipation. The heat dissipation holes can dissipate the heat generated by the microelectronic components during operation in a timely manner, avoiding excessive internal temperature from affecting the accuracy of the balance or damaging the components. The moisture-proof components can prevent external moisture from entering the housing during heat dissipation and ventilation, thus taking into account both the heat dissipation performance and moisture-proof requirements of the equipment.

[0016] Preferably, any of the moisture-proof components includes a filter screen, a sealing screen, and a desiccant for absorbing moisture, wherein the filter screen and the sealing screen, together with the inner wall of the heat dissipation holes, form a placement space, and the desiccant is placed within the placement space.

[0017] By adopting the above technical solution, the moisture-proof component consists of a filter, a sealing mesh, and a desiccant. The filter can block dust and other impurities from entering, the sealing mesh can fix the position of the desiccant, and the desiccant actively adsorbs the moisture entering the heat dissipation holes. The three work together to form a highly efficient moisture-proof filtration structure, which can not only ensure unobstructed heat dissipation channels, but also continuously maintain a dry internal environment, further improving the moisture protection effect of microelectronic components.

[0018] Preferably, each of the filter screens is provided with a sealing ring on the side facing the heat dissipation hole to form an abutment with the inner wall of the heat dissipation hole, and each of the filter screens is provided with a pull ring on the side facing the heat dissipation hole.

[0019] By adopting the above technical solution, the sealing ring on the inner side of the filter screen can enhance the sealing performance between the filter screen and the inner wall of the heat dissipation hole, reduce the seepage of moisture from the gaps, and at the same time, the pull ring on the outer side of the filter screen facilitates quick disassembly of the filter screen, makes it easy to replace the desiccant regularly, ensures the long-term effectiveness of the moisture-proof components, reduces the difficulty of maintenance operations, and improves the convenience of the structure.

[0020] Preferably, an annular groove is formed on the outer wall of any of the sealing rings, and any of the sealing rings forms an interference fit with the inner wall of the heat dissipation hole.

[0021] By adopting the above technical solution, the sealing ring and the inner wall of the heat dissipation hole form an interference fit, which can make the two fit tightly and enhance the sealing effect. At the same time, the annular groove opened on the outer wall of the sealing ring can further improve its elastic deformation ability, making it better adapt to the contour of the inner wall of the heat dissipation hole, reducing the assembly gap, improving assembly stability, preventing it from falling off or shifting during use, and ensuring the continuity of moisture-proof sealing.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting a sealing gasket between the cover and the mounting base plate and fixing it with fixing bolts and threaded holes, the traditional potting adhesive is replaced, which simplifies the disassembly process of the cover and the mounting base plate, reduces maintenance costs and difficulty. At the same time, the mounting base plate has a groove to place the sealing gasket, and the cover has a sealing auxiliary part that fits into the groove, which extends the intrusion path of external moisture and further improves the moisture-proof sealing effect. 2. The housing has heat dissipation holes with moisture-proof components, which can prevent external moisture from entering while dissipating heat. The moisture-proof components consist of a filter, a sealing mesh, and a desiccant. The three work together to form a highly efficient moisture-proof filtration structure, which can not only ensure unobstructed heat dissipation channels, but also continuously maintain a dry internal environment, further improving the moisture protection effect of microelectronic components. 3. A sealing ring is provided on the side of the filter screen facing the heat dissipation hole, which abuts against the inner wall of the heat dissipation hole. The outer wall of the sealing ring has an annular groove that is interference-fitted with the inner wall of the heat dissipation hole, further enhancing the sealing performance of the moisture-proof component. At the same time, a pull ring is provided on the side of the filter screen facing the heat dissipation hole, which facilitates the periodic replacement of the desiccant in the moisture-proof component. Attached Figure Description

[0023] Figure 1 This is an isometric schematic diagram of the main overall structure in the embodiments of this application; Figure 2 This is an exploded view showing the main installation position of the sealing gasket in the embodiments of this application; Figure 3 This is a partial cross-sectional view of the moisture-proof component structure, which is the main feature of the embodiments in this application.

[0024] Reference numerals: 1. Mounting base plate; 11. Groove; 12. Threaded hole; 2. Cover; 21. Fixing plate; 211. Fixing bolt; 22. Sealing auxiliary part; 3. Sealing gasket; 31. Rectangular clearance hole; 4. Gasket; 41. Anti-slip teeth; 5. Heat dissipation hole; 6. Moisture-proof component; 61. Filter screen; 611. Placement space; 62. Sealing mesh; 63. Desiccant; 7. Sealing ring; 71. Annular groove; 8. Pull ring. Detailed Implementation

[0025] The following is in conjunction with the appendix Figure 1 - Appendix Figure 3 This application will be described in further detail.

[0026] This application discloses a moisture-proof sealing structure for a microbalance microelectronic component.

[0027] Reference Figure 1 and Figure 2A moisture-proof sealing structure for a microbalance microelectronic component includes a mounting base plate 1 for mounting the microelectronic component and a cover 2 covering the microelectronic component. A rectangular sealing gasket 3 is provided between the cover 2 and the mounting base plate 1. A rectangular clearance hole 31 for avoiding the microelectronic component is opened at the center of the sealing gasket 3. A groove 11 is opened on the mounting base plate 1 to form an embedded fit with the sealing gasket 3. A plurality of fixing plates 21 are integrally formed on the outer wall of the cover 2 near the mounting base plate 1. Each fixing plate 21 is provided with a fixing bolt 211. In this embodiment, four fixing plates 21 are provided, which are respectively located on the outer wall of the cover 2. Each fixing plate 21 is provided with three fixing bolts 211 at equal intervals along its length. A plurality of threaded holes 12 are opened on the mounting base plate 1 corresponding to the number and position of the fixing bolts 211. Each fixing bolt 211 passes through the fixing plate 21 and forms a threaded fit with the corresponding threaded hole 12.

[0028] In practical use, the mounting base 1 provides the mounting foundation for the microelectronic components and the housing 2. The sealing gasket 3 is precisely embedded in the groove 11 on the mounting base 1, ensuring that the rectangular clearance hole 31 corresponds to the position of the microelectronic components, thus avoiding pressure on the microelectronic components and creating a good sealing environment. During installation, the housing 2 is first slowly placed over the microelectronic components, so that the housing 2 and the sealing gasket 3 fit tightly together. At this time, the multiple fixing plates 21 on the outer wall of the housing 2 abut against the mounting base 1. Then, simply pass the fixing bolts 211 one by one through the fixing plates 21 and screw them into the mounting base 1. As the fixing bolts 211 are gradually tightened in the corresponding threaded holes 12, the connection between the cover 2 and the mounting base plate 1 becomes more and more stable. At the same time, the sealing gasket 3 is further filled with any possible tiny gaps under the pressure of the two, thereby achieving all-round moisture-proof and sealing protection for the microelectronic components. When it is necessary to repair or replace the microelectronic components inside the cover 2, the cover 2 can be opened simply by loosening the fixing bolts 211. This avoids problems such as disassembly difficulties and component damage caused by the use of potting compound, significantly reducing maintenance costs and time, and improving the maintainability and service life of the equipment.

[0029] Reference Figure 1 and Figure 2 The cover 2 is integrally formed with a sealing auxiliary part 22 on the side near the mounting base plate 1, and the sealing auxiliary part 22 is fitted into the groove 11; a gasket 4 is provided between any of the fixing bolts 211 and the fixing plate 21, and the outer surface of any of the gaskets 4 is provided with anti-slip teeth 41. In the embodiment of this application, the upper and lower surfaces of any of the gaskets 4 respectively form abutment fit with the bolt head of the fixing bolt 211 and the fixing plate 21, and the anti-slip teeth 41 on any of the gaskets 4 are concentrated on its upper and lower surfaces.

[0030] In practical use, when the cover 2 is slowly placed over the microelectronic components and gradually approaches the mounting base plate 1, the sealing auxiliary part 22 on the cover 2 will be precisely embedded in the groove 11 on the mounting base plate 1. This fitting makes the connection between the cover 2 and the mounting base plate 1 tighter and more precise. At the same time, the sealing auxiliary part 22 can work together with the sealing gasket 3 to form a double moisture barrier composed of the "fitting surface" and the "pressing surface", further improving the overall sealing and moisture-proof effect and reliability. During the tightening of the fixing bolt 211, the gasket 4 between the fixing bolt 211 and the fixing plate 21 is tightly compressed. The anti-slip teeth 41 on the outer surface of the gasket 4 can increase the friction between it and the bolt head and the fixing plate 21, effectively preventing the fixing bolt 211 from loosening spontaneously when the equipment is used for a long time or subjected to vibration, ensuring the long-term stability of the moisture-proof effect.

[0031] Reference Figure 2 and Figure 3 The housing 2 has multiple heat dissipation holes 5, and each of the heat dissipation holes 5 is provided with a moisture-proof component 6. In this embodiment, there are six heat dissipation holes 5, four of which are located on the side walls around the housing 2, and the other two are located on the side of the housing 2 away from the mounting base plate 1. Each moisture-proof component 6 includes a filter screen 61, a sealing mesh 62, and a desiccant 63 for absorbing moisture. In this embodiment, the desiccant 63 is a molecular sieve desiccant 63. Each sealing mesh 62 is fixedly installed by welding on the side of the heat dissipation hole 5 near the inside of the housing 2, and each filter screen 61 is detachably installed on the side of the heat dissipation hole 5 away from the inside of the housing 2. The filter screen 61 and the sealing mesh 62 in each heat dissipation hole 5 together with the inner wall of the heat dissipation hole 5 form a placement space 611, and each desiccant 63 is placed in the corresponding placement space 611.

[0032] In practical use, when the microelectronic components start working, they generate a certain amount of heat. This heat causes the temperature inside the housing 2 to gradually rise. At this time, the multiple heat dissipation holes 5 on the housing 2 begin to function. The four heat dissipation holes 5 on the four sides of the housing 2 and the two heat dissipation holes 5 on the side of the housing 2 away from the mounting base plate 1 can form an effective heat dissipation channel, allowing the heat to dissipate and preventing the internal temperature from being too high, affecting the accuracy of the balance or damaging the components. While dissipating heat, the moisture-proof component 6 inside the heat dissipation hole 5 is also working continuously. When external moisture tries to enter the inside of the housing 2 through the heat dissipation hole 5, it will first encounter the filter 61. The filter 61 can block dust and other impurities from entering, and also plays a certain role in blocking moisture. Then, the moisture will enter the placement space 611 formed by the filter 61, the sealing mesh 62 and the inner wall of the heat dissipation hole 5. At this time, the desiccant 63 in the placement space 611 will actively absorb this moisture and fix it in its own structure, thereby preventing moisture from further invading the inside of the housing 2 and causing damage to the microelectronic components.

[0033] Reference Figure 2 and Figure 3 Each of the filter screens 61 is fixedly connected to an annular sealing ring 7 that abuts against the inner wall of the heat dissipation hole 5 on the side facing the heat dissipation hole 5, and an annular groove 71 is provided on the outer wall of each of the sealing rings 7. In the embodiments of this application, two annular grooves 71 are provided on each of the sealing rings 7; each of the sealing rings 7 forms an interference fit with the inner wall of the heat dissipation hole 5, and a pull ring 8 is fixedly connected to the side of each filter screen 61 facing the outside of the heat dissipation hole 5.

[0034] In practical use, when the desiccant 63 in the moisture-proof component 6 needs to be replaced, since the filter screen 61 is provided with a pull ring 8 on the side facing the heat dissipation hole 5, the operator only needs to pull the pull ring 8 to remove the filter screen 61 from the heat dissipation hole 5, thus facilitating the replacement of the desiccant 63 in the placement space 611. After replacement, the operator needs to reinstall the filter screen 61 into the heat dissipation hole 5. At this time, the sealing ring 7 on the inner side of the filter screen 61 will form an abutment fit with the inner wall of the heat dissipation hole 5, and the annular groove 71 on the outer wall of the sealing ring 7 can form an interference fit with the inner wall of the heat dissipation hole 5, further enhancing the sealing performance of the moisture-proof component 6 and ensuring the continuity of the moisture-proof effect.

[0035] The implementation principle of this application embodiment is as follows: a preliminary seal is formed by embedding the sealing gasket 3 between the cover 2 and the mounting base plate 1 into the groove 11, and the sealing gasket 3 is compressed and filled by pressing the fixing bolt 211 and the anti-slip pad 4. At the same time, the sealing auxiliary part 22 on the cover 2 and the groove 11 are embedded to form a double moisture barrier. In addition, a moisture-proof component 6 with replaceable desiccant 63 is provided in the heat dissipation hole 5. The filter screen 61 blocks dust, the desiccant 63 absorbs moisture, and the sealing ring 7 on the filter screen 61 forms an interference fit with the heat dissipation hole 5 to maintain the sealing of the hole. Thus, while effectively dissipating the heat of the microelectronic components, it achieves all-round moisture protection, improves the reliability of the equipment and the convenience of maintenance.

[0036] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A moisture-proof and sealing structure for a micro-balance microelectronic component, characterized in that: The device includes a mounting base plate (1) for mounting microelectronic components and a cover (2) covering the microelectronic components. A sealing gasket (3) is provided between the cover (2) and the mounting base plate (1). Multiple fixing plates (21) are provided on the outer wall of the cover (2), and each fixing plate (21) is provided with a fixing bolt (211). Multiple threaded holes (12) are provided on the mounting base plate (1) corresponding to the number and position of the fixing bolts (211). Each fixing bolt (211) passes through the fixing plate (21) and forms a threaded engagement with the corresponding threaded hole (12).

2. The moisture-proof and sealing structure of the microelectronic component of an ultra-micro balance according to claim 1, characterized in that: The mounting base plate (1) has a groove (11) for placing the sealing gasket (3).

3. The moisture-proof and sealing structure of the microelectronic component of an ultra-micro balance according to claim 2, characterized in that: The cover (2) is provided with a sealing auxiliary part (22) on the side near the mounting base plate (1), and the sealing auxiliary part (22) and the groove (11) are fitted together.

4. The moisture-proof and sealing structure of the microelectronic component of an ultra-micro balance according to claim 1, characterized in that: A washer (4) is provided between any of the fixing bolts (211) and the fixing plate (21), and the outer surface of any of the washer (4) is provided with anti-slip teeth (41).

5. The moisture-proof and sealing structure of the microelectronic component of an ultra-micro balance according to claim 1, characterized in that: The cover (2) has multiple heat dissipation holes (5), and a moisture-proof component (6) is provided in any one of the heat dissipation holes (5).

6. The moisture-proof and sealing structure of the microelectronic component of an ultra-micro balance according to claim 5, characterized in that: Each of the moisture-proof components (6) includes a filter screen (61), a sealing mesh (62), and a desiccant (63) for adsorbing moisture. The filter screen (61) and the sealing mesh (62) are arranged with the inner wall of the heat dissipation hole (5) to form a placement space (611), and the desiccant (63) is placed in the placement space (611).

7. The moisture-proof and sealing structure of an ultra-micro balance microelectronic component according to claim 6, characterized in that: Each of the filter screens (61) is provided with a sealing ring (7) that abuts against the inner wall of the heat dissipation hole (5) on the side facing the heat dissipation hole (5), and each of the filter screens (61) is provided with a pull ring (8) on the side facing the outside of the heat dissipation hole (5).

8. The moisture-proof and sealing structure of an ultra-micro balance microelectronic component according to claim 7, characterized in that: An annular groove (71) is provided on the outer wall of any of the sealing rings (7), and any of the sealing rings (7) forms an interference fit with the inner wall of the heat dissipation hole (5).

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