A temperature rise testing device for a semiconductor module

Abstract

The utility model relates to the technical field of semiconductor, especially a kind of temperature rise testing device of semiconductor module, including base, the top of base is equipped with clamping assembly, the both ends of base are connected with telescopic link by pressure component, one end of telescopic link is equipped with temperature sensor and friction component, by adjusting the length and angle of telescopic link, change the temperature measuring point of temperature sensor, the temperature rise test of semiconductor module is more comprehensive, and after the outer telescopic link is stretched, the length and angle of telescopic link can be adjusted by the extension and fixed pipe rotation of telescopic plate, loosen after it can and by the friction force between the rubber ring and semiconductor module under the action of spring positioning temperature sensor, temperature measuring point can be more conveniently adjusted.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a temperature rise testing device for semiconductor modules. Background Technology

[0002] Power semiconductor modules such as IGBTs and MOSFETs generate heat and rise in temperature during operation, which can affect the operation of the chip or even burn it out. Therefore, it is necessary to perform temperature detection on the working semiconductor modules to test whether the temperature rise during operation is within acceptable limits.

[0003] A multi-point temperature measurement device for power semiconductor devices, with publication number CN220454728U, includes a base, a fixing rod on the top of the base, a first threaded rod on the top of the fixing rod, a first clamping claw on the other side of the first threaded rod, a threaded hole on the side wall of the first clamping claw, and a first temperature sensor on the surface of the first clamping claw. Temperature is detected at various locations using the first, second, and third temperature sensors, and the temperature data is then transmitted to a data receiver and subsequently to the operator via a wireless transmitter. This achieves accurate multi-point temperature measurement. The device is designed to measure the power semiconductor device by placing it on a mounting plate and then adjusting the limiting blocks on the auxiliary rod to insert them into different limiting holes on the support rod.

[0004] The aforementioned existing technology allows for adjustable device height, is simple to operate, and is highly practical. However, the fixed positions of multiple temperature sensors make it inconvenient to adjust their positions to detect temperature rise on the surface potential of more semiconductor modules. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the inconvenience in adjusting the position of the temperature sensor, and to propose a temperature rise testing device for semiconductor modules.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Design a temperature rise testing device for a semiconductor module, including a base, a clamping assembly mounted on the top of the base, and telescopic rods connected to both sides of the base via pressure assemblies. A temperature sensor and a friction assembly located on the side of the semiconductor module are mounted on one end of the telescopic rods.

[0008] The pressure assembly includes circular holes on both sides of the base, with a ring inserted inside the circular hole and a spring located outside the ring. A pull rod is fixedly installed inside the ring, and an adjustment assembly is installed outside the spring.

[0009] Furthermore, the telescopic rod includes a fixed tube fixedly installed on the outer end of the pull rod, and a telescopic plate for mounting is inserted inside the fixed tube. The outer end of the telescopic plate is connected to a temperature sensor and a friction assembly.

[0010] The top of the fixed tube has a limiting groove, and the top of the telescopic plate is fixedly connected to a limiting post located in the limiting groove.

[0011] Furthermore, the friction assembly includes a hollow tube fixedly installed at one end of the telescopic rod, a rubber ring fixedly connected to the bottom of the hollow tube, and a temperature sensor fixedly connected to the inner wall of the hollow tube and the rubber ring.

[0012] Furthermore, the adjusting assembly includes a sleeve threaded into a circular hole, and a pull rod is inserted into the inside of the sleeve.

[0013] Furthermore, the clamping assembly includes a guide groove formed on the top of the base, and a pair of clamping plates for clamping a semiconductor module are slidably mounted inside the guide groove via a drive assembly, with rubber pads fixedly mounted near the proximal ends of the pair of clamping plates.

[0014] Furthermore, the drive assembly includes a bidirectional screw that is rotatably mounted in a guide groove, with a pair of clamping plates threaded onto the two outer walls of the bidirectional screw with opposite thread directions, and a crank handle fixedly connected to one end of the bidirectional screw.

[0015] The temperature rise testing device for a semiconductor module proposed in this utility model has the following advantages: by adjusting the length and angle of the telescopic rod, the temperature measurement point of the temperature sensor can be changed, making the temperature rise test of the semiconductor module more comprehensive. Moreover, after pulling the telescopic rod outward, the length and angle of the telescopic rod can be adjusted by the extension and retraction of the telescopic plate and the rotation of the fixed tube. After releasing it, the temperature sensor can be positioned by the friction between the rubber ring and the semiconductor module under the action of the spring, which makes it easier to adjust the temperature measurement point. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the semiconductor module installation according to this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of this utility model;

[0018] Figure 3 This is an exploded view of the pressure component of this utility model;

[0019] Figure 4 This is a cross-sectional structural diagram of the pressure component of this utility model.

[0020] In the diagram: 1. Base; 2. Clamping assembly; 21. Guide groove; 22. Clamping plate; 23. Rubber pad; 3. Pressure assembly; 31. Circular hole; 32. Circular ring; 33. Spring; 34. Pull rod; 4. Telescopic rod; 41. Fixing tube; 42. Telescopic plate; 43. Limiting groove; 44. Limiting post; 5. Temperature sensor; 6. Friction assembly; 61. Hollow tube; 62. Rubber ring; 7. Adjustment assembly; 71. Sleeve; 8. Drive assembly; 81. Bidirectional screw; 82. Crank handle; 9. Semiconductor module. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-4 As an embodiment of this utility model, a temperature rise testing device for a semiconductor module is disclosed, including a base 1, a clamping assembly 2 installed on the top of the base 1, and telescopic rods 4 connected to both sides of the base 1 by pressure assemblies 3. A temperature sensor 5 and a friction assembly 6 located on the side of the semiconductor module 9 are installed at one end of the telescopic rods 4. Preferably, two sets of pressure assemblies 3 of the same number are respectively arranged on both sides of the base 1.

[0023] The pressure component 3 includes circular holes 31 on both sides of the base 1. A circular ring 32 and a spring 33 located outside the circular ring 32 are inserted into the circular holes 31. A pull rod 34 is fixedly installed inside the circular ring 32. An adjustment component 7 is installed on the outside of the spring 33.

[0024] After pulling out several telescopic rods 4, the semiconductor module 9 is clamped to the top of the base 1 by the clamping assembly 2. Then, by lengthening and shortening the telescopic rods 4 and rotating the pull rod 34, the temperature sensor 5 and the friction assembly 6 are moved to different positions on both sides of the semiconductor module 9. Then, the telescopic rods 4 are released, causing the ring 32 to move closer under the pressure of the spring 33. The telescopic rods 4 drive the temperature sensor 5 and the friction assembly 6 to press on different positions on both sides of the semiconductor module 9. The spring 33 transmits pressure to the friction assembly 6 through the ring 32, the pull rod 34 and the telescopic rods 4, so that the friction between the friction assembly 6 and the semiconductor module 9 is used to position the temperature sensor 5 in the front-back and up-down directions. The temperature sensor 5 detects the temperature at different positions on both sides of the semiconductor module 9, and the temperature rise data of the semiconductor module 9 is measured by comparing it with the ambient temperature.

[0025] In some embodiments, the telescopic rod 4 includes a fixed tube 41 fixedly installed on the outer end of the pull rod 34. A telescopic plate 42 for mounting is inserted into the inside of the fixed tube 41. The outer end of the telescopic plate 42 is connected to a temperature sensor 5 and a friction assembly 6. Preferably, the outer section of the fixed tube 41 has an insertion hole, and the pull rod 34 is fixedly installed in the insertion hole.

[0026] The top of the fixed tube 41 is provided with a limiting groove 43, and the top of the telescopic plate 42 is fixedly connected with a limiting post 44 located in the limiting groove 43. Preferably, the top of the telescopic plate 42 is provided with a threaded hole, and the limiting post 44 is threadedly connected inside the threaded hole.

[0027] The telescopic plate 42 can be pulled out and inserted into the fixed tube 41 to increase or decrease the length of the telescopic rod 4, and the telescopic plate 42 can be prevented from detaching from the fixed tube 41 by the limiting post 44 cooperating with the limiting groove 43.

[0028] Specifically, the friction assembly 6 includes a hollow tube 61 fixedly installed at one end of the telescopic rod 4, a rubber ring 62 fixedly connected to the bottom of the hollow tube 61, and a temperature sensor 5 fixedly connected to the inner wall of the hollow tube 61 and the rubber ring 62.

[0029] Spring 33 transmits pressure to hollow tube 61 through ring 32, pull rod 34 and telescopic rod 4, thereby pressing temperature sensor 5 and rubber ring 62 onto semiconductor module 9, increasing static friction between rubber ring 62 and semiconductor module 9. Static friction positions rubber ring 62 and hollow tube 61, preventing them from moving back and forth or up and down, thus pressing temperature sensor 5 onto semiconductor module 9 and preventing it from sliding on semiconductor module 9.

[0030] It should be noted that the adjusting component 7 includes a sleeve 71 threaded into the round hole 31, and a pull rod 34 is inserted into the inside of the sleeve 71. Preferably, the outer end of the sleeve 71 is provided with a plurality of hexagonal holes for inserting a hexagonal wrench.

[0031] By rotating the sleeve 71 to move it left and right within the circular hole 31, the compression length of the spring 33, which is clamped between the ring 32 and the sleeve 71, is changed when the temperature sensor 5 is pressed against the surface of the semiconductor module 9. This adjusts the pressure transmitted by the spring 33 to the hollow tube 61 through the ring 32, the pull rod 34, and the telescopic rod 4, adapting to semiconductor modules 9 of different thicknesses while maintaining the static friction between the rubber ring 62 and the semiconductor module 9.

[0032] Furthermore, the clamping assembly 2 includes a guide groove 21 formed on the top of the base 1. A pair of clamping plates 22 for clamping semiconductor modules are slidably installed inside the guide groove 21 via the drive assembly 8. Rubber pads 23 are fixedly installed near the proximal ends of the pair of clamping plates 22.

[0033] The drive assembly 8 drives the two clamping plates 22 to approach and clamp the semiconductor module 9, and the rubber pad 23 increases the static friction between the semiconductor module 9 and the two clamping plates 22, thereby preventing the semiconductor module 9 from moving left and right, up and down and rotating.

[0034] Furthermore, the drive assembly 8 includes a bidirectional screw 81 rotatably mounted in the guide groove 21. A pair of clamping plates 22 are threadedly connected to the two outer walls of the bidirectional screw 81 with opposite thread directions. A crank handle 82 is fixedly connected to one end of the bidirectional screw 81. Preferably, both ends of the bidirectional screw 81 pass through and are rotatably connected to the base 1.

[0035] By rotating the bidirectional screw 81 with the crank handle 82, the two clamping plates 22 are driven to approach and clamp the semiconductor module 9 simultaneously.

[0036] Working method: During installation, the external telescopic rod 4 is pulled out and the two-way screw 81 is rotated by the crank 82, thereby driving the two clamping plates 22 to approach and clamp the semiconductor module 9 simultaneously. When the telescopic rod 4 is released, the spring 33 transmits pressure to the hollow tube 61 through the ring 32, the pull rod 34 and the telescopic rod 4, thereby pressing the temperature sensor 5 and the rubber ring 62 onto the semiconductor module 9. The temperature of the semiconductor module 9 is detected by the temperature sensor 5.

[0037] When adjusting the temperature measuring point of the temperature sensor 5, first pull the telescopic rod 4 to detach the temperature sensor 5 from the semiconductor module 9. Then, by rotating the fixed tube 41 and extending the telescopic plate 42, the length and angle of the telescopic rod 4 can be adjusted so that the temperature sensor 5 is located at different positions on both sides of the semiconductor module 9. Then, release the telescopic rod 4 so that the hollow tube 61 presses the temperature sensor 5 and the rubber ring 62 onto the semiconductor module 9 under the action of the spring 33.

[0038] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A temperature rise testing device for a semiconductor module, comprising a base (1), characterized in that: The base (1) is equipped with a clamping assembly (2) on its top. The two sides of the base (1) are connected to telescopic rods (4) via pressure assemblies (3). One end of the telescopic rods (4) is equipped with a temperature sensor (5) and a friction assembly (6) located on the side of the semiconductor module (9). The pressure component (3) includes round holes (31) on both sides of the base (1), a ring (32) and a spring (33) located outside the ring (32) are inserted into the round holes (31), a pull rod (34) is fixedly installed inside the ring (32), and an adjustment component (7) is installed outside the spring (33).

2. The temperature rise testing device for a semiconductor module according to claim 1, characterized in that: The telescopic rod (4) includes a fixed tube (41) fixedly installed on the outer end of the pull rod (34), and a telescopic plate (42) for installing is inserted inside the fixed tube (41). The outer end of the telescopic plate (42) is connected to a temperature sensor (5) and a friction assembly (6). The top of the fixed tube (41) is provided with a limiting groove (43), and the top of the telescopic plate (42) is fixedly connected with a limiting post (44) located in the limiting groove (43).

3. The temperature rise testing device for a semiconductor module according to claim 1, characterized in that: The friction assembly (6) includes a hollow tube (61) fixedly installed at one end of the telescopic rod (4), a rubber ring (62) fixedly connected to the bottom of the hollow tube (61), and a temperature sensor (5) fixedly connected to the inner wall of the hollow tube (61) and the rubber ring (62).

4. The temperature rise testing device for a semiconductor module according to claim 1, characterized in that: The adjusting assembly (7) includes a sleeve (71) threaded into a round hole (31), and a pull rod (34) is inserted into the inside of the sleeve (71).

5. The temperature rise testing device for a semiconductor module according to claim 1, characterized in that: The clamping assembly (2) includes a guide groove (21) formed on the top of the base (1). Inside the guide groove (21), a pair of clamping plates (22) for clamping a semiconductor module (9) are slidably mounted via a drive assembly (8). Rubber pads (23) are fixedly mounted on the near ends of the pair of clamping plates (22).

6. The temperature rise testing device for a semiconductor module according to claim 5, characterized in that: The drive assembly (8) includes a bidirectional screw (81) rotatably mounted in a guide groove (21). A pair of clamping plates (22) are threaded onto the two outer walls of the bidirectional screw (81) with opposite thread directions. A crank handle (82) is fixedly connected to one end of the bidirectional screw (81).

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