Optical fiber alignment device for chip testing and chip testing device

Abstract

The application relates to an optical fiber alignment device for chip testing and a chip testing device, comprising a supporting base, a moving mechanism assembly, an optical fiber array assembly and an optical fiber alignment avoidance camera arranged on the supporting base; the moving mechanism assembly comprises a first moving mechanism and a second moving mechanism, the first moving mechanism is arranged on the supporting base, the second moving mechanism is arranged on the first moving mechanism, and the first moving mechanism can drive the second moving mechanism to move in a first axial direction, a second axial direction and a third axial direction; the optical fiber array assembly is arranged on the second moving mechanism, the optical fiber alignment avoidance camera is arranged on one side of the moving mechanism assembly, and the first moving mechanism can drive the optical fiber array assembly to move so that the optical fiber array assembly is aligned with a groove; the technical scheme can avoid collision between the optical fiber array assembly and the groove during chip testing, and improves the alignment accuracy of optical fibers in the optical fiber array assembly and waveguide light ports of an optical chip.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to an optical fiber alignment device and a chip testing apparatus for chip testing. Background Technology

[0002] In the semiconductor manufacturing field, especially in the research and development and production of optoelectronic integrated chips, wafer testing is a crucial step in ensuring chip performance and quality. In this step, achieving high-precision alignment between the optical fiber and the waveguide port on the optical chip is essential, as the alignment accuracy directly affects optical coupling efficiency and the accuracy of the final test results. However, existing optical testing technologies suffer from low alignment accuracy between the optical fiber and the waveguide port on the optical chip, directly impacting the testing accuracy and production efficiency. Utility Model Content

[0003] To address the problems of existing technologies, this application provides a technical solution for an optical fiber alignment device and a chip testing device for chip testing. Specifically, this application utilizes a moving mechanism assembly, an optical fiber array assembly, and an optical fiber alignment and avoidance camera on a support base. The optical fiber alignment and avoidance camera can detect the position of the groove in the chuck structure carrying the chip under test. Then, a first moving mechanism drives a second moving mechanism to move along a first, second, and third axis, achieving coarse alignment between the optical fiber array assembly and the groove in the chuck structure. Furthermore, the first and second moving mechanisms drive the optical fiber array assembly to perform helical movement, thereby enabling optical coupling alignment between the optical fiber array assembly and the waveguide port of the chip under test. This technical solution avoids collisions between the optical fiber array assembly and the groove during chip testing, improving the accuracy of the alignment between the optical fiber in the optical fiber array assembly and the waveguide port of the optical chip.

[0004] This application provides a fiber optic alignment device for chip testing, including a support base and a moving mechanism assembly, a fiber optic array assembly, and a fiber optic alignment and avoidance camera disposed on the support base. The moving mechanism assembly includes a first moving mechanism and a second moving mechanism. The first moving mechanism is disposed on the support base, and the second moving mechanism is disposed on the first moving mechanism. The first moving mechanism can drive the second moving mechanism to move in a first axis, a second axis, and a third axis. The first axis, the second axis, and the third axis are perpendicular to each other. The second moving mechanism is equipped with the fiber array assembly, and the fiber alignment and avoidance camera is disposed on one side of the moving mechanism assembly. The fiber alignment and avoidance camera can detect the position of the groove in the chuck structure carrying the chip under test. The first moving mechanism can drive the fiber array assembly to move in a spiral motion so that the fiber array assembly is aligned with the groove.

[0005] Furthermore, the first moving mechanism includes a first axial moving module, a second axial moving module, and a third axial moving module; The first axial moving module is disposed on the support base, the second axial moving module is disposed on the first axial moving module, and the third axial moving module is disposed on the second axial moving module. The first axial moving module, the second axial moving module, and the third axial moving module are connected by transmission.

[0006] Furthermore, the second moving mechanism includes a swing moving module and a piezoelectric moving module; The swinging moving module is disposed on the third axial moving module and located on one side of the third axial moving module. The piezoelectric moving module is disposed on the swinging moving module, and the swinging moving module and the piezoelectric moving module are connected by a drive.

[0007] Furthermore, the swinging movement module includes a first swinging module and a second swinging module; The second swing module is disposed on the first swing module, and the piezoelectric moving module is disposed on the second swing module.

[0008] Furthermore, the fiber array assembly includes a fiber array, which includes a fiber carrier and a plurality of optical fibers disposed on the fiber carrier. The plurality of optical fibers are arranged along the length direction of the fiber carrier, and the optical fiber ports corresponding to each of the plurality of optical fibers are distributed in a straight line.

[0009] Furthermore, the fiber array assembly also includes an optical power meter, which is mounted on the fiber carrier.

[0010] Furthermore, it also includes a capacitive sensor, which is disposed on the second moving mechanism and moves synchronously with the fiber optic array assembly.

[0011] Furthermore, the chuck structure includes a plurality of parallel grooves, which are spaced apart.

[0012] Furthermore, the trench includes an optical port docking port and a receiving groove, the receiving groove being disposed on one side facing the second moving mechanism, and the optical port docking port being positioned opposite the optical port of the chip under test.

[0013] This application also provides a chip testing device, which includes a chuck structure and an optical fiber alignment device as described above, wherein the chuck structure is disposed on the upper side of the optical fiber alignment device.

[0014] Implementing this application will have the following beneficial effects: This application utilizes a moving mechanism assembly, a fiber optic array assembly, and a fiber optic alignment and avoidance camera mounted on a support base. The fiber optic alignment and avoidance camera detects the position of the groove in the chuck structure carrying the chip under test. A first moving mechanism then drives a second moving mechanism to move along a first, second, and third axis, achieving coarse alignment between the fiber optic array assembly and the groove in the chuck structure. The first and second moving mechanisms then drive the fiber optic array assembly in a helical motion, enabling optical coupling alignment between the fiber optic array assembly and the waveguide port of the chip under test. This technical solution avoids collisions between the fiber optic array assembly and the groove during chip testing, improving the accuracy of alignment between the fiber optics in the fiber optic array assembly and the waveguide port of the chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a chip testing device provided in an embodiment of this application; Figure 2 A schematic diagram of the structure of an optical fiber alignment device for chip testing provided in an embodiment of this application; Figure 3 A schematic diagram of the structure of an optical fiber alignment device for chip testing provided in an embodiment of this application from another angle; Figure 4 This is a schematic diagram of the structure of the fiber optic array assembly and the capacitive sensor provided in the embodiments of this application; Figure 5 A schematic diagram of a fiber optic alignment device having two fiber optic array components and two fiber optic alignment and avoidance cameras provided in an embodiment of this application. Figure 6 A cross-sectional view of the chuck structure provided in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the fiber optic array provided in the embodiments of this application; In the figure, the corresponding reference numerals are as follows: 11-first moving mechanism; 111-first axial moving module; 112-second axial moving module; 113-third axial moving module; 12-second moving mechanism; 121-swinging moving module; 1211-first swinging module; 1212-second swinging module; 122-piezoelectric moving module; 2-fiber array assembly; 21-fiber array; 211-fiber carrier; 212-fiber port; 3-fiber alignment and avoidance camera; 4-chuck structure; 41-groove; 411-optical port docking port; 412-accommodating slot; 5-capacitive sensor. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] It should be noted that, in this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0019] Hereinafter, embodiments will be described with reference to the accompanying drawings, which are not intended to limit the disclosure described in the claims.

[0020] Please see Figures 1-7 The following is combined with Figures 1-7 This application provides a detailed description of an optical fiber alignment device and a chip testing device for chip testing, based on embodiments of the present application.

[0021] This application provides an optical fiber alignment device and a chip testing device for chip testing, such as... Figures 1-7As shown, specifically, the fiber optic alignment device for chip testing includes a support base and a moving mechanism assembly, a fiber optic array assembly 2, and a fiber optic alignment and avoidance camera 3, all mounted on the support base. The moving mechanism assembly includes a first moving mechanism 11 and a second moving mechanism 12. The first moving mechanism 11 is mounted on the support base, and the second moving mechanism 12 is mounted on the first moving mechanism 11. The first moving mechanism 11 can drive the second moving mechanism 12 to move along a first axis, a second axis, and a third axis, which are mutually perpendicular. The second moving mechanism 12 is equipped with a fiber optic array assembly. 2. The fiber optic alignment and avoidance camera 3 can detect the position of the groove 41 in the chuck structure 4 carrying the chip under test. The first moving mechanism 11 can drive the fiber optic array assembly 2 to move so that the fiber optic array assembly 2 is aligned with the groove 41, avoiding collision between the fiber optic array assembly 2 and the groove 41 during the optical coupling process with the chip under test, which would affect the service life of the fiber optic array assembly 2. At the same time, through the coordinated cooperation of the first moving mechanism 11 and the second moving mechanism 12, the fiber optic array assembly 2 can be driven to perform a spiral high-precision movement, thereby realizing the alignment and coupling of the fiber optic array assembly 2 with the waveguide optical port of the chip under test.

[0022] Specifically, the fiber optic alignment and avoidance camera 3 can be fixedly mounted on one side of the moving mechanism assembly.

[0023] In this embodiment, the chuck structure 4 is used to hold the chip under test. That is, the chip under test can be placed on the chuck structure 4 so that optical testing can be performed on the chip under test. In practical applications, the side of the chip under test close to the chuck structure 4 has a waveguide port for optical testing, and the waveguide port matches the groove 41. Then, the fiber array assembly 2 can be optically coupled to the waveguide port of the chip under test through the groove 41 to realize optical testing of the chip under test.

[0024] In one specific embodiment, the fiber optic alignment and avoidance camera 3 can detect the position of the groove 41 in the chuck structure 4. The first moving mechanism 11 and the second moving mechanism 12 are connected by transmission. Both the first moving mechanism 11 and the second moving mechanism 12 are electrically connected to the control mechanism. The control mechanism is used to drive the first moving mechanism 11 and the second moving mechanism 12 to move. After the fiber optic alignment and avoidance camera 3 determines the position of the groove 41 in the chuck structure 4, the control mechanism can drive the first moving mechanism 11 to adjust the position of the fiber optic array assembly 2 so that the fiber optic array assembly 2 is aligned with the groove 41. This can avoid collision between the fiber optic array assembly 2 and the groove 41 during chip testing. Through the coordinated cooperation of the first moving mechanism 11 and the second moving mechanism 12, the fiber optic array assembly 2 is driven to make a precise spiral movement, so that the fiber optic array assembly 2 is optically coupled and aligned with the waveguide port of the optical chip, thereby improving the alignment accuracy of the fiber in the fiber optic array assembly 2 with the waveguide port of the optical chip.

[0025] In practical applications, the first moving mechanism 11 is used to position the fiber array assembly 2. The first axis can be the X-axis, the second axis can be the Y-axis, and the third axis can be the Z-axis. Since the second moving mechanism 12 is set on the first moving mechanism 11 and the fiber array assembly 2 is set on the second moving mechanism 12, the first moving mechanism 11 and the second moving mechanism 12 are connected by transmission. Thus, the first moving mechanism 11 can drive the second moving mechanism 12 and the fiber array assembly 2 to move, thereby moving the fiber array assembly 2 to below the trench 41, thereby achieving coarse positioning of the fiber array assembly 2. The second moving mechanism 12 is used to adjust the deflection angle and attitude of the fiber array assembly 2. Specifically, the second moving mechanism 12, in conjunction with the first moving mechanism 11, can drive the fiber array assembly 2 to move in a spiral motion, thereby enabling the fiber array assembly 2 to be aligned and coupled with the waveguide port of the optical chip through the trench 41.

[0026] In one alternative implementation, such as Figure 6 As shown, the chuck structure 4 includes a plurality of parallel grooves 41, which are spaced apart. In one specific embodiment, the groove 41 includes an optical port docking port 411 and a receiving groove 412. The receiving groove 412 is disposed on the side facing the second moving mechanism 12. The optical port docking port 411 is aligned with the optical port of the chip under test. Under the coordinated drive of the second moving mechanism 12 and the first moving mechanism 11, the fiber array assembly 2 can move spirally up and down in the receiving groove 412, thereby aligning and coupling with the waveguide optical port of the chip under test through the optical port docking port 411.

[0027] It should be noted that the fiber optic signal emitted by the fiber optic array assembly 2 can be optically coupled to the chip under test through the optical port 411.

[0028] Specifically, multiple chips under test can be placed on the chuck structure 4. The waveguide optical ports corresponding to each of the multiple chips under test can be aligned with different positions of different grooves 41. Thus, multiple chips under test can be optically tested simultaneously through the fiber array assembly 2, thereby improving testing efficiency.

[0029] In one alternative implementation, such as Figure 2 and Figure 3 As shown, the first moving mechanism 11 includes a first axial moving module 111, a second axial moving module 112, and a third axial moving module 113; wherein, the first axial moving module 111 is disposed on the support base, the second axial moving module 112 is disposed on the first axial moving module 111, and the third axial moving module 113 is disposed on the second axial moving module 112, and the first axial moving module 111, the second axial moving module 112, and the third axial moving module 113 are connected by transmission.

[0030] In this embodiment, the first axial movement module 111 is used to drive the fiber array assembly 2 to move in the X-axis direction, the second axial movement module 112 can drive the fiber array assembly 2 to move in the Y-axis direction, and the third axial movement module 113 can drive the fiber array assembly 2 to move in the Z-axis direction. Thus, the position of the fiber array assembly 2 can be moved by the first axial movement module 111, the second axial movement module 112, and the third axial movement module 113 so that the fiber array assembly 2 is aligned with the optical port docking port 411 in the trench 41.

[0031] In one alternative implementation, such as Figure 3 As shown, the second moving mechanism 12 includes a swing moving module 121 and a piezoelectric moving module 122; wherein, the swing moving module 121 is disposed on the third axial moving module 113 and located on one side of the third axial moving module 113, and the piezoelectric moving module 122 is disposed on the swing moving module 121, and the swing moving module 121 and the piezoelectric moving module 122 are connected by a drive.

[0032] In this embodiment, the swinging motion module 121 is used to adjust the deflection angle of the fiber array assembly 2. Specifically, the swinging motion module 121 can drive the fiber array assembly 2 to swing, thereby adjusting the deflection angle of the fiber array assembly 2. The piezoelectric motion module 122 is used to drive the fiber array assembly 2 to move precisely along the X-axis and Y-axis. Specifically, with the coordinated cooperation of the first axial motion module 111, the second axial motion module 112, the third axial motion module 113, the swinging motion module 121, and the piezoelectric motion module 122, the fiber array assembly 2 can be aligned with the optical port docking port 411 in the trench 41, thereby improving the alignment accuracy of the optical fiber in the fiber array assembly 2 with the waveguide optical port of the chip under test.

[0033] In one specific implementation, such as Figure 3 As shown, the swinging moving module 121 includes a first swinging module 1211 and a second swinging module 1212; wherein, the second swinging module 1212 is disposed on the first swinging module 1211, and the piezoelectric moving module 122 is disposed on the second swinging module 1212.

[0034] Specifically, the first swing module 1211 is used to drive the fiber array assembly 2 to swing left and right, and the second swing module 1212 is used to drive the fiber array assembly 2 to swing back and forth. It should be noted that the swing patterns of the first swing module 1211 and the second swing module 1212 are both based on... Figure 3 The angles shown are based on a description.

[0035] In one alternative implementation, such as Figure 7As shown, the fiber array assembly 2 includes a fiber array 21, which includes a fiber carrier 211 and a plurality of optical fibers disposed on the fiber carrier 211. The plurality of optical fibers are arranged along the length direction of the fiber carrier 211, and the optical fiber ports 212 corresponding to each of the plurality of optical fibers are distributed in a straight line.

[0036] Specifically, the fiber array 21 is used to perform optical testing on the chip under test. By adjusting the fiber array component 2, multiple fiber ports 212 in the fiber array 21 can be aligned with the optical port docking port 411 in the trench 41, thereby improving the accuracy and precision of the optical test.

[0037] In one alternative implementation, such as Figure 2 As shown, the fiber optic alignment device also includes a capacitive sensor 5, which is mounted on the second moving mechanism 12. The capacitive sensor 5 moves synchronously with the fiber optic array assembly 2. In a specific embodiment, the fiber optic array assembly 2 also includes an optical power meter, which is mounted on the fiber optic carrier 211.

[0038] Specifically, the capacitive sensor 5 is used to detect the amount of movement of the fiber port 212 in the fiber array 21 relative to the waveguide optical port, and the optical power meter is used to record the output or input optical power information of the fiber array 21 at different positions. Then, the control mechanism can determine the position information corresponding to the highest optical power based on the amount of movement of the fiber array 21 and the optical power information corresponding to the different positions, so as to move the fiber array 21 to the position corresponding to the highest optical power point, thereby improving the accuracy of optical testing.

[0039] In an optional embodiment, the fiber optic alignment device includes multiple sets of first moving mechanisms 11, multiple sets of second moving mechanisms 12, multiple sets of fiber optic array assemblies 2, multiple sets of fiber optic alignment and avoidance cameras 3, and multiple sets of capacitive sensors 5. The multiple sets of first moving mechanisms 11, multiple sets of second moving mechanisms 12, multiple sets of fiber optic array assemblies 2, multiple sets of fiber optic alignment and avoidance cameras 3, and multiple sets of capacitive sensors 5 are identical in structure. Furthermore, by setting multiple sets of first moving mechanisms 11, multiple sets of second moving mechanisms 12, multiple sets of fiber optic array assemblies 2, multiple sets of fiber optic alignment and avoidance cameras 3, and multiple sets of capacitive sensors 5, multiple sets of chips under test can be detected simultaneously, thereby improving testing efficiency.

[0040] In one specific embodiment, such as Figure 4 As shown, the fiber optic alignment device includes two first moving mechanisms 11, two second moving mechanisms 12, two fiber optic array assemblies 2, two fiber optic alignment and avoidance cameras 3, and two capacitive sensors 5, which can simultaneously test two chips under test to improve testing efficiency.

[0041] This application also provides a chip testing device, which can be found in the following embodiments: Figure 1 As shown, the chip testing device includes a chuck structure 4 and an optical fiber alignment device. Since the chip testing device has the aforementioned optical fiber alignment device, it should also have the technical effects of the optical fiber alignment device. Therefore, the chip testing device in this embodiment should also have the same technical effects, which will not be elaborated here.

[0042] The above embodiments of this application have the following beneficial effects: This application utilizes a moving mechanism assembly, a fiber optic array assembly, and a fiber optic alignment and avoidance camera mounted on a support base. The fiber optic alignment and avoidance camera detects the position of the groove in the chuck structure carrying the chip under test. A first moving mechanism then drives a second moving mechanism to move along a first, second, and third axis, achieving coarse alignment between the fiber optic array assembly and the groove in the chuck structure. The first and second moving mechanisms then drive the fiber optic array assembly in a helical motion, enabling optical coupling alignment between the fiber optic array assembly and the waveguide port of the chip under test. This technical solution avoids collisions between the fiber optic array assembly and the groove during chip testing, improving the accuracy of alignment between the fiber optics in the fiber optic array assembly and the waveguide port of the chip.

[0043] The structure shown in this embodiment is only a partial structure related to the solution of this application and does not constitute a limitation on the device to which the solution of this application is applied. Specific devices may include more or fewer components than shown, or combinations of certain components, or arrangements of different components. It should be understood that the methods, apparatuses, etc., disclosed in this embodiment can be implemented in other ways.

[0044] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fiber optic alignment device for chip testing, characterized in that, It includes a support base and a moving mechanism assembly, a fiber array assembly (2), and a fiber alignment and avoidance camera (3) mounted on the support base; The moving mechanism assembly includes a first moving mechanism (11) and a second moving mechanism (12). The first moving mechanism (11) is disposed on the support base, and the second moving mechanism (12) is disposed on the first moving mechanism (11). The first moving mechanism (11) can drive the second moving mechanism (12) to move in a first axis, a second axis and a third axis. The first axis, the second axis and the third axis are perpendicular to each other. The second moving mechanism (12) is provided with the fiber array assembly (2), and the fiber alignment and avoidance camera (3) is disposed on one side of the moving mechanism assembly. The fiber alignment and avoidance camera (3) can detect the position of the groove (41) in the chuck structure (4) carrying the chip under test. The first moving mechanism (11) can drive the fiber array assembly (2) to move so that the fiber array assembly (2) is aligned with the groove (41).

2. The optical fiber alignment device according to claim 1, characterized in that, The first moving mechanism (11) includes a first axial moving module (111), a second axial moving module (112), and a third axial moving module (113); The first axial moving module (111) is disposed on the support base, the second axial moving module (112) is disposed on the first axial moving module (111), and the third axial moving module (113) is disposed on the second axial moving module (112). The first axial moving module (111), the second axial moving module (112), and the third axial moving module (113) are connected by transmission.

3. The optical fiber alignment device according to claim 2, characterized in that, The second moving mechanism (12) includes a swing moving module (121) and a piezoelectric moving module (122); The swinging moving module (121) is disposed on the third axial moving module (113) and located on one side of the third axial moving module (113). The piezoelectric moving module (122) is disposed on the swinging moving module (121). The swinging moving module (121) and the piezoelectric moving module (122) are connected by transmission.

4. The optical fiber alignment device according to claim 3, characterized in that, The swinging movement module (121) includes a first swinging module (1211) and a second swinging module (1212); The second swing module (1212) is disposed on the first swing module (1211), and the piezoelectric moving module (122) is disposed on the second swing module (1212).

5. The optical fiber alignment device according to claim 1, characterized in that, The fiber array assembly (2) includes a fiber array (21), which includes a fiber carrier (211) and a plurality of optical fibers disposed on the fiber carrier (211). The plurality of optical fibers are arranged along the length direction of the fiber carrier (211), and the optical fiber ports (212) corresponding to each of the plurality of optical fibers are distributed in a straight line.

6. The optical fiber alignment device according to claim 5, characterized in that, The fiber array assembly (2) also includes an optical power meter, which is mounted on the fiber carrier (211).

7. The optical fiber alignment device according to claim 1, characterized in that, It also includes a capacitive sensor (5), which is disposed on the second moving mechanism (12) and moves synchronously with the fiber array assembly (2).

8. The optical fiber alignment device according to claim 1, characterized in that, The chuck structure (4) includes a plurality of parallel grooves (41) spaced apart.

9. The optical fiber alignment device according to claim 8, characterized in that, The trench (41) includes an optical port docking port (411) and a receiving groove (412). The receiving groove (412) is disposed on the side facing the second moving mechanism (12), and the optical port docking port (411) is positioned opposite to the optical port of the chip under test.

10. A chip testing device, characterized in that, It includes a chuck structure (4) and an optical fiber alignment device as described in any one of claims 1 to 9, wherein the chuck structure (4) is disposed on the upper side of the optical fiber alignment device.

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