An aligning coupling mechanism, chip testing device

Abstract

The application discloses a kind of alignment coupling mechanism, chip testing device, alignment coupling mechanism includes: motion platform, including with the U-shaped structure of opening upward, the open end of U-shaped structure is used to install the chip to be measured, motion platform is used to drive the chip to be measured to move;Six-axis optical fiber alignment module is set in the accommodating cavity of U-shaped structure, for driving the optical fiber assembly on the six-axis optical fiber alignment module multidimensional movement, so that the optical fiber signal emitted by optical fiber assembly can be connected with the waveguide light port on the chip to be measured.Make it possible to carry out optical and electrical collaborative testing simultaneously, solve the problem of possible physical interference between the optical fiber adjustment mechanism and the space above the chip to be measured, also greatly save the space occupation of alignment coupling mechanism, ensure the feasibility and precision of optical alignment.

Description

Technical Field

[0001] This application relates to the technical field of silicon photonics chip testing, and in particular to a positioning coupling mechanism and a chip testing device. Background Technology

[0002] In the field of silicon photonics chip testing, especially for the increasingly important CPO (Co-Packaged Optics) chips, existing technologies can usually only perform single optical or electrical tests, and cannot simultaneously meet the stringent requirements of optical path coupling and electrical probe connection, i.e., to achieve high-precision optical and electrical co-testing. Therefore, it is urgent to solve the above problems. Utility Model Content

[0003] In view of the above-mentioned problems in the prior art, the purpose of this application is to solve the defect in the prior art that mobile devices cannot drive chips to perform photoelectric testing at the same time.

[0004] To address the aforementioned problems, this application provides a alignment coupling mechanism and a chip testing apparatus, which are applied in a chip testing apparatus. The alignment coupling mechanism includes: A motion platform includes a U-shaped structure with an upward opening, the open end of the U-shaped structure being used to mount a chip under test, and the motion platform being used to move the chip under test. A six-axis fiber optic alignment module is disposed in the cavity of the U-shaped structure. It is used to drive the fiber optic assembly disposed on the six-axis fiber optic alignment module to perform multi-dimensional movement so that the fiber optic signal emitted by the fiber optic assembly can be aligned with the waveguide port on the chip under test.

[0005] Preferably, the motion platform includes a first horizontal module, a rotation module, a vertical module, and a second horizontal module arranged sequentially from bottom to top. A non-zero angle is provided between the moving direction of the first horizontal module and the moving direction of the second horizontal module; The second horizontal module includes the U-shaped structure, and the bottom surface of the U-shaped structure is connected to the vertical module.

[0006] Preferably, the moving direction of the first horizontal module is perpendicular to the moving direction of the second horizontal module.

[0007] Preferably, the second horizontal module further includes a second slide rail, which is arranged in pairs on the upright arms on both sides of the opening end of the U-shaped structure. The extension direction of the slide rail is the same as the movement direction of the second horizontal module, so as to guide the movement of the chip under test.

[0008] Preferably, the alignment coupling mechanism further includes a support platform disposed on the second slide rail for adsorbing the chip under test.

[0009] Preferably, the support platform is a plate-shaped structure, and the support platform is provided with a plurality of vertically penetrating and sequentially spaced strip-shaped slots. The slots are used for the optical fiber signals emitted by the optical fiber assembly driven by the six-axis optical fiber alignment module to pass through, so as to align with the waveguide optical port on the chip under test.

[0010] Preferably, the support stage includes, from top to bottom, an adsorption layer, a cooling layer, and a heating layer, wherein the cooling layer and the heating layer are used for temperature control of the chip under test.

[0011] Preferably, the alignment coupling mechanism further includes a lower vision component, which is disposed on the support platform and can move synchronously with the support platform to provide feedback on the alignment status of the chip under test.

[0012] On the other hand, this application also discloses a chip testing apparatus for testing a chip under test, comprising: A pin card module is positioned above the chip under test. The pin card module includes a test pin card, which is used to dock with the contact points of the chip under test. The alignment coupling mechanism described in any of the above is disposed below the pin card module and is used to drive the chip under test to move in multiple dimensions so as to dock with the test pin card.

[0013] Preferably, the pin card module further includes an upper vision component, which is disposed on the side of the pin card module facing the chip under test, for acquiring contact point position information of the chip under test.

[0014] Based on the above technical solutions, the alignment coupling mechanism and chip testing device described in this application have the following beneficial effects: By integrating the motion platform for electrical testing and the six-axis fiber optic alignment module for optical testing into the same "alignment coupling mechanism," the rational spatial layout design not only solves the shortcomings of existing technologies that cannot simultaneously perform optical and electrical collaborative testing, but also saves the overall space occupied by the equipment. Secondly, by placing the six-axis fiber optic alignment module for optical testing alignment below the chip under test (DUT), and placing the DUT above the U-shaped structure, the potential physical interference between the fiber optic adjustment mechanism and the space above the DUT is resolved. This also significantly saves space occupied by the alignment coupling mechanism, making the entire testing device more compact. Simultaneously, this arrangement provides a clear and unobstructed motion path for the fiber optic components to approach and align with the waveguide port on the DUT from below, enabling smooth multi-dimensional motion and thus ensuring the feasibility and accuracy of optical alignment. Furthermore, by adopting a collaborative working mode of "electrical alignment first, then optical alignment," the motion platform combines wide-range and rapid positioning in electrical alignment with the high-precision movement of the six-axis fiber optic alignment module in optical alignment, significantly improving the efficiency and success rate of the entire optical and electrical collaborative testing. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of the chip testing device provided in the embodiments of this application.

[0017] Figure 2 This is a schematic diagram of the alignment coupling mechanism provided in the embodiments of this application from a first-view perspective.

[0018] Figure 3 This is a schematic diagram of the alignment coupling mechanism provided in the embodiments of this application from a second perspective.

[0019] Figure 4 This is a schematic diagram of the alignment coupling mechanism (without the support platform) provided in the embodiment of this application from a first-view perspective.

[0020] Figure 5 This is a schematic diagram of the alignment coupling mechanism (without the support platform) provided in the embodiment of this application from a second perspective.

[0021] Figure 6 This is a bottom view of the pin card module provided in the embodiment of this application.

[0022] Figure 7This is a schematic diagram of the overall structure of the support platform provided in the embodiments of this application.

[0023] Figure 8 This is a cross-sectional view of the support platform provided in the embodiment of this application in the first direction.

[0024] Figure 9 This is a cross-sectional view of the support platform provided in the embodiment of this application in the second direction.

[0025] Figure 10 yes Figure 9 A magnified view of section A in the image.

[0026] The reference numerals in the attached drawings are as follows: 100, chip testing device; 200, pin card module; 21, test pin card; 22, upper vision component; 300, alignment coupling mechanism; 31, motion platform; 311, first horizontal module; 3111, first slide rail; 3112, base; 312, rotating module; 313, vertical module; 314, second horizontal module; 3141, U-shaped structure; 3142, second slide rail; 32, six-axis fiber optic alignment module; 33, support platform; 331, through slot; 332, adsorption layer; 333, cooling layer; 3331, flow channel; 334, heating layer; 34, lower vision component; 400, chip under test; P, direction of fiber optic signal transmission. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0028] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0029] The purpose of silicon photonics chip testing is to verify the optoelectronic functions and performance of the chip through precise measurements, screen out products with defects in the manufacturing process to ensure product yield, and thus ensure the product quality and reliability of cutting-edge technologies such as CPO chips.

[0030] Therefore, as Figures 1-10 As shown in the embodiment of this application, a positioning coupling mechanism 300 is disclosed, which is applied in a chip testing device 100 to drive the chip under test 400 to move so as to perform electrical and optical performance testing on the chip under test 400.

[0031] The alignment coupling mechanism 300 includes: The motion platform 31 includes a U-shaped structure 3141 with an upward opening. The open end of the U-shaped structure 3141 is used to mount the chip under test 400, and the motion platform 31 is used to drive the chip under test 400 to move. The six-axis fiber alignment module 32 is set in the accommodating cavity of the U-shaped structure 3141 and is used to drive the fiber optic assembly set on the six-axis fiber alignment module to perform multi-dimensional movement so that the fiber optic signal emitted by the fiber optic assembly can be aligned with the waveguide optical port on the chip under test 400.

[0032] It is understood that the motion platform 31 is used to move the chip under test 400 to achieve the alignment required for electrical testing. Specifically, the motion platform 31 can drive the chip under test 400 to achieve one or more degrees of freedom of movement. The six-axis fiber optic alignment module 32 is set below the chip under test 400 so that it can drive the fiber optic assembly to make precise adjustments in multiple degrees of freedom in space, thereby achieving the alignment required for optical testing.

[0033] It is understandable that the six-axis fiber optic alignment module 32 is mounted on the motion platform 31, forming an integral unit with the motion platform 31 and moving synchronously with it. The motion platform 31 first moves the chip under test (DUT) 400 to the first target position, achieving the alignment required for the electrical testing of the DUT 400. Then, the six-axis fiber optic alignment module 32 drives the fiber optic assembly to the second target position, ensuring the alignment of the fiber optic signal emitted by the fiber optic assembly with the waveguide port on the DUT 400, achieving the alignment required for the optical testing of the DUT 400. Thus, the synchronous detection of the photoelectric performance of the DUT 400 is completed simultaneously. The specific fiber optic signal emission direction P can be seen... Figure 9 As shown.

[0034] It should be noted that the chip under test 400 can be a silicon photonic chip, and the upper surface of the silicon photonic chip is provided with pad positions for alignment and connection with electrical probes to realize the testing of the electrical performance of the silicon photonic chip; the lower surface of the silicon photonic chip is provided with a waveguide optical port, and the optical fiber signal emitted by the optical fiber assembly is aligned and coupled with the waveguide optical port of the silicon photonic chip to realize the testing of the optical performance of the silicon photonic chip.

[0035] Therefore, by integrating the motion platform 31 for electrical testing and the six-axis fiber optic alignment module 32 for optical testing into the same "alignment coupling mechanism 300", the reasonable spatial layout design not only solves the defect of the existing technology that cannot perform simultaneous optical and electrical testing, but also saves the overall space occupied by the equipment. Secondly, by placing the six-axis fiber optic alignment module 32 for optical testing alignment below the chip under test 400 and placing the chip under test 400 above the U-shaped structure 3141, the problem of potential physical interference between the fiber optic adjustment mechanism and the space above the chip under test 400 is solved, and the space occupied by the alignment coupling mechanism 300 is greatly saved, making the entire testing device more compact. At the same time, this arrangement also provides a clear and unobstructed motion path for the fiber optic assembly to approach and align with the waveguide port on the chip under test 400 from below, enabling smooth multi-dimensional motion and thus ensuring the feasibility and accuracy of optical alignment. Furthermore, by adopting a collaborative working mode of "electrical alignment first, then optical alignment", the motion platform 31 is used for large-scale and rapid positioning in electrical alignment and the six-axis fiber optic alignment module 32 is used for high-precision movement in optical alignment, which significantly improves the efficiency and success rate of the entire optical and electrical collaborative testing.

[0036] like Figures 2-5 As shown, the motion platform 31 includes a first horizontal module 311, a rotation module 312, a vertical module 313, and a second horizontal module 314 arranged sequentially from bottom to top. There is a non-zero included angle between the moving direction of the first horizontal module 311 and the moving direction of the second horizontal module 314. The second horizontal module 314 includes a U-shaped structure 3141, the bottom surface of which is connected to the vertical module 313.

[0037] Specifically, the moving direction of the first horizontal module 311 is perpendicular to the moving direction of the second horizontal module 314.

[0038] Therefore, in this embodiment, the first horizontal module 311 is used to drive the chip under test 400 to translate in the X-axis direction on the horizontal plane, the second horizontal module 314 is used to drive the chip under test 400 to translate in the Y-axis direction on the horizontal plane, the vertical module 313 is used to drive the chip under test 400 to translate in the Z-axis direction on the vertical plane, and the rotation module 312 is used to drive the chip under test 400 to rotate along its own axis.

[0039] It is understandable that the motion platform 31 consists of four independent motion units: a first horizontal module 311, a rotation module 312, a vertical module 313, and a second horizontal module 314, so as to realize the motion capability of the chip under test 400 in four degrees of freedom in space through a stacked design.

[0040] In this embodiment, since the second horizontal module 314 is located at the top, the second horizontal module 314 and the chip under test 400 can be moved in the X-axis direction, the Z-axis direction and rotated on their own axis by the first horizontal module 311, the vertical module 313 and the rotation module 312, respectively. Then, the second horizontal module 314 can move the chip under test 400 in the Y-axis direction.

[0041] In this embodiment of the application, the first horizontal module 311 includes a first slide rail 3111 and a base 3112. The base 3112 is disposed on the first slide rail 3111 so that it can move along the setting direction of the first slide rail 3111.

[0042] In this embodiment, the vertical module 313 can be a ball screw, a drive cylinder, or other similar device.

[0043] Therefore, by designing the motion platform 31 with the above-mentioned structure, the motion platform 31 can not only translate the chip under test 400 at any position in the X-axis and Y-axis directions, but also accurately correct the angular deviation of the chip under test 400 through the rotation module 312, thus ensuring the accuracy of the position docking required for electrical testing.

[0044] In a preferred embodiment, the second horizontal module 314 further includes a second slide rail 3142, which is arranged in pairs on the upright arms on both sides of the opening end of the U-shaped structure 3141. The extension direction of the slide rail 3142 is the same as the movement direction of the second horizontal module 314, so as to guide the movement of the chip under test 400.

[0045] Understandably, the second slide rail 3142 significantly restricts the degrees of freedom of the moving parts in the non-moving direction, ensuring that the chip under test 400 moves strictly along the preset straight line, eliminating deviations in the motion trajectory, and thus improving alignment accuracy. Furthermore, the second slide rail 3142 provides continuous and stable support, reducing vibration and jitter during movement, making it suitable for chip testing scenarios requiring high-precision alignment.

[0046] like Figures 2-3 As shown, the alignment coupling mechanism 300 also includes a support platform 33, which is disposed on the second slide rail 3142 for adsorbing the chip under test 400.

[0047] Understandably, by using "adsorption," the chip under test (DUT) 400 can be firmly fixed to the support stage 33, preventing displacement, warping, or ejection of the DUT 400 during rapid, high-acceleration multi-axis motion of the motion platform 31, thus ensuring the safety and repeatability of the testing process. Furthermore, the adsorption effect ensures that the DUT 400 adheres tightly to the flat surface of the support stage 33, thereby eliminating the possibility of warping.

[0048] It is understandable that by setting the carrier platform 33 on the second slide rail 3142, the motion platform 31 directly drives the carrier platform 33 through the second slide rail 3142, thereby moving the chip under test 400 on the carrier platform 33. This direct motion transmission method without intermediate transmission chains reduces motion delay and error accumulation, enabling the control commands of the motion platform 31 to be reflected more accurately and quickly at the position of the chip under test 400.

[0049] like Figures 7-10 As shown, the support platform 33 is a plate-shaped structure. The support platform 33 has multiple vertically penetrating and sequentially spaced strip-shaped slots 331. The slots 331 are used for the fiber optic signals emitted by the fiber optic assembly driven by the six-axis fiber optic alignment module 32 to pass through, so as to align with the waveguide optical port on the chip under test 400.

[0050] Understandably, the chip under test (DUT) 400 is attached to the upper surface of the support platform 33, while the six-axis fiber optic alignment module 32 is located below the support platform 33, within the accommodating cavity of the U-shaped structure 3141. Without the through slot 331, the fiber optic signal emitted by the fiber optic assembly would not be able to pass through the support platform 33 and reach the waveguide port below the DUT 400. Therefore, the through slot 331 provides the necessary physical channel for the fiber optic signal emitted from the fiber optic assembly from bottom to top to pass through the support platform 33 and ultimately connect with the waveguide port of the DUT 400. Thus, by setting the through slot 331, the spatial contradiction between "the support platform 33 needs to fix the chip" and "the fiber optic assembly needs to contact the bottom of the DUT 400" in the prior art is resolved, making the optical and electrical co-testing of the DUT 400 possible.

[0051] Understandably, the strip-shaped through-slots 331 provide initial guidance for the fiber optic assembly (or fiber array FA). The six-axis fiber alignment module 32 can first drive the fiber optic assembly to move under the corresponding through-slot 331, thereby greatly reducing the search range for subsequent precise alignment and avoiding large-scale blind searching, thus improving alignment efficiency. Then, the six-axis fiber alignment module 32 drives the fiber optic assembly to perform precise helical movement to achieve optical coupling between the fiber optic signal emitted by the fiber optic assembly and the waveguide optical port on the chip under test 400. Furthermore, the design of multiple through-slots 331 allows for simultaneous coupling testing of multiple waveguide optical ports on the chip under test 400, greatly improving testing efficiency.

[0052] like Figure 10 As shown, the support stage 33 includes an adsorption layer 332, a cooling layer 333 and a heating layer 334 from top to bottom. The cooling layer 333 and the heating layer 334 are used for temperature control of the chip 400 under test.

[0053] In this embodiment, the cooling layer 333 includes a flow channel 3331, which is disposed on the plate between adjacent through slots 331. The flow channel 3331 is used to introduce a cooling medium for cooling the chip 400 under test.

[0054] Understandably, the performance of the chip under test 400 is highly sensitive to temperature, and its actual operating temperature may be much higher or lower than room temperature. Therefore, by setting a heating layer 334 and a cooling layer 333 on the stage 33, the chip testing device 100 can accurately simulate the state of the chip under test 400 at various operating temperatures. In this way, only by conducting tests at simulated real operating temperatures can the obtained electrical and optical performance data truly reflect the performance of the chip under test 400 in practical applications, thus improving the validity of the data.

[0055] Furthermore, temperature changes cause thermal expansion and contraction of materials, resulting in minute deformations of the chip under test (DUT) 400 and the support stage 33. These minute deformations alter the relative position between the fiber optic signal and the waveguide port of the DUT 400, leading to decreased or unstable optical coupling efficiency. Therefore, precise temperature control can maintain the temperature at a constant set value, minimizing temperature fluctuations and ensuring the stability of optical alignment. This ensures that the physical state and optical performance of the DUT 400 are on a consistent benchmark in each chip test, thereby greatly improving the consistency and repeatability of tests under varying quantitative factors such as different batches and test results at different times.

[0056] Understandably, the integrated heating and cooling functions can quickly change the temperature of the chip under test 400 without the need for additional temperature control operations, enabling temperature cycling at a single workstation and greatly improving testing efficiency.

[0057] Understandably, with the heating layer 334 located at the bottom, heat is conducted upwards through the entire support platform 33 to the chip under test 400. Compared to placing the heating layer 334 at the top, this design provides more uniform heating.

[0058] like Figures 2-3 As shown, the alignment coupling mechanism 300 also includes a lower vision component 34, which is disposed on the support stage 33 and can move synchronously with the support stage 33 to provide feedback on the alignment status of the chip under test 400.

[0059] Understandably, the lower vision component 34 can observe the position of the electrical test components above the stage 33 at close range, so as to provide a reference for the alignment of contact points on the chip under test 400.

[0060] On the other hand, this application also discloses a chip testing apparatus 100 for testing a chip 400 under test, which includes: The pin card module 200 is disposed above the chip under test 400. The pin card module 200 includes a test pin card 21, which is used to dock with the contact point of the chip under test 400. The aforementioned alignment coupling mechanism 300 is located below the pin card module 200 and is used to drive the chip under test 400 to move in multiple dimensions so as to dock with the test pin card 21.

[0061] Understandably, the function of the pin card module 200 is to dock with the contact point pad of the chip under test 400, and the function of the alignment coupling mechanism 300 is to drive the chip under test 400 to move in multiple dimensions so as to dock with the test pin card 21.

[0062] Understandably, the pin card module 200 is usually connected to a large number of high-frequency and high-speed signal cables. If the pin card module 200 is moved, these cables will swing, introducing noise and interference, which will seriously affect the signal integrity of high-frequency electrical tests. Therefore, keeping the pin card module 200 stationary and only moving the relatively small chip under test 400 and the alignment coupling mechanism 300 can minimize vibration and signal interference and ensure the accuracy of test results.

[0063] In this embodiment, the motion platform 31 drives the entire support platform 33, the chip under test 400, and the six-axis fiber optic alignment module 32 to move in multiple dimensions, so that the contact points of the chip under test 400 are moved to the target position. This allows the electrical contact points on the chip under test 400 to be moved quickly and accurately to the position where the test pin card 21 in the upper pin card module 200 can be precisely connected, thus completing the physical connection for electrical testing. After the electrical connection is established, the six-axis fiber optic alignment module 32 starts to work. Based on the position already positioned by the motion platform 31, the alignment coupling mechanism 300 greatly improves the alignment efficiency and accuracy by first "coarse alignment" and then "fine alignment". Specifically, "coarse alignment" means that the alignment coupling mechanism 300 moves the optical fiber assembly to the bottom of the through slot of the support platform 33; "fine alignment" means that the alignment coupling mechanism 300 drives the optical fiber to perform micron-level, multi-degree-of-freedom (such as pitch, yaw, rotation, etc.) fine adjustments, that is, it drives the optical fiber tip on the optical fiber assembly to make a spiral motion, so as to achieve the optimal optical power position coupling between the optical fiber signal emitted by the optical fiber tip and the waveguide port on the chip under test 400.

[0064] As can be seen, this application achieves the positioning of electrical testing by decoupling the motion platform 31 and the micro-coupling of the six-axis fiber optic alignment module 32, thus balancing the efficiency of large-scale movement with the precision of micron-level adjustment.

[0065] like Figure 6 As shown, the pin card module 200 also includes an upper vision component 22, which is disposed on the side of the pin card module 200 facing the chip under test 400, for collecting contact point position information of the chip under test 400.

[0066] In this embodiment, both the upper visual component 22 and the lower visual component 34 are microscope cameras.

[0067] Understandably, the upper vision component 22 is mounted on the pin card module 200, providing a top-down view of the entire chip under test 400. It can quickly identify the outline, edge markings, and overall layout of all contact points of the chip under test 400, thereby determining the initial position and orientation of the chip under test 400 in the coordinate system of the support stage 33. This allows the system to calculate the macroscopic deviation between the chip under test 400 and the pin card module 200 based on the overall contact point position information collected by the upper vision component 22 and the information from the lower vision component 34. Then, the alignment coupling mechanism 300 can perform a wide-range, rapid movement based on this macroscopic deviation, moving the chip under test 400 below the test pin card 21, thereby significantly shortening the alignment time and improving testing efficiency.

[0068] Thus, through the coordinated operation of the upper vision component 22 and the lower vision component 34, high-precision alignment, automated adjustment, and high-efficiency testing of electrical test alignment are achieved.

[0069] In summary, the entire workflow of the chip testing device 100 is as follows: First, the upper vision component 22 identifies the contact point position information of the chip under test 400, and the lower vision component 34 identifies the tip position information of the test pin card 21. Secondly, based on visual information, the motion platform 31 drives the carrier platform 33 and the chip under test 400 on it to move horizontally, so that the contact point of the chip under test 400 is precisely aligned with the tip of the test pin card 21. Meanwhile, the waveguide position is obtained according to the map (design drawing) of the chip under test 400, and the six-axis fiber alignment module 32 is controlled to drive the fiber assembly to move to the position of the through slot 331 of the support stage 33 and move in a spiral manner, thereby driving the fiber assembly to adjust its attitude to be aligned and coupled with the corresponding waveguide optical port. Finally, the motion platform 31 drives the carrier platform 33 to rise and fall (Z-axis movement), so that the tip of the test pin card 21 is inserted into the contact point of the chip under test 400, completing the electrical connection; at the same time, the optical fiber assembly has achieved optical coupling with the waveguide optical port of the chip under test 400, thereby simultaneously completing the optical and electrical coordinated test of the CPO chip under test 400.

[0070] The foregoing description has fully disclosed the specific embodiments of this application. It should be noted that any modifications made by those skilled in the art to the specific embodiments of this application do not depart from the scope of the claims. Accordingly, the scope of the claims of this application is not limited to the foregoing specific embodiments.

Claims

1. A positioning coupling mechanism, characterized in that, It is used in chip testing equipment, and the alignment coupling mechanism includes: A motion platform includes a U-shaped structure with an upward opening, the open end of the U-shaped structure being used to mount a chip under test, and the motion platform being used to move the chip under test. A six-axis fiber optic alignment module is disposed in the cavity of the U-shaped structure. It is used to drive the fiber optic assembly disposed on the six-axis fiber optic alignment module to perform multi-dimensional movement so that the fiber optic signal emitted by the fiber optic assembly can be aligned with the waveguide port on the chip under test.

2. The alignment coupling mechanism according to claim 1, characterized in that, The motion platform includes a first horizontal module, a rotating module, a vertical module, and a second horizontal module arranged sequentially from bottom to top. A non-zero angle is provided between the moving direction of the first horizontal module and the moving direction of the second horizontal module; The second horizontal module includes the U-shaped structure, and the bottom surface of the U-shaped structure is connected to the vertical module.

3. The alignment coupling mechanism according to claim 2, characterized in that, The movement direction of the first horizontal module is perpendicular to the movement direction of the second horizontal module.

4. The alignment coupling mechanism according to claim 2, characterized in that, The second horizontal module also includes a second slide rail, which is arranged in pairs on the upright arms on both sides of the opening end of the U-shaped structure. The extension direction of the slide rail is the same as the movement direction of the second horizontal module, so as to guide the movement of the chip under test.

5. The alignment coupling mechanism according to claim 4, characterized in that, The alignment coupling mechanism further includes a support platform, which is disposed on the second slide rail for adsorbing the chip under test.

6. The alignment coupling mechanism according to claim 5, characterized in that, The support platform is a plate-shaped structure, and the support platform is provided with multiple vertically penetrating and sequentially spaced strip-shaped slots. The slots are used for the optical fiber signals emitted by the optical fiber assembly driven by the six-axis optical fiber alignment module to pass through, so as to align with the waveguide optical port on the chip under test.

7. The alignment coupling mechanism according to claim 5, characterized in that, The support platform includes, from top to bottom, an adsorption layer, a cooling layer, and a heating layer. The cooling layer and the heating layer are used to control the temperature of the chip under test.

8. The alignment coupling mechanism according to claim 5, characterized in that, The alignment coupling mechanism also includes a lower vision component, which is disposed on the support platform and can move synchronously with the support platform to provide feedback on the alignment status of the chip under test.

9. A chip testing device, characterized in that, It is used to test the chip under test, and includes: A pin card module is positioned above the chip under test. The pin card module includes a test pin card, which is used to dock with the contact points of the chip under test. The alignment coupling mechanism according to any one of claims 1-8 is disposed below the pin card module and is used to drive the chip under test to move in multiple dimensions so as to dock with the test pin card.

10. The chip testing apparatus according to claim 9, characterized in that, The pin card module also includes an upper vision component, which is disposed on the side of the pin card module facing the chip under test, for collecting contact point position information of the chip under test.

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