Defect detection apparatus for electric chip integrated package

Abstract

The utility model provides defect detection equipment for electric chip integrated package relates to electric chip integrated package detection technical field, including base frame, the upper surface fixed of base frame has the U type frame, the inner top wall fixed of U type frame has detection camera, the top of base frame is provided with drive assembly, drive assembly includes electric chip rack, the outer surface fixed of electric chip rack has the rack, the outer surface fixed of electric chip rack has two symmetrical U type connecting rod, the inside of U type frame is provided with cleaning mechanism. This defect detection equipment for electric chip integrated package through the setting of drive assembly and cleaning mechanism, can be in the defect detection to the electric chip integrated package surface attachment chippings carry out the cleaning and removal, avoid the processing chippings or dust of electric chip integrated package surface adhesion influence detection result, thereby guarantee the accuracy of detection result, avoid the error judgment.

Description

Technical Field

[0001] This utility model relates to a defect detection device for integrated packaging of electrical chips, specifically a defect detection device for integrated packaging of electrical chips, and belongs to the field of integrated packaging testing technology for electrical chips. Background Technology

[0002] With the development of modern informatization, electronification, and intelligence, electronic chips, as the core of modern electronic products and production equipment, have seen their usage increase year by year. Moreover, with the needs of production and life, the performance requirements for electronic chips themselves are also constantly increasing. Therefore, electronic chips are an indispensable and important component in modern industries. Electronic chips are integrated and packaged in production, and in order to ensure product quality, defect detection is required.

[0003] The chip surface defect detection device disclosed in Chinese Patent Application Publication CN219532965U uses positioning frames to facilitate the neat placement of chips, a transmission worm gear to connect the transmission crankshaft to the drive mechanism, and the drive mechanism to provide rotational power to the transmission crankshaft. The rotation of the transmission crankshaft, in conjunction with the inner cavity of the transmission beam, causes the moving stage to adjust the position of two sets of positioning frames. The transmission mechanism then performs detection on the chips positioned on the positioning frames inside the detection chamber, further improving the detection efficiency and increasing the ease of operation of the device.

[0004] However, during the implementation of the above-mentioned patented technical solution, residual debris on the surface of the integrated package of the electronic chip can affect the accuracy of defect detection. During the production process of the integrated package of the electronic chip, a detection camera is used to detect defects. However, the surface of the integrated package of the electronic chip may be covered with debris generated during the processing or dust falling from the air. This debris and dust will cover the surface of the electronic chip, thereby affecting the detection judgment and leading to inaccurate detection results.

[0005] Therefore, a defect detection device for integrated packaging of electronic chips is proposed here. Utility Model Content

[0006] This invention proposes a defect detection device for integrated packaging of electronic chips, in order to solve the problem that residual debris on the surface of integrated packaging of electronic chips affects the accuracy of defect detection in the prior art.

[0007] This utility model is achieved through the following technical solution: a defect detection device for integrated packaging of electronic chips, including a base frame, a U-shaped frame fixed on the upper surface of the base frame, a detection camera fixed on the inner top wall of the U-shaped frame, a driving component arranged above the base frame, the driving component including an electronic chip placement frame, a rack fixed on the outer surface of the electronic chip placement frame, and two symmetrical U-shaped connecting rods fixed on the outer surface of the electronic chip placement frame;

[0008] The U-shaped frame is equipped with a cleaning mechanism, which includes a movable plate, a brush, a hollow tube rotatably connected to the top wall of the U-shaped frame, and a vacuum cleaner fixed to the upper surface of the U-shaped frame. Two symmetrical Z-shaped sliding frames are fixed to the outer surface of the movable plate. Two U-shaped connecting rods are slidably connected to the inner walls of the two Z-shaped sliding frames. A gear is fixed to the outer surface of the hollow tube, and the gear meshes with a rack. A Z-shaped rotating rod is slidably connected to the inner wall of the hollow tube. The Z-shaped rotating rod passes through the movable plate and is rotatably connected to the movable plate. A sliding frame is fixed to the upper surface of the brush, and the Z-shaped rotating rod is slidably connected to the inner wall of the sliding frame.

[0009] The vacuum cleaner has a connecting hose fixed to its input end. The connecting hose passes through the U-shaped frame and is fixed to the U-shaped frame. A suction bucket is fixed to the end of the connecting hose away from the vacuum cleaner. The suction bucket is fixed to the upper surface of the moving plate.

[0010] Preferably, a slider is fixed to the upper surface of the rack, and a guide rail is slidably connected to the outer surface of the slider. The guide rail is fixed to the inner top wall of the U-shaped frame, and the slider and guide rail provide auxiliary guidance for the movement of the rack.

[0011] Specifically, a threaded tube is fixed to the bottom surface of the electronic chip placement rack, and a threaded rod is threadedly connected to the inner wall of the threaded tube. The threaded rod is rotatably connected to the inner wall of the base frame, and when the threaded rod rotates, it drives the threaded tube and the electronic chip placement rack to move.

[0012] Furthermore, a sliding tube is fixed to the bottom surface of the electronic chip placement rack, and a support rod is slidably connected to the inner wall of the sliding tube. The support rod is fixed to the inner wall of the base frame, and the support rod and the sliding tube guide the movement of the electronic chip placement rack.

[0013] Preferably, two symmetrical telescopic rods are fixed to the upper surface of the movable plate, and the top ends of the two telescopic rods are fixed to the inner top wall of the U-shaped frame. The telescopic rods guide the movement of the movable plate.

[0014] Specifically, the bottom surface of the movable plate is fixed with two symmetrical U-shaped fixing rods, and the outer surfaces of the two U-shaped fixing rods are slidably connected with sliding connecting seats. The two sliding connecting seats are fixed on the upper surface of the brush. The U-shaped fixing rods and sliding connecting seats guide the movement of the brush.

[0015] This utility model provides a defect detection device for integrated packaging of electrical chips, which has the following beneficial effects:

[0016] 1. This defect detection equipment for integrated circuit packaging of electrical chips, through the setting of drive components and cleaning mechanisms, can clean and remove debris attached to the surface of integrated circuit packaging of electrical chips during defect detection, so as to avoid the processing debris or dust adhering to the surface of integrated circuit packaging of electrical chips from affecting the detection results, thereby ensuring the accuracy of the detection results and avoiding incorrect judgments.

[0017] 2. The defect detection equipment for integrated packaging of electronic chips uses a vacuum cleaner, a connecting hose and a suction bucket. When the brush cleans the surface of the integrated packaging of electronic chips, the vacuum cleaner is controlled to operate and suck up the debris and dust swept off by the brush through the connecting hose and suction bucket, so as to prevent the debris and dust from falling back onto the surface of the integrated packaging of electronic chips. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a schematic diagram of the internal structure of the U-shaped frame of this utility model;

[0020] Figure 3 This is a schematic diagram showing the disassembled structure of the slider and guide rail of this utility model;

[0021] Figure 4 This is a schematic diagram showing the disassembled structure of the hollow tube and Z-shaped rotating rod of this utility model;

[0022] Figure 5 This is a schematic diagram showing the disassembled structure of the hollow tube, Z-shaped rotating rod, sliding frame, and brush of this utility model.

[0023] Explanation of reference numerals in the attached figures

[0024] 1. Base frame; 2. U-shaped frame;

[0025] 3. Drive assembly; 31. Electronic chip placement rack; 32. Rack; 33. U-shaped connecting rod; 34. Slider; 35. Guide rail; 36. Threaded rod; 37. Threaded tube; 38. Support rod; 39. Sliding tube;

[0026] 4. Cleaning mechanism; 41. Moving plate; 42. Z-shaped sliding frame; 43. Hollow tube; 44. Z-shaped rotating rod; 45. Gear; 46. Brush; 47. Sliding frame; 48. Telescopic rod; 49. U-shaped fixing rod; 410. Sliding connecting seat; 411. Vacuum cleaner; 412. Connecting hose; 413. Suction bucket;

[0027] 5. Inspect the camera. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0029] Please see Figures 1-5 The present invention proposes the following implementation scheme: a defect detection device for integrated packaging of electronic chips, including a base frame 1, a U-shaped frame 2 fixed on the upper surface of the base frame 1, a detection camera 5 fixed on the inner top wall of the U-shaped frame 2, the detection camera 5 being able to perform defect detection on integrated packaging of electronic chips, a driving component 3 being provided above the base frame 1, the driving component 3 including an electronic chip placement frame 31, the integrated packaging of electronic chips being stably placed in the electronic chip placement frame 31, a rack 32 fixed on the outer surface of the electronic chip placement frame 31, and two symmetrical U-shaped connecting rods 33 fixed on the outer surface of the electronic chip placement frame 31.

[0030] Please refer to this carefully. Figure 3 A slider 34 is fixed on the upper surface of the rack 32, and a guide rail 35 is slidably connected to the outer surface of the slider 34. The guide rail 35 is fixed to the inner top wall of the U-shaped frame 2. The slider 34 and the guide rail 35 play an auxiliary guiding role for the movement of the rack 32.

[0031] Please refer to this carefully. Figure 3 A threaded tube 37 is fixed to the bottom surface of the electronic chip placement rack 31. A threaded rod 36 is threadedly connected to the inner wall of the threaded tube 37. The threaded rod 36 is rotatably connected to the inner wall of the base frame 1. A motor is provided on the base frame 1 to provide power for the rotation of the threaded rod 36. When the threaded rod 36 rotates, it drives the threaded tube 37 and the electronic chip placement rack 31 to move.

[0032] Please refer to this carefully. Figure 3 A sliding tube 39 is fixed to the bottom surface of the chip placement rack 31. A support rod 38 is slidably connected to the inner wall of the sliding tube 39. The support rod 38 is fixed to the inner wall of the base frame 1. The support rod 38 and the sliding tube 39 guide the movement of the chip placement rack 31.

[0033] Please refer to this carefully. Figure 2 , Figure 4 and Figure 5The U-shaped frame 2 has a cleaning mechanism 4 inside. The cleaning mechanism 4 includes a movable plate 41, a brush 46, a hollow tube 43 rotatably connected to the inner top wall of the U-shaped frame 2, and a vacuum cleaner 411 fixed to the upper surface of the U-shaped frame 2. Two symmetrical Z-shaped sliding frames 42 are fixed to the outer surface of the movable plate 41. Two U-shaped connecting rods 33 are slidably connected to the inner walls of the two Z-shaped sliding frames 42 respectively. When the battery chip placement rack 31 moves, the height of the movable plate 41 will change under the sliding action of the U-shaped connecting rods 33 and the Z-shaped sliding frames 42. A gear 45 is fixed on the outer surface of the hollow tube 43. The gear 45 meshes with the rack 32. A Z-shaped rotating rod 44 is slidably connected to the inner wall of the hollow tube 43. The Z-shaped rotating rod 44 can slide inside the hollow tube 43. When the hollow tube 43 rotates, it can drive the Z-shaped rotating rod 44 to rotate. The Z-shaped rotating rod 44 passes through the moving plate 41 and is rotatably connected to the moving plate 41. A sliding frame 47 is fixed on the upper surface of the brush 46. The Z-shaped rotating rod 44 is slidably connected to the inner wall of the sliding frame 47. When the Z-shaped rotating rod 44 rotates, it pushes the sliding frame 47 to move back and forth.

[0034] Please refer to this carefully. Figure 2 The vacuum cleaner 411 has a connecting hose 412 fixed at its input end. The connecting hose 412 passes through the U-shaped frame 2 and is fixed to the U-shaped frame 2. The end of the connecting hose 412 away from the vacuum cleaner 411 is fixed with a suction bucket 413. The suction bucket 413 is fixed to the upper surface of the moving plate 41. The vacuum cleaner 411 is controlled to operate and sucks away the debris and dust swept by the brush 46 through the connecting hose 412 and the suction bucket 413.

[0035] Please refer to this carefully. Figure 2 and Figure 4 Two symmetrical telescopic rods 48 are fixed on the upper surface of the movable plate 41. The top ends of the two telescopic rods 48 are fixed to the inner top wall of the U-shaped frame 2. The telescopic rods 48 guide the movement of the movable plate 41.

[0036] Please refer to this carefully. Figure 4 The bottom surface of the movable plate 41 is fixed with two symmetrical U-shaped fixing rods 49. The outer surfaces of the two U-shaped fixing rods 49 are slidably connected with sliding connecting seats 410. The two sliding connecting seats 410 are fixed on the upper surface of the brush 46. The U-shaped fixing rods 49 and the sliding connecting seats 410 guide the movement of the brush 46.

[0037] In use, the integrated circuit chip package is placed inside the integrated circuit chip holder 31. The motor on the base frame 1 is controlled to rotate, driving the threaded rod 36 to rotate and pushing the threaded tube 37, the integrated circuit chip holder 31, and the rack 32 to move closer to the gear 45. Under the meshing action of the rack 32 and the gear 45, the hollow tube 43 is driven to rotate. At the same time, under the sliding action of the U-shaped connecting rod 33 and the Z-shaped sliding frame 42, the moving plate 41 moves down. At this time, the brush 46 is in close contact with the integrated circuit chip package. When the hollow tube 43 rotates, it drives the Z-shaped rotating rod 44 to rotate. The Z-shaped rotating rod 44 pushes the sliding frame 47 and the brush 46 to move back and forth. The brush 46 cleans the surface of the integrated circuit chip package. At the same time, the vacuum cleaner 411 is controlled to operate, and the debris and dust cleaned by the brush 46 are sucked away through the connecting hose 412 and the suction bucket 413. This device can clean and remove debris attached to the surface of the integrated circuit chip package during defect detection, thereby ensuring the accuracy of the detection results.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A defect detection device for integrated packaging of electrical chips, comprising a base frame (1), characterized in that: A U-shaped frame (2) is fixed on the upper surface of the base frame (1), and a detection camera (5) is fixed on the inner top wall of the U-shaped frame (2). A driving assembly (3) is provided above the base frame (1). The driving assembly (3) includes an electrical chip placement rack (31). A rack (32) is fixed on the outer surface of the electrical chip placement rack (31), and two symmetrical U-shaped connecting rods (33) are fixed on the outer surface of the electrical chip placement rack (31). The U-shaped frame (2) is equipped with a cleaning mechanism (4), which includes a movable plate (41), a brush (46), a hollow tube (43) rotatably connected to the inner top wall of the U-shaped frame (2), and a vacuum cleaner (411) fixed to the upper surface of the U-shaped frame (2). The outer surface of the movable plate (41) is fixed with two symmetrical Z-shaped sliding frames (42), and the two U-shaped connecting rods (33) are slidably connected to the two Z-shaped sliding frames (42). The inner wall of the hollow tube (43) is fixed with a gear (45) on the outer surface of the hollow tube (43). The gear (45) meshes with the rack (32). A Z-shaped rotating rod (44) is slidably connected to the inner wall of the hollow tube (43). The Z-shaped rotating rod (44) passes through the moving plate (41) and is rotatably connected to the moving plate (41). A sliding frame (47) is fixed to the upper surface of the brush (46). The Z-shaped rotating rod (44) is slidably connected to the inner wall of the sliding frame (47). The vacuum cleaner (411) has a connecting hose (412) fixed at its input end. The connecting hose (412) passes through the U-shaped frame (2) and is fixed to the U-shaped frame (2). The end of the connecting hose (412) away from the vacuum cleaner (411) is fixed with a suction bucket (413). The suction bucket (413) is fixed to the upper surface of the moving plate (41).

2. The defect detection equipment for integrated packaging of electrical chips according to claim 1, characterized in that: A slider (34) is fixed on the upper surface of the rack (32), and a guide rail (35) is slidably connected to the outer surface of the slider (34). The guide rail (35) is fixed to the inner top wall of the U-shaped frame (2).

3. The defect detection equipment for integrated packaging of electrical chips according to claim 1, characterized in that: The bottom surface of the electrical chip placement rack (31) is fixed with a threaded tube (37), and the inner wall of the threaded tube (37) is threaded with a threaded rod (36), which is rotatably connected to the inner wall of the base frame (1).

4. The defect detection equipment for integrated packaging of electrical chips according to claim 1, characterized in that: The bottom surface of the electrical chip placement rack (31) is fixed with a sliding tube (39), and a support rod (38) is slidably connected to the inner wall of the sliding tube (39). The support rod (38) is fixed to the inner wall of the base frame (1).

5. The defect detection equipment for integrated packaging of electrical chips according to claim 1, characterized in that: The upper surface of the movable plate (41) is fixed with two symmetrical telescopic rods (48), and the top ends of the two telescopic rods (48) are fixed to the inner top wall of the U-shaped frame (2).

6. The defect detection equipment for integrated packaging of electrical chips according to claim 1, characterized in that: The bottom surface of the movable plate (41) is fixed with two symmetrical U-shaped fixing rods (49). The outer surfaces of the two U-shaped fixing rods (49) are slidably connected with sliding connecting seats (410). The two sliding connecting seats (410) are fixed on the upper surface of the brush (46).

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