Portable mobile phone mainboard heat dissipation detection platform

Abstract

The utility model discloses a portable mobile phone mainboard heat dissipation detection platform relates to mainboard heat dissipation detection technical field, include: heat dissipation detection platform and adjusting assembly, the adjusting assembly includes: telescopic pneumatic cylinder, lifting assembly and installation component, telescopic pneumatic cylinder and heat dissipation detection platform side fixed connection, the telescopic end of telescopic pneumatic cylinder and lifting assembly fixed connection, is used for driving lifting assembly sliding, the top of lifting assembly and installation component fixed connection, is used for driving installation component elevating, when the mainboard is put into installation component, the telescopic end of telescopic pneumatic cylinder is used for promoting lifting assembly, the dynamic lifting assembly is used for driving installation component elevating, the utility model discloses can adjust installation detection distance, improves detection effect.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation testing technology, and in particular to a portable mobile phone motherboard heat dissipation testing platform. Background Technology

[0002] The mobile phone motherboard is the core circuit board inside the mobile phone, which integrates all key electronic components and circuit systems. It is mainly used to connect, control and coordinate the various hardware components of the mobile phone to realize the basic functions and performance of the mobile phone.

[0003] Existing mobile phone motherboard thermal testing platforms typically employ a fixed motherboard mounting method, which presents certain limitations. Because the distance between the motherboard and the thermal testing platform cannot be adjusted, the platform can interfere with the motherboard's heat dissipation during thermal performance testing. This limitation prevents accurate assessment of the motherboard's cooling effect during testing, thus reducing the overall testing effectiveness. Utility Model Content

[0004] The purpose of this invention is to provide a portable mobile phone motherboard heat dissipation testing platform, which solves the problem that the installation and testing distance cannot be adjusted, thus reducing the testing effect.

[0005] To achieve this objective, the present invention adopts the following technical solution: A portable mobile phone motherboard heat dissipation testing platform includes: a heat dissipation testing platform and an adjustment component; The adjustment assembly includes: a telescopic cylinder, a lifting assembly, and an installation assembly. The telescopic cylinder is fixedly connected to the side of the heat dissipation testing platform. The telescopic end of the telescopic cylinder is fixedly connected to the lifting assembly and is used to drive the lifting assembly to slide. The top end of the lifting assembly is fixedly connected to the installation assembly and is used to drive the installation assembly to rise and fall. After the motherboard is placed into the mounting assembly, the telescopic end of the telescopic cylinder is used to push the lifting assembly, and the movable lifting assembly is used to drive the mounting assembly to move up and down.

[0006] Preferably, the lifting assembly includes: a sliding block, a connecting plate, and a lifting plate. The sliding block is slidably connected to the heat dissipation testing platform and to the top of the heat dissipation testing platform. The side of the sliding block is rotatably connected to the connecting plate, and one end of the connecting plate is fixedly connected to the lifting plate.

[0007] Preferably, one end of the lifting plate is rotatably connected to the heat dissipation testing platform.

[0008] Preferably, the installation assembly includes: a placement plate, a first fixing frame, a second fixing frame, and a spring. The placement plate is fixedly connected to the top of the lifting plate, and the top of the placement plate is slidably connected to the first fixing frame. The second fixing frame is disposed below the first fixing frame and is slidably connected to the bottom of the placement plate. The sides of the first fixing frame and the second fixing frame are respectively fixedly connected to the spring. A cavity is formed inside the placement plate.

[0009] Preferably, the mounting assembly contains a cooling component for cooling the motherboard; The cooling component includes a fan, a connecting frame, a thermally conductive silicone plate, and an airflow pipe. The fan is fixedly connected to the top of the placement plate. A connecting frame is provided below the fan and is fixedly connected to the interior of the cavity. The top of the connecting frame is fixedly connected to the thermally conductive silicone plate. Heat dissipation holes are provided on the side of the connecting frame. An airflow pipe is provided below the connecting frame, and the bottom of the placement plate is fixedly connected to the airflow pipe.

[0010] Preferably, the connecting frame has a through hole on its side.

[0011] Preferably, the spring is fixedly connected to the interior of the placement plate.

[0012] Preferably, the inner sides of the first and second fixing frames are provided with filling grooves corresponding to the cavity.

[0013] Preferably, the lifting plate is rotatably connected to the inner side of the heat dissipation testing platform.

[0014] Compared with the prior art, the present invention has the following beneficial effects: In use, first place the motherboard inside the mounting assembly, then activate the telescopic cylinder. The telescopic end of the cylinder pushes the lifting assembly, causing it to rotate and move the mounting assembly, which in turn moves the motherboard slowly away from the heat dissipation testing platform. Once the motherboard is away from the platform, start the motherboard operation for the predetermined time and observe its temperature rise. Because the motherboard is now away from the platform, the impact of the platform on the motherboard is reduced, allowing for a more accurate assessment of the motherboard's heat dissipation performance. This improves the testing results and solves the problem of not being able to adjust the mounting distance, which reduced the testing effectiveness. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional structural diagram of the second fixing frame, fan, and lifting plate of this utility model; Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle.

[0018] Figure 4 This is a partial cross-sectional structural diagram of the connecting frame, thermally conductive silicone plate, and airflow pipe of this utility model; Figure 5 This is a schematic diagram of the structure of the sliding block and connecting plate of this utility model; Figure 6 This is a schematic diagram showing the movement of the motherboard of this utility model placed at the highest point within the mounting assembly.

[0019] Illustrations: 1. Heat dissipation testing platform; 2. Adjustment component; 3. Telescopic cylinder; 4. Lifting component; 5. Installation component; 401. Sliding block; 402. Connecting plate; 403. Lifting plate; 501. Placement plate; 502. First fixing frame; 503. Second fixing frame; 504. Spring; 6. Cooling component; 601. Fan; 602. Connecting frame; 603. Thermally conductive silicone plate; 604. Airflow pipe; 7. Cavity; 8. Through hole; 9. Filling groove. Detailed Implementation

[0020] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] refer to Figure 1 - Figure 3 As shown, this utility model embodiment provides a portable mobile phone motherboard heat dissipation testing platform, including: a heat dissipation testing platform 1 and an adjustment component 2; The adjustment assembly 2 includes: a telescopic cylinder 3, a lifting assembly 4, a mounting assembly 5, and a cooling assembly 6. The telescopic cylinder 3 is fixedly connected to the side of the heat dissipation testing platform 1. The telescopic end of the telescopic cylinder 3 is fixedly connected to the lifting assembly 4 and is used to drive the lifting assembly 4 to slide. The top end of the lifting assembly 4 is fixedly connected to the mounting assembly 5 and is used to drive the mounting assembly 5 to rise and fall. The mounting assembly 5 is connected to the cooling assembly 6 and is used to transfer heat from the mounting assembly 5. After the motherboard is placed into the mounting assembly 5, the telescopic end of the telescopic cylinder 3 is used to push the lifting assembly 4. The lifting assembly 4 is used to drive the mounting assembly 5 to move up and down, and to activate the cooling assembly 6 to transfer the heat from the motherboard to the heat dissipation test platform 1 for testing.

[0024] refer to Figure 1 , Figure 2 and Figure 5As shown, the lifting assembly 4 includes a sliding block 401, a connecting plate 402, and a lifting plate 403. The sliding block 401 is slidably connected to the heat dissipation testing platform 1 and to the top of the heat dissipation testing platform 1. The side of the sliding block 401 is rotatably connected to the connecting plate 402, and one end of the connecting plate 402 is fixedly connected to the lifting plate 403. Existing testing equipment is usually bulky and the adjustment process is not flexible enough. It usually requires a lot of manual operation or complex mechanical devices for adjustment, which makes the operation cumbersome and time-consuming, affecting the overall convenience. In this embodiment, the design of the lifting assembly 4 cleverly integrates key components such as the sliding block 401, the connecting plate 402, and the lifting plate 403 into a small space. Through reasonable arrangement, a balance between functionality and space utilization is achieved. The range of motion of the entire lifting assembly 4 is limited by the compact design of the structure, so it does not occupy too much working space, making it convenient for users to use in a limited space. Compared with the prior art, the cooperation between the sliding block 401 and the connecting plate 402 is more direct, and the force transmission is relatively simple and effective. Under the action of the telescopic cylinder 3, the sliding block 401 pushes the connecting plate 402 to rotate, which in turn drives the lifting plate 403 to rise and fall. This direct force transmission mechanism reduces energy loss and mechanical complexity, thereby improving the convenience and stability of the entire system.

[0025] like Figure 5 and Figure 6 As shown, when the telescopic cylinder 3 is started, the telescopic end of the telescopic cylinder 3 pushes the sliding block 401 to slide on the heat dissipation testing platform 1. Then the sliding block 401 drives the connecting plate 402 to slide. During the sliding process, the connecting plate 402 rotates clockwise on the sliding block 401. Since one end of the lifting plate 403 is rotatably connected to the heat dissipation testing platform 1, the fixed block rotates to drive the lifting plate 403 to rotate clockwise. Then the lifting plate 403 drives the mounting component 5 to move from bottom to top, realizing lifting and lowering. After the test is completed, the telescopic cylinder 3 is closed, causing the telescopic end of the telescopic cylinder 3 to drive the sliding block 401 to slide on the heat dissipation test platform 1 for reset. The subsequent reset process is the opposite of the above movement process, so it will not be described in detail.

[0026] refer to Figure 1 , Figure 2 and Figure 3As shown, the installation assembly 5 includes: a placement plate 501, a first fixing frame 502, a second fixing frame 503, and a spring 504. The placement plate 501 is fixedly connected to the top end of the lifting plate 403. The top end of the placement plate 501 is slidably connected to the first fixing frame 502. The second fixing frame 503 is disposed below the first fixing frame 502 and is slidably connected to the bottom end of the placement plate 501. The sides of the first fixing frame 502 and the second fixing frame 503 are respectively fixedly connected to the spring 504. A cavity 7 is provided inside the placement plate 501.

[0027] Before use, fill the filling slot 9 with foam board. Manually pull the second fixing bracket 503 outward, causing the second fixing bracket 503 to stretch its spring 504. Then, place one side of the main board into the cavity 7 from the side of the placement plate 501 and press the other side against the second fixing bracket 503, so that the other side of the main board presses against the foam board in its filling slot 9. Then, release the second fixing bracket 503, so that the spring 504 pulls the second fixing bracket 503 back towards the cavity 7 through the rebound force, so that the second fixing bracket 503 pushes the main board through the foam board filled in the filling slot 9. Then, one side of the main board contacts the filling slot 9 of the first fixing bracket 502, so that the first fixing bracket 502 and the second fixing bracket 503 clamp and fix the main board in the cavity 7 of the placement plate 501. The main board is also in contact with the cooling component 6. The foam board can buffer the squeezing force of pushing the main board and prevent the main board from being squeezed and deformed. Then, connect the main board to the external power supply to power the main board and make the main board start working in the cavity of the placement plate. After the test is completed, the motherboard to be tested needs to be removed. The second fixing bracket 503 can be operated in the same way as described above, and then the motherboard can be removed from the cavity 7 of the placement plate 501.

[0028] When the lifting plate 403 rotates, it drives the placement plate 501 to slowly move away from the heat dissipation testing platform 1 until the lifting plate 403 rotates to be perpendicular to the projection of the heat dissipation testing platform 1, and the placement plate 501 is located directly above the heat dissipation testing platform 1. At this time, the telescopic cylinder 3 is closed, and the placement plate 501 is at its farthest distance relative to the heat dissipation testing platform 1.

[0029] refer to Figure 1 , Figure 2 and Figure 4 As shown, the mounting component 5 has a cooling component 6 installed inside, which is used to cool the motherboard. The cooling component 6 includes a fan 601, a connecting frame 602, a thermally conductive silicone plate 603, and an airflow pipe 604. The fan 601 is fixedly connected to the top of the placement plate 501. The connecting frame 602 is located below the fan 601 and is fixedly connected to the interior of the cavity 7. The top of the connecting frame 602 is fixedly connected to the thermally conductive silicone plate 603. Heat dissipation holes are provided on the side of the connecting frame 602. The airflow pipe 604 is located below the connecting frame 602, and the bottom of the placement plate 501 is fixedly connected to the airflow pipe 604. The thermally conductive silicone plate 603 is a plate-shaped structure made of thermally conductive silicone. Thermally conductive silicone is usually a mixture of silicone substrate and thermally conductive filler (such as metal oxide). Its main function is to help reduce thermal resistance and promote heat transfer from the heat source (such as electronic components) to the heat dissipation testing platform 1.

[0030] When the placement plate 501 is directly above the heat dissipation testing platform 1, the heat on its motherboard is transferred to the thermal conductive silicone plate 603 as the placement plate 501 moves. The thermal conductive silicone plate stores the heat and slowly dissipates it. Then, the fan 601 is manually activated, blowing cool air into the cavity 7. The cool air blown out by the fan acts on the thermal conductive silicone plate 603 through the through-hole 8 on the connecting bracket 602. Because the motherboard and cooling component 6 are in contact, and the thermal conductive silicone plate 603 is in contact with the motherboard, a large amount of heat from the motherboard is transferred to the thermal conductive silicone plate 603 for storage and slow dissipation. The blown-in cool air carries away the heat from the motherboard and the thermal conductive silicone plate 603 through heat transfer. Due to the continuous blowing of the fan 601, the cavity... The cold air inside cavity 7 is pushed, causing the motherboard and thermal conductive silicone plate 603 to cool down. The cold air, carrying the absorbed heat, is then blown out of cavity 7 through airflow pipe 604 onto the heat dissipation testing platform 1, causing the motherboard temperature inside placement plate 501 to begin to decrease and cool down. Then, the second fixing bracket 503 is manually pulled outward, causing the spring 504 to move the first fixing bracket 502 towards placement plate 501 through rebound force. The first fixing bracket 502 then pushes the motherboard out of placement plate 501. The motherboard that has been tested is then manually removed. At the same time, the untested motherboard is manually put back into cavity 7 of placement plate 501 for testing through the above operation, thereby enabling quick replacement of motherboards for testing and improving testing efficiency.

[0031] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A portable mobile phone motherboard heat dissipation testing platform, characterized in that, include: Heat dissipation testing platform (1) and adjustment components (2); The adjustment component (2) includes: a telescopic cylinder (3), a lifting component (4), and a mounting component (5). The telescopic cylinder (3) is fixedly connected to the side of the heat dissipation testing platform (1). The telescopic end of the telescopic cylinder (3) is fixedly connected to the lifting component (4) to drive the lifting component (4) to slide. The top end of the lifting component (4) is fixedly connected to the mounting component (5) to drive the mounting component (5) to rise and fall. When the motherboard is placed into the mounting assembly (5), the telescopic end of the telescopic cylinder (3) is used to push the lifting assembly (4), and the lifting assembly (4) is used to drive the mounting assembly (5) to move up and down.

2. The portable mobile phone motherboard heat dissipation testing platform according to claim 1, characterized in that, The lifting assembly (4) includes: a sliding block (401), a connecting plate (402) and a lifting plate (403). The sliding block (401) is slidably connected to the heat dissipation testing platform (1), the sliding block (401) is slidably connected to the top of the heat dissipation testing platform (1), the side of the sliding block (401) is rotatably connected to the connecting plate (402), and one end of the connecting plate (402) is fixedly connected to the lifting plate (403).

3. The portable mobile phone motherboard heat dissipation testing platform according to claim 2, characterized in that, One end of the lifting plate (403) is rotatably connected to the heat dissipation testing platform (1).

4. The portable mobile phone motherboard heat dissipation testing platform according to claim 3, characterized in that, The installation assembly (5) includes: a placement plate (501), a first fixing frame (502), a second fixing frame (503), and a spring (504). The placement plate (501) is fixedly connected to the top of the lifting plate (403). The top of the placement plate (501) is slidably connected to the first fixing frame (502). The second fixing frame (503) is located below the first fixing frame (502). The second fixing frame (503) is slidably connected to the bottom of the placement plate (501). The sides of the first fixing frame (502) and the second fixing frame (503) are respectively fixedly connected to the spring (504). A cavity (7) is opened inside the placement plate (501).

5. A portable mobile phone motherboard heat dissipation testing platform according to claim 4, characterized in that, The mounting component (5) has a cooling component (6) installed inside it for cooling the motherboard; The cooling component (6) includes: a fan (601), a connecting frame (602), a thermally conductive silicone plate (603), and an airflow pipe (604). The fan (601) is fixedly connected to the top of the placement plate (501). The connecting frame (602) is provided below the fan (601). The connecting frame (602) is fixedly connected to the inside of the cavity (7). The top of the connecting frame (602) is fixedly connected to the thermally conductive silicone plate (603). The connecting frame (602) has heat dissipation holes on its side. The airflow pipe (604) is provided below the connecting frame (602). The bottom of the placement plate (501) is fixedly connected to the airflow pipe (604).

6. A portable mobile phone motherboard heat dissipation testing platform according to claim 5, characterized in that, The connecting frame (602) has a through hole (8) on its side.

7. A portable mobile phone motherboard heat dissipation testing platform according to claim 4, characterized in that, The spring (504) is fixedly connected to the inside of the placement plate (501).

8. A portable mobile phone motherboard heat dissipation testing platform according to claim 4, characterized in that, The first fixing frame (502) and the second fixing frame (503) have filling grooves (9) corresponding to the cavity (7) on their inner sides.

9. A portable mobile phone motherboard heat dissipation testing platform according to claim 2, characterized in that, The lifting plate (403) is rotatably connected to the inside of the heat dissipation testing platform (1).

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