An IGBT substrate solder layer cavity on-line detection device

Abstract

The utility model discloses a kind of IGBT substrate welding layer cavity on-line detection device, it is related to IGBT substrate technical field, including conveying mechanism, the conveying mechanism includes mounting bracket, the surface of the mounting bracket is fixedly connected with first motor, the one end of the first motor rotating shaft is fixedly connected with driving roller, the surface of the driving roller is overlapped with driving belt.The utility model is provided with by the setting of pretreatment mechanism, the air blower on support frame exports directional airflow through blowing port, can quickly blow the flux, metal scrap remaining on the surface of IGBT substrate, avoid impurity interference ultrasonic detection signal, without manual secondary cleaning, guarantee detection accuracy;While main auxiliary combination detection eliminates angle blind area, main ultrasonic detection component realizes front detection by fixing frame, and auxiliary ultrasonic detection component can be driven screw rod adjustment lifting piece height by second motor, and adapt to different thickness substrate.

Description

Technical Field

[0001] This utility model relates to the field of IGBT substrate technology, and specifically to an online detection device for voids in the solder layer of an IGBT substrate. Background Technology

[0002] Traditional IGBT substrate solder layer void detection devices are mainly used in the power electronics manufacturing industry, especially in the IGBT module production process, to detect void defects at the solder interface between the substrate and the heat dissipation layer. They identify air bubbles or unfused areas in the solder layer through various detection methods, preventing poor heat dissipation caused by voids and ensuring the stable operation of IGBT modules in scenarios such as new energy vehicles and rail transportation. They are key equipment for ensuring the reliability of power devices.

[0003] However, when inspecting IGBT substrates with complex structures such as edges and corners, or when there is residual flux or metal debris on the substrate surface, traditional devices lack an effective pre-treatment cleaning structure, and surface impurities are easily misjudged as voids. At the same time, the detection angle is singular, mostly frontal inspection, which creates a blind spot for voids in the edge solder layer, resulting in a high rate of missed detections and making it difficult to meet the mass production requirements of high-precision IGBT modules. Utility Model Content

[0004] This invention provides an online detection device for voids in the solder layer of an IGBT substrate, in order to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] An online detection device for voids in the solder layer of an IGBT substrate includes a conveying mechanism, which includes a mounting frame. A first motor is fixedly connected to the surface of the mounting frame, and a drive roller is fixedly connected to one end of the first motor shaft. A drive belt overlaps the surface of the drive roller. A pretreatment mechanism includes a support frame, and a blower is fixedly connected to the top of the support frame. The air outlet of the blower is connected to an air inlet through a pipe. A detection mechanism includes an auxiliary detection component and a main detection component. The auxiliary detection component includes an adjusting frame, and a lifting component is slidably connected to the surface of the adjusting frame. A screw is threadedly connected to the inside of the lifting component.

[0007] A further improvement of the present invention is that the conveying mechanism further includes a driving block, the inner wall of the driving block is fixedly connected to the surface of the driving belt, and a first sliding block is fixedly connected to one side of the driving block.

[0008] A further improvement of this utility model is that: the first sliding block is internally slidably connected to a first slide rail, and one side of the first slide rail is fixedly connected to one side of the mounting bracket.

[0009] A further improvement of the present invention is that: a second slide rail is fixedly connected to the top of the drive block, a second sliding block is slidably connected to the surface of the second slide rail, a placement plate is fixedly connected to the top of the second sliding block, and a locking screw is provided inside the second sliding block.

[0010] A further improvement of this utility model is that the auxiliary detection component further includes a second motor, one end of the second motor shaft is fixedly connected to one end of the threaded rod, the surface of the second motor is fixedly connected to the surface of the adjustment frame, the top of the lifting component is rotatably connected to an auxiliary ultrasonic detection component, the auxiliary ultrasonic detection component includes a high-frequency ultrasonic probe and a receiving probe, and the frictional force between the auxiliary ultrasonic detection component and the lifting component is greater than the weight of the auxiliary ultrasonic detection component.

[0011] A further improvement of the present invention is that the main detection component includes a fixing frame, and a main ultrasonic detection component is disposed inside one end of the fixing frame. The main ultrasonic detection component has the same structure as the auxiliary ultrasonic detection component.

[0012] A further improvement of the present invention is that: the bottom of the conveying mechanism is provided with an installation mechanism, the installation mechanism includes an installation platform and a miscellaneous storage cavity, and the top of the installation platform is fixedly connected to the bottom of the installation frame, the support frame, the adjustment frame and the fixing frame respectively.

[0013] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0014] This invention provides an online detection device for solder layer voids in IGBT substrates. Through a pre-treatment mechanism, a blower on the support frame outputs directional airflow through the air outlet, quickly removing residual flux and metal debris from the IGBT substrate surface. This prevents impurities from interfering with the ultrasonic detection signal, eliminating the need for manual secondary cleaning and ensuring detection accuracy. Simultaneously, the combined main and auxiliary detection eliminates angular blind spots. The main ultrasonic detection component performs frontal detection via a fixed frame, while the auxiliary ultrasonic detection component adjusts the height of the lifting component via a second motor-driven screw, adapting to substrates of different thicknesses. It can also rotate around the top of the lifting component, flexibly aligning with complex areas such as substrate edges and corners, forming a comprehensive "front + edge" detection coverage, significantly reducing the missed detection rate of edge solder layer voids. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a side view of the present invention.

[0017] Figure 3 This is a schematic diagram of the auxiliary detection component structure of this utility model;

[0018] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0019] In the diagram: 11. Mounting platform; 12. Miscellaneous item storage cavity; 21. Mounting frame; 22. First motor; 23. Drive roller; 24. Drive belt; 25. Drive block; 26. First sliding block; 27. First slide rail; 28. Second slide rail; 29. ​​Second sliding block; 210. Placement plate; 31. Support frame; 32. Blower; 33. Air outlet; 41. Adjustment frame; 42. Lifting component; 43. Second motor; 44. Auxiliary ultrasonic testing assembly; 45. Fixing frame; 46. Main ultrasonic testing assembly. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to embodiments:

[0021] Example 1, as Figures 1-4 As shown, this utility model provides an online detection device for voids in the solder layer of an IGBT substrate, including a conveying mechanism, which includes a mounting frame 21. A first motor 22 is fixedly connected to the surface of the mounting frame 21, and a drive roller 23 is fixedly connected to one end of the shaft of the first motor 22. A drive belt 24 overlaps the surface of the drive roller 23. A pretreatment mechanism includes a support frame 31, and a blower 32 is fixedly connected to the top of the support frame 31. The air outlet of the blower 32 is connected to an air outlet 33 through a pipe. A detection mechanism includes an auxiliary detection component and a main detection component. The auxiliary detection component includes an adjusting frame 41, and a lifting component 42 is slidably connected to the surface of the adjusting frame 41. A screw is threadedly connected to the inside of the lifting component 42.

[0022] In this embodiment, a suitable placement plate is first selected according to the size and model of the IGBT substrate to be tested. The placement plate is installed above the drive block by docking the second sliding block with the second slide rail. Then, the position of the second sliding block is locked by locking screws. The IGBT substrate to be tested is then placed on the surface of the placement plate. The first motor of the conveying mechanism is started, and its shaft drives the drive roller to rotate. The drive roller drives the drive belt to move through surface friction. The drive block, which is fixed to the drive belt, moves synchronously. The first sliding block slides along the first slide rail to guide the drive block and prevent it from deviating. The placement plate is smoothly conveyed with the drive block to the pre-processing mechanism until the substrate is completely under the air blowing port. The blower of the pre-processing mechanism is started, and the airflow is delivered to the air blowing port through the pipe. The air blowing port sprays high-pressure airflow directionally onto the surface of the substrate to blow away residual flux, metal debris and other impurities, preventing impurities from being misjudged as solder layer voids in subsequent testing.

[0023] Example 2, as Figures 1-4As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the conveying mechanism further includes a drive block 25, the inner wall of the drive block 25 is fixedly connected to the surface of the drive belt 24, a first sliding block 26 is fixedly connected to one side of the drive block 25, a first slide rail 27 is slidably connected inside the first sliding block 26, one side of the first slide rail 27 is fixedly connected to one side of the mounting bracket 21, a second slide rail 28 is fixedly connected to the top of the drive block 25, a second sliding block 29 is slidably connected to the surface of the second slide rail 28, a placement plate 210 is fixedly connected to the top of the second sliding block 29, and a locking screw is provided inside the second sliding block 29.

[0024] In this embodiment, the first motor continues to operate, transporting the substrate to the main and auxiliary detection components of the detection mechanism. For areas such as substrate edges and corners that are prone to forming blind spots, the auxiliary detection component is adjusted first: the second motor is started, and its shaft drives the threaded rod to rotate. The lifting component, which is threaded to the threaded rod, slides along the surface of the adjustment frame to adjust the height of the auxiliary ultrasonic detection component containing the high-frequency ultrasonic probe and the receiving probe, so that it is flush with the height of the solder layer at the edge of the substrate. Then, the auxiliary ultrasonic detection component is manually rotated, and the angle of the auxiliary ultrasonic detection component is adjusted by utilizing the characteristic that "the friction between it and the lifting component is greater than its own weight" to align it with the solder layer area at the corner of the substrate. The angle can be kept stable without additional locking components.

[0025] Example 3, as Figures 1-4 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the auxiliary detection component further includes a second motor 43, one end of the shaft of the second motor 43 is fixedly connected to one end of the threaded rod, the surface of the second motor 43 is fixedly connected to the surface of the adjusting frame 41, the top of the lifting member 42 is rotatably connected to an auxiliary ultrasonic detection component 44, the auxiliary ultrasonic detection component 44 includes a high-frequency ultrasonic probe and a receiving probe, the friction between the auxiliary ultrasonic detection component 44 and the lifting member 42 is greater than the weight of the auxiliary ultrasonic detection component 44, the main detection component includes a fixed frame 45, the main ultrasonic detection component 46 is provided inside one end of the fixed frame 45, the main ultrasonic detection component 46 has the same structure as the auxiliary ultrasonic detection component 44, the bottom of the conveying mechanism is provided with an installation mechanism, the installation mechanism includes an installation platform 11 and a debris placement cavity 12, the top of the installation platform 11 is fixedly connected to the bottom of the installation frame 21, the support frame 31, the adjusting frame 41 and the fixed frame 45 respectively.

[0026] In this embodiment, by confirming that the probe of the main ultrasonic testing component of the main testing assembly is vertically aligned with the solder layer area on the front side of the substrate, a multi-angle testing layout of "front side + edge / corner" is formed. The main ultrasonic testing component and the auxiliary ultrasonic testing component are activated simultaneously: the main component emits high-frequency ultrasonic waves to the solder layer on the front side of the substrate, and the auxiliary component emits ultrasonic waves to the solder layers at the edges and corners. When the ultrasonic waves penetrate the solder layer, if there are void defects, some sound waves will be reflected by the voids. After the receiving probe captures the reflected signals, it converts the signals into electrical signals and transmits them to the external data processing system. The system identifies the location, size and number of voids by analyzing the time difference and amplitude changes of the signals, and determines whether the solder layer is qualified. During the testing process, the conveying mechanism remains stationary to ensure that the relative position of the probe and the substrate is stable and to avoid testing errors. After the testing is completed, the operator removes the substrate and stores it according to the test results to prepare for the next batch of substrate testing.

[0027] The working principle of this online detection device for solder layer voids in IGBT substrates will be explained in detail below.

[0028] like Figures 1-4As shown, firstly, a suitable placement plate is selected according to the size and model of the IGBT substrate to be tested. The placement plate is then installed above the drive block by aligning the second sliding block with the second slide rail. The position of the second sliding block is then locked with locking screws. Next, the IGBT substrate to be tested is placed on the surface of the placement plate. The first motor of the conveying mechanism is started, and its shaft drives the drive roller to rotate. The drive roller drives the drive belt to move through surface friction. The drive block, fixed to the drive belt, moves synchronously. The first sliding block slides along the first slide rail, providing guidance for the drive block and preventing deviation. The placement plate is smoothly conveyed to the pre-processing mechanism along with the drive block. Below, until the substrate is completely below the air inlet, the blower of the pretreatment mechanism is started. The airflow is delivered to the air inlet through the pipeline. The air inlet sprays high-pressure airflow directionally onto the substrate surface to blow away residual flux, metal debris, and other impurities, preventing impurities from being misjudged as solder layer voids during subsequent testing. After pretreatment, the first motor continues to run, conveying the substrate to the main and auxiliary testing components of the testing mechanism. For areas such as substrate edges and corners that are prone to forming blind spots, the auxiliary testing component is adjusted first: the second motor is started, and its shaft drives the threaded rod to rotate. The lifting component threaded to the threaded rod slides along the surface of the adjusting frame. First, adjust the height of the auxiliary ultrasonic testing component, which includes a high-frequency ultrasonic probe and a receiving probe, to align it with the height of the solder layer at the edge of the substrate. Then, manually rotate the auxiliary ultrasonic testing component, utilizing the characteristic that "friction between it and the lifting mechanism is greater than its own weight," to adjust the angle of the auxiliary ultrasonic testing component and align it with the solder layer area at the corner of the substrate. No additional locking mechanism is needed to maintain a stable angle. Simultaneously, confirm that the probe of the main ultrasonic testing component of the main testing component is vertically aligned with the solder layer area on the front of the substrate, forming a multi-angle testing layout of "front + edge / corner." Simultaneously start the main ultrasonic testing component and the auxiliary ultrasonic testing component: the main component moves towards the solder layer on the front of the substrate. The auxiliary component emits high-frequency ultrasonic waves towards the edge and corner solder layers. When the ultrasonic waves penetrate the solder layer, if there are voids or defects, some of the sound waves will be reflected by the voids. The receiving probe captures the reflected signals and converts them into electrical signals, which are then transmitted to an external data processing system. The system analyzes the time difference and amplitude changes of the signals to identify the location, size, and number of voids, and determines whether the solder layer is qualified. During the inspection, the conveying mechanism remains stationary to ensure that the relative position of the probe and the substrate is stable, avoiding inspection errors. After the inspection is completed, the operator removes the substrate and stores it according to the inspection results, preparing for the inspection of the next batch of substrates.

[0029] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. An online detection device for voids in the solder layer of an IGBT substrate, characterized in that: include The conveying mechanism includes a mounting frame (21), a first motor (22) is fixedly connected to the surface of the mounting frame (21), a drive roller (23) is fixedly connected to one end of the shaft of the first motor (22), and a drive belt (24) overlaps the surface of the drive roller (23). The pretreatment mechanism includes a support frame (31), a blower (32) is fixedly connected to the top of the support frame (31), and the air outlet of the blower (32) is connected to an air outlet (33) through a pipe. The testing mechanism includes an auxiliary testing component and a main testing component. The auxiliary testing component includes an adjustment frame (41). A lifting component (42) is slidably connected to the surface of the adjustment frame (41), and a screw is threadedly connected to the inside of the lifting component (42).

2. The online detection device for solder layer voids in IGBT substrates according to claim 1, characterized in that: The conveying mechanism further includes a drive block (25), the inner wall of which is fixedly connected to the surface of the drive belt (24), and a first sliding block (26) is fixedly connected to one side of the drive block (25).

3. The online detection device for solder layer voids in IGBT substrates according to claim 2, characterized in that: The first sliding block (26) has a first slide rail (27) slidably connected inside, and one side of the first slide rail (27) is fixedly connected to one side of the mounting bracket (21).

4. The online detection device for solder layer voids in IGBT substrates according to claim 3, characterized in that: The top of the drive block (25) is fixedly connected to a second slide rail (28), the surface of the second slide rail (28) is slidably connected to a second sliding block (29), the top of the second sliding block (29) is fixedly connected to a placement plate (210), and a locking screw is provided inside the second sliding block (29).

5. The online detection device for solder layer voids in an IGBT substrate according to claim 1, characterized in that: The auxiliary detection component also includes a second motor (43), one end of the shaft of the second motor (43) is fixedly connected to one end of the threaded rod, the surface of the second motor (43) is fixedly connected to the surface of the adjustment frame (41), and the top of the lifting component (42) is rotatably connected to an auxiliary ultrasonic detection component (44), the auxiliary ultrasonic detection component (44) includes a high-frequency ultrasonic probe and a receiving probe, and the friction between the auxiliary ultrasonic detection component (44) and the lifting component (42) is greater than the weight of the auxiliary ultrasonic detection component (44).

6. The online detection device for solder layer voids in IGBT substrates according to claim 5, characterized in that: The main detection component includes a mounting frame (45), and a main ultrasonic detection component (46) is disposed inside one end of the mounting frame (45). The main ultrasonic detection component (46) has the same structure as the auxiliary ultrasonic detection component (44).

7. The online detection device for solder layer voids in an IGBT substrate according to claim 1, characterized in that: The bottom of the conveying mechanism is provided with an installation mechanism, which includes an installation platform (11) and a debris placement cavity (12). The top of the installation platform (11) is fixedly connected to the bottom of the installation frame (21), the support frame (31), the adjustment frame (41), and the fixing frame (45), respectively.

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