Indenter structure and testing apparatus

Abstract

The application relates to a pressure head structure, comprising: a main body, which is internally provided with a heat exchange flow channel; a first pressure joint and a second pressure joint, which are both in heat conduction connection with the first end surface of the main body along a first direction and are located on the same side of the heat exchange flow channel along the first direction; the first pressure joint and the second pressure joint are arranged at intervals along a direction intersecting the first direction, and the projection of the heat exchange flow channel along the first direction intersects the first pressure joint and the second pressure joint, so that the heat exchange medium flowing in the heat exchange flow channel can conduct heat with the first pressure joint and the second pressure joint along the first direction; the first pressure joint and the part of the main body corresponding to the first pressure joint constitute a first heat transfer part, and the second pressure joint and the part of the main body corresponding to the second pressure joint constitute a second heat transfer part; the heat conduction thermal resistance of the first heat transfer part in the first direction is smaller than that of the second heat transfer part.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, specifically to a pressure head structure and a testing device. Background Technology

[0002] When testing electronic components such as chips, a pressure head structure is needed to press and control the temperature of the electronic components. Generally, the pressure head structure has a flow channel within it, through which the heat exchange medium flows and exchanges heat with the electronic components via the pressure surface of the pressure head structure, thereby controlling the temperature of the electronic components. In conventional technology, the pressure surface is a single plane, and the amount of heat (cold or hot) transferred to different areas of the electronic component is relatively uniform, which cannot meet the temperature control requirements of electronic components with different cooling needs in different areas. Utility Model Content

[0003] Therefore, it is necessary to provide a pressure head structure and testing device to address the problem that traditional pressure head structures cannot meet the temperature control requirements of electronic components with different heat exchange needs in different areas.

[0004] A pressure head structure, comprising:

[0005] The main body has heat exchange channels inside;

[0006] The first pressing part and the second pressing part are both thermally connected to the first end face of the main body along the first direction, and are located on the same side of the heat exchange channel along the first direction.

[0007] The first pressing part and the second pressing part are spaced apart from each other along a direction intersecting with the first direction. The projection of the heat exchange channel along the first direction intersects with both the first pressing part and the second pressing part, so that the heat exchange medium flowing through the heat exchange channel can conduct heat with the first pressing part and the second pressing part along the first direction.

[0008] The first pressing part and the portion of the main body corresponding to the first pressing part constitute a first heat transfer part, and the second pressing part and the portion of the main body corresponding to the second pressing part constitute a second heat transfer part; the thermal resistance of the first heat transfer part in the first direction is less than that of the second heat transfer part.

[0009] In one embodiment, the heat exchange channel includes a connecting hole and at least two channel layers arranged sequentially along the first direction, with each two adjacent channel layers connected through the connecting hole;

[0010] The heat exchange medium in at least one of the flow channel layers is capable of conducting heat with the first and second press-fit portions along the first direction.

[0011] In one embodiment, the main body includes at least two connecting parts arranged sequentially along the first direction and detachably connected to each other, and each connecting part has at least one flow channel layer.

[0012] In one embodiment, the projection of the flow channel layer closest to the first end face along the first direction intersects with the first pressing portion, so that the heat exchange medium flowing through it can conduct heat with the first pressing portion along the first direction.

[0013] The projection of at least one of the other flow channel layers along the first direction intersects with the second pressing portion, so that the heat exchange medium flowing through it can conduct heat with the second pressing portion along the first direction.

[0014] In one embodiment, the main body includes a body, a first mounting portion and a second mounting portion, the first mounting portion and the second mounting portion being spaced apart and mounted at one end of the body in the first direction, and the surfaces of the first mounting portion and the second mounting portion moving away from the body along the first direction together forming the first end face;

[0015] The first crimping part is installed on the first mounting part, the second crimping part is installed on the second mounting part, the flow channel layer closest to the first end face along the first direction is disposed in the first mounting part, and the other flow channel layers are disposed in the body;

[0016] The first pressing part and the first mounting part constitute the first heat transfer part, and the second pressing part, the second mounting part, and the part of the body corresponding to the second pressing part constitute the second heat transfer part.

[0017] In one embodiment, the projection of the flow channel layer closest to the first end face along the first direction intersects with both the first and second pressing portions, so that the heat exchange medium flowing through it can conduct heat with the first and second pressing portions along the first direction.

[0018] The second heat transfer section includes a heat-insulating element, which is disposed between the heat exchange channel and the second pressing section along the first direction.

[0019] In one embodiment, the body includes a first part and a second part connected to each other along the first direction, the cross-sectional area of ​​the second part being smaller than that of the first part, and the surface of the second part facing away from the first part along the first direction forming the first end face;

[0020] The flow channel layer closest to the first end face along the first direction is located within the second portion.

[0021] In one embodiment, the pressure head structure includes at least two second pressing portions, which are sequentially spaced apart from each other on the periphery of the first pressing portion.

[0022] In one embodiment, the first crimping portion and / or the second crimping portion are detachably connected to the body;

[0023] and / or

[0024] Heating elements are provided on the first crimping part and the second crimping part.

[0025] A testing device, characterized by the aforementioned pressure head structure.

[0026] In the aforementioned pressure head structure and testing device, the first and second pressing parts respectively press the first and second regions of the electronic component, with the power of the first region being greater than that of the second region. Because the first and second pressing parts are spaced apart, and the thermal resistance of the first heat transfer part in the first direction is less than that of the second heat transfer part, the first heat transfer part can conduct more heat to the first region, while the second heat transfer part conducts less heat to the second region. This satisfies the requirement of the high-power first region for more heat transfer (e.g., cooling) and the requirement of the lower-power second region for less heat transfer (e.g., cooling). Compared to the existing technology of pressing electronic components onto a single plane (where the heat transferred to each region of the electronic component is relatively uniform, easily leading to insufficient heat transfer in high-power regions and excessive heat transfer in low-power regions, resulting in poor temperature control), this method transfers heat according to the different heat transfer requirements of each region of the electronic component. This not only ensures sufficient heat transfer in high-power regions but also prevents excessive heat transfer in low-power regions, thus guaranteeing effective temperature control of the electronic component. Attached Figure Description

[0027] Figure 1 This is a structural diagram of a pressure head structure provided in an embodiment of this application;

[0028] Figure 2 for Figure 1 A partial exploded view of the pressure head structure shown;

[0029] Figure 3 for Figure 1 Exploded view of the pressure head structure shown ( Figure 3 (The image shows the heat exchange channels inside the pressure head structure).

[0030] Figure 4 for Figure 1 The diagram shows the heat transfer path in the heat exchange channel of the pressure head structure shown.

[0031] Figure 5 for Figure 4 A top view of the pressure head structure shown;

[0032] Figure 6 for Figure 1 Another exploded view of the pressure head structure shown;

[0033] Figure 7 This is a structural diagram of a pressure head structure provided in another embodiment of this application;

[0034] Figure 8 for Figure 7 Another structural view of the pressure head structure shown ( Figure 8 (The image shows the heat exchange channels inside the pressure head structure).

[0035] Figure 9 for Figure 7 A top view of the pressure head structure shown;

[0036] Figure 10 for Figure 7 The image shows a bottom view of the pressure head structure.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100. Pressure head structure; 10. Main body; 11. Heat exchange channel; 111. Channel layer; 112. Connecting hole; 113. Inlet; 114. Outlet; 12. Connecting part; 13. Body; 14. First mounting part; 15. Second mounting part; 16. Heat insulation component; 17. First part; 18. Second part; 19. First end face; 20. First pressing part; 30. Second pressing part. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] See Figure 1 One embodiment of this application provides a pressure head structure 100 for pressing electronic components to control their temperature, thereby facilitating performance testing of the electronic components. Optionally, the electronic component pressed by the pressure head structure 100 is a chip. Of course, in other embodiments, the type of electronic component pressed by the pressure head structure 100 is not limited.

[0046] See Figures 1-3 The pressure head structure 100 includes a main body 10, a first pressing part 20, and a second pressing part 30. The main body 10 has a heat exchange channel 11, and the main body 10 is arranged along a first direction (…). Figure 1 One end (in the Z-direction) forms a first end face 19. Both the first pressing portion 20 and the second pressing portion 30 are thermally connected to the first end face 19 and are located on the same side of the heat exchange channel 11 along the first direction. (See reference...) Figure 4 and Figure 5 The projection of the heat exchange channel 11 along the first direction intersects both the first pressing portion 20 and the second pressing portion 30, enabling the heat exchange medium flowing through the heat exchange channel 11 to conduct heat with the first pressing portion 20 and the second pressing portion 30 along the first direction. That is, the cold or heat energy of the heat exchange medium flowing through the heat exchange channel 11 can be conducted to the first pressing portion 20 and the second pressing portion 30 along the first direction. Cold or heat energy is a physical quantity of energy transfer between objects, used to measure the amount of heat absorbed or released by an object.

[0047] The first pressing part 20 and the second pressing part 30 are used to press the electronic components to conduct cold or heat to the electronic components for temperature control. The electronic components have a first region and a second region. The power of the first region is greater than that of the second region. The first pressing part 20 is used to press the first region, and the second pressing part 30 is used to press the second region. During temperature control, the first region, with its higher power, requires more heat than the second region, with its lower power. In some embodiments, the electronic components are chip-type chips. Chiplet-type chips are generally composed of small chips to form a large chip, which is divided into multiple regions, generally an AIDie region, an I / O Die region, and a PFM Die region. The chip power of each region is different. The AIDie region is called the main Die region, and the others are called secondary Die regions. The main Die region corresponds to the first region, and the secondary Die regions correspond to the second region.

[0048] Generally, the heat exchange medium flowing in the heat exchange channel 11 is a cooling medium. After the cooling medium conducts heat with the first pressing part 20 and the second pressing part 30 along the first direction, the temperature of the first pressing part 20 and the second pressing part 30 can be reduced, thereby controlling the temperature of the electronic components. Furthermore, the first pressing part 20 and the second pressing part 30 are provided with heating elements, and the temperature of the first pressing part 20 and the second pressing part 30 is controlled by the contrast between hot and cold, thereby controlling the temperature of the electronic components.

[0049] Further reading Figures 2-4 The first pressing portion 20 and the second pressing portion 30 are spaced apart from each other along a direction intersecting the first direction. The main body 10 has a portion corresponding to the first pressing portion 20 and a portion corresponding to the second pressing portion 30. The first pressing portion 20 is connected to the main body 10 along the first direction to its corresponding portion, and the second pressing portion 30 is connected to the main body 10 along the first direction to its corresponding portion. The first pressing portion 20 and the portion of the main body 10 corresponding to the first pressing portion 20 constitute the first heat transfer portion, and the second pressing portion 30 and the portion of the main body 10 corresponding to the second pressing portion 30 constitute the second heat transfer portion. The thermal resistance of the first heat transfer portion in the first direction is less than that of the second heat transfer portion.

[0050] Thermal resistance refers to the resistance encountered when heat is transferred through conduction within an object. It is determined by the direction of heat conduction, the thickness along that direction, the cross-sectional area perpendicular to the direction of heat conduction, and the thermal conductivity. The formula is Δx / (kA), where Δx is the thickness, A is the cross-sectional area, and k is the thermal conductivity. A higher thermal resistance along a particular direction of heat conduction indicates a greater resistance to heat flow and a lower heat transfer capacity in that direction.

[0051] Since the first pressing part 20 and the second pressing part 30 are spaced apart from each other, there is no heat conduction between the first pressing part 20 and the second pressing part 30. Also, since the thermal resistance of the first heat transfer part in the first direction is less than that of the second heat transfer part, the heat transfer capacity of the first heat transfer part in the first direction is greater than that of the second heat transfer part in the first direction.

[0052] The pressure head structure 100 provided in this embodiment of the application has a first pressing part 20 and a second pressing part 30 pressing the first and second regions of the electronic component, respectively. This embodiment uses the example where the power of the first region is greater than that of the second region. In other embodiments, the thermal resistance of each heat transfer part can be adjusted according to the different power of the specific regions of the electronic component. Since the first pressing part 20 and the second pressing part 30 are spaced apart, and the thermal resistance of the first heat transfer part in the first direction is less than that of the second heat transfer part, the first heat transfer part can conduct more heat to the first region, while the second heat transfer part conducts less heat to the second region. This satisfies the requirement of the high-power first region to receive more heat and the requirement of the lower-power second region to receive less heat. Compared to the existing technology of pressing electronic components onto a single plane (where the heat transferred to each area of ​​the electronic component is relatively uniform, which can easily lead to insufficient heat in high-power areas and excessive heat in low-power areas, resulting in poor temperature control), this method transfers heat according to the different heat requirements of each area of ​​the electronic component. This not only ensures sufficient heat in high-power areas but also prevents excessive heat in low-power areas, thereby guaranteeing effective temperature control of the electronic components.

[0053] Specifically, when the pressure head structure 100 is used to press a chiplet-type chip, the first pressing part 20 presses the main die area, and the second pressing part 30 presses the secondary die area. Since the thermal resistance of the first heat transfer part is less than that of the second heat transfer part, the first heat transfer part can conduct more cooling energy (cooling energy is the heat absorbed by a low-temperature object from the object or space it is cooling) to the main die area, thereby preventing the main die area from getting too hot. The second heat transfer part can conduct less cooling energy to the secondary die area, thereby preventing the secondary die area from getting too cold.

[0054] Optionally, see Figure 4 The pressure head structure 100 includes at least two second pressing portions 30, which are sequentially spaced apart from the periphery of the first pressing portion 20. This is to accommodate cases where electronic components have multiple second regions.

[0055] In some embodiments, the pressure head structure 100 includes two second pressing portions 30, which are spaced apart on both sides of the first pressing portion 20 along a second direction intersecting the first direction. In other embodiments, the pressure head structure 100 includes four second pressing portions 30, with two second pressing portions 30 spaced apart on both sides of the first pressing portion 20 along a second direction, and the other two second pressing portions 30 spaced apart on both sides of the first pressing portion 20 along a third direction intersecting both the first and second directions.

[0056] It is conceivable that in some other embodiments, the number of second pressing portions 30 included in the pressing head structure 100 is not limited. Of course, in some other embodiments, the pressing head structure 100 may also include multiple first pressing portions 20, which is not limited here.

[0057] In some embodiments, see Figure 3 and Figure 6 The heat exchange channel 11 includes a connecting hole 112 and at least two channel layers 111 arranged sequentially along a first direction, with each pair of adjacent channel layers 111 connected through the connecting hole 112. The heat exchange medium in at least one channel layer 111 can conduct heat with the first pressing portion 20 and the second pressing portion 30 along the first direction. The inlet 113 and outlet 114 of the heat exchange channel 11 are connected to the channel layer 111 furthest from the first pressing portion 20 and the second pressing portion 30 along the first direction.

[0058] By setting the heat exchange channel 11 to include at least two channel layers 111 arranged sequentially along the first direction, the distance between at least a portion of the channel layer 111 and the first pressing part 20 and the second pressing part 30 along the first direction is not too large, thus ensuring the heat transfer effect between the heat exchange medium in the heat exchange channel 11 and the first pressing part 20 and the second pressing part 30 along the first direction.

[0059] Further reading Figure 3 and Figure 6 The main body 10 includes at least two layers of connecting portions 12 arranged sequentially along a first direction. Each connecting portion 12 has at least one flow channel layer 111. A connecting hole 112 can be formed on one of two adjacent connecting portions 12, or a connecting hole 112 can be formed on both adjacent connecting portions 12. Each pair of adjacent connecting portions 12 is detachably connected, facilitating the replacement of connecting portions 12 with different height dimensions in the first direction, thereby facilitating the adjustment of the overall height of the pressure head structure 100 in the first direction. Furthermore, the position of the flow channel layer 111 in the first direction can be set differently for different connecting portions 12. By replacing different connecting portions 12, the position of the flow channel layer 111 in the first direction can also be adjusted to adapt to different working conditions.

[0060] In some specific embodiments, the main body 10 includes two connecting portions 12, each connecting portion 12 containing a flow channel layer 111. This simplifies the structural design of the main body 10 and facilitates the creation of the heat exchange flow channels 11. It is conceivable that in other embodiments, the number of connecting portions 12 included in the main body 10 and the number of flow channel layers 111 contained in each connecting portion 12 are not limited. For example, the main body 10 may also include three connecting portions 12, each connecting portion 12 containing two flow channel layers 111.

[0061] Furthermore, the first crimping part 20 and the second crimping part 30 are detachably connected to the main body 10, so as to facilitate the replacement of different first crimping parts 20 and second crimping parts 30 to meet different crimping conditions.

[0062] In some embodiments, see Figure 4 The projection of the flow channel layer 111, which is closest to the first end face 19 along the first direction, intersects with the first pressing part 20, so that the heat exchange medium flowing through it can conduct heat with the first pressing part 20 along the first direction (the thick black arrow in the middle represents...). Figure 4 The heat exchange medium in the middle and lower flow channel layer 111 can transfer heat to the first pressing portion 20 along the first direction. At least one other flow channel layer 111 (excluding the flow channel layer 111 closest to the first end face 19 along the first direction) has its projection along the first direction intersect with the second pressing portion 30, so that the heat exchange medium flowing through it can conduct heat with the second pressing portion 30 along the first direction (represented by the thick black arrows on the left and right sides). Figure 4 The heat exchange medium in the upper and middle flow channel layer 111 can transfer heat along the first direction to the second pressing parts 30 on both sides.

[0063] Since thermal resistance is related to thickness, cross-sectional area and thermal conductivity, when the first pressing part 20 exchanges heat with the heat exchange medium in the flow channel layer 111 closest to the first end face 19, while the second pressing part 30 exchanges heat with the heat exchange medium in at least one other flow channel layer 111, it is equivalent to the first pressing part 20 being closer to the flow channel layer 111 than the second pressing part 30. That is, the thickness between the first pressing part 20 and the flow channel layer 111 is less than the thickness between the second pressing part 30 and the flow channel layer 111. A smaller thickness results in a smaller thermal resistance, which is beneficial for more heat to be conducted from the first heat transfer part to the first region and less heat to be conducted from the second heat transfer part to the second region.

[0064] See Figure 2 The main body 10 includes a body 13, a first mounting portion 14, and a second mounting portion 15. The first mounting portion 14 and the second mounting portion 15 are spaced apart and mounted at one end of the body 13 in a first direction. The surfaces of the first mounting portion 14 and the second mounting portion 15, along the first direction away from the body 13, together form a first end face 19. A first crimping portion 20 is mounted on the first mounting portion 14, and a second crimping portion 30 is mounted on the second mounting portion 15. The flow channel layer 111 closest to the first end face 19 along the first direction is disposed in the first mounting portion 14, and other flow channel layers 111 are disposed in the body 13. The first crimping portion 20 and the first mounting portion 14 constitute a first heat transfer section, and the second crimping portion 30, the second mounting portion 15, and the portion of the body 13 corresponding to the second crimping portion 30 constitute a second heat transfer section.

[0065] In the above configuration, the first mounting portion 14 and the second mounting portion 15 are spaced apart, and the flow channel layer 111 closest to the first end face 19 along the first direction is located in the first mounting portion 14. This ensures that the heat exchange medium in the flow channel layer 111 closest to the first end face 19 along the first direction is only transferred to the first pressing portion 20 through the first mounting portion 14, and is not transferred to the second pressing portion 30 through the second mounting portion 15 which is spaced apart from the first mounting portion 14, so as to control the heat conducted to the first and second regions.

[0066] In some embodiments, see Figure 7 The main body 10 includes a first part 17 and a second part 18 connected to each other along a first direction. The cross-sectional area of ​​the second part 18 is smaller than that of the first part 17. The surface of the second part 18 facing away from the first part 17 along the first direction forms a first end face 19. The flow channel layer 111 closest to the first end face 19 along the first direction is disposed in the second part 18. Thus, the main body 10 has a stepped structure that is thicker at one end and thinner at the other, which facilitates the thinner end to be inserted into the test socket, and the thicker end to cooperate with the test socket to form a test space.

[0067] Specifically, the body 13 forms a first part 17, and the first mounting part 14 and the second mounting part 15 together form a second part 18. The first part 17 includes at least one layer of connecting part 12, and the remaining connecting parts 12 are formed through the second part 18 or through the first part 17 and the second part 18 together.

[0068] Furthermore, a flow channel layer 111 is provided inside the main body 13, and the heat exchange medium in the flow channel layer 111 exchanges heat with the second pressing part 30 through the main body 13 and the second mounting part 15.

[0069] In other embodiments, see Figures 8-10 The projection of the flow channel layer 111 closest to the first end face 19 along the first direction intersects with both the first pressing part 20 and the second pressing part 30, so that the heat exchange medium inside can conduct heat with the first pressing part 20 and the second pressing part 30 along the first direction. Figure 8 The middle arrow indicates that the heat exchange medium in the lower flow channel layer 111 can transfer heat to the first pressing part 20 and the second pressing part 30. (See also...) Figure 7 The second heat transfer section also includes a heat-insulating element 16, which is disposed between the heat exchange channel 11 and the second pressing section 30 along the first direction.

[0070] Since the first pressing part 20 and the second pressing part 30 exchange heat with the heat exchange medium in the same flow channel layer 111, it is equivalent to the first pressing part 20 and the second pressing part 30 having the same thickness along the first direction from the flow channel layer 111. The thermal conductivity of the heat-insulating element 16 is relatively low (e.g., the heat-insulating element 16 is made of iron, and the other parts of the second heat transfer part are made of copper), which will increase the thermal resistance. This makes the thermal resistance of the first heat transfer part less than that of the second heat transfer part, which is beneficial for more heat to be conducted from the first heat transfer part to the first region and less heat to be conducted from the second heat transfer part to the second region.

[0071] Since both the first pressing part 20 and the second pressing part 30 conduct heat to the heat exchange medium of the flow channel layer 111 closest to the first end face 19, in order to reduce the heat transfer between the heat exchange medium in other flow channel layers 111 and the first pressing part 20 and the second pressing part 30, the part of the main body 10 with other flow channel layers 111 can be made of a material with poor thermal conductivity and lighter weight (such as bakelite), thereby achieving a lightweight press head structure 100.

[0072] Since thermal resistance is related to both thickness and thermal conductivity, as well as cross-sectional area, a larger cross-sectional area results in lower thermal resistance. Furthermore, the thermal resistance of the first heat transfer section can be reduced to be less than that of the second heat transfer section by changing the cross-sectional areas of the first and second heat transfer sections. For example, in some embodiments, when both the first pressing section 20 and the second pressing section 30 conduct heat with the heat exchange medium of the flow channel layer 111 closest to the first end face 19 along the first direction, the cross-sectional area of ​​the first mounting section 14 is set to be larger than that of the second mounting section 15, and the cross-sectional area of ​​the first pressing section 20 is set to be larger than that of the second pressing section 30, so that the thermal resistance of the first heat transfer section is less than that of the second heat transfer section.

[0073] Another embodiment of this application also provides a testing apparatus, which includes the aforementioned indenter structure 100. Since the indenter structure 100 has beneficial effects, the testing apparatus including the indenter structure 100 has the same beneficial effects, and will not be described again here.

[0074] Furthermore, the testing apparatus also includes a test stand with a test cavity, into which at least a portion of the pressure head structure 100 extends to press against electronic components.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A pressure head structure, characterized in that, include: The main body (10) has a heat exchange channel (11) inside; The first crimping part (20) and the second crimping part (30) are both thermally connected to the first end face (19) of the main body (10) along the first direction, and are located on the same side of the heat exchange channel (11) along the first direction; The first pressing part (20) and the second pressing part (30) are spaced apart from each other along a direction intersecting the first direction. The projection of the heat exchange channel (11) along the first direction intersects both the first pressing part (20) and the second pressing part (30), so that the heat exchange medium flowing through the heat exchange channel (11) can conduct heat with the first pressing part (20) and the second pressing part (30) along the first direction. The first pressing part (20) and the portion of the main body (10) corresponding to the first pressing part (20) constitute a first heat transfer part, and the second pressing part (30) and the portion of the main body (10) corresponding to the second pressing part (30) constitute a second heat transfer part; the thermal resistance of the first heat transfer part in the first direction is less than that of the second heat transfer part.

2. The pressure head structure according to claim 1, characterized in that, The heat exchange channel (11) includes a connecting hole (112) and at least two channel layers (111) arranged sequentially along the first direction, with each two adjacent channel layers (111) connected through the connecting hole (112); The heat exchange medium in at least one of the flow channel layers (111) is able to conduct heat with the first press-fit portion (20) and the second press-fit portion (30) along the first direction.

3. The pressure head structure according to claim 2, characterized in that, The main body (10) includes at least two connecting parts (12) arranged sequentially along the first direction and detachably connected to each other, and each connecting part (12) has at least one flow channel layer (111).

4. The pressure head structure according to claim 2, characterized in that, The projection of the flow channel layer (111) closest to the first end face (19) along the first direction intersects with the first pressing part (20) so that the heat exchange medium flowing through it can conduct heat with the first pressing part (20) along the first direction. The projection of at least one of the other flow channel layers (111) along the first direction intersects with the second crimp portion (30), so that the heat exchange medium flowing through it can conduct heat with the second crimp portion (30) along the first direction.

5. The pressure head structure according to claim 4, characterized in that, The main body (10) includes a body (13), a first mounting part (14) and a second mounting part (15). The first mounting part (14) and the second mounting part (15) are spaced apart and mounted at one end of the body (13) in the first direction. The first mounting part (14) and the second mounting part (15) together form the first end face (19) along the surface of the first mounting part (14) away from the body (13) in the first direction. The first crimping part (20) is installed on the first mounting part (14), the second crimping part (30) is installed on the second mounting part (15), the flow channel layer (111) closest to the first end face (19) along the first direction is provided in the first mounting part (14), and the other flow channel layers (111) are provided in the body (13); The first crimping part (20) and the first mounting part (14) constitute the first heat transfer part, and the second crimping part (30), the second mounting part (15) and the body (13) corresponding to the second crimping part (30) constitute the second heat transfer part.

6. The pressure head structure according to claim 2, characterized in that, The projection of the flow channel layer (111) closest to the first end face (19) along the first direction intersects with both the first crimping part (20) and the second crimping part (30), so that the heat exchange medium flowing through it can conduct heat with the first crimping part (20) and the second crimping part (30) along the first direction. The second heat transfer part includes a heat-insulating member (16), which is disposed between the heat exchange channel (11) and the second pressing part (30) along the first direction.

7. The pressure head structure according to any one of claims 4-6, characterized in that, The main body (10) includes a first part (17) and a second part (18) connected to each other along the first direction. The cross-sectional area of ​​the second part (18) is smaller than that of the first part (17). The surface of the second part (18) facing away from the first part (17) along the first direction forms the first end face (19). The flow channel layer (111) closest to the first end face (19) along the first direction is located in the second part (18).

8. The pressure head structure according to claim 1, characterized in that, The pressure head structure includes at least two second pressing parts (30), and the at least two second pressing parts (30) are sequentially spaced apart from each other on the periphery of the first pressing part (20).

9. The pressure head structure according to claim 1, characterized in that, The first crimping part (20) and / or the second crimping part (30) are detachably connected to the main body (10); and / or Heating elements are provided on the first crimping part (20) and the second crimping part (30).

10. A testing apparatus, characterized in that, Including the pressure head structure as described in any one of claims 1-9.

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