A top surface testing device for a motherboard

Abstract

The utility model discloses a top testing device of mainboard, including the fixture for bearing and positioning mainboard and the top testing mechanism for realizing and mainboard connection from mainboard top, the top testing mechanism includes the riser, sets up the top joint module at the top of fixture and is used for driving top joint module and mainboard connection's top wiring drive module, top joint module, top wiring drive module is connected with riser respectively, top wiring drive module realizes the lifting movement through the riser drive top joint module. The utility model makes the test line integrated on top joint module can be connected to mainboard simultaneously once, improves production efficiency, guarantees the yield of product, and saves manual cost.

Description

Technical Field

[0001] This utility model relates to the field of motherboard testing automation technology, and in particular to a motherboard top surface testing device. Background Technology

[0002] Current motherboard testing primarily relies on manual operation, requiring staff to manually connect test cables, such as the CPU cooler fan cable, to the motherboard one by one. Manual motherboard testing presents the following problems:

[0003] 1) Low production efficiency: Manually plugging and unplugging test lines one by one is time-consuming and cannot meet the testing efficiency requirements of mass production.

[0004] 2) High labor costs: A tester can usually only operate one motherboard at a time, which is labor-intensive and has low manpower utilization.

[0005] Therefore, there is an urgent need for a motherboard testing device that can achieve automated connection and is stable and reliable, in order to solve the problems of low efficiency and high labor costs. Utility Model Content

[0006] The purpose of this invention is to provide a top-side testing device for a motherboard, which allows the test lines integrated on the top-side connector module to be connected to the motherboard simultaneously at one time, thereby improving production efficiency, ensuring product yield, and saving labor costs.

[0007] To achieve the above objectives, the following technical solution is adopted:

[0008] A motherboard top surface testing device includes a fixture for supporting and positioning the motherboard, and a top surface testing mechanism for connecting to the motherboard from the top surface. The top surface testing mechanism includes a lifting frame, a top surface connector module disposed above the fixture, and a top surface wiring drive module for driving the top surface connector module to connect to the motherboard. The top surface connector module and the top surface wiring drive module are respectively connected to the lifting frame. The top surface wiring drive module drives the top surface connector module to achieve lifting and lowering movement via the lifting frame.

[0009] Preferably, the lifting frame includes a top frame and a bottom plate arranged in parallel, a plurality of guide rods connected between the top frame and the bottom plate, and a guide sleeve slidably connected to each guide rod; the top surface connector module is installed on the top frame, and the top surface wiring drive module is installed on the bottom plate.

[0010] Preferably, the top frame has a U-shaped structure, including a horizontal frame plate and two vertical frame plates; a groove is formed on the inner sidewall of each vertical frame plate along its length, and a plurality of first insertion holes are respectively formed at the top and bottom of the groove at both ends of the vertical frame plate; a connecting rod is provided on each of the opposite sides of the top surface connector module; the end of the connecting rod is inserted into the groove, and a second insertion hole is formed at each end of the connecting rod; the connecting rod is detachably connected to the vertical frame plate by a pin, and the pin passes through the first insertion hole and the second insertion hole.

[0011] Preferably, the top surface wiring drive module includes a top surface wiring drive component and a lead screw assembly connected to the power output end of the top surface wiring drive component; the lead screw assembly is connected to the lifting frame; the top surface wiring drive component is used to drive the lifting frame to achieve lifting movement via the lead screw assembly.

[0012] Preferably, the lead screw assembly includes a lead screw connected to the power output end of the top surface wiring drive component, and a lead nut connected to the base plate.

[0013] Preferably, the top surface wiring drive component is a servo motor.

[0014] Preferably, a positioning cylinder is provided at the top of each of the two opposite corners of the fixture, and a positioning post is provided at the bottom of the top surface connector module corresponding to each positioning cylinder.

[0015] By adopting the above solution, the beneficial effects of this utility model are:

[0016] This invention provides a top-side testing device for a motherboard, which integrates the test lines that need to be connected to the motherboard onto the top-side connector module. The top-side connector module is automatically connected to the motherboard by a top-side wiring drive module, so that the test lines integrated on the top-side connector module can be connected to the motherboard at the same time, which improves production efficiency, ensures product yield, and saves labor costs. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present utility model;

[0018] Figure 2 This is a perspective view of the top surface testing mechanism of this utility model;

[0019] Figure 3 This is a perspective view of the lifting frame of this utility model;

[0020] Figure 4 This is an exploded view of the top frame, connecting rod, and top surface connector module of this utility model;

[0021] The following are explanations of the labels in the attached diagram:

[0022] 1—Jig, 2—Lifting frame,

[0023] 3—Top surface connector module; 4—Top surface wiring drive module.

[0024] 5—Positioning cylinder, 6—Positioning pin,

[0025] 7—Motherboard, 21—Top frame,

[0026] 22—Base plate, 23—Guide rod,

[0027] 24—Guide sleeve, 25—Connecting rod,

[0028] 26—Pin; 41—Top surface wiring drive component;

[0029] 42—Screw assembly, 211—Horizontal frame plate,

[0030] 212—Vertical frame plate, 213—Slide groove,

[0031] 214—First socket, 251—Second socket. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0035] Reference Figures 1 to 4As shown, this utility model provides a top surface testing device for a motherboard, including a fixture 1 for supporting and positioning a motherboard 7, and a top surface testing mechanism for connecting to the motherboard 7 from the top surface; the top surface testing mechanism includes a lifting frame 2, a top surface connector module 3 disposed above the fixture 1, and a top surface wiring drive module 4 for driving the top surface connector module 3 to connect with the motherboard 7; the top surface connector module 3 and the top surface wiring drive module 4 are respectively connected to the lifting frame 2; the top surface wiring drive module 4 drives the top surface connector module 3 to achieve lifting and lowering movement via the lifting frame 2.

[0036] The lifting frame 2 includes a top frame 21 and a bottom plate 22 arranged in parallel, a number of guide rods 23 connected between the top frame 21 and the bottom plate 22, and a guide sleeve 24 slidably connected to each guide rod 23; the top surface connector module 3 is installed on the top frame 21, and the top surface wiring drive module 4 is installed on the bottom plate 22. The smooth lifting and lowering of the top surface connector module 3 is ensured by the cooperation of the guide rods 23 and the guide sleeves 24.

[0037] The top frame 21 has a U-shaped structure, including a horizontal frame plate 211 and two vertical frame plates 212. Each vertical frame plate 212 has a groove 213 along its length on its inner sidewall, and the top and bottom of the groove 213 are respectively provided with several first insertion holes 214 at both ends of the vertical frame plate 212. A connecting rod 25 is provided on each opposite side of the top connector module 3. The end of the connecting rod 25 is inserted into the groove 213, and each end of the connecting rod 25 is provided with a second insertion hole 251. The connecting rod 25 is detachably connected to the vertical frame plate 212 via a pin 26, and the pin 26 passes through both the first insertion hole 214 and the second insertion hole 251. By providing several first insertion holes 214, the installation requirements of top connector modules 3 of different sizes and installation positions can be accommodated. The top connector module 3 is detachably connected to the top frame 21 via the pin 26, allowing for quick switching of the top connector module 3 according to the needs of different motherboard 7 products.

[0038] The top-side wiring drive module 4 includes a top-side wiring drive component 41 and a lead screw assembly 42 connected to the power output end of the top-side wiring drive component 41. The lead screw assembly 42 is connected to the lifting frame 2. The top-side wiring drive component 41 is used to drive the lifting frame 2 to achieve lifting movement via the lead screw assembly 42. Specifically, the top-side wiring drive component 41 is a servo motor. The lead screw assembly 42 includes a lead screw connected to the power output end of the top-side wiring drive component 41 and a lead screw nut connected to the base plate 22.

[0039] Furthermore, the fixture 1 has a rectangular structure, and a positioning cylinder 5 is provided at the top of each of the two opposite corners of the fixture 1. A positioning post 6 is provided at the bottom of the top surface connector module 3 corresponding to each positioning cylinder 5. By setting the positioning cylinder 5 and the positioning post 6 to cooperate, the top surface connector module 3 can be connected to the main board 7 more accurately.

[0040] Furthermore, the motherboard top surface testing device provided by this utility model also includes a frame. The lifting frame 2 passes through the top plate of the frame, such that the top surface connector module 3 is located above the top plate of the frame, and the top surface wiring drive module 4 is located below the top plate of the frame. Further, the guide sleeve 24 is fixedly installed on the top plate surface of the frame. When the top surface wiring drive module 4 drives the lifting frame 2 to move up and down, the guide rod 23 slides relative to the guide sleeve 24.

[0041] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the utility model and are not intended to limit the implementation of this utility model. For those skilled in the art, various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A motherboard top surface testing device, characterized in that, The device includes a fixture for supporting and positioning the motherboard, and a top surface testing mechanism for connecting to the motherboard from its top surface. The top surface testing mechanism includes a lifting frame, a top surface connector module located above the fixture, and a top surface wiring drive module for driving the top surface connector module to connect to the motherboard. The top surface connector module and the top surface wiring drive module are respectively connected to the lifting frame. The top surface wiring drive module drives the top surface connector module to achieve lifting and lowering movement via the lifting frame.

2. The motherboard top surface testing device according to claim 1, characterized in that, The lifting frame includes a top frame and a bottom plate arranged in parallel, several guide rods connected between the top frame and the bottom plate, and a guide sleeve slidably connected to each guide rod; the top surface connector module is installed on the top frame, and the top surface wiring drive module is installed on the bottom plate.

3. The motherboard top surface testing device according to claim 2, characterized in that, The top frame has a U-shaped structure, including a horizontal frame plate and two vertical frame plates; each vertical frame plate has a groove along its length on its inner sidewall, and the top and bottom of the groove are respectively provided with several first insertion holes at both ends of the vertical frame plate; each side of the top surface connector module is provided with a connecting rod; the end of the connecting rod is inserted into the groove, and each end of the connecting rod is provided with a second insertion hole; the connecting rod and the vertical frame plate are detachably connected by a pin, and the pin passes through the first insertion hole and the second insertion hole.

4. The motherboard top surface testing device according to claim 2, characterized in that, The top-side wiring drive module includes a top-side wiring drive component and a lead screw assembly connected to the power output end of the top-side wiring drive component; the lead screw assembly is connected to the lifting frame; the top-side wiring drive component is used to drive the lifting frame to achieve lifting movement via the lead screw assembly.

5. The motherboard top surface testing device according to claim 4, characterized in that, The lead screw assembly includes a lead screw connected to the power output end of the top-mounted drive component and a lead nut connected to the base plate.

6. The motherboard top surface testing device according to claim 4, characterized in that, The top-mounted wiring drive uses a servo motor.

7. The motherboard top surface testing device according to claim 1, characterized in that, The fixture has a positioning cylinder at each of its two opposite corners, and a positioning post at the bottom of the top surface connector module corresponding to each positioning cylinder.

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