Floating press integrated circuit test probe connector

Abstract

The utility model is suitable for circuit test technical field provides floating press together integrated circuit test probe connecting seat, include: connecting base, press together top seat, press together top seat setting is in the upper of connecting base, gas bearing mechanism, gas bearing mechanism setting is in the outside of connecting base, gas bearing mechanism is used for the integrated circuit that waits for testing to suspend and lift upward, through setting up gas bearing mechanism, when the gas that contains box inside is full of stable pressure, these gases will pass all shower nozzles vertically upward, synchronous injection, the airflow that sprays gathers below integrated circuit chip, forms a layer of even airflow that has specific rigidity and bearing capacity, the upward thrust that this layer of airflow produces can accurately overcome the gravity of chip itself, and it is stably lifted upward, makes it suspend in a predetermined height, realizes the non - contact type support with below mechanical structure, thereby reduced the possibility of mechanical damage.

Description

Technical Field

[0001] This utility model belongs to the field of circuit testing technology, and in particular relates to a floating press-fit integrated circuit test probe connector. Background Technology

[0002] With the rapid development of information technology, integrated circuits, as the core components of modern electronic devices, are facing increasingly higher requirements in terms of integration, complexity, and performance. In order to ensure that the functions and performance of integrated circuits meet design standards, rigorous and efficient electrical testing must be carried out in all aspects of chip manufacturing, packaging, and application. In this process, the test probe connector plays a crucial role. It is the key bridge connecting the test equipment and the integrated circuit under test, and its performance directly determines the accuracy, stability, and efficiency of the test.

[0003] Chinese patent CN111721981A discloses a floating probe mechanism. The patent states that "the probe assembly includes a circuit board and several probes mounted on the circuit board. The floating probe mechanism also includes a base and a floating structure. The floating structure includes a probe plate assembly, anti-loosening screws, and an elastic component. The probe plate assembly is movably mounted on the base via the anti-loosening screws. The two ends of the elastic component respectively abut against the base and the probe plate assembly. The circuit board is located between the base and the probe plate assembly. The probes are housed in the probe plate assembly. When the floating probe mechanism of this invention is used, the floating probe mechanism is fixed on a fixture. The fixture drives the floating probe mechanism to move upward. The probe plate assembly first contacts the product to be tested and is pressed close to the base by the product to be tested. At this time, the probe extends from the probe plate assembly until the product to be tested connects with the probe. During this process, the elastic component buffers the impact force of the product to be tested. Through the above design, the probe experiences less impact force during testing and has a longer service life."

[0004] However, in the above solution, the chip is placed directly on a rigid platform, which makes it very easy for the pins to be damaged, the chip surface to be scratched, or even microcracks to appear during the picking, placing or pressing process due to friction, collision or local stress concentration. Utility Model Content

[0005] This invention provides a floating press-fit integrated circuit test probe connector, which aims to solve the above problems.

[0006] This invention is implemented as follows: a floating press-fit integrated circuit test probe connector includes:

[0007] Connect the base;

[0008] A pressing top seat; the pressing top seat is disposed above the connecting base;

[0009] Air flotation mechanism; the air flotation mechanism is located on the outside of the connecting base, and the air flotation mechanism is used to suspend and lift the integrated circuit to be tested upward. The air flotation mechanism includes a micro air pump, an air guide tube, a gas container, an air flotation nozzle, an air inlet, and an outer support.

[0010] Circuit limiting mechanism; the circuit limiting mechanism is located on the lower rear side of the pressing top seat, and the circuit limiting mechanism is used to limit and fix the integrated circuit to be tested.

[0011] Preferably, the number of the outer supports is set to two, and the two outer supports are respectively fixedly connected to the left and right sides of the connecting base. A gas container is fixedly connected to the middle of the front end of the two outer supports. The upper surface of the gas container is provided with multiple air flotation nozzles, and each air flotation nozzle is interconnected with the interior of the gas container.

[0012] Preferably, air inlets are provided on both the left and right sides of the upper surface of the gas container, and air guide pipes are connected to the upper ends of the two air inlets. A miniature air pump is provided at the end of the air guide pipe away from the air inlets.

[0013] Preferably, the micro air pump is fixedly connected to the rear side of the upper surface of the outer bracket, and the air outlet of the micro air pump is connected to the air guide tube.

[0014] Preferably, the circuit limiting mechanism includes a rotating shaft, a pressing block, a connecting spring, and a pressing pad. The pressing block is fixedly connected to the lower surface of the pressing top seat, and a rotating shaft is provided through the middle of the pressing block. The rotating shaft is rotatably connected to the inner side of the connecting base.

[0015] Preferably, the front end of the pressing pad is fixedly connected to the rear side of the pressing top seat, and a connecting spring is provided between the pressing pad and the connecting base.

[0016] Preferably, the lower front surface of the pressing top seat is provided with multiple probe test slots.

[0017] Preferably, a testing instrument slot is provided in the middle of the pressing top seat.

[0018] Compared with related technologies, the floating press-fit integrated circuit test probe connector provided by this utility model has the following advantages:

[0019] 1. With the air flotation mechanism in place, the micro air pump starts when the test begins, and the generated gas is delivered to the gas container through the air guide pipe connected to its outlet. When the container is filled with gas at a stable pressure, the gas will be sprayed vertically upwards and synchronously through all nozzles. The sprayed airflow converges below the integrated circuit chip, forming a uniform airflow with specific rigidity and load-bearing capacity. The upward thrust generated by this airflow can accurately overcome the chip's own weight and smoothly lift it upwards, suspending it at a predetermined height, achieving non-contact support with the mechanical structure below, thereby reducing the possibility of mechanical damage.

[0020] 2. Using the circuit limiting mechanism, the operator places the integrated circuit to be tested within the area surrounded by the air-bearing nozzle on the connecting base. Using tweezers or a special tool, the position of the chip is finely adjusted in the horizontal direction to roughly align it with the probe test slot on the pressing top seat. After the initial slot alignment is completed, the entire pressing top seat is driven to move downward. As the pressing top seat continues to descend, the connecting spring is gradually stretched. When the lower surface of the pressing top seat is subjected to the upward reaction force of the chip, the pressing block will rotate slightly inward around the rotation axis. This rotation allows the side of the pressing block to tightly fit the side edge of the chip, thus completing the positioning in the left and right directions. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the front structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the rear structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the pressure-sealing top seat of this utility model.

[0025] In the diagram: 1. Connecting base; 2. Pressing top seat; 3. Air flotation mechanism; 301. Miniature air pump; 302. Air guide tube; 303. Gas container box; 304. Air flotation nozzle; 305. Air inlet; 306. Outer bracket; 4. Circuit limiting mechanism; 401. Rotating shaft; 402. Pressing block; 403. Connecting spring; 404. Pressing pad; 5. Probe test slot; 6. Test instrument slot. Detailed Implementation

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] Example 1

[0029] A preferred embodiment of the floating press-fit integrated circuit test probe connector provided by this utility model is, for example... Figures 1 to 4 As shown: Floating press-fit integrated circuit test probe connector, including:

[0030] Connect base 1;

[0031] Pressing top seat 2; Pressing top seat 2 is positioned above connecting base 1;

[0032] Air flotation mechanism 3; Air flotation mechanism 3 is located on the outside of the connecting base 1. Air flotation mechanism 3 is used to suspend and lift the integrated circuit to be tested upward. Air flotation mechanism 3 includes a micro air pump 301, an air guide tube 302, a gas container box 303, an air flotation nozzle 304, an air inlet 305, and an outer support 306.

[0033] In a further preferred embodiment of this utility model, the number of outer supports 306 is set to two, and the two outer supports 306 are respectively fixedly connected to the left and right sides of the connecting base 1. A gas container box 303 is fixedly connected to the middle of the front end of the two outer supports 306. A plurality of air flotation nozzles 304 are provided on the upper surface of the gas container box 303, and each air flotation nozzle 304 is interconnected with the interior of the gas container box 303.

[0034] In a further preferred embodiment of the present invention, air inlets 305 are provided on both the left and right sides of the upper surface of the gas container 303, and air guide pipes 302 are connected to the upper ends of the two air inlets 305. A miniature air pump 301 is provided at the end of the air guide pipe 302 away from the air inlets 305.

[0035] In this embodiment, a symmetrical air supply design with dual air inlets 305 is adopted, which allows high-pressure gas to enter the internal chamber of the gas container 303 simultaneously and evenly from both the left and right sides, further improving the uniformity and stability of the airflow.

[0036] In a further preferred embodiment of the present invention, a miniature air pump 301 is fixedly connected to the rear side of the upper surface of the outer bracket 306, and the air outlet of the miniature air pump 301 is connected to the air guide tube 302.

[0037] In this embodiment, the upward thrust generated by the airflow can precisely overcome the chip's own weight and smoothly lift it upward, suspending it at a predetermined height, thus achieving non-contact support with the mechanical structure below.

[0038] Example 2

[0039] Based on Embodiment 1, a preferred embodiment of the floating press-fit integrated circuit test probe connector provided by this utility model is, for example... Figures 1 to 4 As shown: Circuit limiting mechanism 4; Circuit limiting mechanism 4 is located on the lower rear side of the pressing top seat 2, and is used to limit and fix the integrated circuit to be tested.

[0040] In a further preferred embodiment of the present invention, the circuit limiting mechanism 4 includes a rotating shaft 401, a pressing block 402, a connecting spring 403, and a pressing pad 404. The pressing block 402 is fixedly connected to the lower surface of the pressing top seat 2. The rotating shaft 401 is provided through the middle of the pressing block 402, and the rotating shaft 401 is rotatably connected to the inner side of the connecting base 1.

[0041] In this embodiment, the operator places the integrated circuit to be tested within the area surrounded by the air flotation nozzle 304 on the connecting base 1. Using tweezers or a special tool, the operator fine-tunes the position of the chip in the horizontal direction so that it is roughly aligned with the probe test slot 5 on the pressing top seat 2. After the initial slot alignment is completed, the entire pressing top seat 2 is driven to move downward. As the pressing top seat 2 continues to move downward, the connecting spring 403 is gradually stretched. When the lower surface of the pressing top seat 2 is subjected to the upward reaction force of the chip, the pressing block 402 will generate a small inward rotational motion with the rotation axis 401 as the fulcrum. This rotational motion allows the side of the pressing block 402 to tightly fit the side edge of the chip, thereby completing the positioning in the left and right directions.

[0042] In a further preferred embodiment of the present invention, the front end of the pressing pad 404 is fixedly connected to the rear side of the pressing top seat 2, and a connecting spring 403 is provided between the pressing pad 404 and the connecting base 1.

[0043] In this embodiment, before the pressing top seat 2 moves downward, the tension of the connecting spring 403 keeps the pressing pad 404 in a lower initial position, providing sufficient space for the placement of the chip.

[0044] In a further preferred embodiment of this utility model, a plurality of probe test slots 5 are provided on the lower front surface of the pressing top seat 2.

[0045] In this embodiment, the chip pins form a stable, low-resistance electrical contact with the internal probes through the test slots, thereby importing and exporting test signals.

[0046] In a further preferred embodiment of this utility model, a testing instrument slot 6 is provided in the middle of the pressing top seat 2.

[0047] In this embodiment, the slot is used to accommodate and fix external test instrument modules or interface boards, so that test signals can be transmitted directly and short-path from the probe test slot 5 to the test instrument.

[0048] In summary, when the micro air pump 301 is activated, the generated gas is delivered to the gas container 303 through the air guide pipe 302 connected to its outlet. Once the container is filled with gas at a stable pressure, the gas is sprayed vertically upwards and synchronously through all the nozzles. The sprayed airflow converges below the integrated circuit chip, forming a uniform airflow with specific rigidity and load-bearing capacity. The upward thrust generated by this airflow can precisely overcome the chip's own weight and smoothly lift it upwards, suspending it at a predetermined height. This achieves non-contact support with the mechanical structure below, thereby reducing the possibility of mechanical damage.

[0049] It is worth noting that the circuits, electronic components, and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0050] It should be understood that the disclosed apparatus can be implemented in other ways, given the several embodiments provided in this application. For example, the apparatus embodiments described above are merely illustrative; the division of units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or communication connections shown or discussed may be through some interfaces; the indirect coupling or communication connections between devices or units may be telecommunications or other forms.

[0051] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A floating press-fit integrated circuit test probe connector, characterized in that, include: Connecting base (1); Pressing top seat (2); the pressing top seat (2) is disposed above the connecting base (1); Air flotation mechanism (3); The air flotation mechanism (3) is located on the outside of the connecting base (1). The air flotation mechanism (3) is used to suspend and lift the integrated circuit to be tested upward. The air flotation mechanism (3) includes a micro air pump (301), an air guide pipe (302), a gas container (303), an air flotation nozzle (304), an air inlet (305), and an outer support (306). Circuit limiting mechanism (4); The circuit limiting mechanism (4) is located on the rear side below the pressing top seat (2), and the circuit limiting mechanism (4) is used to limit and fix the integrated circuit to be tested.

2. The floating press-fit integrated circuit test probe connector as described in claim 1, characterized in that, The number of the outer support (306) is set to two. The two outer supports (306) are fixedly connected to the left and right sides of the connecting base (1) respectively. A gas container (303) is fixedly connected to the middle of the front end of the two outer supports (306). A plurality of air flotation nozzles (304) are provided on the upper surface of the gas container (303). Each air flotation nozzle (304) is interconnected with the interior of the gas container (303).

3. The floating press-fit integrated circuit test probe connector as described in claim 2, characterized in that, The gas container (303) has air inlets (305) on both the left and right sides of its upper surface. The upper ends of the two air inlets (305) are connected to air guide pipes (302). A miniature air pump (301) is provided at the end of the air guide pipe (302) away from the air inlets (305).

4. The floating press-fit integrated circuit test probe connector as described in claim 3, characterized in that, The micro air pump (301) is fixedly connected to the rear side of the upper surface of the outer bracket (306), and the air outlet of the micro air pump (301) is connected to the air guide pipe (302).

5. The floating press-fit integrated circuit test probe connector as described in claim 1, characterized in that, The circuit limiting mechanism (4) includes a rotating shaft (401), a pressing block (402), a connecting spring (403), and a pressing pad (404). The pressing block (402) is fixedly connected to the lower surface of the pressing top seat (2). The rotating shaft (401) is provided through the middle of the pressing block (402), and the rotating shaft (401) is rotatably connected to the inner side of the connecting base (1).

6. The floating press-fit integrated circuit test probe connector as described in claim 5, characterized in that, The front end of the pressing pad (404) is fixedly connected to the rear side of the pressing top seat (2), and a connecting spring (403) is provided between the pressing pad (404) and the connecting base (1).

7. The floating press-fit integrated circuit test probe connector as described in claim 1, characterized in that, The lower front surface of the pressing top seat (2) is provided with multiple probe test slots (5).

8. The floating press-fit integrated circuit test probe connector as described in claim 1, characterized in that, The middle part of the pressing top seat (2) is provided with a test instrument slot (6).

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