Cantilevered probe card and chip testing system
Patent Information
- Application Number
- CN202522205389.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-17
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-10-17
AI Technical Summary
[0003]然而，传统的悬臂式探针卡的出针角度通常设计为103度左右，导致探针尖端以较大倾角与焊盘接触，在进行必要的刮擦动作以突破焊盘表面氧化层时，接触点靠近焊盘边缘，应力集中，容易造成焊盘损伤（如扎穿、刮痕过深）、测试针迹过大等问题
[0014]本实用新型提供的悬臂式探针卡包括电路板和固定于电路板上的悬臂探针，悬臂探针包括针尖部以及连接针尖部和电路板的连接部，连接部与针尖部之间的夹角大于等于97度小于等于99度，针尖部用于连接待测芯片的导电焊盘，使用状态下针尖部与导电焊盘之间的夹角大于等于86度小于等于88度，悬臂探针在使用时，针尖部与导电焊盘的接触点更靠近导电焊盘中心区域，接触方式更接近于垂直点压而非斜向刮擦，显著降低了作用在导电焊盘边缘的应力集中现象，从而有效减小了针痕的尺寸和深度，更垂直的接触角度和更小的刮擦距离，使探针尖部能更稳定地压接在焊盘上，有利于稳定地突破表面氧化膜，改善了测试过程中接触电阻的稳定性，提高了测试结果的准确性和可靠性，由于减小了刮擦时的摩擦和应力，探针针尖部的磨损得以减轻，从而显著延长了探针卡的整体使用寿命，降低了生产成本。
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Figure CN224840301U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor testing technology, and more specifically, it relates to a cantilever probe card and chip testing system. Background Technology
[0002] Probe cards are a crucial medium in wafer testing, connecting the tester to the chip's solder pads or bumps. They are used to screen chips for electrical performance before packaging, eliminating defective products. Cantilever probe cards are widely used in the industry due to their simple structure and low cost.
[0003] However, traditional cantilever probe cards typically have a probe exit angle of around 103 degrees, resulting in the probe tip contacting the pad at a large angle. When performing necessary scraping to break through the oxide layer on the pad surface, the contact point is close to the pad edge, causing stress concentration and easily leading to pad damage (such as punctures or excessively deep scratches) and excessively large test probe marks. This not only affects the stability of the contact resistance in current testing but may also pose potential risks to subsequent chip packaging and bonding, while accelerating probe wear and shortening the probe card's lifespan. Although vertical probe cards and MEMS probe cards can solve these problems, their high manufacturing costs make it difficult to completely replace cantilever probe cards. Therefore, how to optimize the performance of cantilever probe cards without significantly increasing costs has become a pressing technical problem in this field. Utility Model Content
[0004] The purpose of this invention is to provide a cantilever probe card and chip testing system, which can improve contact stability and extend the service life of the probe.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The first aspect of this utility model provides a cantilever probe card, including a circuit board and a cantilever probe fixed on the circuit board. The cantilever probe includes a tip and a connecting part connecting the tip and the circuit board. The tip is used to connect to the conductive pad of the chip under test. The angle between the connecting part and the tip is greater than or equal to 97 degrees and less than or equal to 99 degrees. In the use state, the angle between the tip and the conductive pad is greater than or equal to 86 degrees and less than or equal to 88 degrees.
[0006] In one specific embodiment, the circuit board has a first surface and a second surface opposite to the first surface. The first surface has a plurality of test points, and the second surface has a plurality of metal solder joints. The metal solder joints are electrically connected to the test points and electrically connected to the connecting portion of the cantilever probe.
[0007] In one specific embodiment, the circuit board is provided with an opening that penetrates the first surface and the second surface. A probe fixing ring is provided at the opening. The cantilever probe is fixedly connected to the circuit board through the probe fixing ring, and the probe fixing ring is fixed to the first surface of the circuit board.
[0008] In one specific embodiment, a probe fixing ring is provided on the second surface of the circuit board, and the cantilever probe is fixedly connected to the circuit board through the probe fixing ring.
[0009] In one specific embodiment, the connecting part of the cantilever probe is fixedly connected to the probe fixing ring by epoxy resin.
[0010] In one specific embodiment, the probe fixing ring is a ceramic component, and the number of cantilever probes is multiple.
[0011] In one specific embodiment, the angle between the connecting portion and the needle tip is 99 degrees, the angle between the needle tip and the conductive pad is 86 degrees in the use state, and the angle between the connecting portion and the conductive pad is 5 degrees.
[0012] In one specific embodiment, the tip portion and the connecting portion of the cantilever probe are integrally formed.
[0013] The second aspect of this utility model provides a chip testing system, including a chip tester, a cantilever probe card, and a chip under test. The chip under test has conductive pads, and the cantilever probe card is used to connect the conductive pads and the chip tester. The cantilever probe card is the cantilever probe card as described above.
[0014] This utility model provides a cantilever probe card comprising a circuit board and a cantilever probe fixed on the circuit board. The cantilever probe includes a tip and a connecting part connecting the tip and the circuit board. The angle between the connecting part and the tip is greater than or equal to 97 degrees and less than or equal to 99 degrees. The tip is used to connect to the conductive pad of the chip under test. In use, the angle between the tip and the conductive pad is greater than or equal to 86 degrees and less than or equal to 88 degrees. When in use, the contact point between the tip and the conductive pad is closer to the center of the conductive pad, and the contact method is closer to vertical point pressing rather than oblique scraping. This significantly reduces the stress concentration phenomenon acting on the edge of the conductive pad, thereby effectively reducing the size and depth of the pin marks. The more vertical contact angle and the smaller scraping distance allow the probe tip to be pressed more stably onto the pad, which is conducive to stable breakthrough of the surface oxide film, improves the stability of contact resistance during testing, and improves the accuracy and reliability of test results. Due to the reduction of friction and stress during scraping, the wear of the probe tip is reduced, thereby significantly extending the overall service life of the probe card and reducing production costs. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 A partial structural schematic diagram of the cantilever probe card provided in an embodiment of this utility model; Figure 2 A schematic diagram of the structure of the cantilever probe card provided in this embodiment of the utility model; Figure 3 This is a comparative schematic diagram showing the scratch and wear marks on the conductive pads of the chip under test when the included angle between the tip and the connector of the cantilever probe card provided in this embodiment of the utility model is 103 degrees, and when the included angle between the tip and the connector is 99 degrees.
[0017] The following are the labeling elements in the figure: 1-Circuit board; 2-Cantilever probe; 3-Conductive pad; 11-Probe retaining ring; 21-Tip; 22-Connector. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0019] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.
[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. In the description of this utility model, unless otherwise stated, "multiple" means two or more.
[0022] Traditional cantilever probe cards typically have a probe angle of around 103 degrees, resulting in the probe tip contacting the pad at a large angle. When performing necessary scraping actions to break through the oxide layer on the pad surface, the contact point is close to the pad edge, causing stress concentration and easily leading to pad damage (such as punctures or excessively deep scratches) and excessively large test probe marks. This not only affects the stability of the contact resistance during current testing but may also pose potential risks to subsequent chip packaging and bonding, while accelerating probe wear and shortening the probe card's lifespan. Although vertical probe cards and MEMS probe cards can solve these problems, their high manufacturing costs make it difficult to completely replace cantilever probe cards. This application provides a cantilever probe card and chip testing system based on the above reasons.
[0023] The cantilever probe card and chip testing system provided by this utility model will be described in detail below with reference to specific embodiments.
[0024] Figure 1 This is a partial structural diagram of the cantilever probe card provided in an embodiment of the present invention. Figure 2 For a structural schematic diagram of the cantilever probe card provided in this embodiment of the utility model, please refer to [link / reference]. Figure 1 , Figure 2The first aspect of this embodiment provides a cantilever probe card, including a circuit board 1 and a cantilever probe 2 fixed on the circuit board 1. The cantilever probe 2 includes a tip 21 and a connecting part 22 connecting the tip 21 and the circuit board. The included angle α between the connecting part 22 and the tip 21 is greater than or equal to 97 degrees and less than or equal to 99 degrees. The tip 21 is used to connect to the conductive pad 3 of the chip under test. In the use state, the included angle β between the tip 21 and the conductive pad 3 is greater than or equal to 86 degrees and less than or equal to 88 degrees.
[0025] The cantilever probe card in this embodiment acts as a bridge between the tester and the unpackaged chip in semiconductor wafer testing. It performs preliminary screening and functional verification of the chip's electrical performance before packaging, thereby identifying defective products and saving subsequent packaging costs. Its core principle is to utilize a flexible metal probe, precisely positioned so that the probe tip 21 accurately presses against the conductive pad 3 of the chip. The electrical signal from the tester is transmitted to the cantilever probe 2 through the circuit wiring on the probe card, and then guided into the chip through the contact between the cantilever probe 2 and the conductive pad 3. The probe also receives the chip's return signal to determine its performance. The cantilever probe card has a relatively simple structure and low cost.
[0026] This embodiment of the cantilever probe card includes a circuit board 1 and a cantilever probe 2 fixed on the circuit board 1. The circuit board 1 serves as the main body for electrical connection and mechanical support. One side of the circuit board 1 has solder joints for connection with the testing machine, and the other side is provided with wiring to guide the signal to the mounting area of the cantilever probe 2. The cantilever probe 2 is usually made of a special alloy and has good elasticity, conductivity and wear resistance. The cantilever probe 2 includes a tip 21 and a connecting portion 22 connecting the tip 21 and the circuit board 1. Exemplarily, the angle α between the connecting portion 22 and the tip 21 is 99 degrees, 98 degrees, or 97 degrees. The tip 21 is used to connect to the conductive pad 3 of the chip under test, and the angle β between the tip 21 and the conductive pad 3 is 86 degrees, 87 degrees, or 88 degrees. In this embodiment, the connecting portion 22 and the tip 21 are integrally connected. The angle α between the connecting portion 22 and the tip 21 refers to the inherent angle formed by its own structure when the probe is in a free state and not under force. The angle β between the tip 21 and the conductive pad 3 refers to the working angle formed when, under test conditions, the cantilever probe card is installed on the test machine, the tip 21 contacts the chip's conductive pad 3, and a certain pressure is applied, due to the elastic bending of the cantilever probe 2.
[0027] In this embodiment, the included angle α between the connecting part 22 and the tip 21 is 97-99 degrees. During use, the included angle β between the tip 21 and the conductive pad 3 of the chip under test is 86-88 degrees. The tip 21 of the cantilever probe presses against the conductive pad 3 at a more perpendicular angle, rather than the large-angle oblique scraping of traditional designs. The contact between the tip 21 and the conductive pad 3 changes from oblique scraping to near-vertical point pressure, significantly reducing the sliding distance and uncertainty of the tip 21 on the conductive pad 3. This allows the tip 21 to be more stably anchored on the conductive pad 3, reducing edge stress concentration and damage risk, minimizing scratch wear, and extending service life. Furthermore, the more stable physical contact directly contributes to the stability of the contact impedance. The tip 21 can more reliably penetrate the oxide film on the surface of the conductive pad 3 while maintaining the cleanliness of the contact point, resulting in more stable test signal transmission and improved test yield and accuracy.
[0028] In one specific embodiment, the circuit board 1 has a first surface and a second surface opposite to the first surface. The first surface has multiple test points, and the second surface has multiple metal solder joints. The metal solder joints are electrically connected to the test points and to the connection portion 22 of the cantilever probe 2. In this embodiment, the circuit board 1 is typically a PCB or ceramic substrate. The metal solder joints are located on the second surface of the circuit board 1 facing the chip. The test points are electrically connected to the metal solder joints on the second surface through wiring inside the substrate (such as copper-plated vias or wires). The test points are the key interface for connecting the probe card to an external testing machine, and are typically connected to the testing machine's channel via soldering, spring pins, or sockets.
[0029] Exemplarily, the circuit board 1 has an opening penetrating the first surface and the second surface. A probe retaining ring 11 is provided at the opening, and the cantilever probe 2 is fixedly connected to the circuit board 1 via the probe retaining ring 11. The probe retaining ring 11 is fixed to the first surface of the circuit board 1. In this embodiment, the probe retaining ring 11 is installed on the first surface of the circuit board 1 (i.e., the side facing the chip). The probe retaining ring 11 in this embodiment provides a robust mechanical anchor point for the cantilever probe 2, ensuring that all cantilever probes 2 are precisely fixed in their designed positions, thus guaranteeing the relative positional accuracy between the probes. In this embodiment, the probe retaining ring 11 is fixed to the opening of the circuit board 1 with screws, which can improve the fixing strength of the probe retaining ring 11, thereby improving the fixing strength of the cantilever probe 2.
[0030] Optionally, a probe fixing ring 11 is provided on the second surface of the circuit board 1, and the cantilever probe 2 is fixedly connected to the circuit board 1 through the probe fixing ring 11. In this embodiment, the probe fixing ring 11 is directly installed on the second surface of the circuit board 1. The installation method of the probe fixing ring 11 is simple. The connecting part 22 of the cantilever probe 2 is directly fixed on the probe fixing ring 11, and the connecting part 22 of the cantilever probe 2 is electrically connected to the metal solder joint on the circuit board 1.
[0031] In one specific embodiment, the connecting portion 22 of the cantilever probe 2 is fixedly connected to the probe retaining ring 11 via epoxy resin. In this embodiment, the connecting portion 22 of the cantilever probe 2 and the probe retaining ring 11 are fixed together by epoxy resin. Epoxy resin has high adhesive strength, high insulation, and aging resistance. Epoxy resin provides strong adhesive force, ensuring that the probe will not loosen or shift under repeated test impacts. Furthermore, epoxy resin prevents short circuits between adjacent probes through the retaining ring, ensuring the independence of the test signal.
[0032] In one specific embodiment, the probe fixing ring 11 is a ceramic component. Ceramic materials possess extremely high rigidity and hardness, effectively resisting deformation and providing the most stable mounting platform for the cantilever probe 2, ensuring long-term accuracy. Ceramic has a low coefficient of thermal expansion, is less affected by changes in the test environment temperature, maintains dimensional stability, and avoids displacement of the cantilever probe 2 due to thermal expansion and contraction. Furthermore, ceramic components are not easily damaged and have a long service life.
[0033] In one specific embodiment, the number of cantilever probes 2 is multiple. Exemplarily, the multiple cantilever probes 2 are arranged in a specific array, their layout corresponding one-to-one with the conductive pads 3 of multiple chips on the chip under test or wafer. These cantilever probes 2 can simultaneously contact multiple conductive pads 3 of a single chip, or can be designed to simultaneously contact multiple chips on a wafer. This cantilever probe card can test all I / O ports of a chip or multiple chips at once, greatly improving testing efficiency and reducing testing costs.
[0034] In one specific embodiment, please refer to Figure 1 The angle α between the connecting part 22 and the tip 21 is 99 degrees. In the use state, the angle β between the tip 21 and the conductive pad 3 is 86 degrees, and the angle between the connecting part and the conductive pad is 5 degrees. In this embodiment, when the cantilever probe 2 is in use, the angle β between the tip 21 and the conductive pad 3 of the chip under test is 86 degrees. The tip 21 of the cantilever probe presses against the conductive pad 3 at a more vertical angle, rather than the large-angle oblique scraping of the traditional design. The contact between the tip 21 and the conductive pad 3 changes from oblique scraping to near vertical point pressure. The tip 21 can more reliably break through the oxide film (such as Al2O3, CuO) on the surface of the conductive pad 3.
[0035] Table 1 compares the size of the scratch wear marks, contact resistance stability, and service life of the cantilever probe 2 on the conductive pad 3 when the included angle α between the connecting part and the tip is 99 degrees, 101 degrees, and 103 degrees. As shown in Table 1, the scratch wear marks, contact resistance stability, and service life of the cantilever probe 2 on the conductive pad 3 when the included angle α between the connecting part and the tip is 99 degrees are better than those when the included angle α between the connecting part and the tip is 101 degrees and 103 degrees.
[0036]
[0037] Table 1 Figure 3 A comparative schematic diagram showing the scratch wear marks on the conductive pads when the included angle between the tip and the connector of the cantilever probe card provided in this embodiment of the invention is 103 degrees, and when the included angle between the tip and the connector is 99 degrees, is provided. Please refer to [link / reference needed]. Figure 1 and Figure 3 The comparison shows the effect of different included angles α on scratch wear. When the included angle α between the connecting part 22 and the needle tip 21 is 99 degrees and the included angle between the connecting part and the conductive pad is 5 degrees, the corresponding working included angle β is 86 degrees. The scratch wear marks on the conductive pad 3 are much smaller than those in the traditional design (such as when the included angle α is 103 degrees). The angle design of this embodiment can effectively reduce scratch wear. The specific performance data comparison is shown in Table 1.
[0038] In the above embodiments, the tip and the connecting part of the cantilever probe are integrally formed, which improves the mechanical strength and service life to a certain extent. It also ensures that the current path from the connecting part to the tip is continuous and complete. The integral forming of the tip and the connecting part results in a uniform elastic modulus of the entire cantilever probe, ensuring a high degree of consistency and predictability in its deformation during compression and rebound.
[0039] The cantilever probe card provided in this embodiment includes a circuit board and a cantilever probe fixed on the circuit board. The cantilever probe includes a tip and a connecting part connecting the tip and the circuit board. The angle between the connecting part and the tip is greater than or equal to 97 degrees and less than or equal to 99 degrees. The tip is used to connect to the conductive pad of the chip under test. In use, the angle between the tip and the conductive pad is greater than or equal to 86 degrees and less than or equal to 88 degrees. When the cantilever probe is in use, the contact point between the tip and the conductive pad is closer to the center area of the conductive pad, and the contact method is closer to vertical point pressing rather than oblique scraping. This significantly reduces the stress concentration phenomenon acting on the edge of the conductive pad, thereby effectively reducing the size and depth of the pin marks. The more vertical contact angle and the smaller scraping distance allow the probe tip to be pressed more stably on the pad, which is conducive to stable breakthrough of the surface oxide film, improves the stability of contact resistance during testing, and improves the accuracy and reliability of test results. Since the friction and stress during scraping are reduced, the wear of the probe tip is reduced, thereby significantly extending the overall service life of the probe card and reducing production costs.
[0040] A second aspect of this embodiment provides a chip testing system, including a chip tester, a cantilever probe card, and a chip under test. The chip under test has conductive pads, and the cantilever probe card is used to connect the conductive pads and the chip tester. The cantilever probe card is the cantilever probe card described in the above embodiment.
[0041] For example, a cantilever probe card includes a circuit board and a cantilever probe fixed on the circuit board. The cantilever probe includes a tip and a connecting part that connects the tip and the circuit board. The angle between the connecting part and the tip is greater than or equal to 97 degrees and less than or equal to 99 degrees. The tip is used to connect to the conductive pad of the chip under test. In use, the angle between the tip and the conductive pad is greater than or equal to 86 degrees and less than or equal to 88 degrees.
[0042] In this embodiment, the length of the scratch marks on the conductive pad is 20-27 micrometers.
[0043] When using this chip testing system, the contact point between the tip of the cantilever probe and the conductive pad of the chip under test is closer to the center of the conductive pad. The contact method is closer to vertical point pressing rather than oblique scraping, which significantly reduces stress concentration at the edge of the conductive pad, thereby effectively reducing the size and depth of the probe marks. The more vertical contact angle and the shorter scraping distance allow the tip to be pressed more stably onto the conductive pad, which is conducive to stably breaking through the oxide film on the surface of the conductive pad. This improves the stability of contact resistance during testing, and enhances the accuracy and reliability of test results. Because the friction and stress during scraping are reduced, the wear of the tip is lessened, thereby significantly extending the overall service life of the probe card and reducing production costs.
[0044] In the above description, the terms "an embodiment," "some embodiments," "example," "specific example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0045] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A cantilever probe card, characterized in that: The device includes a circuit board and a cantilever probe fixed to the circuit board. The cantilever probe includes a tip and a connecting part that connects the tip and the circuit board. The tip is used to connect to the conductive pad of the chip under test. The angle between the connecting part and the tip is greater than or equal to 97 degrees and less than or equal to 99 degrees. In use, the angle between the tip and the conductive pad is greater than or equal to 86 degrees and less than or equal to 88 degrees.
2. The cantilever probe card according to claim 1, characterized in that: The circuit board has a first surface and a second surface opposite to the first surface. The first surface has multiple test points, and the second surface has multiple metal solder joints. The metal solder joints are electrically connected to the test points and to the connecting portion of the cantilever probe.
3. The cantilever probe card according to claim 2, characterized in that: The circuit board has an opening that penetrates the first surface and the second surface. A probe fixing ring is provided at the opening. The cantilever probe is fixedly connected to the circuit board through the probe fixing ring, and the probe fixing ring is fixed to the first surface of the circuit board.
4. The cantilever probe card according to claim 2, characterized in that: A probe fixing ring is provided on the second surface of the circuit board, and the cantilever probe is fixedly connected to the circuit board through the probe fixing ring.
5. The cantilever probe card according to claim 3 or 4, characterized in that: The connecting part of the cantilever probe is fixedly connected to the probe fixing ring by epoxy resin.
6. The cantilever probe card according to claim 5, characterized in that: The probe fixing ring is made of ceramic; there are multiple cantilever probes.
7. The cantilever probe card according to claim 1, characterized in that: The angle between the connecting part and the needle tip is 99 degrees. In use, the angle between the needle tip and the conductive pad is 86 degrees, and the angle between the connecting part and the conductive pad is 5 degrees.
8. The cantilever probe card according to any one of claims 1-7, characterized in that: The tip and the connecting part of the cantilever probe are integrally formed.
9. A chip testing system, characterized in that: The device includes a chip tester, a cantilever probe card, and a chip under test. The chip under test has conductive pads. The cantilever probe card is used to connect the conductive pads and the chip tester. The cantilever probe card is the cantilever probe card according to any one of claims 1-8.