Endoscope module semi-finished product testing fixture

Abstract

The utility model relates to endoscope module manufacturing technical field, concretely is a kind of endoscope module semi-finished product test fixture, by first, second probe group direct contact the soldering line PAD on semi-finished product circuit board, can before welding wire harness conveniently the imaging function of endoscope module and so on core performance is tested, can significantly improve product yield (remove semi-finished product defective in advance), substantially improve test efficiency (avoid the invalid test and rework of subsequent assembly defective product), and provide effective guarantee for product rapid stable mass production.

Description

Technical Field

[0001] This utility model relates to the field of endoscope module manufacturing, specifically to a test fixture for semi-finished endoscope modules. Background Technology

[0002] Endoscope modules are widely used in various fields due to their advantages such as miniaturization, high precision, low power consumption, and high reliability. A certain endoscope module consists of an endoscope module semi-finished product 1, a connecting wire harness 13, and a test board 14. The endoscope module semi-finished product consists of a lens module and peripheral component circuits soldered onto a circuit board. The circuit board has bonding pads at the end, including an upper bonding pad 102 and a lower bonding pad 103. One end of the wire harness is soldered to the bonding pad, and the other end is soldered to the test board, connecting the endoscope module semi-finished product and the test board. The length of the wire harness is generally between 1 and 4 meters, and can be adjusted according to the actual application. The type is coaxial cable, twisted pair cable, or a combination of both.

[0003] Currently, endoscope modules are typically tested for imaging after assembly (including soldering the connecting wire harnesses). However, if defects are found in core components such as the lens module at this stage, repairs are extremely difficult and time-consuming due to the soldered wire harnesses and relatively enclosed structure. This not only wastes materials but also severely reduces production yield and efficiency. Therefore, there is an urgent need for a fixture that can perform functional testing at the semi-finished stage before the wire harnesses are soldered (i.e., the lens module is soldered to the circuit board but the external wire harnesses have not yet been soldered), in order to identify and remove defective products early and improve overall production efficiency and yield. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a test fixture for semi-finished endoscope modules, which solves the problems of difficult maintenance, low yield, and low efficiency caused by the fact that testing can only be performed after assembly.

[0005] This utility model is achieved through the following technical solution: A test fixture for a semi-finished endoscope module includes: The upper cover plate and the lower cover plate are connected at one end by a spring bolt and at the other end by a movable connection, so that the upper cover plate and the lower cover plate can be opened and closed. The mounting slot is formed on the surface of the lower cover plate near the upper cover plate. The mounting slot is used to place the semi-finished endoscope module to be tested. The first circuit board is fixed above the upper cover of the fixture; The second circuit board is fixed below the lower cover plate of the fixture; The first probe group is located below the first circuit board and is used to enable signal conduction between the first circuit board and the semi-finished product. The second probe group is located above the second circuit board and is used to enable signal conduction between the second circuit board and the semi-finished product; The first and second circuit boards are connected to the test board via external wiring harnesses.

[0006] Preferably, the upper cover plate is provided with a buckle, and the lower cover plate is provided with a slot, with the buckle and the slot cooperating. Preferably, when the upper and lower cover plates are closed, the first probe group contacts the upper solder pad at the tail end of the circuit board of the endoscope module semi-finished product to be tested.

[0007] Preferably, the first probe group is in elastic contact with the upper bonding wire PAD.

[0008] Preferably, when the upper and lower cover plates are closed, the second probe group contacts the lower solder pad (PAD) at the tail end of the circuit board of the endoscope module semi-finished product. Preferably, the second probe group makes elastic contact with the lower bonding wire PAD. Preferably, the upper cover plate has an observation through hole located above the mounting groove.

[0009] Preferably, the observation port is facing the lens module of the semi-finished endoscope module to be tested. Preferably, a transparent plate is installed at the observation hole.

[0010] Preferably, the first probe group and the second probe group are arranged symmetrically.

[0011] Compared with the prior art, the present invention has the following beneficial effects: This utility model discloses a test fixture for semi-finished endoscope modules. It is designed for semi-finished endoscope modules (lens modules and circuit boards are soldered together, but external wiring harnesses have not yet been soldered). By having the first and second probe groups directly contact the bonding pads on the circuit board of the semi-finished product, the core performance of the endoscope module, such as imaging function, can be conveniently tested before the wiring harness is soldered. This can significantly improve product yield (by eliminating defective semi-finished products in advance), greatly improve testing efficiency (avoiding ineffective testing and rework of defective products in subsequent assembly), and provide an effective guarantee for rapid and stable mass production of products. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the endoscope module of this utility model; Figure 2 This is a schematic diagram of the structure of the semi-finished endoscope module of this utility model; Figure 3 This is a side view structural diagram of the semi-finished endoscope module of this utility model; Figure 4 This is a front view of the test fixture of this utility model; Figure 5This is a schematic diagram of the back of the test fixture of this utility model; Figure 6 This is a cross-sectional schematic diagram of the testing fixture of this utility model; Figure 7 This is a schematic diagram of the structure of the test fixture of this utility model.

[0013] In the diagram, 1. Endoscope module semi-finished product; 101. Lens module; 102. Upper bonding pad; 103. Lower bonding pad; 2. Upper cover plate; 3. Lower cover plate; 4. Spring bolt; 5. Mounting slot; 6. Clip; 7. Observation through hole; 8. First circuit board; 9. Second circuit board; 10. First probe group; 11. Second probe group; 12. External wiring harness; 13. Connecting wiring harness; 14. Test board. Detailed Implementation

[0014] The present invention will be further described in detail below with reference to specific embodiments. The description is for explanation and not limitation of the present invention.

[0015] This utility model discloses a testing fixture for semi-finished endoscope modules, referring to... Figures 1-7 The system includes an upper cover plate 2 and a lower cover plate 3. One end of the upper cover plate 2 and the lower cover plate 3 are rotatably connected by a spring bolt 4, while the other end is movably connected, allowing the upper cover plate 2 and the lower cover plate 3 to open and close. For example, a buckle 6 is provided on the upper cover plate 2, and a slot is provided on the lower cover plate 3. The buckle 6 and the slot cooperate with each other. The upper and lower cover plates 3 are provided with uniform closing pressure and automatic spring-opening force through the spring bolt 4. The buckle 6 and the slot make the operation of placing and removing the semi-finished module very simple and quick. The operator only needs to open the fixture, put in the product, and close the fixture to start testing. Compared with the traditional method of welding temporary wire harnesses, the testing efficiency is improved.

[0016] Mounting slot 5 is formed on the surface of the lower cover plate 3 near the upper cover plate 2. Mounting slot 5 is used to place the semi-finished endoscope module 1 to be tested. First circuit board 8: fixed above the upper cover plate 2 of the fixture; Second circuit board 9: fixed below the lower cover plate 3 of the fixture; First probe group 10: Located below the first circuit board 8, when the upper and lower cover plates 3 are closed, the first probe group 10 elastically contacts the upper solder line PAD at the tail end of the circuit board of the endoscope module semi-finished product 1 to be tested, so as to realize the signal conduction between the first circuit board 8 and the semi-finished product. Second probe group 11: Located above the second circuit board 9, when the upper and lower cover plates 3 are closed, the second probe group 11 elastically contacts the lower solder line PAD at the tail end of the circuit board of the endoscope module semi-finished product 1, so as to realize the signal conduction between the second circuit board 9 and the semi-finished product. The first circuit board 8 and the second circuit board 9 are connected to the test board 14 via an external wiring harness 12.

[0017] An observation through-hole 7 is provided on the upper cover plate 2. The observation through-hole 7 is located above the mounting groove 5 and faces the lens module 101 of the endoscope module semi-finished product 1 to be tested. A transparent plate is provided at the observation through-hole 7.

[0018] The first probe group 10 and the second probe group 11 are symmetrically arranged, which makes the pressure applied to the semi-finished circuit board by the upper cover plate 2 uniform and symmetrical when closed. This avoids the risk of the circuit board bending, poor probe contact or even damage to the semi-finished product due to uneven force, and helps to improve the stability of the test and the service life of the fixture.

[0019] The testing process of this utility model's endoscope module semi-finished product testing fixture is as follows: Preparation: Loosen the clip 6, and under the elastic force of the spring bolt 4, the upper cover plate 2 of the fixture will lift up. Precisely place the semi-finished endoscope module 1 into the mounting groove 5 in the center area of ​​the lower cover plate 3 of the fixture.

[0020] Closure and Contact: Press down the upper cover plate 2 of the fixture until the buckle 6 engages with the corresponding slot on the lower cover plate 3 of the fixture. During this process, the spring bolt 4 is compressed, providing initial clamping force. Simultaneously, the first probe group 10, fixed below the first circuit board 8, extends downward under pressure, reliably and elastically contacting the upper solder pad at the tail end of the semi-finished circuit board; the second probe group 11, fixed above the second circuit board 9, extends upward under pressure, reliably and elastically contacting the lower solder pad at the tail end of the semi-finished circuit board. This achieves electrical signal conduction between the first circuit board 8, the second circuit board 9, and the semi-finished endoscope module 1.

[0021] Connect to external test equipment: One end of the external wiring harness 12 is soldered to the corresponding bonding pads of the first circuit board 8 and the second circuit board 9, and the other end is connected to the external test board 14.

[0022] Test execution: Power is supplied to the endoscope module semi-finished product 1 and control signals are sent through the test board 14 and the back-end decoding board to light up the lens module 101. The image signal generated by the lens module 101 is transmitted to the decoding board for decoding and processing through the probe group, circuit board, external wiring harness 122 and test board 14.

[0023] Imaging assessment: Operators can directly observe the imaging effect (e.g., sharpness, distortion, dirt, etc.) of the lens module 101 through the through-hole on the fixture cover plate 2. At the same time, the decoded image is displayed on the screen or automatically analyzed to comprehensively assess the imaging function, signal quality, etc.

[0024] Completion: After the test is completed, disconnect the test board 14, loosen the buckle 6, lift the upper cover plate 2 of the fixture, and take out the semi-finished endoscope module 1 after the test is completed.

[0025] This invention enables convenient and reliable testing of the core imaging function before welding the external wire harness 12 by directly contacting the key test points (upper and lower solder pads) of the semi-finished product with a probe assembly. The clamping structure of the fixture (spring bolt 4 + buckle 6) ensures the stable positioning of the semi-finished product and good electrical contact of the probes during the testing process.

[0026] This utility model discloses a semi-finished endoscope module test fixture that uses elastic probes instead of soldering, achieving non-destructive contact with the semi-finished product's solder pads. This avoids thermal or physical damage to the precision solder pads caused by repeated soldering and desoldering, thus protecting the product's integrity. The dispersed probe signals are collected via a built-in first circuit board 8 and second circuit board 9, and then connected to the test board 14 via an external wiring harness 12. This simplifies the fixture's internal structure, reduces flying wires, not only improves signal integrity but also standardizes and unifies the connection between the fixture and external testing equipment, avoiding the risk of incorrect wiring.

[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the technical solution of the present utility model in any way. Those skilled in the art should understand that, without departing from the spirit and principles of the present utility model, the technical solution can be modified and replaced in several simple ways, and these modifications and replacements are all within the scope of protection covered by the claims.

Claims

1. A testing fixture for a semi-finished endoscope module, characterized in that, include: The upper cover plate (2) and the lower cover plate (3) are connected at one end by a spring bolt (4) and at the other end by a movable connection so that the upper cover plate (2) and the lower cover plate (3) can be opened and closed. The mounting slot (5) is opened on the surface of the lower cover plate (3) near the upper cover plate (2). The mounting slot (5) is used to place the semi-finished endoscope module (1) to be tested. The first circuit board (8) is fixed above the upper cover plate (2) of the fixture; The second circuit board (9) is fixed below the lower cover plate (3) of the fixture; The first probe group (10) is located below the first circuit board (8) and is used to enable signal conduction between the first circuit board (8) and the semi-finished product; The second probe group (11) is located above the second circuit board (9) and is used to enable signal conduction between the second circuit board (9) and the semi-finished product; The first circuit board (8) and the second circuit board (9) are connected to the test board (14) via an external wiring harness (12).

2. The endoscope module semi-finished product testing fixture according to claim 1, characterized in that, The upper cover plate (2) is provided with a buckle (6), and the lower cover plate (3) is provided with a slot, and the buckle (6) cooperates with the slot.

3. The endoscope module semi-finished product testing fixture according to claim 1, characterized in that, When the upper and lower cover plates (3) are closed, the first probe group (10) contacts the upper solder line PAD at the end of the circuit board of the endoscope module semi-finished product (1) to be tested.

4. The endoscope module semi-finished product testing fixture according to claim 3, characterized in that, The first probe group (10) is in elastic contact with the upper bonding wire PAD.

5. The endoscope module semi-finished product testing fixture according to claim 1, characterized in that, When the upper and lower cover plates (3) are closed, the second probe group (11) contacts the lower solder line PAD at the end of the circuit board of the endoscope module semi-finished product (1).

6. The endoscope module semi-finished product testing fixture according to claim 5, characterized in that, The second probe group (11) makes elastic contact with the lower bonding wire PAD.

7. The endoscope module semi-finished product testing fixture according to claim 1, characterized in that, An observation through hole (7) is provided on the upper cover plate (2), and the observation through hole (7) is located above the mounting groove (5).

8. The endoscope module semi-finished product testing fixture according to claim 7, characterized in that, The observation hole (7) is facing the lens module (101) of the endoscope module semi-finished product (1) to be tested.

9. The endoscope module semi-finished product testing fixture according to claim 7, characterized in that, A transparent plate is installed at the observation hole (7).

10. The endoscope module semi-finished product testing fixture according to claim 1, characterized in that, The first probe group (10) and the second probe group (11) are symmetrically arranged.

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