Semiconductor module gate self-pressing device

Abstract

The utility model belongs to the technical field of electronic industry, concretely relates to a kind of semiconductor module gate self-adapting connection device, including rubber fixed block, two spring needles, triangular copper metal piece;Two spring needles have fixed installation on rubber fixed block, and the triangular copper metal piece has two, two triangular copper metal pieces are fixedly installed respectively in the lower end of two spring needles, rubber fixed block is provided with rubber fixed block extension baffle, rubber fixed block extension baffle is located between two spring needles, and it is located between two triangular copper metal pieces, and rubber fixed block extension baffle is used to block two triangular copper metal pieces and contact due to deformation;Two mounting holes are opened in the rubber fixed block, and two mounting holes are symmetrically distributed along the central axis of rubber fixed block length direction.

Description

Technical Field

[0001] This utility model belongs to the field of electronic industry technology, and specifically relates to a semiconductor module gate self-adaptive bonding device. Background Technology

[0002] In the testing of semiconductor modules (such as IGBT and MOSFET modules), it is often necessary to input a trigger signal by connecting the gate (gate) of the semiconductor module to activate the internal switching function of the module, thereby completing the testing of key parameters such as conduction characteristics, withstand voltage performance, and switching losses.

[0003] Currently, the industry commonly uses a bonding method where probes directly contact the gate (or electrode) of semiconductor modules to meet the triggering function requirements. However, because the gate (or electrode) size of semiconductor modules is small, this method requires high precision in process positioning. If the processing accuracy is insufficient, it is easy to fail to bond the probes accurately, resulting in the failure to trigger the semiconductor module test. Utility Model Content

[0004] The purpose of this invention is to provide a self-adaptive bonding device for semiconductor module gates to solve the problem that existing probes cannot be accurately bonded to the gates of semiconductor modules.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a semiconductor module gate self-adaptive bonding device, comprising a rubber fixing block, two spring pins, and a triangular copper metal part; The two spring pins are fixedly mounted on the rubber fixing block. There are two triangular copper metal parts, which are respectively fixedly mounted on the lower ends of the two spring pins. The rubber fixing block is provided with a rubber fixing block extension baffle, which is located between the two spring pins and between the two triangular copper metal parts. The rubber fixing block extension baffle is used to prevent the two triangular copper metal parts from contacting each other due to deformation.

[0006] Furthermore, the rubber fixing block has two mounting holes, which are opened through the thickness of the rubber fixing block and are symmetrically distributed along the central axis of the length of the rubber fixing block.

[0007] Furthermore, the spring pin is installed in the mounting hole, the inner diameter of which is slightly smaller than the outer diameter of the spring pin. When the two are assembled, they form an interference fit, and the spring pin is fixed to the rubber fixing block by adhesive.

[0008] Furthermore, the lower end of the spring pin is fixedly connected to the triangular copper metal part by welding.

[0009] Compared with the prior art, the beneficial effects of this utility model are: 1. The conical structure formed by two triangular copper metal parts and the contact characteristics at any position of the inclined surface of the triangular copper metal parts can greatly improve the bonding accuracy problem when the semiconductor module requires gate (gate) triggering characteristic testing.

[0010] 2. By using the combination design of two triangular copper metal parts and two independent spring pins, the processing accuracy can be greatly reduced and the device can adapt to various gate (gate) semiconductor module structures with a certain width interval. Attached Figure Description

[0011] Figure 1 This is a front view schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the rubber fixing block of this utility model; Figure 3 This is a front view schematic diagram of the rubber fixing block of this utility model; Figure 4 This is a side view of the rubber fixing block of this utility model; Figure 5 This is a schematic diagram of the application of this utility model in a needle-type gate (grid) module; Figure 6 This is a cross-sectional structural diagram of the present invention used in a needle-type gate (grid) module; Among them, 1-rubber fixing block, 2-spring pin, 3-triangular copper metal part, 12-mounting hole, 13-rubber fixing block extension baffle. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. It should be understood that the preferred embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can be arranged and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model. In the embodiments, the components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application.

[0013] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to an electrical connection; they can refer to a hydraulic connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0014] According to the appendix Figure 1 As shown, the present invention provides a gate self-adaptive bonding device for semiconductor modules, comprising a rubber fixing block 1, a spring pin 2, and a triangular copper metal part 3.

[0015] According to the appendix Figure 2-4 As shown: The rubber fixing block 1 is generally rectangular in shape. Two mounting holes 12 are formed along the thickness direction of the rubber fixing block 1 for embedding and assembling the spring pin 2. The two mounting holes 12 are symmetrically distributed along the central axis of the length direction of the rubber fixing block 1. The spring pin 2 is installed in the mounting holes 12. The inner diameter of the mounting holes 12 is slightly smaller than the outer diameter of the spring pin 2, forming an interference fit during assembly. This ensures that the spring pin 2 can achieve initial radial positioning after embedding, preventing radial offset during the initial assembly stage. Furthermore, the spring pin 2 and the rubber fixing block 1 are fixed with adhesive, further strengthening the connection stability after assembly and preventing axial loosening or radial offset of the spring pin 2 during the bonding process. Simultaneously, the adhesive layer seals the gap between the two, preventing external dust and moisture from intruding and affecting electrical performance.

[0016] According to the appendix Figure 1 As shown, a triangular copper metal part 3 is installed at the bottom end of each spring pin 2, and the triangular copper metal part 3 is fixedly connected to the spring pin 2 by welding. The triangular copper metal part 3 is semi-conical in shape, and two triangular copper metal parts 3 are installed opposite each other. At this time, the triangular copper metal parts 3 form a conical structure. This conical structure enables the binding operation of the gate (aperture) electrode of the semiconductor module. The conical guiding characteristics reduce the binding alignment accuracy requirements and ensure the reliability of the binding contact.

[0017] During the gate connection process of the semiconductor module, the two triangular copper metal parts 3 will come into contact with each other. To prevent the two triangular copper metal parts 3 from forming a short circuit due to deformation after contacting the gate of the device under test, a rubber fixing block extension baffle 13 is provided on the lower surface of the rubber fixing block 1. The rubber fixing block extension baffle 13 is made of the same material as the rubber fixing block 1. The rubber fixing block extension baffle 13 is sheet-shaped and located in the middle of the two mounting holes 12. At this time, the two spring pins 2 are located on both sides of the rubber fixing block extension baffle 13, and the two triangular copper metal parts 3 are also located on both sides of the rubber fixing block extension baffle 13. The rubber fixing block extension baffle 13 can prevent the two triangular copper metal parts 3 from contacting each other and forming a short circuit.

[0018] In addition, when the triangular copper metal part 3 deforms and contacts the rubber fixing block extension baffle 13, the rubber fixing block extension baffle 13 will absorb part of the impact force through slight elastic deformation. This not only avoids damage to the copper part due to rigid collision, but also limits the excessive deformation of the triangular copper metal part 3 through elastic recovery force, ensuring that the triangular copper metal part 3 can still maintain a relatively stable position after contacting the gate.

[0019] According to the appendix Figure 5-6 As shown in the embodiment: For semiconductor module gates (gates) of different structural specifications, this device has significant alignment tolerance and structural adaptability when performing the binding action through the moving overall structure. The specific implementation method is as follows: When the semiconductor module gate is connected, the two semi-conical triangular copper metal parts 3 are installed in a relative position, forming a conical structure. The design of this conical structure makes it possible to eliminate the need for high-precision positioning and calibration of the gate gap during the connection process.

[0020] In this device, the inclined surface of the triangular copper metal part 3 can be used as a contact reference. During the binding process, any inclined area of ​​the triangular copper metal part 3 can reach the effective contact range of the gate (gate) electrode of the semiconductor module. The guiding effect of the conical structure can automatically correct the motion deviation and guide the triangular copper metal part 3 to form a stable fit with the gate (gate) electrode, reducing the dependence on the processing accuracy and operation positioning accuracy of the motion mechanism.

[0021] Meanwhile, the two triangular copper metal parts 3 are respectively assembled with the rubber fixing block 1 through independent spring pins 2, and independent position adjustment and contact adaptation can be achieved during the binding process.

[0022] When the semiconductor module under test has gate processing accuracy deviations (such as gate spacing offset, misalignment of a single gate position, insufficient gate surface flatness, etc.), a single triangular copper metal piece 3 can independently adapt to the actual position of the corresponding gate by relying on the elastic extension and contraction characteristics of the spring pin 2, without needing to maintain synchronous alignment with another triangular copper metal piece 3. Even if the gate position is offset on one side due to accuracy defects in the gate portion of the device under test, the independent displacement compensation of a single triangular copper metal piece 3 can ensure that both triangular copper metal pieces 3 can form an effective electrical connection with the corresponding gate. This can solve the problem of connection failure caused by insufficient gate accuracy in traditional connection methods, and achieve compatibility and adaptation for gate (gate) structures of different specifications and accuracy.

[0023] Furthermore, this utility model device not only supports conventional semiconductor modules, but also needle-shaped gate (gate) modules. It utilizes a conical structure formed by two semi-conical triangular copper metal parts 3 facing each other. Its inclined surface can capture the position of the needle-shaped gate through a guiding effect. Even if there is a slight offset of the needle-shaped gate, it can still form effective contact with the gate sidewall through the inclined surface. This solves the problem that the needle-shaped gate (gate) module is prone to contact failure due to alignment deviation in the traditional binding scheme, thus broadening the applicability of the device.

[0024] This utility model also provides a method for preparing a semiconductor module gate adaptive bonding device, which is used to prepare the above-mentioned semiconductor module gate (gate) adaptive bonding device, including the following steps: S1: Material Selection Rubber fixing block 1: It can be made of light-cured fluorosilicone rubber / polyurethane interpenetrating network material, which achieves dual curing function of light and heat by means of molecular structure design, combining the heat resistance of fluorosilicone rubber with the high strength of polyurethane.

[0025] Spring pin 2: P156-J round-tip spring probe can be selected. This probe is made of all-copper material and has a unique self-cleaning function. During insertion and removal, the oxide layer on the copper surface is removed by mechanical friction, thus ensuring stable contact resistance, which is ≤50mΩ. Triangular copper metal parts 3: It is recommended to use pure copper, which has excellent conductivity and can ensure stable signal transmission when the gate (gate) electrodes of semiconductor modules are connected. At the same time, pure copper has good ductility, is easy to process, and has moderate softness, which can reduce hard wear on the gate (gate) electrodes during connection.

[0026] S2: Material Processing Rubber fixing block 1: It is recommended to use 3D printing technology for one-time molding, which can efficiently and accurately shape the required shape to meet the needs of complex structures.

[0027] Spring pin 2: Purchase finished products directly to reduce processing costs while ensuring product quality and performance stability. Triangular copper metal part 3: After basic shape shaping is achieved by turning, the surface is electroplated with chromium to increase the surface hardness to HV1000+, thereby improving wear resistance. This processing sequence can further reduce processing costs.

[0028] S3: Assembly Insert the spring pin 2 into the mounting hole 12 of the rubber fixing block 1 with an interference fit of 0.02mm, and perform a pressing operation using a 5kN press, ensuring that the perpendicularity is ≤0.5°. This operation ensures that the spring pin 2 is securely installed in the rubber fixing block 1 and pre-compresses the spring pin 2 by 9mm. Then, fix the spring pin 2 to the rubber fixing block 1 with adhesive. Subsequently, align the telescopic tip of the spring pin 2 with the welding point of the triangular copper metal part 3 and fix it by spot welding to complete the assembly of the entire device.

[0029] During assembly, the rubber fixing block extends the baffle 13 to completely block the two triangular copper metal parts 3, preventing them from deforming and coming into contact with each other after contacting the gate of the device under test, thereby preventing the formation of a short circuit loop.

[0030] S4: Implementation Effectiveness Verification The device was configured on a testing equipment to perform simulated bonding tests on semiconductor modules (test sample size exceeding 1000). After the test, it was checked whether each module had triggered failures due to bonding contact problems. At the same time, the structural stability and signal transmission reliability of the device during the continuous bonding process were recorded.

[0031] Test results: In the traditional method of directly contacting the gate (gate) electrode of the semiconductor module with a probe, after testing more than 1000 modules, 5% of the modules failed the test because of poor contact due to their own size and operator placement.

[0032] The structure of the device of the present invention was verified using the same testing method. After the test was completed, no module test failures were found due to poor contact of the gate (grid) connection.

[0033] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be primarily defined by the scope of the claims.

Claims

1. A gate adaptive bonding device for a semiconductor module, characterized in that: Includes a rubber fixing block (1), two spring pins (2), and a triangular copper metal part (3); The two spring pins (2) are fixedly installed on the rubber fixing block (1). There are two triangular copper metal parts (3). The two triangular copper metal parts (3) are fixedly installed on the lower ends of the two spring pins (2). The rubber fixing block (1) is provided with a rubber fixing block extension baffle (13). The rubber fixing block extension baffle (13) is located between the two spring pins (2) and between the two triangular copper metal parts (3). The rubber fixing block extension baffle (13) is used to prevent the two triangular copper metal parts (3) from contacting each other due to deformation.

2. The gate adaptive bonding device for a semiconductor module according to claim 1, characterized in that: The rubber fixing block (1) has two mounting holes (12) which are opened through the thickness direction of the rubber fixing block (1) and are symmetrically distributed along the central axis of the length direction of the rubber fixing block (1).

3. The gate adaptive bonding device for a semiconductor module according to claim 1, characterized in that: The spring pin (2) is installed in the mounting hole (12). The inner diameter of the mounting hole (12) is slightly smaller than the outer diameter of the spring pin (2). When the two are assembled, they form an interference fit. The spring pin (2) is fixed to the rubber fixing block (1) by adhesive.

4. The gate adaptive bonding device for a semiconductor module according to claim 1, characterized in that: The lower end of the spring pin (2) is fixedly connected to the triangular copper metal part (3) by welding.

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