A test module

CN224840411UActive Publication Date: 2026-10-09SHANGHAI JINJIN MICROELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202522191256.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-16
Publication Date
2026-10-09
Estimated Expiration
2035-10-16

AI Technical Summary

Technical Problem

[0003]然而,在实际应用中,当移动板需要进行高频次的精密移动,或承载对定位精度要求较高的测试组件时,这种较大尺寸的倒角结构可能带来一定的负面影响

Benefits of technology

[0004]有鉴于此,本申请实施例的目的在于提供一种测试模块,以改善现有技术中存在的上述问题。

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Abstract

The application provides a test module, and relates to the technical field of testing. The test module comprises a moving plate, a moving cavity, a test component and a positioning component. The moving plate is arranged inside the moving cavity. The projection area of the moving plate in the moving cavity is consistent with the size of the moving cavity. The moving plate comprises a first positioning structure and a second positioning structure. The test component comprises a test pin. The test pin is in contact with a test piece to form an electrical connection through the first positioning structure. The positioning component comprises a positioning hole. The projection of the second positioning structure on the positioning component does not exceed the positioning hole. The second positioning structure is inserted into the positioning hole to complete coarse positioning. The projection does not exceed the limit, which can reduce interference. Then, the test pin is guided into the test point of the test piece by the first positioning structure to form a high-reliability electrical connection. The double-positioning structure is matched to realize fast and accurate alignment of the probe and the test point, improve the test stability and efficiency, reduce wear, and be compatible with various packages.
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Description

Technical Field

[0001] This application relates to the field of testing technology, and more specifically, to a testing module. Background Technology

[0002] In the current field of semiconductor testing, the moving board of the test module is usually equipped with chamfered holes to facilitate assembly with connectors such as probes. This chamfer design generally reduces the alignment accuracy requirements between the connectors and holes during assembly by setting a large bevel, and also reduces hard contact and friction between the hole edges and the connectors.

[0003] However, in practical applications, when the moving board needs to perform high-frequency precision movements or carry test components with high positioning accuracy requirements, this large chamfered structure may have certain negative impacts. Specifically, the spatial redundancy in the chamfered area may cause additional wobbling of the connectors under small displacements, or increase the mating clearance between the holes and the connectors, thereby affecting the overall positioning accuracy of the test module and potentially leading to a decrease in test yield. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a testing module to improve the above-mentioned problems existing in the prior art.

[0005] This application provides a testing module, comprising: a movable plate, a movable cavity, a testing component, and a positioning component; the movable plate is disposed inside the movable cavity; wherein the projected area of ​​the movable plate in the movable cavity is consistent with the size of the movable cavity; the movable plate includes a first positioning structure and a second positioning structure; the testing component includes a test probe; wherein the test probe contacts the test piece through the first positioning structure to form an electrical connection; the positioning component includes a positioning hole; wherein the projection of the second positioning structure onto the positioning component does not exceed the positioning hole.

[0006] In the above implementation process, the consistent projected area allows the moving plate to slide without gaps within the moving cavity. First, the second positioning structure is inserted into the positioning hole to complete coarse positioning. Keeping the projection within limits reduces interference. Then, the first positioning structure guides the test probe in, forming a highly reliable electrical connection with the test point of the device under test. This dual positioning structure enables rapid and accurate alignment of the probe and the test point, improving test stability and efficiency, reducing wear, and ensuring compatibility with various packages.

[0007] Optionally, the first positioning structure includes: a plurality of test holes; the test holes are evenly distributed in the middle of the moving plate; the number of test holes is the same as the number of test pins, and corresponds one-to-one with the test pins.

[0008] In the above implementation process, by designing the first positioning structure as multiple test holes evenly distributed in the middle of the moving plate, and making the number of test holes completely consistent with the number of test needles and corresponding one-to-one, the precise positioning and guidance of all test needles can be completed at one time, avoiding needle body offset or tilting; the uniform arrangement ensures force balance, reduces the wear difference of single needles, improves test consistency, reliability and service life, and also facilitates quick disassembly and maintenance.

[0009] Optionally, the test hole includes a chamfered structure, wherein the radial width of the chamfer on the hole opening plane is less than 0.09 mm and the chamfer angle is greater than 45°.

[0010] In the above implementation process, the radial width of the chamfer on the orifice plane is less than 0.09 mm and the chamfer angle is greater than 45°. On the one hand, this allows the test probe to obtain a sufficiently large guide cone surface in the initial stage of insertion, significantly reducing the difficulty of centering the probe in the orifice and achieving rapid positioning. On the other hand, the small chamfer width avoids the decrease in orifice strength caused by excessive material removal and effectively removes burrs and micro-protrusions, reducing the risk of scratching the coating on the probe surface.

[0011] Optionally, the test hole includes a rounded corner structure.

[0012] In the above implementation process, by further setting the orifice of the test hole to a rounded structure, the original straight chamfer transition is transformed into a smooth curve transition; when the test needle is inserted with a certain eccentricity, the rounded corner can continuously and evenly disperse the lateral impact force of the needle body on the orifice, eliminating local stress concentration.

[0013] Optionally, the movable plate is one of a square plate, a square plate with rounded corners, or an irregularly shaped plate.

[0014] In the above implementation process, when using a conventional square plate, the rectangular cross-section of the moving cavity can be maximized to achieve the highest area utilization rate and increase the density of test holes that can be arranged at one time. When using a square plate with rounded corners, while maintaining a high area utilization rate, the rounded corners can alleviate stress concentration, avoid corner impacts and microcracks during high-speed reciprocating motion, and extend the life of the moving plate and seals. When using an irregularly shaped plate coupled with the surrounding mechanism, obstacles such as columns, wire grooves or optical sensors can be avoided in a limited space to achieve a compact layout. Furthermore, the contour self-positioning function can reduce additional guide components, thereby reducing the overall thickness and weight.

[0015] Optionally, the second positioning structure includes a first positioning protrusion and a second positioning protrusion; the first positioning protrusion and the second positioning protrusion have different shapes and are disposed on both sides of the same side of the movable plate; the height of the first positioning protrusion is the same as the height of the second positioning protrusion.

[0016] In the above implementation process, by setting the second positioning structure as the first positioning protrusion and the second positioning protrusion with the same surface, different shape and equal height, the anti-reverse insertion and limit of the moving plate can be realized at the same time in one clamping, avoiding the test target deviation caused by worker misoperation; the equal height design ensures that the two protrusions and the test piece make zero-gap contact at the same time, eliminating the tilt of the plate.

[0017] Optionally, the movable plate is a square plate, the first positioning protrusion is a cylinder, and the second positioning protrusion is a protrusion along the corner edge; wherein the first positioning protrusion and the second positioning protrusion are arranged on the diagonal of the movable plate.

[0018] In the above implementation process, a square moving plate is used, and the cylindrical first positioning protrusion and the corner edge-shaped second positioning protrusion are arranged on the same diagonal, which can complete the foolproof positioning of the moving plate in one go. The cylindrical protrusion provides a high-precision center reference, and the corner edge-shaped protrusion uses the longest lever arm of the diagonal to achieve angle locking.

[0019] Optionally, the movable plate includes a limiting groove; the movable cavity includes an elastic element; the limiting groove is disposed on the other side, distinct from the first positioning protrusion and the second positioning protrusion; the limiting groove is symmetrically arranged with the center of gravity of the movable plate as the center; the elastic element is connected to the limiting groove, and the limiting groove and the elastic element correspond one-to-one.

[0020] In the above implementation process, by symmetrically opening limiting grooves on the back of the moving plate with the center of gravity as the center, and allowing the elastic elements in the moving cavity to fall into the grooves one by one, the elastic force is evenly distributed to the entire plate. The elastic elements provide support for the moving plate and keep it horizontal, and the relative position of the needle tip and the point to be measured is always locked.

[0021] Optionally, the limiting groove is one of a circle, a square, or a polygon.

[0022] In the above implementation process, by optionally setting the limiting groove to a circle, square, or polygon, it can be quickly matched according to the shape of the elastic element. A circular groove is conducive to the automatic centering of rotationally symmetrical springs or rubber rings, a square groove is convenient for fitting with rectangular elastic blocks to prevent rotation, and a polygonal groove can also accommodate the contours of irregularly shaped elastic bodies.

[0023] Optionally, the test assembly further includes: a base; the test probe is connected to the base; and the center of the base is used to accommodate the test probe.

[0024] In the above implementation process, by uniformly fixing the test probes in the middle of the base, the base serves as both a common base for all test probes and an overall protective shell. The accommodating area in the middle of the base allows the probe tip to be suspended without being scratched by surrounding parts, and no additional protective sleeve is required for transportation or storage. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A first schematic diagram of the test components provided in this application; Figure 2 A second schematic diagram of the test components provided in this application; Figure 3 A first schematic diagram of the movable plate provided in this application; Figure 4 A second schematic diagram of the movable plate provided in this application; Figure 5 A third schematic diagram of the test components provided in this application.

[0027] Icons: 110-Moving plate; 111-First positioning structure; 1111-First positioning protrusion; 1112-Second positioning protrusion; 112-Second positioning structure; 1121-Limiting groove; 113-Test hole; 120-Moving cavity; 121-Elastic element; 200-Positioning assembly; 210-Positioning hole; 300-Testing assembly; 310-Test pin; 320-Base. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0029] The testing module's workflow is as follows: the chip is precisely positioned and placed into the cavity by a robotic arm, the cover moves downward, the spring probe is compressed, and a stable low-resistance contact is formed with the solder ball or pin; after completing DC, AC and functional tests, the cover is lifted, and the chips are sorted into good or defective product trays according to the results.

[0030] In this process, the movable plate 110 is a guide plate that can float up and down, ensuring that each pin can be pressed vertically into the chip without obstructing chip placement and removal. In the traditional solution, although the large chamfer is beneficial for assembly, the material and the probe only make local point contact on the inclined surface. During high-frequency sliding, stress concentration occurs, which accelerates probe wear.

[0031] This application provides a test module; please refer to [link / reference]. Figure 1, Figure 1 This is a first schematic diagram of the test component 300 provided in this application, which can also be combined with... Figure 2 To understand, Figure 2 This is a second schematic diagram of the test assembly 300 provided in this application. The test module includes: a moving plate 110, a moving cavity 120, a test assembly 300, and a positioning assembly 200; the moving plate 110 is disposed inside the moving cavity 120; wherein the projected area of ​​the moving plate 110 in the moving cavity 120 is the same as the size of the moving cavity 120; the moving plate 110 includes a first positioning structure 111 and a second positioning structure 112; the test assembly 300 includes a test needle 310; wherein the test needle 310 contacts the test piece through the first positioning structure 111 to form an electrical connection; the positioning assembly 200 includes a positioning hole 210; wherein the projection of the second positioning structure 112 on the positioning assembly 200 does not exceed the positioning hole 210.

[0032] Based on the above structural implementation process, by setting the moving plate 110 inside the moving cavity 120 and ensuring that the projected area of ​​the moving plate 110 in the moving cavity 120 is consistent with the size of the moving cavity 120, the positioning and stable sliding of the moving plate 110 within the moving cavity 120 are achieved. At the same time, the first positioning structure 111 is used to guide and limit the test probe 310, enabling it to accurately and reliably contact the test piece and form an electrical connection, thereby improving the accuracy and consistency of the test. In addition, the projection of the second positioning structure 112 on the positioning component 200 does not exceed the positioning hole 210, ensuring that the positioning component 200 will not interfere with the second positioning structure 112 during assembly or adjustment, further improving the assembly efficiency and operational stability of the entire test module.

[0033] Optionally, the 310 test probe can be made of beryllium copper (Be-Cu), which has good elasticity, conductivity, and wear resistance, and is a mainstream high-lifespan solution; it can also be SK4 / piano steel with gold plating, which has high hardness and low contact resistance, suitable for high pressure and low current; it can also be tungsten steel, which is ultra-wear-resistant and high-temperature resistant, and is specially used for high-frequency, high-temperature or high-impact scenarios; or gold-plated phosphor bronze, which has low cost and solder pad friendliness, and is suitable for low-pressure, consumer chip testing.

[0034] Optionally, the movable board 110 can be made of stainless steel, which is high in strength, wear-resistant, and corrosion-resistant, making it suitable for long-life, high-pressure testing; it can also be made of hard anodized aluminum, which is lightweight, has fast thermal conductivity, and low cost, making it suitable for high-speed, low-pressure scenarios; or it can be made of PEEK / reinforced engineering plastics, which is insulating, has low dielectric loss, and soft contact, making it suitable for high-frequency, sensitive chip testing, and can be injection molded in one piece, reducing weight and cost.

[0035] In one embodiment of this application, the movable board 110 is made of PEEK (polyetheretherketone) material. The excellent properties of PEEK material, such as high temperature resistance (heat distortion temperature exceeding 300°C, capable of long-term stable operation at 260°C, and short-term tolerance to 350°C), chemical corrosion resistance (almost insoluble in any organic solvent, highly resistant to acids, alkalis, salts, and other chemicals), and high wear resistance (wear coefficient far lower than common thermoplastic polymers), provide a fundamental guarantee for the performance of the movable board 110, ensuring stable operation in semiconductor testing environments. Furthermore, its good processing performance facilitates subsequent process implementation.

[0036] For mobile board 110, please refer to Figure 3 , Figure 3 This is a first schematic diagram of the movable board 110 provided in this application.

[0037] Optionally, the first positioning structure 111 includes: a plurality of test holes 113; the test holes 113 are evenly distributed in the middle of the moving plate 110; the number of test holes 113 is the same as the number of test pins 310, and corresponds one-to-one with the test pins 310.

[0038] Based on the above structure implementation process, the test holes 113 are evenly distributed in the middle of the moving plate 110, and the number corresponds one-to-one with the test pins 310, ensuring that the probes are subjected to uniform force and pressed down synchronously, avoiding skewing or loose connection, and further improving contact reliability and module life.

[0039] Optionally, the test hole 113 includes a chamfer structure, wherein the radial width of the chamfer on the hole opening plane is less than 0.09 mm and the chamfer angle is greater than 45°.

[0040] Based on the above structure implementation process, the radial width of the orifice chamfer is less than 0.09mm and the chamfer angle is greater than 45°, which facilitates the smooth insertion of the test probe 310, avoids scratching or jamming, and balances insertion and removal life and alignment accuracy.

[0041] In one embodiment of this application, the diameter is reduced from 0.09 mm to 0.045 mm, which greatly limits the shaking space of the connector during the high-frequency precision movement of the moving plate 110, significantly improves the positioning accuracy of the moving plate 110, ensures the accuracy of the contact position between the probe and the semiconductor device during the test, and improves the reliability of the test data.

[0042] Optionally, the test hole 113 includes a rounded corner structure.

[0043] Based on the above structure implementation process, the rounded corners of the orifice can eliminate sharp edges, the test probe 310 slides in more smoothly, reducing wear and jamming, and extending the life of the probe and the plate.

[0044] Optionally, the radius of the arc transition of the orifice with rounded corners is less than 0.05 mm.

[0045] Based on the above implementation process, the rounded corner structure retains the guiding function without sacrificing positioning accuracy. The probe can be finely adjusted into position, balancing smoothness and precision.

[0046] Optionally, the movable plate 110 is one of a square plate, a square plate with rounded corners, or an irregularly shaped plate.

[0047] Based on the above structural implementation process, the movable plate 110 can be freely selected in square, rounded square, or irregular shape according to the overall layout. Square plates are simple to process and low in cost; rounded square plates can alleviate stress concentration and prevent corner chipping during assembly; irregular shapes can avoid surrounding components and achieve high-density arrangement. Regardless of the shape adopted, the edge of the plate matches the contour of the movable cavity 120 mirror, which not only maintains the guiding accuracy but also leaves more freedom for structural design, enabling the test module to complete the rapid, accurate, and low-wear alignment of probes even in miniaturized and irregularly shaped equipment.

[0048] Optionally, the second positioning structure 112 includes a first positioning protrusion and a second positioning protrusion; the first positioning protrusion and the second positioning protrusion have different shapes and are disposed on both sides of the same side of the movable plate 110; the height of the first positioning protrusion is the same as the height of the second positioning protrusion.

[0049] Based on the above structure implementation process, the two ends of the same side of the moving plate 110 are respectively provided with first and second positioning protrusions of different shapes but equal height; after the two are inserted into the positioning hole 210 at the same time, the shape difference allows only one correct posture to be placed, which not only prevents mistakes but also provides bidirectional limit, so that the moving plate 110 can complete the rotation and translation correction in the moving cavity 120 in one go, realize the rapid and accurate alignment of the probe and the point to be tested, avoid repeated debugging, and improve assembly efficiency and test consistency.

[0050] For details on the specific mobile board 110, please refer to [link / reference]. Figure 4 , Figure 4 This is a second schematic diagram of the movable plate 110 provided in this application.

[0051] Optionally, the movable plate 110 is a square plate, the first positioning protrusion 1111 is a cylinder, and the second positioning protrusion 1112 is a protrusion along the corner edge; wherein the first positioning protrusion 1111 and the second positioning protrusion 1112 are located on the diagonal of the movable plate 110.

[0052] Based on the above structure implementation process, the square movable plate 110 is provided with a first positioning protrusion 1111 and a second positioning protrusion 1112 at the corner edge, respectively, with cylindrical protrusions at the two diagonal ends. The two protrusions have different shapes and are located diagonally. When inserting into the positioning hole 210, the first positioning protrusion 1111 cylindrical protrusion is used to complete the initial centering, and then the irregular second positioning protrusion 1112 eliminates the rotational degree of freedom, so as to realize the unique correct posture lock of the movable plate 110 in the movable cavity 120, ensuring that the test probe 310 and the test point are accurately aligned at one time, while preventing foolproof insertion and reverse insertion, improving assembly efficiency and test consistency.

[0053] Combination Figure 4 Please see Figure 5 , Figure 5 This is a third schematic diagram of the test component 300 provided in this application.

[0054] Optionally, the movable plate 110 includes a limiting groove 1121; the movable cavity 120 includes an elastic element 121; the limiting groove 1121 is disposed on the other side that is different from the first positioning protrusion and the second positioning protrusion; the limiting groove 1121 is symmetrically arranged with the center of gravity of the movable plate 110 as the center; the elastic element 121 is connected to the limiting groove 1121, and the limiting groove 1121 and the elastic element 121 correspond one-to-one.

[0055] Based on the above structural implementation process, several limiting grooves 1121 are symmetrically opened on the back of the moving plate 110 with the center of gravity as the center, and the moving cavity 120 is provided with the same number of elastic elements 121 at corresponding positions. When the moving plate 110 slides into the cavity, the elastic elements 121 are engaged with the limiting grooves 1121 one by one, forming a centrally symmetrical flexible support, which is used to reset the moving plate 110 after the test is completed. This structure provides a uniform reaction force at the moment the test probe 310 is pressed down, offsetting the lateral component force, preventing the plate from deflecting or rebounding, and at the same time absorbing vibration, so that the probe and the test point maintain a constant contact pressure, improving the stability of electrical connection and the repeatability accuracy of the test, and reducing the wear on the rigid guide rail.

[0056] Optionally, the limiting groove 1121 can be one of a circle, a square, or a polygon.

[0057] Based on the above structural implementation process, the limiting groove 1121 can be flexibly selected as circular, square, or polygonal according to the shape of the end of the elastic element 121. Circular grooves are simple to process and have good centering, making them suitable for ball-head spring posts; square or polygonal grooves, in conjunction with the corresponding cross-section of the elastic element 121, can additionally restrict circumferential rotation, further enhancing the torsional resistance of the moving plate 110 during testing. Regardless of the groove shape, it maintains a one-to-one correspondence with the elastic element 121 and a symmetrical arrangement of the center of gravity, ensuring balanced force on the moving plate 110 and guaranteeing a stable and low-wear-resistant reliable electrical connection between the probe and the test point.

[0058] Optionally, the test assembly 300 further includes: a base 320; a test probe 310 connected to the base 320; and a central portion of the base 320 for accommodating the test probe 310.

[0059] Based on the above structure implementation process, the test probe 310 is first fixed in the middle of the base 320, and then the base 320 is docked with the first positioning structure 111 of the moving plate 110, so that all probes are synchronously introduced into the test hole 113 at one time. The base 320 not only protects the probe body from overpressure bending, but also evenly distributes the downward pressure to each probe to ensure contact consistency, and facilitates overall replacement. During maintenance, there is no need to adjust the individual probes; the probe maintenance or upgrade can be completed by directly replacing the base 320.

[0060] In summary, this application provides a test module, relating to the field of testing technology. The test module includes: a movable plate 110, a movable cavity 120, a test component 300, and a positioning component 200; the movable plate 110 is disposed inside the movable cavity 120; wherein the projected area of ​​the movable plate 110 in the movable cavity 120 is the same as the size of the movable cavity 120; the movable plate 110 includes a first positioning structure 111 and a second positioning structure 112; the test component 300 includes a test needle 310; wherein the test needle 310 forms an electrical connection with the test piece through the first positioning structure 111; the positioning component 200 includes a positioning hole 210; wherein the projection of the second positioning structure 112 on the positioning component 200 does not exceed the positioning hole 210. First, the second positioning structure 112 is inserted into the positioning hole 210 to complete coarse positioning; the projection not exceeding the limit reduces interference. Then, the first positioning structure 111 guides the test needle 310 in, forming a highly reliable electrical connection with the test point of the test piece. The dual-positioning structure enables rapid and accurate alignment of the probe and the test point, improving testing stability and efficiency, reducing wear, and ensuring compatibility with various packages. In the several embodiments provided in this application, it should be understood that the disclosed device can also be implemented in other ways. The device embodiments described above are merely illustrative; for example, the block diagrams in the accompanying drawings show the possible architecture, functions, and operations of the device according to various embodiments of this application. Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0061] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

[0063] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A test module, characterized in that, The test module includes: a moving plate, a moving cavity, a test component, and a positioning component; The movable plate is disposed inside the movable cavity; wherein the projected area of ​​the movable plate in the movable cavity is the same as the size of the movable cavity; The movable plate includes a first positioning structure and a second positioning structure; The test component includes a test probe; wherein the test probe forms an electrical connection with the test piece through the first positioning structure. The positioning component includes a positioning hole; wherein the projection of the second positioning structure onto the positioning component does not exceed the positioning hole.

2. The test module according to claim 1, characterized in that, The first positioning structure includes: multiple test holes; The test holes are evenly distributed in the middle of the moving plate; The number of test holes is the same as the number of test pins, and each test hole corresponds to one test pin.

3. The test module according to claim 2, characterized in that, The test hole includes a chamfered structure, wherein the radial width of the chamfer on the hole opening plane is less than 0.09 mm and the chamfer angle is greater than 45°.

4. The test module according to claim 2, characterized in that, The test hole has a rounded corner structure.

5. The test module according to claim 1, characterized in that, The movable plate is one of the following: a square plate, a square plate with rounded corners, or an irregularly shaped plate.

6. The test module according to claim 1, characterized in that, The second positioning structure includes a first positioning protrusion and a second positioning protrusion; The first positioning protrusion and the second positioning protrusion have different shapes and are located on both sides of the same side of the moving plate; The height of the first positioning protrusion is the same as the height of the second positioning protrusion.

7. The test module according to claim 6, characterized in that, The movable plate is a square plate, the first positioning protrusion is a cylinder, and the second positioning protrusion is a protrusion shape along the corner edge; The first positioning protrusion and the second positioning protrusion are located on the diagonal of the moving plate.

8. The test module according to claim 6, characterized in that, The movable plate includes a limiting groove; the movable cavity includes an elastic element; The limiting groove is located on the other side, which is different from the first positioning protrusion and the second positioning protrusion; The limiting grooves are arranged symmetrically with the center of gravity of the moving plate as the center; The elastic element is connected to the limiting groove, and the limiting groove corresponds one-to-one with the elastic element.

9. The test module according to claim 8, characterized in that, The limiting groove is one of the following: circular, square, or polygonal.

10. The test module according to claim 1, characterized in that, The test components also include: a base; The test probe is connected to the base; the middle part of the base is used to accommodate the test probe.