Noise injection module and apparatus for chip power supply fault tolerance test

Abstract

The application discloses a noise injection module and a device for chip power supply fault-tolerant test, and belongs to the field of testing. The noise injection module comprises a power supply module, a signal generation module, a signal enhancement module, a signal coupling module and a measured module. The output end of the power supply module is connected with the direct current input end of the signal coupling module, the output end of the signal generation module is connected with the input end of the signal enhancement module, the output end of the signal enhancement module is connected with the noise signal input end of the signal coupling module, and the output end of the signal coupling module is connected with the voltage input end of the measured module.

Description

Technical Field

[0001] This application belongs to the field of testing, specifically relating to a noise injection module and an apparatus for chip power supply fault tolerance testing. Background Technology

[0002] Currently, in the power supply fault tolerance testing process of various chips, it is necessary to inject noise into the power supply of the chip and then test it.

[0003] In related technologies, isolation transformers are used for power supply coupling and noise injection. Specifically, a balun transformer can be used to inject the noise signal generated by the signal generator into the power supply of the chip under test.

[0004] However, the related technologies suffer from the problem of small power supply noise injection amplitude, which makes it difficult to meet actual noise injection requirements. This is because the noise amplitude injected into the power supply of the chip under test depends on the maximum amplitude of the signal generator. Since the output noise amplitude of the signal generator is limited, it is difficult to meet actual noise injection requirements in many situations (such as when the current of the chip under test increases). Utility Model Content

[0005] This application provides a noise injection module and an apparatus for chip power supply fault tolerance testing. It can use a signal enhancement module to enhance the noise signal output by the signal generation module, thereby coupling the enhanced noise signal into the power supply of the module under test. This solves the problem in related technologies that the power supply noise injection amplitude is small and cannot meet the actual noise injection requirements.

[0006] In a first aspect, embodiments of this application provide a noise injection module, including: a power supply module, a signal generation module, a signal enhancement module, a signal coupling module, and a module under test; Specifically, the output terminal of the power supply module is connected to the DC input terminal of the signal coupling module, the output terminal of the signal generation module is connected to the input terminal of the signal enhancement module, the output terminal of the signal enhancement module is connected to the noise signal input terminal of the signal coupling module, and the output terminal of the signal coupling module is connected to the voltage input terminal of the module under test.

[0007] Secondly, embodiments of this application provide an apparatus for chip power supply fault tolerance testing, including the noise injection module described in the first aspect.

[0008] In this embodiment, the noise injection module includes a power supply module, a signal generation module, a signal enhancement module, a signal coupling module, and a module under test. The output of the power supply module is connected to the DC input of the signal coupling module, the output of the signal generation module is connected to the input of the signal enhancement module, the output of the signal enhancement module is connected to the noise signal input of the signal coupling module, and the output of the signal coupling module is connected to the voltage input of the module under test. Thus, in the noise injection module provided in this embodiment, since the output of the signal generation module is connected to the noise signal input of the signal coupling module through the signal enhancement module, the noise signal output by the signal generation module can be enhanced using the signal enhancement module. This enhances the noise signal and couples it into the power supply of the module under test, solving the problem in related technologies where the power supply noise injection amplitude is small and cannot meet actual noise injection requirements. Attached Figure Description

[0009] Figure 1 Schematic structural diagram of a noise injection module provided in some embodiments of this application; Figure 2 Schematic structural diagram of a noise injection module provided in some embodiments of this application; Figure 3-1 for Figure 2 A schematic diagram of the equivalent circuit of the noise injection module shown. Figure 3-2 for Figure 3-1 The simulation waveform of the equivalent circuit is shown below; Figure 4 This is a schematic structural diagram of an apparatus for chip power supply fault tolerance testing provided in some embodiments of this application.

[0010] Explanation of reference numerals in the attached figures: 10 - Noise injection module; 100 - Power supply module; 200 - Signal generation module; 300 - Signal enhancement module; 400 - Signal coupling module; 500 - Module under test; U1 - Low dropout linear regulator; MCU - Microcontroller unit; CON2 - Connector; G1 - Grounding component; G2 - Grounding component; G3 - Grounding component; G4 - Grounding component; S - Signal receiving pin; U3 - Operational amplifier; U4 - Chip under test; IN - Voltage input pin; R1 - First resistor; R2 - Second resistor; R3 - Third resistor; R4 - Fourth resistor; R5 - Fifth resistor; R6 - Sixth resistor; R7 - Seventh resistor; C1 - Filter capacitor; C2 - Second capacitor; C3 - Third capacitor; T1 - Isolation transformer; L1 - Primary coil; L2 - Secondary coil; 40 - Device for chip power supply fault tolerance testing. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0012] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] In the description of this application, it should be understood that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0014] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connection" and "coupled" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a wired connection or a wireless connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0015] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0016] The noise injection module provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0017] Figure 1 This is a schematic structural diagram of a noise injection module provided in an embodiment of this application.

[0018] like Figure 1As shown, the noise injection module 10 provided in this application embodiment may include: a power supply module 100, a signal generation module 200, a signal enhancement module 300, a signal coupling module 400, and a module under test 500; The output terminal of the power supply module 100 is connected to the DC input terminal of the signal coupling module 400, the output terminal of the signal generation module 200 is connected to the input terminal of the signal enhancement module 300, the output terminal of the signal enhancement module 300 is connected to the noise signal input terminal of the signal coupling module 400, and the output terminal of the signal coupling module 400 is connected to the voltage input terminal of the module under test 500.

[0019] Thus, in the noise injection module provided in this application embodiment, since the output terminal of the signal generation module 200 is connected to the noise signal input terminal of the signal coupling module 400 through the signal enhancement module 300, the noise signal output by the signal generation module 200 can be enhanced by the signal enhancement module 300, thereby coupling the enhanced noise signal into the power supply of the module under test 500, solving the problem in the related technology that the power supply noise injection amplitude is small and it is difficult to meet the actual noise injection requirements.

[0020] For example, such as Figure 1 As shown, in some embodiments of this application, the working principle of the noise injection module 10 includes: the output terminal of the power supply module 100 outputs a DC signal to the DC input terminal of the signal coupling module 400; the output terminal of the signal generation module 200 outputs a noise signal to the input terminal of the signal enhancement module 300; the signal enhancement module 300 performs enhancement processing on the input noise signal to obtain a target noise signal (i.e., the enhanced noise signal), and outputs the target noise signal to the noise signal input terminal of the signal coupling module 400 through its output terminal; the signal coupling module 400 couples the DC signal input at the DC input terminal with the target noise signal input at the noise signal input terminal to obtain a test signal, and outputs the test signal to the voltage input terminal of the module under test 500 through its output terminal.

[0021] In this embodiment, the frequency of the noise signal output from the output terminal of the signal generation module 200 is adjustable. For example, the signal generation module 200 can generate a switching signal or a sine wave signal in the frequency range of 0 to 20 MHz, so that the frequency of the noise signal output from the output terminal of the signal generation module 200 can be flexibly adjusted. Thus, this embodiment utilizes the signal generation module 200 to provide a frequency-controllable noise source for the test signal coupled by the signal coupling module 400.

[0022] In this embodiment, the target noise signal output by the output terminal of the signal enhancement module 300 is obtained by enhancing the noise signal input by the input terminal of the signal enhancement module 300. For example, the signal enhancement module 300 can enhance the voltage amplitude, current magnitude, and voltage change rate (i.e., output slope) of the noise signal output by the signal generation module 200 to obtain the target noise signal and achieve a better ripple injection effect.

[0023] In this embodiment, the test signal output from the output terminal of the signal coupling module 400 can be obtained by coupling the DC signal input from the DC input terminal with the target noise signal input from the noise signal input terminal. For example, the signal coupling module 400 can superimpose the target noise signal input from the noise signal input terminal onto the DC signal input from the DC input terminal to mix and output the test signal, thereby injecting the enhanced target noise signal into the test signal based on the DC voltage signal. This solves the problem in related technologies where the power supply noise injection amplitude is small and cannot meet actual noise injection requirements.

[0024] The following example illustrates the noise injection module 10 provided in this application embodiment, taking into account the specific structure of each functional module in the noise injection module 10.

[0025] In practical applications, the power supply module 100 provides a power input for power supplies requiring noise injection. This power input must be free of switching noise to avoid influencing subsequent power supply noise injection. The power supply module 100 must have high input ripple suppression to prevent the input power from influencing subsequent power supply noise injection. Furthermore, the current requirement of the power supply module 100 must match the current carrying capacity of the balun converter in the subsequent signal coupling module 400. To address these requirements, in some embodiments of this application, a low dropout regulator (LDO) can be selected as the power supply module 100. Compared to other types of power supply modules, the LDO does not have power ripple generated by switching and has excellent ripple suppression capabilities, effectively isolating input noise and not generating noise interference for subsequent circuits. A current carrying capacity of 1A is selected for the LDO to match most current requirements.

[0026] For example, such as Figure 2 As shown, the power supply module 100 may include a low dropout linear regulator U1, the output terminal of which is connected to the DC input terminal of the signal coupling module 400.

[0027] Among them, such as Figure 2 As shown, the low dropout linear regulator U1 can be a power supply chip with VIN pin, EN pin, GND pin, Epad pad, OUT1 pin, OUT2 pin and ADJ pin.

[0028] The VIN pin is the power input terminal of the chip, used to input voltage. The unregulated, higher DC voltage V1 from the voltage input terminal of the power supply module 100 is connected to this VIN pin. The task of the low dropout linear regulator U1 is to reduce this DC voltage (e.g., V1) and stabilize it to the required DC voltage (e.g., V2) for output.

[0029] An input capacitor, namely the second capacitor C2, is also set near the VIN pin. The VIN pin is grounded through the second capacitor C2 for filtering and stabilizing operation. The second capacitor C2 can be 1µF to 10µF to cope with instantaneous high current requirements.

[0030] The EN pin is the enable pin, a digital control pin used to turn the LDO output on or off. The EN pin is connected to the DC voltage V1 terminal via resistor R5. When the EN pin is high (above a certain potential, such as 1.5V), the low-dropout linear regulator U1 operates normally, and the OUT1 / OUT2 pins have voltage output. When the EN pin is low (e.g., close to the GND pin), the low-dropout linear regulator U1 enters shutdown or sleep mode, the OUT1 / OUT2 pins have no output, and the power consumption of the low-dropout linear regulator U1 becomes extremely low.

[0031] The GND pin is the ground pin, providing a common reference ground for the low-dropout linear regulator U1. All voltage measurements are referenced to the voltage on this pin. Current flows in from the VIN pin, passes through the internal circuitry, and finally flows out from the GND pin, forming a complete current loop. The GND pin can be directly grounded.

[0032] The Epad is not an electrical function pin, but a mechanical and thermal structure, typically a large exposed metal area on the bottom of the chip. Its primary function is heat dissipation. During operation, the low-dropout linear regulator U1 converts its power loss into heat. This Epad efficiently conducts this heat to the circuit board, reducing the chip temperature and preventing overheating-induced protection triggering or damage. The Epad is connected to the GND pin for optimal noise performance and heat dissipation.

[0033] The OUT1 / OUT2 pins are regulated, clean DC voltage output terminals used to provide a stable power supply to the subsequent load circuits. The OUT1 / OUT2 pins are two output channels; for example, OUT1 outputs 3.3V, and OUT2 outputs 1.8V, etc. They share the same VIN pin, but internally they are two independent adjustment circuits. In this embodiment, the OUT1 and OUT2 pins are connected, allowing them to jointly output a 1.8V DC signal, ensuring that the voltage at the voltage output terminal V2 of the power supply module 100 is 1.8V.

[0034] An output capacitor, namely the third capacitor C3, is also set near the OUT1 pin. The OUT1 pin is grounded through the third capacitor C3 for filtering and stabilization. The third capacitor C3 can be 1µF to 10µF to ensure the loop stability and transient response of the low dropout linear regulator U1.

[0035] The ADJ pin is used on the adjustable output low-dropout linear regulator U1 to regulate the output voltage V2. The ADJ pin is connected to an external resistor divider (the seventh pull-up resistor R7 is connected to the OUT1 pin, and the sixth pull-down resistor R6 is grounded), allowing for setting any output voltage. The output voltage V2 is calculated as: V2 = Vf * (1 + R7 / R6), where Vf is the internal reference voltage of the low-dropout linear regulator U1 (e.g., 1.2V). By adjusting the output voltage V2 of the power supply module through the ADJ pin, different output voltages can be generated using the same chip, improving the flexibility and range of testing.

[0036] Thus, in this embodiment of the application, a low-dropout linear regulator U1 is used to provide a DC signal. The low-dropout linear regulator U1 has no power ripple generated by switching and has excellent ripple suppression capability. It can fully isolate the noise generated by the input power supply and does not generate noise interference to the subsequent circuits, thereby improving the accuracy of the test.

[0037] In some embodiments of this application, the signal generation module 200 provides a frequency-controllable noise source for the test signal output by the signal coupling module 400. The signal generation module 200 is required to output a switching signal or a sine wave signal within the 0-20MHz frequency range. In practical applications, various implementation methods can be used to meet these requirements.

[0038] For example, such as Figure 2 As shown, the signal generation module 200 includes at least one of a microcontroller unit (MCU) and a connector (CON2).

[0039] For example, in a specific instance, when the signal generation module 200 includes a microcontroller unit (MCU), the MCU is connected to the input of the signal enhancement module 300. In this embodiment, the MCU can be programmed to output a switching signal or a sine wave signal within the 0-20MHz frequency range to the signal enhancement module 300. The advantage of this approach is its programmability and controllability, enabling automated noise injection testing.

[0040] Thus, the embodiments of this application can use MCU programming to output noise signals in the frequency range of 0-20M. The advantage of this method is that it is programmable and controllable, and can realize automated noise injection testing.

[0041] Of course, the above-mentioned method of outputting noise signals using MCU programming requires the support of professional programmers and is not easy to debug. In other embodiments of this application, an external signal generator can also be used to output noise signals. The advantage of this method is that it is simple and easy to operate, and is more suitable for daily debugging.

[0042] For example, in another specific instance, when the signal generation module 200 includes a connector CON2, the signal receiving pin S of the connector CON2 is connected to the input terminal of the signal enhancement module 300.

[0043] The connector CON2 has a signal receiving pin S, which is used to connect to an external signal generator of the noise injection module 10. In this embodiment, the signal receiving pin S of the connector CON2 can be connected to the external signal generator via a cable. In this case, the external signal generator is connected to the input terminal of the signal enhancement module 300 via the cable and the signal receiving pin S of the connector CON2. Thus, the external signal generator can generate a switching signal or a sine wave signal in the frequency range of 0-20MHz, and output it to the input terminal of the signal enhancement module 300 through the signal receiving pin S of the connector CON2 as a noise source for the test signal.

[0044] Connector CON2 may include four grounding components, namely G1, G2, G3 and G4, and connector CON2 can be grounded through G1, G2, G3 and G4.

[0045] Thus, in this embodiment of the application, an external signal generator is connected through connector CON2, so that the external signal generator can generate a switching signal or a sine wave signal in the frequency range of 0-20M, and output to the input terminal of the signal enhancement module 300 through the signal receiving pin S of connector CON2 as a noise source for the test signal, which is simple and easy to operate.

[0046] In some embodiments of this application, the signal enhancement module 300 can employ an isolation transformer to couple DC signals and high-frequency AC signals, thereby injecting noise signals into the power supply. According to Faraday's law of electromagnetic induction, the secondary induced voltage V2 of the isolation transformer is proportional to the rate of change of the primary current: V = M * di / dt, where M is the mutual inductance and di / dt is the rate of change of the primary current. As can be seen from the formula, the faster the rate of change of the primary current, the higher the secondary induced voltage V, resulting in a more significant coupling effect.

[0047] The primary current change rate di / dt is directly proportional to the voltage value and the inductance. Generally, the smaller the inductance, the higher the voltage value, and the higher the current change rate. Based on this, the signal enhancement module 300 achieves the purpose of rapidly increasing the voltage to a preset voltage value and rapidly decreasing the voltage to a preset voltage value under high-frequency conditions.

[0048] To achieve the above requirements, this embodiment of the application can use a current-type operational amplifier in the signal enhancement module 300 to enhance the slope of the noise signal. The input stage of a current-type operational amplifier receives a current signal (or converts it to current through a resistor), and internally converts the input current directly to the output current through transconductance. The output stage is often a current buffer or a current-to-voltage conversion structure. Its core advantage is that it overcomes the capacitive limitation of the "voltage-to-current" conversion in voltage-type operational amplifiers. When a current signal is transmitted, the capacitive load's resistance to the current manifests as a "voltage change rate," rather than directly limiting the current itself. When the input current changes abruptly, the output current can quickly follow, avoiding the smooth edge problem caused by the "capacitor charging time" in voltage-type operational amplifiers, and improving the bandwidth and rise slope of the output noise signal.

[0049] In practical applications, the current-type operational amplifier selected in this embodiment has an output slope of 1700V / μs, which far exceeds the output slope of most current-type operational amplifiers. When used in the current solution, it can achieve better ripple injection effect.

[0050] For example, such as Figure 2 As shown, the signal enhancement module 300 may include an operational amplifier U3, a first resistor R1, a second resistor R2, a third resistor R3, and a fourth resistor R4; The first input terminal of the operational amplifier U3 is connected to the output terminal of the signal generation module 200. The first input terminal of the operational amplifier U3 is also grounded through the first resistor R1. The second terminal of the operational amplifier U3 is connected to the output terminal of the operational amplifier U3 through the second resistor R2. The second terminal of the operational amplifier U3 is also grounded through the third resistor R3. The output terminal of the operational amplifier U3 is connected to the noise signal input terminal of the signal coupling module 400 through the fourth resistor R4.

[0051] In this way, by setting the operational amplifier U3 to enhance the driving capability, the voltage of the target noise signal can be rapidly increased to a preset voltage value (e.g., 3.5V) in the signal enhancement module 300 under high frequency conditions, and then rapidly decreased to a preset voltage value (e.g., 0V).

[0052] For example, operational amplifier U3 is a current-mode operational amplifier. The target noise signal output from the output terminal of the current-mode operational amplifier is obtained by enhancing the noise signal input from the first input terminal of the current-mode operational amplifier.

[0053] The input stage of operational amplifier U3 converts the input voltage signal into a current signal through the first resistor R1 and the third resistor; the second input terminal of operational amplifier U3 is connected to the output terminal through the second resistor R2, and operational amplifier U3 can be an operational amplifier with a 1:1 proportional output; the output stage of operational amplifier U3 converts the output voltage signal into a current signal through R4.

[0054] Among them, the current-mode operational amplifier U3 has a wide bandwidth and fast slew rate (i.e., high bandwidth and fast response), which can effectively transmit and amplify noise signals in the high-frequency range, making it suitable for noise injection testing of the test module 500, which has high requirements for high-frequency characteristics.

[0055] Among them, the current-type operational amplifier U3 can also easily adjust the amplification factor and frequency characteristics of noise signals by adjusting the parameters of external components, such as the feedback resistor, so as to flexibly enhance the processing of noise signals and meet different test requirements.

[0056] In this way, the current-type operational amplifier U3 is used to perform slope enhancement processing on the input noise signal to obtain the target noise signal and output it. When the input current changes abruptly, the output current can quickly follow, avoiding the edge smoothing problem caused by "capacitor charging time" in voltage-type operational amplifiers, and improving the frequency bandwidth and rise slope of the output noise signal.

[0057] In some embodiments of this application, the signal enhancement module 300 may employ an isolation transformer to couple DC signals and high-frequency AC signals, thereby injecting noise signals into the power supply. For example, such as Figure 2 As shown, the signal coupling module 400 includes an isolation transformer T1, which includes a primary coil L1 and a secondary coil L2. One end of the primary coil L1 is connected to the output terminal of the signal enhancement module 300, and the other end of the primary coil L1 is grounded. One end of the secondary coil L2 is connected to the output terminal of the power supply module 100, and the other end of the secondary coil L2 is connected to the voltage input terminal of the module under test 500.

[0058] In this embodiment, the secondary coil L2 of the isolation transformer T1 is connected in series to the power supply path to be injected with noise. The output of the current-type operational amplifier (e.g., operational amplifier U3) is connected to the primary coil L1 of the isolation transformer T1. The output of the current-type operational amplifier (e.g., operational amplifier U3) is then adjusted by the signal generation module 200 to inject the required noise into the input terminal of the module under test 500.

[0059] In this way, the current-type operational amplifier (such as operational amplifier U3) can output a sufficiently large current to drive the isolation transformer T1, injecting noise into the power supply domain with a large current. At the same time, the isolation transformer T1 isolates the test module 500 terminal from the noise injection terminal, effectively preventing damage to the chip at the test module 500 terminal caused by devices such as the signal generation module 200 and signal enhancement module 300 at the noise injection terminal.

[0060] In practical applications, UFS embedded storage products have a clear requirement for UFS noise tolerance of ±3% according to the protocol. The protocol defines noise frequencies above 2MHz. Due to the low-pass characteristics of the package, input noise above 10MHz will be attenuated and will not directly affect the chip under test. Therefore, special attention should be paid to mid-to-high frequency noise between 2MHz and 10MHz. During the power supply fault tolerance test of the chip under test, it is necessary to test the noise tolerance of each module of the chip under test. For OEM SSD products, the OEM has clear requirements for power supply noise. It is required that 100mV of noise from 0-20MHz superimposed on the input PCB should not affect the normal operation of the SSD. This requires testing whether the power supply module will have abnormal ripple under 0-20MHz noise interference, and needs to cover the power supply module in light-load high-efficiency scenarios and continuous switching scenarios.

[0061] To meet the two specific application requirements mentioned above, the isolation transformer T1 may include a balun transformer.

[0062] Therefore, the high-frequency injection of the balun transformer is utilized to inject 0-20MHz high frequencies into the power supply; the RC matching of the low-pass filter is adjusted according to different application scenarios. Simultaneously, the current-carrying capacity of the high-power balun transformer is used to power the power supply modules of UFS embedded products and OEM SSD products. Furthermore, for UFS 3.1 and UFS 2.2 products, the maximum supply current of a single product design is 500mA. In scenarios where 500mA current injection noise exists in the chip under test, a 700mA balun transformer can cover this application scenario. In SSD noise injection testing, it can generally cover two operating states of DC-DC converters: a light-load, high-efficiency state and a forced-conduction state. Currently used DC-DC converters are generally cut off at less than 300mA, so there is a need to use a 700mA balun transformer to cover the 300mA current testing scenario.

[0063] Based on this, when the isolation transformer T1 includes a balun transformer, the performance requirements and selection criteria for the balun transformer are as follows: To address frequency bandwidth requirements, the output of the balun transformer can inject noise into the downstream load (i.e., the module under test 500) at a frequency not lower than 10MHz. It should be noted that ordinary isolation transformers have a narrow frequency range; low frequencies are limited by the core inductance, and high frequencies are limited by distributed parameters, making them suitable for low-to-medium frequency operating scenarios, generally within 1MHz. In contrast, this embodiment uses a balun transformer as the isolation transformer T1. The balun transformer achieves a wideband response through a transmission line structure or special winding process, extending low frequencies to near DC and high frequencies to the GHz level, making it suitable for wideband scenarios such as radio frequency and high-speed digital signals. Therefore, to meet the frequency bandwidth requirements, a balun transformer can be selected as the signal coupling module.

[0064] Regarding the power supply requirements, the output of the balun transformer can supply power to the downstream load (i.e., the module under test 500), with a supply voltage of not less than 500mA. It should be noted that the power supply capacity of ordinary balun transformers is relatively weak. In order to meet the 500mA requirement, this embodiment of the application can select a specific high-power balun transformer, which generally needs to be derated to 80% for use. Therefore, the balun transformer needs to have a current carrying capacity of at least 625mA.

[0065] Regarding inductance requirements, the output should not experience significant voltage interference from load current fluctuations in the subsequent stages. Generally, with load fluctuations of ±10%, the output fluctuation should not exceed the chip's power supply requirements, typically ±5%. For a 50mA current fluctuation, assuming an output voltage of 1V, the output voltage drop should not exceed 50mV. Using the formula 0.5*I*I*L=0.5*V*V*C, where I=50mA, V=50mV, and C=100nF, the calculated value of L should not exceed 0.1uH.

[0066] To meet DC impedance requirements, under full load conditions, the balun transformer cannot produce a large deviation from the DC bias voltage value of the downstream power supply.

[0067] Taking all the above factors into consideration, the balun transformer selected in this application embodiment is required to have a current carrying capacity of 625mA or more, a test frequency greater than 50MHz, and an inductance of less than 0.1uH.

[0068] Thus, using a balun transformer as the isolation transformer T1 provides excellent electrical isolation characteristics. The isolation transformer T1 can achieve electrical isolation between the primary and secondary circuits. This means that during the noise injection process, there is no direct electrical connection between the noise source and the module under test, thereby avoiding the DC bias voltage and other electrical interference from the noise source to the module under test, and improving the accuracy and reliability of the test.

[0069] Meanwhile, the use of a balun transformer as the isolation transformer T1 provides wide bandwidth characteristics. Isolation transformer T1 exhibits a wide bandwidth response to noise signals of different frequencies, effectively transmitting noise signals over a broad frequency range. This allows it to meet the noise injection requirements of modules under test with varying frequency characteristics.

[0070] In addition, the use of a balun transformer as the isolation transformer T1 provides strong adjustability. By selecting isolation transformers with different turns ratios and adjusting parameters such as the output amplitude and frequency of the noise signal source (e.g., signal generation module 200), the magnitude and frequency range of the noise injected into the module under test can be easily controlled to meet different testing requirements.

[0071] In some embodiments of this application, for example, such as Figure 2 As shown, the module under test 500 includes a chip under test U4, and the voltage input pin IN of the chip under test U4 is connected to the output terminal of the signal coupling module 400.

[0072] The chip under test, U4, can be a UFS embedded storage product or an OEM SSD product, etc. This application embodiment does not impose specific restrictions on the specific type and structure of the chip under test, U4.

[0073] Thus, the noise injection module 10 provided in this application embodiment can inject a large current, high amplitude, and wide frequency range noise signal into the power supply of the chip under test U4, meeting the noise injection requirements under different test scenarios.

[0074] In some embodiments of this application, such as Figure 2 As shown, the module under test 500 may also include a filter capacitor C1, and the voltage input pin IN of the chip under test U4 is grounded through the filter capacitor C1.

[0075] The filter capacitor C1 at the load end serves two purposes: energy storage and filtering. First, since the load on the chip under test (U4) is not perfectly constant, and due to the inductance of the balun transformer coil, the current cannot be supplied quickly enough when the load fluctuates, leading to voltage drops. Generally, to prevent voltage drops from causing malfunctions in the U4 chip during operation, a certain amount of charge needs to be supplied to the U4 chip to quickly power it. Therefore, an energy storage capacitor needs to be placed at the U4 chip. However, due to the nature of the injection noise test scenario, the capacitance of the energy storage capacitor needs to be precisely calculated to avoid interfering with the injection of low-frequency and high-frequency noise. Second, since the balun transformer generates multiple harmonics during injection noise, filtering of noise above a certain frequency needs to be implemented in the circuit to avoid interference from these harmonics during the injection noise test, depending on the actual application.

[0076] The capacitance of the filter capacitor C1 can be set according to actual needs. Taking the commonly used RC low-pass filter as an example, the cutoff frequency of the low-pass filter is calculated as F=1 / 2πRC, where R is the DC impedance of the selected balun converter (0.15 ohms), and F is the noise level that can be injected at 10MHz or below in the actual application scenario. Therefore, the calculated values ​​are F=10MHz and R=0.15 ohms. The calculated value is that C should not be greater than 0.1uF; therefore, a 0.1uF filter capacitor C1 is selected as the energy storage and filtering capacitor for the load.

[0077] In this embodiment, a filter capacitor C1 is connected to the voltage input pin IN of the chip under test (DUT) U4. The filter capacitor C1 provides a certain amount of charge to the DUT U4 to quickly supply power, preventing voltage drops in the DUT U4 during operation and thus avoiding malfunctions. Simultaneously, the filter capacitor C1 also prevents multiple harmonics generated by the balun converter from interfering with the noise injection test.

[0078] In practical applications, such as Figure 3-1 As shown, the embodiments of this application provide Figure 2 The equivalent circuit of the noise injection module 10 is shown. The chip under test U4 at the analog load end can be equivalent to a 10-ohm resistor, and the noise injection end can also be equivalent to a 10-ohm resistor. The capacitance value of the filter capacitor C1 is 0.1uF. The voltage bias value of the DC signal at the voltage input end of the chip under test U4 is 1.8V. The noise signal output by the noise injection end can be a high-frequency square wave signal with an amplitude of 3.5V.

[0079] like Figure 3-2 As shown, embodiments of this application provide as follows: Figure 3-1 The signal waveform of the equivalent circuit is shown. A high-frequency square wave signal with an amplitude of 3.5V is input to the noise injection terminal and coupled to a 1.8V DC signal. The signal is then output to the chip under test. A high-current, high-amplitude, and wide-frequency noise source is injected into the 1.8V DC signal for subsequent power supply fault tolerance testing of the chip under test U4.

[0080] Thus, the noise injection module 10 provided in this embodiment has the following technical effects: A current-mode operational amplifier U3 is used to perform slope enhancement processing on the input noise signal to obtain the target noise signal and output it. When the input current changes abruptly, the output current can quickly follow, avoiding the edge smoothing problem caused by the "capacitor charging time" in voltage-mode operational amplifiers, and improving the frequency bandwidth and rise slope of the output noise signal.

[0081] The current-mode operational amplifier U3 has a wide bandwidth and fast slew rate (i.e., high bandwidth and fast response), which can effectively transmit and amplify noise signals in the high-frequency range. It is suitable for noise injection testing of the test module 500, which has high requirements for high-frequency characteristics.

[0082] The current-mode operational amplifier U3 can also be easily adjusted by changing the parameters of external components, such as the feedback resistor, to adjust the amplification factor and frequency characteristics of the noise signal, flexibly enhancing the processing of noise signals to meet different testing needs.

[0083] A current-mode operational amplifier (such as operational amplifier U3) can output a sufficiently large current to drive the isolation transformer T1, injecting noise into the power supply domain with a large current. At the same time, the isolation transformer T1 isolates the test module 500 terminal from the noise injection terminal, effectively preventing damage to the chip at the test module 500 terminal caused by devices such as the signal generation module 200 and signal enhancement module 300 at the noise injection terminal.

[0084] Furthermore, in practical applications, compared with related technologies, this embodiment changes the use of the balun transformer from impedance transformation to signal coupling, which can achieve high-frequency noise injection into the chip power supply for subsequent chip noise tolerance testing. The selection of a balun transformer as the isolation transformer T1 provides excellent electrical isolation characteristics. Isolation transformer T1 can achieve electrical isolation between the primary and secondary circuits, meaning that during noise injection, there is no direct electrical connection between the noise source and the module under test, thus avoiding DC bias voltage and other electrical interference from the noise source to the module under test, improving the accuracy and reliability of the test.

[0085] Meanwhile, the use of a balun transformer as the isolation transformer T1 provides wide bandwidth characteristics. Isolation transformer T1 exhibits a wide bandwidth response to noise signals of different frequencies, effectively transmitting noise signals over a broad frequency range. This allows it to meet the noise injection requirements of modules under test with varying frequency characteristics.

[0086] In addition, the use of a balun transformer as the isolation transformer T1 provides strong adjustability. By selecting isolation transformers with different turns ratios and adjusting parameters such as the output amplitude and frequency of the noise signal source (e.g., signal generation module 200), the magnitude and frequency range of the noise injected into the module under test can be easily controlled to meet different testing requirements.

[0087] Based on the same concept as the noise injection module provided in the above embodiments, this application embodiment can also provide an apparatus for chip power supply fault tolerance testing.

[0088] like Figure 4As shown, this application embodiment provides a device 40 for chip power supply fault tolerance testing, which includes the noise injection module 10 provided in the above embodiment and can achieve the same function. To avoid repetition, it will not be described again here.

[0089] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0090] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A noise injection module, characterized in that, include: The power supply module (100), signal generation module (200), signal enhancement module (300), signal coupling module (400), and the module under test (500) are included. The output terminal of the power supply module (100) is connected to the DC input terminal of the signal coupling module (400), the output terminal of the signal generation module (200) is connected to the input terminal of the signal enhancement module (300), the output terminal of the signal enhancement module (300) is connected to the noise signal input terminal of the signal coupling module (400), and the output terminal of the signal coupling module (400) is connected to the voltage input terminal of the module under test (500). The signal coupling module (400) includes an isolation transformer (T1), which includes a primary coil (L1) and a secondary coil (L2). One end of the primary coil (L1) is connected to the output terminal of the signal enhancement module (300), and the other end of the primary coil (L1) is grounded. One end of the secondary coil (L2) is connected to the output terminal of the power supply module (100), and the other end of the secondary coil (L2) is connected to the voltage input terminal of the module under test (500). The isolation transformer (T1) includes a balun transformer.

2. The noise injection module according to claim 1, characterized in that, The frequency of the noise signal output from the output terminal of the signal generation module (200) is adjustable; The target noise signal output from the output terminal of the signal enhancement module (300) is obtained by enhancing the noise signal input from the input terminal of the signal enhancement module (300). The test signal output from the output terminal of the signal coupling module (400) is obtained by coupling the DC signal input from the DC input terminal with the target noise signal input from the noise signal input terminal.

3. The noise injection module according to claim 1, characterized in that, The power supply module (100) includes a low-dropout linear regulator (U1), the output of which is connected to the DC input of the signal coupling module (400).

4. The noise injection module according to claim 1, characterized in that, The signal generation module (200) includes at least one of a microcontroller unit (MCU) and a connector (CON2).

5. The noise injection module according to any one of claims 1-4, characterized in that, The signal enhancement module (300) includes an operational amplifier (U3), a first resistor (R1), a second resistor (R2), a third resistor (R3), and a fourth resistor (R4). The first input terminal of the operational amplifier (U3) is connected to the output terminal of the signal generation module (200). The first input terminal of the operational amplifier (U3) is also grounded through the first resistor (R1). The second terminal of the operational amplifier (U3) is connected to the output terminal of the operational amplifier (U3) through the second resistor (R2). The second terminal of the operational amplifier (U3) is also grounded through the third resistor (R3). The output terminal of the operational amplifier (U3) is connected to the noise signal input terminal of the signal coupling module (400) through the fourth resistor (R4).

6. The noise injection module according to claim 5, characterized in that, The operational amplifier (U3) is a current-mode operational amplifier. The target noise signal output from the output terminal of the current-mode operational amplifier is obtained by enhancing the noise signal input from the first input terminal of the current-mode operational amplifier.

7. The noise injection module according to any one of claims 1-4, characterized in that, The module under test (500) includes a chip under test (U4), and the voltage input pin (IN) of the chip under test (U4) is connected to the output terminal of the signal coupling module (400).

8. The noise injection module according to claim 7, characterized in that, The module under test (500) also includes a filter capacitor (C1), and the voltage input pin (IN) of the chip under test (U4) is grounded through the filter capacitor (C1).

9. An apparatus for chip power supply fault tolerance testing, characterized in that, Includes the noise injection module (10) as described in any one of claims 1-8.

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