An optical module

Abstract

The present disclosure provides an optical module, comprising an upper shell, a circuit board, a digital signal processing chip and a heat-conducting assembly, the digital signal processing chip is arranged on the circuit board, the bottom of the heat-conducting assembly is connected with the digital signal processing chip, and the top of the heat-conducting assembly is connected with the upper shell. The heat-conducting assembly comprises a first heat-conducting member and a second heat-conducting member, the first heat-conducting member is located in the middle of the heat-conducting assembly, and the second heat-conducting member wraps the first heat-conducting member. The hardness value of the second heat-conducting member is less than the hardness value of the first heat-conducting member, and the heat conductivity coefficient of the second heat-conducting member is less than the heat conductivity coefficient of the first heat-conducting member. The bottom of the second heat-conducting member protrudes from the bottom of the first heat-conducting member, and the top of the second heat-conducting member protrudes from the top of the first heat-conducting member. According to the present disclosure, the hardness value of the second heat-conducting member is less than the hardness value of the first heat-conducting member, and the bottom of the second heat-conducting member protrudes from the bottom of the first heat-conducting member, so that the heat dissipation of the digital signal processing chip is realized while the digital signal processing chip is protected.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] This disclosure provides an optical module that protects a digital signal processing chip while dissipating heat.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Upper shell;

[0006] Circuit board;

[0007] A digital signal processing chip is mounted on the circuit board;

[0008] A heat-conducting assembly, with its bottom connected to the digital signal processing chip and its top connected to the upper housing, is used to conduct heat from the digital signal processing chip.

[0009] The thermally conductive assembly includes:

[0010] The first heat-conducting element is located in the middle of the heat-conducting assembly;

[0011] The second heat-conducting element wraps around the first heat-conducting element, has a hardness value less than that of the first heat-conducting element, a thermal conductivity less than that of the first heat-conducting element, a bottom protruding from the bottom of the first heat-conducting element, and a top protruding from the top of the first heat-conducting element.

[0012] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including an upper housing, a circuit board, a digital signal processing chip, and a heat-conducting assembly. The digital signal processing chip is disposed on the circuit board, and the heat-conducting assembly is used to conduct heat. The bottom of the heat-conducting assembly is connected to the digital signal processing chip, and the top of the heat-conducting assembly is connected to the upper housing, so that the heat-conducting assembly can conduct the heat of the digital signal processing chip to the upper housing. The heat-conducting assembly includes a first heat-conducting element and a second heat-conducting element. The first heat-conducting element is located in the middle of the heat-conducting assembly, and the second heat-conducting element wraps around the first heat-conducting element. The hardness value of the second heat-conducting element is less than that of the first heat-conducting element. Compared to the heat-conducting assembly which only includes the first heat-conducting element, this reduces the hardness value and increases the compressibility of the heat-conducting assembly. The thermal conductivity of the second heat-conducting element is less than that of the first heat-conducting element. Compared to the heat-conducting assembly which only includes the second heat-conducting element, this increases the thermal conductivity and improves the heat conduction efficiency. The bottom of the second heat-conducting component protrudes beyond the bottom of the first heat-conducting component. The connection between the heat-conducting assembly and the digital signal processing chip is actually a connection between the second heat-conducting component and the digital signal processing chip, ensuring soft contact between the heat-conducting assembly and the digital signal processing chip to protect it. The top of the second heat-conducting component protrudes beyond the top of the first heat-conducting component. The connection between the heat-conducting assembly and the upper housing is actually a connection between the second heat-conducting component and the upper housing, ensuring soft contact between the heat-conducting assembly and the upper housing to protect it. In this disclosure, the hardness value of the second heat-conducting component is less than that of the first heat-conducting component, and the bottom of the second heat-conducting component protrudes beyond the bottom of the first heat-conducting component, thus protecting the digital signal processing chip while simultaneously dissipating heat from it.

[0013] In some embodiments, an optical module is provided, wherein the first heat-conducting element includes:

[0014] First heat-conducting column;

[0015] The second heat-conducting pillar is disposed on the first heat-conducting pillar and is arranged in the same direction as the first heat-conducting element.

[0016] The above technical solution has the following beneficial effects: The first heat-conducting component includes a first heat-conducting pillar and a second heat-conducting pillar, with the second heat-conducting pillar disposed on the first heat-conducting pillar so that the heat of the digital signal processing chip can be conducted from the first heat-conducting pillar to the second heat-conducting pillar. The first and second heat-conducting pillars are arranged along the same direction as the first heat-conducting component, allowing them to form an island structure or a mesh structure, thereby improving heat conduction efficiency.

[0017] In some embodiments, an optical module is provided, wherein the first heat-conducting element includes:

[0018] First heat-conducting column;

[0019] The second heat-conducting pillar is disposed on the first heat-conducting pillar and is disposed in a different direction from the first heat-conducting pillar along the first heat-conducting component.

[0020] The above technical solution has the following beneficial effects: The first heat-conducting component includes a first heat-conducting pillar and a second heat-conducting pillar, with the second heat-conducting pillar disposed on the first heat-conducting pillar so that the heat from the digital signal processing chip can be conducted from the first heat-conducting pillar to the second heat-conducting pillar. The first and second heat-conducting pillars are arranged along different directions of the first heat-conducting component, so that continuous heat-conducting channels can be formed in both the left-right and front-back directions of the first heat-conducting component, further improving the heat conduction efficiency.

[0021] In some embodiments, an optical module is provided, wherein the top of the first heat-conducting pillar is connected to the bottom of the second heat-conducting pillar.

[0022] The above technical solution has the following beneficial effects: the top of the first heat-conducting column is connected to the bottom of the second heat-conducting column, so that the heat of the first heat-conducting column can be directly conducted from the top of the first heat-conducting column to the bottom of the second heat-conducting column, thereby improving the heat conduction efficiency.

[0023] In some embodiments, an optical module is provided, wherein the elastic modulus of the second thermal conductive element is less than that of the first thermal conductive element.

[0024] The above technical solution has the following beneficial effects: the elastic modulus of the second heat-conducting component is less than that of the first heat-conducting component. Compared with the first heat-conducting component, the second heat-conducting component can effectively absorb assembly tolerances, meet the installation requirements of the optical module, and also effectively absorb compressive stress.

[0025] In some embodiments, an optical module is provided, wherein the side surface of the first heat-conducting element is flush with the side surface of the second heat-conducting element.

[0026] The above technical solution has the following beneficial effects: the side of the first heat-conducting component is flush with the side of the second heat-conducting component, which can reduce the heat conduction path and allow the heat on the side of the second heat-conducting component to be directly conducted to the side of the first heat-conducting component, thereby improving the heat conduction efficiency.

[0027] In some embodiments, an optical module is provided, further comprising:

[0028] An optical receiving component, electrically connected to the digital signal processing chip, includes:

[0029] The fiber optic array has its end face tilted so that the optical signal is reflected downwards through the end face.

[0030] An optical receiving chip is disposed on the reflected optical path of the end face of the optical fiber array for receiving optical signals; the optical receiving chip is tilted so that the optical signal can be incident perpendicularly onto the optical receiving chip;

[0031] A transimpedance amplifier chip is mounted on the circuit board and is electrically connected to the optical receiver chip.

[0032] The above technical solution has the following beneficial effects: The optical module also includes an optical receiving component, which is electrically connected to a digital signal processing chip so that the digital signal processing chip can receive the voltage signal from the optical receiving component. The optical receiving component includes an optical fiber array, an optical receiving chip, and a transimpedance amplifier chip. The end face of the optical fiber array is tilted so that the optical signal is reflected downwards through the end face. The optical receiving chip is disposed on the reflected optical path of the end face of the optical fiber array so that the optical receiving chip can receive the optical signal reflected by the end face of the optical fiber array and convert the optical signal into a current signal. The tilted arrangement of the optical receiving chip allows the optical signal to be incident perpendicularly onto the optical receiving chip, improving coupling efficiency. The transimpedance amplifier chip is disposed on a circuit board and is electrically connected to the optical receiving chip so that the transimpedance amplifier chip can receive the current signal and convert the current signal into a voltage signal.

[0033] In some embodiments, an optical module is provided, wherein the optical receiving chip is disposed on the transimpedance amplifier chip, and the solder balls of the optical receiving chip are soldered to the transimpedance amplifier chip;

[0034] The optical receiving component further includes:

[0035] The substrate is connected to the light receiving chip at the top and to the transimpedance amplifier chip at the bottom, with the thickness of the first end being greater than that of the second end.

[0036] The above technical solution has the following beneficial effects: the optical receiver chip can be disposed on the transimpedance amplifier chip, and the solder balls of the optical receiver chip are soldered to the transimpedance amplifier chip. The optical receiver component also includes a substrate, the top of which is connected to the optical receiver chip, and the bottom of which is connected to the transimpedance amplifier chip. The thickness of the first end of the substrate is greater than the thickness of the second end of the substrate, so that the optical receiver chip is tilted.

[0037] In some embodiments, an optical module is provided, wherein the optical receiving chip is disposed on the circuit board, and the optical receiving chip is wire-connected to the transimpedance amplifier chip;

[0038] The optical receiving component further includes:

[0039] The substrate is connected to the light receiving chip at the top and to the circuit board at the bottom, with the thickness of the first end being greater than that of the second end.

[0040] The above technical solution has the following advantages: the optical receiver chip can be mounted on a circuit board, and the optical receiver chip is wire-connected to the transimpedance amplifier chip. The optical receiver component also includes a substrate, the top of which is connected to the optical receiver chip, and the bottom of which is connected to the circuit board. The thickness of the first end of the substrate is greater than the thickness of the second end of the substrate, so that the optical receiver chip can be tilted.

[0041] In some embodiments, an optical module is provided, further comprising:

[0042] A light-emitting component, electrically connected to the digital signal processing chip, includes:

[0043] Laser chip array, used to emit optical signals;

[0044] An isolator array is located in the optical output path of the laser chip array;

[0045] An optical fiber array is located on the output optical path of the isolator array;

[0046] The support plate carries the laser chip array, the isolator array, and the fiber array.

[0047] The above technical solution has the following beneficial effects: The optical module also includes an optical emitting component, which is electrically connected to a digital signal processing chip, so that the optical emitting component can emit optical signals under the driving signal provided by the digital signal processing chip. The optical emitting component includes a laser chip array, an isolator array, an optical fiber array, and a support plate, with the support plate supporting the laser chip array, isolator array, and optical fiber array. The laser chip array is used to emit optical signals, enabling the optical emitting component to emit optical signals. The isolator array is located in the output optical path of the laser chip array to prevent the optical signal from returning along the original path. The optical fiber array is located in the output optical path of the isolator array, so that the optical fiber array can receive optical signals transmitted through the isolator array. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments;

[0050] Figure 2 This is a partial structural diagram of a switch according to some embodiments;

[0051] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0052] Figure 4 An exploded view of an optical module according to some embodiments;

[0053] Figure 5This is an exploded view of the internal structure of an optical module according to some embodiments;

[0054] Figure 6a This is a structural diagram of a light emitting component according to some embodiments;

[0055] Figure 6b Disassembly of a light emitting component provided according to some embodiments Figure 1 ;

[0056] Figure 6c Disassembly of a light emitting component provided according to some embodiments Figure 2 ;

[0057] Figure 7a This is a structural diagram of a fiber optic array according to some embodiments;

[0058] Figure 7b An exploded view of a fiber optic array provided according to some embodiments;

[0059] Figure 8 This is an exploded view of an isolator array provided according to some embodiments;

[0060] Figure 9 This is a cross-sectional view of a light emitting component provided according to some embodiments;

[0061] Figure 10a This is a structural diagram of another light-emitting component provided according to some embodiments;

[0062] Figure 10b Disassembly of another light emitting component provided according to some embodiments Figure 1 ;

[0063] Figure 10c Disassembly of another light emitting component provided according to some embodiments Figure 2 ;

[0064] Figure 10d This is a cross-sectional view of another light-emitting component provided according to some embodiments;

[0065] Figure 11 This is a partial structural diagram of another light emitting component provided according to some embodiments;

[0066] Figure 12a This is a structural diagram of a heat-conducting assembly according to some embodiments;

[0067] Figure 12b This is an exploded view of a thermally conductive assembly provided according to some embodiments;

[0068] Figure 13aThe structure of another thermally conductive assembly provided according to some embodiments Figure 1 ;

[0069] Figure 13b The structure of another thermally conductive assembly provided according to some embodiments Figure 2 ;

[0070] Figure 13c This is an exploded view of another thermally conductive assembly provided according to some embodiments;

[0071] Figure 14a This is a structural diagram of a first optical receiving component according to some embodiments;

[0072] Figure 14b This is a partial view of a first optical receiving component provided according to some embodiments;

[0073] Figure 14c Partial breakdown of a first optical receiving component provided according to some embodiments Figure 1 ;

[0074] Figure 14d Partial breakdown of a first optical receiving component provided according to some embodiments Figure 2 . Detailed Implementation

[0075] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0076] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0077] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0078] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, an optical module is needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0079] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0080] Information processing equipment connected to optical modules is also known as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0081] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1(not shown) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0082] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0083] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0084] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0085] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. (Example) Figure 2 As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0086] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0087] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0088] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0089] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0090] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0091] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical interface and the other is an optical interface. In some embodiments, the shell forms an opening that serves as both an electrical interface and an optical interface.

[0092] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0093] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0094] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0095] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0096] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0097] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0098] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0099] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0100] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0101] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0102] In some implementations, the gold fingers of the circuit board extend from the electrical interface and insert into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0103] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0104] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the switch 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0105] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 can be used to emit light signals.

[0106] In some embodiments, the light emitting component 400 may be disposed on the surface of the circuit board 300. For example, the light emitting component 400 may be disposed on the upper surface of the circuit board 300.

[0107] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown. The light receiving component 500 can be used to receive light signals. The light receiving component 500 can be disposed on the surface of the circuit board 300. For example, the light receiving component 500 can be disposed on the upper surface of the circuit board 300.

[0108] In some embodiments, the light receiving component 500 may include a first light receiving assembly 510. The first light receiving assembly 510 may be disposed on one side of the light emitting component 400 so that the first light receiving assembly 510 and the light emitting component 400 may be arranged side by side along the width direction of the circuit board 300.

[0109] In some embodiments, the light receiving component 500 may include a second light receiving component 520. The second light receiving component 520 may be disposed on the other side of the light emitting component 400, so that the second light receiving component 520 and the light emitting component 400 may be arranged side by side along the width direction of the circuit board 300.

[0110] In some embodiments, a DSP chip 320 may be disposed on the surface of the circuit board 300. The DSP chip 320 can process electrical signals transmitted by the optical network terminal through the gold fingers, and can also process electrical signals transmitted by the optical receiving component 500. For example, the DSP chip 320 may be disposed on the upper surface of the circuit board 300.

[0111] In some implementations, a driver chip can be provided on the surface of the circuit board 300. One end of the driver chip can be connected to the DSP chip 320, and the other end of the driver chip can be connected to the light emitting component 400, so that the driver chip provides a high-frequency drive signal under the action of the processed electrical signal provided by the DSP chip 320, thereby causing the light emitting component 400 to emit a second light signal under the action of the high-frequency drive signal.

[0112] In some embodiments, the DSP chip 320 may integrate a driver chip. The DSP chip 320 may be connected to the light emitting component 400 via a first signal line to provide a high-frequency driving signal to the light emitting component 400, thereby enabling the light emitting component 400 to emit light signals under the action of the high-frequency driving signal. For example, the circuit board 300 is provided with signal pads, and the DSP chip 320 may be connected to the signal pads via a first signal line. The signal pads are wire-connected to the laser chip of the light emitting component 400.

[0113] In some embodiments, the optical receiver 500 can be connected to the DSP chip 320 via a second signal line, so that the DSP chip 320 can process the high-frequency electrical signal provided by the optical receiver 500 and transmitted via the second signal line. For example, the optical receiver matching chip of the optical receiver 500 can be connected to the DSP chip 320 via the second signal line.

[0114] Figure 5 This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5 As shown, in some embodiments, the circuit board 300 forms a storage through hole 310, and the light emitting component 400 is embedded in the storage through hole 310 so that the light emitting component 400 can be flush with the upper surface of the circuit board 300.

[0115] In some embodiments, the optical module further includes a thermally conductive assembly 700. The thermally conductive assembly 700 can conduct heat. The bottom of the thermally conductive assembly 700 is connected to the DSP chip 320 so that the thermally conductive assembly 700 can conduct heat from the DSP chip 320. The top of the thermally conductive assembly 700 can be connected to the upper housing 201, so that heat on the thermally conductive assembly 700 is conducted to the upper housing 201 and then conducted away through the upper housing 201.

[0116] The thermally conductive assembly 700 is thermally conductive, enabling it to conduct heat. The thermally conductive assembly 700 has good elasticity, effectively absorbing assembly tolerances to meet the installation requirements of the optical module, and also effectively absorbing compressive stress to prevent hard contact between the rigid thermally conductive material and the DSP chip 320, thus protecting the DSP chip 320.

[0117] Figure 6a This is a structural diagram of a light emitting component according to some embodiments. Figure 6b Disassembly of a light emitting component provided according to some embodiments Figure 1 . Figure 6c Disassembly of a light emitting component provided according to some embodiments Figure 2 .like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the light emitting component 400 may be a light emitting component 400a.

[0118] In some embodiments, the light emitting component 400a may include a support plate 410. The support plate 410 may be embedded in the storage through hole 310 so that the light emitting component 400a is embedded in the storage through hole 310. The support plate 410 may be made of metal.

[0119] In some embodiments, the light emitting component 400a may include a laser chip array 420. The laser chip array 420 may include at least one laser chip, enabling the laser chip array 420 to emit at least one optical signal. For example, the laser chip array 420 may include eight laser chips arranged side by side along the width direction of the circuit board, enabling the laser chip array 420 to emit eight optical signals.

[0120] In some embodiments, the light emitting component 400a may include a lens array 430. The lens array 430 may be located in the light emission direction of the laser chip array 420 to receive the light signals emitted by the laser chip array 420. The lens array 430 may converge the received light signals. The lens array 430 may include at least one lens to enable it to receive at least one light signal. The number of lenses in the lens array 430 is the same as the number of laser chips in the laser chip array 420, so that the lens array 430 can receive the light signals emitted by the laser chip array 420. For example, the lens array 430 may include eight lenses arranged side-by-side along the width direction of the circuit board, enabling it to receive and converge eight light signals emitted by the laser chip array 420.

[0121] In some embodiments, the lenses of the lens array 430 may include converging lenses, so that the lens array 430 may include a converging lens array. The converging lens array can focus the optical signal emitted by the laser chip array 420.

[0122] In some embodiments, the lenses of the lens array 430 may include collimating lenses, so that the lens array 430 may include a collimating lens array. The collimating lens array may be located between the laser chip array 420 and the converging lens array. The collimating lens array can collimate the optical signal emitted by the laser chip array 420.

[0123] Because the optical signal between the converging lens array and the collimating lens array is collimated light, the distance between them can be short or long, facilitating the placement of more components. This flexibility not only increases the tolerance of the emitted optical path, making it more tolerant of changes in the position and angle of components, but also improves the stability of the emitted optical path.

[0124] In some embodiments, the light emitting component 400a may include a thermoelectric cooler 460. A laser chip array 420 may be disposed on the thermoelectric cooler 460 to control the operating temperature of the laser chip array 420 within a target temperature range. A lens array 430 may be placed on the thermoelectric cooler 460 such that the central axis of the lens array 430 is flush with the light emission port of the laser chip array 420.

[0125] In some embodiments, the light emitting component 400a may include an isolator array 440. The isolator array 440 can prevent optical signals from returning to the laser chip array 420 via their original paths. The isolator array 440 may include at least one isolator to prevent multiple optical signals from returning via their original paths. The number of isolator arrays 440 is the same as the number of lens arrays 430, so that the isolators of the isolator array 440 correspond one-to-one with the lenses of the lens array 430. For example, the isolator array 440 may include eight isolators arranged side-by-side along the width of the circuit board.

[0126] In some embodiments, the optical emitting component 400 may include an optical fiber array 450. The optical fiber array 450 may be located in the converging direction of the lens array 430, so that the end faces of the optical fibers of the optical fiber array 450 are located at the focal point of the lens array 430, thereby enabling the optical fibers of the optical fiber array 450 to transmit optical signals. The optical fiber array 450 may include at least one optical fiber, and the number of optical fibers in the optical fiber array 450 matches the number of lenses in the lens array 430, ensuring that each optical signal can be accurately coupled to the corresponding optical fiber. For example, when the lens array 430 contains 8 lenses, the optical fiber array 450 is also correspondingly provided with 8 optical fibers to achieve synchronous transmission of 8 optical signals.

[0127] Figure 7a This is a structural diagram of a fiber optic array according to some embodiments. Figure 7b This is an exploded view of a fiber optic array according to some embodiments. Figure 7a and Figure 7b As shown, in some embodiments, the fiber array 450 may include a fastener 452, which may form a snap-fit ​​groove 4521. The snap-fit ​​groove 4521 is connected to the fiber 451 by adhesive so that the fiber 451 is snapped into the snap-fit ​​groove 4521, thereby fixing the fiber 451 in the fastener 452.

[0128] The locking slot 4521 is V-shaped, meaning that the locking slot 4521 and the support plate 410 are inclined to securely fix the optical fiber and prevent the optical fiber from shifting during assembly or use.

[0129] The material of the fastener 452 can be light-transmitting. For example, the material of the fastener 452 is glass, and light can propagate within the fastener 452.

[0130] Optical fiber 451 may include a core and a cladding. The cladding encloses the core. The reflectivity of the interface between the outer surface of the cladding and the adhesive is greater than that between the inner surface of the cladding and the core. When light shines perpendicularly onto optical fiber 451, the light intensity reflected back to the camera through the interfaces between the outer surface of the cladding and the adhesive and between the inner surface of the cladding and the core differs, causing the image in the camera to display bright and dark fringes. Specifically, the core displays bright fringes, and the cladding displays dark fringes. Therefore, the left and right position information of the bright fringes can be obtained from the image to identify the core, and thus determine the position of the core in the width direction of the support plate.

[0131] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the light emitting component 400a may include a reflective-transmitting element 470. The reflective-transmitting element 470 is disposed on the support plate 410. The reflective-transmitting element 470 can split a beam of light into two beams according to a predetermined intensity ratio: one beam is reflected, and the other is transmitted. The reflective-transmitting element 470 may be located within the projection area of ​​the fiber array 450. A gap exists between the reflective-transmitting element 470 and the fiber array 450, and this gap is filled with air. The refractive index of the fiber array 450 is greater than the refractive index of air, causing light to be reflected and transmitted at the interface between the fiber array 450 and air. The refractive index of the reflective-transmitting element 470 is greater than the refractive index of air, causing light to be reflected and transmitted at the interface between air and the reflective-transmitting element 470.

[0132] The specific optical path is as follows: Light emitted from the camera travels through air → fiber optic array → air / fiber optic array 450 interface → air → air / reflective / transmissive element 470 interface → reflective / transmissive element 470 → reflective / transmissive element 470 / support plate 410 interface → support plate 410. Part of the light is reflected back to fiber optic array 450 at the interface between fiber optic array 450 and air (i.e., the fiber optic array 450 / air interface), while another part is transmitted through the air at the fiber optic array 450 / air interface and continues to propagate downwards. Part of the light entering the air is reflected at the interface between air and reflective / transmissive element 470 (i.e., the air / reflective / transmissive element 470 interface), while another part is transmitted through the air / reflective / transmissive element 470 interface to reflective / transmissive element 470. Part of the light entering reflective / transmissive element 470 undergoes diffuse reflection at the reflective / transmissive element 470 / support plate 410 interface.

[0133] The light reflected by the fiber array 450 / air interface passes through the fiber array 450 and air sequentially and enters the camera. The image of this light in the camera perfectly replicates the shape of the fiber array 450, making it possible to identify the fiber core based on the image.

[0134] Light that has been transmitted through the fiber array 450 / air interface and continues to propagate downwards undergoes multiple reflections and transmissions before finally entering the camera. The intensity of these subsequent reflected and diffused reflections has been attenuated multiple times (loss occurs at each interface), becoming very weak. When they finally return to the camera, their intensity is far lower than the signal light directly reflected from the fiber array 450 / air interface. Therefore, placing a reflective / transmitting element 470 directly below the fiber array 450 can reduce background noise, improve the signal-to-noise ratio, and enhance the fiber core recognition effect. The background noise of the image is the superposition of these subsequent reflected lights.

[0135] For example, the refractive index of fiber array 450 is 1.5, the refractive index of air is 1, the refractive index of reflective transmissive element 470 is 1.5, the reflectivity of the fiber array 450 / air interface is 0.04, and the reflectivity of the air / reflective transmissive element 470 interface is 0.04. The reflectivity of the fiber array 450 / air interface is 0.04, meaning that 4% of the light passing through the fiber array 450 / air interface is reflected back to the fiber array 450. The reflectivity of the air / reflective transmissive element 470 interface is 0.04, meaning that 4% * 96% of the light passing through the air / reflective transmissive element 470 interface is reflected back to the air. The light that continues to propagate downwards after being transmitted through the fiber array 450 / air interface repeats this process, resulting in multiple attenuations in light intensity. The intensity of the light that continues to propagate downwards after being transmitted through the fiber array 450 / air interface is much lower than the intensity of the light reflected from the fiber array 450 / air interface.

[0136] When the two reflecting surfaces (fiber array 450 / air interface and air / reflective transmissive element 470 interface) are very close, the light they reflect will interfere. Destructive interference can significantly suppress background noise.

[0137] When two beams of light interfere, the intensity of their combined light depends on their optical path difference Δ. Destructive interference (darkening): Δ = (m + 1 / 2)λ (where m is an integer and λ is the wavelength of light). A half-wave loss (phase abrupt change π) occurs when light is reflected back into air from the fiber array 45° / air interface. A half-wave loss also occurs when light is reflected back into air from the air / reflector / transmitter interface.

[0138] The optical path difference Δ is mainly determined by the thickness d of the air gap (i.e., the gap itself): Δ = 2 * n * d = 2d. Considering that there is a half-wave loss in both reflections, the phase difference between them cancels out. Therefore, the destructive interference (darkening) relation is: 2d = (m + 1 / 2)λ.

[0139] The thickness of the gap satisfies the destructive interference relationship, ensuring that the first beam of light reflected from the interface between the fiber array 450 and air and the second beam of light transmitted through the interface between the fiber array 450 and air destructively interfere with each other. This results in most of the light entering the camera being the first beam reflected from the interface between the fiber array 450 and air, and a small portion being the second beam transmitted through the interface between the fiber array 450 and air, further reducing background noise entering the camera. Specifically, the second beam of light transmitted through the interface between the fiber array 450 and air consists of light that is transmitted through the interface between the fiber array 450 and air, reflected by the interface between air and the reflective / transmissive element 470, and finally transmitted through the interface between air and the fiber array 450.

[0140] For example, the material of the reflective and transmissive element 470 is glass, which allows the visible light band to pass through. The wavelength of the visible light λ is 500nm, 2d=0.5(m+0.5), d=0.25m+0.125, take m=400, d≈100um.

[0141] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the support plate 410 may include a support plate body 411. A second storage slot 412 may be provided at a first end of the support plate body 411. A semiconductor cooler may be disposed in the second storage slot 412.

[0142] like Figure 6a , Figure 6b and Figure 6cAs shown, in some embodiments, a limiting support portion 413 may be provided at the second end of the support plate body 411. The limiting support portion 413 protrudes relative to the support plate body 411. An optical fiber array 450 and an isolator array 440 may be placed on the limiting support portion 413.

[0143] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the limiting support portion 413 may include a dispensing boss 4135. The dispensing boss 4135 may be located at one end of the limiting support portion 413 away from the second storage slot 412. Adhesive may be dispensed onto the dispensing boss 4135.

[0144] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, a first support boss 4136 may be provided on the dispensing boss 4135. The fiber optic array 450 may be disposed on the first support boss 4136. The area of ​​the dispensing boss 4135 other than the first support boss 4136 is the dispensing area, and adhesive can be dispensed within this area. The adhesive within the dispensing area and the first support boss 4136 are in contact with and connected to the fiber optic array 450. After the adhesive in the dispensing area cures, it forms a colloid, which fixes the fiber optic array 450 to the limiting support portion 413. Dispensing adhesive on the area of ​​the dispensing boss 4135 other than the first support boss 4136 increases the thickness of the adhesive. Increased adhesive thickness increases the strength of the adhesive body and enhances its adhesive force, thereby improving the stability of the support plate and the fiber optic array 450, and thus improving the stability of the optical path. Here, "dispensing" refers to dispensing adhesive.

[0145] In some embodiments, the thickness of the adhesive can be equal to the height of the first support boss 4136. The thickness of the adhesive is equal to the height of the first support boss 4136 and is also higher than the distance between the bonding surface and the fiber array 450, thereby increasing the adhesive force of the adhesive, thereby improving the stability of the support plate and the fiber array 450, and thus improving the stability of the optical path.

[0146] In some embodiments, the thickness of the adhesive can be greater than the height of the first support boss 4136, so that the adhesive is also adhered to the first support boss 4136, thereby increasing the adhesive surface area. The thickness of the adhesive, being greater than the height of the first support boss 4136, not only increases the adhesive surface area but also increases the adhesive thickness, further enhancing the adhesive force and improving the stability of the support plate and the fiber array 450, as well as the optical path stability.

[0147] In some embodiments, at least two first support bosses 4136 may be provided on the dispensing boss 4135. The at least two first support bosses 4136 support the fiber optic array 450. Adhesive can be dispensed into the area between any two first support bosses 4136, and after the adhesive cures, a colloid is formed, which fixes the fiber optic array 450 to the limiting support portion 413. The fact that adhesive can be dispensed into the area between any two first support bosses 4136 ensures contact and connection between the adhesive and the fiber optic array 450, increases the thickness of the adhesive, and improves the stability of the support plate 410 and the fiber optic array 450.

[0148] In some embodiments, adhesive can be applied to the area between the two parallel first support protrusions 4136 to ensure that the adhesive is in contact with the fiber array 450, increase the thickness of the adhesive, and improve the stability of the support plate 410 and the fiber array 450.

[0149] In some embodiments, adhesive can be applied to the area between the first support bosses 4136 located at both ends of the diagonal. This not only ensures that the adhesive is in contact with the fiber array 450 and improves the stability of the support plate 410 and the fiber array 450, but also allows the adhesive to flow around the first support bosses 4136, increasing the contact area between the adhesive and the fiber array 450 and further improving the stability of the support plate 410 and the fiber array 450.

[0150] In some embodiments, the shape of the first support boss 4136 can be rectangular, square, or circular.

[0151] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the support plate 410 limiting support portion 413 may include an adhesive guide groove 4134. The adhesive guide groove 4134 is located around the dispensing boss 4135. The adhesive guide groove 4134 is recessed relative to the dispensing boss 4135. The adhesive guide groove 4134 is used to guide the flow of adhesive to reduce excessive adhesive contamination of the fiber end face of the fiber array 450.

[0152] The protrusion of the adhesive guide groove 4134, the adhesive dispensing boss 4135 and the first support boss 4136 increases sequentially to avoid excessive adhesive contamination of the fiber end face of the fiber array 450.

[0153] The bottom surface of the fiber optic array 450 can contact and connect with the adhesive on the first support boss 4136 and the dispensing boss 4135 to define the position of the fiber optic array 450 in the vertical direction of the optical module. To further define the position of the fiber optic array 450, in some embodiments, the limiting support portion 413 may include a first limiting plate 4133. The first limiting plate 4133 may be located between the second placement groove 412 and the adhesive guide groove 4134. The end of the fiber optic array 450 (the end of the fiber optic array 450 with the fiber end face) contacts and connects with the first limiting plate 4133 to define the position of the fiber optic array 450 in the fiber direction (i.e., the horizontal direction of the optical module).

[0154] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the limiting support portion 413 may include a second limiting plate 4131. The second limiting plate 4131 may be located between the edge of the adhesive guide groove and the support plate, that is, the second limiting plate 4131 is located at the front end or the rear end of the limiting support portion 413. The side of the fiber array 450 is in contact with the second limiting plate 4131 to limit the position of the fiber array 450 in the front-rear direction of the optical module. For example, the limiting support portion 413 may include two second limiting plates 4131, one second limiting plate 4131 is located at the front end of the support plate 410, and the other second limiting plate 4131 is located at the rear end of the support plate 410. The side of one fiber array 450 is in contact with one second limiting plate 4131, and the side of the other fiber array 450 is in contact with the other second limiting plate 4131.

[0155] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the limiting support portion 413 may include a second support boss 4132. The second support boss 4132 may be located at one end of the limiting support portion 413 near the second placement slot 412, and the first limiting plate 4133 may be located in the middle of the second support boss 4132, with the second support boss 4132 recessed relative to the first limiting plate 4133. The isolator array 440 may be located on the second support boss 4132 to increase the height of the isolator array 440, making the central axis of the isolator array 440 flush with the height of the light outlet of the laser chip array 420.

[0156] like Figure 6a , Figure 6b and Figure 6cAs shown, in some embodiments, a fulcrum groove 4137 may be provided at the end of the support plate 410 away from the second placement slot 412. The fulcrum groove 4137 may be located in the edge region of the support plate 410. The fulcrum groove 4137 may be located in the projection region of one end of the fiber array 450, and there is a gap between the fulcrum groove 4137 and the fiber array 450. The fulcrum groove 4137 is located to the left of the adhesive guide groove 4134. The edge of the fiber array 450 extends to the left across the adhesive guide groove 4134 and the fulcrum groove 4137, so the adhesive guide groove 4134 is away from the edge of the fiber array 450 relative to the fulcrum groove 4137. The adhesive guide groove 4134 is away from the edge of the fiber array 450 relative to the fulcrum groove 4137. There is a gap between the fulcrum groove 4137 and the fiber array 450. The fulcrum groove 4137 serves as a fulcrum to facilitate the separation of the fiber array 450 from the support plate 410. When disassembling the fiber array 450, the disassembly tool uses the fulcrum slot 4137 as a fulcrum to pry the fiber array 450 off the support plate 410.

[0157] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the limiting support portion 413 can form a first placement groove 414. The first placement groove 414 can be located between the adhesive guide groove 4134 and the second support boss 4132. The first placement groove 414 can be located in the projection area at the other end of the fiber array 450. A reflective and transmissive element 470 can be placed in the first placement groove 414, such that the bottom of the reflective and transmissive element 470 is in direct contact with the first placement groove 414.

[0158] Since the support plate 410 is made of metal, and metal has a complex refractive index, when light is directly transmitted from the reflective element 470 to the support plate 410, a large amount of reflection (approximately 90%) occurs at the interface between the reflective element 470 and the support plate 410, generating more background noise and hindering fiber core identification. To address this issue, such as... Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, a fourth support boss 4141 may be provided at the bottom of the first storage slot 414, and the top of the fourth support boss 4141 may support the reflective and transmissive element 470, so that there is a gap between the reflective and transmissive element 470 and the bottom of the first storage slot 414. This can prevent light from being directly transmitted from the reflective and transmissive element 470 to the support plate 410, reduce the generation of background noise, and facilitate the identification of the fiber core. The fourth support boss 4141 is recessed into the first support boss 4136, so that there is a gap between the fourth support boss 4141 and the fiber array 450. The gap between the fourth support boss 4141 and the fiber array 450 is greater than the thickness of the reflective and transmissive element 470, so that there is a gap between the reflective and transmissive element 470 and the fiber array 450.

[0159] like Figure 6a , Figure 6b and Figure 6c As shown, in some embodiments, the limiting support portion 413 may include a third support boss 4138. The third support boss 4138 may be formed on the second limiting plate 4131 near the second support boss 4132. The third support boss 4138 may also be formed on the second supporting boss 4132 near the second limiting plate 4131. The third support boss 4138 may be located on one side of the first limiting plate 4133. There may be a gap between the third support boss 4138 and the first limiting plate 4133 to facilitate the placement of structural components in the gap. For example, the limiting support portion 413 may include two third support bosses 4138, one of which may be located on one side of the first limiting plate 4133, and the other on the other side.

[0160] In some embodiments, the third support boss 4138 is flush with the first limiting plate 4133, making both ends of the structural component level. This ensures that the structural component can be stably placed on the first limiting plate and the third support boss, avoiding installation instability caused by height differences. For example, the structural component can be a magnetic component; the flush height of the third support boss 4138 with the first limiting plate 4133 also avoids uneven magnetic field distribution caused by height differences.

[0161] Figure 8 This is an exploded view of an isolator array provided according to some embodiments. Figure 9 This is a cross-sectional view of a light-emitting component according to some embodiments. Figure 8 and Figure 9 As shown, the fulcrum slot 4137 is located in the projection area of ​​one end of the fiber array 450, the first placement slot 414 is located in the projection area of ​​the other end of the fiber array 450, the reflective and transmissive element 470 is located in the first placement slot 414, there is a gap between the reflective and transmissive element 470 and the fiber array 450, and there is a gap between the reflective and transmissive element 470 and the inner bottom surface of the first placement slot 414.

[0162] In some embodiments, the isolator array 440 may include at least one isolator 441. For example, the isolator array 440 may include eight isolators arranged along the width direction of the circuit board 300.

[0163] In some embodiments, the isolator 441 may be disposed on the second support boss 4132 such that the central axis of the isolator 441 is flush with the central axis of the lens array 430. The isolator 441 may be located in the gap between the third support boss 4138 and the first limiting plate 4133 to define the position of the isolator 441 in the width direction of the support plate 410.

[0164] The isolator 441 may include a first polarizer, a Faraday plate, and a second polarizer. The Faraday plate rotates in the same direction. Polarized light passing through the first polarizer cannot return to the first polarizer after the Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate, and the second polarizer has the function of reverse isolation.

[0165] The Faraday crystal can only function under the influence of a magnetic field. When the isolator 441 is magnetic, the isolator array 440 only includes the isolator 441. When the isolator 441 is not magnetic, the isolator array 440 may include the isolator 441 and a magnetic element 442, which can provide a magnetic field to enable the Faraday crystal to function normally under the magnetic field.

[0166] In some embodiments, the magnetic element 442 may be disposed on the second support boss 4132, and the magnetic element 442 may be disposed on one side of the isolator 441. A certain distance may be maintained between the magnetic element 442 and the isolator 441 to ensure that the magnetic field distribution is uniform and does not interfere with the performance of the isolator 441.

[0167] When the isolator array 440 includes multiple isolators 441, a magnetic element 442 can be provided on one side of each isolator 441 to ensure that each isolator 441 can work normally under the action of a magnetic field.

[0168] In some embodiments, the magnetic element 442 can be disposed on the third support boss 4138 and the first limiting plate 4133. The magnetic element 442 can be connected to the top of the isolator 441, which can not only reduce the width dimension of the support plate 410, thereby reducing the space occupied by the support plate 410 on the circuit board 300, but also reduce material costs.

[0169] Figure 10a This is a structural diagram of another light-emitting component provided according to some embodiments. Figure 10b Disassembly of another light emitting component provided according to some embodiments Figure 1 . Figure 10c Disassembly of another light emitting component provided according to some embodiments Figure 2 .like Figure 10a , Figure 10b and Figure 10c As shown, in some embodiments, the light emitting component 400 may be the light emitting component 400b.

[0170] In some embodiments, the light emitting component 400b may include a support plate 410a. The support plate 410a may be embedded in the storage through hole 310 so that the light emitting component 400b is embedded in the storage through hole 310.

[0171] In some embodiments, the light emitting component 400b may include a filter 470a. The filter 470a allows light of a specific wavelength range to pass through. The filter 470a is disposed on the support plate 410a. The filter 470a may be located directly above the fiber array 450. A gap exists between the filter 470a and the fiber array 450, and this gap is filled with air. The refractive index of both the fiber array 450 and the filter 470a is greater than the refractive index of air, causing light to be reflected and transmitted at the interface between the fiber array 450 and air, and at the interface between air and the reflective / transmissive component 470, thereby allowing the fiber array 450 and the filter 470a to form an optical resonant cavity.

[0172] Optical resonant cavities exhibit strong wavelength selectivity for incident light; only light of a specific wavelength that satisfies the resonance condition (i.e., light at the resonant wavelength) can efficiently pass through the optical resonant cavity. In other words, light that satisfies the resonance condition oscillates back and forth within the optical resonant cavity, amplifies, and is then emitted, while light that does not satisfy the resonance condition gradually dissipates within the optical resonant cavity.

[0173] In some embodiments, the resonant wavelength of the optical resonant cavity is within the wavelength range that the filter 470a is allowed to transmit, so that the light transmitted from the optical resonant cavity can be transmitted through the filter 470a, reducing other background noise from entering the camera.

[0174] The specific optical path is as follows: Light emitted from the camera passes through filter 470a → filter 470a / air interface → air → air / fiber array 450 interface → fiber array 450 → fiber array 450 / support plate 410a interface → support plate 410a. Part of the light is reflected back to filter 470a at the filter 470a / air interface, and another part is transmitted into the air at the filter 470a / air interface. Part of the light entering the air is reflected back into the air at the air / fiber array 450 interface, and another part is transmitted into the fiber array 450 at the air / fiber array 450 interface. Part of the light entering the fiber array 450 undergoes diffuse reflection at the fiber array 450 / support plate 410a interface.

[0175] The light reflected by the fiber array 450 / air interface passes sequentially through the fiber array 450, air, and filter 470a into the camera. The image of this light in the camera perfectly replicates the shape of the fiber array 450, making it possible to identify the fiber core based on the image.

[0176] The optical path difference for one round trip within an optical resonant cavity is an integer multiple of the wavelength; that is, the resonance condition is 2n. air dcosθ=mλ (m=1,2,3,...), where n airθ is the refractive index of the air gap, d is the thickness of the air gap, θ is the incident angle of light in the optical resonant cavity, m is the interference order, and λ is the resonant wavelength.

[0177] By precisely adjusting the air gap thickness d, the optical resonant cavity selects which wavelength of light can pass through with the highest efficiency, while background noise deviating from that wavelength is strongly suppressed, resulting in a significant improvement in the signal-to-noise ratio.

[0178] An optical resonant cavity is sensitive not only to wavelength but also to the incident angle θ. For the same interference order m, only light satisfying 2d cosθ=mλ can pass through efficiently. This means that: (1) Light incident perpendicularly (θ=0) satisfies the resonance condition and has the highest transmittance. (2) Light incident at a large angle (larger θ) has a shorter effective optical path 2dcosθ, no longer satisfies the resonance condition, and its transmittance drops sharply.

[0179] Optical fiber 451 is arranged parallel to support plate 410a. The camera emits vertically downward light, which is incident almost perpendicularly on optical fiber 451. This causes the light reflected back to the optical resonant cavity from the interface between optical fiber 451 and adhesive to be incident almost perpendicularly on the optical resonant cavity. The light incident perpendicularly on the optical resonant cavity satisfies the resonance condition and has the highest transmittance, allowing it to be transmitted out of the optical resonant cavity.

[0180] The mounting slot 4521 and the support plate 410a are inclined. The camera emits vertically downward light, which is incident at a large angle onto the mounting slot 4521. This causes the light reflected back to the optical resonator from the interface between the mounting slot 4521 and the adhesive to also be incident at a large angle onto the optical resonator. The light incident at a large angle onto the optical resonator no longer meets the resonance condition, and its transmittance drops sharply, making it impossible for it to pass through the optical resonator.

[0181] The light transmitted back to the optical resonant cavity via the interface between optical fiber 451 and adhesive has the highest transmittance, while the light transmitted back to the optical resonant cavity via the interface between the slot 4521 and adhesive has a lower transmittance. This means that most of the light entering the camera is reflected back via the interface between optical fiber 451 and adhesive, with only a very small portion reflected back via the interface between slot 4521 and adhesive. This reduces background noise in the camera image and improves the signal-to-noise ratio.

[0182] The gap thickness between the filter 470a and the fiber array 450 satisfies the resonance condition; that is, changes in the gap thickness between the filter 470a and the fiber array 450 result in changes in the resonant wavelength of the optical resonant cavity. Specifically, a larger gap thickness results in a longer resonant wavelength, while a smaller gap thickness results in a shorter resonant wavelength. Therefore, the resonant wavelength of the optical resonant cavity can be adjusted based on the relationship between the gap thickness and the resonant wavelength to reduce background noise.

[0183] For example, the material of filter 470a is silicon, which allows near-infrared and mid-infrared wavelengths. The wavelength of infrared light is 1500nm, 2d = 1.5m, d = 0.75m, and taking m = 100, d ≈ 75um.

[0184] In some embodiments, the support plate 410a may include a support plate body 411. A limiting support portion 413a may be provided at the second end of the support plate body 411. The limiting support portion 413a protrudes relative to the support plate body 411. An optical fiber array 450 and an isolator array 440 may be placed on the limiting support portion 413a.

[0185] In some embodiments, the limiting support portion 413a may include a second limiting plate 4131a. The second limiting plate 4131a may be located between the edge of the adhesive guide groove and the support plate, that is, the second limiting plate 4131a may be located at the front end or the rear end of the limiting support portion 413a. The side of the fiber array 450 is in contact with the second limiting plate 4131a to define the position of the fiber array 450 in the front-rear direction of the optical module. For example, the limiting support portion 413a may include two second limiting plates 4131a, one second limiting plate 4131a is located at the front end of the support plate 410a, and the other second limiting plate 4131a is located at the rear end of the support plate 410a. The side of one fiber array 450 is in contact with one second limiting plate 4131a, and the side of the other fiber array 450 is in contact with the other second limiting plate 4131a.

[0186] In some embodiments, the limiting support portion 413a may include a second support boss 4132. The second support boss 4132 may be located at one end of the limiting support portion 413a near the second storage slot 412, and a first limiting plate 4133 may be located in the middle of the second support boss 4132, with the second support boss 4132 recessed relative to the first limiting plate 4133. An isolator array 440 may be located on the second support boss 4132.

[0187] Since the support plate 410 is made of metal, and metal has a complex refractive index, when light is directly transmitted from the fiber array 450 to the support plate 410, a large amount of reflection (approximately 90%) will occur at the fiber array 450 / support plate 410 interface, generating more background noise and hindering fiber core identification. To address this issue, in some embodiments, the limiting support portion 413a can form a first placement groove 414. The first placement groove 414 can be located between the adhesive guide groove 4134 and the second support boss 4132. The first placement groove 414 can be located within the projection area at the other end of the fiber array 450. The inner bottom surface of the first storage slot 414 is recessed into the first support protrusion 4136, creating a gap between the first support protrusion 4136 and the inner bottom surface of the first storage slot 414. This prevents direct contact between the fiber optic array 450 and the inner bottom surface of the first storage slot 414, thus avoiding reflection and transmission of light from the interface between the fiber optic array 450 and the inner bottom surface of the first storage slot 414. Instead, light is reflected and transmitted through the interface between the fiber optic array 450 and the air, and light entering the air is reflected and transmitted through the interface between the air and the inner bottom surface of the first storage slot 414. The light transmitted through the fiber optic array 450 is not directly reflected from the interface between the fiber optic array 450 and the inner bottom surface of the first storage slot 414, but rather reflected and transmitted through the interface between the fiber optic array 450 and the air, and then reflected and transmitted through the interface between the air and the inner bottom surface of the first storage slot 414. This reduces the light intensity, decreases background noise, and facilitates fiber core identification.

[0188] In some embodiments, the limiting support portion 413a may include a third support boss 4138. The third support boss 4138 may be formed on the second limiting plate 4131a near the second support boss 4132. The third support boss 4138 may be formed on the second supporting boss 4132 near the second limiting plate 4131a. The third support boss 4138 may be located on one side of the first limiting plate 4133. For example, the limiting support portion 413a may include two third support bosses 4138, one of which may be located on one side of the first limiting plate 4133, and the other of which may be located on the other side of the first limiting plate 4133.

[0189] In some embodiments, a fifth support boss 4139 is formed on the second limiting plate 4131a near the second support boss 4132. The fifth support boss 4139 is connected to the end of the third support boss 4138 away from the second storage slot 412. The fifth support boss 4139 can support the filter element 470a.

[0190] In some embodiments, the top of the fifth support boss 4139 protrudes beyond the top of the third support boss 4138, so that when the filter element 470a is placed on the fifth support boss 4139, it can maintain a certain distance from other elements below, thus avoiding physical interference between them.

[0191] Except for the parts mentioned above that are different from those of light emitting component 400a, the rest of the light emitting component 400b is the same as that of light emitting component 400a in terms of both structure and function, and will not be described again here.

[0192] Figure 10d This is a cross-sectional view of another light-emitting component provided according to some embodiments. Figure 10d As shown, the filter element 470a is located directly above the fiber array 450, there is a gap between the filter element 470a and the fiber array 450, and there is a gap between the fiber array 450 and the inner bottom surface of the first storage slot 414.

[0193] Figure 11 This is a partial structural diagram of another light-emitting component provided according to some embodiments. For example... Figure 11 As shown, in some embodiments, the light emitting component 400 may be a light emitting component 400c. The light emitting component 400c may include an optical modulation chip 480. The optical modulation chip 480 may include an input port and an output port. The input port may be located in the output optical path of the isolator array 440 to receive light transmitted through the isolator array 440. The optical modulation chip 480 can modulate the light into an optical signal. The output port can emit the optical signal.

[0194] In some embodiments, the optical emitting component 400c may include an optical fiber array 450. The optical fiber array 450 may be located at the output port of the optical modulation chip 480, so that the optical fiber array 450 can receive and transmit optical signals emitted by the optical modulation chip 480.

[0195] In some embodiments, the light inlet and the light outlet are located on the same side of the optical modulation chip 480, so that the lens array 430 and the fiber array 450 can both be located on the same side of the optical modulation chip 480.

[0196] In some embodiments, the optical emitting component 400c may include a support plate, which can support the laser chip array 420, lens array 430, isolator array 440, optical modulation chip 480, and fiber array. Since the devices on the support plate of the optical emitting component 400c are different from those on the support plate 410 of the optical emitting component 400a, and the positional relationship of each device is different, the support plate of the optical emitting component 400c can be adaptively adjusted according to the support plate 410, which will not be elaborated here.

[0197] Except for the parts mentioned above that are different from those of the light emitting component 400a, the light emitting component 400c is the same as the light emitting component 400a in terms of both structure and function, and will not be described again here.

[0198] Since the devices on the support plate of the light emitting component 400c are different from those on the support plate 410a of the light emitting component 400b, and the positional relationship of each device is different, the support plate of the light emitting component 400c can be adjusted according to the support plate 410a, which will not be elaborated here.

[0199] Except for the parts mentioned above that are different from those of the light emitting component 400b, the light emitting component 400c is the same as the light emitting component 400b in both structure and function, and will not be described again here.

[0200] Figure 12a This is a structural diagram of a heat-conducting assembly provided according to some embodiments. Figure 12b This is an exploded view of a thermally conductive assembly provided according to some embodiments. Figure 12a and Figure 12b As shown, in some embodiments, the thermally conductive assembly 700 may be a thermally conductive assembly 700a.

[0201] In some embodiments, the thermally conductive assembly 700a may include a first thermally conductive element 720, which may be located in the middle of the thermally conductive assembly 700a. The first thermally conductive element 720 has a large thermal conductivity, resulting in better thermal conductivity.

[0202] However, the first heat-conducting element 720 has a relatively high hardness value. If the first heat-conducting element 720 is placed directly on the DSP chip 320, the hard contact between the first heat-conducting element 720 and the DSP chip 320 can easily damage the DSP chip 320. To solve this problem, in some embodiments, the heat-conducting assembly 700a may include a second heat-conducting element 710. The second heat-conducting element 710 can wrap around the first heat-conducting element 720. The hardness value of the second heat-conducting element 710 is less than that of the first heat-conducting element 720, which can reduce the overall hardness value and increase the compressibility of the heat-conducting assembly 700a.

[0203] The thermal conductivity of the first heat-conducting element 720 is greater than that of the second heat-conducting element 710, and the thermal conductivity of the first heat-conducting element 720 is greater than that of the second heat-conducting element 710. This results in the overall thermal conductivity of the thermally conductive assembly 700a being greater than that of a thermally conductive assembly consisting only of the second heat-conducting element 710, thereby improving the thermal efficiency of the optical module. For example, the material of the first heat-conducting element 720 may be metal, and the material of the second heat-conducting element 710 may be thermally conductive gel.

[0204] In some embodiments, the elastic modulus of the second heat-conducting element 710 is less than that of the first heat-conducting element 720. Compared with the first heat-conducting element 720, the second heat-conducting element 710 can not only effectively absorb assembly tolerances and meet the installation requirements of the optical module, but also effectively absorb compressive stress.

[0205] In some implementations, the bottom of the second heat-conducting component 710 may protrude from the bottom of the first heat-conducting component 720. The connection between the heat-conducting assembly 700a and the DSP chip 320 is actually the connection between the second heat-conducting component 710 and the DSP chip 320, so that the heat-conducting assembly 700a and the DSP chip 320 make soft contact to protect the DSP chip 320.

[0206] In some embodiments, the top of the second heat-conducting element 710 may protrude beyond the top of the first heat-conducting element 720. The connection between the heat-conducting assembly 700a and the upper housing 201 is actually the connection between the second heat-conducting element 710 and the upper housing 201, so that the heat-conducting assembly 700a makes soft contact with the upper housing 201 to protect the upper housing 201.

[0207] In some embodiments, the side of the second heat conductor 710 may protrude beyond the side of the first heat conductor 720.

[0208] In some embodiments, the side of the second heat-conducting element 710 can be flush with the side of the first heat-conducting element 720, which can reduce the heat conduction path and allow the heat on the side of the second heat-conducting element 710 to be directly conducted to the side of the first heat-conducting element 720, thereby improving the heat conduction efficiency.

[0209] In some embodiments, the second heat-conducting element 710 can fill the gap of the first heat-conducting element 720, increasing the contact area between the first heat-conducting element 720 and the second heat-conducting element 710, thereby improving the heat conduction efficiency of the heat-conducting assembly 700a.

[0210] In some embodiments, the first heat-conducting element 720 may include a first heat-conducting pillar 721 and a second heat-conducting pillar 722. The second heat-conducting pillar 722 may be located on the first heat-conducting pillar 721 so that the first heat-conducting pillar 721 and the second heat-conducting pillar 722 are stacked, so that the heat of the DSP chip 320 can be conducted from the first heat-conducting pillar 721 to the second heat-conducting pillar 722.

[0211] In some embodiments, the first heat-conducting pillar 721 and the second heat-conducting pillar 722 can be arranged along the same direction as the first heat-conducting element 720, such that the first heat-conducting pillar 721 and the second heat-conducting pillar 722 can form an island structure or a mesh structure to improve heat conduction efficiency. For example, both the first heat-conducting pillar 721 and the second heat-conducting pillar 722 can be arranged along the front-back direction of the first heat-conducting element 720. Alternatively, both the first heat-conducting pillar 721 and the second heat-conducting pillar 722 can be arranged along the left-right direction of the first heat-conducting element 720.

[0212] In some embodiments, the first heat-conducting pillar 721 and the second heat-conducting pillar 722 can be arranged along different directions of the first heat-conducting element 720, and continuous heat-conducting channels can be formed in both the front-back and left-right directions of the first heat-conducting element 720, further improving heat conduction efficiency. For example, the first heat-conducting pillar 721 can be arranged along the front-back direction of the first heat-conducting element 720, and the second heat-conducting pillar 722 can be arranged along the left-right direction of the first heat-conducting element 720.

[0213] In some embodiments, the top of the first heat-conducting column 721 can be connected to the bottom of the second heat-conducting column 722, so that the heat of the first heat-conducting column 721 can be directly conducted from the top of the first heat-conducting column 721 to the bottom of the second heat-conducting column 722, thereby improving the heat conduction efficiency.

[0214] Figure 13a The structure of another thermally conductive assembly provided according to some embodiments Figure 1 . Figure 13b The structure of another thermally conductive assembly provided according to some embodiments Figure 2 . Figure 13c This is an exploded view of another thermally conductive assembly provided according to some embodiments. Figure 13a , Figure 13b and Figure 13c As shown, the heat-conducting assembly 700 can be a heat-conducting assembly 700b, and the heat-conducting assembly 700b can include a first heat-conducting element 720a. The first heat-conducting element 720a has a large thermal conductivity, which makes the heat conduction effect of the first heat-conducting element 720a better.

[0215] However, the first heat-conducting element 720a has a relatively high hardness value. If the first heat-conducting element 720a is placed directly on the DSP chip 320, the hard contact between the first heat-conducting element 720a and the DSP chip 320 may easily damage the DSP chip 320. To solve this problem, in some embodiments, the first heat-conducting element 720a can be provided with a first through hole 721a, which can penetrate through the top and bottom of the first heat-conducting element 720a. The first through hole 721a can be filled with a second heat-conducting element 710a. The hardness value of the second heat-conducting element 710a is less than that of the first heat-conducting element 720a, which can reduce the overall hardness value and increase the compressibility of the heat-conducting assembly 700b.

[0216] The thermal conductivity of the first thermally conductive element 720a is greater than that of the second thermally conductive element 710a, and the thermal conductivity of the first thermally conductive element 720a is greater than that of the second thermally conductive element 710a. This results in the thermal conductivity of the thermally conductive assembly 700b being greater than that of the assembly consisting only of the second thermally conductive element 710a, thereby improving the thermal conductivity efficiency of the optical module. For example, the material of the first thermally conductive element 720a can be metal, and the material of the second thermally conductive element 710a can be thermally conductive gel.

[0217] In some embodiments, the elastic modulus of the second heat-conducting element 710a is less than that of the first heat-conducting element 720a. Compared with the first heat-conducting element 720a, the second heat-conducting element 710a can not only effectively absorb assembly tolerances and meet the installation requirements of the optical module, but also effectively absorb compressive stress.

[0218] In some implementations, the bottom of the second heat-conducting component 710a may protrude beyond the bottom of the first heat-conducting component 720a. The connection between the heat-conducting assembly 700b and the DSP chip 320 is actually the connection between the second heat-conducting component 710a and the DSP chip 320, so that the heat-conducting assembly 700b and the DSP chip 320 make soft contact to protect the DSP chip 320.

[0219] In some embodiments, the top of the second heat-conducting element 710a may protrude beyond the top of the first heat-conducting element 720a. The connection between the heat-conducting assembly 700b and the upper housing 201 is actually the connection between the second heat-conducting element 710a and the upper housing 201, so that the heat-conducting assembly 700b makes soft contact with the upper housing 201 to protect the upper housing 201.

[0220] In some embodiments, the first heat-conducting element 720a may be provided with a second through hole 722a. The second through hole 722a may be filled with a second heat-conducting element 710a. The second through hole 722a may penetrate through the first sidewall and the second sidewall of the first heat-conducting element 720a. The first sidewall and the second sidewall are arranged opposite to each other, which reduces the effective contact area of ​​the first heat-conducting element 720a that actually bears pressure in the length or width direction, reduces the structural stability, and lengthens the force flow path, thereby reducing the structural stiffness of the first heat-conducting element 720a and increasing the compressibility of the first heat-conducting element 720a in the length or width direction.

[0221] In some embodiments, the second through-hole 722a and the first through-hole 721a can be connected to form a complex heat-conducting network, further optimizing the heat conduction path. This design not only enables effective heat transfer in the vertical direction but also disperses heat in the horizontal direction, avoiding localized overheating.

[0222] In some embodiments, the first heat-conducting element 720a may be provided with a third through hole. The third through hole may be filled with a second heat-conducting element 710a. The third through hole may penetrate the third sidewall and the fourth sidewall of the first heat-conducting element 720a, and the third sidewall and the fourth sidewall are disposed opposite to each other.

[0223] In some embodiments, the third through hole can be connected to the second through hole 722a and the first through hole 721a to form a more complex heat conduction network, further optimizing the heat conduction path.

[0224] In some embodiments, the side of the second heat-conducting element 710a can be flush with the side of the first heat-conducting element 720a, which can reduce the heat conduction path and allow the heat on the side of the second heat-conducting element 710a to be directly conducted to the side of the first heat-conducting element 720a, thereby improving the heat conduction efficiency.

[0225] Figure 14a This is a structural diagram of a first optical receiving component according to some embodiments. Figure 14a As shown, in some embodiments, the first optical receiving component 510 may include an optical fiber array 511, which may include at least one optical fiber to enable the optical fiber array 511 to transmit at least one optical signal. For example, the optical fiber array 511 may include four optical fibers, enabling the optical fiber array 511 to transmit four optical signals.

[0226] The end face of the fiber array 511 is an inclined surface. The optical signal is reflected downwards by the inclined surface, which changes the transmission direction of the optical signal from the horizontal direction to the vertical direction.

[0227] In some embodiments, the first optical receiving component 510 may be disposed on a support plate. The first optical receiving component 510 is similar to the optical emitting component 400a in that it includes an optical fiber array, a reflective / transmitting element, and a support plate including a first support boss supporting the optical fiber array and a first placement groove supporting the reflective / transmitting element. All other aspects are different. The support plate supporting the first optical receiving component 510 can be adjusted accordingly to correspond to the support plate 410, which will not be elaborated further here. The first optical receiving component 510 is similar to the optical emitting component 400b in that it includes an optical fiber array, a filter element, and a support plate including a first support boss supporting the optical fiber array and a fifth support boss supporting the filter. All other aspects are different. The support plate supporting the first optical receiving component 510 can be adjusted accordingly to correspond to the support plate 410, which will not be elaborated further here.

[0228] In some embodiments, the first optical receiving component 510 may be disposed on the circuit board 300.

[0229] In some embodiments, the first optical receiving component 510 may include at least one optical receiving chip 512. The optical receiving chip 512 can convert optical signals into current signals, so that the first optical receiving component 510 can convert at least one optical signal into at least one current signal. For example, the first optical receiving component 510 may include four optical receiving chips 512, so that the first optical receiving component 510 can convert four optical signals into four current signals.

[0230] The optical receiver chip 512 can be located below the end face of the fiber array 511, so that the optical receiver chip 512 can be located on the reflected light path of the end face of the fiber array 511, thereby enabling the optical receiver chip 512 to receive the optical signal reflected by the end face of the fiber array 511.

[0231] In some embodiments, the optical receiver chip 512 is tilted so that the optical signal reflected by the end face of the fiber array 511 can be incident vertically onto the optical receiver chip 512, thereby improving coupling efficiency.

[0232] In some embodiments, the first optical receiving component 510 may include a transimpedance amplifier chip 513. The transimpedance amplifier chip 513 may be electrically connected to the optical receiving chip 512 so that the transimpedance amplifier chip 513 can convert the current signal of the optical receiving chip 512 into a voltage signal. The transimpedance amplifier chip 513 may be disposed on the upper surface of the circuit board 300 and electrically connected to the circuit board 300.

[0233] In some embodiments, the optical receiver chip 512 is disposed on the circuit board 300, and the optical receiver chip 512 is wire-connected to the transimpedance amplifier chip 513.

[0234] In some embodiments, the optical receiver chip 512 can be disposed on the transimpedance amplifier chip 513, which provides a stable support platform for the optical receiver chip 512, while the vertical transmission of the signal is achieved through the circuit board 300. This layered layout shortens the electrical signal transmission path and effectively suppresses electromagnetic interference by utilizing the ground plane of the circuit board 300.

[0235] In some embodiments, the front side of the optical receiver chip 512 faces away from the circuit board 300, and the pads on the front side of the optical receiver chip 512 are wire-connected to the pads on the front side of the transimpedance amplifier chip 513 to achieve electrical connection between the optical receiver chip 512 and the transimpedance amplifier chip 513.

[0236] In some embodiments, the front side of the optical receiver chip 512 faces the circuit board 300, and the solder balls on the front side of the optical receiver chip 512 are soldered to the solder pads on the front side of the transimpedance amplifier chip 513 to achieve electrical connection between the optical receiver chip 512 and the transimpedance amplifier chip 513.

[0237] Figure 14b This is a partial view of a first optical receiving component provided according to some embodiments. Figure 14c Partial breakdown of a first optical receiving component provided according to some embodiments Figure 1 . Figure 14d Partial breakdown of a first optical receiving component provided according to some embodiments Figure 2 .like Figure 14b , Figure 14c and Figure 14dAs shown, in some embodiments, the first light receiving component 510 may include a substrate 514. The top of the substrate 514 is connected to the light receiving chip 512.

[0238] In some embodiments, the bottom of the substrate 514 may be connected to the top of the transimpedance amplifier chip 513 so that the light receiving chip 512 can be disposed on the transimpedance amplifier chip 513 through the substrate 514.

[0239] In some embodiments, solder balls may surround the perimeter of the substrate 514 so that the transimpedance amplifier chip 513 and the light receiver chip 512 can be connected through the solder balls and the substrate 514.

[0240] In some embodiments, the solder ball can completely enclose the substrate 514 so that the transimpedance amplifier chip 513 and the light receiver chip 512 can be connected through the solder ball, and the substrate 514 is disposed inside the solder ball.

[0241] In some embodiments, the bottom of the substrate 514 may be connected to the circuit board 300 so that the receiving chip 512 can be disposed on the circuit board 300 through the substrate 514.

[0242] In some embodiments, the thickness dimension d1 of the first end of the substrate 514 is greater than the thickness dimension d2 of the second end of the substrate 514, so that the light receiving chip 512 is tilted, that is, the photosensitive surface of the light receiving chip 512 is tilted relative to the circuit board 300, so the light signal reflected by the end face of the fiber array 511 is perpendicularly incident on the photosensitive surface of the light receiving chip 512.

[0243] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Upper casing; Circuit board; A digital signal processing chip is mounted on the circuit board; A heat-conducting assembly, with its bottom connected to the digital signal processing chip and its top connected to the upper housing, is used to conduct heat from the digital signal processing chip. The thermally conductive assembly includes: The first heat-conducting element is located in the middle of the heat-conducting assembly; The second heat-conducting element wraps around the first heat-conducting element, has a hardness value less than that of the first heat-conducting element, a thermal conductivity less than that of the first heat-conducting element, a bottom protruding from the bottom of the first heat-conducting element, and a top protruding from the top of the first heat-conducting element.

2. The optical module according to claim 1, characterized in that, The first heat-conducting element includes: First heat-conducting column; The second heat-conducting pillar is disposed on the first heat-conducting component and is arranged in the same direction as the first heat-conducting pillar along the first heat-conducting component.

3. The optical module according to claim 1, characterized in that, The first heat-conducting element includes: First heat-conducting column; The second heat-conducting pillar is disposed on the first heat-conducting component and is arranged in a different direction from the first heat-conducting pillar along the first heat-conducting component.

4. The optical module according to claim 2 or 3, characterized in that, The top of the first heat-conducting pillar is connected to the bottom of the second heat-conducting pillar.

5. The optical module according to claim 1, characterized in that, The side of the first heat-conducting component is flush with the side of the second heat-conducting component.

6. The optical module according to claim 1, characterized in that, The elastic modulus of the second heat-conducting component is less than that of the first heat-conducting component.

7. The optical module according to claim 1, characterized in that, Also includes: An optical receiving component, electrically connected to the digital signal processing chip, includes: The fiber optic array has its end face tilted so that the optical signal is reflected downwards through the end face. An optical receiving chip is disposed on the reflected optical path of the end face of the optical fiber array for receiving optical signals; the optical receiving chip is tilted so that the optical signal can be incident perpendicularly onto the optical receiving chip; A transimpedance amplifier chip is mounted on the circuit board and is electrically connected to the optical receiver chip.

8. The optical module according to claim 7, characterized in that, The optical receiving chip is disposed on the transimpedance amplifier chip, and the solder balls of the optical receiving chip are soldered to the transimpedance amplifier chip. The optical receiving component further includes: The substrate is connected to the light receiving chip at the top and to the transimpedance amplifier chip at the bottom, with the thickness of the first end being greater than that of the second end.

9. The optical module according to claim 7, characterized in that, The optical receiving chip is disposed on the circuit board, and the optical receiving chip is wire-connected to the transimpedance amplifier chip; The optical receiving component further includes: The substrate is connected to the light receiving chip at the top and to the circuit board at the bottom, with the thickness of the first end being greater than that of the second end.

10. The optical module according to claim 1, characterized in that, Also includes: A light-emitting component, electrically connected to the digital signal processing chip, includes: Laser chip array, used to emit optical signals; An isolator array is located in the optical output path of the laser chip array; An optical fiber array is located on the output optical path of the isolator array; The support plate carries the laser chip array, the isolator array, and the fiber array.

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