Lens driving device

Abstract

The utility model belongs to optical image equipment technical field, concretely relates to a lens drive arrangement, include: base, frame is provided with the accommodation groove on one side side wall, and the frame inside pre -buried has frame built -in metal, and the frame built -in metal includes and AF emitter plate and AF receiver plate side of accommodation groove are arranged side by side, carrier, carrier is located in the frame and is set up to be movable along the third direction relative to the frame, one side of carrier is provided with AF floating plate, AF floating plate adopts the metal sheet, and AF floating plate is inserted in the accommodation groove and can move along the third direction with carrier, and AF floating plate makes AF emitter plate and AF receiver plate form AF capacitor structure between. The utility model sets up AF capacitor structure in the third direction and realizes the effect of third direction position sensor, and will not increase the thickness between carrier and frame, and AF floating plate does not need to energize, reduces the power supply layout, and the structure design is more simple.

Description

Technical Field

[0001] This utility model belongs to the field of optical imaging equipment technology, and specifically relates to a lens driving device. Background Technology

[0002] In recent years, with the development of technology, many electronic devices now have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards a more convenient and thinner design to provide users with more choices.

[0003] In practice, in order to adapt to various shooting scenarios, the lens needs to be constantly focused. In existing technologies, a lens drive device is generally used to drive the lens to move along the optical axis to adjust the focal length.

[0004] In the prior art, a lens driving device includes a frame, a carrier, and a base. The carrier is used to mount the lens, and the carrier is equipped with a coil and is movably mounted within the frame, capable of moving along the optical axis of the lens to adjust the lens focal length. The frame is movably mounted above the base and can move perpendicular to the optical axis to prevent lens shake.

[0005] However, to precisely control the movement of the carrier or frame, it is also necessary to sense the specific position of the carrier and frame in real time. In existing technologies, Hall effect sensors are generally used to sense the position of the carrier or frame. However, Hall effect sensors are relatively large, which affects the slim design of the lens drive mechanism, and the detection results are unstable, failing to meet market demands. Therefore, how to achieve three-axis motion while simultaneously achieving a slim design of the lens drive mechanism is one of the issues that needs attention. Utility Model Content

[0006] The present invention addresses the aforementioned technical problems by providing a lens driving device.

[0007] A lens driving device, the lens driving device comprising:

[0008] Base;

[0009] A frame is suspended on the base. The frame is configured to move relative to the base in a first direction and a second direction. A receiving groove is provided on one side wall of the frame. Frame-embedded metal is embedded inside the frame. The frame-embedded metal includes an AF emitting electrode plate and an AF receiving electrode plate arranged side by side on the side of the receiving groove.

[0010] A carrier is located within the frame and is configured to move relative to the frame in a third direction. An AF floating plate is provided on one side of the carrier. The AF floating plate is made of metal and extends out of the carrier in a third direction. The AF floating plate is inserted into the receiving groove and can move with the carrier in a third direction. The AF floating plate enables the formation of an AF capacitor structure between the AF transmitting electrode and the AF receiving electrode.

[0011] Optionally, the carrier has a built-in metal embedded inside, and the AF floating plate is disposed on the built-in metal. The top end of the AF floating plate is embedded in the carrier, and the bottom end of the AF floating plate is bent and extends out to one side of the carrier, so that the AF floating plate forms a bent structure on one side of the carrier.

[0012] Optionally, the AF transmitting electrode and the AF receiving electrode are arranged side by side on one or both inner walls of the receiving groove along a first direction or a second direction.

[0013] Optionally, the frame-embedded metal also includes a frame-embedded power-conducting protective plate, which is disposed on the outside of the AF transmitting electrode and the AF receiving electrode.

[0014] Optionally, the lens driving device further includes a plurality of upper springs, which are respectively connected between the top of the frame and the top of the carrier, wherein three of the upper springs are independently connected to the AF emitting electrode plate, the AF receiving electrode plate, and the frame-built-in power-conducting protective plate.

[0015] The base has support parts at its four corners. The top of each support part is connected to one or more upper springs. The frame and the carrier are suspended on the base by the support parts. The current provided by the base's built-in circuit is transmitted through three independent upper springs to the AF transmitting plate, the AF receiving plate, and the frame's built-in power protection plate by the three support parts.

[0016] Optionally, the frame-embedded metal also includes a plurality of frame-embedded hollow metals, which are embedded in the sidewalls away from the receiving groove.

[0017] Optionally, the frame-embedded metal also includes an X-axis emitting electrode plate and a Y-axis emitting electrode plate, one of which is connected to the bottom end of the AF emitting electrode plate and the other is connected to the bottom end of the AF receiving electrode plate. Preferably, the X-axis emitting electrode plate and the Y-axis emitting electrode plate are exposed on the bottom surface of the frame.

[0018] An X-axis receiving electrode and a Y-axis receiving electrode are provided on the base or on the circuit board disposed on the base. The X-axis receiving electrode and the Y-axis receiving electrode are respectively disposed in relation to the X-axis emitting electrode and the Y-axis emitting electrode to form an OIS capacitor structure.

[0019] Optionally, the lens driving device further includes a plurality of upper springs, which are respectively connected between the top of the frame and the top of the carrier, wherein two upper springs are independently connected to the AF emitting electrode plate and the AF receiving electrode plate, respectively.

[0020] The base has support parts at its four corners. The top of each support part is connected to one or more upper spring plates. The frame and the carrier are suspended on the base by the support parts. The current provided by the base's built-in circuit is transmitted to the AF transmitting plate, the AF receiving plate, the X-axis transmitting plate, and the Y-axis transmitting plate by two independent upper spring plates through two support parts.

[0021] Optionally, a plurality of OIS coils are provided on the base or in a circuit board disposed on the base, and a plurality of magnets are provided on the frame. Each magnet is disposed opposite to a corresponding OIS coil, and after the OIS coil is energized, the frame can move relative to the base in a first direction or a second direction.

[0022] Optionally, a circuit board is provided on the base, and a plurality of OIS coils and a substrate are provided in the circuit board. The X-axis receiving electrode plate and the Y-axis receiving electrode plate are provided on the top of the substrate, and a control IC chip is provided at the bottom of the substrate. The control IC chip is electrically connected to the X-axis receiving electrode plate, the Y-axis receiving electrode plate and the OIS coil respectively.

[0023] Several of the OIS coils are arranged around or away from the substrate.

[0024] Optionally, the upper end of the base is provided with a chip clearance slot for avoiding the control IC chip, and when the circuit board is disposed on the base, the control IC chip is located in the chip clearance slot.

[0025] Optionally, an AF coil is provided on the outside of the carrier, and a plurality of magnets are provided on the frame. Each magnet is arranged opposite to a corresponding AF coil, and after the AF coil is energized, the carrier can move relative to the frame in a third direction.

[0026] Optionally, the lens driving device further includes a plurality of upper springs, which are respectively connected between the top of the frame and the top of the carrier, and one of the upper springs is independently connected to the AF coil;

[0027] The base has support parts at its four corners. The top of each support part is connected to a corresponding upper spring. The frame and the carrier are suspended on the base by the support parts. The current provided by the base's built-in circuit is transmitted to the AF coil through an independent upper spring via one of the support parts.

[0028] Optionally, the support portion adopts a mounting protrusion, which is provided with an electrical contact point connected to the built-in circuit of the base, and the built-in circuit of the base is connected to the upper spring through the electrical contact point.

[0029] Optionally, the support portion is an energized rod that extends in a third direction and whose bottom end is connected to the built-in circuit of the base. The built-in circuit of the base is connected to the upper spring through the energized rod.

[0030] Optionally, the circuit board is an FPC board.

[0031] Optionally, both the upper end of the base and the bottom end of the frame are provided with ball grooves, and balls are provided in the ball grooves.

[0032] Optionally, the lens driving device further includes a lower spring, which is connected between the bottom end of the frame and the bottom end of the carrier.

[0033] Optionally, the lens driving device further includes a housing, which is detachably connected to the base and forms a hollow cavity, and the frame and the carrier are both disposed in the hollow cavity.

[0034] Beneficial effects: This utility model has at least one or more of the following advantages:

[0035] 1. In the third direction, this utility model establishes an AF capacitor structure between the AF transmitting plate and the AF receiving plate by setting an AF floating plate on the carrier. When the AF floating plate moves with the carrier in the third direction, the capacitance value of this AF capacitor structure changes. Based on this change, the third moving position of the carrier can be determined, achieving the effect of a third-direction position sensor. Since the AF floating plate is inserted into a receiving slot on the frame, it does not increase the thickness between the carrier and the frame, and the AF floating plate does not require power, reducing the power supply layout and making the structural design simpler.

[0036] 2. This utility model provides a frame with an internally connected protective plate on the outside of the AF transmitting plate and the AF receiving plate. This plate serves to fix the potential and prevent the change in electric field during OIS operation from affecting the AF direction sensing signal, thereby improving the sensing accuracy of the AF direction capacitor structure.

[0037] This utility model has a frame-embedded hollow metal built into the side wall of the frame without a receiving groove. Its main function is to strengthen the frame structure and attract magnets to improve the stability of magnet installation.

[0038] 3. This utility model uses the design of upper and / or lower springs for the resetting operation of the carrier.

[0039] This invention utilizes the coordinated design of the upper spring and the support to fully support the frame and carrier, placing them in a suspended state to reduce friction during OIS driving. Simultaneously, the elasticity of the upper spring provides a certain degree of reset after the frame moves in the first and second directions. During driving, the current from the base's built-in circuit is transmitted to the OIS coil and the upper spring, then via the upper spring to the AF coil on the outer periphery of the carrier, thus powering the OIS coil and AF coil.

[0040] In addition, the power-on protective plate, AF transmitting plate, AF receiving plate, X-axis transmitting plate, and Y-axis transmitting plate are also powered through upper springs.

[0041] 4. In the first and second OIS driving directions of this utility model, an OIS capacitor structure is formed by the combination of the X-axis emitting electrode plate and the X-axis receiving electrode plate, and the combination of the Y-axis emitting electrode plate and the Y-axis receiving electrode plate. After the frame moves in the first and second directions, the capacitance value of the corresponding capacitor in the OIS capacitor structure will change. Based on this change, the first and second direction moving positions of the frame and the carrier can be determined, thus realizing the effect of the first and second direction position sensors.

[0042] In addition, since the X-axis and Y-axis receiving plates are positioned away from the OIS coil, the placement of the receiving plates avoids affecting the Lorentz force between the OIS coil and the magnet. It also avoids the receiving plates occupying the mounting space of the OIS coil on the circuit board, thus reducing the thickness of the circuit board. Attached Figure Description

[0043] Figure 1 This is an exploded view of the structure of this utility model;

[0044] Figure 2 for Figure 1 Further exploded view;

[0045] Figure 3 for Figure 2 Further exploded view;

[0046] Figure 4 This is a diagram showing the positional relationship between the frame and the carrier of this utility model;

[0047] Figure 5 for Figure 4 Another perspective illustration;

[0048] Figure 6 for Figure 4 Exploded view;

[0049] Figure 7 for Figure 4 Internal structure diagram;

[0050] Figure 8 for Figure 7 Exploded view;

[0051] Figure 9 for Figure 8 Another perspective illustration;

[0052] Figure 10 This is a diagram showing the positional relationship between the base and the circuit board of this utility model;

[0053] Figure 11 This is a schematic diagram of the circuit board structure of this utility model;

[0054] Figure 12 for Figure 11 A schematic diagram of the internal structure. Detailed Implementation

[0055] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0056] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0057] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0058] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0059] In the following description, the first direction is defined as the X-axis, the second direction as the Y-axis, and the third direction as the Z-axis, which is the optical axis. The optical axis represents the direction of light propagation within an optical element; it is an abstract concept and does not refer to a physical axis.

[0060] Reference Figures 1 to 12 This utility model provides a lens driving device, which mainly includes a housing 10, a base 20, a frame 30, and a carrier 40.

[0061] The outer shell 10 is an optional structure. The outer shell 10 and the base 20 are detachably connected and form a hollow cavity. The frame 30 and the carrier 40 are both disposed within the hollow cavity. The outer shell 10 and the base 20 are preferably connected by a snap-fit ​​mechanism to form the hollow cavity.

[0062] The frame 30 is suspended above the base 20 and is configured to move relative to the base 20 along the X-axis and Y-axis directions. The X-axis and Y-axis directions are perpendicular to each other. In a specific implementation, in one example, refer to... Figure 3 and Figure 12 The lens driving device also includes a circuit board 50, which is mounted on the base 20. Several OIS coils 61 are disposed within the circuit board 50. Several magnets 62 are disposed on the frame 30, each magnet 62 being positioned opposite a corresponding OIS coil 61. When the OIS coil 61 is energized, the frame 30, together with the carrier 40 mounted thereon, can move relative to the base 20 along the X-axis and Y-axis directions within the hollow cavity, achieving image stabilization.

[0063] Since the OIS coil 61 is built into the circuit board 50, the base-built circuit in the base transmits current to the OIS coil 61 through the circuit board 50.

[0064] When the lens drive device does not have circuit board 50, in another example, refer to Figure 10 Several OIS coils 61 are fixedly wound on the base 20, and the OIS coils 61 are powered by the built-in circuit inside the base 20.

[0065] The carrier 40 is located within the frame 30 and is configured to move relative to the frame 30 along the Z-axis. The Z-axis is perpendicular to both the X-axis and Y-axis. In one specific implementation example, refer to... Figures 3 to 6 An AF coil 63 is provided on the outside of the carrier 40, and several magnets 62 are provided on the frame 30. Each magnet 62 is positioned opposite to a corresponding AF coil 63. After the AF coil 63 is energized, the carrier 40 can move relative to the frame 30 along the Z-axis to achieve zoom.

[0066] The lens is installed inside the carrier 40. When the carrier 40 moves, it can drive the lens to move along its optical axis, that is, the Z-axis. When the frame 30 moves, it can drive the carrier 40 and the lens on it to move along the X-axis and Y-axis, thus realizing the three-axis movement operation of the lens.

[0067] Reference Figures 6 to 9 A receiving groove 31 is provided on one side wall of the frame 30. An embedded frame metal is pre-installed inside the frame 30, including an AF emitting plate 71 and an AF receiving plate 72 arranged side-by-side on the side of the receiving groove 31. An AF floating plate 73 is provided on one side of the carrier 40. The AF floating plate 73 is made of metal and extends out of the carrier 40 along the Z-axis. The AF floating plate 73 is inserted into the receiving groove 31 and can move along the Z-axis with the carrier 40. The AF floating plate 73 forms an AF capacitor structure between the AF emitting plate 71 and the AF receiving plate 72.

[0068] When the AF floating plate 73 moves along the Z-axis with the carrier 40, the capacitance value of the AF capacitor structure changes. Based on this change, the Z-axis position of the carrier 40 can be determined, thus achieving the effect of a Z-axis position sensor. Since the AF floating plate 73 is inserted into the receiving groove 31 on the frame 30, it does not increase the thickness between the carrier 40 and the frame 30. Furthermore, the AF floating plate 73 does not require power, reducing the power supply layout and making the structural design simpler.

[0069] In the above design, the positions and functions of the AF transmitting plate 71 and the AF receiving plate 72 can be interchanged, and they can also form an AF capacitor structure and achieve the same position sensing effect.

[0070] In one embodiment, the frame 30 is a frame structure extending around the Z-axis and is disposed above the circuit board 50. The frame 30 is provided with a magnet mounting groove for mounting magnets. Magnets 62 are installed in the magnet mounting groove. Magnets 62 correspond to OIS coil 61 and AF coil 63 wound around the outside of carrier 40, respectively.

[0071] In one embodiment, reference is made to Figures 6 to 9The carrier 40 has a built-in metal 41 embedded inside, and an AF floating plate 73 is provided on the built-in metal 41. The top end of the AF floating plate 73 is embedded inside the carrier 40, and the bottom end of the AF floating plate 73 is bent and extends out to one side of the carrier 40, so that the AF floating plate 73 forms a bent structure on one side of the carrier 40.

[0072] The AF floating plate 73 is preferably integrally made of metal material with the carrier-embedded metal 41.

[0073] In one embodiment, the AF transmitting electrode 71 and the AF receiving electrode 72 are arranged side by side along the X-axis on one or both inner walls of the receiving groove 31.

[0074] Reference Figures 7 to 9 The AF emitting electrode 71 and the AF receiving electrode 72 are arranged side-by-side on the inner walls of the receiving groove 31 along the X-axis. The AF emitting electrodes 71 on the inner walls of the receiving groove 31 are interconnected, and the AF receiving electrodes 72 on the inner walls of the receiving groove 31 are interconnected. When there is an X-axis emitting electrode or a Y-axis emitting electrode, the AF emitting electrodes 71 or the AF receiving electrodes 72 on the inner walls of the receiving groove 31 are connected through the X-axis emitting electrode or the Y-axis emitting electrode. Figure 9 As shown, the AF emitting plates 71 located on both sides of the inner wall of the receiving tank 31 are connected through the X-axis emitting plate 74, and the AF receiving plates 72 located on both sides of the inner wall of the receiving tank 31 are connected through the Y-axis emitting plate 75.

[0075] In one embodiment, the lens driving device further includes an AF capacitor IC chip, which is preferably disposed on the frame. The AF capacitor IC chip is connected to the AF emitting electrode 71 and is used to monitor the capacitance value of the AF capacitor structure formed between the AF emitting electrode 71 and the AF receiving electrode 72.

[0076] In one embodiment, reference is made to Figures 8 to 9 The frame-embedded metal also includes a frame-embedded power-conducting protective plate 76, which is disposed on the outside of the AF transmitting electrode plate 71 and the AF receiving electrode plate 72.

[0077] This invention provides a frame-integrated power-conducting protective plate 76 on the outside of the AF transmitting plate 71 and the AF receiving plate 72. This plate serves to fix the potential and prevent the change in electric field during the OIS operation of the frame 30 from affecting the sensing signal in the AF direction, thereby improving the sensing accuracy of the AF direction capacitor structure.

[0078] In one embodiment, reference is made to Figures 1 to 3The lens driving device also includes several upper springs 81. The AF transmitting electrode 71, the AF receiving electrode 72, and the frame-built-in power-conducting protective plate 76 are energized through the upper springs 81. Specifically:

[0079] Several upper spring plates 81 are respectively connected between the top of the frame 30 and the top of the carrier 40, among which three upper spring plates 81 are independently connected to the AF transmitting plate 71, the AF receiving plate 72, and the frame-built-in power-conducting protective plate 76.

[0080] The base 20 has support parts at its four corners. The top of each support part is connected to one or more upper spring plates 81. The frame 30 and the carrier 40 are suspended on the base 20 through the support parts. The current provided by the base built-in circuit in the base 20 is transmitted to the AF transmitting plate 71, the AF receiving plate 72, and the frame built-in power protection plate 76 through the three support parts via the three independent upper spring plates 81.

[0081] In one embodiment, reference is made to Figures 1 to 3 , Figure 10 The support part adopts a mounting protrusion 21, which is provided with an electrical contact point connected to the built-in circuit of the base. The built-in circuit of the base is connected to the spring 81 through the electrical contact point.

[0082] In this embodiment, the mounting protrusions 21 at the four corners of the base 20 support and supply power to the upper spring 81, the frame 30, and the carrier 40.

[0083] In one embodiment, the support part adopts an electric rod that extends along the Z-axis. The bottom end of the electric rod is connected to the built-in circuit of the base, and the top end of the electric rod is connected to the upper spring 81. The built-in circuit of the base is connected to the upper spring 81 through the electric rod.

[0084] In one embodiment, reference is made to Figures 7 to 9 The frame-embedded metal also includes several frame-embedded hollow metal 32, which are embedded in the side wall of the frame 30 away from the receiving groove 31.

[0085] The frame's built-in hollow metal 32 is a structure in which metal strips / blocks have metal through-slots / grooves cut out. This design minimizes the weight of the frame 30 while simultaneously strengthening its structure and attracting the magnets 62, thus improving the stability of the magnets 62 during installation. Adjacent frame-built-in hollow metal 32s within the frame 30 can be connected together as a single unit or designed independently.

[0086] When the frame 30 is a rectangular frame, one side is provided with a receiving groove 31, and the other three sides are provided with frame-embedded hollow metal 32. Of course, when the frame 30 is other irregular structures, the frame-embedded hollow metal 32 is built into all other positions except for the side where the receiving groove 31 is located or the preset position nearby.

[0087] In one embodiment, reference is made to Figure 9 The frame's built-in metal also includes an X-axis emitting electrode 74 and a Y-axis emitting electrode 75. One of the X-axis emitting electrode 74 and the Y-axis emitting electrode 75 is connected to the bottom end of the AF emitting electrode 71, and the other is connected to the bottom end of the AF receiving electrode 72. Preferably, the X-axis emitting electrode 74 and the Y-axis emitting electrode 75 are exposed on the bottom surface of the frame 30. Figure 9 As shown, the X-axis emitting electrode 74 is connected to the bottom end of the AF emitting electrode 71, and the Y-axis emitting electrode 75 is connected to the bottom end of the AF receiving electrode 72.

[0088] Reference Figure 2 and Figure 12 A circuit board 50 is mounted on the base 20. An X-axis receiving electrode 77 and a Y-axis receiving electrode 78 are housed within the circuit board 50. The X-axis receiving electrode 77 and the Y-axis receiving electrode 78 are respectively positioned to correspond with the X-axis transmitting electrode 74 and the Y-axis transmitting electrode 75, forming an OIS capacitor structure. Since the X-axis receiving electrode 77 and the Y-axis receiving electrode 78 are integrated within the circuit board 50, the circuit board 50 provides power to the X-axis receiving electrode 77 and the Y-axis receiving electrode 78.

[0089] After the frame 30 moves in the X-axis and Y-axis directions, the capacitance value of the corresponding capacitor in the OIS capacitor structure will change. Based on this change, the X-axis and Y-axis positions of the frame 30 and the carrier 40 can be determined, thus achieving the effect of an X-axis and Y-axis position sensor.

[0090] In another example where the lens drive device does not have a circuit board 50, the X-axis receiving electrode 77 and the Y-axis receiving electrode 78 are embedded in the upper surface of the base 20. The X-axis receiving electrode 77 and the Y-axis receiving electrode 78 are respectively positioned to correspond with the X-axis emitting electrode 74 and the Y-axis emitting electrode 75, forming an OIS capacitor structure. In this case, power is supplied by the built-in circuit within the base, which also achieves the technical effect of an inductive capacitor.

[0091] In one embodiment, one of the X-axis emitting electrode 74 and the Y-axis emitting electrode 75 is integrally connected to the bottom end of the AF emitting electrode 71 and the other is integrally connected to the bottom end of the AF receiving electrode 72.

[0092] like Figure 9As shown, the X-axis emitting electrode 74 and the AF emitting electrode 71 are integrally formed, and the Y-axis emitting electrode 75 and the AF receiving electrode 72 are integrally formed.

[0093] In one embodiment, reference is made to Figures 1 to 3 The lens driving device also includes several upper springs 81. The AF emitting electrode 71, AF receiving electrode 72, X-axis emitting electrode 74, and Y-axis emitting electrode 75 are energized through the upper springs 81. Specifically:

[0094] Several upper spring plates 81 are respectively connected between the top of the frame 30 and the top of the carrier 40, among which two upper spring plates 81 are independently connected to the AF transmitting plate 71 and the AF receiving plate 72.

[0095] The base 20 has support parts at its four corners. The top of each support part is connected to one or more upper spring plates 81. The frame 30 and the carrier 40 are suspended on the base 20 through the support parts. The current provided by the base built-in circuit in the base 20 is transmitted to the AF transmitting plate 71, AF receiving plate 72, X-axis transmitting plate 74, and Y-axis transmitting plate 75 through two independent upper spring plates 81 via two support parts.

[0096] Since one of the X-axis emitting electrode 74 and the Y-axis emitting electrode 75 is connected to the bottom end of the AF emitting electrode 71 and the other is connected to the bottom end of the AF receiving electrode 72, therefore... Figure 9 In the embodiment shown, the X-axis emitting plate 74 is energized simultaneously with the AF emitting plate 71, and the Y-axis emitting plate 75 is energized simultaneously with the AF receiving plate 72. Therefore, power supply can be achieved by cooperating with only two support parts and two upper springs 81.

[0097] In this embodiment, the upper spring 81 and the support part are designed to fully support the frame 30 and the carrier 40, so that the frame 30 and the carrier 40 are suspended in the air, thereby reducing the friction during OIS driving; at the same time, after the frame 30 moves in the X-axis and Y-axis directions, the elasticity of the upper spring 81 can play a certain role in resetting.

[0098] In one embodiment, reference is made to Figure 2 , Figure 3 , Figure 11 and Figure 12A circuit board 50 is mounted on the base 20. Several OIS coils 61 and a substrate 51 are housed within the circuit board 50. An X-axis receiving plate 77 and a Y-axis receiving plate 78 are positioned at the top of the substrate 51. A control IC chip 79 is located at the bottom of the substrate 51. The control IC chip 79 is electrically connected to the X-axis receiving plate 77, the Y-axis receiving plate 78, and the OIS coils 61. By detecting the capacitance value of the formed OIS capacitor structure, the control IC chip 79 determines the movement position of the lens in the X and Y axes and controls the current state of the OIS.

[0099] Several OIS coils 61 are arranged around or away from the substrate 51. (Refer to...) Figure 12 Three OIS coils 61 are arranged around the substrate 51. Since the X-axis receiving plate 77 and Y-axis receiving plate 78 on the substrate 51 are positioned away from the OIS coils 61, the placement of the receiving plates avoids affecting the Lorentz force between the OIS coils 61 and the magnet 62. At the same time, the receiving plates also avoid occupying the mounting space of the OIS coils 61 on the circuit board 50, thus reducing the thickness of the circuit board 50.

[0100] In one embodiment, the upper end of the base 20 is provided with a chip clearance groove 22 for avoiding the control IC chip 79. When the circuit board 50 is disposed on the base 20, the control IC chip 79 is located within the chip clearance groove 22, thereby reducing the thickness between the base 20 and the circuit board 50.

[0101] In one embodiment, reference is made to Figures 1 to 3 The lens drive mechanism also includes several upper springs 81, through which the AF coil 63 is energized. Specifically:

[0102] Several upper springs 81 are respectively connected between the top of the frame 30 and the top of the carrier 40, and one of the upper springs 81 is independently connected to the AF coil 63.

[0103] The base 20 has support parts at its four corners. The top of each support part is connected to a corresponding upper spring 81. The frame 30 and the carrier 40 are suspended on the base 20 through several support parts. The current provided by the base built-in circuit in the base 20 is transmitted to the AF coil 63 through an independent upper spring 81 via a support part.

[0104] In one embodiment, the circuit board 50 is an FPC board.

[0105] In one embodiment, reference is made to Figure 5 and Figure 10Both the upper end of the base 20 and the bottom end of the frame 30 are provided with ball grooves 91, and ball bearings 90 are provided in the ball grooves 91. By providing the ball bearings 90, the frame 30 can be supported, thereby reducing the friction of the frame 30 when it performs OIS movement.

[0106] In one embodiment, reference is made to Figure 3 and Figure 5 The lens driving device also includes a lower spring 82, which is connected between the bottom end of the frame 30 and the bottom end of the carrier 40. The upper spring 81 and / or the lower spring 82 are designed for the reset operation of the carrier 40.

[0107] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A lens driving device, characterized in that, The lens driving device includes: Base; A frame is suspended on the base. The frame is configured to move relative to the base in a first direction and a second direction. A receiving groove is provided on one side wall of the frame. Frame-embedded metal is embedded inside the frame. The frame-embedded metal includes an AF emitting electrode plate and an AF receiving electrode plate arranged side by side on the side of the receiving groove. A carrier is located within the frame and is configured to move relative to the frame in a third direction. An AF floating plate is provided on one side of the carrier. The AF floating plate is made of metal and extends out of the carrier in a third direction. The AF floating plate is inserted into the receiving groove and can move with the carrier in a third direction. The AF floating plate enables the formation of an AF capacitor structure between the AF transmitting electrode and the AF receiving electrode.

2. The lens driving device as described in claim 1, characterized in that, The carrier has a built-in metal embedded inside, and the AF floating plate is set on the built-in metal. The top end of the AF floating plate is embedded in the carrier, and the bottom end of the AF floating plate is bent and extends out of the carrier, so that the AF floating plate forms a bent structure on the carrier side.

3. The lens driving device as described in claim 1, characterized in that, The AF transmitting electrode and the AF receiving electrode are arranged side by side along a first direction or a second direction on one or both inner walls of the receiving groove.

4. The lens driving device as described in claim 1, characterized in that, The frame-embedded metal also includes a frame-embedded power-conducting protective plate, which is disposed on the outside of the AF transmitting electrode plate and the AF receiving electrode plate; And / or, the frame-embedded metal also includes a plurality of frame-embedded hollow metals, which are embedded in the sidewalls away from the receiving groove.

5. The lens driving device as described in claim 4, characterized in that, The lens driving device further includes several upper springs, which are respectively connected between the top of the frame and the top of the carrier. Three of the upper springs are independently connected to the AF emitting electrode plate, the AF receiving electrode plate, and the frame's built-in power-conducting protective plate. Support parts are provided at the four corners of the base, and the top of each support part is connected to one or more of the corresponding upper springs. The frame and the carrier are suspended on the base by the several support parts. The current provided by the base's built-in circuit is transmitted through the three support parts to the AF emitting electrode plate, the AF receiving electrode plate, and the frame's built-in power-conducting protective plate via the three independent upper springs.

6. The lens driving device as claimed in claim 1, characterized in that, The frame's built-in metal also includes an X-axis emitting electrode plate and a Y-axis emitting electrode plate, one of which is connected to the bottom end of the AF emitting electrode plate and the other is connected to the bottom end of the AF receiving electrode plate; An X-axis receiving electrode and a Y-axis receiving electrode are provided on the base or on the circuit board disposed on the base. The X-axis receiving electrode and the Y-axis receiving electrode are respectively disposed in relation to the X-axis emitting electrode and the Y-axis emitting electrode to form an OIS capacitor structure.

7. The lens driving device as described in claim 6, characterized in that, The X-axis emitting electrode and the Y-axis emitting electrode are respectively exposed on the bottom surface of the frame.

8. The lens driving device as described in claim 6, characterized in that, The circuit board is an FPC board.

9. The lens driving device as described in claim 6, characterized in that, The lens driving device further includes several upper springs, which are respectively connected between the top of the frame and the top of the carrier. Two upper springs are independently connected to the AF emitting electrode plate and the AF receiving electrode plate, respectively. Support parts are provided at the four corners of the base. The top of each support part is connected to one or more corresponding upper springs. The frame and the carrier are suspended on the base by the several support parts. The current provided by the base built-in circuit in the base is transmitted to the AF emitting electrode plate, the AF receiving electrode plate, the X-axis emitting electrode plate, and the Y-axis emitting electrode plate through two independent upper springs via two support parts.

10. The lens driving device as claimed in claim 1, characterized in that, A plurality of OIS coils are provided on the base or in the circuit board disposed on the base, and a plurality of magnets are provided on the frame. Each magnet is disposed opposite to a corresponding OIS coil, and after the OIS coil is energized, the frame can move relative to the base in a first direction or a second direction.

11. The lens driving device as claimed in claim 10, characterized in that, The circuit board is an FPC board.

12. The lens driving device as claimed in claim 10, characterized in that, The frame's built-in metal also includes an X-axis emitting electrode plate and a Y-axis emitting electrode plate, one of which is connected to the bottom end of the AF emitting electrode plate and the other is connected to the bottom end of the AF receiving electrode plate; The base is provided with a circuit board, and the circuit board is provided with an X-axis receiving electrode plate and a Y-axis receiving electrode plate. The X-axis receiving electrode plate and the Y-axis receiving electrode plate are respectively arranged to correspond to the X-axis emitting electrode plate and the Y-axis emitting electrode plate and form an OIS capacitor structure. The circuit board contains a plurality of OIS coils and a substrate. The X-axis receiving plate and the Y-axis receiving plate are disposed at the top of the substrate. A control IC chip is disposed at the bottom of the substrate. The control IC chip is electrically connected to the X-axis receiving plate, the Y-axis receiving plate and the OIS coils respectively. The plurality of OIS coils are disposed around or away from the substrate.

13. The lens driving device as claimed in claim 12, characterized in that, The upper end of the base is provided with a chip clearance slot for avoiding the control IC chip. When the circuit board is placed on the base, the control IC chip is located in the chip clearance slot.

14. The lens driving device as claimed in claim 1, characterized in that, An AF coil is provided on the outside of the carrier, and several magnets are provided on the frame. Each magnet is positioned opposite to a corresponding AF coil, and the carrier can move relative to the frame in a third direction after the AF coil is energized.

15. The lens driving device as claimed in claim 14, characterized in that, The lens driving device also includes several upper springs, which are respectively connected between the top of the frame and the top of the carrier. One of the upper springs is independently connected to the AF coil. The four corners of the base are provided with support parts, and the top of each support part is connected to a corresponding upper spring. The frame and the carrier are suspended on the base by the several support parts. The current provided by the base built-in circuit in the base is transmitted to the AF coil through an independent upper spring through one of the support parts.

16. The lens driving device as described in claim 5, 9, or 15, characterized in that, The support portion adopts a mounting protrusion, and the mounting protrusion is provided with an electrical contact point that is connected to the built-in circuit of the base. The built-in circuit of the base is connected to the upper spring through the electrical contact point.

17. The lens driving device as described in claim 5, 9, or 15, characterized in that, The support part adopts an electric rod, which extends in a third direction and its bottom end is connected to the built-in circuit of the base. The built-in circuit of the base is connected to the upper spring through the electric rod.

18. The lens driving device as claimed in claim 1, characterized in that, Both the upper end of the base and the bottom end of the frame are provided with ball grooves, and balls are provided in the ball grooves. And / or, the lens driving device further includes a lower spring, which is connected between the bottom end of the frame and the bottom end of the carrier; And / or, the lens driving device further includes a housing, which is detachably connected to the base and forms a hollow cavity, and the frame and the carrier are both disposed in the hollow cavity.

Images