An intelligent eyewear

Abstract

The application belongs to the technical field of wearable technology, and particularly relates to a kind of smart glasses. The application aims to solve the problem of high surface temperature of the shell when using relevant smart glasses. The smart glasses of the application include a shell, a heating element and a heat dissipation structure. The heating element and the heat dissipation structure are both arranged in the shell, and the heat dissipation structure is located between the heating element and the shell. The heat dissipation structure includes a heat reflecting layer and a heat conducting ring layer. By arranging the heat dissipation structure between the heating element and the shell, the heat reflecting layer in the heat dissipation structure reflects most of the heat from the heating element back to the heating element, and a small part of the heat from the heating element is transmitted to the surface of the shell through the heat conducting ring layer of the heat dissipation structure, thereby reducing the surface temperature of the shell, improving the comfort when wearing and enhancing the user experience.

Description

Technical Field

[0001] This application relates to the field of wearable technology, and more particularly to a smart pair of glasses. Background Technology

[0002] As a key product in the wearable technology field, smart glasses are seeing their functions continuously expanded and enhanced with the integration and development of technologies such as artificial intelligence, computer vision, and communication. Currently, smart glasses integrate high-performance chips to perform complex computational tasks such as voice recognition, real-time image processing, augmented reality / virtual reality scene rendering, and rapid data transmission and analysis.

[0003] Chips generate a lot of heat during operation. To dissipate heat from the chip and prevent it from overheating and affecting performance, smart glasses typically transfer the heat generated by the chip to the smart glasses' housing. The housing then exchanges heat with the air to transfer the chip's heat to the air, thereby lowering the chip's temperature.

[0004] However, since smart glasses need to be worn, excessively high surface temperatures of the casing can reduce comfort when wearing them. Utility Model Content

[0005] In view of this, the main objective of this application is to provide a smart glasses solution to the technical problem of high surface temperature of the housing during use.

[0006] To achieve the above objectives, embodiments of this application provide smart glasses, including:

[0007] The shell has an internal cavity;

[0008] The heating element is disposed within the accommodating cavity;

[0009] A heat dissipation structure is disposed on the side of the housing facing the accommodating cavity and located between the heat-generating component and the housing; the heat dissipation structure includes a heat-conducting ring layer, a heat insulation layer and a heat-reflecting layer;

[0010] One side of the heat-conducting ring layer is connected to the side of the housing facing the accommodating cavity, and the other side of the heat-conducting ring layer faces the heating element; the heat-conducting ring layer has an inner cavity;

[0011] The insulation layer is installed inside the cavity;

[0012] The heat-reflective layer is disposed on the side of the heat-conducting ring layer facing the heat-generating element.

[0013] In some embodiments that may include the above embodiments, the housing includes a first housing wall and a second housing wall connected to each other, and the second housing wall is inclined relative to the first housing wall.

[0014] The heat-conducting ring layer includes an outer ring and an inner ring that are connected to each other; the inner ring faces the heat-generating element.

[0015] The outer ring portion includes a first external heat-conducting portion and a second external heat-conducting portion connected to each other, the second external heat-conducting portion being inclined relative to the first external heat-conducting portion; the first external heat-conducting portion is connected to the side of the first shell wall facing the receiving cavity, and the second external heat-conducting portion is connected to the side of the second shell wall facing the receiving cavity.

[0016] In some embodiments that may include the above embodiments, the inner ring portion includes a first inner heat-conducting portion and a second inner heat-conducting portion connected to each other, and the second inner heat-conducting portion is inclined relative to the first inner heat-conducting portion.

[0017] The first inner heat-conducting part and the first outer heat-conducting part are arranged opposite to each other, and the end of the first inner heat-conducting part away from the second inner heat-conducting part is connected to the end of the first outer heat-conducting part away from the second outer heat-conducting part.

[0018] The second inner heat-conducting part and the second outer heat-conducting part are arranged opposite to each other, and the end of the second inner heat-conducting part away from the first inner heat-conducting part is connected to the end of the second outer heat-conducting part away from the first outer heat-conducting part.

[0019] In some embodiments that may include the above embodiments, a first cavity is formed between the first inner heat-conducting portion and the first outer heat-conducting portion; a second cavity is formed between the second inner heat-conducting portion and the second outer heat-conducting portion, the second cavity is connected to the first cavity and constitutes an inner cavity; the thickness of the first cavity is equal to the thickness of the second cavity.

[0020] In some embodiments that may include the above embodiments, the thermally conductive ring layer is a graphene layer.

[0021] In some embodiments that may include the above embodiments, the heat insulation layer is an aerogel layer.

[0022] In some embodiments that may include the above embodiments, the heat-reflective layer is an aluminum layer.

[0023] In some embodiments that may include the above embodiments, a copper layer is disposed between the aluminum layer and the heat-conducting ring layer, and the aluminum layer is sprayed on the side of the copper layer away from the heat-conducting ring layer.

[0024] In some embodiments that may include the above-described embodiments, the thermally conductive ring layer is bonded to the side of the housing facing the accommodating cavity.

[0025] In some embodiments that may include the above embodiments, the smart glasses also include a circuit board, the heating element is a chip, the chip is disposed on the side of the circuit board facing the heat-conducting ring layer, and the chip is electrically connected to the circuit board.

[0026] The smart glasses provided in this application embodiment have a heat dissipation structure between the heating element and the housing. The heat reflection layer in the heat dissipation structure reflects most of the heat from the heating element back to the heating element, while a small portion of the heat from the heating element is transferred to the surface of the housing through the heat-conducting ring layer of the heat dissipation structure. This reduces the surface temperature of the housing, improves the comfort of wearing the glasses, and enhances the user experience. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of the housing, heating element, heat dissipation structure and circuit board in the smart glasses provided in the embodiments of this application;

[0029] Figure 2 A schematic diagram of the heating element, heat dissipation structure, and circuit board in the smart glasses provided in this application embodiment;

[0030] Figure 3 for Figure 1 A magnified view of a portion of point P in the middle;

[0031] Figure 4 for Figure 2 A partial diagram of the exploded structure;

[0032] Figure 5 for Figure 4 A structural diagram from another perspective;

[0033] Figure 6 This is a schematic diagram of the structure of the heat-conducting ring layer in the smart glasses provided in the embodiments of this application;

[0034] Figure 7 This is a schematic diagram of the heat insulation layer in the smart glasses provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10 - Shell; 101 - Receiving cavity; 110 - First shell wall; 120 - Second shell wall;

[0037] 20 - Heating element;

[0038] 30-Heat dissipation structure;

[0039] 310 - Thermally conductive ring layer; 311 - Inner cavity; 3111 - First cavity; 3112 - Second cavity; 312 - Outer ring; 3121 - First outer thermally conductive portion; 3122 - Second outer thermally conductive portion; 313 - Inner ring; 3131 - First inner thermally conductive portion; 3132 - Second inner thermally conductive portion;

[0040] 320 - Insulation layer;

[0041] 330 - Heat-reflective layer;

[0042] 340 - Copper layer;

[0043] 350 - Adhesive layer;

[0044] 40 - Circuit board. Detailed Implementation

[0045] First, those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0046] Secondly, it should be noted that in the description of the embodiments of this application, the terms "inner" and "outer" and other terms indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and is not intended to indicate or imply that the described device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0047] Furthermore, it should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] As stated in the background section, smart glasses in the relevant technology suffer from a high surface temperature of the casing during use. The applicant's research has revealed that this problem arises because, in order to dissipate heat from the chip and prevent performance degradation due to overheating, the smart glasses typically transfer the heat generated by the chip to the casing, where it exchanges heat with the air to dissipate the chip's heat and lower its temperature. However, since the casing is located on the outermost part of the smart glasses and is in closest contact with the skin when worn, excessively high casing temperatures significantly reduce wearer comfort and diminish the user experience.

[0050] To address the aforementioned technical problems, this application provides a smart glasses solution. By setting a heat dissipation structure between a heating element (which may be a chip) and a housing, the heat dissipation structure reflects most of the heat from the heating element back to the heating element, while a small portion of the heat from the heating element is transferred to the surface of the housing through the heat dissipation structure. This reduces the surface temperature of the housing, improves wearing comfort, and enhances the user experience.

[0051] The principles and features of the embodiments of this application are described below with reference to the accompanying drawings. The examples given are only used to explain the embodiments of this application and are not intended to limit the scope of the embodiments of this application.

[0052] refer to Figure 1 This embodiment provides a smart glasses, which may include a housing 10, a heating element 20, and a heat dissipation structure 30.

[0053] The housing 10 can be a frame or a temple (see reference). Figure 1 (or other external structures of the smart glasses.) (See reference) Figure 1 The interior of the housing 10 may be configured to form a receiving cavity 101.

[0054] The housing 10 may have an inner wall and an outer wall. The inner wall is the side of the housing 10 facing the receiving cavity 101. The outer wall is the side of the housing 10 away from the receiving cavity 101, that is, the side of the housing 10 facing the user.

[0055] refer to Figure 1 The heating element 20 and the heat dissipation structure 30 can be respectively disposed in the accommodating cavity 101. The heat dissipation structure 30 can be separated between the heating element 20 and the housing 10. Part of the heat generated by the heating element 20 can be transferred to the housing 10 through the heat dissipation structure 30. The heat of the heating element 20 can be transferred to the air through heat exchange between the housing 10 and the air outside the housing 10, so as to reduce the temperature of the heating element 20.

[0056] The heating element 20 can be a chip or other device that generates heat during the use of smart glasses.

[0057] The heat dissipation structure 30 is disposed on the side of the housing 10 facing the accommodating cavity 101 (that is, the inner wall of the housing) to fix the heat dissipation structure 30 to the housing 10.

[0058] refer to Figure 2 and Figure 3 The heat dissipation structure 30 may include a heat-conducting ring layer 310, a heat insulation layer 320, and a heat-reflecting layer 330.

[0059] refer to Figure 3 The heat-conducting ring layer 310 can be annular, and an inner cavity 311 is formed inside the annular heat-conducting ring layer 310.

[0060] The heat-conducting ring layer 310 is ring-shaped, which allows the heat transferred to the heat-conducting ring layer 310 to be quickly transferred to the entire heat-conducting ring layer 310, reducing the temperature difference at different locations of the heat-conducting ring layer 310 and improving the heat transfer rate of the heat-conducting ring layer 310.

[0061] One side of the heat-conducting ring layer 310 is connected to the side of the housing 10 facing the accommodating cavity 101, and the other side of the heat-conducting ring layer 310 faces the heating element 20.

[0062] In some possible implementations of the embodiments of this application, reference is made to Figure 2 and Figure 3 The heat-conducting ring layer 310 and the housing 10 can be connected by an adhesive layer 350. The adhesive layer 350 can be double-sided tape or other types of adhesive. The heat-conducting ring layer 310 is bonded to the side of the housing 10 facing the accommodating cavity 101. The adhesive connection method is easy to operate and simplifies the connection structure between the heat-conducting ring layer 310 and the housing 10, thereby improving the assembly efficiency of the heat dissipation structure 30 and the housing 10.

[0063] In some other possible implementations of the embodiments of this application, the side of the housing 10 facing the accommodating cavity 101 may be provided with a mounting groove, and the heat dissipation structure 30 may be snapped into the mounting groove to set the heat dissipation structure 30 on the housing 10.

[0064] refer to Figure 2 and Figure 3 The heat insulation layer 320 is disposed in the inner cavity 311 of the heat-conducting ring layer 310.

[0065] refer to Figure 2 and Figure 3 The heat reflective layer 330 is disposed on the side of the heat-conducting ring layer 310 facing the heat-generating element 20.

[0066] During use, the heating element 20 generates heat. The heat generated by the heating element 20 diffuses outward within the accommodating cavity 101.

[0067] The heat reflective layer 330 has heat reflectivity. After receiving heat radiation from the heating element 20, the heat reflective layer 330 can reflect part of the heat radiation back to the heating element 20 to reduce the heat transfer caused by heat radiation, thereby reducing the heat transferred from the heating element 20 to the heat reflective layer 330.

[0068] In some possible implementations of this application, the heat-reflective layer 330 can be an aluminum layer with a heat reflectivity of 90% to 95%, exhibiting high heat reflectivity. As a metal, aluminum has a large number of free electrons in its outer atomic shell. When heat from the heating element 20 is transferred to the surface of the aluminum layer, these free electrons interact strongly with electromagnetic waves (the main carrier of heat radiation), reflecting most of the electromagnetic wave energy back. In other words, most of the heat from the heating element 20 is reflected back to the heating element 20, with only a small portion of the heat being transferred to the heat-reflective layer 330.

[0069] In addition, the aluminum layer is low in cost and easy to process. The aluminum layer also has good ductility, which improves the ductility of the heat dissipation structure 30, allowing the heat dissipation structure 30 to be bent and deformed appropriately according to the installation space, thereby facilitating the arrangement of the heat dissipation structure 30 within the accommodating cavity 101.

[0070] In some other possible implementations of the embodiments of this application, the heat reflective layer 330 can be a nickel layer or a chromium layer, etc. The heat reflectivity of the nickel layer and the chromium layer is 75%~85%, which has good heat reflectivity and can reflect most of the heat from the heating element 20 back to the heating element 20, with only a small portion of the heat being transferred to the heat reflective layer 330.

[0071] The thermally conductive ring layer 310 has thermal conductivity. When a temperature gradient exists in the thermally conductive ring layer 310 (i.e., there is a temperature difference between different parts), heat will spontaneously transfer from the high-temperature region to the low-temperature region. The stronger the thermal conductivity of the thermally conductive ring layer 310, the more heat is transferred per unit time, and the faster the temperature reaches equilibrium.

[0072] In some possible implementations of the embodiments of this application, the thermally conductive ring layer 310 can be a graphene layer. Graphene has a high thermal conductivity, and therefore a high heat transfer efficiency.

[0073] In some other possible implementations of the embodiments of this application, the thermally conductive ring layer 310 can be diamond or other structural layers with high thermal conductivity.

[0074] A small portion of the heat transferred from the heating element 20 to the heat reflective layer 330 is first transferred along the heat reflective layer 330 to the side of the heat-conducting ring layer 310 facing the heating element 20, and then continues along the heat-conducting ring layer 310 to the side of the heat-conducting ring layer 310 away from the heating element 20, and from the side of the heat-conducting ring layer 310 away from the heating element 20 to the housing 10. Since the heat reflective layer 330 absorbs only a small portion of the heat from the heating element 20, less heat is transferred to the housing 10 through the heat-conducting ring layer 310, thereby reducing the temperature of the housing 10.

[0075] In the implementation where the heat-reflective layer 330 is an aluminum layer and the heat-conducting ring layer 310 is a graphene layer, the heat dissipation structure 30 may further include a copper layer 340, which is disposed between the aluminum layer and the graphene layer and can be bonded to the graphene layer. The aluminum layer can be sputtered onto the side of the copper layer 340 away from the heat-conducting ring layer 310.

[0076] Since aluminum does not easily adhere to the surface of the graphene layer, aluminum is sprayed onto the copper layer 340 to form an aluminum layer on the side of the copper layer 340 away from the graphene layer. This improves the adhesion of the aluminum layer and avoids a decrease in the reflectivity of the aluminum layer due to poor adhesion.

[0077] In addition, the copper layer 340 has a high thermal conductivity (approximately 386 W / (m·K)), which allows the copper layer 340 to transfer heat quickly, improving the thermal conductivity compared to the aluminum layer and thus increasing the efficiency of heat transfer.

[0078] The insulation layer 320 has heat insulation properties, meaning that the insulation layer 320 has a certain ability to prevent heat transfer.

[0079] In some possible implementations of the embodiments of this application, the thermal insulation layer 320 can be an aerogel layer, which can fill the inner cavity 311. Aerogel has a low thermal conductivity, typically as low as 0.01 W / (m·K), while its thermal resistance is high, typically as high as 0.02 k / W, thus exhibiting good thermal insulation performance.

[0080] In some other possible implementations of the embodiments of this application, the heat insulation layer 320 can be a foamed polyurethane layer, which can be filled in the inner cavity 311. The thermal conductivity of the foamed polyurethane is usually 0.024 W / (m·K), and it has good heat insulation performance.

[0081] The heat insulation layer 320 can reduce the heat transfer rate of the heat-conducting ring layer 310 along the direction from the side facing the heat-generating element 20 to the side away from the heat-generating element 20. In other words, it reduces the heat transfer of the heat-conducting ring layer 310 along the direction perpendicular to the surface layer, so that the heat of the heat-conducting ring layer 310 is transferred as much as possible along the surface layer direction of the heat-conducting ring layer 310. This allows the heat on the side facing the heat-generating element 20 to be quickly transferred to the side away from the heat-generating element 20, and thus the heat transferred to the heat-conducting ring layer 310 can be quickly transferred to the housing 10. This increases the rate at which heat is transferred from the heat reflection layer 330 to the housing 10, and improves the heat dissipation efficiency of the heat reflection layer 330.

[0082] In some possible implementations of the embodiments of this application, reference is made to Figure 3 The housing 10 includes a first housing wall 110 and a second housing wall 120 connected to each other, with the second housing wall 120 being inclined relative to the first housing wall 110.

[0083] The first shell wall 110 and the second shell wall 120 can be flat or other irregular shapes.

[0084] The second shell wall 120 is inclined relative to the first shell wall 110, meaning that the second shell wall 120 is bent at a certain angle relative to the first shell wall 110, such as 90° (e.g.). Figure 3 (As shown), it can also be bent at other angles, such as 30° or 60°.

[0085] refer to Figure 3 The heat-conducting ring layer 310 may include an outer ring portion 312 and an inner ring portion 313 connected to each other. The inner ring portion 313 faces the heating element 20. The outer ring portion 312 faces away from the heating element 20, or in other words, the outer ring portion 312 faces the first shell wall 110 and the second shell wall 120.

[0086] refer to Figure 3 , Figure 4 and Figure 5 The outer ring portion 312 may include a first external heat-conducting portion 3121 and a second external heat-conducting portion 3122 connected to each other. The second external heat-conducting portion 3122 is inclined relative to the first external heat-conducting portion 3121. The degree of inclination (bending angle) of the second external heat-conducting portion 3122 relative to the first external heat-conducting portion 3121 may be substantially consistent with the degree of inclination (bending angle) of the second shell wall 120 relative to the first shell wall 110. The first external heat-conducting portion 3121 is connected to the side of the first shell wall 110 facing the receiving cavity 101, and the second external heat-conducting portion 3122 is connected to the side of the second shell wall 120 facing the receiving cavity 101.

[0087] A small portion of the heat emitted by the heating element 20 is transferred to the heat-conducting ring layer 310 via the heat-reflecting layer 330. First, it is transferred to the inner ring portion 313, and then to the first outer heat-conducting portion 3121 and the second outer heat-conducting portion 3122. The heat transferred to the first outer heat-conducting portion 3121 continues to be transferred to the first shell wall 110, and is transferred to the air through heat exchange between the first shell wall 110 and the air outside the shell 10. The heat transferred to the second outer heat-conducting portion 3122 continues to be transferred to the second shell wall 120, and is transferred to the air through heat exchange between the second shell wall 120 and the air outside the shell 10.

[0088] The first external heat-conducting portion 3121 and the second external heat-conducting portion 3122 disperse the heat transferred to the heat-conducting ring layer 310 to the first shell wall 110 and the second shell wall 120, respectively, and transfer it to the air through the first shell wall 110 and the second shell wall 120. Compared with the heat-conducting ring layer 310 being connected to only one shell wall (the first shell wall 110 or the second shell wall 120), the heat concentrated on one shell wall is reduced, thereby lowering the temperature of the portion of the shell 10 connected to the heat-conducting ring layer 310, improving wearing comfort, and thus enhancing the user experience.

[0089] In some possible implementations of the embodiments of this application, reference is made to Figure 3 , Figure 4 and Figure 5 The inner ring portion 313 may include a first inner heat-conducting portion 3131 and a second inner heat-conducting portion 3132 connected to each other, with the second inner heat-conducting portion 3132 being inclined relative to the first inner heat-conducting portion 3131.

[0090] The degree of inclination (bending angle) of the second inner heat-conducting part 3132 relative to the first inner heat-conducting part 3131 can be basically consistent with the degree of inclination (bending angle) of the second outer heat-conducting part 3122 relative to the first outer heat-conducting part 3121.

[0091] refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 The first inner heat-conducting portion 3131 and the first outer heat-conducting portion 3121 are arranged opposite to each other, and the end of the first inner heat-conducting portion 3131 that is away from the second inner heat-conducting portion 3132 is connected to the end of the first outer heat-conducting portion 3121 that is away from the second outer heat-conducting portion 3122.

[0092] refer to Figure 3 , Figure 4 , Figure 5 and Figure 6The second inner heat-conducting portion 3132 is disposed opposite to the second outer heat-conducting portion 3122, and one end of the second inner heat-conducting portion 3132 away from the first inner heat-conducting portion 3131 is connected to one end of the second outer heat-conducting portion 3122 away from the first outer heat-conducting portion 3121.

[0093] The heating element 20 may be oriented toward at least one of the first inner heat-conducting portion 3131 and the second inner heat-conducting portion 3132. For example, the heating element 20 may be oriented toward the first inner heat-conducting portion 3131, or the heating element 20 may be oriented toward the second inner heat-conducting portion 3132 (e.g., Figure 3 Alternatively, part of the heating element 20 faces the first internal heat-conducting part 3131, and another part faces the second internal heat-conducting part 3132.

[0094] The second inner heat-conducting portion 3132 is inclined relative to the first inner heat-conducting portion 3131, which can reduce the volume of the heat-conducting ring layer 310, thereby reducing the space occupied by the heat-conducting ring layer 310.

[0095] In some possible implementations of the embodiments of this application, reference is made to Figure 6 A first cavity 3111 is formed between the first inner heat-conducting portion 3131 and the first outer heat-conducting portion 3121. A second cavity 3112 is formed between the second inner heat-conducting portion 3132 and the second outer heat-conducting portion 3122. The second cavity 3112 communicates with the first cavity 3111 and forms the inner cavity 311 of the heat-conducting ring layer 310. The thickness of the first cavity 3111 is equal to the thickness of the second cavity 3112, so that the spacing between the inner ring portion 313 and the outer ring portion 312 along the thickness direction from the first outer heat-conducting portion 3121 to the second outer heat-conducting portion 3122 is basically the same, so that the thickness of the heat insulation layer 320 is basically the same, that is, the heat insulation layer 320 is a layer structure of approximately equal thickness (see reference). Figure 7 This ensures that the heat insulation effect of the heat insulation layer 320 is basically consistent along its extension direction, improves the temperature uniformity of each position of the heat-conducting ring layer 310, reduces the temperature difference between the first outer heat-conducting part 3121 and the second outer heat-conducting part 3122, and further reduces the temperature difference between the first shell wall 110 and the second shell wall 120, thus improving the comfort when wearing it.

[0096] It should be noted that the thickness of the first cavity 3111 refers to the dimension along the direction from the first inner heat-conducting portion 3131 to the first outer heat-conducting portion 3121. The thickness of the second cavity 3112 refers to the dimension along the direction from the second inner heat-conducting portion 3132 to the second outer heat-conducting portion 3122.

[0097] In some possible implementations of the embodiments of this application, reference is made to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The smart glasses may also include a circuit board 40, and the heating element 20 may be a chip. The chip is located on the side of the circuit board 40 facing the heat-conducting ring layer 310, and the chip is electrically connected to the circuit board 40.

[0098] The circuit board 40 may include a printed circuit board and electronic components fixed on the printed circuit board. The chip is electrically connected to the circuit board 40 so that the chip performs its function through the circuits on the circuit board 40.

[0099] The heat generated by the chip is transferred outward through the side of the chip away from the circuit motherboard 40. The side of the chip away from the circuit motherboard 40 faces the heat-conducting ring layer 310 or the heat-reflecting layer 330 to facilitate the outward transfer of heat from the chip.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A type of smart glasses, characterized in that, include: The housing (10) has an internal cavity (101). A heating element (20) is disposed within the accommodating cavity (101); A heat dissipation structure (30) is disposed on the side of the housing (10) facing the accommodating cavity (101) and located between the heat-generating element (20) and the housing (10); the heat dissipation structure (30) includes a heat-conducting ring layer (310), a heat insulation layer (320) and a heat-reflecting layer (330). One side of the heat-conducting ring layer (310) is connected to the side of the housing (10) facing the accommodating cavity (101), and the other side of the heat-conducting ring layer (310) faces the heating element (20); the heat-conducting ring layer (310) has an inner cavity (311). The heat insulation layer (320) is disposed within the inner cavity (311); The heat reflective layer (330) is disposed on the side of the heat-conducting ring layer (310) facing the heat-generating element (20).

2. The smart glasses according to claim 1, characterized in that, The housing (10) includes a first shell wall (110) and a second shell wall (120) connected to each other, the second shell wall (120) being inclined relative to the first shell wall (110); The heat-conducting ring layer (310) includes an outer ring portion (312) and an inner ring portion (313) connected to each other; the inner ring portion (313) faces the heating element (20). The outer ring portion (312) includes a first external heat-conducting portion (3121) and a second external heat-conducting portion (3122) connected to each other. The second external heat-conducting portion (3122) is inclined relative to the first external heat-conducting portion (3121). The first external heat-conducting portion (3121) is connected to the side of the first shell wall (110) facing the receiving cavity (101), and the second external heat-conducting portion (3122) is connected to the side of the second shell wall (120) facing the receiving cavity (101).

3. The smart glasses according to claim 2, characterized in that, The inner ring portion (313) includes a first inner heat-conducting portion (3131) and a second inner heat-conducting portion (3132) connected to each other, wherein the second inner heat-conducting portion (3132) is inclined relative to the first inner heat-conducting portion (3131); The first internal heat-conducting portion (3131) is disposed opposite to the first external heat-conducting portion (3121), and one end of the first internal heat-conducting portion (3131) away from the second internal heat-conducting portion (3132) is connected to one end of the first external heat-conducting portion (3121) away from the second external heat-conducting portion (3122). The second inner heat-conducting portion (3132) is disposed opposite to the second outer heat-conducting portion (3122), and one end of the second inner heat-conducting portion (3132) away from the first inner heat-conducting portion (3131) is connected to one end of the second outer heat-conducting portion (3122) away from the first outer heat-conducting portion (3121).

4. The smart glasses according to claim 3, characterized in that, A first cavity (3111) is formed between the first inner heat-conducting portion (3131) and the first outer heat-conducting portion (3121); a second cavity (3112) is formed between the second inner heat-conducting portion (3132) and the second outer heat-conducting portion (3122), the second cavity (3112) is connected to the first cavity (3111) and constitutes the inner cavity (311); the thickness of the first cavity (3111) is equal to the thickness of the second cavity (3112).

5. The smart glasses according to any one of claims 1-4, characterized in that, The thermally conductive ring layer (310) is a graphene layer.

6. The smart glasses according to any one of claims 1-4, characterized in that, The heat insulation layer (320) is an aerogel layer.

7. The smart glasses according to any one of claims 1-4, characterized in that, The heat reflective layer (330) is an aluminum layer.

8. The smart glasses according to claim 7, characterized in that, A copper layer (340) is disposed between the aluminum layer and the heat-conducting ring layer (310), and the aluminum layer is sprayed on the side of the copper layer (340) away from the heat-conducting ring layer (310).

9. The smart glasses according to any one of claims 1-4, characterized in that, The thermally conductive ring layer (310) is bonded to the side of the housing (10) facing the accommodating cavity (101).

10. The smart glasses according to any one of claims 1-4, characterized in that, The smart glasses also include a circuit board (40), the heating element (20) is a chip, the chip is disposed on the side of the circuit board (40) facing the heat conduction ring layer (310), and the chip is electrically connected to the circuit board (40).

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