Display device

Abstract

The present application relates to the technical field of display, in particular to a display device. The display device of the present application comprises a display panel, a back plate, a circuit board, a reflection layer, a plurality of light emitting units, a glue layer and a plurality of reflection structures. The reflection structures are configured to reflect at least part of the light emitted by the corresponding light emitting units to the reflection layer, so that the reflection layer reflects at least part of the light to the glue layer again and mixes with other light emitted by the light emitting units. In one aspect, the reflection structures can reflect at least part of the light emitted by the corresponding light emitting units to the reflection layer, so that the reflection layer reflects at least part of the light to the glue layer again and mixes with other light emitted by the light emitting units, thereby improving the light mixing effect of the light emitting units. On the other hand, the reflection structures are arranged on the glue layer, without the need for additional light mixing structures such as diffusion plates, reflective lenses, etc., which helps to reduce the thickness and cost of the display device, and meets the design requirements of product thinness and low cost.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Mini LED (Mini Light Emitting Diode) backlight modules are gaining increasing attention due to their advantages such as high brightness, high contrast, low power consumption, and high reliability. Mini LED backlight modules typically employ a direct-lit backlight architecture. To achieve uniform light mixing across the entire backlight module, diffusers or reflective lenses are generally used. However, this design increases the thickness and cost of the Mini LED backlight module, hindering the pursuit of thinner and lower-cost display devices. Utility Model Content

[0003] This application discloses a display device that can achieve uniform light mixing of the backlight module while meeting the requirements of thinness and low cost.

[0004] To achieve the above objectives, embodiments of this application disclose a display device, including:

[0005] Display panel;

[0006] A backplate, wherein the backplate is disposed on the backlight side of the display panel;

[0007] A circuit board, the circuit board being disposed on the back plate;

[0008] A reflective layer is disposed on the circuit board;

[0009] Multiple light-emitting units are spaced apart on the circuit board along a first direction and electrically connected to the circuit board;

[0010] An adhesive layer is coated on the reflective layer and the plurality of light-emitting units;

[0011] Multiple reflective structures are disposed on the adhesive layer, and the multiple reflective structures are respectively disposed corresponding to multiple light-emitting units. The projection of the reflective structure on the reflective layer is at least partially located outside the projection range of the corresponding light-emitting unit on the reflective layer. The reflective structure is configured to reflect at least a portion of the light emitted by the corresponding light-emitting unit to the reflective layer, so that the reflective layer reflects the at least a portion of the light back to the adhesive layer to mix with other light.

[0012] Wherein, the first direction is the height direction or the width direction of the display panel.

[0013] On the one hand, by setting a reflective layer on the circuit board and coating both the reflective layer and the light-emitting unit with an adhesive layer, and setting multiple reflective structures on the side of the adhesive layer corresponding to the light-emitting unit, the projection of the reflective structure onto the reflective layer is at least partially outside the projection range of the corresponding light-emitting unit onto the reflective layer. This allows the reflective structure to reflect at least a portion of the light emitted from the corresponding light-emitting unit to the reflective layer, so that the reflective layer reflects at least a portion of the light back to the adhesive layer and mixes it with other light emitted from the light-emitting unit, thereby improving the light mixing effect of the light-emitting unit and making the display device display more uniform. On the other hand, setting the reflective structure on the adhesive layer eliminates the need for additional light mixing structures such as diffusers and reflective lenses, which helps to reduce the thickness and cost of the display device, thus enabling the design requirements of thinner and lighter products and lower costs.

[0014] In some embodiments of this application, the light-emitting unit includes a first chip, a second chip, and a third chip arranged sequentially along the first direction, wherein at least two of the first chip, the second chip, and the third chip emit light of different wavelengths;

[0015] The reflective structure includes:

[0016] A first microstructure, at least partially corresponding to the first chip, is configured to reflect at least a portion of the light emitted from the first chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer;

[0017] The second microstructure is disposed corresponding to the second chip and is configured to reflect at least a portion of the light emitted from the second chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer;

[0018] A third microstructure, at least partially corresponding to the third chip, is configured to reflect at least a portion of the light emitted from the third chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer;

[0019] The projection of the first microstructure onto the reflective layer is at least partially located outside the projection range of the first chip onto the reflective layer; and / or,

[0020] The projection of the second microstructure onto the reflective layer lies within the projection range of the second chip onto the reflective layer; and / or,

[0021] The projection of the third microstructure onto the reflective layer is at least partially outside the projection range of the third chip onto the reflective layer.

[0022] It is understandable that by using a first microstructure to reflect at least a portion of the light from the first chip, a second microstructure to reflect at least a portion of the light from the second chip, and a third microstructure to reflect at least a portion of the light from the third chip, the light emitted from each chip can be more evenly distributed on the display panel after multiple reflections and mixing by the reflective layer and the adhesive layer. This significantly improves the color uniformity and overall display effect of the display device. This design, which sets corresponding reflective microstructures for each chip, not only optimizes the light propagation path but also effectively reduces problems such as bright spots, polarization, or dark areas that may be caused by direct light emission.

[0023] In addition, the projection of the first microstructure on the reflective layer is at least partially outside the projection range of the first chip on the reflective layer. This arrangement can ensure that the first microstructure effectively reflects at least part of the light emitted from the first chip to the reflective layer, avoiding the light from being directly refracted out of the adhesive layer without being fully mixed with other light in the adhesive layer, thereby reducing the possibility of a reddish area appearing in the backlight module.

[0024] The projection of the second microstructure onto the reflective layer is at least partially outside the projection range of the second chip onto the reflective layer. This arrangement ensures that the second microstructure effectively reflects at least part of the light emitted from the second chip to the reflective layer, preventing the light from being directly refracted out of the adhesive layer without being fully mixed with other light within the adhesive layer, thereby reducing the possibility of a greenish area appearing in the backlight module.

[0025] The projection of the third microstructure onto the reflective layer is at least partially outside the projection range of the third chip onto the reflective layer. This arrangement ensures that the third microstructure effectively reflects at least part of the light emitted from the third chip to the reflective layer, preventing the light from being directly refracted out of the adhesive layer without being fully mixed with other light within the adhesive layer, thereby reducing the possibility of a bluish area appearing in the backlight module.

[0026] In some embodiments of this application, the first microstructure, the second microstructure, and the third microstructure all extend along the first direction;

[0027] The line connecting the end point of the first microstructure away from the second microstructure and the emission center of the first chip forms a first included angle α1 with the emission surface of the first chip;

[0028] The line connecting the end point of the first microstructure near the second microstructure and the emission center of the first chip forms a second included angle α2 with the emission surface of the first chip;

[0029] The line connecting the end point of the second microstructure near the first microstructure and the emission center of the second chip forms a third included angle α3 with the emission surface of the second chip;

[0030] The line connecting the end point of the second microstructure near the third microstructure and the emission center of the second chip forms a fourth included angle α4 with the emission surface of the second chip;

[0031] The line connecting the end point of the third microstructure near the second microstructure and the emission center of the third chip forms a fifth included angle α5 with the emission surface of the second chip;

[0032] The line connecting the endpoint of the third microstructure away from the second microstructure and the emission center of the third chip forms a sixth included angle α6 with the emission surface of the third chip.

[0033] The first included angle is equal to the sixth included angle, the second included angle is equal to the fifth included angle, and the third included angle is equal to the fourth included angle;

[0034] Wherein, the second included angle is greater than the first included angle, and the second included angle is greater than or equal to the third included angle.

[0035] By rationally setting the relationship between the first to sixth included angles, the reflection effect of the reflective structure on the light emitted from each chip can be optimized. Specifically, when the second included angle is greater than the first included angle, it ensures that the first microstructure more effectively reflects the edge light emitted from the first chip to the reflective layer, preventing light from directly escaping from the adhesive layer and causing insufficient light mixing. Simultaneously, the design where the second included angle is greater than or equal to the third included angle ensures that the second microstructure, when reflecting the light from the second chip, can both mix with the light from the first chip and ensure its own light is fully reflected to the reflective layer. This angle setting helps reduce color shift issues in the backlight module, improving the uniformity and color reproduction of the overall display. Furthermore, the symmetrical design where the first and sixth included angles are equal, the second and fifth included angles are equal, and the third and fourth included angles are equal simplifies the manufacturing process of the reflective structure, reduces production costs, and maintains consistent light reflection.

[0036] In some embodiments of this application, the first included angle α1 satisfies: α1≥90°-arcsin(n1 / n2);

[0037] The second included angle α2 satisfies: 75°≤α2≤102°;

[0038] The third included angle α3 satisfies: 75°≤α3≤82°;

[0039] Where n1 is the refractive index of air and n2 is the refractive index of the adhesive layer.

[0040] When the first included angle α1 satisfies the above relationship, the reflection direction of the first microstructure on the edge light of the first chip can be reasonably controlled, ensuring that most of the light can enter the interior of the adhesive layer for sufficient light mixing, rather than being directly refracted out of the adhesive layer, causing energy loss and uneven light mixing. When the first included angle is less than this critical value, some edge light may directly pass through the adhesive layer due to excessive refraction angle, resulting in brightness attenuation or color deviation in the edge area of ​​the backlight module.

[0041] When the second included angle α2 < 75°, the reflection effect of the first microstructure on the edge light of the first chip is enhanced. Most of the light is reflected by the first microstructure into the adhesive layer for mixing, while the amount of light directly refracted or scattered decreases. This leads to a decrease in brightness in the edge area of ​​the backlight module, resulting in dark areas and affecting the uniformity of the overall display. When the second included angle α2 > 102°, the light emitted from the first chip cannot be reflected back to the adhesive layer by the first microstructure for mixing. Instead, it is directly refracted or scattered, which not only fails to improve the mixing effect but may also cause bright spots or color shifts in the backlight module, reducing display quality. Therefore, controlling the second included angle α2 within the range of 75° to 102° ensures that the first microstructure reflects the light emitted from the first chip at an appropriate angle, allowing the light to be fully mixed within the adhesive layer before being emitted uniformly. This effectively improves the light utilization rate and display uniformity of the backlight module, meeting the display device's demand for high-quality images.

[0042] When the third included angle α3 is within this range, the second microstructure can reflect the light emitted from the second chip at a suitable angle, ensuring that the light is fully mixed with other light within the adhesive layer, and avoiding energy loss and uneven light mixing caused by the light directly escaping from the adhesive layer or being reflected back to the vicinity of the chip due to an improper reflection angle.

[0043] When the third included angle α3 < 75°, the reflection of light from the edge of the second chip by the second microstructure may be too concentrated, causing some light to fail to diffuse sufficiently to other areas of the adhesive layer, resulting in a decrease in light mixing effect and potential localized brightness unevenness or color deviation in the backlight module. When the third included angle α3 > 82°, the light emitted from the second chip may not be able to effectively enter the adhesive layer for light mixing due to the excessively large reflection angle, and instead be directly refracted or scattered, which will also reduce the light efficiency and display uniformity of the backlight module.

[0044] In some embodiments of this application, the adhesive layer includes a first surface, which is configured as a side surface of the adhesive layer opposite to the reflective layer;

[0045] The first microstructure, the second microstructure, and the third microstructure are all composed of a plurality of microstructure grooves, which are spaced apart along the first direction. Each microstructure groove includes a reflective surface and a connecting surface. The reflective surface is connected to the connecting surface and the first surface, and the opening of the microstructure groove is oriented towards the side away from the reflective layer. The reflective surface is configured to reflect at least a portion of the light emitted by the light-emitting unit to the reflective layer, so that the reflective layer reflects the at least a portion of the light again to the adhesive layer and mixes it with other light emitted by the light-emitting unit.

[0046] In the first microstructure, at least two of the multiple microstructure grooves have different inclination angles for their reflective surfaces; and / or,

[0047] In the second microstructure, at least two of the microstructure grooves have different inclination angles for their reflective surfaces; and / or,

[0048] In the third microstructure, at least two of the reflective surfaces in the plurality of microstructure grooves have different tilt angles.

[0049] Since the emission angles of any single emitted light beam from the first, second, and third chips are different, setting multiple microstructure slots corresponding to multiple emitted light beams ensures that each emitted light beam can be effectively reflected by the corresponding microstructure slot. Specifically, when the light emitted from the first chip strikes the adhesive layer at a specific angle, the corresponding microstructure slot's reflective surface can reflect it to the reflective layer at the optimal angle. The reflective layer then reflects the light back to the adhesive layer to mix with other light beams. Similarly, the light emitted from the second and third chips can also achieve a similar effective reflection and mixing process through their respective corresponding microstructure slots. This method of arranging multiple microstructure slots at intervals along the first direction can precisely match the angle and position of the light emitted from different chips, ensuring that light from all directions and angles is fully reflected and mixed, thereby further improving the light efficiency and color uniformity of the display device and reducing display defects caused by insufficient light reflection.

[0050] In some embodiments of this application, a seventh included angle α7 is formed between the reflective surface and the first surface, and the seventh included angle α7 satisfies: α7 > arcsin(n1 / n2) - β; or,

[0051] The reflective surface and the first surface form a seventh included angle α7, which satisfies: 5°≤α7≤49°;

[0052] Wherein, n1 is the refractive index of air, n2 is the refractive index of the adhesive layer, and β is the emission angle of the light emitted by the light-emitting unit.

[0053] When the seventh included angle α7 satisfies the above relationship, the tilt angle of the reflective surface can be precisely adjusted according to the actual emission angle of the light emitted from the light-emitting unit, ensuring that the reflective surface reflects the light to the reflective layer at the optimal angle. In this way, the light can be more fully mixed with other light after entering the adhesive layer, avoiding the light from directly escaping from the adhesive layer or being reflected back to the vicinity of the chip due to improper reflection angle, thereby effectively improving the light mixing effect.

[0054] When the seventh angle α7 < 5°, the tilt angle of the reflective surface is too small. For light with a large exit angle, it may not be effectively reflected to the reflective layer, causing some light to escape directly from the adhesive layer, reducing the light mixing effect and resulting in uneven brightness or color deviation in the backlight module. When the seventh angle α7 > 49°, the tilt angle of the reflective surface is too large, and the direction of light reflection may be unreasonable, making it impossible for the light to achieve good light mixing within the adhesive layer. This will also affect the light efficiency and color uniformity of the display device.

[0055] It can be seen that by controlling the seventh angle α7 within the range of 5° to 49°, the reflective surface can reflect the light emitted by the light-emitting unit to the reflective layer at a suitable tilt angle, so that the light can be fully mixed with other light in the adhesive layer, thereby improving the light mixing effect in the adhesive layer and thus improving the light efficiency and color uniformity of the display device.

[0056] In some embodiments of this application, the center distance between any two adjacent microstructure grooves is not equal along the first direction.

[0057] This design, with unequal center distances between adjacent microstructure slots, further optimizes the reflection and mixing of light within the adhesive layer. Since the distribution and angle of light emitted from different chips vary within the adhesive layer, if the center distances between microstructure slots were perfectly equal, some light might not be effectively reflected, or the reflected light might not mix sufficiently, or moiré patterns might appear in the backlight module. By setting unequal center distances, the distribution of the microstructure slots can be flexibly adjusted according to the characteristics of the light emitted from different chips, ensuring that each ray of light is reflected by the corresponding microstructure slot within a suitable distance range.

[0058] In some embodiments of this application, along the first direction, the center distance between every two adjacent microstructure grooves is W, satisfying: 70um≤D≤80um.

[0059] When the center distance W < 70µm, the microstructure grooves are too densely distributed, which may cause interference between adjacent microstructure grooves, affecting the light reflection effect. This prevents some light from being properly reflected to the reflective layer, thus reducing the light mixing effect and causing uneven brightness or color deviation in the backlight module. When the center distance W > 80µm, the microstructure grooves are too sparsely distributed. For some light rays with large emission angles or scattered distribution, they may not be effectively reflected, causing the light to escape directly from the adhesive layer. This also reduces the light mixing effect and affects the light efficiency and color uniformity of the display device.

[0060] It is evident that by controlling the center distance W between any two adjacent microstructure grooves within the range of 70µm to 80µm, the microstructure grooves can be distributed in the adhesive layer at a suitable density, ensuring that light from different angles and positions can be effectively reflected to the reflective layer for light mixing, thereby improving the light efficiency and color uniformity of the display device.

[0061] In some embodiments of this application, the depth of the microstructure groove along the thickness direction of the display panel is D, satisfying: 12um≤D≤18um.

[0062] When the depth D of the microstructure trench is less than 12 μm, the reflective surface is too shallow and may not be able to effectively reflect and guide the emitted light. This results in some light not being fully mixed within the adhesive layer, escaping directly, or being reflected in an unreasonable direction, thus reducing the light mixing effect and causing problems such as uneven brightness or color deviation in the backlight module. When the depth D of the microstructure trench is greater than 18 μm, the reflective surface is too deep, which may increase the propagation path and loss of light within the adhesive layer, leading to weakened light energy. It is also not conducive to uniform light mixing within the adhesive layer, which will also affect the light efficiency and color uniformity of the display device.

[0063] It is evident that controlling the depth D of the microstructure groove within the range of 12µm to 18µm enables the reflective surface to have a suitable depth, ensuring that the light emitted by the light-emitting unit is fully reflected and mixed within the adhesive layer, thereby enhancing the light mixing effect within the adhesive layer and improving the light efficiency and color uniformity of the display device.

[0064] In some embodiments of this application, along the thickness direction of the display panel, the dimension H from the reflective layer to the side of the adhesive layer facing away from the reflective layer satisfies: 0.8mm ≤ H ≤ 1.2mm; and / or,

[0065] The display device further includes a brightness enhancement layer, which is disposed on the side of the adhesive layer opposite to the reflective layer.

[0066] When H < 0.8mm, on the one hand, since a reflective structure needs to be set on the adhesive layer, if the adhesive layer is too thin, the setting of the reflective structure may affect the structural strength of the adhesive layer, which may lead to local breakage or cracks in the adhesive layer, affecting the light mixing effect of the backlight module, thus reducing the display effect of the display device; on the other hand, if the adhesive layer is too thin, it may weaken its protection of the light-emitting unit, reflective layer and electronic components on the circuit board, and cannot effectively block the influence of external environment such as dust pollution, water vapor pollution, air oxidation and physical collisions, thereby affecting the performance and service life of the display device.

[0067] When H > 1.2mm, the adhesive layer is too thick. On the one hand, it will increase the overall thickness of the display device, which is not conducive to the design requirements of thin and light products. On the other hand, an excessively thick adhesive layer may hinder the propagation of light, affect the light mixing effect of the light-emitting unit, and cause uneven display of the display device.

[0068] By properly setting the dimension H of the reflective layer to the side of the adhesive layer facing away from the reflective layer, the adhesive layer can play a protective role without adversely affecting the thin and light design of the display device or the light mixing effect of the light-emitting unit, thereby ensuring that the display device has good performance and service life.

[0069] The addition of a brightness enhancement layer can further improve the brightness and contrast of a display device, making the displayed image clearer and more vibrant. By using a brightness enhancement layer, display devices can achieve higher display performance while maintaining a slim profile and low cost.

[0070] Compared with the prior art, the beneficial effects of this application are:

[0071] The display device disclosed in this application, by setting a reflective layer on a circuit board and coating an adhesive layer on both the reflective layer and the light-emitting unit, and setting multiple reflective structures on the side of the adhesive layer corresponding to the light-emitting unit, ensures that the projection of the reflective structure onto the reflective layer is at least partially outside the projection range of the corresponding light-emitting unit onto the reflective layer. This allows the reflective structure to reflect at least a portion of the light emitted from the corresponding light-emitting unit back to the reflective layer, so that the reflective layer reflects at least a portion of the light back to the adhesive layer and mixes it with other light emitted from the light-emitting unit, thereby improving the light mixing effect of the light-emitting unit and achieving uniform light emission. Furthermore, by setting the reflective structure on the adhesive layer, there is no need for additional light mixing structures such as diffusers and reflective lenses, which helps to reduce the thickness and cost of the display device, achieving the design requirements of thinner and lighter products and lower costs. Attached Figure Description

[0072] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0073] Figure 1A This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0074] Figure 1B A front view of a display device provided in an embodiment of this application;

[0075] Figure 2 A cross-sectional view of a display device provided in an embodiment of this application;

[0076] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0077] Figure 4 A cross-sectional view of the backlight module (back panel omitted) provided in an embodiment of this application;

[0078] Figure 5 for Figure 4 One of the magnified views of a section at point B in the middle;

[0079] Figure 6 for Figure 4 Part 2 of the enlarged view of section B in the middle;

[0080] Figure 7 for Figure 4 The second magnified view of a section at point B.

[0081] Explanation of reference numerals in the attached figures:

[0082] 100. Display devices;

[0083] 10. Display panel; 2. Backlight module;

[0084] 20. Backplate; 30. Circuit board; 40. Reflective layer;

[0085] 50. Light-emitting unit; 51. First chip; 52. Second chip; 53. Third chip;

[0086] 60. Adhesive layer; 61. First surface;

[0087] 70. Reflective structure; 71. First microstructure; 72. Second microstructure; 73. Third microstructure; 701. Microstructure groove; 701a. Reflective surface; 701b. Connecting surface;

[0088] 80. Brightening layer;

[0089] F1, first direction; X, thickness direction; Y, width direction; Z, height direction. Detailed Implementation

[0090] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0091] In this application, the terms "upper," "lower," "front," "rear," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0092] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0093] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0094] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0095] In the description of this application, it should be noted that the singular forms of "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that terms such as "comprising / including" or "having" specify the presence of the stated features, integrals, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integrals, steps, operations, components, parts, or combinations thereof.

[0096] Display devices have become an indispensable household appliance in daily life. Internally, a display device typically includes a display panel and a backlight module. The display panel displays images, while the backlight module supports the display panel and provides a light source. With the rapid iteration of display technology, Mini LED (Mini Light Emitting Diode) backlight modules have not only achieved a fusion of high brightness and high contrast, but also demonstrated significant advantages in power consumption control and reliability.

[0097] MiniLED backlight modules generally employ a direct-lit backlight design, achieving precise light control through densely packed thousands to tens of thousands of micro-LED chips. However, this high-density light source layout makes it difficult to maintain consistent brightness across the entire display panel. Therefore, the inventors attempted to add a diffuser plate above the light source to achieve light intensity homogenization through scattering. However, the diffuser plate requires multiple layers of composite materials, resulting in a significant thickness of the backlight module. To address the thickness issue, the inventors continued their experiment by configuring a reflective lens for each LED chip, using optical curved surfaces to control the light emission angle and achieve light intensity homogenization. However, the high cost of reflective lenses increases the overall cost of the display device.

[0098] In view of this, the display device disclosed in this application can improve the light mixing effect of the light-emitting unit, achieve uniform light emission of the light-emitting unit, and eliminate the need for additional light mixing structures such as diffuser plates and reflective lenses. This helps to reduce the thickness and cost of the display device, and realize the design requirements of thinner and lighter products and lower costs.

[0099] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0100] Please refer to the following: Figures 1A to 1B , Figure 1A This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Figure 1BThis is a front view of a display device provided in an embodiment of this application. This application discloses a display device 100, which may include, but is not limited to, televisions, displays, tablets, laptops, mobile phones, etc., and can be widely used in homes, offices, conference halls, exhibition halls, stations, hospitals, or shopping malls. In this embodiment, a television will be used as an example of the display device 100, but this embodiment is not limited to this example.

[0101] In some embodiments, the display device 100 includes a display panel 10 for displaying image information.

[0102] It is understood that the display panel 10 has an upper and lower side along the height direction Z, a left and right side along the width direction Y, and a front and rear side along the thickness direction X. The side of the display panel 10 facing the user is the front side, and the side of the display panel 10 away from the user is the rear side. When the display panel 10 is in a standing (e.g., placed on a table via a base) or hanging (e.g., hung on a wall via a wall mount) state, the absolute height of the upper side of the display panel 10 is greater than the absolute height of the lower side.

[0103] It is understandable that the extension direction between the top and bottom sides is the height direction Z of the display panel 10, the extension direction between the left and right sides is the width direction Y of the display panel 10, and the extension direction between the front and rear sides is the thickness direction X of the display panel 10. It can be seen that among the width direction Y, thickness direction X, and height direction Z, each pair is perpendicular. That is to say, the width direction Y is perpendicular to the thickness direction X, the width direction Y is perpendicular to the height direction Z, and the thickness direction X is perpendicular to the height direction Z.

[0104] Optionally, the display panel 10 has a backlight side and a light-emitting side, which can be understood to be two opposite sides of the display panel 10 along its thickness direction X.

[0105] In some embodiments, the display device 100 includes a mid-frame (not shown), which may be fixedly connected to the four edges of the back panel 20 or detachably connected to the four edges of the back panel 20. This application embodiment does not limit this.

[0106] Please see Figure 2 , Figure 2 This is a cross-sectional view of a display device provided in an embodiment of this application. In some embodiments, the display device 100 includes a backlight module 2, which provides a light source for the display panel 10.

[0107] In some embodiments, the backlight module 2 includes a back plate 20, which is disposed on the backlight side of the display panel 10 and serves as the main support component of the display device 100.

[0108] In some embodiments, the backlight module 2 includes a circuit board 30 disposed on the backplate 20, and the circuit board 30 is used to carry and connect electronic components in the display device 100.

[0109] In some embodiments, the backlight module 2 includes a plurality of light-emitting units 50, which are spaced apart on a circuit board 30 along a first direction F1 and electrically connected to the circuit board 30. The light-emitting units 50 serve as the light source of the display device 100 and are used to emit light.

[0110] In some embodiments, the backlight module 2 includes a reflective layer 40 disposed on the circuit board 30. The main function of the reflective layer 40 is to reflect the light emitted from the light-emitting unit 50, so that the light can be more evenly distributed on the display panel 10, thereby improving the display effect of the display device 100.

[0111] For example, the material of the reflective layer 40 may include white solder resist ink, white paint, reflective mirror, electroplated silver, etc., and this application embodiment does not limit it.

[0112] In some embodiments, the backlight module 2 includes an adhesive layer 60, which is coated on the reflective layer 40 and a plurality of light-emitting units 50. The adhesive layer 60 protects the light-emitting units 50, the reflective layer 40, and the electronic components on the circuit board 30 from external environmental influences, such as dust contamination, moisture contamination, air oxidation, and physical impacts. Simultaneously, the adhesive layer 60 also serves to fix and support, maintaining the relative positional stability of the light-emitting units 50 and the reflective layer 40.

[0113] For example, the material of the adhesive layer 60 may include, but is not limited to, silicone, epoxy resin, polyurethane, etc., and the embodiments of this application do not limit it.

[0114] In some embodiments, along the thickness direction X of the display panel 10, the dimension (i.e., the thickness of the adhesive layer 60) of the surface of the reflective layer 40 to the adhesive layer 60 opposite to the reflective layer 40 is H, satisfying: 0.8mm ≤ H ≤ 1.2mm. For example, the dimension H of the surface of the reflective layer 40 to the adhesive layer 60 opposite to the reflective layer 40 includes, but is not limited to, 0.8mm-0.9mm, 0.9mm-1.0mm, 1.0mm-1.1mm, and 1.1mm-1.2mm. For example, the dimension H of the surface of the reflective layer 40 to the adhesive layer 60 facing away from the reflective layer 40 includes, but is not limited to, 0.8mm, 0.82mm, 0.84mm, 0.86mm, 0.88mm, 0.9mm, 0.92mm, 0.94mm, 0.96mm, 0.98mm, 1.0mm, 1.02mm, 1.04mm, 1.06mm, 1.08mm, 1.1mm, 1.12mm, 1.14mm, 1.16mm, 1.18mm, 1.2mm, etc., and the embodiments of this application do not limit this.

[0115] When H < 0.8 mm, on the one hand, since a reflective structure 70 needs to be set on the adhesive layer 60 later, if the adhesive layer 60 is too thin, the setting of the reflective structure 70 may affect the structural strength of the adhesive layer 60, which may lead to local breakage or cracks in the adhesive layer 60, affecting the light mixing effect of the backlight module 2, and thus reducing the display effect of the display device 100; on the other hand, if the adhesive layer 60 is too thin, it may weaken its protective effect on the light-emitting unit 50, the reflective layer 40 and the electronic components on the circuit board 30, and cannot effectively block the influence of external environment such as dust pollution, water vapor pollution, air oxidation and physical collisions, thereby affecting the performance and service life of the display device 100.

[0116] When H > 1.2 mm, the adhesive layer 60 is too thick. On the one hand, it will increase the overall thickness of the display device 100, which is not conducive to the design requirements of the product to be thin and light. On the other hand, the excessively thick adhesive layer 60 may have a certain obstruction effect on the propagation of light, affecting the light mixing effect of the light-emitting unit 50, resulting in uneven display of the display device 100.

[0117] By reasonably setting the dimension H of the side surface of the reflective layer 40 to the adhesive layer 60 facing away from the reflective layer 40, the adhesive layer 60 can play a protective role without adversely affecting the thin and light design of the display device 100 and the light mixing effect of the light-emitting unit 50, thereby ensuring that the display device 100 has good performance and service life.

[0118] Please see Figure 3 , Figure 3 for Figure 2A partial enlarged view at point A. In some embodiments, a reflective structure 70 is disposed on the adhesive layer 60, and multiple reflective structures 70 are respectively disposed corresponding to multiple light-emitting units 50. The projection of the reflective structure 70 onto the reflective layer 40 is at least partially outside the projection range of the corresponding light-emitting unit 50 onto the reflective layer 40. The reflective structure 70 is configured to reflect at least a portion of the light emitted from the corresponding light-emitting unit 50 to the reflective layer 40, so that the reflective layer 40 reflects at least a portion of the light again to the adhesive layer 60 for mixing with other light.

[0119] On the one hand, by setting a reflective layer 40 on the circuit board 30, and simultaneously coating the reflective layer 40 and the light-emitting unit 50 with an adhesive layer 60, and setting a plurality of reflective structures 70 on the side of the adhesive layer 60 corresponding to the light-emitting unit 50, the projection of the reflective structure 70 on the reflective layer 40 is at least partially outside the projection range of the corresponding light-emitting unit 50 on the reflective layer 40. This allows the reflective structure 70 to reflect at least a portion of the light emitted from the corresponding light-emitting unit 50 to the reflective layer 40, so that the reflective layer 40 can reflect at least a portion of the light again to the adhesive layer 60 for mixing with other light, thereby improving the light mixing effect of the light-emitting unit 50 and making the display of the display device 100 more uniform. On the other hand, by setting the reflective structure 70 on the adhesive layer 60, there is no need to set additional light mixing structures such as diffuser plates and reflective lenses, which helps to reduce the thickness and cost of the display device 100, and realize the design requirements of product thinness and low cost.

[0120] It is understandable that "other rays" refers to other rays emitted by the light-emitting unit 50, that is, rays other than at least some of the rays reflected by the reflective structure 70.

[0121] It is understood that the first direction F1 can be the height direction Z or the width direction Y of the display panel 10, and this application embodiment does not limit it.

[0122] In some embodiments, the display device 100 further includes a brightness enhancement layer 80, which is disposed on the side of the adhesive layer 60 opposite to the reflective layer 40. The brightness enhancement layer 80 can further improve the brightness and contrast of the display device 100, making the displayed image clearer and more vibrant. By using the brightness enhancement layer 80, the display device 100 can achieve higher display performance while maintaining a thinner and lighter design and lower cost.

[0123] For example, the material of the brightness enhancement layer 80 may include, but is not limited to, optical-grade polyester film, brightness enhancement coating, or film with a microprism structure. These materials can effectively improve light transmittance and focusing effect, reduce light loss during propagation, and thus enhance the overall light emission efficiency of the display device 100.

[0124] In some embodiments, the light-emitting unit 50 includes a first chip 51, a second chip 52, and a third chip 53 arranged sequentially along a first direction F1, wherein at least two of the first chip 51, the second chip 52, and the third chip 53 emit light of different wavelengths.

[0125] For example, the first chip 51 can be a red light chip, the second chip 52 can be a green light chip, and the third chip 53 can be a blue light chip. The first chip 51, the second chip 52, and the third chip 53 together form a light-emitting unit 50, enabling the light-emitting unit 50 to emit mixed light containing red, green, and blue primary colors, thereby achieving a full-color display effect. This design makes the display device 100 more colorful and realistic, meeting users' needs for high-quality display images.

[0126] For example, the first chip 51 can be a green light chip, the second chip 52 can be a red light chip, and the third chip 53 can be a blue light chip; or, the first chip 51 can be a blue light chip, the second chip 52 can be a green light chip, and the third chip 53 can be a red light chip; or, the first chip 51 can be a blue light chip, the second chip 52 can be a red light chip, and the third chip 53 can be a green light chip. This application does not limit the specific implementation of the embodiments.

[0127] Of course, as other embodiments, the first chip 51 can also be a chip of other colors, and the second chip 52 and the third chip 53 can also be adjusted according to the actual display requirements, as long as at least two chips emit light of different wavelengths to achieve the multi-color mixed output of the light-emitting unit 50.

[0128] The following will provide a detailed explanation of why the first chip 51 can be a red light chip, the second chip 52 can be a green light chip, and the third chip 53 can be a blue light chip.

[0129] In some embodiments, the reflective structure 70 includes a first microstructure 71, a second microstructure 72, and a third microstructure 73. The first microstructure 71 is at least partially disposed corresponding to the first chip 51 and is configured to reflect at least a portion of the light emitted from the first chip 51 to the reflective layer 40, so that the reflective layer 40 reflects at least a portion of the light to the adhesive layer 60 and mixes it with other light within the adhesive layer 60. The second microstructure 72 is disposed corresponding to the second chip 52 and is configured to reflect at least a portion of the light emitted from the second chip 52 to the reflective layer 40, so that the reflective layer 40 reflects at least a portion of the light to the adhesive layer 60 and mixes it with other light within the adhesive layer 60. The third microstructure 73 is at least partially disposed corresponding to the third chip 53 and is configured to reflect at least a portion of the light emitted from the third chip 53 to the reflective layer 40, so that the reflective layer 40 reflects at least a portion of the light to the adhesive layer 60 and mixes it with other light within the adhesive layer 60.

[0130] It is understandable that by using the first microstructure 71 to reflect at least a portion of the light from the first chip 51, the second microstructure 72 to reflect at least a portion of the light from the second chip 52, and the third microstructure 73 to reflect at least a portion of the light from the third chip 53, the light emitted from each chip can be more evenly distributed on the display panel 10 after multiple reflections and mixing by the reflective layer 40 and the adhesive layer 60, thereby significantly improving the color uniformity and overall display effect of the display device 100. This design of setting corresponding reflective microstructures for each chip not only optimizes the light propagation path but also effectively reduces problems such as bright spots, polarization, or dark areas that may be caused by direct light emission.

[0131] Specifically, since the first chip 51, the second chip 52, and the third chip 53 are arranged sequentially at intervals along the first direction F1, and the adhesive layer 60 is coated on the first chip 51, the second chip 52, and the third chip 53, the light emitted from the first chip 51, the second chip 52, and the third chip 53 is reflected, refracted, or transmitted within the adhesive layer 60. Along the first direction F1, the portion of the light emitted from the first chip 51 closer to the second chip 52 can mix with the light emitted from the second chip 52. The portion of the light emitted from the first chip 51 farther from the second chip 52 is reflected back into the adhesive layer 60 based on the principle of total internal reflection, thus mixing with other light within the adhesive layer 60. If the other portion of the light emitted from the first chip 51 farther from the second chip 52 is directly refracted out of the adhesive layer 60 without mixing with other light within the adhesive layer 60, then part of the emitted light from the backlight module 2 will appear reddish.

[0132] The second chip 52 is located between the first chip 51 and the third chip 53 along the first direction F1. The portion of the emitted light from the second chip 52 that is close to the first chip 51 can mix with the emitted light from the first chip 51. The portion of the emitted light from the second chip 52 that is close to the third chip 53 can mix with the emitted light from the third chip 53. The portion of the emitted light from the second chip 52 that is close to the center of the emitted light directly refracts out of the adhesive layer 60 without mixing with other light within the adhesive layer 60, thus causing part of the emitted light from the backlight module 2 to be greenish.

[0133] Along the first direction F1, the portion of the light emitted from the third chip 53 that is closer to the second chip 52 can mix with the light emitted from the second chip 52. The portion of the light emitted from the third chip 53 that is farther from the second chip 52 is reflected back to the adhesive layer 60 based on the principle of total internal reflection, and mixes with other light within the adhesive layer 60. If the other portion of the light emitted from the third chip 53 that is farther from the second chip 52 is directly refracted out of the adhesive layer 60 without mixing with other light within the adhesive layer 60, the light emitted from part of the backlight module 2 will be bluish.

[0134] In some embodiments, the projection of the first microstructure 71 onto the reflective layer 40 is at least partially outside the projection range of the first chip 51 onto the reflective layer 40. That is, the projection of the first microstructure 71 onto the reflective layer 40 does not completely cover the first chip 51. Part of the projection of the first microstructure 71 falls within the projection range of the first chip 51 onto the reflective layer 40, while another part falls outside the projection range. This means that at least a portion of the first chip 51 is not completely covered by the first microstructure 71. In other words, the projection of the first microstructure 71 onto the reflective layer 40 actually only covers a portion of the projection of the first chip 51 onto the reflective layer 40, allowing a portion of the first chip 51 to directly emit light to the adhesive layer 60, rather than all the light being reflected by the first microstructure 71. This configuration ensures that the first microstructure 71 effectively reflects at least a portion of the light emitted from the first chip 51 to the reflective layer 40, preventing the light from being directly refracted out of the adhesive layer 60 without being fully mixed with other light within the adhesive layer 60, thereby reducing the possibility of a reddish area appearing in the backlight module 2.

[0135] In some embodiments, the projection of the second microstructure 72 onto the reflective layer 40 lies within the projection range of the second chip 52 onto the reflective layer 40. That is, the projection of the second microstructure 72 onto the reflective layer 40 does not completely cover the second chip 52. Part of the projection of the second microstructure 72 falls within the projection range of the second chip 52 onto the reflective layer 40, while another part falls outside the projection range. This means that at least a portion of the second chip 52 is not completely covered by the second microstructure 72. In other words, the projection of the second microstructure 72 onto the reflective layer 40 actually only covers a portion of the projection of the second chip 52 onto the reflective layer, allowing a portion of the second chip 52 to directly emit light to the adhesive layer 60, rather than all the light being reflected by the second microstructure 72. This arrangement ensures that the second microstructure 72 effectively reflects at least a portion of the light emitted from the second chip 52 to the reflective layer 40, preventing light from being directly refracted out of the adhesive layer 60 without sufficient mixing with other light within the adhesive layer 60, thereby reducing the possibility of a greenish tint appearing in the backlight module 2.

[0136] In some embodiments, the projection of the third microstructure 73 onto the reflective layer 40 is at least partially outside the projection range of the third chip 53 onto the reflective layer 40. That is, the projection of the third microstructure 73 onto the reflective layer 40 does not completely cover the third chip 53; part of the projection falls within the projection range of the third chip 53 onto the reflective layer 40, and another part falls outside the projection range of the third chip 53 onto the reflective layer 40. This means that at least a portion of the third chip 53 is not completely covered by the third microstructure 73. In other words, the projection of the third microstructure 73 onto the reflective layer 40 actually only covers a portion of the projection of the third chip 53 onto the reflective layer 40, thus allowing a portion of the third chip 53 to directly emit light to the adhesive layer 60, rather than all the light being reflected by the third microstructure 73. This configuration ensures that the third microstructure 73 effectively reflects at least a portion of the light emitted from the third chip 53 to the reflective layer 40, preventing the light from being directly refracted out of the adhesive layer 60 without being fully mixed with other light within the adhesive layer 60, thereby reducing the possibility of a bluish area appearing in the backlight module 2.

[0137] Please see Figure 4 , Figure 4 This is a cross-sectional view of a backlight module (back panel omitted) provided in an embodiment of this application. In some embodiments, the first microstructure 71, the second microstructure 72, and the third microstructure 73 all extend along the first direction F1.

[0138] In some embodiments, a first angle α1 is formed between the line connecting the endpoint of the first microstructure 71 away from the second microstructure 72 and the emission center of the first chip 51 and the emission surface of the first chip 51. A second angle α2 is formed between the line connecting the endpoint of the first microstructure 71 near the second microstructure 72 and the emission center of the first chip 51 and the emission surface of the first chip 51.

[0139] In some embodiments, a third angle α3 is formed between the line connecting the endpoint of the second microstructure 72 near the first microstructure 71 and the emission center of the second chip 52 and the emission surface of the second chip 52. A fourth angle α4 is formed between the line connecting the endpoint of the second microstructure 72 near the third microstructure 73 and the emission center of the second chip 52 and the emission surface of the second chip 52.

[0140] In some embodiments, a fifth angle α5 is formed between the line connecting the endpoint of the third microstructure 73 near the second microstructure 72 and the emission center of the third chip 53 and the emission surface of the second chip 52. A sixth angle α6 is formed between the line connecting the endpoint of the third microstructure 73 away from the second microstructure 72 and the emission center of the third chip 53 and the emission surface of the third chip 53.

[0141] It is understandable that the emission center of each chip refers to the central point where light is emitted from each chip; this position can be considered as the reference point for light emission. For example... Figure 4 As shown, the emission center O of the first chip 51 is the center point of the first chip 51 along the first direction F1, the emission center P of the second chip 52 is the center point of the second chip 52 along the first direction F1, and the emission center Q of the third chip 53 is the center point of the third chip 53 along the first direction F1.

[0142] In some embodiments, the first included angle α1 is equal to the sixth included angle α6, the second included angle α2 is equal to the fifth included angle α5, and the third included angle α3 is equal to the fourth included angle α4. The second included angle α2 is greater than the first included angle α1, and the second included angle α2 is greater than or equal to the third included angle α3.

[0143] By rationally setting the relationship between the first included angle α1 and the sixth included angle α6, the reflection effect of the reflective structure 70 on the light emitted from each chip can be optimized. Specifically, when the second included angle α2 is greater than the first included angle α1, it ensures that the first microstructure 71 more effectively reflects the edge light emitted from the first chip 51 to the reflective layer 40, preventing light from directly escaping from the adhesive layer 60 and causing insufficient light mixing. At the same time, the design that the second included angle α2 is greater than or equal to the third included angle α3 ensures that when the second microstructure 72 reflects the light from the second chip 52, it can both mix with the light from the first chip 51 and ensure that its own light is fully reflected to the reflective layer 40. This angle setting helps to reduce the color shift problem in the backlight module 2 and improve the uniformity and color reproduction of the overall display. In addition, the symmetrical design of the first included angle α1 being equal to the sixth included angle α6, the second included angle α2 being equal to the fifth included angle α5, and the third included angle α3 being equal to the fourth included angle α4 simplifies the manufacturing process of the reflective structure 70, reduces production costs, and maintains the consistency of light reflection.

[0144] In some embodiments, the first included angle α1 satisfies: α1 ≥ 90° - arcsin(n1 / n2). Here, n1 is the refractive index of air, and n2 is the refractive index of the adhesive layer 60. When the first included angle α1 satisfies the above relationship, the reflection direction of the first microstructure 71 on the edge light of the first chip 51 can be reasonably controlled, ensuring that most of the light can enter the interior of the adhesive layer 60 for sufficient light mixing, rather than being directly refracted out of the adhesive layer 60, causing energy loss and uneven light mixing. When the first included angle is less than this critical value, some edge light may directly pass through the adhesive layer 60 due to an excessively large refraction angle, resulting in brightness attenuation or color deviation in the edge area of ​​the backlight module 2.

[0145] By setting a lower limit for α1, the light efficiency and edge display uniformity of the backlight module 2 can be effectively improved. For example, when the adhesive layer 60 is made of silicone, with a refractive index n2 = 1.45 and an air refractive index n1 = 1.0, the calculated arcsin(n1 / n2) ≈ 44°. In this case, the first included angle α1 must satisfy α1 = 46°. That is, the first included angle α1 satisfies: α1 ≥ 46°. For example, α1 can be, but is not limited to, 46°, 47°, 48°, 49°, 50°, 51°, 52°, 53°, 54°, 55°, 56°, 57°, 58°, 59°, 60°, etc. This embodiment does not limit this.

[0146] Of course, as another embodiment, the value range of α1 can also be 30°≤α1≤46°. For example, α1 can include, but is not limited to, 30°-34°, 34°-38°, 38°-42°, and 42°-46°. For instance, α1 can include, but is not limited to, 30°, 31°, 32°, 33°, 34°, 35°, 36°, 37°, 38°, 39°, 40°, 41°, 42°, 43°, 44°, 45°, and 46°, etc. The embodiments of this application do not limit this. By reasonably controlling the range of α1, the emitted light from other positions of the light-emitting unit 50, except for the emitted light from its emission center, can also be reflected, thereby avoiding the problem of polarization caused by the direct emission of emitted light from other positions, and further ensuring the display effect of the display device 100.

[0147] In some embodiments, the second included angle α2 satisfies: 75°≤α2≤102°. For example, the second included angle α2 may include, but is not limited to, 75°-80°, 80°-82°, 82°-84°, 84°-86°, 86°-88°, 88°-90°, 90°-92°, 92°-94°, 94°-96°, 96°-98°, 98°-100°, and 100°-102°. For example, the second included angle α2 may include, but is not limited to, 75°, 76°, 77°, 78°, 79°, 80°, 81°, 82°, 83°, 84°, 85°, 86°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, 94°, 95°, 96°, 97°, 98°, 99°, 100°, 101°, 102°, etc., and the embodiments of this application do not limit this.

[0148] When the second included angle α2 < 75°, the reflection effect of the first microstructure 71 on the edge light of the first chip 51 is enhanced. Most of the light is reflected by the first microstructure 71 into the adhesive layer 60 for light mixing, while the amount of light directly refracted or scattered decreases. This will lead to a decrease in brightness in the edge area of ​​the backlight module 2, resulting in dark areas and affecting the uniformity of the overall display image. When the second included angle α2 > 102°, the light emitted from the first chip 51 cannot be reflected back to the adhesive layer 60 by the first microstructure 71 to achieve light mixing. Instead, it is directly refracted or scattered. This not only fails to improve the light mixing effect but may also cause bright spots or color shifts in the backlight module 2, reducing display quality. Therefore, controlling the second included angle α2 within the range of 75° to 102° ensures that the first microstructure 71 reflects the light emitted from the first chip 51 at an appropriate angle, allowing the light to be fully mixed within the adhesive layer 60 and then emitted uniformly. This effectively improves the light efficiency and display uniformity of the backlight module 2, meeting the requirements of the display device 100 for high-quality images.

[0149] In some embodiments, the third included angle α3 satisfies: 75°≤α3≤82°. Exemplarily, the third included angle α3 may include, but is not limited to, 75°-78°, 78°-80°, and 80°-82°. For example, the third included angle α3 may include, but is not limited to, 75°, 76°, 77°, 78°, 79°, 80°, 81°, and 82°, etc., and this application embodiment does not limit this. When the third included angle α3 is within this range, the second microstructure 72 can reflect the light emitted from the second chip 52 at a suitable angle, ensuring that the light is fully mixed with other light within the adhesive layer 60, avoiding energy loss and uneven light mixing caused by the light directly escaping from the adhesive layer 60 or reflecting back to the vicinity of the chip due to an improper reflection angle.

[0150] When the third included angle α3 < 75°, the reflection of light from the edge of the second chip 52 by the second microstructure 72 may be too concentrated, causing some light to fail to diffuse sufficiently to other areas of the adhesive layer 60, resulting in a decrease in the light mixing effect. This may lead to localized uneven brightness or color deviation in the backlight module 2. When the third included angle α3 > 82°, the light emitted from the second chip 52 may not be able to effectively enter the adhesive layer 60 for light mixing due to the excessively large reflection angle. Instead, it may be directly refracted or scattered, which will also reduce the light efficiency and display uniformity of the backlight module 2.

[0151] Please refer to the following: Figures 5 to 6 , Figure 5 for Figure 4 One of the magnified views of a section at point B in the middle. Figure 6 for Figure 4 The second enlarged view at point B. In some embodiments, the adhesive layer 60 includes a first surface 61, which is configured as the surface of the adhesive layer 60 facing away from the reflective layer 40. The first microstructure 71, the second microstructure 72, and the third microstructure 73 are each composed of a plurality of microstructure grooves 701, which are spaced apart along a first direction F1. That is, the microstructure grooves 701 are disposed on the first surface 61 of the adhesive layer 60.

[0152] In some embodiments, the microstructure groove 701 includes a reflective surface 701a and a connecting surface 701b. The reflective surface 701a is connected to the connecting surface 701b and the first surface 61. The opening of the microstructure groove 701 is disposed facing away from the reflective layer 40. The reflective surface 701a is configured to reflect at least a portion of the light emitted by the light-emitting unit 50 to the reflective layer 40, so that the reflective layer 40 reflects at least a portion of the light again to the adhesive layer 60 for mixing with other light.

[0153] See Figure 6 , Figure 6The dashed line illustrates a schematic diagram of two rays emitted at different angles being reflected back to the adhesive layer 60 by the microstructure groove 701. Since the emission angles of any ray emitted from the first chip 51, the second chip 52, and the third chip 53 are different, setting multiple microstructure grooves 701 corresponding to multiple rays allows the emitted rays to be effectively reflected by the corresponding microstructure grooves 701. Specifically, when the ray emitted from the first chip 51 strikes the adhesive layer 60 at a specific angle, the reflective surface 701a of the corresponding microstructure groove 701 reflects it to the reflective layer 40 at the optimal angle. The reflective layer 40 then reflects the ray back to the adhesive layer 60 and mixes it with other rays. Similarly, the rays emitted from the second chip 52 and the third chip 53 can also achieve a similar effective reflection and mixing process through their respective corresponding microstructure grooves 701. This method of arranging multiple microstructure slots 701 at intervals along the first direction F1 can precisely match the angle and position of light emitted from different chips, ensuring that light from all directions and angles can be fully reflected and mixed, thereby further improving the light efficiency and color uniformity of the display device 100 and reducing display defects caused by insufficient light reflection.

[0154] In some embodiments, in the first microstructure 71, at least two reflective surfaces 701a in the plurality of microstructure grooves 701 have different tilt angles. In some embodiments, in the second microstructure 72, at least two reflective surfaces 701a in the plurality of microstructure grooves 701 have different tilt angles.

[0155] In some embodiments, in the third microstructure 73, at least two of the multiple microstructure grooves 701 have different tilt angles for their reflective surfaces 701a.

[0156] By setting different tilt angles for the reflective surfaces 701a in multiple microstructure slots 701, light emitted from different angles can be reflected to the reflective layer 40 in a more suitable direction by the reflective surfaces 701a with corresponding tilt angles. For example, light emitted at a larger angle is reflected by the reflective surface 701a with a larger tilt angle, ensuring it reaches the reflective layer 40 smoothly and is reflected back to the adhesive layer 60 to participate in light mixing; light emitted at a smaller angle is reflected by the reflective surface 701a with a smaller tilt angle, achieving effective light reflection and mixing as well. This design avoids the problem of poor light reflection due to all reflective surfaces 701a having the same tilt angle, ensuring accurate reflection of light emitted from each chip at different angles. This further improves the light mixing effect within the adhesive layer 60, significantly enhancing the light efficiency and color uniformity of the display device 100, and effectively reducing defects such as bright spots, dark areas, or color shifts that may occur during display.

[0157] Since the emission angles of any of the emitted light rays from the first chip 51, the second chip 52, and the third chip 53 are different, setting multiple microstructure slots 701 corresponding to multiple emitted light rays allows each emitted light ray to be effectively reflected by the corresponding microstructure slot 701. Specifically, when the light emitted from the first chip 51 strikes the adhesive layer 60 at a specific angle, the reflective surface 701a of the corresponding microstructure slot 701 can reflect it to the reflective layer 40 at the optimal angle. The reflective layer 40 then reflects the light back to the adhesive layer 60 to mix with other light rays. Similarly, the light emitted from the second chip 52 and the third chip 53 can also achieve a similar effective reflection and mixing process through their respective corresponding microstructure slots 701. This method of arranging multiple microstructure slots 701 at intervals along the first direction F1 can precisely match the angles and positions of the emitted light rays from different chips, ensuring that light rays from all directions and angles are fully reflected and mixed, thereby further improving the light efficiency and color uniformity of the display device 100 and reducing display defects caused by insufficient light reflection.

[0158] See you again Figure 5 and Figure 6 In some embodiments, a seventh included angle α7 is formed between the reflective surface 701a and the first surface 61, and the seventh included angle α7 satisfies: α7 > arcsin(n1 / n2) - β. Wherein, n1 is the refractive index of air, n2 is the refractive index of the adhesive layer 60, and β is the emission angle of the light emitted by the light-emitting unit 50.

[0159] When the seventh included angle α7 satisfies the above relationship, the tilt angle of the reflective surface 701a can be precisely adjusted according to the actual emission angle of the light emitted from the light-emitting unit 50, ensuring that the reflective surface 701a reflects the light to the reflective layer 40 at the optimal angle. In this way, the light can be more fully mixed with other light after entering the adhesive layer 60, avoiding the light from directly escaping from the adhesive layer 60 or being reflected back to the vicinity of the chip due to improper reflection angle, thereby effectively improving the light mixing effect.

[0160] For example, when the air refractive index n1 = 1.0 and the refractive index of the adhesive layer 60 n2 = 1.45, the emitted light meets the condition for total internal reflection: arcsin(n1 / n2) ≈ 44°. That is, total internal reflection needs to be considered for emitted light with a β value between 0° and 44°. If the emission angle β of the emitted light from the light-emitting unit 50 is 10°, then the seventh angle α7 = 44° - 10° = 34°; if β = 20°, then the seventh angle α7 = 44° - 20° = 24°. Through this precise angle calculation and setting, light with different emission angles can achieve sufficient light mixing within the adhesive layer 60, further improving the light efficiency and color uniformity of the display device 100.

[0161] In other embodiments, a seventh included angle α7 is formed between the reflective surface 701a and the first surface 61, wherein the seventh included angle α7 satisfies: 5°≤α7≤49°. Exemplarily, the seventh included angle α7 formed between the reflective surface 701a and the first surface 61 may include, but is not limited to, 5°-9°, 9°-13°, 13°-17°, 17°-21°, 21°-25°, 25°-29°, 29°-33°, 33°-37°, 37°-41°, 41°-45°, and 45°-49°. For example, the seventh included angle α7 can include, but is not limited to, 5°, 6°, 7°, 8°, 9°, 10°, 11°, 12°, 13°, 14°, 15°, 16°, 17°, 18°, 19°, 20°, 21°, 22°, 23°, 24°, 25°, 26°, 27°, 28°, 29°, 30°, 31°, 32°, 33°, 34°, 35°, 36°, 37°, 38°, 39°, 40°, 41°, 42°, 43°, 44°, 45°, 46°, 47°, 48°, 49°, etc., and the embodiments of this application do not limit this.

[0162] When the seventh angle α7 < 5°, the tilt angle of the reflective surface 701a is too small. For light with a larger exit angle, it may not be effectively reflected to the reflective layer 40, causing some light to escape directly from the adhesive layer 60, reducing the light mixing effect and causing uneven brightness or color deviation in the backlight module 2. When the seventh angle α7 > 49°, the tilt angle of the reflective surface 701a is too large, and the direction of light reflection may be unreasonable, making it impossible for the light to achieve good light mixing within the adhesive layer 60. This will also affect the light efficiency and color uniformity of the display device 100.

[0163] As can be seen, by controlling the seventh included angle α7 within the range of 5° to 49°, the reflective surface 701a can reflect the light emitted from the light-emitting unit 50 to the reflective layer 40 at a suitable tilt angle, so that the light can be fully mixed with other light in the adhesive layer 60, thereby improving the light mixing effect in the adhesive layer 60 and thus improving the light efficiency and color uniformity of the display device 100.

[0164] In some embodiments, since the light-emitting unit 50 emits light from five sides, in addition to the light emitted from its emission center, there are other emitted light rays. To further consider the polarization problem of these emitted light rays, the emission angle β of the light emitted from the light-emitting unit 50 is set to 44° to 60° to achieve total internal reflection. Therefore, the seventh included angle α7 can also be set to satisfy: 4°≤α7≤20°. For example, the seventh included angle α7 can include, but is not limited to, 4°-8°, 8°-12°, 12°-16°, and 16°-20°. For instance, the seventh included angle α7 can include, but is not limited to, 4°, 5°, 6°, 7°, 8°, 9°, 10°, 11°, 12°, 13°, 14°, 15°, and 16°, etc. The embodiments of this application do not limit this.

[0165] Please see Figure 7 , Figure 7 for Figure 4 The second enlarged view at point B. In some embodiments, the center distance between any two adjacent microstructure grooves 701 along the first direction F1 is unequal. This design of unequal center distances between any two adjacent microstructure grooves 701 can further optimize the reflection and mixing process of light within the adhesive layer 60. Since the distribution and angle of light emitted from different chips within the adhesive layer 60 differ, if the center distances between the microstructure grooves 701 are completely equal, some light may not be effectively reflected, or the reflected light may not be sufficiently mixed, or moiré patterns may occur in the backlight module 2. By setting unequal center distances, the distribution of the microstructure grooves 701 can be flexibly adjusted according to the characteristics of the light emitted from different chips, so that each ray of light can be reflected by the corresponding microstructure groove 701 within a suitable distance range. For example, for light rays with a large emission angle and a relatively dispersed distribution, the center distance between adjacent microstructure slots 701 can be appropriately increased to ensure that these light rays have enough space to be captured and reflected by the reflective surface 701a to the reflective layer 40. For light rays with a small emission angle and a relatively concentrated distribution, the center distance between adjacent microstructure slots 701 can be decreased, allowing the reflective surface 701a to reflect these light rays more accurately and achieve more complete light mixing. This design effectively avoids the problem of light reflection dead angles or insufficient light mixing caused by uneven distribution of microstructure slots 701, further improving the light efficiency and color uniformity of the display device 100, and reducing defects such as bright spots and dark areas that may occur during the display process.

[0166] In some embodiments, along the first direction F1, the center distance between any two adjacent microstructure grooves 701 is W, satisfying: 70um ≤ D ≤ 80um. For example, the center distance W between any two adjacent microstructure grooves 701 may include, but is not limited to, 70um-72um, 72um-74um, 74um-76um, 76um-78um, 78um-80um, etc. For instance, the center distance W may include, but is not limited to, 70um, 71um, 72um, 73um, 74um, 75um, 76um, 77um, 78um, 79um, 80um, etc., and this application embodiment does not limit this.

[0167] When the center distance W < 70µm, the microstructure grooves 701 are too densely distributed, which may cause interference between adjacent microstructure grooves 701, affecting the light reflection effect. This results in some light not being properly reflected to the reflective layer 40, thus reducing the light mixing effect and causing uneven brightness or color deviation in the backlight module 2. When the center distance W > 80µm, the microstructure grooves 701 are too sparsely distributed. Some light with large emission angles or scattered distribution may not be effectively reflected, causing the light to escape directly from the adhesive layer 60. This also reduces the light mixing effect and affects the light efficiency and color uniformity of the display device 100.

[0168] It can be seen that by controlling the center distance W between each two adjacent microstructure grooves 701 within the range of 70um to 80um, the microstructure grooves 701 can be distributed in the adhesive layer 60 with a suitable density, ensuring that light from different angles and positions can be effectively reflected to the reflective layer 40 for light mixing, thereby improving the light efficiency and color uniformity of the display device 100.

[0169] In some embodiments, the depth D of the microstructure groove 701 along the thickness direction X of the display panel 10 satisfies: 12um ≤ D ≤ 18um. Exemplarily, the depth D of the microstructure groove 701 may include, but is not limited to, 12um-14um, 14um-16um, 16um-18um, etc. For example, the depth D may include, but is not limited to, 12um, 13um, 14um, 15um, 16um, 17um, 18um, etc., and this application embodiment does not limit this.

[0170] When the depth D of the microstructure groove 701 is less than 12 μm, the depth of the reflective surface 701a is too shallow, which may prevent effective reflection and guidance of the emitted light. This results in some light not being fully mixed within the adhesive layer 60, escaping directly, or having an unreasonable reflection direction, thereby reducing the light mixing effect and causing problems such as uneven brightness or color deviation in the backlight module 2. When the depth D of the microstructure groove 701 is greater than 18 μm, the depth of the reflective surface 701a is too large, which may increase the propagation path and loss of light within the adhesive layer 60, leading to weakened light energy. It is also not conducive to uniform light mixing within the adhesive layer 60, which will also affect the light efficiency and color uniformity of the display device 100.

[0171] It can be seen that by controlling the depth D of the microstructure groove 701 within the range of 12um to 18um, the reflective surface 701a can have a suitable depth, ensuring that the light emitted from the light-emitting unit 50 is fully reflected and mixed within the adhesive layer 60, thereby improving the light mixing effect within the adhesive layer 60 and thus improving the light efficiency and color uniformity of the display device 100.

[0172] The display device disclosed in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the display device and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display device, characterized in that, include: Display panel; A backplate, wherein the backplate is disposed on the backlight side of the display panel; A circuit board, the circuit board being disposed on the back plate; A reflective layer is disposed on the circuit board; Multiple light-emitting units are spaced apart on the circuit board along a first direction and electrically connected to the circuit board; An adhesive layer is coated on the reflective layer and the plurality of light-emitting units; Multiple reflective structures are disposed on the adhesive layer, and the multiple reflective structures are respectively disposed corresponding to multiple light-emitting units. The projection of the reflective structure on the reflective layer is at least partially located outside the projection range of the corresponding light-emitting unit on the reflective layer. The reflective structure is configured to reflect at least a portion of the light emitted by the corresponding light-emitting unit to the reflective layer, so that the reflective layer reflects the at least a portion of the light back to the adhesive layer to mix with other light. Wherein, the first direction is the height direction or the width direction of the display panel.

2. The display device according to claim 1, characterized in that, The light-emitting unit includes a first chip, a second chip, and a third chip arranged sequentially along the first direction, wherein at least two of the first chip, the second chip, and the third chip emit light of different wavelengths. The reflective structure includes: A first microstructure, at least partially corresponding to the first chip, is configured to reflect at least a portion of the light emitted from the first chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer; The second microstructure is disposed corresponding to the second chip and is configured to reflect at least a portion of the light emitted from the second chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer; A third microstructure, at least partially corresponding to the third chip, is configured to reflect at least a portion of the light emitted from the third chip to the reflective layer, so that the reflective layer reflects the at least a portion of the light to the adhesive layer and mixes it with other light within the adhesive layer; The projection of the first microstructure onto the reflective layer is at least partially located outside the projection range of the first chip onto the reflective layer; and / or, The projection of the second microstructure onto the reflective layer lies within the projection range of the second chip onto the reflective layer; and / or, The projection of the third microstructure onto the reflective layer is at least partially outside the projection range of the third chip onto the reflective layer.

3. The display device according to claim 2, characterized in that, The first microstructure, the second microstructure, and the third microstructure all extend along the first direction; The line connecting the end point of the first microstructure away from the second microstructure and the emission center of the first chip forms a first included angle α1 with the emission surface of the first chip; The line connecting the end point of the first microstructure near the second microstructure and the emission center of the first chip forms a second included angle α2 with the emission surface of the first chip; The line connecting the end point of the second microstructure near the first microstructure and the emission center of the second chip forms a third included angle α3 with the emission surface of the second chip; The line connecting the end point of the second microstructure near the third microstructure and the emission center of the second chip forms a fourth included angle α4 with the emission surface of the second chip; The line connecting the end point of the third microstructure near the second microstructure and the emission center of the third chip forms a fifth included angle α5 with the emission surface of the second chip. The line connecting the endpoint of the third microstructure away from the second microstructure and the emission center of the third chip forms a sixth included angle α6 with the emission surface of the third chip. The first included angle is equal to the sixth included angle, the second included angle is equal to the fifth included angle, and the third included angle is equal to the fourth included angle; Wherein, the second included angle is greater than the first included angle, and the second included angle is greater than or equal to the third included angle.

4. The display device according to claim 3, characterized in that, The first included angle α1 satisfies: α1≥90°-arcsin(n1 / n2); The second included angle α2 satisfies: 75°≤α2≤102°; The third included angle α3 satisfies: 75°≤α3≤82°; Where n1 is the refractive index of air and n2 is the refractive index of the adhesive layer.

5. The display device according to claim 2, characterized in that, The adhesive layer includes a first surface, which is configured as a side surface of the adhesive layer opposite to the reflective layer. The first microstructure, the second microstructure, and the third microstructure are all composed of a plurality of microstructure grooves, which are spaced apart along the first direction. Each microstructure groove includes a reflective surface and a connecting surface. The reflective surface is connected to the connecting surface and the first surface, and the opening of the microstructure groove is oriented towards the side away from the reflective layer. The reflective surface is configured to reflect at least a portion of the light emitted by the light-emitting unit to the reflective layer, so that the reflective layer reflects the at least a portion of the light again to the adhesive layer and mixes it with other light emitted by the light-emitting unit. In the first microstructure, at least two of the multiple microstructure grooves have different inclination angles for their reflective surfaces; and / or, In the second microstructure, at least two of the microstructure grooves have different inclination angles for their reflective surfaces; and / or, In the third microstructure, at least two of the reflective surfaces in the plurality of microstructure grooves have different tilt angles.

6. The display device according to claim 5, characterized in that, The reflective surface and the first surface form a seventh included angle α7, which satisfies: α7 > arcsin(n1 / n2) - β; or, The reflective surface and the first surface form a seventh included angle α7, which satisfies: 5°≤α7≤49°; Wherein, n1 is the refractive index of air, n2 is the refractive index of the adhesive layer, and β is the emission angle of the light emitted by the light-emitting unit.

7. The display device according to claim 5, characterized in that, Along the first direction, the center distance between any two adjacent microstructure grooves is not equal.

8. The display device according to claim 7, characterized in that, Along the first direction, the center distance between any two adjacent microstructure grooves is W, which satisfies: 70um≤D≤80um.

9. The display device according to claim 5, characterized in that, Along the thickness direction of the display panel, the depth of the microstructure groove is D, which satisfies: 12um≤D≤18um.

10. The display device according to any one of claims 1-9, characterized in that, Along the thickness direction of the display panel, the dimension H from the reflective layer to the side of the adhesive layer facing away from the reflective layer satisfies: 0.8mm ≤ H ≤ 1.2mm; and / or, The display device further includes a brightness enhancement layer, which is disposed on the side of the adhesive layer opposite to the reflective layer.

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