Backlight module of mini-led display screen

Abstract

The utility model relates to a kind of backlight module of MINI-LED display screen, the utility model effectively solves the problem that the current Mini-LED backlight module is not good at heat dissipation effect, halo effect is easy to produce, and the problem of lower mounting precision.The backlight module of the Mini-LED display screen is connected with the composite heat dissipation mechanism by the bottom heat conduction path of the mutual connection of metal substrate and chip mounting plate through insulating heat-conducting adhesive, and can quickly export and evenly disperse the heat generated by Mini-LED chip, guarantee the long-term stable operation and service life of module;The air gap formed between microstructure diffusion plate and chip mounting plate carries out first light mixing, and then controllable secondary scattering and guidance are carried out through array type micro-lens, which greatly improves the lateral diffusion capacity of light, makes the light transition between each dimming partition soft, effectively suppresses halo phenomenon;And positioning groove provides physical reference for die bonding process of Mini-LED chip, improves patch yield and efficiency, and improves display uniformity from the root, avoids moire.

Description

Technical Field

[0001] This utility model belongs to the field of display screen technology, specifically relating to a backlight module for a Mini-LED display screen. Background Technology

[0002] Mini-LED, as a new generation of backlight technology, integrates tens of thousands of micron-sized LED chips into the backlight module, achieving high brightness, high contrast, and fine dynamic local dimming, significantly improving the picture quality of LCD screens.

[0003] However, while existing Mini-LED backlight modules have improved performance, they also face several technical challenges. First, high-density LED chips generate a lot of heat during operation. Poor heat dissipation can lead to chip light decay and color shift, shortening product lifespan. Second, when performing local dimming, the boundary between bright and dark areas is prone to a visible "halo" effect due to insufficient light diffusion, affecting the viewing experience. Furthermore, the chip mounting process requires extremely high mounting precision. Even slight positional deviations can lead to decreased display uniformity and moiré patterns. Utility Model Content

[0004] To address the above issues and overcome the shortcomings of existing technologies, this invention provides a backlight module for a Mini-LED display. This backlight module utilizes interconnected bottom-layer heat conduction paths via insulating thermally conductive adhesive, and works in conjunction with a composite heat dissipation mechanism to construct a highly efficient multi-level heat dissipation system. This system can quickly and evenly dissipate the heat generated by the Mini-LED chips, ensuring long-term stable operation and extended lifespan of the module. Initial light mixing is achieved through the air gap between the microstructure diffuser plate and the chip mounting plate, followed by controllable secondary scattering and guidance via an array of microlenses, effectively suppressing halo effects. Furthermore, the positioning groove provides a physical reference for the die bonding process of the Mini-LED chips, improving chip bonding yield and efficiency, and fundamentally improving display uniformity, thus avoiding moiré patterns.

[0005] A backlight module for a Mini-LED display screen, comprising:

[0006] metal substrate(1);

[0007] The chip mounting board (2) is attached to one side of the metal substrate (1) by insulating thermally conductive adhesive (6), and the chip mounting board (2) is provided with a driving circuit.

[0008] Multiple positioning grooves (3) are equidistantly provided on the side of the chip mounting plate (2) away from the metal substrate (1);

[0009] Multiple Mini-LED chips (4), each of the Mini-LED chips (4) is die-bonded in a corresponding positioning groove (3) and electrically connected to the driving circuit on the chip mounting board (2);

[0010] A microstructure diffusion mechanism (5) is disposed on the side of the chip mounting plate (2) away from the metal substrate (1) for mixing and diffusing the light emitted by the Mini-LED chip (4);

[0011] A composite heat dissipation mechanism (7) is disposed on the side of the metal substrate (1) away from the chip mounting plate (2).

[0012] Preferably, the microstructure diffusion mechanism (5) includes a microstructure diffusion plate (501), an array of microlenses (502), and a breathable frame (503). The array of microlenses (502) is embedded inside the microstructure diffusion plate (501), and the position and arrangement of the array of microlenses (502) correspond to the Mini-LED chip (4).

[0013] Preferably, the breathable frame (503) is fixedly connected to the periphery of the chip mounting plate (2) and fixedly connected to the microstructure diffusion plate (501), thereby forming a defined air gap between the microstructure diffusion plate (501) and the chip mounting plate (2).

[0014] Preferably, the composite heat dissipation mechanism (7) includes a heat-conducting metal plate (701) and a heat-conducting pipe (702) embedded inside the heat-conducting metal plate (701).

[0015] Preferably, the heat-conducting metal plate (701) and heat-conducting pipe (702) in the composite heat dissipation mechanism (7) are both tightly attached to the side of the metal substrate (1) away from the chip mounting plate (2).

[0016] The beneficial effects of the above technical solution are as follows:

[0017] The backlight module of this Mini-LED display uses a bottom-level heat conduction path that connects the metal substrate and the chip mounting plate through insulating thermally conductive adhesive. This, combined with a composite heat dissipation mechanism, creates a highly efficient multi-level heat dissipation system. This system quickly and evenly dissipates the heat generated by the Mini-LED chips, ensuring long-term stable operation and extending the module's lifespan. Initial light mixing occurs through the air gap between the microstructure diffuser plate and the chip mounting plate, followed by controllable secondary scattering and guidance via an array of microlenses. This significantly enhances the lateral diffusion of light, resulting in smooth light transitions between different dimming zones and effectively suppressing halo effects. Furthermore, the positioning grooves provide a physical reference for the die-bonding process of the Mini-LED chips, ensuring the relative positional accuracy between tens of thousands of chips, improving chip bonding yield and efficiency, and fundamentally improving display uniformity, avoiding moiré patterns, and making the display easier to use. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram showing the disassembled state of the microstructure diffusion mechanism and the composite heat dissipation mechanism of this utility model;

[0020] Figure 3 This is a schematic diagram of the overall disassembled state of this utility model.

[0021] In the figure: 1. Metal substrate; 2. Chip mounting board; 3. Positioning groove; 4. Mini-LED chip; 5. Microstructure diffusion mechanism; 501. Microstructure diffusion plate; 502. Array microlens; 503. Breathable frame; 6. Insulating thermally conductive adhesive; 7. Composite heat dissipation mechanism; 701. Thermally conductive metal plate; 702. Heat pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This embodiment provides a backlight module for a Mini-LED display screen, as shown in the attached diagram. Figure 1-3As shown, the device includes a metal substrate 1, one side of which is bonded with an insulating thermally conductive adhesive 6, and a chip mounting board 2 containing a driving circuit is bonded to the insulating thermally conductive adhesive 6. The chip mounting board 2 has multiple positioning grooves 3 equidistantly opened on the side away from the metal substrate 1, and Mini-LED chips 4 are die-bonded inside the positioning grooves 3. Each positioning groove 3 has a Mini-LED chip 4 die-bonded inside, and each Mini-LED chip 4 is electrically connected to the driving circuit on the chip mounting board 2.

[0024] In one alternative embodiment, multiple positioning grooves 3 are equidistantly formed on the side of the chip mounting board 2 by CNC machining or etching. A Mini-LED chip 4 is die-bonded in each positioning groove 3 using surface mount technology, and each Mini-LED chip 4 is electrically connected to the driving circuit on the chip mounting board 2 by solder. These positioning grooves 3 ensure the positional accuracy of all Mini-LED chips 4 during mounting.

[0025] A microstructure diffusion mechanism 5 for eliminating halo is provided on the side of the chip mounting board 2 away from the metal substrate 1. The microstructure diffusion mechanism includes a microstructure diffusion plate 501, an array of microlenses 502 and a breathable frame 503. The array of microlenses 502 is embedded inside the microstructure diffusion plate 501 and each microlens corresponds to a Mini-LED chip 4 on the chip mounting board 2. The size and arrangement of these array of microlenses 502 are optimized by optical software to match the spacing and emission angle of the Mini-LED.

[0026] Furthermore, the ventilated frame 503 is fixedly connected to the outer periphery of the chip mounting plate 2 away from the metal substrate 1. The ventilated frame 503 can ensure that all Mini-LED chips 4 have good ventilation and heat dissipation effect during long-term operation, so that the heat generated by the Mini-LED chips 4 can be discharged outward from the holes around the ventilated frame 503, thereby effectively improving the heat dissipation effect of the backlight module and avoiding the overall operation effect due to excessive heat generation. The microstructure diffuser plate 501 is fixedly connected to the side of the ventilated frame 503 away from the chip mounting plate 2. The microstructure diffuser plate 501 and the Mini-LED lamp 4 are supported by a ring of ventilated frame 503, forming a defined air gap.

[0027] The air gap provides space for the light to mix for the first time, while the arrayed microlenses 502 controllably scatter and guide the light for a second time, greatly improving the light diffusion capability in the lateral direction. This makes the light transition at the edge of each dimming zone smoother and effectively suppresses the halo phenomenon under local dimming. Moreover, this structure can reduce or optimize the need for the upper diffusion film and brightness enhancement film, simplify the film structure, and reduce costs.

[0028] A composite heat dissipation mechanism 7 is provided on the side of the metal substrate 1 away from the chip mounting plate 2, which can improve the overall heat dissipation effect of the backlight module. The composite heat dissipation mechanism 7 includes a thermally conductive metal plate 701 and a heat-conducting pipe 702. The heat-conducting pipe 702 is embedded inside the thermally conductive metal plate 701 in a bent arrangement. The thermally conductive metal plate 701 is fixedly connected to the side of the metal substrate 1 away from the chip mounting plate 2. Both the thermally conductive metal plate 701 and the heat-conducting pipe 702 are fully attached to the side of the metal substrate 1.

[0029] In one alternative embodiment, the composite heat dissipation mechanism 7 can be tightly bonded to the metal substrate 1 by means of high thermal conductivity adhesive or welding. The composite heat dissipation mechanism 7 provides an efficient heat dissipation solution for extreme high brightness applications, and conducts heat to the display housing or heat sink more efficiently, ensuring the stability of the module under long-term high load.

[0030] In summary, the usage steps for the backlight module of this Mini-LED display are as follows:

[0031] 1. Prepare a chip mounting board 2 with a driving circuit, and process positioning grooves 3 on it;

[0032] 2. Using high-precision SMT equipment, Mini-LED chips 4 are die-bonded one by one into the corresponding positioning grooves 3 and soldered; 3. The chip mounting board 2 with the chips attached is attached to the metal substrate 1 by using insulating thermal conductive adhesive 6, and the composite heat dissipation mechanism 7 is fixed to the back of the metal substrate 1 by using high thermal conductivity adhesive or soldering.

[0033] 4. Fix the ventilated frame 503 around the chip mounting plate 2, and finally install the microstructure diffuser plate 501 on the ventilated frame 503 to complete the assembly of the entire backlight module.

[0034] The above description is only for illustrating the present utility model. It should be understood that the present utility model is not limited to the above embodiments, and various modifications that conform to the concept of the present utility model are within the protection scope of the present utility model.

Claims

1. A backlight module for a Mini-LED display screen, characterized in that, include: metal substrate(1); The chip mounting board (2) is attached to one side of the metal substrate (1) by insulating thermally conductive adhesive (6), and the chip mounting board (2) is provided with a driving circuit. Multiple positioning grooves (3) are equidistantly provided on the side of the chip mounting plate (2) away from the metal substrate (1); Multiple Mini-LED chips (4), each of the Mini-LED chips (4) is die-bonded in a corresponding positioning groove (3) and electrically connected to the driving circuit on the chip mounting board (2); A microstructure diffusion mechanism (5) is disposed on the side of the chip mounting plate (2) away from the metal substrate (1) for mixing and diffusing the light emitted by the Mini-LED chip (4); A composite heat dissipation mechanism (7) is disposed on the side of the metal substrate (1) away from the chip mounting plate (2).

2. The backlight module of a Mini-LED display screen according to claim 1, characterized in that: The microstructure diffusion mechanism (5) includes a microstructure diffusion plate (501), an array of microlenses (502), and a breathable frame (503). The array of microlenses (502) is embedded inside the microstructure diffusion plate (501), and the position and arrangement of the array of microlenses (502) correspond to the Mini-LED chip (4).

3. The backlight module of a Mini-LED display screen according to claim 2, characterized in that: The breathable frame (503) is fixedly connected to the periphery of the chip mounting plate (2) and fixedly connected to the microstructure diffusion plate (501), thereby forming a defined air gap between the microstructure diffusion plate (501) and the chip mounting plate (2).

4. The backlight module of a Mini-LED display screen according to claim 1, characterized in that: The composite heat dissipation mechanism (7) includes a heat-conducting metal plate (701) and a heat-conducting pipe (702) embedded inside the heat-conducting metal plate (701).

5. The backlight module of a Mini-LED display screen according to claim 1, characterized in that: The heat-conducting metal plate (701) and heat-conducting pipe (702) in the composite heat dissipation mechanism (7) are both closely attached to the side of the metal substrate (1) away from the chip mounting plate (2).

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