A lamp panel and display device

Abstract

The application relates to the technical field of display, and specifically discloses a lamp panel and a display device. The lamp panel comprises a plurality of light emitting units, each of which comprises a plurality of light emitting chips, at least two of the plurality of light emitting chips are used for emitting light rays of different colors, and each light emitting chip is provided with a positive electrode pin and a negative electrode pin. Wherein, the positive electrode pin and the negative electrode pin of each light emitting chip are arranged along a first direction, and the plurality of light emitting chips are arranged into two columns along the first direction, wherein the number of light emitting chips in one column is at least one, and the number of light emitting chips in the other column is at least two. At least part of the cross-wire assembly is arranged corresponding to one column of the two columns of light emitting chips with at least two light emitting chips, and the cross-wire assembly is located on the side of the corresponding column of light emitting chips far away from the other column. The cross-wire assembly is configured to connect the top layer conductive connection part between other top layer conductive connection parts along the first direction to a driving chip or a power supply wiring group.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a light panel and display device. Background Technology

[0002] As people's demands for home audio-visual entertainment experiences continue to increase, they are placing higher demands on the clarity, color, and realism of images on display devices such as televisions.

[0003] Display devices typically include a display panel capable of displaying image information. The display panel may include a backlight board, which serves as the light source for the display panel. The backlight board may include a substrate and multiple light-emitting units disposed on the substrate. The backlight board may also include power traces disposed on the substrate and connected to the light-emitting units for supplying power to the light-emitting units.

[0004] Each light-emitting unit comprises multiple light-emitting chips, at least two of which emit light of different colors, thereby improving the color gamut of the display panel. Different colored light-emitting chips achieve different light effects through color mixing, but uneven chip arrangement may prevent different colors of light from fully blending during propagation, resulting in some colors being too strong and others too weak, ultimately leading to poor color mixing and affecting the color uniformity and accuracy of the light emitted from the lamp panel. Utility Model Content

[0005] This application discloses a lamp board and display device, in which multiple light-emitting chips in the same light-emitting unit can be arranged more densely, and it is convenient to route the light-emitting chips in the same column.

[0006] To achieve the above objectives, in a first aspect, some embodiments of this application provide a lamp board, comprising: a circuit board, the circuit board including: a substrate; a top conductive connection portion disposed on the substrate; an insulating layer covering the side of the top conductive connection portion away from the substrate; and multiple light-emitting units, each light-emitting unit including: multiple light-emitting chips disposed on the circuit board, at least two of the multiple light-emitting chips emitting light of different colors, each light-emitting chip having a positive electrode pin and a negative electrode pin; a driving chip connected to the negative electrode pin of the multiple light-emitting chips for driving the multiple light-emitting chips to emit light; a power supply trace group disposed between the substrate and the insulating layer, the power supply trace group being connected to the positive electrode pin of the multiple light-emitting chips through the top conductive connection portion; and a ground trace group disposed between the substrate and the insulating layer, the ground trace group being electrically connected to the driving chip; the top conductive connection portion having multiple portions, and the multiple top conductive connection portions forming multiple conductive connection groups, each... The conductive connection group includes two paired top conductive connection portions. Each top conductive connection portion in the conductive connection group corresponds one-to-one with each of the light-emitting chips, and the two top conductive connection portions of each conductive connection group are respectively soldered to the positive and negative pins of the light-emitting chips. The positive and negative pins of each light-emitting chip are arranged along a first direction, and the plurality of light-emitting chips are arranged in two columns along the first direction. The number of light-emitting chips in one column is at least one, and the number of light-emitting chips in the other column is at least two. The top conductive connection portions of the conductive connection group corresponding to the light-emitting chips in the same column are spaced apart along the first direction. A cross-line assembly is provided, at least a portion of which corresponds to a column of light-emitting chips with at least two light-emitting chips. The cross-line assembly is located on the side of the corresponding column of light-emitting chips away from the other column. The cross-line assembly is configured to connect the top conductive connection portions located between other top conductive connection portions along the first direction to the driver chip or the power trace group.

[0007] In this way, the light-emitting chips of different colors are arranged in two staggered rows in space, which shortens the mixing distance of each color light. After the light is emitted, it can be quickly fused through the optical film layer, reducing the local color imbalance caused by spatial isolation, and making the overall output of the synthesized light of the light-emitting unit more stable in color accuracy.

[0008] When there are at least two light-emitting chips in a column, if the pins of the light-emitting chips located between other light-emitting chips along the first direction are directly routed, they are prone to interfering with the traces of the edge light-emitting chips within the column. For example, the trace of the negative electrode pin in the middle needs to merge with the trace of the negative electrode pin at the edge, but the trace of the positive electrode pin in the middle needs to merge with the trace of the positive electrode pin at the other edge, so the traces of the negative electrode pin and the positive electrode pin in the middle will intersect. However, the crossover assembly can lead the traces of the top conductive connection (whether positive or negative) corresponding to the pin located between other pins along the first direction out from the outside of the column (the side away from the other column), and allow the trace of the positive electrode pin in the middle to extend to one edge through the crossover assembly, and the trace of the negative electrode pin in the middle to extend to the other edge through the crossover assembly, thus achieving spatial separation of the positive and negative electrode traces. This avoids wiring intersections, ensures that the circuits of each positive and negative pin are independently connected (positive pins are connected to the power supply wiring group, and negative pins are connected to the driver chip), and does not occupy the color mixing space between the two columns. While maintaining the advantages of multi-column color mixing, it provides a regular wiring path for high-density chip layout, taking into account both the optical performance of the lamp board and the reliability of the circuit.

[0009] As an optional implementation, the crossover assembly includes at least one bridging structure disposed on the circuit board. The bridging structure includes at least two input terminals and at least two output terminals, with each input terminal and each output terminal corresponding to one another. Each top-layer conductive connection portion located in the middle along the first direction is respectively connected to each input terminal, so that the top-layer conductive connection portion corresponding to the positive pin can be connected to the power supply trace group from one side of the bridging structure through the output terminal, and the top-layer conductive connection portion corresponding to the negative pin can be connected to the driver chip from the other side of the bridging structure through the output terminal.

[0010] When the number of LED chips in a column is greater than or equal to two, the pins arranged along the first direction have at least four pins. If the top conductive connection corresponding to the pin (at least one positive pin and one negative pin) located between other pins in this column along the first direction is directly connected to the power supply trace group and the driver chip, it will interfere with the traces of the top conductive connection corresponding to the edge pins in this column.

[0011] After the trace corresponding to the top conductive connection of the central positive pin is connected to the positive input terminal of the bridging structure, it is led out from the side of the power trace group corresponding to the edge positive pin through the internal circuit design of the bridging structure, and finally connected to the power trace group. After the top conductive connection corresponding to the central negative pin is connected to the negative input terminal of the bridging structure, it is led out from the side of the driver chip corresponding to the edge negative pin, and finally connected to the driver chip. The bridging structure connects these top conductive connections in the middle to the input terminal of the bridging structure, and the input terminal and the output terminal correspond one-to-one, ensuring that each trace has a dedicated access channel and avoiding circuit confusion.

[0012] As an optional implementation, the positive pins of the light-emitting chips located in the same column point in the same direction to the negative pins.

[0013] The positive and negative pins of LEDs located in the same column along the first direction are on the same side. This ensures that two pins at the edge of the same column are one positive and one negative, facilitating the separation of positive and negative electrodes. The traces corresponding to the negative pins in the middle extend to the negative side via a crossover assembly, and the traces corresponding to the positive pins in the middle extend to the positive side via a crossover assembly. This avoids the need for crossovers on the traces corresponding to the edge pins if they are of the same polarity. Simultaneously, this regular arrangement of pins within the column facilitates the installation of the LEDs.

[0014] As an optional implementation, each light-emitting unit contains three light-emitting chips, each capable of emitting light of a different color. Two of the light-emitting chips are arranged in a first column along the first direction, and the third light-emitting chip is arranged in a second column along the first direction. The bridging structure is disposed on the side of the first column of light-emitting chips facing away from the second column. The bridging structure includes a pair of first input terminals and a first output terminal, as well as a pair of second input terminals and a second output terminal. The negative electrode pin corresponding to the top conductive connection portion of the first column of light-emitting chips, located between other pins along the first direction, is... The corresponding top conductive connection portion is connected to the first input terminal, the first output terminal is used to connect to the driver chip, and the first output terminal is closer to the driver chip corresponding to the other negative electrode pin in the first column of light-emitting chips than the second output terminal; the top conductive connection portion corresponding to the positive electrode pin located between other pins along the first direction in the top conductive connection portion of the first column of light-emitting chips is connected to the second input terminal, the second output terminal is used to connect to the power supply trace group, and the second output terminal is closer to the power supply trace group corresponding to the other positive electrode pin in the first column of light-emitting chips than the first output terminal.

[0015] In this way, the light from the second column of chips can be diffused simultaneously towards the upper and lower chips in the first column, which greatly shortens the mixing distance of the three colors of light, avoids the crossing of the wiring corresponding to the middle pin of the first column, ensures that the circuits of each positive and negative pin are independently connected, and does not occupy the color mixing space between the two columns. While maintaining the advantages of multi-column color mixing, it provides a regular wiring path for high-density chip layout, taking into account both the optical performance and circuit reliability of the lamp board.

[0016] As an optional implementation, each light-emitting unit contains four light-emitting chips, and one of the light-emitting chips can emit light of the same color as one of the other three light-emitting chips; two of the light-emitting chips are arranged in a third column along the first direction, and the other two light-emitting chips are arranged in a fourth column along the first direction, and the light-emitting chips in the third and fourth columns are correspondingly arranged along a second direction, which is perpendicular to the first direction; the at least one bridging structure includes: a first bridging structure disposed on the side of the third column away from the fourth column; and a second bridging structure disposed on the side of the fourth column away from the third column.

[0017] Thus, the dual-bridge structure, with one bridge on each side (one on the outer side of the third and fourth columns), solves the problem of interference between the middle pins of the two columns. The dual-bridge structure provides independent routing paths for the interfering traces in each column. The traces of the middle pins in the third column are led out from the side opposite to the fourth column through the first bridge structure, while the traces of the middle pins in the fourth column are led out from the side opposite to the third column through the second bridge structure. The traces in the two columns are completely separated in space, avoiding both intra-column crossing and inter-column interference, ensuring independent driving of each chip.

[0018] As an optional implementation, the cross-line assembly includes: a bottom conductive connection portion disposed on the side of the substrate opposite to the top conductive connection portion; and two vias passing through the substrate along the thickness direction of the circuit board and located on the side of one column having at least two light-emitting chips away from the other column, so that the conductive connection portion located in the middle along the first direction corresponding to the positive electrode pin or the negative electrode pin is electrically connected to the bottom conductive connection portion through one of the vias, and the bottom conductive connection portion is connected to the top conductive connection portion corresponding to the electrode pin located at the edge along the first direction and having the same electrode through the other via.

[0019] When there are at least two LEDs in a row, the positive and negative pins in the middle will only intersect if they are only traces on the same layer. The combination of the bottom conductive connection and vias provides a "detour path" for the middle chip traces. The trace connected to the top conductive connection of one of the middle pins is led through a via to the bottom conductive connection, extends laterally through the bottom conductive connection, and then returns to the same polarity side of the top edge chip through another via. This three-dimensional routing allows the same polarity traces in the middle and at the edge to converge on one side, spatially avoiding the possibility of top layer trace crossing and preventing short circuits or signal crosstalk risks.

[0020] As an optional implementation, each column of light-emitting chips has at least two light-emitting chips, and each column has two vias on the side opposite to the other column.

[0021] In this way, the problem of interference between the middle pins of the two columns is effectively solved. The vias on both sides provide independent routing paths for the interference between the two columns of routing. The routing of the middle pin of the third column is led out from the side away from the fourth column through the first bridging structure, and the routing of the middle pin of the fourth column is led out from the side away from the third column through the second bridging structure. The routing of the two columns is completely separated in space, which avoids crossing within the column and prevents line interference between the two columns, ensuring that each chip is driven independently.

[0022] As an optional implementation, two light-emitting units are connected in series to form a light-emitting group, and there are multiple light-emitting groups, each of which is connected to the driver chip and the power supply wiring group respectively.

[0023] In this way, the same color light-emitting chips of two series-connected light-emitting units are connected in series and share the driving circuit, reducing the number of traces and the occupation of the driving chip interface, and optimizing the circuit layout. At the same time, multiple light-emitting groups work independently, which can realize zone control (such as different light-emitting groups outputting different brightness or color temperature), and improve the adaptability of the lamp board to local dimming of display devices. In addition, the group design ensures that the failure of a single light-emitting group does not affect the operation of the entire lamp board, enhancing reliability. The modular structure facilitates mass production and maintenance, and while ensuring the multi-color mixing effect, it also takes into account circuit simplification and functional expandability.

[0024] As an alternative implementation, a positive pin of one of the light-emitting units in one of the light-emitting groups can be connected to the negative pin of a light-emitting chip of the same color in another light-emitting unit via the cross-wire assembly.

[0025] In this way, the cross-line component eliminates the need for additional redundant traces in the series path of the two light-emitting units. The current signal transmission is completed by using bridging or via structures, effectively avoiding cross-interference between the series line and other pin traces. At the same time, this series connection method achieved through the cross-line component makes it easier for the driver chip to uniformly regulate the current of light-emitting chips of the same color in the light-emitting group.

[0026] Secondly, embodiments of this application also provide a display device, the display device including a backlight module, the backlight module including: a lamp panel as described in any of the first aspects; an optical film layer disposed on the light-emitting side of the lamp panel; and a liquid crystal panel disposed on the side of the optical film layer away from the lamp panel.

[0027] This ensures both uniform light mixing of different color chips (avoiding color layering in single-column arrangements) and independent and stable circuitry for each chip (eliminating short circuits or brightness fluctuations caused by wiring intersections). As the core of the backlight module in a display device, the lamp board outputs uniform multi-color synthesized light, which, after optimization by optical films, provides a consistent and stable backlight foundation for the LCD panel. This effectively reduces local color shifts and flickering in the displayed image, improving color accuracy and visual comfort.

[0028] Compared with the prior art, the beneficial effects of this application are at least as follows:

[0029] The lamp board provided in this application embodiment can avoid wiring intersections, ensure that the circuits of each positive and negative pin are independently connected (positive pins are connected to the power supply wiring group, and negative pins are connected to the driver chip), and does not occupy the color mixing space between the two columns. While maintaining the advantages of multi-column color mixing, it provides a regular wiring path for high-density chip layout, taking into account both the optical performance and circuit reliability of the lamp board. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application;

[0032] Figure 2 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application;

[0033] Figure 3 Schematic block diagrams of the structure of a display device provided in some embodiments of this application;

[0034] Figure 4 This is a schematic diagram of the structure of the lamp panel provided in some embodiments of this application;

[0035] Figure 5 A simplified structural diagram of a circuit board provided in some embodiments of this application;

[0036] Figure 6 A schematic diagram of a light-emitting unit including three light-emitting chips and their corresponding bridging structure provided for some embodiments of this application;

[0037] Figure 7 A schematic diagram of a light-emitting unit including four light-emitting chips and their corresponding conductive connections, provided for some embodiments of this application;

[0038] Figure 8 This is a schematic diagram of the structure of conductive connection parts, windows and pins provided in some embodiments of this application;

[0039] Figure 9 A schematic diagram of a light-emitting unit including four light-emitting chips and their corresponding bridging structure provided for some embodiments of this application;

[0040] Figure 10 for Figure 9 A magnified view of a section at point A in the middle;

[0041] Figure 11 Another simplified structural diagram of the circuit board provided in some embodiments of this application;

[0042] Figure 12 A schematic diagram of a light-emitting unit including four light-emitting chips and their corresponding vias, provided for some embodiments of this application;

[0043] Figure 13 This is a schematic diagram of the structure of a light-emitting group provided in some embodiments of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100 - Lamp board; 101 - Power supply circuit; 110 - Circuit board; 111 - Substrate; 111a - Via; 1111 - First via; 1112 - Second via; 1113 - Third via; 1114 - Fourth via; 112 - Conductive connection group; 1121 - Top layer conductive connection; 1122 - Bottom layer conductive connection; 113 - Insulating layer; 1131 - Window; 121 - First light-emitting unit; 122 - Second light-emitting unit; 123 - Light-emitting unit; 123a - Light-emitting chip; 123b - Positive pin; 123c - Negative pin; 1231 - First light-emitting chip; 1232 - Second light-emitting chip; 1233 - Third light-emitting chip; 1234 - Fourth light-emitting chip; 130 - Driver chip; 140 - Power supply Line group; 150-Grounding wiring group; 160-Crossing assembly; 161-Bridging structure; 1611-First incoming terminal; 1612-First outgoing terminal; 1613-Second incoming terminal; 1614-Second outgoing terminal; 162-First bridging structure; 163-Second bridging structure; 171-First negative terminal wiring segment; 172-Second negative terminal wiring segment; 173-First positive terminal wiring segment; 174-Second positive terminal wiring segment; 200-Display device; 201-Main board; 202-Central control board; 203-Driver board; 210-Display panel; 211-Backlight module; 2111-Optical film layer; 212-LCD panel; 212a-Liquid crystal molecule; 213-Color filter; 220-Housing; 230-Bracket; X-First direction; Y-Second direction. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0048] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0049] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0050] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0051] As people's demands for home audio-visual entertainment experiences continue to increase, they are placing higher demands on the clarity, color, and realism of images on display devices such as televisions. Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application. For example... Figure 1 As shown, an embodiment of this application provides a display device 200, which has an image display function.

[0052] The display device 200 can be a television, laptop computer, tablet computer, in-vehicle computer, smartphone, smartwatch, projection device, head-up display (HDU), augmented reality (AR) glasses, etc. The embodiments of this application do not further limit the specific form of the display device 200.

[0053] like Figure 1 As shown, the display device 200 may include a display panel 210 and a housing 220. The display panel 210 is used to display image information. The display panel 210 may be a light-emitting diode (LED) display panel, for example, the display panel 210 may be at least one of a micro light-emitting diode (Micro LED) display panel and a mini light-emitting diode (Mini LED) display panel.

[0054] Understandably, Mini LED and Micro LED display panels have advantages such as self-illumination, high brightness, high contrast, high resolution, high color saturation, long lifespan, fast response speed, and low power consumption.

[0055] The display panel 210 includes a light-emitting side and a backlight side disposed opposite to each other. The housing 220 is disposed on the backlight side and connected to the display panel 210, so that the housing 220 can protect the display panel 210 and reduce the impact of the housing 220 on the light emitting side of the display panel 210.

[0056] The housing 220 can be connected to the display panel 210 by snap-fit ​​or by adhesive bonding. The embodiments of this application do not further limit this.

[0057] For example, such as Figure 1 As shown, the display device 200 may also include a bracket 230, which is located on one side of the housing 220 and connected to the housing 220, serving to support the housing 220 and the display panel 210.

[0058] Figure 2 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application. The display panel 210 is described below as an example.

[0059] In some examples, such as Figure 2 The display panel 210 includes a backlight module 211 and a liquid crystal panel 212. That is, the display device 200 includes a backlight module 211 and a liquid crystal panel 212.

[0060] The backlight module 211 includes a lamp panel 100 and an optical film layer 2111. Understandably, the lamp panel 100 serves as the light source for the display panel 210, and includes multiple light-emitting units capable of emitting light. The light-emitting side of the lamp panel 100 is the light-emitting side of the display panel 210. The optical film layer 2111 is disposed on the light-emitting side of the lamp panel 100, allowing the light emitted from the lamp panel 100 to pass through the optical film layer 2111, thereby enabling the optical film layer 2111 to perform optical processing on the light emitted from the lamp panel 100.

[0061] For example, the number of optical film layers 2111 can be one or more. When the number of optical film layers 2111 is multiple, the multiple optical film layers 2111 can be stacked on the light-emitting side of the lamp panel 100. The optical film layer 2111 can include at least one of a light-diffusing sheet, a prism sheet, and a diffuser sheet. Understandably, the light-diffusing sheet is used to uniformly distribute light, the prism sheet is used to refract or reflect light to improve the brightness of the display panel 210, and the diffuser sheet is used to diffuse the light.

[0062] It is understood that the optical film layer 2111 may also include other light processing films besides light sheets, prism sheets and diffusers. The embodiments of this application do not further limit the specific form of the optical film layer 2111.

[0063] Continue to refer to Figure 2 In some examples, the liquid crystal panel 212 is disposed on the side of the optical film layer 2111 away from the lamp panel 100. For example, the liquid crystal panel 212 may include a liquid crystal driving circuit (not shown) and a plurality of liquid crystal molecules 212a. The liquid crystal driving circuit can apply a voltage to the liquid crystal molecules 212a, so that the liquid crystal molecules 212a can be deflected to transmit or block the light emitted by the backlight module 211.

[0064] Continue to refer to Figure 2 For example, the display device 200 may also include a color filter 213, which is disposed on the side of the liquid crystal panel 212 away from the backlight module 211. The color filter 213 has red pixel blocks, green pixel blocks and blue pixel blocks, where the red pixel blocks are used to transmit red light, the green pixel blocks are used to transmit green light and the blue pixel blocks are used to transmit blue light.

[0065] Understandably, the light passing through the color filter 213 is red, green and blue light of different intensities, enabling the display panel 210 to achieve full-color display.

[0066] Figure 3 This is a schematic block diagram illustrating the structure of a display device provided in some embodiments of this application. Referring below... Figure 3 An example is given to illustrate the method of displaying images on the display panel 210.

[0067] For example, such as Figure 3 As shown, the display device 200 may include a motherboard 201, a central control board 202, and a driver board 203. The motherboard 201, the central control board 202, and the driver board 203 are respectively disposed within the receiving space enclosed by the housing 220.

[0068] The motherboard 201, the central control board 202, and the driver board 203 may include at least one of printed circuit board (PCB), flexible printed circuit board (FPC), and flexible printed circuit board (FPCB). The specific forms of the motherboard 201, the central control board 202, and the driver board 203 may be the same or different, and the embodiments of this application do not further limit them.

[0069] For example, the display device 200 may also include a main chip, a backlight control chip (bcon chip), and a timing control chip (tcon chip, timing controller). The main chip is located on the motherboard 201, the backlight control chip is located on the central control board 202, and the timing control chip is located on the driver board 203.

[0070] Alternatively, the display device 200 may only include the motherboard 201, with the main chip, backlight control chip, and timing control chip all located on the motherboard. This application's embodiments use the example of the display device 200 including the motherboard 201, central control board 202, and driver board 203 as an example for further illustration.

[0071] Continue to refer to Figure 3 For example, the motherboard 201 is connected to the central control board 202 and the driver board 203 respectively, so that the main chip can transmit signals to the backlight control chip and the timing control chip respectively.

[0072] For example, the main chip can receive external video sources and decode them. After decoding the video source, the main chip can send some data to the timing control chip. The timing control chip is connected to the liquid crystal driving circuit of the liquid crystal panel 212, enabling the timing control chip to control the deflection of the liquid crystal molecules 212a.

[0073] The main chip can send another part of the data to the backlight control chip. The backlight control chip is connected to the driver chip 130, and the driver chip 130 is connected to the light-emitting unit 123, so that the backlight control chip can control the light-emitting unit 123 to emit light through the driver chip 130.

[0074] Continue to refer to Figure 3 The display device 200 also includes a power supply circuit 101, which is connected to the light-emitting unit 123 and is used to supply power to the light-emitting unit 123. The driver chip 130 can receive the light-emitting state of the light-emitting unit 123 and generate a first feedback signal based on the light-emitting state of the light-emitting unit 123, feeding the first feedback signal back to the backlight control chip. The backlight control chip can generate a second feedback signal based on the first feedback signal and feed the second feedback signal back to the power supply circuit 101. The power supply circuit 101 can supply power to the light-emitting unit 123 based on the second feedback signal to achieve closed-loop control.

[0075] For example, the light-emitting unit 123 may include a plurality of light-emitting chips 123a, at least two of which are capable of emitting light of different colors.

[0076] Understandably, in order to simplify the structure of the accompanying drawings, Figure 3Only one light-emitting chip 123a is shown in the figure, and the number of light-emitting chips 123a in the light-emitting unit 123 is not limited.

[0077] When there are multiple light-emitting chips 123a in the light-emitting unit 123, the power supply circuit 101 can be connected to the multiple light-emitting chips 123a one-to-one through multiple power supply lines, or at least two light-emitting chips 123a can be connected to the power supply circuit 101 through the same power supply line.

[0078] Understandably, in order to simplify the structure of the accompanying drawings, Figure 3 Only one power supply trace connecting the light-emitting unit 123 and the power supply circuit 101 is shown in the diagram, and the number of power supply traces is not limited.

[0079] Each light-emitting unit 123 includes multiple light-emitting chips 123a, at least two of which emit light of different colors, thereby improving the color gamut of the display panel. Different colored light-emitting chips 123a achieve different light effects through color mixing, but uneven chip arrangement may prevent different colors of light from fully blending during propagation, resulting in some colors being too strong and others too weak, ultimately leading to poor color mixing and affecting the color uniformity and accuracy of the light emitted from the lamp panel.

[0080] However, when multiple light-emitting chips of the same light-emitting unit are arranged in multiple columns, the conductive connection part corresponding to the positive electrode pin is connected to the power supply trace group, and the conductive connection part corresponding to the negative electrode pin is connected to the driver chip. Therefore, the traces corresponding to the positive and negative electrode pins in the same column need to extend in different directions, and the traces connected to the corresponding top conductive connection part may interfere.

[0081] Based on this, the present application provides a light board in which the cross-line assembly can lead out the traces that are connected to the top conductive connection portions corresponding to the positive and negative pins respectively, located between other top conductive connection portions along the first direction, from both sides, thereby solving the problem of trace interference.

[0082] The present technical solution will be further described below with reference to the embodiments and accompanying drawings.

[0083] Please see Figure 5 , Figure 5 This is a simplified structural diagram of a circuit board 110 provided in some embodiments of this application. In a first aspect, embodiments of this application provide a lamp board 100, which includes a circuit board 110. The circuit board 110 typically includes a substrate 111, a top conductive connection portion 1121, and an insulating layer 113. The top conductive connection portion 1121 is disposed on the substrate 111, and the insulating layer 113 covers the side of the top conductive connection portion 1121 that is away from the substrate 111.

[0084] The substrate 111 is mostly a sheet-like substrate made of insulating material. It has a flat surface and a certain mechanical strength, which can support all components such as the top conductive connection part 1121, the light-emitting chip 123a, and the driving chip 130. It can prevent the circuit from being damaged or broken due to deformation caused by external forces. Its own insulation properties can isolate conductive structures of different layers (such as copper foil of double-sided or multi-layer boards), prevent short circuits, and ensure electrical safety. Some high thermal conductivity materials (such as ceramic substrates) can conduct the heat generated by the components during operation to the outside, avoiding local overheating that affects the life of the components.

[0085] A thin copper foil layer is attached to the surface of the substrate 111, which is etched into specific shapes (such as traces and pads). The insulating layer 113 of the circuit board 110 on the lamp board 100 is usually white solder resist (white oil), mainly used for solder protection and circuit insulation. By covering the circuit (thin copper foil layer), it prevents high temperatures from damaging components during soldering, and at the same time, it acts as insulation to avoid short circuits. White oil has good reflectivity; the higher the whiteness of the white oil, the better the reflectivity, and the higher the energy utilization rate, thus making the energy-saving effect more significant.

[0086] Normally, the area corresponding to the component pins (such as the positive and negative pins 123c of the light-emitting chip 123a) is soldered in the shape of a pad, and the remaining area is in the shape of a wire. In this embodiment, the top conductive connection 1121 is a copper foil area connected between the wire-shaped copper foil and the pad. The top conductive connection 1121 is configured to allow solder to flow on the top conductive connection 1121.

[0087] In some embodiments, combined with Figure 4 , Figure 6 and Figure 7 , Figure 6 This application provides a schematic diagram of a light-emitting unit 123 including three light-emitting chips 123a and its corresponding bridging structure 161, according to some embodiments. Figure 7 This is a schematic diagram of a light-emitting unit 123 including four light-emitting chips 123a and its corresponding top-layer conductive connection portion 1121 provided in some embodiments of this application. The lamp board 100 also includes multiple light-emitting units 123. Each light-emitting unit 123 includes multiple light-emitting chips 123a and is disposed on a circuit board 110. Each light-emitting chip 123a is provided with a positive electrode pin 123b and a negative electrode pin 123c. The positive electrode pin 123b and the negative electrode pin 123c of the light-emitting chip 123a are connected to the pad.

[0088] In some embodiments, the lamp board 100 further includes a driver chip 130, a power supply trace group 140, and a ground trace group 150. The driver chip 130 is connected to the negative pin 123c of a plurality of light-emitting chips 123a to drive the plurality of light-emitting chips 123a to emit light. The power supply trace group 140 and the ground trace group 150 are both formed by etching a thin copper foil layer and are both disposed between the substrate 111 and the insulating layer 113.

[0089] The driver chip 130 is the "core controller" in electronic devices such as the lamp board 100 that controls the operation of the light-emitting unit 123. It is usually connected to the negative pin 123c of the light-emitting chip 123a. It can receive external control signals and convert them into driving current, and accurately adjust the lighting, extinguishing and brightness of the light-emitting chip 123a. It can realize the coordinated operation of multiple light-emitting chips 123a, such as controlling the light emission sequence of different color chips to ensure the consistency of display or lighting effects.

[0090] The power trace assembly 140 is connected to the positive pins 123b of multiple light-emitting chips 123a via the top conductive connection portion 1121. The power trace assembly 140 includes multiple power traces connected to each light-emitting chip 123a, stably delivering external power to each light-emitting chip 123a, providing continuous and sufficient power support for chip illumination. During the design process, appropriate trace width and material must be matched according to the power requirements of the light-emitting chips 123a to reduce losses during power transmission and ensure that all light-emitting chips 123a can obtain stable operating voltage and current.

[0091] The grounding trace group 150 is electrically connected to the driver chip 130, which can form a stable potential reference point and ensure the stable operating voltage of the driver chip 130.

[0092] In some embodiments, combined with Figure 6 and Figure 7 The top conductive connection portion 1121 has multiple portions, and the multiple top conductive connection portions 1121 are spaced apart to form multiple conductive connection groups 112. Each conductive connection group 112 includes two pairs of top conductive connection portions 1121 that are arranged in pairs and spaced apart. The top conductive connection portions 1121 in each conductive connection group 112 are arranged in a one-to-one correspondence with each light-emitting chip 123a, that is, each conductive connection group 112 corresponds to one light-emitting chip 123a. The two top conductive connection portions 1121 of each conductive connection group 112 are respectively soldered to the positive electrode pin 123b and the negative electrode pin 123c in the light-emitting chip 123a.

[0093] In some embodiments, combined with Figure 8 , Figure 8This is a schematic diagram of the structure of conductive connection portion 1121, window 1131 and pin provided in some embodiments of this application. The insulating layer 113 is provided with a plurality of windows 1131. The windows 1131 and the top conductive connection portion 1121 are arranged one-to-one along the thickness direction of the circuit board 110, and the area of ​​the window 1131 is smaller than the area of ​​the corresponding top conductive connection portion 1121. Along the thickness direction of the circuit board 110, the top conductive connection portion 1121 corresponding to the area of ​​the window 1131 is a pad, that is, the exposed area of ​​the top conductive connection portion 1121. The positive electrode pin 123b and the negative electrode pin 123c are both soldered to the top conductive connection portion 1121 (pad) through the corresponding window 1131.

[0094] In some embodiments, combined with Figure 6 and Figure 7 The positive electrode pins 123b and negative electrode pins 123c of each light-emitting chip 123a are arranged along the first direction X. The multiple light-emitting chips 123a are arranged in two columns along the first direction X. The number of light-emitting chips 123a in one column is at least one, and the number of light-emitting chips 123a in the other column is at least two. The top conductive connection portion 1121 of the conductive connection group 112 corresponding to the same column of light-emitting chips 123a is arranged at intervals along the first direction X.

[0095] In this way, the light-emitting chips 123a of different colors are arranged in two staggered rows in space, which shortens the mixing distance of each color light. After the light is emitted, it can be quickly fused by the optical film layer 2111, reducing the local color imbalance caused by spatial isolation, and making the overall output of the synthesized light of the light-emitting unit 123 more stable in color accuracy.

[0096] In some embodiments, combined with Figure 6 , Figure 9 and Figure 12 , Figure 9 This application provides a schematic diagram of a light-emitting unit 123 including four light-emitting chips 123a and its corresponding bridging structure 161, according to some embodiments. Figure 12 This is a schematic diagram of a light-emitting unit 123 including four light-emitting chips 123a and their corresponding vias 111a provided in some embodiments of this application. The lamp board 100 also includes a cross-line assembly 160. At least a portion of the cross-line assembly 160 corresponds to a column of two light-emitting chips 123a having at least two light-emitting chips 123a. The cross-line assembly 160 is located on the side of the corresponding column of light-emitting chips 123a away from the other column. The cross-line assembly 160 is configured to connect the top conductive connection 1121 located between other top conductive connection portions 1121 along the first direction X to the driver chip 130 or the power supply trace group 140.

[0097] The distribution of the light-emitting chips 123a can be roughly divided into two cases. In the first case, there is one light-emitting chip 123a in one column and at least two light-emitting chips 123a in another column, and the cross-line component 160 is set in this column. In the second case, there are at least two light-emitting chips 123a in each column, and the cross-line component 160 is set in each column.

[0098] When there are at least two light-emitting chips 123a in a column, if the pins of the light-emitting chip 123a located between other light-emitting chips 123a along the first direction X are directly routed, they are prone to intersecting with the traces of the light-emitting chips 123a at the edge within the column. For example, the trace of the negative electrode pin 123c in the middle needs to merge with the trace of the negative electrode pin 123c at the edge, but the trace of the positive electrode pin 123b in the middle needs to merge with the trace of the positive electrode pin 123b at the other edge. Therefore, the traces of the negative electrode pin 123c and the positive electrode pin 123b in the middle will intersect. The crossover assembly 160 can lead the traces of the top conductive connection portion 1121 (whether positive or negative) corresponding to the pins located between other pins along the first direction X out from the outside of the column (the side away from the other column), and allow the trace of the middle positive pin 123b to extend to one side edge through the crossover assembly 160, and the trace of the middle negative pin 123c to extend to the other side edge through the crossover assembly 160, thus achieving spatial separation of positive and negative traces. In this way, trace crossing is avoided, ensuring that the circuits of each positive pin 123b and negative pin 123c are independently connected (positive pin 123b is connected to the power supply trace group 140, and negative pin 123c is connected to the driver chip 130), without occupying the color mixing space between the two columns. While maintaining the advantages of multi-column color mixing, it provides a regular wiring path for high-density chip layout, taking into account both the optical performance and circuit reliability of the lamp board 100.

[0099] It should be noted that the crossover component 160 can be any structure that can prevent circuit crossing after the traces corresponding to the negative pin 123c of the positive pin 123b intersect at this point. This embodiment does not limit this.

[0100] In some embodiments, combined with Figure 6 and Figure 9The cross-line assembly 160 includes at least one bridging structure 161 disposed on the circuit board 110. The bridging structure 161 includes at least two input terminals and at least two output terminals, with each input terminal and each output terminal corresponding to one another. Each top-layer conductive connection portion 1121 located in the middle along the first direction X is connected to each input terminal, so that the top-layer conductive connection portion 1121 corresponding to the positive terminal 123b can be connected to the power supply trace group 140 from one side of the bridging structure 161 through the output terminal, and the top-layer conductive connection portion 1121 corresponding to the negative terminal 123c can be connected to the driver chip 130 from the other side of the bridging structure 161 through the output terminal.

[0101] When the number of light-emitting chips 123a in a column is greater than or equal to two, there are at least four pins arranged along the first direction X. The top conductive connection portion 1121 corresponding to the pins located between other pins in this column along the first direction X (including at least one positive pin 123b and one negative pin 123c) will interfere with the traces of the top conductive connection portion 1121 corresponding to the edge pins in this column if it is directly connected to the power supply trace group 140 and the driver chip 130.

[0102] After the trace connected to the top conductive connection 1121 corresponding to the middle positive pin 123b is connected to the positive input terminal of the bridging structure 161, through the internal circuit design of the bridging structure 161, an output terminal is led out from the side of the power trace group 140 corresponding to the edge positive pin 123b, and finally connected to the power trace group 140. After the top conductive connection 1121 corresponding to the middle negative pin 123c is connected to the negative input terminal of the bridging structure 161, an output terminal is led out from the side of the driver chip 130 corresponding to the edge negative pin 123c, and finally connected to the driver chip 130. The bridging structure 161 connects these top conductive connections 1121 located in the middle to the input terminal of the bridging structure 161 respectively, and the input terminal and the output terminal are in a one-to-one correspondence, ensuring that each trace has a dedicated access channel and avoiding circuit confusion.

[0103] Among them, the bridging structure 161 is an existing bridging structure, which typically includes an insulating material layer, multiple conductive structures and multiple conductive leads, and will not be described in detail here.

[0104] In some embodiments, combined with Figure 6 and Figure 9 The positive pin 123b of each light-emitting chip 123a located in the same column points in the same direction to the negative pin 123c.

[0105] Along the first direction X, the positive pins 123b and negative pins 123c of the light-emitting chips 123a located in the same column are on the same side. This ensures that the two pins at the edge of the same column are one positive and one negative, facilitating the separation of positive and negative electrodes. The trace corresponding to the negative pin 123c in the middle extends to the negative side through the crossover assembly 160, and the trace corresponding to the positive pin 123b in the middle extends to the positive side through the crossover assembly 160. This avoids the two pins at the edge of the same column having the same polarity, which would require the traces corresponding to the edge pins to also be crossed. Simultaneously, this regular arrangement of the pins within the column facilitates the installation of the light-emitting chips 123a.

[0106] In some embodiments, combined with Figure 6 Each light-emitting unit 123 contains three light-emitting chips 123a, namely a first light-emitting chip 1231, a second light-emitting chip 1232, and a third light-emitting chip 1233. All three light-emitting chips 123a can emit light of different colors. Two of the light-emitting chips 123a (the first light-emitting chip 1231 and the second light-emitting chip 1232) are arranged in the first direction X as the first column, and the other light-emitting chip 123a (the third light-emitting chip 1233) is arranged in the second column along the first direction X.

[0107] The bridging structure 161 is disposed on the side of the first column of light-emitting chips 123a away from the second column of light-emitting chips 123a. The bridging structure 161 includes a first input terminal 1611 and a first output terminal 1612 arranged in pairs, and a second input terminal 1613 and a second output terminal 1614 arranged in pairs.

[0108] In the top conductive connection portion 1121 of the first column of light-emitting chips 123a, the top conductive connection portion 1121 corresponding to the negative electrode pin 123c located between other pins along the first direction X is connected to the first input terminal 1611, the first output terminal 1612 is used to connect to the driver chip 130, and the first output terminal 1612 is closer to the driver chip 130 corresponding to another negative electrode pin 123c in the first column of light-emitting chips 123a than the second output terminal 1614.

[0109] In the top conductive connection portion 1121 of the first column of light-emitting chips 123a, the top conductive connection portion 1121 corresponding to the positive electrode pin 123b located between other pins along the first direction X is connected to the second input terminal 1613, and the second output terminal 1614 is used to connect to the power supply wiring group 140. The second output terminal 1614 is closer to the power supply wiring group 140 corresponding to another positive electrode pin 123b in the first column of light-emitting chips 123a than the first output terminal 1612.

[0110] Specifically, the trace connected to the top conductive connection portion 1121 corresponding to the negative pin 123c of the first light-emitting chip 1231 is the first negative trace segment 171. The first negative trace segment 171 is connected to the first input terminal 1611, and the trace led out from the first output terminal 1612 is the second negative trace segment 172. The first negative trace segment 171 and the second negative trace segment 172 are electrically connected within the bridging structure 161. The trace connected to the top conductive connection portion 1121 corresponding to the positive pin 123b of the second light-emitting chip 1232 is the first positive trace segment 173. The first positive trace segment 173 is connected to the second input terminal 1613, and the trace led out from the second output terminal 1614 is the second positive trace segment 174. The first positive trace segment 173 and the second positive trace segment 174 are electrically connected within the bridging structure 161.

[0111] The light from the second column of chips can be diffused simultaneously towards the upper and lower chips in the first column, significantly shortening the mixing distance of the RGB three-color light. This avoids the wiring crossing of the corresponding pins in the middle of the first column, ensuring that the circuits of each positive pin 123b and negative pin 123c are independently connected, without occupying the color mixing space between the two columns. While maintaining the advantages of multi-column color mixing, it provides a regular wiring path for high-density chip layout, taking into account both the optical performance and circuit reliability of the lamp board 100.

[0112] In some embodiments, combined with Figure 7 , Figure 9 and Figure 10 , Figure 10 for Figure 9 The enlarged view at point A shows that each light-emitting unit 123 contains four light-emitting chips 123a, including a fourth light-emitting chip 1234, and one of the light-emitting chips 123a can emit light of the same color as one of the other three light-emitting chips 123a.

[0113] Two light-emitting chips 123a are arranged in the third column along the first direction X, and the other two light-emitting chips 123a are arranged in the fourth column along the first direction X. The light-emitting chips 123a in the third and fourth columns are correspondingly arranged along the second direction Y, which is perpendicular to the first direction X.

[0114] The fourth light-emitting chip 1234 is the same color as an existing light-emitting chip 123a (such as a red light chip), which means that the number of light-emitting chips 123a of that color increases, thereby enhancing the light output power of the corresponding color. For example, in scenarios where it is necessary to enhance the red light component in white light to improve the warm tone performance, the additional red light chip can compensate for the insufficient brightness of a single chip. At the same time, the synergistic emission of the fourth chip with the existing chips of the same color allows for a more uniform distribution of the light of that color on the lamp board 100, avoiding local brightness peaks or dark areas caused by single-chip emission. This is especially suitable for backlight modules 211 of display devices 200 with high requirements for color saturation and brightness. The two-column arrangement allows the four light-emitting chips 123a to be evenly distributed in space, shortening the mixing path of each color light and reducing local color shift.

[0115] At least one bridging structure 161 includes a first bridging structure 162 and a second bridging structure 163, wherein the first bridging structure 162 is disposed on the side of the third column opposite to the fourth column, and the second bridging structure 163 is disposed on the side of the fourth column opposite to the third column.

[0116] The dual-bridge structure 161 is set on both sides (one on the outer side of the third column and one on the outer side of the fourth column), which solves the problem of interference between the middle pins of the two columns. The dual-bridge structure 161 provides independent routing paths for the interference of the two columns of routing. The routing of the middle pin of the third column is led out from the side away from the fourth column through the first bridge structure 162, and the routing of the middle pin of the fourth column is led out from the side away from the third column through the second bridge structure 163. The routing of the two columns is completely separated in space, which avoids crossing within the column and prevents line interference between the two columns, ensuring that each chip can be driven independently.

[0117] It should be noted that the connection relationship between the pins of the third column of light-emitting chips 123a and the first bridging structure 162 is the same as the connection relationship between the pins of the first column of light-emitting chips 123a and the bridging structure 161 when the light-emitting unit 123 includes three, and the second bridging structure 163 is similar to the first bridging structure 162, which will not be described in detail here.

[0118] In some embodiments, combined with Figure 11 and Figure 12 , Figure 11The following is a simplified structural diagram of the circuit board 110 provided in some embodiments of this application. The cross-line assembly 160 includes a bottom conductive connection portion 1122 and two vias 111a, which are disposed on the side of the substrate 111 away from the top conductive connection portion 1121. The two vias 111a pass through the substrate 111 along the thickness direction of the circuit board 110 and are located on the side of one column with at least two light-emitting chips 123a away from the other column, so that the conductive connection portion located in the middle along the first direction X, corresponding to the positive electrode pin 123b or the negative electrode pin 123c, is electrically connected to the bottom conductive connection portion 1122 through one via 111a, and the bottom conductive connection portion 1122 is connected to the top conductive connection portion 1121 corresponding to the electrode pin located at the edge along the first direction X and having the same electrode through the other via 111a.

[0119] When there are at least two light-emitting chips 123a in a column, the positive and negative pins 123c in the middle will only intersect if they are only traces on the same layer. The combination of the bottom conductive connection 1122 and the via 111a provides a "detour channel" for the middle chip traces. The trace connected to the top conductive connection 1121 of one of the middle pins is led to the bottom conductive connection 1122 through a via 111a, extends laterally through the bottom conductive connection 1122, and then returns to the same polarity side of the top edge chip through another via 111a. This three-dimensional wiring allows the same polarity traces in the middle and at the edge to converge on one side, spatially avoiding the possibility of top layer trace crossing and avoiding the risk of short circuits or signal crosstalk.

[0120] In some embodiments, combined with Figure 12 Each column of light-emitting chips 123a has at least two light-emitting chips 123a, and each column has two vias 111a on the side opposite to the other column.

[0121] Taking a light-emitting unit 123 comprising four light-emitting chips 123a as an example, a first via 1111 and a second via 1112 are provided on one side of the third column where the first light-emitting chip 1231 and the second light-emitting chip 1232 are located. The trace corresponding to the positive electrode pin 123b of the second light-emitting chip 1232 passes through the first via 1111 and connects to the bottom conductive connection part 1122, and is then guided through the second via 1112 to a position adjacent to the trace corresponding to the positive electrode pin 123b of the first light-emitting chip 1231. A third via 1113 and a fourth via 1114 are provided on one side of the fourth column where the third light-emitting chip 1233 and the fourth light-emitting chip 1234 are located. The trace corresponding to the negative electrode pin 123c of the third light-emitting chip 1233 passes through the third via 1113 and connects to the bottom conductive connection part 1122, and is then guided through the fourth via 1114 to a position adjacent to the trace corresponding to the negative electrode pin 123c of the fourth light-emitting chip 1234.

[0122] In this regard, based on the rationality of spatial layout, the traces corresponding to pins of the same polarity can be combined or set up adjacently.

[0123] This effectively solves the problem of interference between the middle pins of the two columns. The vias 111a on both sides provide independent routing paths for the interference between the two columns of routing. The routing of the middle pin of the third column is led out from the side away from the fourth column through the first bridging structure 162, and the routing of the middle pin of the fourth column is led out from the side away from the third column through the second bridging structure 163. The routing of the two columns is completely separated in space, which avoids crossing within the column and prevents line interference between the two columns, ensuring that each chip can be driven independently.

[0124] In some embodiments, combined with Figure 13 , Figure 13 This is a schematic diagram of the structure of a light-emitting group provided in some embodiments of this application. Two light-emitting units 123 are connected in series to form a light-emitting group. There are multiple light-emitting groups, and each light-emitting group is connected to the driver chip 130 and the power supply line group 140 respectively.

[0125] Specifically, taking a light-emitting unit 123 comprising four light-emitting chips 123a as an example, the third light-emitting chip 1233 in two light-emitting units 123 emits the same color. The two light-emitting units 123 are the first light-emitting unit 121 and the second light-emitting unit 122, respectively. The negative pin 123c of the third light-emitting chip 1233 of the first light-emitting unit 121 is connected to the driver chip 130. The positive pin 123b of the third light-emitting chip 1233 of the first light-emitting unit 121 is connected to the negative pin 123c of the third light-emitting chip 1233 of the second light-emitting unit 122. The positive pin 123b of the third light-emitting chip 1233 of the second light-emitting unit 122 is connected to the power supply wiring group 140.

[0126] In this way, the same color light-emitting chips 123a of the two series-connected light-emitting units 123 are connected in series and share the driving circuit, reducing the number of traces and the occupation of the driver chip 130 interface, and optimizing the circuit layout. At the same time, multiple light-emitting groups work independently, which can realize zone control (such as different light-emitting groups outputting different brightness or color temperature), and improve the adaptability of the lamp board 100 to the local dimming of the display device 200. In addition, the group design ensures that the failure of a single light-emitting group does not affect the operation of the entire lamp board 100, enhancing reliability. The modular structure facilitates mass production and maintenance, and while ensuring the multi-color mixing effect, it also takes into account circuit simplification and functional expandability.

[0127] In some embodiments, combined with Figure 13 A positive pin 123b of one of the light-emitting units 123 in a light-emitting group can be connected to the negative pin 123c of the light-emitting chip 123a of another light-emitting unit 123 with the same color via a crossover assembly 160.

[0128] For example, the positive pin 123b of the second light-emitting chip 1232 of the first light-emitting unit 121 can be electrically connected to the negative pin 123c of the second light-emitting chip 1232 of the second light-emitting unit 122 through the cross-line assembly 160.

[0129] The cross-line component 160 eliminates the need for additional redundant traces in the series path of the two light-emitting units 123. Current signal transmission is completed using a bridging or via structure 111a, effectively avoiding cross-interference between the series line and other pin traces. At the same time, this series connection method implemented through the cross-line component 160 facilitates the driver chip 130 to uniformly regulate the current of the light-emitting chips 123a of the same color in the light-emitting group.

[0130] In some embodiments, combined with Figure 1 This application also discloses a display device 200, which includes a backlight module 211 and a liquid crystal panel 212. The backlight module 211 includes an optical film layer 2111 and a lamp board 100 as described in any of the first aspects. The optical film layer 2111 is disposed on the light-emitting side of the lamp board 100, and the liquid crystal panel 212 is disposed on the side of the optical film layer 2111 away from the lamp board 100.

[0131] In this way, uniform light mixing of different color chips is ensured (avoiding color layering in single-column arrangement), while also ensuring the independent and stable operation of each chip circuit (no short circuits or brightness fluctuations caused by wiring intersections). As the core of the backlight module 211 of the display device 200, the lamp board 100 outputs uniform multi-color synthesized light, which, after being optimized by the optical film layer 2111, can provide a backlight foundation with consistent color and stable brightness for the liquid crystal panel 212, effectively reducing local color shift and flicker problems in the displayed image, and improving the color accuracy and visual comfort of the image.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light panel, characterized in that, include: Circuit board, the circuit board comprising: Substrate; A top conductive connection portion is disposed on the substrate. An insulating layer covers the side of the top conductive connection portion facing away from the substrate. Light-emitting units, wherein there are multiple light-emitting units, and each light-emitting unit includes: Multiple light-emitting chips are disposed on the circuit board, at least two of the multiple light-emitting chips are used to emit light of different colors, and each light-emitting chip is provided with a positive electrode pin and a negative electrode pin; A driver chip is connected to the negative pin of the plurality of light-emitting chips to drive the plurality of light-emitting chips to emit light; A power trace group is disposed between the substrate and the insulating layer, and the power trace group is connected to the positive pin of the plurality of light-emitting chips through the top conductive connection portion; A grounding trace group is disposed between the substrate and the insulating layer, and the grounding trace group is electrically connected to the driver chip; The top conductive connection portion has multiple portions, and the multiple top conductive connection portions form multiple conductive connection groups. Each conductive connection group includes two paired top conductive connection portions. The top conductive connection portions in each conductive connection group are correspondingly arranged with each light-emitting chip, and the two top conductive connection portions in each conductive connection group are respectively soldered to the positive electrode pin and the negative electrode pin in the light-emitting chip. In this configuration, the positive and negative pins of each light-emitting chip are arranged along a first direction, and the plurality of light-emitting chips are arranged in two columns along the first direction, wherein the number of light-emitting chips in one column is at least one, and the number of light-emitting chips in the other column is at least two. The top conductive connection portions of the conductive connection group corresponding to the light-emitting chips in the same column are spaced apart along the first direction. A cross-line assembly is provided, at least a portion of which corresponds to a column of light-emitting chips with at least two light-emitting chips, and the cross-line assembly is located on the side of the corresponding column of light-emitting chips away from the other column. The cross-line assembly is configured to connect the top conductive connection portions located between other top conductive connection portions along the first direction to the driver chip or the power supply trace group.

2. The lamp panel according to claim 1, characterized in that, The crossover assembly includes at least one bridging structure disposed on the circuit board. The bridging structure includes at least two input terminals and at least two output terminals, with each input terminal and each output terminal corresponding to one another. Each top-layer conductive connection portion located in the middle along the first direction is respectively connected to each input terminal, so that the top-layer conductive connection portion corresponding to the positive pin can be connected to the power supply trace group from one side of the bridging structure through the output terminal, and the top-layer conductive connection portion corresponding to the negative pin can be connected to the driver chip from the other side of the bridging structure through the output terminal.

3. The lamp panel according to claim 2, characterized in that, The positive pins of the light-emitting chips located in the same column point in the same direction to the negative pins.

4. The lamp panel according to claim 3, characterized in that, The number of light-emitting chips in each light-emitting unit is three, and the three light-emitting chips can emit light of different colors. Two of the light-emitting chips are arranged in a first column along the first direction, and the other light-emitting chip is arranged in a second column along the first direction. The bridging structure is disposed on the side of the first column of light-emitting chips away from the second column of light-emitting chips. The bridging structure includes a first input terminal and a first output terminal arranged in pairs, and a second input terminal and a second output terminal arranged in pairs. In the top conductive connection portion of the light-emitting chips in the first column, the top conductive connection portion corresponding to the negative electrode pin located between the other pins along the first direction is connected to the first input terminal, the first output terminal is used to connect to the driving chip, and the first output terminal is closer to the driving chip corresponding to another negative electrode pin in the first column of light-emitting chips than the second output terminal. In the top conductive connection portion of the light-emitting chip in the first column, the top conductive connection portion corresponding to the positive electrode pin located between the other pins along the first direction is connected to the second input terminal, the second output terminal is used to connect to the power supply trace group, and the second output terminal is closer to the power supply trace group corresponding to another positive electrode pin in the first column of the light-emitting chip than the first output terminal.

5. The lamp panel according to claim 3, characterized in that, Each light-emitting unit contains four light-emitting chips, and one of the light-emitting chips can emit light of the same color as one of the other three light-emitting chips; Two of the light-emitting chips are arranged in a third column along the first direction, and the other two light-emitting chips are arranged in a fourth column along the first direction. The light-emitting chips in the third and fourth columns are arranged in a corresponding second direction, which is perpendicular to the first direction. The at least one bridging structure includes: A first bridging structure is disposed on the side of the third column opposite to the fourth column; The second bridging structure is disposed on the side of the fourth column opposite to the third column.

6. The lamp panel according to claim 1, characterized in that, The cross-line component includes: The bottom conductive connection portion is disposed on the side of the substrate opposite to the top conductive connection portion; Two vias are disposed in the substrate along the thickness direction of the circuit board and located on the side of one column of at least two light-emitting chips away from the other column, so that the conductive connection portion located in the middle along the first direction and corresponding to the positive or negative electrode pin is electrically connected to the bottom conductive connection portion through one of the vias, and the bottom conductive connection portion is connected to the top conductive connection portion corresponding to the electrode pin located at the edge along the first direction and having the same electrode through the other via.

7. The lamp panel according to claim 6, characterized in that, Each column of the light-emitting chips has at least two light-emitting chips, and each column has two vias on the side opposite to the other column.

8. The lamp panel according to any one of claims 1-7, characterized in that, Two light-emitting units are connected in series to form a light-emitting group. There are multiple light-emitting groups, and each light-emitting group is connected to the driver chip and the power supply wiring group respectively.

9. The lamp panel according to claim 8, characterized in that, A positive pin of one of the light-emitting units in one of the light-emitting groups can be connected to the negative pin of a light-emitting chip of the same color in another light-emitting unit via the cross-wire assembly.

10. A display device, characterized in that, include: Backlight module, the backlight module comprising: The lamp panel as described in any one of claims 1-9; An optical film layer is disposed on the light-emitting side of the lamp panel; The liquid crystal panel is disposed on the side of the optical film layer away from the lamp panel.

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