Light panel and display device

Abstract

Embodiments of the present application disclose a lamp panel and a display device, and relate to the technical field of display. The lamp panel comprises a light-emitting group, and the light-emitting group comprises a plurality of light-emitting units. A driving chip comprises a chip main body, a driving pin group, an input pin group, an output pin group and a ground pin. The number of the driving pin group is multiple, and the multiple driving pin groups are arranged at intervals along the circumference of the chip main body. The input pin group is arranged on one side of the multiple driving pin groups along the circumference of the chip main body, and the output pin group is arranged on the side, away from the input pin group, of the multiple driving pin groups along the circumference of the chip main body. The ground pin is arranged between the input pin group and the output pin group along the circumference of the chip main body. The driving pin group comprises multiple connection pins, and the multiple connection pins in one driving pin group are connected to the multiple light-emitting chips in one light-emitting unit in one-to-one correspondence. Embodiments of the present application can improve the connection convenience of the driving chip and the light-emitting chip.

Description

Technical Field

[0001] Embodiments of this application relate to the technical field of backlighting, and more particularly to a lamp panel and a display device. Background Technology

[0002] Display devices typically include display modules, which are capable of displaying image information. The display module may include a backlight panel, which serves as the light source for the display module.

[0003] A light panel may include a substrate and multiple light-emitting units disposed on the substrate. Each light-emitting unit includes multiple light-emitting chips, with at least two of the chips emitting light of different colors. The light panel may also include a driver chip connected to the multiple light-emitting chips to drive them to emit light. However, the more light-emitting chips there are, the more interconnecting traces there are between the chips and the driver chip, resulting in a very complex substrate wiring design. Utility Model Content

[0004] Embodiments of this application provide a lamp board and a display device that can improve the ease of connection between the light-emitting chip and the driver chip, thereby simplifying the wiring design on the substrate.

[0005] To address the aforementioned problems, one embodiment of this application provides a lamp board, which includes a substrate, a light-emitting group, and a driver chip. The light-emitting group is disposed on the substrate and includes multiple light-emitting units arranged in multiple rows along a first direction and multiple columns along a second direction, with the first and second directions perpendicular. The driver chip is disposed on the substrate and connected to the light-emitting units, and is used to drive the light-emitting units to emit light. Each light-emitting unit includes multiple light-emitting chips, at least two of which emit light of different colors. The driver chip includes a chip body, a drive pin group, an input pin group, an output pin group, and a ground trace. There are multiple drive pin groups, spaced apart along the circumference of the chip body. An input pin group is disposed along the circumference of the chip body on one side of the multiple drive pin groups, and is used to receive input signals. An output pin group is disposed along the circumference of the chip body on the side of the multiple drive pin groups away from the input pin groups, and is used to send output signals. A ground pin is disposed along the circumference of the chip body between the input pin group and the output pin group, and is used to ground the chip body. The driving pin group includes multiple connection pins. Each of the multiple connection pins in a driving pin group is connected to a corresponding multiple light-emitting chips in a light-emitting unit. The connection pins are used to provide driving signals to the light-emitting chips.

[0006] In the embodiments of this application, multiple drive pin groups are arranged at intervals along the circumference of the chip body. Input pin groups, output pin groups, and ground pins are also arranged at intervals along the circumference of the chip body, but are located on one or both sides of the drive pin groups. That is, in the circumference of the chip body, the input pin groups, output pin groups, and ground pins are not arranged between the multiple drive pin groups.

[0007] This eliminates the need for the input pin group, output pin group, and ground pin to be shielded or surrounded by the connection traces of other components (such as terminals, ground traces, or other driver chips). This reduces the impact of the input pin group, output pin group, and ground pin on the connection between multiple connection pins and the light-emitting chip when connected to other components. It also eliminates the need for the connection traces between multiple connection pins and multiple light-emitting chips to cross other traces, thus eliminating the need for a cross-line structure to connect the connection pins of the light-emitting chip and the driver chip. This improves the ease of connection between the light-emitting chip and the driver chip and helps reduce the complexity of the traces on the substrate.

[0008] Understandably, the connection lines of multiple connection pins and multiple light-emitting chips do not need to cross, which can also improve the convenience of routing during design, improve the regularity of routing on the substrate, and improve the convenience of routing maintenance.

[0009] Furthermore, the elimination of the need for cross-line connections between the light-emitting chip and the driver chip improves the reliability of their connection and helps reduce the cost of the light board.

[0010] In some possible implementations, there are multiple driver chips. The input pin group of one driver chip is connected to the output pin group of another driver chip, thus forming a driver chip string. The lamp board also includes terminals disposed on the substrate. The input pin group of the driver chip at one end of the driver chip string is connected to the terminal, and the output pin group of the driver chip at the other end of the driver chip string is also connected to the terminal.

[0011] By employing the above connection method, multiple driver chips in the driver chip string can be connected to the terminal blocks and, through the terminal blocks, to other components outside the lamp board. Compared to connecting multiple driver chips individually to the terminal blocks, connecting multiple driver chips into a driver chip string reduces the number of traces between the driver chips and the terminal blocks, improves the ease of connection between multiple driver chips and the terminal blocks, and helps reduce the complexity of the wiring on the substrate.

[0012] In addition, connecting multiple driver chips into a driver chip string eliminates the need for the backlight control chip to send control signals to each driver chip individually, thus improving the ease of control over multiple driver chips.

[0013] In some possible implementations, the input pin group includes a power input pin, a data signal input pin, and an address signal input pin. The power input pin and ground pin are arranged adjacent to each other, and the power input pin is used to receive power signals. The data signal input pin is arranged circumferentially around the chip body and adjacent to the power input pin, and the data signal input pin is used to receive data signals. The address signal input pin is arranged circumferentially around the chip body and adjacent to either the power input pin or the data signal input pin, and the address signal input pin is used to receive address signals. The lamp board also includes a filtering device connected between the power input pin and the ground pin, which is used to filter the power signals input to the driver chip.

[0014] Understandably, filtering devices can play a filtering role, thereby reducing the impact of power signal fluctuations on the driver chip.

[0015] The power input pin and the ground pin are arranged adjacent to each other, and the filter device is connected between the power input pin and the ground pin. This means that when the filter device is connected to the power input pin and the ground pin, it does not need to cross other pins. Therefore, there is no need to set up a bridging structure to connect the filter device to the power input pin and the ground pin, which improves the connection convenience of the filter device to the power input pin and the ground pin and helps to reduce the complexity of the wiring on the substrate.

[0016] In some possible implementations, the filtering components include filter capacitors. Understandably, compared to a filtering network formed by capacitors, resistors, and other connected components, including filter capacitors eliminates the need for complex circuit structures, simplifying the lamp board's structure and reducing its cost.

[0017] In some possible implementations, the output pin group includes a power output pin, a data signal output pin, and an address signal output pin. The power output pin and ground pin are arranged adjacent to each other, and the power output pin is used to output a power supply signal. The data signal output pin is arranged circumferentially around the chip body and adjacent to the power output pin, and the data signal output pin is used to output a data signal. The address signal output pin is arranged circumferentially around the chip body and adjacent to either the power output pin or the data signal output pin, and the address signal output pin is used to output an address signal.

[0018] Understandably, the adjacent placement of the power output pin and the ground pin allows the power input pin and the power output pin to be positioned correspondingly, improving the ease of connection between the power output pin of one driver chip and the power input pin of another driver chip.

[0019] In some possible implementations, the lamp board also includes grounding traces, power trace groups, and bridging structures. Grounding traces are disposed on the substrate and connected to grounding pins. Power trace groups are disposed on the substrate. Bridging structures are disposed on the substrate, and the light-emitting units are connected to the power trace groups via the bridging structures. Along the second direction, a first trace channel is formed between two adjacent light-emitting groups, with the grounding traces and power trace groups disposed within different first trace channels.

[0020] Understandably, grounding traces can ground the driver chip. Considering the significant voltage difference between the power trace group and the ground trace if they are located in the same first trace channel, a larger distance is needed between them to reduce the risk of short circuits. However, since the space in the first trace channel is inherently limited, and a distance must be reserved between the power trace group and the ground trace, this further compresses the trace space of the power trace group. This results in insufficient trace space, forcing a reduction in the trace width of the power traces within the group. This leads to an increase in voltage drop across the power traces, reducing the brightness of the LED connected to the end of the power trace.

[0021] In the embodiments of this application, the grounding trace and the power trace are arranged in different first trace channels, so there is no need to reserve a distance in the first trace channel, thus avoiding compression of the trace space of the power trace group. If there is enough space, the width of the power trace located in the first trace channel can also be increased, thereby reducing the voltage drop of the power trace located in the first trace channel.

[0022] In some possible implementations, the driver chip is positioned within the arrangement range of multiple light-emitting units on the substrate.

[0023] This configuration eliminates the need for the driver chip to occupy the routing space between multiple light-emitting groups and between the light-emitting groups and the edges of the substrate. This allows for a larger width of the power traces in the power trace group, thereby reducing the voltage drop of the power traces.

[0024] In some possible implementations, the driver chip is located between two adjacent rows of light-emitting units along the first direction and between two adjacent columns of light-emitting units along the second direction, and the bridging structure is located outside the arrangement range of the multiple light-emitting units on the substrate.

[0025] In the embodiments of this application, the driving chip is located between two adjacent rows of light-emitting units along the first direction and between two adjacent columns of light-emitting units along the second direction. The bridging structure is located outside the arrangement range of multiple light-emitting units on the substrate, so that at least one light-emitting unit can be spaced between the driving chip and the bridging structure, thereby increasing the distance between the driving chip and the bridging structure.

[0026] This ensures that the portion of the optical film layer lifted by the driver chip and the portion of the optical film layer lifted by the bridging structure are not connected. Compared to the driver chip and the bridging structure being adjacent, this reduces the area of ​​the area where the optical film layer is lifted, which means reducing the area of ​​the area where the optical film layer protrudes away from the substrate. This reduces the risk of shadows appearing in the display module and improves the display performance of the display module.

[0027] In some possible implementations, multiple light-emitting units in a light-emitting group are connected by one or at least two bridging structures and power supply traces.

[0028] This configuration improves the flexibility of connection between multiple light-emitting units and bridging structures in a light-emitting group, meeting the needs of different situations.

[0029] On the other hand, embodiments of this application provide a display device. The display device includes a backlight module and a liquid crystal panel. The backlight module includes a lamp panel and an optical film layer, the optical film layer being disposed on the light-emitting side of the lamp panel. The liquid crystal panel is disposed on the side of the optical film layer away from the lamp panel.

[0030] The display device provided in the embodiments of this application includes the lamp panel as described above, and therefore has all the above-described beneficial effects, which will not be repeated here. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application;

[0032] Figure 2 This is a schematic diagram of the structure of a display module provided in some embodiments of this application;

[0033] Figure 3 This is a schematic diagram of the structure of the lamp panel provided in some embodiments of this application;

[0034] Figure 4 This is a schematic diagram of the structure of the lamp panel provided in some other embodiments of this application;

[0035] Figure 5 for Figure 3 A magnified schematic diagram of the local structure of the Q11 region;

[0036] Figure 6 for Figure 4 A magnified schematic diagram of a portion of the Q21 region;

[0037] Figure 7 This is a schematic diagram of the structure of the light-emitting unit and the conductive unit provided in some embodiments of this application;

[0038] Figure 8 This is a schematic diagram of the structure of a driver chip provided in some embodiments of this application;

[0039] Figure 9 A schematic diagram illustrating the connection relationship between multiple driver chips and terminals provided in some embodiments of this application;

[0040] Figure 10 This is a structural block diagram of a display device provided in some embodiments of this application.

[0041] Explanation of icon numbers:

[0042] 100-Lamp board, 101-Power supply circuit, 110-Substrate, 120-Light-emitting group, 121-Light-emitting unit, 121a-First group of light-emitting units, 121b-Second group of light-emitting units, 1211-Light-emitting chip, 130-Driver chip, 131-Chip body, 132-Driver pin group, 1321-Connection pin, 133-Input pin group, 1331-Power input pin, 1332-Data signal input pin, 1333-Addressing signal input pin, 134-Output pin group, 1341-Power output pin, 1342-Data signal output pin, 1343-Addressing signal output pin, 135-Ground pin, 136-Heat dissipation pad, 141-Power trace group, 151-Ground trace, 161 -Bridge structure, 171-Filtering device, 172-Terminal block, 1721-Terminal block body, 1722-Connection pin, 181-Conductive connection unit, 1811-Conductive connection part, 1811a-First sub-part, 1811b-Second sub-part, 200-Display device, 210-Display module, 211-Backlight module, 2111-Optical film layer, 212-LCD panel, 212a-Liquid crystal molecule, 213-Color filter, 220-Housing, 230-Bracket, 201-Main board, 202-Central control board, 203-Driver board, 204-Main chip, 205-Backlight control chip, 206-Timing control chip, L1-First edge, L2-Second edge, P-Lamp area, X-First direction, Y-Second direction. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all possible embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0045] As used herein, terms such as “equal,” “parallel,” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equal items less than or equal to 5% of either one.

[0046] In the embodiments of this application, the directional indications used to explain the structure and movement of different components, such as up, down, left, right, front, and back, are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0047] Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application. For example... Figure 1 As shown, an embodiment of this application provides a display device 200, which has an image display function.

[0048] The display device 200 can be a television, laptop computer, tablet computer, in-vehicle computer, smartphone, smartwatch, projection device, head-up display (HDU), augmented reality (AR) glasses, etc. The embodiments of this application do not further limit the specific form of the display device 200.

[0049] like Figure 1As shown, the display device 200 may include a display module 210 and a housing 220. The display module 210 is used to display image information. The display module 210 may be a light-emitting diode (LED) display module. For example, the display module 210 may be at least one of a micro light-emitting diode (Micro LED) display module and a mini light-emitting diode (Mini LED) display module.

[0050] Understandably, Mini LED display modules and Micro LED display modules have advantages such as self-illumination, high brightness, high contrast, high resolution, high color saturation, long lifespan, fast response speed, and low power consumption.

[0051] The display module 210 includes a light-emitting side and a backlight side disposed opposite to each other. A housing 220 is disposed on the backlight side and connected to the display module 210, thereby protecting the display module 210 and reducing the impact of the housing 220 on the light emitting side of the display module 210. For example, the housing 220 can be connected to the display module 210 by a snap-fit ​​connection, or it can be connected to the display module 210 by an adhesive connection; the embodiments of this application do not further limit this.

[0052] like Figure 1 As shown, the display device 200 may also include a bracket 230, which is disposed on one side of the housing 220 and connected to the housing 220, serving to support the housing 220 and the display module 210.

[0053] Figure 2 This is a schematic diagram illustrating the structure of a display module provided in some embodiments of this application. In some examples, such as... Figure 2 As shown, the display module 210 includes a backlight module 211 and a liquid crystal panel 212. That is, the display device 200 includes a backlight module 211 and a liquid crystal panel 212.

[0054] The backlight module 211 includes a lamp panel 100 and an optical film layer 2111. Understandably, the lamp panel 100 is the light source of the display module 210, and the light-emitting side of the lamp panel 100 is the light-emitting side of the display module 210.

[0055] The optical film layer 2111 is disposed on the light-emitting side of the lamp panel 100. The light emitted by the lamp panel 100 can pass through the optical film layer 2111, and the optical film layer 2111 can perform optical processing on the light emitted by the lamp panel 100.

[0056] For example, the number of optical film layers 2111 can be one or more. When the number of optical film layers 2111 is multiple, the multiple optical film layers 2111 can be stacked on the light-emitting side of the lamp panel 100.

[0057] The optical film layer 2111 may include at least one of a light-diffusing sheet, a prism sheet, and a diffuser sheet. Understandably, the light-diffusing sheet is used to homogenize light, the prism sheet is used to refract or reflect light to improve the brightness of the display module 210, and the diffuser sheet is used to diffuse light. Understandably, the optical film layer 2111 may also include other light-processing films besides the light-diffusing sheet, prism sheet, and diffuser sheet; the embodiments of this application do not further limit the specific form of the optical film layer 2111.

[0058] Continue to refer to Figure 2 In some examples, the liquid crystal panel 212 is disposed on the side of the optical film layer 2111 away from the lamp panel 100. For example, the liquid crystal panel 212 may include a stacked liquid crystal driving circuit (not shown) and a liquid crystal layer, the liquid crystal layer including a plurality of liquid crystal molecules 212a, the liquid crystal driving circuit being able to apply a voltage to the liquid crystal molecules 212a, causing the liquid crystal molecules 212a to deflect, so as to transmit or block the light emitted by the backlight module 211.

[0059] The display module 210 may further include a color filter 213, which is disposed on the side of the liquid crystal panel 212 away from the backlight module 211. The color filter 213 has red, green, and blue pixel blocks. The red pixel blocks transmit red light, the green pixel blocks transmit green light, and the blue pixel blocks transmit blue light. The size and shape of the red, green, and blue pixel blocks may be the same or different. The embodiments of this application do not further limit the size, shape, or arrangement of the red, green, and blue pixel blocks.

[0060] Understandably, the light passing through the color filter 213 is red, green and blue light of different intensities, enabling the display module 210 to achieve full-color display.

[0061] The embodiments of this application do not further limit the liquid crystal panel 212 and color filter 213, etc., and the lamp board 100 is described by example below.

[0062] Figure 3 This is a schematic diagram of the structure of a lamp panel provided in some embodiments of this application. Figure 4 This is a schematic diagram of the structure of a lamp panel provided in some other embodiments of this application. Figure 5 for Figure 3 A magnified schematic diagram of the Q11 region. Figure 6 for Figure 4 A magnified schematic diagram of the Q21 region.

[0063] In some examples, such as Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the lamp panel 100 may include a substrate 110 and a light-emitting group 120, the light-emitting group 120 being disposed on the substrate 110. The light-emitting group 120 includes a plurality of light-emitting units 121.

[0064] For example, substrate 110 can be a single-layer aluminum substrate, or substrate 110 can be a multilayer printed circuit board (PCB). The embodiments of this application use a single-layer aluminum substrate as an example for further illustration.

[0065] Understandably, the light-emitting group 120 is capable of emitting light. The light-emitting group 120 may include eight light-emitting units 121, or the light-emitting group 120 may also include other numbers of light-emitting units 121. The embodiments of this application do not further limit the number of light-emitting units 121 in the light-emitting group 120.

[0066] In some examples, such as Figure 5 and Figure 6 As shown, multiple light-emitting units 121 are arranged in multiple rows along the first direction X and in multiple columns along the second direction Y.

[0067] For example, the second direction Y and the first direction X can be perpendicular or approximately perpendicular. That is, the angle between the second direction Y and the first direction X can be 90°, or it can be 88° or 89°, etc.

[0068] For example, multiple light-emitting units 121 can be arranged in 4 rows along the first direction X and in 2 columns along the second direction Y. Alternatively, multiple light-emitting units 121 can be arranged in other numbers of rows along the first direction X and in other numbers of columns along the second direction Y. The embodiments of this application do not further limit the values ​​of the number of rows arranged along the first direction X and the number of columns arranged along the second direction Y of multiple light-emitting units 121.

[0069] For example, the first direction X can be the length direction of the substrate 110, and the second direction Y can be the width direction of the substrate 110.

[0070] Figure 7 The diagram illustrates the structure of the light-emitting unit and the conductive unit provided in some embodiments of this application. In some examples, such as... Figure 7 As shown, the light-emitting unit 121 includes a plurality of light-emitting chips 1211, and at least two of the plurality of light-emitting chips 1211 emit light of different colors.

[0071] The light-emitting chip 1211 can be a miniLED chip. There can be three light-emitting chips 1211, which can be used to emit red, green, and blue light respectively. Alternatively, there can be two light-emitting chips 1211, which can be used to emit green and blue light respectively. Or, there can be four light-emitting chips 1211, with two emitting red light and the other two emitting green and blue light, or two emitting green light and the other two emitting red and blue light.

[0072] Multiple light-emitting chips 1211 can be spaced apart along a first direction X, or along a second direction Y, or along both directions X and Y. The first direction X and the second direction Y are perpendicular.

[0073] The light-emitting unit 121 includes multiple light-emitting chips 1211, with at least two light-emitting chips 1211 emitting light of different colors, which can improve the color gamut of the display module 210 and facilitate image display.

[0074] For example, such as Figure 7 As shown, the substrate 110 may include a plurality of conductive connection units 181, the number of conductive connection units 181 being equal to the number of light-emitting units 121, and the plurality of conductive connection units 181 and the plurality of light-emitting units 121 being connected in a one-to-one correspondence.

[0075] The conductive connection unit 181 may include a plurality of conductive connection portions 1811. The number of conductive connection portions 1811 and the number of light-emitting chips 1211 may be equal. The plurality of conductive connection portions 1811 and the plurality of light-emitting chips 1211 are connected in a one-to-one correspondence, so that the plurality of light-emitting chips 1211 in the light-emitting unit 121 can be connected to the substrate 110 respectively.

[0076] Alternatively, the number of conductive connections 1811 may be less than the number of light-emitting chips 1211, and at least two light-emitting chips 1211 may be connected to the same conductive connection 1811. For example, at least two light-emitting chips 1211 with the same emitting color may be connected to the same conductive connection 1811.

[0077] For example, the conductive connection portion 1811 may include a first sub-portion 1811a and a second sub-portion 1811b, the anode pin of the light-emitting chip 1211 is connected to the first sub-portion 1811a, and the cathode pin of the light-emitting chip 1211 is connected to the second sub-portion 1811b.

[0078] Continue to refer to Figure 5 and Figure 6In some examples, the lamp board 100 may include a driver chip 130, which is disposed on the substrate 110 and connected to the light-emitting unit 121. The driver chip 130 is used to drive the light-emitting unit 121 to emit light.

[0079] Figure 8 This is a schematic diagram of the structure of a driver chip provided in some embodiments of this application. Figure 9 This diagram illustrates the connection relationship between multiple driver chips and terminals provided in some embodiments of this application. It is understood that, for the sake of simplicity, the accompanying drawings... Figure 9 The power supply trace group 141, bridging structure 161, ground trace 151, and filtering device 171 are not shown.

[0080] Understandably, the more light-emitting chips 1211 there are, the more connection traces there are between the light-emitting chips 1211 and the driver chip 130, resulting in a very complex trace design for the substrate 110.

[0081] Based on this, in the embodiments of this application, such as Figure 8 and Figure 9 As shown, the driver chip 130 includes a chip body 131, a driver pin group 132, an input pin group 133, an output pin group 134, and a ground pin 135.

[0082] There are multiple drive pin groups 132, which are spaced apart along the circumference of the chip body 131.

[0083] For example, such as Figure 9 As shown, the driver chip 130 may include four driver pin groups 132, which can be connected to four light-emitting units 121 in a one-to-one correspondence.

[0084] Alternatively, the driver chip 130 may also include multiple driver pin groups 132. The embodiments of this application do not further limit the number of driver pin groups 132.

[0085] Continue to refer to Figure 8 and Figure 9 In some examples, the driving pin group 132 includes multiple connection pins 1321. The multiple connection pins 1321 in a driving pin group 132 are respectively connected to multiple light-emitting chips 1211 in a light-emitting unit 121. The connection pins 1321 are used to provide driving signals to the light-emitting chips 1211.

[0086] The number of connection pins 1321 in a driving pin group 132 can be equal to the number of light-emitting chips 1211 in a light-emitting unit 121, so that multiple connection pins 1321 in a driving pin group 132 can be connected one-to-one with multiple light-emitting chips 1211 in a light-emitting unit 121. In this way, the driving chip 130 can drive the multiple light-emitting chips 1211 in the light-emitting unit 121.

[0087] For example, connection pin 1321 can be connected to the negative pin of LED chip 1211, and the positive pin of LED chip 1211 can be connected to the power trace in power trace group 141.

[0088] For example, at least two of the multiple light-emitting units 121 are connected in series. Taking two light-emitting units 121 connected in series as an example, in the two light-emitting units 121 connected in series, the negative terminals of multiple light-emitting chips 1211 in one light-emitting unit 121 are respectively connected to multiple connection pins 1321, the positive terminals of multiple light-emitting chips 1211 in the same light-emitting unit 121 are respectively connected to the negative terminals of multiple light-emitting chips 1211 in the other light-emitting unit 121, and the negative terminals of multiple light-emitting chips 1211 in the other light-emitting unit 121 are respectively connected to the power traces in the power trace group 141 through the bridging structure 161.

[0089] For example, at least two light-emitting units 121 connected in series are spaced apart along a first direction X or a second direction Y to improve the arrangement flexibility of the light-emitting units 121 on the substrate 110. The embodiments of this application do not further limit the arrangement of the light-emitting units 121 on the substrate 110.

[0090] Continue to refer to Figure 8 and Figure 9 In some examples, input pin group 133 is arranged circumferentially along the chip body 131 on one side of multiple drive pin groups 132, and is used to receive input signals. Output pin group 134 is arranged circumferentially along the chip body 131 on the side of multiple drive pin groups 132 away from input pin group 133, and is used to send output signals. Ground pin 135 is arranged circumferentially along the chip body 131 between input pin group 133 and output pin group 134, and is used to ground the chip body 131.

[0091] In some examples, the driving pin group 132 includes multiple connection pins 1321. Each connection pin 1321 in the driving pin group 132 is connected to a corresponding plurality of light-emitting chips 1211 in a light-emitting unit 121. The connection pins 1321 are used to provide driving signals to the light-emitting chips 1211. This allows the driving chip 130 to drive the plurality of light-emitting chips 1211 in the light-emitting unit 121 to emit light.

[0092] In the embodiments of this application, multiple drive pin groups 132 are arranged at intervals along the circumference of the chip body 131. Input pin group 133, output pin group 134 and ground pin 135 are also arranged at intervals along the circumference of the chip body 131, but are located on one or both sides of the drive pin group 132. That is, in the circumference of the chip body 131, the input pin group 133, output pin group 134 and ground pin 135 are not arranged between the multiple drive pin groups 132.

[0093] This eliminates the need for the connection traces of the input pin group 133, output pin group 134, and ground pin 135 to other components (such as terminal block 172, ground trace 151, or other driver chips 130) to block or surround the driver pin group 132. This reduces the impact of the input pin group 133, output pin group 134, and ground pin 135 on the connection between multiple connection pins 1321 and the light-emitting chip 1211 when they are connected to other components. This also eliminates the need for the connection lines of multiple connection pins 1321 and multiple light-emitting chips 1211 to cross other traces. As a result, there is no need to set up a crossover structure to connect the connection pins 1321 of the light-emitting chip 1211 and the driver chip 130, which improves the ease of connection between the light-emitting chip 1211 and the driver chip 130 and helps to reduce the complexity of the traces on the substrate 110.

[0094] Understandably, the connection lines of multiple connection pins 1321 and multiple light-emitting chips 1211 do not need to cross, which can also improve the convenience of routing during design, improve the regularity of routing on the substrate 110, and improve the convenience of troubleshooting the routing.

[0095] Furthermore, the light-emitting chip 1211 and the driver chip 130 do not need to be linked by a cross-line structure, which can improve the reliability of the connection between the two and help reduce the cost of the lamp board 100.

[0096] In some examples, such as Figure 8 and Figure 9 As shown, the input pin group includes a power input pin 1331, a data input of parallel (DIP) pin 1332, and an addressing signal input pin of serial (DIS) pin 1333. The power input pin 1331 is used to receive power signals, enabling the driver chip 130 to operate normally.

[0097] The data signal input pin 1332 is arranged adjacent to the power input pin 1331 along the circumference of the chip body 131, and is used to receive data signals. The address signal input pin 1333 is arranged adjacent to the power input pin 1331 or the data signal input pin 1332 along the circumference of the chip body 131, and is used to receive address signals.

[0098] Understandably, when the address signal input pin 1333 is arranged adjacent to the power input pin 1331 along the circumference of the chip body 131, the power input pin 1331 is located between the address signal input pin 1333 and the data signal input pin 1332 along the circumference of the chip body 131.

[0099] When the address signal input pin 1333 is arranged adjacent to the data signal input pin 1332 along the circumference of the chip body 131, the data signal input pin 1332 is located between the address signal input pin 1333 and the power input pin 1331 along the circumference of the chip body 131.

[0100] In other examples, the address signal input pin 1333 may be arranged adjacent to the power input pin 1331 along the circumference of the chip body 131, and the data signal input pin 1332 may be arranged adjacent to the power input pin 1331 or the address signal input pin 1333 along the circumference of the chip body 131.

[0101] It is understood that the embodiments of this application do not further limit the specific arrangement of the power input pin 1331, the data signal input pin 1332, and the address signal input pin 1333.

[0102] Continue to refer to Figure 8 In some examples, the power input pin 1331 and the ground pin 135 are arranged adjacent to each other. The lamp board 100 also includes a filter element 171 connected between the power input pin 1331 and the ground pin 135. The filter element 171 is used to filter the power signal of the input driver chip 130.

[0103] Understandably, the filter device 171 can perform filtering, thereby reducing the impact of power signal fluctuations on the driver chip 130.

[0104] The power input pin 1331 and the ground pin 135 are arranged adjacent to each other. The filter element 171 is connected between the power input pin 1331 and the ground pin 135, so that the filter element 171 does not need to cross other pins when connecting to the power input pin 1331 and the ground pin 135. Therefore, there is no need to set up a bridging structure to connect the filter element 171 to the power input pin 1331 and the ground pin 135, which improves the connection convenience of the filter element 171 to the power input pin 1331 and the ground pin 135 and helps to reduce the complexity of the wiring on the substrate 110.

[0105] Continue to refer to Figure 8 In some examples, the filter component 171 includes a filter capacitor. Understandably, compared to a filter network formed by connecting capacitors, resistors, and other components, including a filter capacitor in the filter component 171 eliminates the need for a complex circuit structure, simplifying the structure of the lamp board 100 and reducing its cost. Understandably, the embodiments of this application do not further limit the size of the filter capacitor.

[0106] Continue to refer to Figure 8 In some examples, the output pin group includes a power output pin 1341, a data output of paralle (DOP) pin 1342, and an addressing signal output pin (DOS) pin 1343.

[0107] Power output pin 1341 is used to output a power supply signal. For example, the power output pin 1341 of one driver chip 130 can be connected to the power input pin 1331 of another driver chip 130, so that one driver chip 130 can supply power to the other driver chip 130. (Continue to refer to...) Figure 8 and Figure 9 In some examples, the power output pin 1341 and the ground pin 135 are positioned adjacent to each other.

[0108] This configuration allows the power input pin 1331 and the power output pin 1341 to correspond in position, improving the ease of connection between the power output pin 1341 of one driver chip 130 and the power input pin 1331 of another driver chip 130, and helping to reduce the complexity of the wiring on the substrate 110.

[0109] The data signal output pin 1342 is arranged adjacent to the power output pin 1341 along the circumference of the chip body 131, and is used to output data signals. The address signal output pin 1343 is arranged adjacent to the power output pin 1341 or the data signal output pin 1342 along the circumference of the chip body 131, and is used to output address signals.

[0110] Understandably, when the address signal output pin 1343 is arranged adjacent to the power output pin 1341 along the circumference of the chip body 131, the power output pin 1341 is located between the address signal output pin 1343 and the data signal output pin 1342 along the circumference of the chip body 131.

[0111] When the address signal output pin 1343 is arranged adjacent to the data signal output pin 1342 along the circumference of the chip body 131, the data signal output pin 1342 is located between the address signal output pin 1343 and the power output pin 1341 along the circumference of the chip body 131.

[0112] In other examples, the address signal output pin 1343 may be arranged adjacent to the power input pin 1331 along the circumference of the chip body 131, and the data signal output pin 1342 may be arranged adjacent to the power input pin 1331 or the address signal output pin 1343 along the circumference of the chip body 131.

[0113] It is understood that the embodiments of this application do not further limit the specific arrangement of the power output pin 1341, the data signal output pin 1342, and the address signal output pin 1343.

[0114] Continue to refer to Figure 5 and Figure 6 In some examples, the lamp board 100 may include a power trace group 141 and a bridging structure 161, with the power trace group 141 disposed on the substrate 110. The bridging structure 161 is disposed on the substrate 110, and the light-emitting unit 121 is connected to the power trace group 141 through the bridging structure 161.

[0115] Understandably, the bridging structure 161 enables cross-line connection. The substrate 110 is a single-layer aluminum substrate. By placing the bridging structure 161 on the substrate, two intersecting traces on the substrate 110 can be connected through the bridging structure 161.

[0116] The power supply voltage of the light-emitting chip 1211 that emits different colors of light is different. For example, the power supply voltage of the light-emitting chip 1211 that emits red light can be lower than the power supply voltage of the light-emitting chip 1211 that emits green light. The power supply voltage of the light-emitting chip 1211 that emits green light can be lower than the power supply voltage of the light-emitting chip 1211 that emits blue light.

[0117] The power supply wiring group 141 may include multiple power supply lines. Multiple light-emitting chips 1211 in the light-emitting unit 121 can be connected to the multiple power supply lines in the power supply wiring group 141 through the bridge structure 161, so as to realize separate power supply for light-emitting chips 1211 with different light-emitting colors.

[0118] For example, the number of power traces in the power trace group 141 and the number of light-emitting chips 1211 in the light-emitting unit 121 can be equal, and the multiple power traces in the power trace group 141 and the multiple light-emitting chips 1211 in the light-emitting unit 121 are connected in a one-to-one correspondence.

[0119] The number of power traces in the power trace group 141 can also be less than the number of light-emitting chips 1211 in the light-emitting unit 121, with at least two light-emitting chips 1211 connected to the same power trace in the power trace group 141. For example, at least two light-emitting chips 1211 with the same light emission color can be connected to the power supply circuit 101 through the same power trace in the power trace group 141.

[0120] When the number of power lines in the power line group 141 is less than the number of light-emitting chips 1211 in the light-emitting unit 121, the blue light-emitting chip 1211 and the green light-emitting chip 1211 can also be connected to the power supply circuit 101 through the same power line in the power line group 141.

[0121] In some examples, such as Figure 9 As shown, grounding trace 151 is connected to grounding pin 135. (As indicated...) Figure 5 and Figure 6 Along the second direction Y, a first wiring channel M1 is formed between two adjacent light-emitting groups 120, and the grounding wiring 151 and the power wiring group 141 are arranged in different first wiring channels M1.

[0122] For example, there can be multiple ground pins 135, which are spaced apart circumferentially along the chip body 131. After the multiple ground pins 135 are connected, they are connected together to the ground trace 151, so that the driver chip 130 can be grounded.

[0123] Considering that the voltage difference between the power trace group 141 and the ground trace 151 is relatively large when they are located in the same first trace channel M1, a large distance needs to be set between them to reduce the risk of breakdown and short circuit. However, since the space of the first trace channel M1 is limited, and a distance needs to be reserved between the power trace group 141 and the ground trace 151, the trace space of the power trace group 141 will be further compressed, resulting in insufficient trace space. This will only reduce the line width of the power traces in the power trace group 141, which will increase the voltage drop of the power traces and reduce the brightness of the light-emitting chip 1211 connected to the end of the power traces.

[0124] In the embodiments of this application, the grounding trace 151 and the power trace group 141 are arranged in different first trace channels M1, so that there is no need to reserve a distance in the first trace channel M1, thereby avoiding compression of the trace space of the power trace group 141. If there is enough space, the width of the power trace located in the first trace channel M1 can be increased, thereby reducing the voltage drop of the power trace located in the first trace channel M1.

[0125] For example, such as Figure 8 As shown, the driver chip 130 may further include a heat dissipation pad 136, which is disposed on the chip body 131 and soldered to the substrate 110 to dissipate heat. A ground pin 135 may be connected to the heat dissipation pad 136. The heat dissipation pad 136 may be rectangular or approximately rectangular; the embodiments of this application do not further limit the specific shape of the heat dissipation pad 136.

[0126] Understandably, Figure 8 and Figure 9 In order to standardize the accompanying drawings, the heat sink 136 is equivalent to a pin, and the connection relationship between the heat sink 136 and the pin is shown with connecting lines.

[0127] In some examples, such as Figure 9 As shown, there are multiple driver chips 130. Among the multiple driver chips 130, the input pin group 133 of one driver chip 130 and the output pin group 134 of another driver chip 130 are connected to form a driver chip string.

[0128] For example, the power input pin 1331, data signal input pin 1332, and address signal input pin 1333 in the input pin group 133 of one driver chip 130 are respectively connected to the power output pin 1341, data signal output pin 1342, and address signal output pin 1343 in another driver chip 130, so that multiple driver chips 130 can be connected as a driver chip string.

[0129] Continue to refer to Figure 9 In some examples, the lamp board 100 also includes a terminal block 172 disposed on the substrate 110. The input pin group 133 of the driver chip 130 located at one end of the driver chip string is connected to the terminal block 172, and the output pin group 134 of the driver chip 130 located at the other end of the driver chip string is connected to the terminal block 172.

[0130] Understandably, the input pin group 133 of the first driver chip 130 in the driver chip string is connected to the terminal block 172. For example, the power input pin 1331, data signal input pin 1332, and address signal input pin 1333 of the first driver chip 130 in the driver chip string are all connected to the terminal block 172. For instance, the data signal input pin 1332 and the address signal input pin 1333 can both be connected to the terminal block 172.

[0131] The power output pin 1341 and the address signal output pin 1343 of the last driver chip 130 in the driver chip string are connected to the terminal block 172 respectively, while the data signal output pin 1342 does not need to be connected to the terminal block 172.

[0132] By adopting the above connection method, all the driver chips 130 in the driver chip string can be connected to the terminal block 172, and connected to other components outside the lamp board 100 through the terminal block 172. Compared with multiple driver chips 130 being connected to the terminal block 172 separately, connecting multiple driver chips 130 into a driver chip string can reduce the number of traces between the driver chips 130 and the terminal block 172, improve the convenience of connection between multiple driver chips 130 and the terminal block 172, and help reduce the complexity of the wiring on the substrate 110.

[0133] In addition, by connecting multiple driver chips 130 into a driver chip string, it is no longer necessary to send control signals to each driver chip 130 individually, thus improving the convenience of controlling multiple driver chips 130.

[0134] Continue to refer to Figure 9 For example, the terminal block 172 may include a terminal block body 1721 and wiring pins 1722. The number of wiring pins 1722 is multiple, and the multiple wiring pins 1722 are spaced apart and located on both sides of the terminal block body 1721.

[0135] Terminal 172 is used to connect to the external power supply and control chip (e.g., backlight control chip) of lamp board 100. In addition, the wiring pin 1722 can be connected to the driver chip 130 and the power supply wiring group 141 so that the power supply wiring group 141 can supply power to the light-emitting unit 121 and the driver chip 130 can drive the light-emitting unit 121 to emit light.

[0136] Multiple wiring pins 1722 are spaced apart and located on both sides of the terminal block body 1721, so that multiple driver chips 130 located on both sides of the terminal block body 1721 can be connected to the terminal block body 1721 through the wiring pins 1722 respectively, and the power supply wiring groups 141 located on both sides of the terminal block body 1721 can be connected to the terminal block body 1721 through the wiring pins 1722 respectively.

[0137] In some examples, such as Figure 9 As shown, the driving chip 130 is disposed within the arrangement range of the multiple light-emitting units 121 on the substrate 110.

[0138] This configuration eliminates the need for the driver chip 130 to occupy the wiring space between multiple light-emitting groups 120 and between the edges of the light-emitting groups 120 and the substrate 110, allowing the power traces in the power trace group 141 to be wider, thereby reducing the voltage drop of the power traces.

[0139] In some examples, such as Figure 5 and Figure 6 As shown, the driving chip 130 is located between two adjacent rows of light-emitting units 121 along the first direction X, and between two adjacent columns of light-emitting units 121 along the second direction Y. The bridging structure 161 is located outside the arrangement range of the multiple light-emitting units 121 on the substrate 110.

[0140] Understandably, the relatively large heights of both the driver chip 130 and the bridging structure 161 allow them to lift a portion of the optical film layer 2111, causing a portion of the optical film layer 2111 to bulge away from the substrate 110. When the distance between the driver chip 130 and the bridging structure 161 is small, the portion of the optical film layer 2111 lifted by the driver chip 130 and the portion of the optical film layer 2111 lifted by the bridging structure 161 become connected, resulting in a larger area of ​​the lifted region of the optical film layer 2111, which in turn results in a larger area of ​​the bulging region of the optical film layer 2111 away from the substrate 110.

[0141] When the area of ​​the protruding region of the optical film layer 2111 in the direction away from the substrate 110 is large, a shadow will appear on the display module 210, affecting the display performance of the display module 210.

[0142] In the embodiments of this application, the driving chip 130 is located between two adjacent rows of light-emitting units 121 along the first direction X, and between two adjacent columns of light-emitting units 121 along the second direction Y. The bridging structure 161 is located outside the arrangement range of the multiple light-emitting units 121 on the substrate 110, so that at least one light-emitting unit 121 can be spaced between the driving chip 130 and the bridging structure 161, thereby increasing the distance between the driving chip 130 and the bridging structure 161.

[0143] In this way, the portion of the optical film layer 2111 lifted by the driving chip 130 and the portion of the optical film layer 2111 lifted by the bridging structure 161 are not connected. Compared with the driving chip 130 and the bridging structure 161 being arranged adjacently, the area of ​​the area where the optical film layer 2111 is lifted can be reduced, that is, the area of ​​the area where the optical film layer 2111 protrudes in the direction away from the substrate 110 can be reduced, thereby reducing the risk of shadows appearing in the display module 210 and improving the display performance of the display module 210.

[0144] In some examples, such as Figure 5 and Figure 6 As shown, multiple light-emitting units 121 in a light-emitting group 120 are connected to a power supply line group 141 through one or more bridging structures 161.

[0145] This configuration improves the connection flexibility between multiple light-emitting units 121 and the bridging structure 161 in a light-emitting group 120, meeting the needs of different situations.

[0146] In some examples, when multiple light-emitting units 121 in a light-emitting group 120 are connected by at least two bridging structures 161 and power supply wiring groups 141, the at least two bridging structures 161 connected to the multiple light-emitting units 121 in a light-emitting group 120 are spaced apart along a first direction X or a second direction Y.

[0147] This configuration improves the flexibility of the at least two bridging structures 161 connected to multiple light-emitting units 121 in a light-emitting group 120, meeting the needs of different situations.

[0148] Figure 10 The following is a structural block diagram of a display device provided in some embodiments of this application. Referring below... Figure 10 An example is given of a method for displaying images on the display device 200.

[0149] like Figure 10 As shown, the display device 200 may include a motherboard 201, a central control board 202, and a driver board 203. The motherboard 201, the central control board 202, and the driver board 203 are respectively disposed within the receiving space enclosed by the housing 220.

[0150] The motherboard 201, the central control board 202, and the driver board 203 may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPC), and a flexible printed circuit board (FPCB). The specific forms of the motherboard 201, the central control board 202, and the driver board 203 may be the same or different, and the embodiments of this application do not further limit them.

[0151] The display module 210 may also include a main chip 204, a backlight control chip (bcon chip) 205, and a timing control chip (tcon chip) 206. The main chip 204 is located on the motherboard 201, the backlight control chip 205 is located on the central control board 202, and the timing control chip 206 is located on the driver board 203.

[0152] Alternatively, the display device 200 may consist of only the motherboard 201, with the main chip 204, backlight control chip 205, and timing control chip 206 all located on the motherboard 201.

[0153] The embodiments of this application take the example of a display device 200 including a motherboard 201, a central control board 202, and a driver board 203, and will be further illustrated below.

[0154] Continue to refer to Figure 10 The motherboard 201 is connected to the central control board 202 and the driver board 203 respectively, so that the main chip 204 can transmit signals to the backlight control chip 205 and the timing control chip 206 respectively.

[0155] For example, the main chip 204 can receive video sources from external sources and decode the video sources. After decoding the video sources, the main chip 204 can send a portion of the data to the backlight control chip 205 and another portion of the data to the timing control chip 206.

[0156] The timing control chip 206 can be connected to the liquid crystal driving circuit of the liquid crystal panel 212, so that the timing control chip 206 can control the deflection of the liquid crystal molecules 212a.

[0157] The backlight control chip 205 can be connected to the driver chip 130, and the driver chip 130 is connected to the light-emitting unit 121, so that the backlight control chip 205 can control the light-emitting unit 121 to emit light through the driver chip 130.

[0158] The display module 210 may also include a power supply circuit 101, which is connected to the power supply wiring group 141 through a terminal block, so that the power supply circuit 101 can be connected to the light-emitting unit 121 and thus supply power to the light-emitting unit 121.

[0159] The driver chip 130 can receive the light emission state of the light-emitting unit 121 and generate a first feedback signal based on the light emission state of the light-emitting unit 121, and feed the first feedback signal back to the backlight control chip 205. The backlight control chip 205 can generate a second feedback signal based on the first feedback signal and feed the second feedback signal back to the power supply circuit 101. The power supply circuit 101 can supply power to the light-emitting unit 121 based on the second feedback signal to achieve closed-loop control.

[0160] Understandably, in order to simplify the structure of the attached figures, Figure 10 Only one light-emitting chip 1211 in the light-emitting unit 121 is shown, and the number of light-emitting chips 1211 in the light-emitting unit 121 is not limited. Furthermore, to simplify the structure of the drawings, Figure 10 Only one power trace connecting the light-emitting unit 121 and the power supply circuit 101 is shown in the diagram, and the number of power traces in the power trace group 141 is not limited.

[0161] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or as many of the technical features as possible; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light panel, characterized in that, include: substrate; A light-emitting group is disposed on the substrate, the light-emitting group comprising: Multiple light-emitting units are arranged in multiple rows along a first direction and in multiple columns along a second direction, wherein the first direction and the second direction are perpendicular. A driver chip is disposed on the substrate and connected to the light-emitting unit, and the driver chip is used to drive the light-emitting unit to emit light. The light-emitting unit includes: A plurality of light-emitting chips, at least two of which emit light of different colors; the driving chip includes: Chip body; The driving pin groups are multiple, and the multiple driving pin groups are spaced apart along the circumference of the chip body; An input pin group is arranged on one side of a plurality of driving pin groups along the circumference of the chip body, and the input pin group is used to receive input signals; An output pin group is arranged circumferentially along the chip body on one side of the plurality of drive pin groups away from the input pin group, and the output pin group is used to send output signals; A grounding pin is disposed circumferentially between the input pin group and the output pin group, and the grounding pin is used to ground the chip body; The driving pin group includes multiple connection pins, and each of the multiple connection pins in the driving pin group is connected to a corresponding multiple light-emitting chips in the light-emitting unit. The connection pins are used to provide driving signals to the light-emitting chips.

2. The lamp panel according to claim 1, characterized in that, The number of driver chips is multiple, and among the multiple driver chips, the input pin group of one driver chip is connected to the output pin group of another driver chip, so that the multiple driver chips are connected to form a driver chip string; The light panel also includes: A terminal block is disposed on the substrate. The input pin group of the driver chip located at one end of the driver chip string is connected to the terminal block, and the output pin group of the driver chip located at the other end of the driver chip string is connected to the terminal block.

3. The lamp panel according to claim 1, characterized in that, The input pin group includes: A power input pin is provided, wherein the power input pin and the ground pin are arranged adjacently, and the power input pin is used to receive a power signal; A data signal input pin is arranged adjacent to the power input pin along the circumference of the chip body, and the data signal input pin is used to receive data signals; An address signal input pin is disposed adjacent to the power input pin or the data signal input pin along the circumference of the chip body, and the address signal input pin is used to receive an address signal; The light panel also includes: A filtering device is connected between the power input pin and the ground pin, and the filtering device is used to filter the power signal input to the driver chip.

4. The lamp panel according to claim 3, characterized in that, The filtering device includes a filter capacitor.

5. The lamp panel according to claim 1, characterized in that, The output pin group includes: A power output pin is provided, wherein the power output pin and the ground pin are arranged adjacently, and the power output pin is used to output a power supply signal; A data signal output pin is arranged adjacent to the power output pin along the circumference of the chip body, and the data signal output pin is used to output a data signal; An address signal output pin is disposed adjacent to the power output pin or the data signal output pin along the circumference of the chip body, and the address signal output pin is used to output an address signal.

6. The lamp panel according to claim 1, characterized in that, The light panel also includes: A grounding trace is provided on the substrate, and the grounding trace is connected to the grounding pin. A power supply trace assembly is disposed on the substrate; A bridging structure is disposed on the substrate, and the light-emitting unit is connected to the power supply trace group through the bridging structure; Along the second direction, a first wiring channel is formed between two adjacent light-emitting groups, and the grounding wiring group and the power supply wiring group are arranged in different first wiring channels.

7. The lamp panel according to claim 6, characterized in that, The driving chip is positioned within the arrangement range of the multiple light-emitting units on the substrate.

8. The lamp panel according to claim 7, characterized in that, in, The driving chip is located between two adjacent rows of light-emitting units along the first direction and between two adjacent columns of light-emitting units along the second direction. The bridging structure is located outside the arrangement range of the plurality of light-emitting units on the substrate.

9. The lamp panel according to claim 6, characterized in that, The plurality of light-emitting units in one of the light-emitting groups are connected to the power supply wiring group through one or at least two of the bridging structures.

10. A display device, characterized in that, include: Backlight module, the backlight module includes: The lamp panel as described in any one of claims 1 to 9; An optical film layer is disposed on the light-emitting side of the lamp panel; The liquid crystal panel is disposed on the side of the optical film layer away from the lamp panel.

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