Liquid crystal screen heat dissipation structure

Abstract

The utility model relates to display heat management technical field discloses a liquid crystal screen heat dissipation structure, including middle frame (1), install OC module (2) of middle frame (1) front side, install the base plate (3) of middle frame (1) back side, the clamping of OC module (2) and base plate (3) between back light board (4) and set up in the inside of middle frame (1) and located back light board (4) upside LED light bar (5), the gap between the upper edge of base plate (3) and middle frame (1) inserts the heat conduction plate (6), LED light bar (5) is installed in the lower plate surface of heat conduction plate (6) to carry out heat exchange with heat conduction plate (6), the back of base plate (3) is provided with the heat sink (7) of the link to heat conduction plate (6) to pass on heat conduction plate (6) heat to the outside, a liquid crystal screen heat dissipation structure of the utility model, heat conduction plate (6) can export the heat generated when LED light bar (5) works and carry out heat dissipation through heat sink (7), to reduce the working temperature of LED light bar (5), to effectively promote LED light bar (5) and the use time length and life of whole liquid crystal screen.

Description

Technical Field

[0001] This utility model relates to the field of display heat management technology, and in particular to a heat dissipation structure for LCD screens. Background Technology

[0002] like Figure 1 and Figure 2 The diagram shows the internal structure of a liquid crystal display (LCD) screen in the prior art. It mainly includes a mid-frame 1, an OC module 2 mounted on the front of the mid-frame 1, a substrate 3 mounted on the rear of the mid-frame 1, a backlight plate 4 sandwiched between the OC module 2 and the substrate 3, and an LED strip 5 disposed at the upper part of the interior of the mid-frame 1. The OC module 2 integrates a liquid crystal panel and a control circuit for controlling the pattern displayed on the liquid crystal panel. The LED strip 5 provides a light source to the backlight plate 4. Because the backlight plate 4 integrates a polarizer, it can conduct and evenly distribute the light from the LED strip 5 to the back of the liquid crystal panel, thereby illuminating the liquid crystal panel and allowing the human eye to receive the pattern displayed on the liquid crystal panel.

[0003] However, the LED light strip 5 operates within the narrow frame 1, which easily generates a lot of heat. This heat cannot be dissipated quickly, which can easily cause the light strip to burn out or even damage the display screen. Therefore, it still needs to be improved. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing a heat dissipation structure for LCD screens, which can effectively conduct the heat generated by LED light strips to the outside of the LCD screen, thereby extending the service life and lifespan of the LED light strips and the entire LCD screen.

[0005] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method: A liquid crystal display heat dissipation structure includes a middle frame, an OC module mounted on the front side of the middle frame, a substrate mounted on the rear side of the middle frame, a backlight plate sandwiched between the OC module and the substrate, and an LED light strip disposed inside the middle frame and located above the backlight plate. A heat-conducting plate is inserted into the gap between the upper edge of the substrate and the middle frame. The LED light strip is mounted on the lower surface of the heat-conducting plate to exchange heat with the heat-conducting plate. A heat sink is disposed on the back side of the substrate and connected to the heat-conducting plate to transfer the heat of the heat-conducting plate to the outside.

[0006] By adopting the above solution, the heat-conducting plate can conduct the heat generated by the LED light strip during operation and dissipate it through the heat sink, thereby reducing the operating temperature of the LED light strip and effectively improving the service life and lifespan of the LED light strip and the entire LCD screen.

[0007] Preferably, the heat sink includes a heat sink plate attached to the back of the substrate and a plurality of heat sink fins arranged on the heat sink plate.

[0008] By adopting the above scheme, the heat dissipation fins can increase the surface area of ​​the heat sink, thereby improving the heat dissipation performance.

[0009] Preferably, the heat dissipation fins are arranged horizontally.

[0010] By adopting the above scheme, the horizontally arranged heat dissipation fins can further increase the surface area of ​​the heat sink, thereby further improving the heat dissipation performance.

[0011] Preferably, both sides of the heat dissipation fins are provided with a wave groove, which is arranged along the length of the heat dissipation fins.

[0012] By adopting the above scheme, the wave groove can effectively increase the surface area of ​​the heat dissipation fins, thereby increasing their contact area with the outside air, and is more conducive to air circulation between adjacent heat dissipation fins, resulting in better heat dissipation performance.

[0013] Preferably, the heat dissipation fins are detachably connected to the heat dissipation plate. Both sides of the heat dissipation plate are provided with long, vertically arranged mounting seats. Each mounting seat has a slot for horizontal insertion of the two ends of the heat dissipation fins. There are multiple slots arranged vertically. A pin is inserted into the upper end of the mounting seat, which penetrates the entire mounting seat and slot to lock the heat dissipation fins on the mounting seat. The edge of the heat dissipation fins near the heat dissipation plate is in contact with the surface of the heat dissipation plate.

[0014] The above-described design, with its detachable heat sink fins, facilitates cleaning and allows for adjustment of the number of fins as needed. The slots on the mounting base enable efficient and stable installation of the heat sink fins. Pins securely fasten the fins to the heat sink plate, enhancing installation stability.

[0015] Preferably, the heat dissipation fins have an outwardly convex arc-shaped surface near the edge of the heat dissipation plate, and the surface of the heat dissipation plate has an arc-shaped groove for the arc-shaped surface to abut.

[0016] By adopting the above solution, the abutting fit between the arc-shaped surface and the arc-shaped groove can not only achieve a tight fit between the heat dissipation fins and the heat dissipation plate, but also increase the contact area, making the heat conduction between the heat dissipation fins and the heat dissipation plate better, thereby improving the heat dissipation performance.

[0017] Preferably, the upper end of the pin is provided with a gripping part.

[0018] By adopting the above solution, the gripping component is easier to apply force, which can effectively improve the insertion and removal efficiency and convenience of the pin component.

[0019] Preferably, a long strip-shaped positioning seat is vertically arranged at the middle position of the heat sink away from the substrate. The positioning seat is higher than the mounting seat in the horizontal direction. On the side of the positioning seat away from the substrate, a number of slots are opened in the vertical direction for a number of heat sink fins to be engaged one by one. The slots correspond one by one with a number of slots in the vertical direction.

[0020] By adopting the above solution, the positioning base, which is horizontally higher than the mounting base, can help users perform single-point positioning of the heat sink fins, thereby improving the pre-positioning efficiency and convenience of the heat sink fins, and making the installation of the heat sink fins more convenient.

[0021] Preferably, the heat dissipation fins are provided with limiting members that abut against both sides of the positioning seat.

[0022] By adopting the above solution, the limiting component can help the heat sink fins be laterally positioned on the positioning seat, thereby improving the pre-positioning accuracy and convenience of the heat sink fins.

[0023] Preferably, the inner wall of the slot has several wave grooves that are elastically engaged with the wave groove one.

[0024] The above solution features a simple and flexible interlocking mechanism between the second and first wave grooves. It also prevents the heat sink fins from detaching laterally from the positioning seat after entering the slot, thus facilitating the subsequent installation and locking of the heat sink fins.

[0025] This utility model has significant technical effects due to the adoption of the above technical solutions: the heat-conducting plate can conduct the heat generated by the LED light strip during operation and dissipate it through the heat sink to reduce the working temperature of the LED light strip, thereby effectively improving the service life and lifespan of the LED light strip and the entire LCD screen. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the internal structure of an LCD screen in the prior art; Figure 2 for Figure 1 An enlarged schematic diagram of part A shown; Figure 3 This is a schematic diagram of the internal structure of this embodiment; Figure 4 for Figure 3 An enlarged schematic diagram of part B is shown below; Figure 5 This is a schematic diagram of the structure of this embodiment; Figure 6 for Figure 5 An enlarged schematic diagram of section C is shown below; Figure 7 for Figure 5 An enlarged schematic diagram of part D is shown.

[0027] The parts referred to by the numbers in the above attached figures are as follows: 1. Mid-frame; 2. OC module; 3. Substrate; 4. Backlight panel; 5. LED light strip; 6. Heat-conducting plate; 7. Heat sink; 8. Heat sink plate; 9. Heat sink fins; 10. Wave groove one; 11. Mounting base; 12. Slot; 13. Pin; 14. Curved surface; 15. Curved groove; 16. Grip; 17. Positioning base; 18. Slot; 19. Limiting component; 20. Wave groove two; 21. Spacer ring; 22. Outer frame; 23. First limiting strip; 24. Second limiting strip; 25. First screw; 26. Second screw; 27. Guide arc surface. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0029] like Figures 3 to 7 As shown, this embodiment discloses a liquid crystal screen heat dissipation structure, including a middle frame 1, an OC module 2 mounted on the front side of the middle frame 1, an aluminum substrate 3 mounted on the rear side of the middle frame 1, a backlight plate 4 sandwiched between the OC module 2 and the substrate 3, and an LED light strip 5 disposed inside the middle frame 1 and located above the backlight plate 4. An aluminum heat-conducting plate 6 is inserted into the gap between the upper edge of the substrate 3 and the middle frame 1. The heat-conducting plate 6 is elongated and disposed along the upper edge of the middle frame 1. The LED light strip 5 is fixed to the lower surface of the heat-conducting plate 6 with thermally conductive adhesive to exchange heat with the heat-conducting plate 6. A heat sink 7 is integrally connected to the heat-conducting plate 6 on the back side of the substrate 3 to transfer the heat of the heat-conducting plate 6 to the outside. Specifically, the heat sink 7 includes a heat sink 8 vertically connected to the heat sink 6 and attached to the back side of the substrate 3, and a plurality of heat sink fins 9 arranged on the heat sink 8, each heat sink fin 9 being horizontally disposed. The heat sink 8 is the same length as the heat conduction plate 6 and is set horizontally, and the heat sink fins 9 are the same length as the heat sink 8 in the horizontal direction.

[0030] In order to improve the heat dissipation performance of the heat dissipation fins 9, multiple wave grooves 10 are provided on both sides of the heat dissipation fins 9. The wave grooves 10 are elongated in the horizontal direction and are arranged along the length of the heat dissipation fins 9.

[0031] To facilitate the replacement and cleaning of the heat dissipation fins 9, the heat dissipation fins 9 are detachably connected to the heat dissipation plate 8. Specifically, both sides of the heat dissipation plate 8 are fixed with elongated and vertically arranged mounting bases 11. Each mounting base 11 has slots 12 for horizontal insertion of both ends of the heat dissipation fins 9. Multiple slots 12 are arranged vertically. A pin 13 is inserted into the upper end of the mounting base 11, penetrating the entire mounting base 11 and slot 12 to lock the heat dissipation fins 9 onto the mounting base 11. The edge of the heat dissipation fins 9 near the heat dissipation plate 8 is in contact with the surface of the heat dissipation plate 8.

[0032] In order to improve the thermal conductivity between the heat dissipation fins 9 and the heat dissipation plate 8, the heat dissipation fins 9 are provided with an outwardly convex arc-shaped surface 14 near the edge of the heat dissipation plate 8, and the surface of the heat dissipation plate 8 is provided with an arc-shaped groove 15 for the arc-shaped surface 14 to abut against.

[0033] To improve the operational efficiency and convenience of the pin 13, a grip 16 is integrally provided on the upper end of the pin 13.

[0034] To facilitate pre-positioning of the heat dissipation fins 9 during installation, a long strip-shaped positioning seat 17 is vertically fixed at the middle position of the heat dissipation plate 8 away from the surface of the substrate 3 in the horizontal direction. The positioning seat 17 is higher than the mounting seat 11 in the horizontal direction so that the positioning seat 17 can mate with the heat dissipation fins 9 before the mounting seat 11. On the side of the positioning seat 17 away from the substrate 3, a plurality of slots 18 are formed in the vertical direction for the plurality of heat dissipation fins 9 to be engaged one by one. The plurality of slots 18 correspond one-to-one with a plurality of slots 12 in the vertical direction.

[0035] To achieve lateral pre-positioning of the heat dissipation fins 9 on the heat dissipation plate 8, limiting members 19 are integrally provided on the heat dissipation fins 9, which respectively abut against both sides of the positioning seat 17. The inner sidewall of the slot 18 is distributed with a number of wave grooves 20 that elastically engage with the wave grooves 10.

[0036] To ensure stable installation of the LCD screen, a baffle ring 21 is fixed around the inner sidewall of the middle frame 1. The OC module 2 and the heat-conducting plate 6 abut against the front and rear sides of the baffle ring 21, respectively. An outer frame 22 is provided around the outer side of the LCD screen. The outer frame 22 is in the shape of a right-angled steel frame and includes a first limiting strip 23 wrapped around the front side of the OC module 2 and a second limiting strip 24 wrapped around the outer side of the middle frame 1. The first limiting strip 23 and the second limiting strip 24 are integrally formed. Several first screws 25 are distributed on the second limiting strip 24. The first screws 25 are screwed sequentially into the second limiting strip 24, the middle frame 1, and the heat-conducting plate 6 to complete the splicing and fixing of the overall LCD screen structure. The heat sink 8 is attached to the back of the substrate 3 and fixed by several second screws 26.

[0037] The specific usage process is as follows: When the LCD screen is working, the LED light strip 5 provides a light source for the backlight panel 4 below, thereby powering the LCD panel inside the OC module 2 of the backlight panel 4. At this time, the heat-conducting plate 6 fixed above the LED light strip 5 can conduct the heat generated by the LED light strip 5 to the heat sink 8 through thermally conductive adhesive, and dissipate heat through the heat sink fins 9, thereby reducing the operating temperature of the LED light strip 5 and extending its working time and lifespan as well as that of the entire LCD screen.

[0038] When replacing the heat sink fin 9, use the gripping piece 16 to pull the pin 13 out of the two mounting bases 11 respectively to release the locking at both ends of the heat sink fin 9. Then, move the heat sink fin 9 horizontally out of the slots 12 of the two mounting bases 11 to complete the removal of the current heat sink fin 9. During this process, it is necessary to overcome the elastic clamping force between the first wave groove 10 and the second wave groove 20.

[0039] When installing the heat sink fin 9, first align the gap between the two limiting members 19 on the heat sink fin 9 with a slot 18 on the positioning seat 17, and use the guiding arc surface 27 at the opening of the slot 18 to engage it within the slot 18. During this process, the elastic engagement force between the first wave groove 10 and the second wave groove 20 must be overcome. When the heat sink fin 9 horizontally enters to the bottom of the slot 18, the arc-shaped surface 14 on the heat sink fin 9 can abut against the arc-shaped groove 15 of the heat sink plate 8, and the two limiting members 19 abutting against both sides of the positioning seat 17 can complete the horizontal positioning of the heat sink fin 9. Simultaneously, the engagement between the first wave groove 10 and the second wave groove 20 can prevent the heat sink fin 9 from detaching from the positioning seat 17. During this process, both ends of the heat sink fin 9 can be engaged in the slots 12 of the mounting seats 11 on both sides, thereby achieving the pre-positioning of the heat sink fin 9.

[0040] After the pre-positioning is completed, the pin 13 is inserted into the corresponding mounting base 11 from bottom to top with the holding member 16, and passes through the longitudinally arranged heat dissipation fins 9 in sequence, thereby completing the locking of the heat dissipation fins 9.

Claims

1. A liquid crystal display heat dissipation structure, comprising a middle frame (1), an OC module (2) mounted on the front side of the middle frame (1), a substrate (3) mounted on the rear side of the middle frame (1), a backlight plate (4) sandwiched between the OC module (2) and the substrate (3), and an LED light strip (5) disposed inside the middle frame (1) and located on the upper side of the backlight plate (4), characterized in that: A heat-conducting plate (6) is inserted into the gap between the upper edge of the substrate (3) and the middle frame (1). An LED light strip (5) is installed on the lower surface of the heat-conducting plate (6) to exchange heat with the heat-conducting plate (6). A heat sink (7) is provided on the back of the substrate (3) to connect to the heat-conducting plate (6) and transfer the heat of the heat-conducting plate (6) to the outside.

2. The liquid crystal screen heat dissipation structure according to claim 1, characterized in that: The heat sink (7) includes a heat sink plate (8) attached to the back of the substrate (3) and a plurality of heat sink fins (9) arranged on the heat sink plate (8).

3. The liquid crystal screen heat dissipation structure according to claim 2, characterized in that: The heat dissipation fins (9) are arranged horizontally.

4. The liquid crystal screen heat dissipation structure according to claim 3, characterized in that: Both sides of the heat dissipation fins (9) are provided with a wave groove (10), which is provided along the length of the heat dissipation fins (9).

5. The liquid crystal screen heat dissipation structure according to claim 4, characterized in that: The heat dissipation fins (9) are detachably connected to the heat dissipation plate (8). Both sides of the heat dissipation plate (8) are provided with long and vertically arranged mounting seats (11). Each mounting seat (11) has a slot (12) for horizontal insertion of the two ends of the heat dissipation fins (9). There are multiple slots (12) arranged vertically. The upper end of the mounting seat (11) is inserted with a heat dissipation fin (9) that runs vertically through the entire mounting seat (11) and the slot (12) to lock the heat dissipation fins (9) on the mounting seat (11). The edge of the heat dissipation fins (9) near the heat dissipation plate (8) is attached to the surface of the heat dissipation plate (8).

6. The liquid crystal screen heat dissipation structure according to claim 5, characterized in that: The heat dissipation fins (9) have an outwardly protruding arc-shaped surface (14) near the edge of the heat dissipation plate (8), and the heat dissipation plate (8) has an arc-shaped groove (15) for the arc-shaped surface (14) to abut.

7. The liquid crystal screen heat dissipation structure according to claim 5, characterized in that: A gripper (16) is provided at the upper end of the pin (13).

8. The liquid crystal screen heat dissipation structure according to claim 5, characterized in that: A long strip-shaped positioning seat (17) is vertically arranged at the middle position of the heat sink (8) away from the substrate (3) in the horizontal direction. The positioning seat (17) is higher than the mounting seat (11) in the horizontal direction. On the side of the positioning seat (17) away from the substrate (3), a number of slots (18) are opened in the vertical direction for a number of heat sink fins (9) to be engaged one by one. The slots (18) correspond one by one with a number of slots (12) in the vertical direction.

9. The liquid crystal screen heat dissipation structure according to claim 8, characterized in that: The heat dissipation fins (9) are provided with limiting members (19) that abut against both sides of the positioning seat (17).

10. A liquid crystal screen heat dissipation structure according to claim 8, characterized in that: The inner wall of the slot (18) is provided with several wave grooves (20) that are elastically engaged with wave groove one (10).

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