Backlight module and display device

Abstract

The application discloses a backlight module and a display device. The backlight module comprises a circuit board assembly and a plurality of lamp beads. The circuit board assembly comprises a circuit board. The plurality of lamp beads are arranged on the circuit board and electrically connected to the circuit board. The circuit board assembly further comprises a plurality of mesh structures. The mesh structures are suitable for diffusing light emitted by the lamp beads. Through the technical scheme, the circuit board assembly can diffuse the light emitted by the lamp beads. The direct light emitted by the lamp beads is scattered, so that the direct light is converted into a uniform surface light source. The light uniformity of the entire light emitting surface is realized. In the case that the number of optical films arranged on the light emitting side of the backlight module is reduced, the light uniformity of the light emitting surface is not reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a backlight module and display device. Background Technology

[0002] To improve the uniformity of light emission in the backlight module, a film layer structure is set on one side of the light-emitting surface of the backlight module to process the light. In related technologies, the film layer structure includes more than five film layers, which results in a large thickness of the film layer structure and a large overall thickness of the backlight module. This is not conducive to the thinning of the backlight module and results in a large thickness of the display device. If the thickness of the film layer is reduced, it will affect the light emission performance of the backlight module. Utility Model Content

[0003] This application provides a backlight module and display device that can balance the film thickness and display performance of the backlight module, so as to at least partially solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, a backlight module is provided, comprising: Circuit board assembly, including circuit board; and Multiple LED beads are disposed on the circuit board and electrically connected to the circuit board; The circuit board assembly further includes multiple dot structures, which are adapted to diffuse the light emitted by the LED beads.

[0005] Optionally, the circuit board assembly further includes: A reflective layer is located on the circuit board; The dot structure is located on the side of the reflective layer away from the circuit board.

[0006] Optionally, the LED beads are disposed on the reflective layer and are arranged with the LED bead dot structure.

[0007] Optionally, the dot structure is configured as a groove; The light emitted from the side light-emitting surface of the lamp bead is diffused by the groove.

[0008] Optionally, the backlight module further includes: An encapsulation layer is disposed on the circuit board and the LED chip, for encapsulating the LED chip to the circuit board; The encapsulation layer is configured as a transparent adhesive layer containing phosphor, or as an injection-molded layer containing phosphor, so that the light emitted by the LED bead is converted into white light through the encapsulation layer.

[0009] Optionally, the LED bead is configured as a blue light chip, and the phosphor is configured as a yellow phosphor, so that the blue light emitted by the LED bead is converted into white light through the encapsulation layer.

[0010] Optionally, the backlight module further includes: Multiple spaced diffuse reflection layers are disposed on the encapsulation layer; and The membrane structure includes one of the following: a spectrophotometer and a diffusion membrane; Wherein, from a viewing angle along the thickness direction of at least one of the LED beads and the diffuse reflection layer, each of the diffuse reflection layers covers the corresponding LED bead; One of the beam-splitting film and the diffusion film is located on the side of the plurality of diffuse reflection layers away from the encapsulation layer.

[0011] Optionally, the diffuse reflection layer is a white oil-printed pattern layer formed by screen printing.

[0012] Optionally, the film structure further includes a composite prism sheet and an upper diffusion film arranged from bottom to top; The composite prism sheet is located between the upper diffusion film and one of the beam splitting film and diffusion film.

[0013] According to a second aspect of this application, a display device is provided, including a backlight module as described above.

[0014] The beneficial effect of this application is that it provides a backlight module and display device that can balance the film thickness and display performance of the backlight module.

[0015] More specifically, some embodiments of this application may produce the following specific beneficial effects: In the backlight module of this application embodiment, the backlight module includes a circuit board assembly and multiple LED chips. The circuit board assembly includes a circuit board on which the multiple LED chips are disposed and electrically connected. The circuit board assembly also includes multiple dot structures adapted to diffuse the light emitted by the LED chips. Through the above technical solution, the circuit board assembly can diffuse the light emitted by the LED chips, thereby dispersing the direct light emitted by the LED chips and converting it into a uniform surface light source, achieving uniform light emission across the entire light-emitting surface. This reduces the number of optical films on the light-emitting side of the backlight module without reducing the uniformity of light emission.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0018] Figure 1 This is a schematic diagram of the overall structure of the backlight module provided in an exemplary embodiment of this application; Figure 2 This is a schematic diagram of another overall structure of the backlight module provided in an exemplary embodiment of this application; Figure 3 This is a schematic diagram of the reflective layer and dot structure, as well as the position structure of the LED beads, provided in an exemplary embodiment of this application. Figure 4 This is a schematic diagram showing the positional structure of the silkscreen pattern, LED beads, and encapsulation layer provided in an exemplary embodiment of this application; Figure 5 This is a schematic diagram of a display device provided in an exemplary embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 10. Display devices; 100. Backlight module; 110. Circuit board assembly; 111. Circuit board; 112. Dot structure; 113. Reflective layer; 120. LED chip; 130. Encapsulation layer; 140. Diffuse reflection layer; 150. Membrane structure; 151. Spectrophotometer; 152. Lower diffuser; 153. Composite prism sheet; 154. Upper diffuser; 200. First polarizer; 300, Display panel; 310, First substrate; 320, Second substrate; 330, Liquid crystal layer; 340, Frame adhesive; 400. Second polarizer. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0021] In the following detailed description, only certain embodiments of the invention are shown and described by way of simple illustration. As will be understood by those skilled in the art, the embodiments described herein can be modified in various ways without departing from the spirit or scope of the invention.

[0022] In the accompanying drawings, the thickness of layers, films, plates, regions, etc., may be exaggerated for clarity, better understanding, and ease of description. It should be understood that when an element such as a layer, film, region, or substrate is referred to as "located on another element," it may be located directly on the other element or there may be inserted elements.

[0023] Furthermore, unless explicitly stated otherwise, the word "including" and its variations such as "comprising" or "containing" will be understood to imply the inclusion of the discussed element, but not necessarily the exclusion of other elements. Further, in the specification, the phrase "on" means placed above or below the object part, and not necessarily on the upper side of the object part based on the direction of gravity.

[0024] It will be understood that although the terms “first,” “second,” etc., may be used in this document to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another.

[0025] As used in this article, the singular forms “one,” “a,” and “the” are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0026] It will also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the said feature or component, but do not exclude the presence or addition of one or more other features or components.

[0027] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, it can be formed directly or indirectly on that other layer, region, or component. For example, intermediate layers, regions, or components may exist.

[0028] According to a first aspect of this application, a backlight module 100 is provided, with reference to... Figure 1 and Figure 2 The backlight module 100 includes a circuit board assembly 110 and multiple LEDs 120.

[0029] The circuit board assembly 110 includes a circuit board 111, on which a plurality of LED beads 120 are disposed and electrically connected to the circuit board 111. The circuit board assembly 110 also includes a plurality of dot structures 112. In this embodiment, the dot structures 112 are adapted to diffuse the light emitted by the LED beads 120.

[0030] By utilizing the above technical solution, the circuit board assembly 110 can diffuse the light emitted by the lamp bead 120. By breaking down the direct light emitted by the lamp bead 120, it is transformed into a uniform surface light source, thereby achieving uniform light emission across the entire light-emitting surface. This reduces the number of optical films on the light-emitting side of the backlight module 100 without reducing the uniformity of light emission from the light-emitting surface.

[0031] It is understood that multiple LED beads 120 are spaced apart on the circuit board 111. The dot structure 112 can diffuse the light emitted by the LED beads 120, meaning that the dot structure 112 can evenly disperse the light emitted by the LED beads 120 to at least a portion of the light-emitting surface.

[0032] In some embodiments, the circuit board assembly 110 further includes a reflective layer 113.

[0033] In this embodiment, the reflective layer 113 is located on the circuit board 111; wherein the dot structure 112 is disposed on the side of the reflective layer 113 away from the circuit board 111.

[0034] By setting the reflective layer 113 and placing the dot structure 112 on the side of the reflective layer 113 away from the circuit board 111, the light incident on the circuit board 111 can be efficiently reflected back to the light output direction under the action of the reflective layer 113. In conjunction with the dot structure 112, the light is reflected and diffused, further improving the light output uniformity of the backlight module 100.

[0035] For example, the reflective layer 113 in this embodiment can be ink on the surface of the circuit board 111. It is a coating applied to the surface of the circuit board 111 to provide protection and insulation. The ink is set to white, which can reflect the light emitted from the LED bead 120 to a large extent. By using the ink of the circuit board 111 itself as the reflective layer 113, it is not necessary to set an additional reflective film.

[0036] In some embodiments, the LED beads 120 are disposed on the reflective layer 113 and spaced apart from the dot structure 112. In this embodiment, multiple LED beads 120 are disposed on the reflective layer 113, and the LED beads 120 and the dot structure 112 are spaced apart. This is beneficial for heat dissipation of the LED beads 120, preventing the heat generated by the LED beads 120 after emitting light for a period of time from affecting the dot structure 112. On the other hand, by using the dot structure 112 to reflect the light emitted from the light-emitting surface of the LED beads 120, the light is homogenized through the reflective layer 113 and the dot structure 112 from the initial stage of emission from the LED beads 120, which can reduce the dependence on the film structure 150 on the light-emitting surface side.

[0037] For example, a dot structure 112 is provided between two adjacent LED beads 120. Alternatively, two or three can be provided, and there is no limitation thereto.

[0038] In some embodiments, the dot structure 112 is configured as a groove; wherein light emitted from the side light-emitting surface of the lamp bead 120 is diffused by the groove.

[0039] By constructing the dot structure 112 as a groove, the light emitted from the side light-emitting surface of the lamp bead 120 is diffused by the groove, thereby improving the diffusion effect.

[0040] refer to Figure 1 In this embodiment, the groove can be a curved groove, allowing light to overlap and blend better between adjacent LED beads 120, thereby achieving a uniform surface light effect within a shorter mixing distance. Further, refer to... Figure 3 You can set the top view of the groove to a circle, that is, the groove is a circular groove.

[0041] For example, taking the multiple LED beads 120 in this embodiment of the application as being configured such that all four sides and one top surface can emit light, the light emitted from the four sides of each LED bead 120 will be emitted toward the circuit board 111. The grooves provided on the reflective layer 113 can reflect and diffuse the light emitted from the four sides of each LED bead 120 toward the circuit board 111. On the one hand, this can simplify the structure of the backlight module 100, and on the other hand, it is also beneficial to achieve the thinning of the backlight module 100, thereby achieving a balance between the film thickness and display performance of the backlight module 100.

[0042] In some embodiments, reference Figure 1 The backlight module 100 further includes an encapsulation layer 130.

[0043] In this embodiment, the encapsulation layer 130 is disposed on the circuit board 111 and the lamp bead 120, and is used to encapsulate the lamp bead 120 to the circuit board 111.

[0044] By setting the encapsulation layer 130, the light is scattered and reflected multiple times under the action of the encapsulation layer 130 before it is emitted, which can further improve the uniformity of light emission.

[0045] For example, the encapsulation layer 130 is configured as a transparent adhesive layer containing phosphor, so that the light emitted by the LED bead 120 is converted into white light through the encapsulation layer 130. That is, under the action of the phosphor in the encapsulation layer 130, the light mixes with the light emitted by the phosphor to emit white light. In this way, the setting of quantum dot film (QD film) and light transmission film that allows specific wavelengths of light can be eliminated.

[0046] In some other embodiments, the encapsulation layer 130 may also be an injection-molded layer with phosphor, so that the light emitted by the lamp bead 120 is converted into white light by the encapsulation layer 130.

[0047] By setting the encapsulation layer 130 as a transparent adhesive layer containing phosphor or an injection-molded layer containing phosphor, the conversion of light color can be accomplished. For example, the transparent adhesive layer can be made of transparent silicone doped with phosphor, and the injection-molded layer can be made of injection molding material doped with phosphor.

[0048] In some embodiments, the LED chip 120 is configured as a blue light chip, and the phosphor is configured as a yellow phosphor, so that the blue light emitted by the LED chip 120 is converted into white light by the encapsulation layer 130.

[0049] It is understandable that when the light-emitting chip of the LED 120 is set as a blue light chip, the blue light chip emits blue light. The blue photon energy of the blue light can efficiently excite the yellow phosphor. After the phosphor is excited, it emits yellow light. The remaining unabsorbed blue light mixes with the yellow light to form white light, so that the backlight module 100 emits white light. In this case, the quantum dot film (QD film) and the blue light transmission film can be eliminated. That is, by setting the phosphor in the encapsulation layer 130, two films can be reduced.

[0050] In some embodiments, reference Figure 1 The backlight module 100 further includes a diffuse reflection layer 140 and a film structure 150.

[0051] In this embodiment, the diffuse reflection layer 140 is disposed on the encapsulation layer 130, and multiple diffuse reflection layers 140 are spaced apart on the encapsulation layer 130. The film structure 150 in this embodiment includes one of a beam-splitting film 151 and a diffusion film. (Reference) Figure 1 and Figure 2 The diffuse reflection layer 140 is disposed on the side of the encapsulation layer 130 away from the reflective layer 113.

[0052] In this configuration, from a perspective along the thickness direction of at least one of the LED beads 120 and the diffuse reflection layer 140, each diffuse reflection layer 140 covers the corresponding LED bead 120, and one of the beam splitting film 151 and the diffusion film is located on the side of the plurality of diffuse reflection layers 140 away from the encapsulation layer 130.

[0053] In this embodiment, a diffuse reflection layer 140 is provided on the encapsulation layer 130, and each diffuse reflection layer 140 can cover a corresponding LED bead 120. After the light emitted by the LED bead 120 is converted into white light by the encapsulation layer 130, it is then incident on the diffuse reflection layer 140. Under the action of the diffuse reflection layer 140, the light can be scattered to disrupt the direction of the light, so that it changes from a point light source to a surface light source, thereby reducing the shadow effect.

[0054] By setting the diffuse reflection layer 140, only one diffusion film or one beam-splitting film 151 needs to be set on top of the diffuse reflection layer 140 to achieve the same light scattering effect as when the film structure 150 includes four beam-splitting films 151. The diffusion film set on top of the diffuse reflection layer 140 is defined as the lower diffusion film 152.

[0055] Specifically, refer to Figure 1 A lower diffusion film 152 is disposed on the diffuse reflection layer 140. Through the synergistic effect of the diffuse reflection layer 140 and the lower diffusion film 152, the light scattering effect of the four beam splitting films 151 stacked together can be achieved, thus eliminating the need for the four beam splitting films 151.

[0056] Or, refer to Figure 2 A beam splitter 151 can be set on the diffuse reflection layer 140. In this way, the diffuse reflection layer 140 and the beam splitter 151 can achieve the effect of four beam splitters 151. In this case, the setting of three beam splitters 151 can be reduced.

[0057] It should be noted that the lower diffusion film 152 and the beam splitter 151 are not simultaneously disposed on the diffuse reflection layer 140.

[0058] In some embodiments, the diffuse reflection layer 140 is a white ink printed pattern layer formed by screen printing. That is, the diffuse reflection layer 140 has a microstructure, which can be used to scatter light.

[0059] Figure 4 This is a schematic diagram showing the positional structure of the LED chip 120, diffuse reflection layer 140, and encapsulation layer 130 from bottom to top, viewed along the thickness direction of the LED chip 120. (Reference) Figure 4 The diffuse reflection layer 140 covers the LED chip 120, that is, the orthographic projection of the LED chip 120 in the encapsulation layer 130 is located within the orthographic projection of the diffuse reflection layer 140 in the encapsulation layer 130, wherein the LED chip 120 and the diffuse reflection layer 140 are configured to correspond one-to-one.

[0060] It can be understood that the diffuse reflection layer 140 is a white ink printing pattern layer formed by screen printing, which means that the white ink printing pattern layer has a number of white ink particles arranged in a certain way. In this way, the light emitted by the lamp bead 120 is converted to white by the encapsulation layer 130 and then enters the diffuse reflection layer 140. It is repeatedly reflected by the white ink particles and passes through the diffuse reflection layer 140 to achieve the function of heat dissipation.

[0061] refer to Figure 4 The dashed line represents the projection outline of the diffuse reflection layer 140 on the encapsulation layer 130. The shape of the projection outline of the diffuse reflection layer 140 can be a polygon with an outer edge that is curved.

[0062] In some embodiments, to further improve the light emission performance of the backlight module 100, reference is made. Figure 1 The film structure 150 in this embodiment further includes a composite prism sheet 153 and an upper diffusion film 154 disposed from bottom to top; wherein the composite prism sheet 153 is located between the upper diffusion film 154 and one of the beam splitting film 151 and the diffusion film.

[0063] By setting the composite prism sheet 153, the light is brightened, while the upper diffusion film 154 ensures uniform light output. Exemplarily, the composite prism sheet 153 can be a composite prism sheet 153 that includes a base layer, a heat-resistant layer, a prism layer, and may integrate light-diffusing particles. The specific structure of the composite prism sheet 153 is not limited in this application embodiment, as long as it achieves the effect of brightening the light.

[0064] In summary, this application provides a backlight module 100. By arranging multiple LEDs 120 on a circuit board 111, the light emitted by the LEDs 120 can be diffused using a dot structure 112. Furthermore, by placing phosphor within an encapsulation layer 130 and providing a diffuse reflection layer 140 on the encapsulation layer 130 to cover the LEDs 120, the functions of a beam splitter 151, a quantum dot film (QD film), and a blue light transmission film are essentially integrated into the encapsulation layer 130 and the diffuse reflection layer 140, thereby making the film... The layer structure 150 reduces the use of quantum dot film (QD film) and blue light transmission film, as well as three or four beam splitting films 151. That is, the film layer structure 150 in this embodiment includes one lower diffusion film 152 or beam splitting film 151, an upper diffusion film 154 and a composite prism sheet 153, totaling three films. This allows the film layer structure 150 to reduce the use of five films, achieving a thinner and lighter backlight module 100 while ensuring the light emission performance of the backlight module 100.

[0065] According to a second aspect of this application, a display device 10 is provided, including a backlight module 100 as described above.

[0066] The display device 10 in this embodiment includes the backlight module 100 as described above, and therefore has all the beneficial effects of the backlight module 100, which will not be elaborated here.

[0067] The display device 10 in this embodiment further includes a first polarizer 200, a display panel 300, and a second polarizer 400. The first polarizer 200 is disposed on the light-emitting side of the display panel 300; the second polarizer 400 is disposed on the side of the display panel 300 away from the first polarizer 200; and the backlight module 100 is disposed on the side of the second polarizer 400 away from the display panel 300.

[0068] Below, for reference Figure 5 Taking a liquid crystal display panel 300 as an example, the liquid crystal display panel 300 includes a first substrate 310 and a second substrate 320 disposed opposite to each other, and a liquid crystal layer 330 located between the first substrate 310 and the second substrate 320. The first substrate 310 may be an array substrate, including a first substrate and a driving circuit layer located on the first substrate. The first substrate may be a flexible substrate or a rigid substrate, and the driving circuit layer includes a thin-film transistor array. The second substrate 320 may be a color filter substrate, including a second substrate and a color resist layer located on the second substrate. The second substrate may be a flexible substrate or a rigid substrate, and the color resist layer includes at least one of red, green, and blue color resists. The display panel 300 also includes a sealant 340, which is located between the first substrate 310 and the second substrate 320 and surrounds the liquid crystal layer 330.

[0069] The first polarizer 200 is located on the light-emitting side of the display panel 300, that is, on the side of the second substrate 320 away from the first substrate 310. The second polarizer 400 is located on the light-incident side of the display panel 300, that is, on the side of the first substrate 310 away from the second substrate 320. The second polarizer 400 is used to polarize the light emitted by the backlight module 100, and the first polarizer 200 is used to adjust the polarization angle to achieve image display. The backlight module 100 is disposed on the light-incident side of the display panel 300 to provide a light source for the display panel 300. The backlight module 100 is the backlight module 100 described above, wherein the lamp bead 120 of the backlight module 100 can be an LED, or a Mini-LED or Micro-LED; the lamp bead 120 is a blue LED, which can convert blue light into white light through its encapsulation layer 130 for emission.

[0070] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0071] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0072] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0073] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A backlight module, characterized in that, include: Circuit board assembly, including circuit boards; Multiple LED beads are disposed on the circuit board and electrically connected to the circuit board; The circuit board assembly further includes multiple dot structures, which are adapted to diffuse the light emitted by the LED beads.

2. The backlight module according to claim 1, characterized in that, The circuit board assembly also includes: A reflective layer is located on the circuit board; The dot structure is located on the side of the reflective layer away from the circuit board.

3. The backlight module according to claim 2, characterized in that, The LED beads are disposed on the reflective layer and are spaced apart from the dot structure.

4. The backlight module according to claim 1, characterized in that, The dot structure is constructed as grooves; The light emitted from the side light-emitting surface of the lamp bead is diffused by the groove.

5. The backlight module according to claim 1, characterized in that, The backlight module also includes: An encapsulation layer is disposed on the circuit board and the LED chip, for encapsulating the LED chip to the circuit board; The encapsulation layer is configured as a transparent adhesive layer containing phosphor, or as an injection-molded layer containing phosphor, so that the light emitted by the LED bead is converted into white light through the encapsulation layer.

6. The backlight module according to claim 5, characterized in that, The LED bead is configured as a blue light chip, and the phosphor is configured as a yellow phosphor, so that the blue light emitted by the LED bead is converted into white light through the encapsulation layer.

7. The backlight module according to claim 5, characterized in that, The backlight module also includes: Multiple spaced diffuse reflection layers are disposed on the encapsulation layer; and The membrane structure includes one of the following: a spectrophotometer and a diffusion membrane; Wherein, from a viewing angle along the thickness direction of at least one of the LED beads and the diffuse reflection layer, each of the diffuse reflection layers covers the corresponding LED bead; One of the beam-splitting film and the diffusion film is located on the side of the plurality of diffuse reflection layers away from the encapsulation layer.

8. The backlight module according to claim 7, characterized in that, The diffuse reflection layer is a white oil-printed pattern layer formed by screen printing.

9. The backlight module according to claim 7, characterized in that, The membrane structure also includes a composite prism sheet and an upper diffusion film arranged from bottom to top; The composite prism sheet is located between the upper diffusion film and one of the beam splitting film and diffusion film.

10. A display device, characterized in that, This includes the backlight module as described in any one of claims 1 to 9.

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