An ultra-thin mini LED module

Abstract

The application relates to the field of LED display, and discloses an ultrathin mini LED module. In the application, the backlight assembly comprises a mini LED soft plate, a FILM structure and a die-cast rear shell, the FILM structure is composed of a diffusion plate, a light splitting sheet, a diffusion sheet, a QD quantum film and a BEF / DBEF superposition, and each component is fixed by a support in the order of CG, OCR, FOG, the backlight assembly and PCBA, the redundant space is reduced through the compact layer-by-layer layout, and the foundation for the ultrathin design is laid; the mini LED soft plate in the backlight assembly provides accurate partition light sources, the multi-layer film sheet superposition of the FILM structure realizes the functions of light diffusion, white light adjustment and brightness enhancement, and the display quality is guaranteed; the die-cast rear shell has the functions of bearing and decoration, replaces the traditional assembly rear shell, and reduces the number of parts; the support ensures that each component is assembled firmly and avoids interlayer displacement, and the ultrathin design and structural stability are considered.

Description

Technical Field

[0001] This application belongs to the field of LED display technology, specifically an ultra-thin mini LED module. Background Technology

[0002] In the fields of flat panel displays and high-density direct-view displays, Mini LED technology has become a key path to achieve ultra-high contrast, high brightness, wide color gamut, and fine dynamic backlighting, and is widely used in high-end LCD backlighting and micro-pitch direct-view display products. With the end-market's dual pursuit of "ultimate visual experience" and "ultimate industrial design" in display devices, higher integration, thinner physical thickness, and superior thermal management performance are required for Mini LED modules.

[0003] However, existing cases require increasing the distance between the LED and the display surface to improve the thickness due to the processing of mini LED light holes; and the overall thickness is further increased due to the IC on the mini LED flexible board. Utility Model Content

[0004] The purpose of this application is to provide an ultra-thin mini LED module in order to solve the problems mentioned above.

[0005] The technical solution adopted in this application is as follows: An ultra-thin mini LED module includes CG, OCR, FOG, backlight assembly, PCBA, and bracket. The backlight assembly includes a mini LED flexible board, a FILM structure, and a die-cast back shell. The FILM structure is composed of a diffuser plate, a beam splitter, a diffuser sheet, a QD quantum film, and BEF / DBEF stacked together. The components are assembled and fixed by the bracket in the order of CG, OCR, FOG, backlight assembly, and PCBA. The compact stacked layout reduces redundant space and lays the foundation for ultra-thin design. The mini LED flexible board in the backlight assembly provides precise zoned light sources. The multi-layer film stacking of the FILM structure realizes the functions of light diffusion, white light adjustment, and brightness enhancement, ensuring display quality. The die-cast back shell has both load-bearing and decorative functions, replacing the traditional assembly back shell and reducing the number of parts. The bracket ensures that the components are firmly assembled, avoids interlayer displacement, and balances ultra-thinness and structural stability.

[0006] In a preferred embodiment, the LED pitch of the mini LED flexible board is 2.73×2.7mm, and the gap between the mini LED flexible board and the FILM structure is set to 0.5mm. By optimizing the lamp eye design, the distance between the LED and the display surface is shortened. The 2.73×2.7mm LED pitch ensures uniform light emission in different zones, avoiding bright spots or dark areas. The extremely small gap of 0.5mm, combined with the optimized lamp eye design, significantly shortens the distance between the LED and the display surface, eliminating the need to cover lamp eye defects by increasing thickness, and directly contributing to the ultra-thinness of the module. At the same time, the close-range layout improves light utilization, and together with the optical processing of the FILM structure, further improves display clarity and brightness.

[0007] In a preferred embodiment, the backplate of the die-cast back cover has a front slot and a rear slot, with the rear slot located in the lower half of the backplate. The backlight control chip and PCBA are integrated in the rear slot, and no IC is set on the mini LED flexible board. The front slot is used to assemble the mini LED flexible board and the FILM structure, while the rear slot centrally accommodates the PCBA and the backlight control chip, realizing the partitioned layout of functional components and avoiding thickness stacking. The mini LED flexible board does not have an IC, which simplifies the design complexity of the flexible board, reduces costs, and reduces the thickness of the flexible board. At the same time, the centralized chip layout facilitates heat dissipation and maintenance, and the module thickness is concentrated in the lower half, making it suitable for space-constrained scenarios such as automotive applications.

[0008] In a preferred embodiment, the total thickness of the FILM structure is 2.875 mm, the OCR thickness is 0.2 mm, the FOG thickness is 1.2 mm, the CG thickness is 1.3 mm, and the gap between the FOG and the FILM structure is 0.7 mm. Each component adopts an ultra-thin design to reduce the space occupied by a single component. The 2.875 mm thick FILM structure compresses the thickness while ensuring optical performance, and the 0.7 mm interlayer gap avoids component compression damage and does not generate redundant space. All dimensional parameters work together to reduce the total thickness of the module from the traditional 11.975 mm to 9.475 mm, achieving the goal of ultra-thin design.

[0009] In a preferred embodiment, the thickness of the die-cast back shell is 2.0 mm. The 2.0 mm thickness of the die-cast back shell is significantly thinner than that of the traditional back shell, which directly contributes to the overall ultra-thinness of the module. At the same time, the die-casting process gives the back shell sufficient structural strength to stably support the components of each layer, avoid module deformation due to excessive thickness, and ensure structural stability in vibration environments such as vehicle-mounted environments, thus balancing ultra-thinness and durability.

[0010] In a preferred embodiment, the FOG is connected to the TCON board via a FOG cable, and the mini LED flexible board communicates with the TCON board via a mini LED flexible board cable. The FOG cable and the mini LED flexible board cable respectively realize the signal transmission for display driving and backlight control. The TCON board, as the control hub, centrally receives and distributes instructions, replacing the traditional distributed control layout and reducing the space occupied by wiring. The cable connection method is flexible and adaptable to the compact internal structure of the module, avoiding the increase in thickness caused by hard connections, while ensuring stable signal transmission and guaranteeing display quality and accurate local dimming.

[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0012] 1. This utility model, by optimizing the lamp eye to shorten the distance between the LED and the display surface and concentrating the IC on the TCON board and the rear slot layout, reduces the total thickness of the module from 11.975mm in the traditional structure to 9.475mm, significantly reducing the thickness of the display area, and making it suitable for scenarios with strict space requirements such as automotive applications.

[0013] 2. The die-cast rear shell of this utility model serves as both a decorative element and a load-bearing component, replacing the traditional assembly rear shell and reducing the number of parts; the centralized layout of ICs reduces the complexity of flexible circuit board design, achieving a synergy of "lightweight + low cost + high performance". Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of the ultra-thin mini LED module of this application;

[0015] Figure 2 This is a schematic diagram of the cross-sectional thickness structure of the module in this application;

[0016] Figure 3 This is a schematic diagram of the chip and cable layout structure in this application.

[0017] The markings in the diagram are: 1. CG; 2. OCR; 3. FOG; 4. Backlight assembly; 5. PCBA; 6. Bracket; 7. Mini LED flexible board; 8. Gap; 9. FILM structure; 10. Die-cast back cover; 16. FOG cable; 17. Mini LED flexible board cable; 23. TCON board. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Example:

[0020] Reference Figure 1-3 An ultra-thin mini LED module includes CG1, OCR2, FOG3, backlight assembly 4, PCBA5, and bracket 6. The backlight assembly 4 includes a mini LED flexible board 7, a film structure 9, and a die-cast back shell 10. The film structure 9 is composed of a diffuser plate, a beam splitter, a diffuser sheet, a QD quantum film, and BEF / DBEF stacked together. The components are assembled and fixed by the bracket 6 in the order of CG1, OCR2, FOG3, backlight assembly 4, and PCBA5. The compact stacked layout reduces redundant space and lays the foundation for the ultra-thin design. The mini LED flexible board 7 in the backlight assembly 4 provides precise zoned light sources. The multi-layer film stacking of the film structure realizes the functions of light diffusion, white light adjustment, and brightness enhancement, ensuring display quality. The die-cast back shell 10 has both load-bearing and decorative functions, replacing the traditional assembly back shell and reducing the number of parts. The bracket 6 ensures that the components are firmly assembled, avoids interlayer displacement, and balances ultra-thinness and structural stability.

[0021] Reference Figure 1-2 The mini LED flexible board 7 has an LED pitch of 2.73×2.7mm, and the gap 8 between the mini LED flexible board 7 and the FILM structure 9 is set to 0.5mm. By optimizing the lamp eye design, the distance between the LED and the display surface is shortened. The 2.73×2.7mm LED pitch ensures uniform light emission in different zones and avoids bright spots or dark areas. The extremely small gap 8 of 0.5mm, combined with the optimized lamp eye design, significantly shortens the distance between the LED and the display surface. There is no need to cover up lamp eye defects by increasing the thickness, which directly contributes to the ultra-thinness of the module. At the same time, the close-range layout improves light utilization, and with the optical processing of the FILM structure, it further improves display clarity and brightness.

[0022] Reference Figure 1-2The die-cast back cover 10 has a front slot and a rear slot on its back plate, with the rear slot located in the lower half of the back plate. The backlight control chip and PCBA5 are integrated in the rear slot, and no IC is set on the mini LED flexible board 7. The front slot is used to assemble the mini LED flexible board 7 and the FILM structure 9, while the rear slot centrally accommodates the PCBA5 and the backlight control chip, realizing the partitioned layout of functional components and avoiding thickness stacking. The mini LED flexible board 7 does not have an IC, which simplifies the design complexity of the flexible board, reduces costs, and reduces the thickness of the flexible board. At the same time, the centralized chip layout facilitates heat dissipation and maintenance, and the module thickness is concentrated in the lower half, making it suitable for space-constrained scenarios such as automotive.

[0023] Reference Figure 1-2 The total thickness of FILM structure 9 is 2.875mm, OCR2 is 0.2mm, FOG3 is 1.2mm, and CG1 is 1.3mm. The gap between FOG3 and FILM structure 9 is 0.7mm. Each component adopts an ultra-thin design to reduce the space occupied by a single component. The 2.875mm thick FILM structure compresses its thickness while ensuring optical performance. The 0.7mm interlayer gap avoids component compression damage and does not generate redundant space. All dimensional parameters work together to reduce the total thickness of the module from the traditional 11.975mm to 9.475mm, achieving the goal of ultra-thin design.

[0024] Reference Figure 1-2 The die-cast back shell 10 has a thickness of 2.0mm. The 2.0mm thickness of the die-cast back shell is significantly thinner than that of the traditional back shell, which directly contributes to the overall ultra-thinness of the module. At the same time, the die-casting process gives the back shell sufficient structural strength to stably support the components of each layer, avoid module deformation due to excessive thickness, and ensure structural stability in vibration environments such as vehicle-mounted vehicles, thus balancing ultra-thinness and durability.

[0025] Reference Figure 1-3 The FOG3 is connected to the TCON board 23 via the FOG cable 16, and the mini LED flexible board 7 communicates with the TCON board 23 via the mini LED flexible board cable 17. The FOG cable 16 and the mini LED flexible board cable 17 respectively realize the signal transmission of display driving and backlight control. The TCON board 23 acts as the control hub, centrally receiving and distributing instructions, replacing the traditional distributed control layout and reducing the space occupied by wiring. The cable connection method is flexible and adaptable to the compact internal structure of the module, avoiding the increase in thickness caused by hard connection, while ensuring stable signal transmission and guaranteeing display quality and accurate local dimming.

[0026] The implementation principle of an ultra-thin mini LED module embodiment of this application is as follows:

[0027] 1. Process each component according to the preset size, and stack the diffuser plate, beam splitter, diffuser plate, QD quantum film and BEF / DBEF to form a 2.875mm thick FILM structure 9; fix PCBA5 and backlight control chip in the rear groove of die-cast back shell 10 to ensure that the thickness is concentrated in the lower half of the module.

[0028] 2. Assemble the mini LED flexible board 7 and the FILM structure 9 with a gap of 0.5mm 8, and fix them to the front groove of the die-cast back shell 10 through the bracket 6; install FOG3, OCR2 and CG1 in sequence, control the gap and thickness parameters of each layer, and ensure that the total thickness is controlled at 9.475mm.

[0029] 3. The FOG3, mini LED flexible board 7 and TCON board 23 are connected by FOG cable 16 and mini LED flexible board cable 17. The centralized IC and control chip work together to control the 2880 zones of the backlight assembly 4 to emit light. The FILM structure 9 realizes the functions of diffused light, white light adjustment and brightness enhancement. The optimized lamp eye design and compact interlayer layout ensure display clarity while achieving an ultra-thin effect.

[0030] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An ultra-thin mini LED module, comprising a CG (1), an OCR (2), a FOG (3), a backlight assembly (4), a PCBA (5), and a bracket (6), characterized in that: The backlight assembly (4) includes a mini LED flexible board (7), a FILM structure (9), and a die-cast back shell (10). The FILM structure (9) is composed of a diffuser plate, a beam splitter, a diffuser sheet, a QD quantum film, and a BEF / DBEF stack. The components are assembled and fixed by a bracket (6) in the order of CG (1), OCR (2), FOG (3), backlight assembly (4), and PCBA (5).

2. The ultra-thin mini LED module as described in claim 1, characterized in that: The LED pitch of the mini LED flexible board (7) is 2.73×2.7mm, and the gap (8) between the mini LED flexible board (7) and the FILM structure (9) is set to 0.5mm. The distance between the LED and the display surface is shortened by optimizing the lamp eye design.

3. The ultra-thin mini LED module as described in claim 1, characterized in that: The back plate of the die-cast back shell (10) is provided with a front slot and a rear slot, and the rear slot is located in the lower half of the back plate. The backlight control chip and PCBA (5) are integrated in the rear slot, and no IC is set on the mini LED flexible board (7).

4. The ultra-thin mini LED module as described in claim 1, characterized in that: The total thickness of the FILM structure (9) is 2.875 mm, the thickness of the OCR (2) is 0.2 mm, the thickness of the FOG (3) is 1.2 mm, the thickness of the CG (1) is 1.3 mm, and the gap between the FOG (3) and the FILM structure (9) is 0.7 mm.

5. The ultra-thin mini LED module as described in claim 1, characterized in that: The thickness of the die-cast shell (10) is 2.0 mm.

6. The ultra-thin mini LED module as described in claim 1, characterized in that: The FOG (3) is connected to the TCON board (23) via the FOG cable (16), and the mini LED flexible board (7) communicates with the TCON board (23) via the mini LED flexible board cable (17).

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