Electrochromic diaphragm

Abstract

The embodiment of the application relates to an electrochromic diaphragm. The electrochromic diaphragm comprises a functional layer and an outer frame; the functional layer comprises a first substrate layer, an electrochromic layer and a second substrate layer which are sequentially arranged; the outer frame surrounds the outer circumferential side of the functional layer, and the outer frame is fixedly connected with at least one of the first substrate layer and the second substrate layer. In the process of preparing an electrochromic device by using the electrochromic diaphragm, an edge sealing layer does not need to be arranged on the circumferential side of the electrochromic diaphragm, so that the preparation of the electrochromic device is simplified.

Description

Technical Field

[0001] This application relates to the field of electrochromic technology, and in particular to an electrochromic film. Background Technology

[0002] Electrochromic films are flexible films that change color under the influence of an applied electric field, altering their color or light transmittance to allow light beams to pass through completely, partially, or completely. In recent years, electrochromic films have been increasingly used in various fields such as electronic devices, wearable devices, transportation, and construction. Before use, flexible electrochromic films typically require lamination with a substrate such as glass to form the electrochromic device; this involves sealing the film between two pieces of glass using an adhesive layer. However, current lamination processes for electrochromic films suffer from complexities, high automation challenges, and low yield rates. Utility Model Content

[0003] This application provides an electrochromic film that can optimize the lamination process of the electrochromic film and improve the performance of electrochromic devices containing the electrochromic film.

[0004] An electrochromic film, comprising:

[0005] The functional layer includes a first base layer, an electrochromic stack, and a second base layer that are stacked sequentially.

[0006] An outer frame surrounds the outer periphery of the functional layer, and the outer frame is fixedly connected to at least one of the first base layer and the second base layer.

[0007] In one embodiment, two surfaces of the outer frame are respectively flush with two opposing surfaces of the functional layer along the thickness direction of the functional layer.

[0008] In one embodiment, the thickness of the outer frame is greater than or equal to half the thickness of the functional layer and less than or equal to twice the thickness of the functional layer.

[0009] In one embodiment, the electrochromic film further includes:

[0010] A welded structure, wherein the outer frame is fixedly connected to at least one of the first base layer and the second base layer via the welded structure; the welded structure includes at least one of a weld point and a weld line.

[0011] In one embodiment, the welding structure includes a plurality of welding points spaced apart along the outer periphery of the functional layer.

[0012] In one embodiment, the welding structure includes a plurality of first welding points and a plurality of second welding points. The first welding points are fixedly connected to the outer frame and the first base layer, and the second welding points are fixedly connected to the outer frame and the second base layer. The first welding points and the second welding points are alternately spaced along the outer periphery of the functional layer.

[0013] In one embodiment, the welding structure includes a welding line, the length of which is greater than or equal to half the outer perimeter of the functional layer.

[0014] In one embodiment, the welded structure is located on the surface of the outer frame and the surface of the first base layer, and / or the welded structure is located on the surface of the outer frame and the surface of the second base layer.

[0015] In one embodiment, the welded structure is located between the inner wall of the outer frame and the outer wall of the functional layer.

[0016] In one embodiment, the transmittance of the first substrate layer or the second substrate layer to 0.8μm-2μm laser light is greater than that of the outer frame to 0.8μm-2μm laser light.

[0017] In one embodiment, the outer frame has a higher absorption rate of 0.8μm-2μm laser light than the first substrate layer or the second substrate layer.

[0018] In one embodiment, the width of the outer frame is less than 10 mm.

[0019] In one embodiment, the deformation of the outer frame is smaller than that of the first adhesive layer and the second adhesive layer, respectively.

[0020] In one embodiment, the melting point of the outer frame is lower than or equal to the melting point of the first substrate layer and the melting point of the second substrate layer, respectively.

[0021] In one embodiment, the outer frame is made of at least one of PET, PC, PMMA and PP.

[0022] In one embodiment, the material of the first substrate layer and / or the second substrate layer includes PET.

[0023] In one embodiment, the outer frame is made of the same material as the first base layer and / or the second base layer.

[0024] In the aforementioned electrochromic film, an outer frame is provided on the outer periphery of the functional layer and is fixedly connected to the functional layer. When the electrochromic film is assembled, the first substrate, the first adhesive layer, the electrochromic film, the second adhesive layer, and the second substrate can be stacked in sequence. An electrochromic device can be formed by high temperature and high pressure or lamination processes. The first adhesive layer bonds the functional layer to the first substrate to fix and seal the functional layer to the first substrate. The second adhesive layer bonds the functional layer to the second substrate to fix and seal the functional layer to the second substrate. The first adhesive layer bonds the outer frame to the first substrate, and the second adhesive layer bonds the outer frame to the second substrate to seal the sidewall of the functional layer.

[0025] If the functional layer does not have an outer frame, in order to seal the sidewalls of the functional layer and reduce the risk of splicing breakage, in addition to stacking the first substrate, the first adhesive layer, the electrochromic film, the second adhesive layer, and the second substrate, an edge sealing layer needs to be placed on the outside of the functional layer, between the first and second adhesive layers, making the splicing process complex and difficult. Furthermore, if the edge sealing layer is narrow, it is difficult for the robotic arm to position it, and the edge sealing layer is prone to deformation and displacement, increasing automation difficulty. Defects such as splicing bubbles caused by edge sealing layer deformation and displacement also occur. Increasing the width of the edge sealing layer increases the area of ​​the non-visible zone, affecting the user experience.

[0026] The electrochromic film provided in this application has an outer frame fixed to the outer periphery of the functional layer. In the process of fabricating electrochromic devices using the electrochromic film of this disclosure, it is unnecessary to place an edge-sealing layer on the periphery of the electrochromic film, simplifying the fabrication of the electrochromic device. The fixedly connected functional layer and outer frame are as a whole, making them less prone to deformation, facilitating automated production of electrochromic devices, and allowing for precise positioning, eliminating defects caused by inaccuracy and improving the performance of the electrochromic device. The relative position of the functional layer and the outer frame remains unchanged, avoiding the impact of positional misalignment on the performance of the electrochromic film due to air bubbles. Furthermore, an appropriate outer frame can be selected according to the thickness of the functional layer to obtain electrochromic films of different thicknesses. Since no edge-sealing layer is required during lamination, there is no need to consider the compatibility between the thickness of the electrochromic film and the thickness of the edge-sealing layer, which simplifies the lamination process. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is one of the top views of the electrochromic film in the embodiments of this disclosure;

[0029] Figure 2 As described in this embodiment of the disclosure Figure 1 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0030] Figure 3 This is a second top view of the electrochromic film in an embodiment of this disclosure;

[0031] Figure 4 As described in this embodiment of the disclosure Figure 3 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0032] Figure 5 This is the third top view schematic diagram of the electrochromic film in the embodiments of this disclosure;

[0033] Figure 6 As described in this embodiment of the disclosure Figure 5 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0034] Figure 7 This is the fourth top view schematic diagram of the electrochromic film in the embodiments of this disclosure;

[0035] Figure 8 As described in this embodiment of the disclosure Figure 7 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0036] Figure 9 This is the fifth top view schematic diagram of the electrochromic film in the embodiments of this disclosure;

[0037] Figure 10 As described in this embodiment of the disclosure Figure 9 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0038] Figure 11 This is the sixth top view schematic diagram of the electrochromic film in the embodiments of this disclosure;

[0039] Figure 12 As described in this embodiment of the disclosure Figure 11 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown.

[0040] Figure 13 This is one of the flowcharts illustrating the fabrication method of the electrochromic device in this embodiment of the present disclosure;

[0041] Figure 14 This is one of the cross-sectional schematic diagrams of the electrochromic device in the embodiments of this disclosure;

[0042] Figure 15 This is one of the schematic diagrams of the process for preparing the electrochromic film in the embodiments of this disclosure;

[0043] Figure 16 This is one of the corresponding schematic diagrams of the laser and the outer frame in the embodiments of this disclosure;

[0044] Figure 17 This is the second schematic diagram showing the correspondence between the laser and the outer frame in an embodiment of this disclosure.

[0045] Explanation of reference numerals in the attached figures:

[0046] Functional layer 102; outer frame 104; welding structure 106; first base layer 202; electrochromic laminate 204; second base layer 206; welding point 208; welding line 210; first substrate 302; first adhesive layer 304; electrochromic film 306; second adhesive layer 308; second substrate 310. Detailed Implementation

[0047] To facilitate understanding of the embodiments of this application, a more comprehensive description of the embodiments of this application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the embodiments of this application. However, the embodiments of this application can be implemented in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the embodiments of this application more thorough and complete.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this application belong. The terminology used herein in the description of embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0049] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the method or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0050] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first substrate layer may be referred to as a second substrate layer, and similarly, a second substrate layer may be referred to as a first substrate layer. Both the first substrate layer and the second substrate layer are substrate layers, but they are not the same substrate layer.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise explicitly specified.

[0052] An electrochromic film comprises a first substrate layer, an electrochromic laminate, and a second substrate layer stacked sequentially. Existing methods for fabricating electrochromic devices including an electrochromic film include: sequentially stacking a first glass, a first adhesive layer made of polyvinyl butyral (PVB) resin, and an electrochromic film, wherein the size of the electrochromic film is smaller than that of the first glass and the first adhesive layer; placing an annular sealing layer made of PVB around the electrochromic film; sequentially stacking a second adhesive layer and a second glass made of PVB on the surface of the electrochromic film and the surface of the sealing layer away from the first adhesive layer, wherein the electrochromic film has a predetermined thickness, and the dimensions of the second adhesive layer and the second glass are approximately the same as those of the first glass and the first adhesive layer; and melting the first adhesive layer, the sealing layer, and the second adhesive layer under high temperature and pressure to form the electrochromic device.

[0053] The aforementioned method for fabricating electrochromic devices has the following drawbacks: (1) The edge-sealing layer is relatively soft, making it difficult for a robotic arm to precisely align the edge-sealing layer with the electrochromic film. Furthermore, the robotic arm has difficulty grasping the edge-sealing layer, resulting in high automation difficulty. This leads to significant fluctuations in the spacing between the edge-sealing layer and the electrochromic film during lamination, often ranging from 1mm to 2mm. (2) The thickness of the edge-sealing layer needs to be roughly matched with the electrochromic film to avoid the electrochromic film cracking (i.e., splitting) due to the thickness difference between the two during lamination. However, the selection of commercially available edge-sealing layers is limited, with thicknesses only available in 0.38, 0.76, or 1.14mm. If the thickness of the electrochromic film differs significantly from this, it becomes difficult to match the edge-sealing layer with the electrochromic film. Moreover, when the thickness of the edge-sealing layer exceeds 0.3mm, there is a risk of splitting during the lamination process to form the electrochromic device. (3) The width of the edge sealing layer needs to be greater than 10mm to ensure that the electrochromic device will not fail due to water ingress within its 10-year service life. If the width of the edge sealing layer is narrow, it will be difficult for the robot to position it, and the edge sealing layer is prone to deformation and displacement. (4) PVB material will melt and soften into a molten state at temperatures above 80℃, and has fluidity. When the ambient temperature is high, PVB material shrinks and deforms, affecting the process accuracy and machinability of the edge sealing layer. (5) After PVB material is die-cut or laser-cut, the resulting edge sealing layer will shrink and deform, with deformation at the millimeter level, resulting in poor product accuracy. When producing electrochromic devices, the distance between the different areas of the edge sealing layer facing the electrochromic film is likely to be different from that of the electrochromic film, which will produce bubbles when the film is joined.

[0054] To address at least one of the aforementioned problems, embodiments of this disclosure provide an electrochromic film. Figure 1 This is one of the top views of the electrochromic film in the embodiments of this disclosure. Figure 2 As described in this embodiment of the disclosure Figure 1 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown. See also Figure 1 and Figure 2 For example, the X direction can be Figure 1 The first direction shown is in the plane parallel to functional layer 102, and the Y direction can be... Figure 1 The second direction shown is in the plane parallel to functional layer 102, and the Z direction can be... Figure 1 The third direction shown is parallel to the thickness direction of the functional layer 102 (perpendicular to the functional layer). In this embodiment, the electrochromic film includes: a functional layer 102 and an outer frame 104; the functional layer 102 includes a first base layer 202, an electrochromic stack 204 and a second base layer 206 stacked sequentially; the outer frame 104 surrounds the outer periphery of the functional layer 102 and is fixedly connected to at least one of the first base layer 202 and the second base layer 206.

[0055] "Sequentially stacked" refers to the arrangement of layers stacked sequentially along the stacking direction, with adjacent surfaces of adjacent layers in contact along this direction. The first substrate layer 202, the electrochromic stack 204, and the second substrate layer 206 are sequentially stacked along the thickness direction Z of the functional layer 102. The electrochromic stack 204 is a film layer in the functional layer 102 that performs the electrochromic function, and the first substrate layer 202 and the second substrate layer 206 are substrates located on opposite sides of the electrochromic stack 204 in the functional layer 102. As an example, both the first substrate layer 202 and the second substrate layer 206 are flexible substrates, such as PET films. As an example, the electrochromic stack 204 includes a first conductive layer, an electrochromic material layer, an electrolyte layer, an ion storage layer, and a second conductive layer sequentially stacked along the thickness direction Z; wherein, adjacent surfaces of adjacent layers are in contact along the thickness direction Z.

[0056] The outer frame 104 is annular. In a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), the orthographic projection of the functional layer 102 is surrounded by the orthographic projection of the outer frame 104, and at least one of the first base layer 202 and the second base layer 206 is fixedly connected to the adjacent outer frame 104, realizing the fixed connection between the outer frame 104 and the functional layer 102. The sidewall of the functional layer 102 is the surface of the functional layer 102 parallel to the thickness direction Z.

[0057] Furthermore, the outer frame 104 can be fixedly connected to both the first base layer 202 and the second base layer 206, making the connection between the outer frame 104 and the functional layer 102 more robust and reducing the risk of separation between the outer frame 104 and the functional layer 102. See also Figure 1 and Figure 2 An example is given by fixing the outer frame 104 and the first base layer 202 together.

[0058] In the aforementioned electrochromic film, an outer frame 104 fixedly connected to the functional layer 102 is provided on the outer periphery of the functional layer 102. When the electrochromic film is laminated, the first substrate 302, the first adhesive layer 304, the electrochromic film 306, the second adhesive layer 308, and the second substrate 310 can be sequentially stacked (see reference). Figure 14 Electrochromic devices can be formed through processes such as high temperature and high pressure or lamination. Specifically, the first adhesive layer 304 bonds the functional layer 102 to the first substrate 302 to fix and seal the functional layer 102 to the first substrate 302; the second adhesive layer 308 bonds the functional layer 102 to the second substrate 310 to fix and seal the functional layer 102 to the second substrate 310; the first adhesive layer 304 bonds the outer frame 104 to the first substrate 302, and the second adhesive layer 308 bonds the outer frame 104 to the second substrate 310 to seal the sidewalls of the functional layer 102.

[0059] If the outer periphery of the functional layer 102 is not provided with an outer frame 104, in order to seal the sidewalls of the functional layer 102 and reduce the risk of splicing breakage, as in the existing electrochromic device fabrication method, in addition to stacking the first substrate 302, the first adhesive layer 304, the electrochromic film 306, the second adhesive layer 308, and the second substrate 310, an edge sealing layer needs to be placed on the outer side of the functional layer 102, between the first adhesive layer 304 and the second adhesive layer 308, making the splicing process complex and difficult. In addition, if the edge sealing layer is narrow, it is difficult for the robot to position it, the edge sealing layer is prone to deformation and displacement, the automation difficulty is high, and defects such as splicing bubbles caused by the deformation and displacement of the edge sealing layer are easy to occur. If the width of the edge sealing layer is increased, the area of ​​the non-visible area will be increased, affecting the appearance and user experience of the electrochromic device.

[0060] Compared with the prior art, the electrochromic film 306 provided in this application has an outer frame 104 fixed to the outer periphery of the functional layer 102. During the fabrication of electrochromic devices using the electrochromic film of this application, it is not necessary to place a sealing layer on the periphery of the functional layer 102, thereby simplifying the fabrication of the electrochromic device. The fixedly connected functional layer 102 and outer frame 104 form a whole, which is not easily deformed, facilitating the automated production of electrochromic devices, and allowing for precise positioning, eliminating defects caused by inaccurate precision, and improving the performance of the electrochromic device. The relative position of the functional layer 102 and outer frame 104 remains unchanged, avoiding the impact of positional misalignment on the performance of the electrochromic film due to defects such as air bubbles. Furthermore, an appropriate outer frame 104 can be selected according to the thickness of the functional layer 102 to obtain electrochromic films of different thicknesses. Since no sealing layer is required during lamination, the compatibility between the thickness of the electrochromic film and the thickness of the sealing layer does not need to be considered, which simplifies the lamination process of the electrochromic film.

[0061] Figure 3 This is the second top view schematic diagram of the electrochromic film in the embodiments of this disclosure. Figure 4 As described in this embodiment of the disclosure Figure 3 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown. Figure 5 This is the third top view schematic diagram of the electrochromic film in the embodiments of this disclosure. Figure 6 As described in this embodiment of the disclosure Figure 5 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown. See also Figures 1-6In some embodiments, the electrochromic film further includes a welding structure 106; the welding structure 106 is located between the functional layer 102 and the outer frame 104, and is used to fix the outer frame 104 to at least one of the first base layer 202 and the second base layer 206. The welding structure 106 achieves a fixed connection between the outer frame 104 and the functional layer 102. As an example, the material of the welding structure 106 may be the same as the material of the outer frame 104, or the material of the welding structure 106 may be a mixture of the material of the outer frame 104 and the materials of the first base layer 202 and / or the second base layer 206.

[0062] See Figure 1 and Figure 2 In the case where the outer frame 104 and the first base layer 202 are fixedly connected, the welded structure 106 is located between the outer frame 104 and the first base layer 202 for fixing the outer frame 104 and the first base layer 202. See also Figure 3 and Figure 4 In the case where the outer frame 104 and the second base layer 206 are fixedly connected, the welding structure 106 is located between the outer frame 104 and the second base layer 206 to fix the outer frame 104 and the second base layer 206. By providing the welding structure 106 between one of the first base layer 202 and the second base layer 206 and the outer frame 104, a fixed connection between the outer frame 104 and the functional layer 102 is achieved, reducing the cost of the electrochromic film.

[0063] See Figure 5 and Figure 6 With the outer frame 104 fixedly connected to the first base layer 202 and the second base layer 206 respectively, welding structures 106 are located between the outer frame 104 and the first base layer 202, and between the outer frame 104 and the second base layer 206. The welding structure 106 between the outer frame 104 and the first base layer 202 is used to fix the outer frame 104 and the first base layer 202, and the welding structure 106 between the outer frame 104 and the second base layer 206 is used to fix the outer frame 104 and the second base layer 206. By providing welding structures 106 between the first base layer 202 and the outer frame 104, and between the second base layer 206 and the outer frame 104, a fixed connection between the outer frame 104 and the functional layer 102 is achieved, making the connection between the outer frame 104 and the functional layer 102 more robust and increasing the structural stability of the electrochromic film.

[0064] It is understandable that welded structure 106 can be replaced with other connection structures that can provide a fixed connection.

[0065] See Figure 1 , Figure 2 , Figure 5 and Figure 6In some embodiments, the welding structure 106 is located on the surface of the outer frame 104 and the surface of the first base layer 202, for fixing the outer frame 104 and the first base layer 202. The welding structure 106 on the surfaces of the outer frame 104 and the first base layer 202 achieves a fixed connection between the outer frame 104 and the functional layer 102, reducing the adverse effects of the welding process on the electrochromic stack 204, such as reducing the risk of electrolyte leakage and short circuits in the electrochromic stack 204.

[0066] See Figures 3-6 In some embodiments, the welding structure 106 is located on the surface of the outer frame 104 and the surface of the second base layer 206, for fixing the outer frame 104 and the second base layer 206 together. The welding structure 106 on the surfaces of the outer frame 104 and the second base layer 206 achieves a fixed connection between the outer frame 104 and the functional layer 102, and avoids the welding structure 106 from affecting the performance of the electrochromic stack 204.

[0067] Figure 7 This is the fourth top view schematic diagram of the electrochromic film in the embodiments of this disclosure. Figure 8 As described in this embodiment of the disclosure Figure 7 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown. Figure 9 This is the fifth top view schematic diagram of the electrochromic film in the embodiments of this disclosure. Figure 10 As described in this embodiment of the disclosure Figure 9 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown. See also Figures 7-10 In some embodiments, the welded structure 106 is located between the inner wall of the outer frame 104 and the outer wall of the functional layer 102.

[0068] The inner sidewall of the outer frame 104 is one of the two opposing sidewalls of the outer frame 104 extending along the thickness direction Z, which is closer to the sidewall of the functional layer 102; the outer sidewall of the functional layer 102 is the sidewall of the functional layer 102 extending along the thickness direction Z. By placing the welding structure 106 between the inner sidewall of the outer frame 104 and the outer sidewall of the functional layer 102, the connection strength of the welding structure 106 can be increased, the number of welding structures 106 can be reduced, and the cost of the electrochromic film can be reduced.

[0069] like Figure 7 and Figure 8 As shown, the welded structure 106 is located between the inner wall of the outer frame 104 and the outer wall of the first base layer 202, increasing the connection strength between the outer frame 104 and the first base layer 202 and improving the stability of the fixed connection between the outer frame 104 and the functional layer 102.

[0070] like Figure 9 and Figure 10As shown, the welded structure 106 is located between the inner wall of the outer frame 104 and the outer wall of the second base layer 206, increasing the connection strength between the outer frame 104 and the second base layer 206 and improving the stability of the fixed connection between the outer frame 104 and the functional layer 102.

[0071] It is understood that in some other embodiments, the welding structure 106 is located between the inner sidewall of the outer frame 104 and the outer sidewall of the first base layer 202, and between the inner sidewall of the outer frame 104 and the outer sidewall of the second base layer 206. This arrangement further increases the connection strength between the outer frame 104 and the first base layer 202, and improves the stability of the fixed connection between the outer frame 104 and the functional layer 102.

[0072] See Figure 9 and Figure 10 In some embodiments, along the thickness direction Z of the functional layer 102, two opposing surfaces of the outer frame 104 are flush with two opposing surfaces of the functional layer 102. This arrangement improves the surface flatness of the electrochromic film and reduces the risk of the electrochromic film cracking during lamination.

[0073] In one embodiment, the thickness of the outer frame 104 is greater than or equal to half the thickness of the functional layer 102 and less than or equal to twice the thickness of the functional layer 102. In this embodiment, the thickness range of the outer frame 104 is limited so that the thickness of the outer frame 104 is close to the thickness of the functional layer 102. During the electrochromic film lamination process, when the thickness of the outer frame 104 is greater than or equal to half the thickness of the functional layer 102 and less than the thickness of the functional layer 102, the gap between the outer frame 104 and the first adhesive layer 304 (or the second adhesive layer 308) can be eliminated during high-temperature melting. When the thickness of the outer frame 104 is greater than the thickness of the functional layer 102 and less than or equal to twice the thickness of the functional layer 102, the portion of the outer frame 104 protruding from the functional layer 102 can also be eliminated during high-temperature melting, so that in the manufactured electrochromic device, the functional layer 102 can be tightly bonded to the first substrate 302 and the second substrate 310.

[0074] See Figure 9 and Figure 10 In some embodiments, the widths L1 and L2 of the outer frame 104 are both less than 10 mm. This setting reduces the size of the frame of the electrochromic film, thereby reducing the area of ​​the non-visible region of the electrochromic film and increasing the proportion of the visible region. As an example, widths L1 and L2 are the same. It can be understood that the width of the outer frame 104 is set according to the moisture resistance of the functional layer 102 and the moisture-blocking performance of the outer frame 104.

[0075] Furthermore, the water resistance of the outer frame 104 is greater than a first preset value, where the first preset value is the water resistance of the PVB material. Water resistance refers to the water vapor barrier performance of the outer frame 104. By reducing the width of the outer frame 104 while keeping the performance of the electrochromic film (such as the visible area) unchanged, the size of the electrochromic film can be reduced. As an example, the width L of the outer frame 104 is less than or equal to 5 mm.

[0076] See Figures 1-8 In some embodiments, the welding structure 106 includes welding points 208. The welding points 208 provide a fixed connection between the outer frame 104 and the functional layer 102, while reducing the material usage of the welding structure 106 and lowering the cost of the electrochromic film.

[0077] See Figures 1-8 In some embodiments, the welding structure 106 includes a plurality of welding points 208, which are spaced apart along the outer periphery of the functional layer 102. This reduces the cost of the electrochromic film. The spacing along the outer periphery of the functional layer 102 eliminates contact between adjacent welding points 208. Furthermore, the equidistant spacing of the welding points 208 along the outer periphery of the functional layer 102 simplifies the design of the welding points 208.

[0078] See Figure 1 and Figure 2 Multiple welding points 208 are located between the outer frame 104 and the first base layer 202, connecting the outer frame 104 and the first base layer 202 to achieve a fixed connection between the outer frame 104 and the functional layer 102. (See also...) Figure 3 and Figure 4 Multiple welding points 208 are located between the outer frame 104 and the second base layer 206. The outer frame 104 and the second base layer 206 are connected by welding points 208, so as to realize the fixed connection between the outer frame 104 and the functional layer 102.

[0079] See Figure 5 and Figure 6 In some embodiments, the welding structure 106 includes multiple first welding points and multiple second welding points. The first welding points are welding points 208 located between the outer frame 104 and the first base layer 202, and the second welding points are welding points 208 located between the outer frame 104 and the second base layer 206. The first welding points are used to fixably connect the outer frame 104 and the first base layer 202, and the second welding points are used to fixably connect the outer frame 104 and the second base layer 206. By providing the first and second welding points, the outer frame 104 and the functional layer 102 are fixedly connected on opposite sides in the thickness direction Z, increasing the connection between the outer frame 104 and the functional layer 102 and preventing displacement between them.

[0080] See Figure 5 and Figure 6 In some embodiments, the positions of the first solder point and the second solder point coincide along the outer periphery of the functional layer 102. That is, in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), the orthographic projections of the first solder point and the second solder point coincide. This facilitates the formation of the first solder point and the second solder point and simplifies their design.

[0081] Figure 11 This is the sixth top view schematic diagram of the electrochromic film in the embodiments of this disclosure. Figure 12 As described in this embodiment of the disclosure Figure 11 One of the schematic cross-sectional views of the electrochromic film along the AA direction in a direction perpendicular to the functional layer is shown below. Figures 11-12 In some embodiments, the first welding point and the second welding point are alternately arranged along the outer periphery of the functional layer 102. That is, in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), the orthographic projections of the first welding point and the second welding point are alternately arranged. Through the first welding point and the second welding point, the functional layer 102 and the outer frame 104 are fixedly connected at different positions along the outer periphery of the functional layer 102, increasing the connection between the outer frame 104 and the functional layer 102 and preventing displacement between the outer frame 104 and the functional layer 102.

[0082] See Figures 7-10 In some embodiments, the welding structure 106 includes a welding line 210; the welding line 210 strengthens the fixed connection between the outer frame 104 and the functional layer 102, preventing displacement between the outer frame 104 and the functional layer 102, and making the fixed connection between the outer frame 104 and the functional layer 102 more secure.

[0083] See Figure 7 and Figure 8 The welding line 210 is located between the outer frame 104 and the first base layer 202. By increasing the connection between the outer frame 104 and the first base layer 202, the fixed connection between the outer frame 104 and the functional layer 102 is strengthened, making the fixed connection between the outer frame 104 and the functional layer 102 more secure.

[0084] See Figure 9 and Figure 10 The welding line 210 is located between the outer frame 104 and the second base layer 206. By increasing the connection between the outer frame 104 and the second base layer 206, the fixed connection between the outer frame 104 and the functional layer 102 is made more secure.

[0085] See Figures 7-10In some embodiments, the length of the welding line 210 is greater than or equal to half the outer perimeter of the functional layer 102. This arrangement maintains the fixed connection between the outer frame 104 and the functional layer 102 while reducing the material usage of the welding line 210, thus lowering the cost of the electrochromic film. It is understood that when the welding line 210 is located between the outer frame 104 and the first base layer 202, and / or between the outer frame 104 and the second base layer 206, the length of the welding line 210 is less than or equal to the outer perimeter of the functional layer 102. The outer perimeter is the length of the edge of the functional layer 102 in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y).

[0086] See Figure 10 and Figure 11 In some embodiments, along the thickness direction Z of the functional layer 102, the outer wall of the first base layer 202, the outer wall of the electrochromic stack 204, and the outer wall of the second base layer 206 are flush with each other, which facilitates the fixed connection between the outer frame 104 and the functional layer 102.

[0087] In some embodiments, the transmittance of the first substrate layer 202 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to 0.8μm-2μm laser light. That is, when 0.8μm-2μm laser light irradiates the first substrate layer 202 and the outer frame 104, the proportion of laser light passing through the first substrate layer 202 is greater than the proportion of laser light passing through the outer frame 104. This arrangement reduces the absorption of laser energy by the first substrate layer 202 and increases the absorption of laser energy by the outer frame 104. When using a 0.8μm-2μm laser as the heat source for welding, it facilitates partial melting of the outer frame 104 to form the welded structure 106, improving the welding effect between the first substrate layer 202 and the outer frame 104. Simultaneously, it reduces the melting of the first substrate layer 202, minimizing the adverse effects of the welding process on the functional layer 102.

[0088] The laser wavelength of 0.8μm-2μm is used to form the welded structure 106. The laser wavelength corresponding to the material of the outer frame 104, the first base layer 202, and the second base layer 206 can be selected to form the welded structure 106.

[0089] In some embodiments, the transmittance of the second substrate layer 206 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to the same wavelength. This configuration reduces the absorption of laser energy by the second substrate layer 206 and increases the absorption of laser energy by the outer frame 104. When using a 0.8μm-2μm laser as the heat source for welding, it facilitates partial melting of the outer frame 104 to form the welded structure 106, improving the welding effect between the second substrate layer 206 and the outer frame 104. Simultaneously, it reduces the melting of the second substrate layer 206, minimizing the adverse effects of the welding process on the functional layer 102.

[0090] In other embodiments, the transmittance of the first substrate layer 202 and the second substrate layer 206 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to 0.8μm-2μm laser light. This arrangement facilitates partial melting of the outer frame 104 to form the welded structure 106, improving the welding effect between the first substrate layer 202 and the second substrate layer 206 and the outer frame 104. Simultaneously, it reduces the melting of the first substrate layer 202 and the second substrate layer 206, minimizing the adverse effects of the welding process on the functional layer 102.

[0091] In some embodiments, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than that of the first substrate layer 202 for the same wavelength. With this configuration, when using a 0.8μm-2μm laser as the heat source for welding, the outer frame 104 has a higher absorption rate, increasing the energy absorbed and utilized by the outer frame 104. The outer frame 104 readily absorbs laser energy and melts, accelerating the formation of the welded structure 106 and improving laser utilization. Simultaneously, the first substrate layer 202 has a lower absorption rate, resulting in lower melting or no melting of the first substrate layer 202, reducing the impact on the performance of the functional layer 102 during the formation of the welded structure 106. As an example, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than 80%.

[0092] In some embodiments, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than that of the second substrate layer 206 for the same wavelength. With this configuration, when using a 0.8μm-2μm laser as the heat source for welding, the outer frame 104 has a higher absorption rate, increasing the energy absorbed and utilized by the outer frame 104. The outer frame 104 readily absorbs laser energy and melts, accelerating the formation of the welded structure 106 and improving laser utilization. Simultaneously, the second substrate layer 206 has a lower absorption rate, resulting in lower melting or no melting of the second substrate layer 206, reducing the impact on the performance of the functional layer 102 during the formation of the welded structure 106.

[0093] In some embodiments, the outer frame 104 is made of a sealing material and an additive, the additive being used to increase the absorption rate of the outer frame 104 to laser. By incorporating a strong-absorbing additive, the outer frame 104 made of the sealing material is modified, increasing the absorption rate of the outer frame 104 to laser and improving the welding efficiency between the outer frame 104 and the functional layer 102.

[0094] In some embodiments, the outer frame 104 may be made of at least one of PET, PC, PMMA, and PP. Further, if the outer frame 104 is made of PET, compared to PVB, the dimensional accuracy of the outer frame 104 is improved from ±3mm to ±0.2mm, eliminating defects such as bubbles, delamination, and cracking caused by inaccurate precision of the outer frame 104.

[0095] Table 1 shows the relationship between laser wavelength, additives, welding speed and power for different materials of the outer frame 104. The higher the laser power, the greater the laser energy, the faster the welding speed, the greater the laser energy, the wider the width of the weld structure 106 (weld), and the greater the welding strength. However, excessive laser intensity may cause bubbles and porosity defects, affecting the welding strength and reducing the fixed connection between the outer frame 104 and the functional layer 102.

[0096] Table 1

[0097]

[0098] In some embodiments, the material of the first substrate 202 and / or the second substrate 206 includes PET.

[0099] In some embodiments, the melting point of the outer frame 104 is lower than or equal to the melting point of the first base layer 202. This arrangement reduces the impact on the first base layer 202 during the process of melting the outer frame 104 to form the weld structure 106 located between the first base layer 202 and the outer frame 104.

[0100] In some embodiments, the melting point of the outer frame 104 is lower than or equal to the melting point of the second base layer 206. This arrangement reduces the impact on the second base layer 206 during the process of melting the outer frame 104 to form the weld structure 106 located between the second base layer 206 and the outer frame 104.

[0101] In some embodiments, the outer frame 104 is made of the same material as the first base layer 202. This facilitates the formation of a welded structure 106 connecting the outer frame 104 and the first base layer 202 using laser welding, and simplifies the selection of the material for the outer frame 104.

[0102] In some embodiments, the outer frame 104 is made of the same material as the second base layer 206. This facilitates the formation of the welded structure 106 connecting the outer frame 104 and the second base layer 206 using laser welding, and simplifies the selection of the material for the outer frame 104.

[0103] It is understood that by replacing the functional layer 102 in the electrochromic film with a liquid crystal dimming layer, an antenna layer, or a heating layer, the corresponding liquid crystal dimming film, antenna film, or heating film can be obtained, achieving the same technical effect.

[0104] Based on the same inventive concept, this application also provides a method for preparing an electrochromic device, wherein the parts that are the same as or corresponding to the above-mentioned electrochromic film embodiment will not be described in detail below.

[0105] Figure 13 This is one of the schematic flowcharts illustrating the fabrication method of the electrochromic device in this embodiment of the present disclosure. Figure 14 This is one of the cross-sectional schematic diagrams of the electrochromic device in the embodiments of this disclosure, see [link / reference]. Figure 13 and Figure 14 In this embodiment, a method for fabricating an electrochromic device is provided, comprising:

[0106] S102, providing or preparing a first substrate, a first adhesive layer, an electrochromic film as described above, a second adhesive layer, and a second substrate.

[0107] A first substrate 302, a first adhesive layer 304, an electrochromic film 306 as described above, a second adhesive layer 308, and a second substrate 310 are provided (or fabricated) to facilitate the subsequent formation of an electrochromic device. The first substrate 302 and the second substrate 310 serve as the support structure in the electrochromic device. Providing (or fabricating) the first substrate 302 and the second substrate 310 can involve cutting a substrate material into a shape suitable for the electrochromic film 306. As an example, the materials of the first substrate 302 and the second substrate 310 can be glass.

[0108] The first adhesive layer 304 is used to bond the first substrate 302 and the electrochromic film 306, and the second adhesive layer 308 is used to bond the second substrate 310 and the electrochromic film 306. The first adhesive layer 304 and the second adhesive layer 308 also have a sealing function to prevent moisture from affecting the performance of the functional layer 102 from the surface of the functional layer 102 perpendicular to the thickness direction Z. The first adhesive layer 304 and the second adhesive layer 308 can be provided (or prepared) by cutting the adhesive layer roll into a shape adapted to the electrochromic film 306.

[0109] S104, the first substrate, the first adhesive layer, the electrochromic film, the second adhesive layer and the second substrate are stacked in sequence to form a stack.

[0110] Along the thickness direction Z, a first substrate 302, a first adhesive layer 304, an electrochromic film 306, a second adhesive layer 308, and a second substrate 310 are sequentially stacked to form a stack for subsequent fabrication of an electrochromic device. The functional layer 102 and the outer frame 104 in the electrochromic film 306 are fixedly connected and placed as a whole on the surface of the first adhesive layer 304. This allows for simple gripping and positioning by a robotic arm, facilitating automated production. Furthermore, during subsequent heating and pressurization of the stack, there is no risk of displacement between the fixedly connected functional layer 102 and the outer frame 104.

[0111] In the thickness direction Z, the two opposing surfaces of the first adhesive layer 304 are in contact with the surface of the first substrate 302 near the first adhesive layer 304 and the surface of the electrochromic film 306 near the first adhesive layer 304, respectively; and in the thickness direction Z, the two opposing surfaces of the second adhesive layer 308 are in contact with the surface of the second substrate 310 near the second adhesive layer 308 and the surface of the electrochromic film 306 near the second adhesive layer 308, respectively, and there is a certain gap between adjacent layers after stacking.

[0112] S106 involves heating and pressurizing the stacked material to form an electrochromic device.

[0113] The stack is heated and pressurized, causing the first adhesive layer 304 and the second adhesive layer 308 to melt. This allows the first adhesive layer 304 to bond to the first substrate 302 and the electrochromic film 306, respectively, and the second adhesive layer 308 to bond to the second substrate 310 and the electrochromic film 306, respectively, eliminating gaps between adjacent layers. It is worth noting that the first adhesive layer 304 and the second adhesive layer 308 were not adhesive before the heating and pressurization process; they became adhesive after melting during the process.

[0114] The first adhesive layer 304 and the second adhesive layer 308 seal the functional layer 102 in the electrochromic film 306 on the surface of the functional layer 102 perpendicular to the thickness direction Z. The outer frame 104 in the electrochromic film 306 seals the functional layer 102 on the outer periphery of the functional layer 102. The functional layer 102 in the electrochromic film 306 is isolated from the external environment as a whole, thereby achieving the sealing of the functional layer 102 and preventing water ingress and failure of the functional layer 102.

[0115] In the above-described method for fabricating an electrochromic device, the functional layer 102 and the outer frame 104 in the electrochromic film are fixedly connected to prevent displacement between the functional layer 102 and the outer frame 104 during the formation of the electrochromic device. The outer frame 104 seals the functional layer 102 on its outer periphery, eliminating the step of setting an edge sealing layer on the outer periphery of the functional layer 102 and simplifying the fabrication of the electrochromic device. Furthermore, the functional layer 102 and the outer frame 104 are placed as a whole on the surface of the first adhesive layer 304, making robotic gripping and positioning simple and facilitating automated production of the electrochromic device.

[0116] Figure 15 This is one of the schematic diagrams of the process for preparing the electrochromic film in this embodiment of the present disclosure. See also: Figure 1 , Figure 2 and 15 In some embodiments, the method for preparing the electrochromic film 306 includes:

[0117] S202 provides an outer frame substrate and a functional layer.

[0118] An outer frame substrate for forming an outer frame 104 is provided, and a functional layer 102 for forming an electrochromic film 306 is provided. The functional layer 102 includes a first base layer 202, an electrochromic stack 204, and a second base layer 206, which are sequentially stacked along the thickness direction Z.

[0119] S204, cut the outer frame substrate to form the outer frame.

[0120] Based on the shape and dimensions of the functional layer 102 in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), and the dimensions of the functional layer 102 in the thickness direction Z, a cutting method, such as laser cutting or die cutting, is used to cut the outer frame substrate, forming a receiving groove in the outer frame substrate to obtain the outer frame 104. The outer frame 104 includes an inner sidewall and an outer sidewall disposed opposite to each other in the direction parallel to the functional layer 102. The inner sidewall of the outer frame 104 is the same as the sidewall of the receiving groove. As an example, the external dimensions of the receiving groove are the same as the external dimensions of the functional layer 102. When the functional layer 102 is placed inside the outer frame 104, the inner sidewall of the outer frame 104 contacts the outer sidewall of the functional layer 102.

[0121] In the thickness direction Z, the depth of the receiving groove is greater than or equal to the thickness of the functional layer 102. Furthermore, the depth of the receiving groove is equal to the thickness of the functional layer 102, so that the functional layer 102 can be received in the receiving groove, and the outer frame 104 subsequently isolates the sidewalls of the functional layer 102 from the external environment.

[0122] When the deviation between the depth of the receiving groove and the thickness of the functional layer 102 is less than or equal to 0.3 mm, the outer wall of the functional layer 102 can be sealed by bonding the first adhesive layer 304 and the second adhesive layer 308 to the outer frame 104 during the subsequent heating and pressurization process to form the electrochromic device.

[0123] In some embodiments, the bottom of the receiving groove exposes the outer frame substrate. The outer frame substrate at the bottom of the receiving groove can support the functional layer 102 subsequently fixedly connected in the receiving groove, reducing the risk of displacement between the functional layer 102 and the outer frame 104. At the same time, the outer frame substrate at the bottom of the receiving groove can isolate the surface of the functional layer 102 near the bottom of the receiving groove from the external environment.

[0124] See Figure 1 and Figure 2 In some embodiments, the receiving groove extends through the outer frame substrate. This simplifies the formation of the receiving groove, and the functional layer 102 is subsequently bonded and fixed by the first adhesive layer 304, which also isolates the surface of the functional layer 102 from the external environment.

[0125] S206, fixedly connects the outer frame and the functional layer to form an electrochromic film.

[0126] The functional layer 102 is fixed in the receiving groove to achieve a fixed connection between the outer frame 104 and the functional layer 102, forming an electrochromic film 306.

[0127] In some embodiments, the outer frame and the functional layer are fixedly connected to form an electrochromic film, including: forming an adhesive structure on the sidewall of the receiving groove; placing the functional layer 102 in the receiving groove, and the adhesive structure fixingly connecting the functional layer 102 and the outer frame 104. The fixed connection between the functional layer 102 and the outer frame 104 is achieved through the adhesive structure.

[0128] In some embodiments, the outer frame and the functional layer are fixedly connected to form an electrochromic film, including: surrounding the functional layer 102 with the outer frame 104 (i.e., placing the functional layer 102 in a receiving groove); and welding the outer frame and the functional layer to form the electrochromic film. A welding structure 106 is formed between the outer sidewall of the functional layer 102 and the inner sidewall of the outer frame 104 using a welding process to fix the functional layer 102 and the outer frame 104 together.

[0129] In some embodiments, a laser spot welding process is used to form the welded structure 106. No solder resist is required, and the welded structure 106 formed by welding is smooth and bubble-free, increasing the fixed connection between the functional layer 102 and the outer frame 104, making the connection between the functional layer 102 and the outer frame 104 more stable.

[0130] Figure 16 This is one of the corresponding schematic diagrams of the laser and the outer frame in an embodiment of this disclosure. See also... Figure 1 , Figure 2 and Figure 16 In some embodiments, the laser beam of the laser spot welding process is incident vertically onto a portion of the outer frame 104 near the functional layer 102 and a portion of the first base layer 202 near the outer frame 104 to form a welded structure 106 on the surface of the outer frame 104 and the surface of the first base layer 202.

[0131] The direction of the laser beam affects the position of the welded structure 106. When the laser beam is incident perpendicularly to the junction of the outer frame 104 and the first base layer 202, the welded structure 106 is formed on the surface of the outer frame 104 and the first base layer 202.

[0132] See Figure 3 and Figure 4In some embodiments, the laser beam of the laser spot welding process is incident vertically onto a portion of the outer frame 104 near the functional layer 102 and a portion of the second base layer 206 near the outer frame 104 to form a welded structure 106 located on the surface of the outer frame 104 and the surface of the second base layer 206.

[0133] The direction of the laser beam affects the position of the welded structure 106. When the laser beam is incident perpendicularly to the junction of the outer frame 104 and the second base layer 206, the welded structure 106 is formed on the surface of the outer frame 104 and the second base layer 206.

[0134] Figure 17 This is the second schematic diagram showing the correspondence between the laser and the outer frame in an embodiment of this disclosure. See also... Figure 7 , Figure 8 and Figure 17 In some embodiments, the laser beam of the laser spot welding process is incident from the surface of the first substrate layer 202 to the inner sidewall (sidewall of the receiving groove) of the outer frame 104 to form a welded structure 106 between the outer frame 104 and the first substrate layer 202.

[0135] See Figure 9 and Figure 10 In some embodiments, the laser beam of the laser spot welding process is incident from the surface of the second substrate layer 206 to the inner sidewall (sidewall of the receiving groove) of the outer frame 104 to form a welded structure 106 between the outer frame 104 and the second substrate layer 206.

[0136] In some embodiments, the transmittance of the first substrate layer 202 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to 0.8μm-2μm laser light. This configuration increases the absorption of laser light by the outer frame 104, facilitating the formation of a welded structure 106 between the inner wall of the outer frame 104 and the outer wall of the first substrate layer 202 via laser spot welding. The 0.8μm-2μm laser wavelength is the wavelength of the laser used to form the welded structure 106. The corresponding wavelength of laser light can be selected to form the welded structure 106 based on the materials of the outer frame 104, the first substrate layer 202, and the second substrate layer 206.

[0137] In some embodiments, the transmittance of the second substrate layer 206 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to 0.8μm-2μm laser light. This configuration increases the absorption of laser light by the outer frame 104, facilitating the formation of a welded structure 106 between the inner wall of the outer frame 104 and the outer wall of the second substrate layer 206 via laser spot welding.

[0138] In other embodiments, the transmittance of the first substrate layer 202 and the second substrate layer 206 to 0.8μm-2μm laser light is greater than that of the outer frame 104 to 0.8μm-2μm laser light. This arrangement increases the absorption of laser light by the outer frame 104, facilitating the formation of a welded structure 106 between the inner wall of the outer frame 104 and the outer wall of the second substrate layer 206, and between the inner wall of the outer frame 104 and the outer wall of the first substrate layer 202, via laser spot welding.

[0139] In some embodiments, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than that of the first substrate layer 202 for the same wavelength. This configuration increases the energy absorbed and utilized by the outer frame 104, accelerates the formation of the welded structure 106, improves laser utilization, reduces the impact on the performance of the functional layer 102 during the formation of the welded structure 106, and facilitates the formation of the welded structure 106 between the inner wall of the outer frame 104 and the outer wall of the first substrate layer 202 via laser spot welding. As an example, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than 80%.

[0140] In some embodiments, the absorption rate of the outer frame 104 for 0.8μm-2μm laser light is greater than that of the second substrate layer 206 for the same wavelength. This configuration increases the energy absorbed and utilized by the outer frame 104, accelerates the formation of the welded structure 106, improves laser utilization, reduces the impact on the performance of the functional layer 102 during the formation of the welded structure 106, and facilitates the formation of the welded structure 106 between the inner wall of the outer frame 104 and the outer wall of the second substrate layer 206 via laser welding.

[0141] See Figure 1 and Figure 2 In some embodiments, the functional layer 102 and the outer frame 104 are welded at intervals along the outer periphery of the functional layer 102 in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), forming a plurality of welding points 208; wherein, the welding structure 106 includes a plurality of welding points 208. This increases the rate of forming the welding structure 106 and reduces the cost of the electrochromic device.

[0142] See Figure 7 and Figure 8 In some embodiments, the functional layer 102 and the outer frame 104 are continuously welded along the outer periphery of the functional layer 102 in a plane parallel to the functional layer 102 (the plane containing the first direction X and the second direction Y), forming a weld line 210 as a weld structure 106. This prevents displacement between the outer frame 104 and the functional layer 102, making the fixed connection between the outer frame 104 and the functional layer 102 more secure.

[0143] See Figure 14 In some embodiments, along the thickness direction Z of the functional layer 102, the orthographic projections of the first substrate 302, the first adhesive layer 304, the electrochromic film 306, and the second adhesive layer 308 on the second substrate 310 coincide with the second substrate 310. This arrangement makes the sidewalls of the electrochromic device flush, reducing the size of the electrochromic device and facilitating its use.

[0144] See Figure 14 In some embodiments, along the thickness direction Z of the functional layer 102, the outer walls of the first substrate 302, the first adhesive layer 304, the electrochromic film 306, the second adhesive layer 308, and the second substrate 310 are flush with each other. The outer wall of the electrochromic film 306 is also the outer wall of the outer frame 104. This arrangement ensures that the sidewalls of each stack used to fabricate the electrochromic device are flush, which simplifies the fabrication process of the electrochromic device, ensures uniform stress distribution among the stacks, and reduces the risk of cracking in the electrochromic device.

[0145] In some embodiments, the material of the first adhesive layer 304 and / or the second adhesive layer 308 may be at least one of PVB, EVA and OCA.

[0146] In some embodiments, the outer frame 104 may be made of at least one of PET, PC, PMMA and PP.

[0147] In some embodiments, the material of the first substrate 202 and / or the second substrate 206 may be PET.

[0148] In some embodiments, the outer frame 104 is made of the same material as the first base layer 202. This facilitates the formation of a welded structure 106 connecting the outer frame 104 and the first base layer 202 using laser spot welding, and simplifies the selection of the material for the outer frame 104.

[0149] In some embodiments, the material of the first adhesive layer 304 and / or the second adhesive layer 308 is different from the material of the outer frame 104.

[0150] The deformation of the outer frame 104 is smaller than that of the first adhesive layer 304 and the second adhesive layer 308, respectively. Deformation refers to the magnitude of shape change of the material when heated or subjected to stress. Using an outer frame 104 with small deformation simplifies robotic gripping and positioning, facilitating automated production of electrochromic devices. The high production precision of the outer frame 104 eliminates defects such as bubbles, delamination, and cracks caused by inaccuracies during production, thus improving the performance of the electrochromic devices.

[0151] As an example, the first adhesive layer 304 and the second adhesive layer 308 are made of PVB, the first base layer 202 and the second base layer 206 are made of PET, and the outer frame 104 is made of PET. During the pressurization and heat treatment process, the outer frame 104, which is fixedly connected to the functional layer 102, melts to achieve edge sealing. Compared with PVB, PET has micron-level heat shrinkage, strong processability, and high production precision, eliminating defects such as bubbles, delamination, and cracking in the device caused by inaccurate precision during the production process. At the same time, PET has better water resistance than PVB, and the width of the outer frame 104 is less than 10mm. The specific width of the outer frame 104 is selected according to the different moisture resistance of the functional layer 102.

[0152] It should be understood that, although Figure 13 and Figure 15 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 13 and Figure 15 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0153] Based on the same inventive concept, this application also discloses an electrochromic device, the parts of which are the same as or corresponding to the above-described method for preparing the electrochromic device, will not be repeated below.

[0154] See Figure 14 In some embodiments, the electrochromic device includes a first substrate 302, a first adhesive layer 304, an electrochromic film 306 as described above, a second adhesive layer 308, and a second substrate 310 stacked sequentially. In the thickness direction Z of the functional layer 102 in the electrochromic film 306, the two opposing surfaces of the first adhesive layer 304 are bonded to the first substrate 302 and the electrochromic film 306, respectively, and the two opposing surfaces of the second adhesive layer 308 are bonded to the second substrate 310 and the electrochromic film 306, respectively.

[0155] In some embodiments, the electrochromic device is fabricated using the preparation method described above.

[0156] This application also provides an apparatus comprising an electrochromic film prepared by the preparation method described above; and / or an electrochromic device as described above.

[0157] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0158] The above-described embodiments are merely illustrative of several implementation methods of the present application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present application embodiments, and these all fall within the protection scope of the present application embodiments. Therefore, the protection scope of the patent for the embodiments of this application should be determined by the appended claims.

Claims

1. An electrochromic film, characterized in that, include: The functional layer includes a first base layer, an electrochromic stack, and a second base layer that are stacked sequentially. An outer frame surrounds the outer periphery of the functional layer, and the outer frame is fixedly connected to at least one of the first base layer and the second base layer.

2. The electrochromic film according to claim 1, characterized in that, The electrochromic film further includes: A welded structure, wherein the outer frame is fixedly connected to at least one of the first base layer and the second base layer via the welded structure; the welded structure includes at least one of a weld point and a weld line.

3. The electrochromic film according to claim 2, characterized in that, The welding structure includes multiple welding points, which are spaced apart along the outer periphery of the functional layer; or The welding structure includes multiple first welding points and multiple second welding points. The first welding points are fixedly connected to the outer frame and the first base layer, and the second welding points are fixedly connected to the outer frame and the second base layer. Along the outer periphery of the functional layer, the first welding points and the second welding points are alternately spaced. The welding structure includes a welding line, the length of which is greater than or equal to half the outer perimeter of the functional layer.

4. The electrochromic film according to claim 2, characterized in that, The welded structure is located on the surface of the outer frame and the surface of the first base layer, and / or the welded structure is located on the surface of the outer frame and the surface of the second base layer.

5. The electrochromic film according to claim 2, characterized in that, The welded structure is located between the inner wall of the outer frame and the outer wall of the functional layer.

6. The electrochromic film according to claim 1, characterized in that, The transmittance of the first substrate layer or the second substrate layer to 0.8μm-2μm laser light is greater than that of the outer frame to 0.8μm-2μm laser light.

7. The electrochromic film according to claim 1, characterized in that, The absorption rate of the outer frame for 0.8μm-2μm laser light is greater than that of the first substrate layer or the second substrate layer for 0.8μm-2μm laser light.

8. The electrochromic film according to claim 1, characterized in that, Along the thickness direction of the functional layer, two opposing surfaces of the outer frame are flush with two opposing surfaces of the functional layer; and / or The width of the outer frame is less than 10mm; and / or The melting points of the outer frame are lower than or equal to the melting points of the first base layer and the second base layer, respectively.

9. The electrochromic film according to claim 1, characterized in that, The outer frame is made of at least one material selected from PET, PC, PMMA, and PP; and / or The material of the first substrate layer and / or the second substrate layer includes PET.

10. The electrochromic film according to claim 1, characterized in that, The material of the outer frame is the same as that of the first base layer and / or the second base layer.

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