Liquid cooling system for projector

Abstract

The application discloses a liquid cooling heat dissipation system for a projector, which comprises a projection module, a heat dissipation module and a plurality of pipelines, wherein the pipelines are filled with cooling liquid; the projection module comprises a DMD chip part and a light source part, and the heat dissipation module comprises a first heat absorption part, a second heat absorption part, a water pump and a heat dissipation part; the first heat absorption part is in heat conduction connection with the DMD chip part, the second heat absorption part is in heat conduction connection with the light source part, the first heat absorption part is connected with the water pump and the second heat absorption part through the pipelines, and the second heat absorption part is connected with the heat dissipation part through the pipelines; and the heat dissipation part is connected with the water pump through the pipelines to form a circulation loop. Compared with the prior art, the pipeline structure is simplified, the structure is simple, the assembly is easy, the core heat source of the projector can be effectively cooled, and therefore the stability of system operation can be improved.

Description

Technical Field

[0001] This application relates to the technical field, and more particularly to a liquid cooling heat dissipation system for projectors. Background Technology

[0002] With the rapid development of display technology, projection devices are constantly moving towards higher brightness, higher resolution, and miniaturization. To achieve higher image quality, the core components of a projector—especially the DMD chip, which is the core of the imaging process, and the high-power-density LED light source—generate a significant amount of heat during operation. If this heat cannot be dissipated in a timely and effective manner, the temperature of the core components will rise sharply. Excessive operating temperature can cause a series of serious problems: for the DMD chip, high temperatures can lead to substrate deformation and misalignment of the micromirror deflection angle, resulting in image color distortion, blurring, and even fixed spots. Prolonged high-temperature operation will significantly shorten the chip's lifespan. For the LED light source, its luminous efficacy and lifespan are closely related to the operating temperature; for every 10°C-15°C increase in junction temperature, its lifespan may decrease exponentially. Therefore, the quality of heat dissipation directly determines the projector's image stability, reliability, and lifespan.

[0003] Currently, traditional projector cooling solutions mainly rely on air-cooling systems. However, air-cooling systems have significant limitations. First, their heat dissipation efficiency is limited, making it difficult to meet the needs of higher-power projection modules; second, high-speed fans generate noise, affecting the user experience; and third, high-speed fan operation easily accumulates dust, which may lead to decreased heat dissipation efficiency over time, or even overheating failure due to dust blockage.

[0004] To overcome the shortcomings of air cooling, some high-end models have begun to introduce liquid cooling technology. However, existing liquid cooling system designs still have room for optimization. For example, when using parallel water circuits to dissipate heat from different heat sources, the system structure is complex with numerous pipe joints, increasing the risk of coolant leakage. Once a leak occurs, it can easily lead to short circuits and damage to expensive DMD chips and circuits, causing serious losses. In addition, most liquid cooling systems lack intelligent collaborative control strategies. Pumps and fans typically operate at fixed power or simple temperature control curves, unable to accurately adjust according to the real-time and differentiated heat load of the DMD chip and light source. This results in unnecessary energy waste and noise at low loads, while insufficient heat dissipation may occur at high loads.

[0005] Therefore, there is an urgent need in the field for a liquid cooling system that is highly efficient in heat dissipation, reliable in operation, highly intelligent, and capable of precise temperature control of the projector's core heat source, in order to solve the aforementioned problems in the prior art. Utility Model Content

[0006] The purpose of this application is to provide a liquid cooling system for projectors, thereby solving the technical problems of complex liquid cooling structures and poor heat dissipation in existing projector technologies. The preferred technical solutions among the various technical solutions provided in this application and their numerous technical effects are detailed below.

[0007] To achieve the above objectives, this application provides the following technical solutions:

[0008] This application provides a liquid cooling system for a projector, comprising: a projection module, a heat dissipation module, and a plurality of pipes, wherein the pipes are filled with coolant; the projection module includes a DMD chip section and a light source section, and the heat dissipation module includes a first heat-absorbing section, a second heat-absorbing section, a water pump, and a heat dissipation section; the first heat-absorbing section is thermally connected to the DMD chip section, the second heat-absorbing section is thermally connected to the light source section, the first heat-absorbing section is connected to both the water pump and the second heat-absorbing section through the pipes, the second heat-absorbing section is connected to the heat dissipation section through the pipes, and the heat dissipation section is connected to the water pump through the pipes to form a circulation loop.

[0009] In some embodiments, the first heat-absorbing part, the water pump, the heat dissipation part, and the second heat-absorbing part are connected in series via the pipe.

[0010] In some embodiments, the heat dissipation unit includes a radiator and a fan assembly disposed on one side of the radiator, wherein the radiator includes a liquid cooling pipe and heat dissipation fins disposed around the liquid cooling pipe.

[0011] In some embodiments, the liquid cooling system for projectors further includes a main controller, the first heat-absorbing part is provided with a first temperature-sensing probe, the second heat-absorbing part is provided with a second temperature-sensing probe, and both the first temperature-sensing probe and the second temperature-sensing probe are electrically connected to the main controller.

[0012] In some embodiments, the water pump is an adjustable speed water pump, and the water pump is electrically connected to the main controller.

[0013] In some embodiments, the fan assembly includes at least one adjustable-speed fan electrically connected to the main controller.

[0014] In some embodiments, a pressure sensor for detecting liquid pressure is provided inside the pipeline, and the pressure sensor is electrically connected to the main controller.

[0015] In some embodiments, the liquid cooling system for the projector further includes an external buzzer and an emergency power-off switch, both of which are electrically connected to the main controller.

[0016] In some embodiments, the main controller has a built-in AI intelligent module, which is used to adjust the speed of the water pump and / or the fan assembly based on the temperature data from the first temperature sensor and the second temperature sensor.

[0017] In some embodiments, both the first heat-absorbing part and the second heat-absorbing part are made of copper.

[0018] Implementing one of the technical solutions described above in this application has the following advantages or beneficial effects: In this application, the DMD chip section and the light source section of the projector are cooled by respectively setting a first heat-absorbing part and a second heat-absorbing part. Simultaneously, the first heat-absorbing part, the second heat-absorbing part, the water pump, and the heat dissipation part are connected by pipes to form a circulation loop, allowing the coolant in the pipes to flow through the circulation loop for heat dissipation. Compared to the prior art, the embodiments of this application simplify the pipe structure, making it simple and easy to assemble. This effectively dissipates heat from the core heat source of the projector, thereby improving the stability of the system operation. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0020] Figure 1 This is a schematic diagram of the liquid cooling system for a projector according to an embodiment of this application;

[0021] Figure 2 This is an exploded view of a liquid cooling system for a projector according to an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the projection module according to an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the heat dissipation module according to an embodiment of this application.

[0024] In the diagram: 1. Projection module; 2. Heat dissipation module; 11. DMD chip section; 12. Light source section; 21. First heat absorption section; 22. Second heat absorption section; 23. Water pump; 24. Heat dissipation section; 241. Radiator; 242. Fan assembly; 25. Pipeline. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments and depict various exemplary embodiments that may be adopted to implement this application. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this application disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this application.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] To illustrate the technical solutions described in this application, specific embodiments are provided below, showing only the parts related to the embodiments of this application.

[0028] like Figures 1 to 4 As shown, this application provides a liquid cooling heat dissipation system for a projector, which may include a projection module 1, a heat dissipation module 2 and a plurality of pipes 25, the pipes 25 being filled with coolant.

[0029] In some embodiments, the projection module 1 may include a DMD chip section 11 and a light source section 12, and the heat dissipation module 2 may include a first heat absorption section 21, a second heat absorption section 22, a water pump 23, and a heat dissipation section 24. The first heat absorption section 21 may be thermally connected to the DMD chip section 11, and the second heat absorption section 22 may be thermally connected to the light source section 12. The first heat absorption section 21 may be connected to both the water pump 23 and the second heat absorption section 22 via a pipe 25. The second heat absorption section 22 may be connected to the heat dissipation section 24 via a pipe 25, and the heat dissipation section 24 may be connected to the water pump 23 via a cold zone pipe 25, so that the pipe 25 forms a circulation loop.

[0030] Specifically, the DMD (Digital Micromirror Device) chip is the core component of DLP (Digital Light Processing) technology. It controls light reflection through a precise micromirror array to achieve image projection. The first heat absorption part 21 is used to dissipate heat from the DMD chip 11, and the second heat absorption part 22 is used to dissipate heat from the light source part 12, which is an LED lamp assembly. The water pump 23 can be used to provide power to circulate the coolant in the pipe 25 for heat dissipation.

[0031] In some embodiments, the first heat-absorbing part 21, the water pump 23, the heat dissipation part 24, and the second heat-absorbing part 22 can be connected in series via a pipe 25. In this case, the first heat-absorbing part 21, the water pump 23, the heat dissipation part 24, and the second heat-absorbing part 22 form a series-connected water circuit structure via the pipe 25, which simplifies the piping, avoids multiple parallel connection joints, reduces the risk of joint leakage, and thus improves the stability of system operation.

[0032] In some embodiments, the heat dissipation unit 24 may include a radiator 241 and a fan assembly 242 disposed on one side of the radiator 241. The radiator 241 may include a liquid cooling pipe and heat dissipation fins disposed around the liquid cooling pipe. Specifically, the heat of the coolant in the liquid cooling pipe can be conducted to the heat dissipation fins through the pipe wall, and then the heat is blown out by the fan assembly 242.

[0033] In some embodiments, the liquid cooling system for the projector may further include a main controller. The first heat-absorbing part 21 may be equipped with a first temperature sensor, and the second heat-absorbing part 22 may be equipped with a second temperature sensor. Both the first and second temperature sensors are electrically connected to the main controller. The first and second temperature sensors can use two signal buses, such as RVSP twisted-pair cables, to connect the signal output terminals of the temperature sensors to the signal bus input terminals of the main controller. Specifically, the first and second temperature sensors can detect the temperatures of the first heat-absorbing part 21 and the second heat-absorbing part 22 in real time and feed them back to the main controller for data analysis.

[0034] In some embodiments, the water pump 23 is an adjustable-speed water pump and is electrically connected to the main controller. It can be controlled by a PLC, which is connected to the frequency setpoint of the frequency converter. The PLC outputs a corresponding frequency signal according to the program logic to control the speed of the water pump 23. Specifically, the main controller can adjust the speed of the adjustable-speed water pump in real time according to the load conditions.

[0035] In some embodiments, the fan assembly 242 may include at least one adjustable-speed fan, which may be electrically connected to the main controller. The main controller can directly control the speed of the fan assembly 242 via a PWM interface to achieve precise speed regulation. Specifically, the main controller can adjust the fan speed in real time according to the load conditions.

[0036] In some embodiments, a pressure sensor for detecting liquid pressure may be installed inside the pipe 25, and the pressure sensor is electrically connected to the main controller. In this embodiment, the pressure sensor is a two-wire pressure sensor, sharing two wires for power supply and signal transmission. Specifically, the pressure sensor can be used to monitor the liquid pressure inside the pipe 25 in real time and feed the monitoring signal data back to the main controller in real time.

[0037] In some embodiments, the liquid cooling system for the projector further includes an external buzzer and an emergency power-off switch, both electrically connected to the main controller. The buzzer and emergency power-off switch can be located on the PCB motherboard of the main controller, and the controller can directly control their on / off state. Specifically, when the pressure value detected by the pressure sensor is lower than a first preset threshold, the main controller can control the buzzer to sound an alarm; when the pressure value is lower than a second preset threshold, the main controller can control the emergency power-off switch to cut off the system power, wherein the second preset threshold is lower than the first preset threshold.

[0038] Specifically, when the pressure value detected by the pressure sensor is lower than the first preset threshold, there may be a slight leak in pipe 25, and the buzzer alarm will sound, prompting the user to inspect and confirm. When the pressure sensor reading is lower than the second preset threshold, there may be a serious leak in pipe 25. In this case, the main controller will control the emergency power-off switch to cut off the system power supply to prevent the leak from damaging equipment components. This effectively prevents short circuits and other damage risks caused by leaks, improving equipment safety.

[0039] In some embodiments, the main controller has a built-in AI intelligent module for dynamically adjusting the speed of the water pump 23 and / or the speed of the fan assembly 242 based on the temperature data from the first and second temperature sensors using a preset algorithm model.

[0040] This application embodiment is based on an AI intelligent module that integrates AI algorithms and automated control. Through real-time data acquisition and working condition modeling analysis, it monitors and dynamically analyzes temperature data in real time, and intelligently controls the flow rate and temperature of the coolant, thereby controlling the temperature of the DMD chip section 11 and the light source section 12.

[0041] Specifically, when the temperature is high, the main controller can increase the speed of the water pump 23, increase the coolant flow rate, and increase the fan speed for more efficient heat dissipation.

[0042] When the temperature is low, the main controller can reduce the speed of the water pump 23, decrease the flow rate of the coolant, and reduce the fan speed, thereby reducing energy consumption and noise, achieving energy saving and quiet operation. By analyzing historical and real-time data through an algorithm model, the system operating status can be adjusted more smoothly and proactively. Compared with traditional automatic control that simply sets thresholds, the embodiments of this application are more energy-efficient, quieter, and have more balanced performance.

[0043] In some embodiments, both the first heat-absorbing part 21 and the second heat-absorbing part 22 may be made of copper. Copper has a high thermal conductivity and good heat transfer performance, and using copper can efficiently transfer heat from the heat source to the coolant.

[0044] In this application, heat dissipation is achieved by respectively providing a first heat-absorbing part 21 and a second heat-absorbing part 22 to the DMD chip part 11 and the light source part 12 of the projector. Simultaneously, the first heat-absorbing part 21, the second heat-absorbing part 22, the water pump 23, and the heat dissipation part 24 are connected by a pipe 25 to form a circulation loop, allowing the coolant within the pipe 25 to flow through the circulation loop for heat dissipation. Compared to the prior art, the embodiment of this application simplifies the pipe structure, making it simpler, easier to assemble, and able to effectively dissipate heat from the core heat source of the projector, thereby improving the stability of system operation.

[0045] The above description is merely a preferred embodiment of this application. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this application. Furthermore, under the teachings of this application, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this application. Therefore, this application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this application.

Claims

1. A liquid cooling system for a projector, characterized in that, include: The projection module, the heat dissipation module, and several pipes, wherein the pipes are filled with coolant; The projection module includes a DMD chip and a light source. The heat dissipation module includes a first heat absorption part, a second heat absorption part, a water pump, and a heat dissipation part. The first heat absorption part is thermally connected to the DMD chip, and the second heat absorption part is thermally connected to the light source. The first heat absorption part is connected to both the water pump and the second heat absorption part through the pipe. The second heat absorption part is connected to the heat dissipation part through the pipe. The heat dissipation part is connected to the water pump through the pipe to form a circulation loop.

2. The liquid cooling system for projectors according to claim 1, characterized in that, The first heat-absorbing part, the water pump, the heat dissipation part, and the second heat-absorbing part are connected in series via the pipe.

3. The liquid cooling system for projectors according to claim 1, characterized in that, The heat dissipation unit includes a radiator and a fan assembly disposed on one side of the radiator. The radiator includes a liquid cooling pipe and heat dissipation fins disposed around the liquid cooling pipe.

4. The liquid cooling system for projectors according to claim 3, characterized in that, The liquid cooling system for the projector also includes a main controller. The first heat-absorbing part is equipped with a first temperature-sensing probe, and the second heat-absorbing part is equipped with a second temperature-sensing probe. Both the first temperature-sensing probe and the second temperature-sensing probe are electrically connected to the main controller.

5. The liquid cooling system for projectors according to claim 4, characterized in that, The water pump is an adjustable speed water pump, and the water pump is electrically connected to the main controller.

6. The liquid cooling system for projectors according to claim 4, characterized in that, The fan assembly includes at least one adjustable speed fan, which is electrically connected to the main controller.

7. The liquid cooling system for projectors according to claim 4, characterized in that, The pipeline is equipped with a pressure sensor for detecting the pressure of the liquid circuit, and the pressure sensor is electrically connected to the main controller.

8. The liquid cooling system for projectors according to claim 4, characterized in that, The liquid cooling system for the projector also includes an external buzzer and an emergency power-off switch, both of which are electrically connected to the main controller.

9. The liquid cooling system for projectors according to claim 4, characterized in that, The main controller has a built-in AI intelligent module, which is used to adjust the speed of the water pump and / or the fan group according to the temperature data of the first temperature probe and the second temperature probe.

10. The liquid cooling system for projectors according to claim 1, characterized in that, Both the first heat-absorbing part and the second heat-absorbing part are made of copper.

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