Developing cartridge assembly
Patent Information
- Application Number
- CN202522659982.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-03-11
- Filing Date
- 2024-11-06
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2034-11-06
AI Technical Summary
当显影盒因分离机构作用而向上移动(例如在非打印状态下使显影辊与感光鼓分离)时,芯片架随之上移,若其末端面与设备后侧壁无间隙,则可能因结构干涉或摩擦阻力导致芯片与触针之间产生前后方向的错位或脱离,进而引发通信中断、识别失败等问题
[0145]当需要拆卸/取出显影盒B100时,通过连接部B32,可以使得芯片组件B20随着显影盒主体B10一同从成像设备PM被被拆卸/取出,从而方便用户操作。
Smart Images

Figure CN224840801U_ABST
Abstract
Description
[0001] This divisional application is a divisional application of Chinese utility model patent application filed on November 6, 2024, with application number 202422713456.4 and titled "Chip Assembly, Developing Box and Processing Box".
[0002] This utility model claims priority to the following prior applications: application number 202322994581.2, filed on November 6, 2023, entitled "Chip Assembly, Developing Cartridge Assembly and Processing Cartridge"; application number 202420246289.4, filed on January 31, 2024, entitled "Chip Assembly and Developing Cartridge"; application number 202420396032.7, filed on February 29, 2024, entitled "Chip Assembly and Imaging Material Cartridge"; and application number 202420467580.4, filed on March 11, 2024, entitled "Chip Assembly and Imaging Material Cartridge". All contents of these prior applications are cross-referenced in this application. Technical Field
[0003] This utility model relates to the field of electrophotographic imaging, and more particularly to a developing cartridge assembly that can be detachably installed in an electrophotographic imaging device. Background Technology
[0004] In electrophotographic imaging equipment, the developing cartridge or processing cartridge, as a replaceable consumable, typically integrates a chip assembly for communicating with the equipment to identify the consumable's status. This chip assembly is generally located at the end of the cartridge and connects to contacts within the equipment via electrical contacts. To ensure reliable communication, the chip must maintain a stable electrical connection with the contacts after installation, and the contact should not be interrupted even if the developing cartridge undergoes slight displacement due to separation during equipment operation.
[0005] In existing technologies, the chip holder is often designed to be flush against or abut against the rear wall of the device's housing cavity. When the developing cartridge moves upward due to the separation mechanism (e.g., separating the developing roller from the photosensitive drum in a non-printing state), the chip holder moves upward as well. If there is no gap between its end face and the rear wall of the device, structural interference or frictional resistance may cause misalignment or detachment between the chip and the contact pin in the front-to-back direction, leading to communication interruptions, recognition failures, and other problems. Furthermore, if the chip holder is in direct contact with the rear wall of the housing cavity during installation or removal, it will increase operational resistance and affect the user experience. Utility Model Content
[0006] In view of the above, this utility model provides a developing cartridge employing the following technical solution to solve the aforementioned technical problems. The specific solution is as follows:
[0007] A developing cartridge assembly is detachably mounted into an electrophotographic imaging device having a housing, the housing including a stylus, a receiving cavity, and a front side plate and a rear side plate spaced apart in a front-rear direction, the receiving cavity being located between the front side plate and the rear side plate, the stylus being disposed on the same side as the front side plate, and the rear side plate having a rear surface facing the front side plate. The developing cartridge assembly is characterized by comprising: a housing for containing developer, the housing including a cartridge body and an end cap fixedly connected to the cartridge body; a developing roller for carrying the developer, the developing roller being rotatably disposed in the cartridge body about a rotation axis parallel to the left-right direction; and a driving force receiver for receiving driving force from the imaging device, directly or indirectly transmitting the driving force. Power is transmitted to the developing roller in the left-right direction, with the end where the driving force receiver and end cap are located being the driving end, and at least a portion of the driving force receiver being exposed from the end cap; a chip assembly is mounted downwards into the receiving cavity in the up-down direction, the chip assembly being located at the driving end, the chip assembly comprising: a chip including an electrical contact portion that forms an electrical connection with a stylus; and a chip holder supporting the chip, the chip holder having a rearward-facing end face; wherein, when the developing cartridge assembly is mounted to the imaging device, in the front-back direction, the end face faces the rear surface, a gap exists between the end face and the rear surface, and the front-back direction, the left-right direction, and the up-down direction are perpendicular to each other.
[0008] In some embodiments, the chip assembly is fixedly disposed on at least one of the housing and the end cap.
[0009] In some embodiments, the chip further includes a substrate and a storage portion electrically connected to an electrical contact portion, wherein the electrical contact portion and the storage portion are respectively disposed on opposite sides of the substrate, and the electrical contact portion, the substrate, and the storage portion are integrally formed.
[0010] In some embodiments, the chip assembly further includes an adapter, through which the chip holder is connected to the housing.
[0011] In some embodiments, the chip assembly is further provided with an elastic element disposed on the side of the substrate away from the electrical contact portion.
[0012] In some embodiments, the elastic element is made of sponge.
[0013] In some embodiments, the developing cartridge assembly is detachably coupled to a drum housing provided with a photosensitive drum and a second abutment portion. The driving end of the developing cartridge assembly is provided with a second force-applying portion, which abuts against the second abutment portion to separate the developing roller from the photosensitive drum. In the state where the developing roller and the photosensitive drum are separated, there is a gap between the end face and the rear surface.
[0014] In some embodiments, the developing cartridge assembly includes a driving force transmission section coaxially disposed with a driving force receiver, a blade, and a blade holder supporting the blade. The blade holder includes a first portion, a second portion, and a bent portion formed between the first portion and the second portion. When viewed in a left-right direction, the bent portion is located outside the projection range of the driving force transmission section.
[0015] In some embodiments, the developing cartridge is provided with a power receiver, and the imaging device is provided with a power output component for contacting the power receiver. When viewed in the left-right direction, the contact point when the power receiver and the power output component are electrically connected is located outside the projection range of the driving force transmission part.
[0016] In some embodiments, the gap is 0.5mm-4mm.
[0017] The beneficial effects of this utility model are: maintaining a gap between the chip holder and the rear wall of the equipment to ensure smooth installation and disassembly and stable and reliable electrical contact during separation. Attached Figure Description
[0018] Figure 1 This is a perspective view of the developing cartridge assembly and the drum cartridge after they are separated, according to Embodiment 1 of this utility model.
[0019] Figure 2 This is an exploded view of the chip assembly after it has been separated from the developing cartridge housing in the developing cartridge assembly according to Embodiment 1 of this utility model.
[0020] Figure 3 After the developing cartridge assembly according to Embodiment 1 of this utility model is installed into the imaging device, along... Figure 1 A cross-sectional view taken from left to right after being cut along the AA direction.
[0021] Figure 4 This is a perspective view of the developing cartridge assembly according to Embodiment 2 of this utility model, after the second elastic element is separated from the chip holder.
[0022] Figure 5 After the developing cartridge assembly according to Embodiment 2 of this utility model is installed into the imaging device, along... Figure 1 A cross-sectional view taken from left to right after being cut along the AA direction.
[0023] Figure 6 This is a diagram showing the state of the developing cartridge assembly according to Embodiment 3 of this utility model after it has been installed in the imaging device.
[0024] Figure 7 After the developing cartridge assembly according to Embodiment 3 of this utility model is installed into the imaging device, along... Figure 1 A cross-sectional view taken from left to right after being cut along the AA direction.
[0025] Figure 8 yes Figure 7 A magnified schematic diagram of a local area R.
[0026] Figure 9 This is a diagram showing the state of the developing cartridge assembly according to Embodiment 4 of this utility model after the developing cartridge is installed into the drum cartridge.
[0027] Figure 10 This is a schematic diagram of the first installation method of the chip assembly in the developing cartridge assembly according to Embodiment 4 of this utility model.
[0028] Figure 11 This is a schematic diagram of the second mounting method of the chip assembly in the developing cartridge assembly according to Embodiment 4 of this utility model.
[0029] Figure 12 This is a schematic diagram of the developing cartridge and drum unit combined according to Embodiment 5 of this utility model.
[0030] Figure 13 This is a schematic diagram of the developing cartridge and drum unit not being combined according to Embodiment 5 of this utility model.
[0031] Figure 14 This is a schematic diagram of the chip assembly and the main body of the developing cartridge after separation in Embodiment 5 of this utility model.
[0032] Figure 15A and Figure 15B This is a schematic diagram of the developing cartridge being installed in an imaging device according to Embodiment Six of this utility model.
[0033] Figure 16A and Figure 16B This is a schematic diagram of the cover element involved in Embodiment Six of this utility model.
[0034] Figure 17 This is a schematic diagram of the developing cartridge and drum unit combined according to Embodiment 7 of this utility model.
[0035] Figure 18 This is a schematic diagram of the developing cartridge being installed in an imaging device according to Embodiment 7 of this utility model.
[0036] Figure 19 This is a schematic diagram of the deformed developing cartridge and drum unit combined in Embodiment 7 of this utility model.
[0037] Figure 20 and Figure 21 This is a schematic diagram of the deformed developing cartridge being installed into the imaging device in Embodiment 7 of this utility model.
[0038] Figure 22 This is a schematic diagram of the cover element involved in Embodiment 8 of this utility model.
[0039] Figure 23 This is a schematic diagram of the chip assembly involved in Embodiment 8 of this utility model.
[0040] Figure 24 This is a schematic diagram of the chip assembly installed in place according to Embodiment 8 of this utility model.
[0041] Figure 25 This is a schematic diagram of the cover element involved in Embodiment 9 of this utility model.
[0042] Figure 26 This is a schematic diagram of the chip assembly involved in Embodiment Nine of this utility model.
[0043] Figure 27 This is a schematic diagram of the developing cartridge being installed in an imaging device according to Embodiment 9 of this utility model.
[0044] Figure 28 This is a schematic diagram of the cover element involved in Embodiment 10 of this utility model.
[0045] Figure 29 and Figure 30 This is a schematic diagram of the chip assembly involved in Embodiment 10 of this utility model.
[0046] Figure 31A and Figure 31B This is a schematic diagram of the developing cartridge being installed into the drum cartridge according to Embodiment Eleven of this utility model.
[0047] Figure 32A This is a schematic diagram of the electrical connection between the chip assembly and the stylus in the imaging device according to Embodiment 11 of this utility model.
[0048] Figure 32B and Figure 32C This is a schematic diagram of the guide rail in the imaging device according to Embodiment Eleven of this utility model.
[0049] Figures 33A-33C This is a schematic diagram of the chip assembly involved in Embodiment Eleven of this utility model.
[0050] Figure 34A This is a schematic diagram of the end cap and chip assembly involved in Embodiment Eleven of this utility model.
[0051] Figure 34B This is a schematic diagram of the end cap according to Embodiment Eleven of this utility model.
[0052] Figure 35A This is a schematic diagram of the developing cartridge being installed into the drum cartridge according to Embodiment Twelve of this utility model.
[0053] Figure 35B This is an exploded view of the developing cartridge drive end according to Embodiment Twelve of this utility model.
[0054] Figure 35C This is a side view of the developing cartridge and drum cartridge as described in Embodiment Twelve of this utility model, viewed from left to right.
[0055] Figure 36A This is a schematic diagram of the chip assembly involved in Embodiment Twelve of this utility model.
[0056] Figure 36B This is a schematic diagram of the chip rack involved in Embodiment Twelve of this utility model.
[0057] Figure 37A This is a schematic diagram of the structure of the first contact part and the first force-applying part involved in Embodiment Twelve of this utility model.
[0058] Figure 37B This is a schematic diagram of the separating component involved in Embodiment Twelve of this utility model.
[0059] Figure 37C This is a schematic diagram of the first contact portion according to Embodiment Twelve of this utility model.
[0060] Figure 38A This is a schematic diagram of the structure of the second abutting part and the second force-applying part according to Embodiment Twelve of this utility model.
[0061] Figure 38B This is a schematic diagram of the second force-applying part involved in Embodiment Twelve of this utility model.
[0062] Figure 38C This is a schematic diagram of the second abutting part according to Embodiment Twelve of this utility model.
[0063] Figure 39 This is a schematic diagram of the developing cartridge and drum cartridge being installed in an imaging device according to Embodiment Thirteen of this utility model.
[0064] Figure 40 This is a schematic diagram of the developing cartridge being installed into the drum cartridge according to Embodiment Thirteen of this utility model.
[0065] Figure 41A and Figure 41B This is a schematic diagram of the chip assembly involved in Embodiment Thirteen of this utility model.
[0066] Figure 42A This is a schematic diagram of the non-drive end of the developing cartridge according to Embodiment Thirteen of this utility model when it is installed into the drum cartridge.
[0067] Figure 42B This is a schematic diagram of the developing cartridge according to Embodiment Thirteen of this utility model when viewed from right to left.
[0068] Figure 43This is a schematic diagram of the developing cartridge and drum box installed in the imaging device according to Embodiment Fourteen of this utility model.
[0069] Figure 44A and Figure 44B This is a schematic diagram of the chip assembly mounting section according to Embodiment Fourteen of this utility model.
[0070] Figure 45 This is a schematic diagram of the developing cartridge and drum cartridge according to Embodiment Fourteen of this utility model, with some components hidden after installation into the imaging device.
[0071] Figure 46 This is a schematic diagram of the chip assembly involved in Embodiment Fourteen of this utility model. Detailed Implementation
[0072] The embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0073] [Example 1]
[0074] like Figure 1 As shown, the processing cartridge includes a developing cartridge assembly 100 and a drum cartridge 200. The processing cartridge can be detachably installed into the imaging device. The developing cartridge assembly 100 includes a developing cartridge and a chip assembly 300. The developing cartridge includes a cartridge body 11 and a developing roller 13. The cartridge body 11 is used to contain developer, and the developing roller 13 is rotatably disposed in the cartridge body 11 and is used to carry developer. The chip assembly 300 cooperates with the developing cartridge assembly 100 and is provided with a chip 32 for establishing a communication connection with the imaging device. The drum cartridge 200 includes a drum frame 21 and a photosensitive drum 23 rotatably disposed in the drum frame 21. The drum frame 21 forms a receiving space 22 for accommodating the developing cartridge. In the developing cartridge assembly 100, at least the developing cartridge and the drum cartridge are detachably combined, or at least the developing cartridge can be detachably installed into the receiving space 22.
[0075] Preferably, the drum cartridge 200 further includes a pusher 24 movable relative to the drum frame 21. When the developing cartridge is installed into the receiving space 22, the pusher 24 pushes the developing cartridge so that the developing roller 13 and the photosensitive drum 23 remain close to each other. When the imaging device performs development, the developing roller 13 supplies developer to the photosensitive drum 23 on which an electrostatic latent image is formed, so that the electrostatic latent image is developed.
[0076] In the following text, the direction in which the developing roller 13 extends is the first direction / longitudinal direction / left-right direction, the direction intersecting with the first direction is the second direction / lateral direction / up-down direction, and the direction intersecting with both the first and second directions is the third direction / vertical direction / front-back direction. Along the second direction, the developing roller 13 is located at one end / below of the cartridge 11, and conversely, above. Preferably, the first direction, the second direction, and the third direction are perpendicular to each other. Along the third direction, the exposed side of the developing roller 15 is the front, and conversely, the rear.
[0077] Furthermore, the developing cartridge assembly 100 also includes a driving force receiver 15 for receiving driving force from the imaging device. The driving force receiver 15 directly or indirectly transmits the driving force to the developing roller 13 to drive the developing roller 13 to rotate about a rotation axis L extending along a first direction. Along the first direction, one end where the driving force receiver 15 is located is the driving end, and the end opposite to the driving end is the non-driving end.
[0078] like Figure 6 and Figure 7 As shown, based on the orientation of the developing cartridge / processing cartridge after it is installed in the imaging device, the following are defined: along the first direction, the direction from the driving end to the non-driving end is right, and the opposite is left; along the second direction, the direction from the end where the developing roller 13 is provided to the end where the developing roller 13 is not provided is up, and the opposite is down; along the third direction, the exposed part of the developing roller 13 faces forward, and the opposite is rearward.
[0079] In practice, the developing cartridge assembly 100 and the drum box 200 can be first combined outside the imaging device to form a processing cartridge, which is then detachably installed into the imaging device. Alternatively, the drum box 200 can be installed into the imaging device, and then the developing cartridge assembly 100 can be installed into the drum box 200. Or, the drum box 200 can be pre-installed in the imaging device, and the developing cartridge assembly can be directly detachably installed into the imaging device / drum box 200.
[0080] More specifically, the chip component 300 in the developing cartridge assembly 100 can also be independent of the developing cartridge. Thus, the combination of the developing cartridge assembly 100 and the drum cartridge 200 can be divided into three methods: First, the developing cartridge and drum cartridge 200 are combined, and the chip component 300 is installed after the combined developing cartridge and drum cartridge 200 are installed into the imaging device. Second, the developing cartridge and drum cartridge 200 are combined, and the chip component 300 is installed into the developing cartridge / drum cartridge before the combined developing cartridge and drum cartridge 200 are installed into the imaging device, and then the developing cartridge, chip component 300, and drum cartridge 200 are installed together into the imaging device. Third, the developing cartridge and chip component 300 are combined to form the developing cartridge assembly 100, which is then combined with the drum cartridge 200 to form a processing cartridge. Finally, the processing cartridge is detachably installed into the imaging device. These three methods will be specifically described in the embodiments of this utility model.
[0081] like Figure 1 and Figure 2 As shown, the developing cartridge also includes an end cap 14 disposed at the drive end, the end cap 14 being fixedly connected to the cartridge body 11, at least a portion of the drive force receiving member 15 being exposed from the end cap 14, and the chip assembly 300 being fixedly disposed on at least one of the cartridge body 11 and the end cap 14. Overall, the cartridge body 11 and the end cap 14 can be collectively referred to as the housing of the developing cartridge, the developing roller being rotatably disposed on the housing, and the chip assembly 300 being fixedly connected to the housing / developing cartridge.
[0082] The chip assembly 300 includes a chip holder 31 and a chip 32 supported by the chip holder 31. The chip holder 31 is fixedly connected to a housing and includes a front portion 31a, a middle portion 31c, and a rear portion 31b arranged sequentially from front to back along a third direction. The front portion 31a supports the chip, the middle portion 31c connects the front portion 31a and the rear portion 31b, and the rear portion 31b is disposed opposite to the front portion 31a and has a rearward-facing end surface 31b1. The chip 32 includes a substrate 321, a plurality of electrical contacts 322, and a storage portion (not shown). The electrical contacts 322 are electrically connected to the storage portion and are used to contact a stylus in an imaging device to form an electrical connection. The chip 32 / developer cartridge assembly / processor cartridge establishes a communication connection with the imaging device. The storage unit is used to store information of the developer cartridge assembly / processor cartridge. Generally, the electrical contact 322 and the storage unit are respectively disposed on opposite sides of the substrate 321, that is, the electrical contact 322, the substrate 321 and the storage unit are formed as one unit. However, in an achievable manner, the electrical contact 322 and the substrate 321 can also be disposed separately, as long as the electrical contact 322 is electrically connected to the storage unit. Therefore, the chip 32 being supported by the chip holder 31 should be understood as at least the electrical contact 322 being supported by the chip holder 31. Specifically, in the chip 32, at least the electrical contact 322 is supported by the front part 31a.
[0083] In some embodiments, the chip 32 also includes a positioning portion 323 disposed on the substrate 321. Correspondingly, the chip holder 31 is provided with a positioning portion for cooperating with the positioning portion 323. In this way, the chip 32 can be stably positioned on the chip holder 31. It should be understood that the combination of the positioning portion 323 and the positioning portion can be a snap-fit combination, or a welding combination, magnetic combination, etc.
[0084] In some embodiments, the chip assembly 300 further includes a first elastic element 33 for applying a pushing force to the chip 32 / electrical contact 322 to bring the chip 32 / electrical contact 322 closer to the stylus.
[0085] In some embodiments, the chip assembly 300 further includes an adapter 39, through which the chip holder 31 is connected to the housing. The adapter 39 allows for more diverse connection methods and positions between the chip assembly 300 and the housing. For ease of understanding, the following description assumes that the adapter 39 is not provided.
[0086] The imaging device includes a housing 400 for accommodating the chip assembly 300. The housing 400 can be part of a guide rail for mounting the processing cartridge, or it can be a separate component outside the guide rail. Continuing... Figure 1 As shown, the container 400 includes a main body 401, a receiving cavity 402, and a stylus 403. The main body 401 has a front side plate 401a and a rear side plate 401b that are spaced apart from each other in the front-rear direction. The receiving cavity 402 is located between the front side plate 401a and the rear side plate 401b. The stylus 403 is disposed on the same side as the front side plate 401a and faces the receiving cavity 402. When the stylus 403 is subjected to a forward pressing force, the stylus 403 can retract into the front side plate 401a. According to the above description, the receiving cavity 402 can also be disposed on the developing cartridge. Therefore, the receiving cavity 402 should be understood as being disposed between the developing cartridge and the imaging device.
[0087] Furthermore, the housing 400 also includes a device-side guide surface 404, and the rear side plate 401b also has a rear surface 401c facing the front side plate 401a. The guide surface 404 is adjacent to the rear surface 401c. Preferably, the guide surface 404 is connected to the rear surface 401c. In this way, under the action of the guide surface 404, the chip assembly 300 can enter the housing cavity 402 more smoothly.
[0088] As described above, the chip holder 31 is fixedly connected to the housing, and thus the chip assembly 300 is installed as the developing cartridge is installed toward the drum cartridge 200 / imaging device, and disassembled as the developing cartridge is removed from the drum cartridge 200 / imaging device.
[0089] like Figure 3 As shown, when the developing cartridge assembly 100 / processing cartridge is installed in the predetermined position of the imaging device, in the chip assembly 300, at least a portion of the chip holder 31 enters the receiving cavity 402, and the stylus 403 contacts the chip 32 / electrical contact portion 322. Preferably, under the action of the first elastic member 33, the stylus 403 and the chip 32 / electrical contact portion 322 can be kept in a more stable contact state. Along the third direction, the end face 31b1 faces the rear surface 401c, but the end face 31b1 and the rear surface 401c do not contact each other and a gap g is formed between them. The gap g is preferably 0.5mm-4mm.
[0090] During the installation of the developing cartridge assembly 100 / processing cartridge toward or from the imaging device, the gap g is always present, thus making the installation and removal process smoother.
[0091] In some embodiments, when the imaging device is not developing, the developing roller 13 and the photosensitive drum 23 will change from a state of being close to each other to a state of being separated from each other. Specifically, the imaging device applies a separation force to the separation mechanism 25 provided in the drum cassette 200. The separation mechanism 25 pushes the developing cassette upward, causing the developing roller 13 and the photosensitive drum 23 to separate from each other. When the chip holder 31 is fixedly connected to the housing, as the developing cassette moves upward, the chip holder 31 will also move upward. However, as long as the gap g exists, the chip 32 / electrical contact 322 supported by the chip holder 31 will slide relative to the stylus 403 in the second direction. However, in the third direction, the electrical contact 322 and the stylus 403 will still maintain stable contact.
[0092] On the other hand, when the developing cartridge assembly 100 is installed in the imaging device, and the imaging device is shaken, the gap g can provide the chip holder 31 with a third-direction movement space, which helps to prevent the chip holder 31 from being damaged by hard contact with the housing 400; furthermore, when the gap g is set to be smaller than the size by which the stylus 403 is squeezed forward by the chip 32 / electrical contact portion 322, even if the end face 31b1 contacts the rear surface 401c during the movement of the chip holder 31, it can be ensured that the stylus 403 does not lose contact with the chip 32 / electrical contact portion 322.
[0093] [Example 2]
[0094] The same structure as in Embodiment 1 will not be described again, and the same components as in Embodiment 1 will be numbered the same. The following focuses on describing the differences between this embodiment and Embodiment 1.
[0095] like Figure 4 and Figure 5 As shown, the chip assembly 300 in this embodiment also includes a second elastic member 34 disposed at the rear part 31b. The second elastic member 34 can ensure a more stable contact between the stylus 403 and the chip 32 / electrical contact part 322. When the chip holder 31 with the second elastic member 34 enters the receiving cavity 402, the purpose of this utility model can be achieved regardless of whether the second elastic member 34 is in contact with the rear surface 401c. However, the end face 31b1 is never in contact with the rear surface 401c.
[0096] Furthermore, the chip holder 31 also includes a hollow portion 31d disposed in the middle portion 31c. The hollow portion 31d can reduce the amount of material used in the chip holder 31. On the other hand, when the chip holder 31 is compressed in the third direction, the hollow portion 31d can cause a slight deformation of the chip holder 31 in the third direction, so that the electrical contact portion 322 and the contact pin 403 can maintain stable contact. Preferably, the hollow portion 31d extends through the middle portion 31c in the direction intersecting with the third direction.
[0097] [Example 3]
[0098] The imaging device is provided with an installation port for allowing the installation of the processing cartridge / developing cartridge / developing cartridge assembly 100 and a cover 500 for covering the installation port. For color imaging devices, generally four processing cartridges need to be installed simultaneously for development. The four processing cartridges have essentially the same structure, but contain different colors of developer, such as... Figure 6 As shown, along the direction from back to front, there are black processing box K, blue processing box C, red processing box M and yellow processing box Y arranged in sequence.
[0099] In some embodiments, the four processing boxes can be sequentially mounted on a tray that can move in the front-back direction, and then the tray is pushed forward until it reaches a predetermined position in the imaging device, after which the door cover 500 is closed.
[0100] In some embodiments, the tray can also be fixed inside the imaging device. In this case, the user can directly install the four processing boxes into the imaging device and then close the door cover 500.
[0101] The cover 500 includes a cover body 501 and a protrusion 502 connected to the cover body 501. In the imaging device, the protrusion 502 protrudes from the cover body 501 toward a mounting cavity Q for accommodating a processing box, and the number of protrusions is the same as the number of processing boxes, with each protrusion corresponding to one processing box.
[0102] like Figure 7 and Figure 8 As shown, when the door cover 500 is closed, along the second direction, the protrusion 502 is opposite to the receiving cavity 402, and the end face 31b1 still does not contact the rear surface 401c, and a gap g is still formed between them; furthermore, the chip assembly 300 also includes an extension 35 connected to the chip holder 31. Along the third direction, the extension 35 is used to abut against the protrusion 502, so that the gap g can be stably maintained.
[0103] Preferably, the extension 35 protrudes from the chip holder 31 in the form of a cantilever. Therefore, regardless of whether the extension 35 is integrally formed with the chip holder 31, the extension 35 always has a certain amount of deformability. Thus, the chip assembly in this embodiment also has the advantages described in Embodiment 2, and is conducive to improving the contact stability between the electrical contact 322 and the stylus 403.
[0104] In some embodiments, when the door cover 500 is closed, the end face 31b1 contacts the rear surface 401c without a gap g between them, but the contact stability between the electrical contact 322 and the stylus 403 is still maintained under the abutting action of the extension 35 and the protrusion 502.
[0105] In some embodiments, when the cover 500 is closed, the chip assembly 300 can also contact other parts of the cover 500, for example, the extension 35 engages with a recess provided in the cover 500, or the cover 501 engages with the chip assembly 300, etc.
[0106] [Example 4]
[0107] Unlike the above embodiments, in this embodiment, the chip assembly 300 is set separately from the developing cartridge. That is, in the developing cartridge assembly 100, the chip assembly 300 is independent of the developing cartridge and is no longer connected to the developing cartridge. When at least a portion of the chip assembly 300 involved in this embodiment is accommodated by the housing 400, the end face 31b1 contacts or forms a gap g with the rear surface 401c.
[0108] like Figure 9 As shown, the developing cartridge also includes a guide 16, which guides the chip assembly 300 toward the receiving cavity 402; as described above, there are three ways to combine the developing cartridge assembly 100 with the drum cartridge 200. Figure 10 The first method is shown, in which the developing cartridge and the drum cartridge 200 are first combined, then the combined developing cartridge and the drum cartridge 200 are installed into the imaging device, and finally the chip assembly 300 is installed downward along the second direction into the receiving cavity 402. During the installation of the chip assembly 300, the guide surface 161 provided on the guide member 16 can guide the chip assembly 300.
[0109] Preferably, the guide member 16 protrudes to the left from the housing, and the guide surface 161 is an inclined surface provided on the guide member 16.
[0110] More preferably, the chip assembly 300 also includes a gripping part 36 disposed on the chip holder 31, which facilitates the user to install and remove the chip assembly 300 independently. The gripping part 36 can be a protrusion protruding from the chip holder 31 or a recess disposed on the chip holder 31.
[0111] As can be seen, in the first method, the chip assembly 300 does not need to be connected to the developing cartridge, which allows the chip assembly 300 to be freely installed in or removed from the imaging device as an independent component; in the second and third methods, the chip assembly 300 needs to be connected to the developing cartridge. Specifically, the chip assembly 300 can be attached to the outer surface of the housing or installed in a pre-set cavity of the developing cartridge.
[0112] Clearly, the chip assembly 300 in the first approach offers greater operability and design freedom. When only a component in the chip assembly 300 or a component in the developing cartridge needs replacement, the user only needs to replace one of the chip assembly 300 or the developing cartridge, while the other can continue to be used, which helps reduce the user's operating costs. On the other hand, the relatively independent chip assembly 300 and developing cartridge also have wider versatility. For example, in two similar models, the only difference is the data or shape of the chip, or the only difference is the structure or developer color in the developing cartridge. In this case, the manufacturer of the developing cartridge assembly 100 / processing cartridge can combine the corresponding chip assembly 300 and developing cartridge according to actual shipping requirements. Similarly, users can also combine the chip assembly 300 and developing cartridge according to their own needs.
[0113] Based on the inventive concept of this utility model, this utility model also provides a developing cartridge as described below, such as... Figures 12-14 As shown, the developing cartridge B100 and the drum stand / drum box B900 are combined and installed together in the imaging device PM through the mounting port 010 to perform developing / imaging operations. When it is necessary to remove / take out the developing cartridge B100, the developing cartridge B100 together with the drum stand / drum box B900 is removed / taken out of the imaging device PM to the outside of the mounting port 010.
[0114] like Figures 12-14 As shown, the developing cartridge B100 includes a housing B1 for containing developer and a developing element / developing roller B11 rotatably disposed within the housing B1 (e.g., Figure 19 As shown), the developing element / developing roller B11 extends along a first direction and can rotate about a rotation axis L parallel to the first direction (as shown). Figure 19As shown, in the second direction, the developing element / developing roller B11 is located at one end of the housing B1. After the developing cartridge B100 is combined with the drum frame / drum box B900, the developing element / developing roller B11 is opposite to the photosensitive element / photosensitive drum B910 disposed in the drum frame / drum box B900. The photosensitive element / photosensitive drum B910 is rotatably disposed in the frame / drum frame B901 of the drum frame / drum box B900. The developing element / developing roller B11 is used to transport developer to the photosensitive element / photosensitive drum B910. The developing cartridge B100 also includes a driving force receiver B12 disposed at one end of the housing B1 in the first direction. The driving force receiver B12 is used to receive the driving force provided by the imaging device PM, thereby driving the developing element / developing roller B11 to rotate.
[0115] Furthermore, along the second direction, the direction in which the developing element / developing roller B11 approaches the photosensitive element / photosensitive drum B910 is defined as the installation direction, and the direction in which the developing element / developing roller B11 moves away from the photosensitive element / photosensitive drum B910 is defined as the removal / removal direction.
[0116] Furthermore, one end where the driving force receiver B12 is located can be defined as the driving end C1, and the other end opposite to the driving end C1 in the first direction can be defined as the non-driving end C2.
[0117] In the first direction, the developing cartridge B100 also includes a cover / end cap B31 disposed at one end of the housing B1. Further, the cover / end cap B31 includes a cover body B311 and a cover clearance opening B312. When the cover / end cap B31 is disposed at the drive end C1, at least a portion of the drive force receiving member B12 is exposed from the cover clearance opening B312.
[0118] The developing cartridge B100 includes a developing cartridge body B10 and a chip assembly B20. The developing cartridge body B10 refers to all components except for the chip assembly B20; that is, the developing cartridge body B10 includes a housing B1 and a developing element / developing roller B11. A portion of the chip assembly B20 is used to connect with the contact pin / electric contact pin 403 (e.g., Figure 22 (As shown) Electrical connection / contact. Further, the chip assembly B20 is separately disposed from the developing cartridge body B10 (the chip assembly B20 is independent of the developing cartridge body B10), or the chip assembly B20 is disposed in the middle of the developing cartridge body B10. During transportation or before installation into the imaging device PM, the chip assembly B20 can be separately disposed from the developing cartridge body B10 or disposed in the middle of the developing cartridge body B10. When the chip assembly is disposed in the middle of the developing cartridge body B10, the chip assembly B20 may be located on the side of the developing cartridge body B10 closer to the imaging device PM door cover when the developing cartridge body B10 is in the imaging device PM, or it may be located on the side of the developing cartridge body B10 closer to the inner wall of the imaging device PM when the developing cartridge body B10 is in the imaging device PM.
[0119] After the chip assembly B20 is installed into the imaging device PM, the chip assembly B20 and the developing cartridge body B10 may or may not have an assembly relationship, which will be further explained in the following sections.
[0120] [Example 5]
[0121] In this embodiment, during transportation or before installation into the imaging device PM, the chip assembly B20 is positioned in the middle of the developing cartridge body B10. When the developing cartridge B100 needs to be installed into the imaging device PM, the chip assembly B20 is first removed from the developing cartridge body B10, and then the developing cartridge body B10 is attached to the drum mount / drum box B900. The chip assembly B20 is installed into the imaging device PM independently of the developing cartridge body B10. Specifically, the developing cartridge body B10 can be installed into the imaging device PM first, and then the chip assembly B20 can be installed into the imaging device PM, or the chip assembly B20 can be installed into the imaging device PM first, and then the developing cartridge body B10 can be installed into the imaging device PM. That is to say, after the chip assembly B20 is installed into the imaging device PM, the chip assembly B20 and the developing cartridge body B10 do not contact each other, that is, there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10.
[0122] After the chip assembly B20 and the developing cartridge body B10 are installed into the imaging device PM, the chip assembly B20 can be electrically connected / contacted with the contact pin / electrical contact 403 (described later). At this time, the chip assembly B20 is located in the installation position relative to the developing cartridge body B10. Specifically, the installation position refers to the position where the chip assembly B20 can be electrically connected / contacted with the contact pin / electrical contact 403 (described later).
[0123] Furthermore, in this application, the installation position can be located at the driving end C1 or the non-driving end C2. Along the first direction, the middle position is set between the driving end C1 and the non-driving end C2. Relative to the installation position, the chip component B20 also has a non-installation position. The non-installation position refers to the case where the chip component B20 is located in the middle position and the case where the chip component B20 and the developing cartridge body B10 are separately set (the chip component B20 is independent of the developing cartridge body B10). When the chip component B20 is in the non-installation position relative to the developing cartridge body B10, the chip component B20 does not contact the contact pin / electric contact pin 403.
[0124] Furthermore, when the chip assembly B20 is in the intermediate position, the developing cartridge body B10 is provided with a bonding assembly. This bonding assembly is used to mount the chip assembly B20 onto the developing cartridge body B10. In this embodiment, the bonding assembly includes a bonding portion B131, through which the chip assembly B20 is mounted on the developing cartridge body B10. In a first direction, the bonding portion B131 is located between the driving end C1 and the non-driving end C2. The bonding portion B131 is also provided with a bonding member, which is used to engage with at least a portion of the chip assembly B20 to mount the chip assembly B20 onto the developing cartridge body B10. In this embodiment, the chip assembly B20 and the bonding portion B131 are bonded by adhesive. Specifically, the bonding member is an adhesive, which can be glue or double-sided tape, as long as it enables the chip assembly B20 to be mounted on the developing cartridge body B10.
[0125] In some embodiments, the engagement between the chip assembly B20 and the junction B131 can also be achieved by snap-fit engagement, friction engagement, magnetic engagement, riveting, etc., as long as it enables the chip assembly B20 to be placed on the developing cartridge body B10 and the chip assembly B20 to be removed from the junction B131.
[0126] Furthermore, the chip assembly B20 includes at least an electrical contact portion B211 for electrical connection / contact with the stylus / electrical stylus 403. Specifically, the chip assembly B20 is provided with a chip B21 and a chip holder B22. The chip B21 includes a chip substrate B212 and an electrical contact portion B211 disposed on the chip substrate B212. The electrical contact portion B211 is used for electrical connection / contact with the stylus / electrical stylus 403 to establish a communication connection between the developing cartridge B100 and the imaging device PM. When the developing cartridge body B10 is provided with a connecting portion B131, the chip assembly B20 also includes a connected portion B224 disposed on the chip holder B22. The connected portion B224 is used to engage with the connecting portion B131 so that the chip assembly B20 can be disposed on the developing cartridge body B10. The chip assembly B20 is also provided with a gripping portion B223 connected to the chip holder B22. 223 facilitates user access to the chip assembly B20; the chip assembly B20 is also provided with an elastic element B225, which can be disposed on the side of the chip substrate B212 (in this embodiment, the chip substrate B212 can be regarded as a substrate) away from the electrical contact portion B211. That is, the elastic element B225 can be disposed between the chip B21 and the chip holder B22, or it can be disposed on the side of the chip holder B22 opposite to the chip B21. The elastic element B225 can also be disposed in both of the aforementioned positions simultaneously. Furthermore, the elastic element B225 can generate elastic deformation. By providing the elastic element B225, the chip assembly B20 can achieve a flexible connection with the imaging device PM, making the electrical connection / contact between the chip B21 and the stylus / electrical stylus 403 more stable. Furthermore, the elastic element B225 can be a sponge, spring, rubber, etc., which are not limited here.
[0127] When the developing cartridge B100 needs to be removed from the imaging device PM, the developing cartridge body B10 and the chip assembly B20 are removed / taken out separately. The chip assembly B20 will not be taken out of the imaging device PM along with the developing cartridge body B10. Specifically, the order of removal / taking out the developing cartridge body B10 and the chip assembly B20 can be reversed; that is, the chip assembly B20 can be removed / taken out first, followed by the developing cartridge body B10, or vice versa.
[0128] In some embodiments, the developing cartridge body B10 may not have the joining part B131. During transportation or before installation into the imaging device PM, the chip assembly B20 is separately set from the developing cartridge body B10 (the chip assembly B20 is independent of the developing cartridge body B10).
[0129] It should be noted that in this application, when the developing cartridge B100 needs to be installed into the imaging device PM, the chip assembly B20 needs to be installed separately. That is, during transportation or before installation into the imaging device PM, the chip assembly B20 is in a non-installation position relative to the developing cartridge body B100. In this application, the chip assembly B20 is installed into the imaging device PM independently of the developing cartridge body B100.
[0130] like Figure 15B As shown, the side wall 001 of the imaging device PM is located on one side of the developing cartridge body B10. The upper wall 002 and lower wall 003 of the imaging device are arranged opposite to each other. The stylus / electrical stylus 403 is arranged on the upper wall 002. The side wall 001, upper wall 002 and lower wall 003 enclose a chip assembly receiving space 007. When the chip assembly B20 is installed into the imaging device PM, it is received by the chip assembly receiving space 007 so that the chip assembly B20 can be installed. The side wall 001, upper wall 002 and lower wall 003 can position the chip assembly B20 so that the electrical contact part B211 of the chip B21 is electrically connected / contacts the stylus / electrical stylus 403. Along the direction intersecting with the first direction, the side of the chip holder B22 opposite to the chip B21 / elastic member B225 is used to abut against the lower wall 003.
[0131] In some implementations, the chip assembly 22 can also be positioned by other components in the imaging device PM.
[0132] By positioning the chip assembly B20 in a non-installation position relative to the developing cartridge body B100 during transport or before installation into the imaging device PM, i.e., the chip assembly B20 and the developing cartridge body B100 are separately configured, or the chip assembly B20 is positioned in the middle of the developing cartridge body B10, the beneficial effects of this embodiment are as follows:
[0133] 1. It can simplify the structure of the developing cartridge body B10 to avoid interference between the developing cartridge body B10 and the imaging device PM during the installation process, so as to ensure smooth installation of the developing cartridge body B10 and improve the user experience.
[0134] 2. When the chip assembly B20 is located in the middle of the developing cartridge body B10, if the user installs the developing cartridge B100 without removing the chip assembly B20, the door cover of the imaging device PM will be blocked by the chip assembly B20 and cannot be closed, or the inner wall of the imaging device PM will interfere with the chip assembly B20, making it impossible to install the developing cartridge B100. Therefore, the user can be prompted to remove the chip assembly B20 before installation.
[0135] [Example 6]
[0136] like Figure 15Aand Figure 15B , Figure 16A and Figure 16B As shown, based on Embodiment 5, in this embodiment, the developing cartridge body B10 is provided with a connecting part B32. The connecting part B32 is used to connect with the chip assembly B20 removed from the connecting part B131. The chip assembly B20 also includes a connected part B222 disposed on the chip holder B22. The connected part B222 is used to connect with the connecting part B32. When the chip assembly B20 is connected to the connecting part B32, the chip assembly B20 is in the installation position relative to the developing cartridge body B10. Furthermore, the connecting part B32 is provided on the cover / end cap B31. The connecting part B32 is a protrusion that protrudes from the cover body B311 along a first direction toward the driving end C1 (away from the housing B1 / non-driving end C2). The connecting part B32 includes a first surface B321 and a second surface B322 that are arranged opposite to each other in their thickness direction. The first surface B321 is provided with a connector B323 that is connected to the chip assembly B20. The connector B323 is used to connect with the connected part B222. The connection method between the chip assembly B20 and the connector B323 can be adhesive, snap-fit, or friction bonding, etc., as long as it can enable the chip assembly B20 to be connected to the connector B323 after being removed from the joint part B131 and the chip assembly B20 to be easily removed from the connecting part B32.
[0137] In this embodiment, the chip assembly B20 and the connector B323 are bonded together by adhesive. Furthermore, the connector B323 is a bonding agent used to connect with the chip assembly B20. The bonding agent can be glue or double-sided tape, as long as it enables the chip assembly B20 to connect with the connector B323. In some embodiments, the connecting portion B32 can also be disposed on the housing B1.
[0138] It should be noted that, in this embodiment, after the chip assembly B20 is installed onto the imaging device PM, the chip assembly B20 is connected to the connector B323 by adhesive bonding, and there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10. When the chip assembly B20 and the connector B323 are in frictional engagement, there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10; when the chip assembly B20 and the connector B323 are in snap-fit engagement, there is an assembly relationship between the chip assembly B20 and the developing cartridge body B10.
[0139] Furthermore, the position of the connecting part B222 relative to the developing cartridge body B100 is different before and after the developing cartridge B100 is installed in the imaging device PM. Specifically, before the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in a non-installation position relative to the developing cartridge body B10, and after the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in an installation position relative to the developing cartridge body B10.
[0140] In this embodiment, the connected portion B222 and the joined portion B224 are the same component.
[0141] When the developing cartridge B100 needs to be installed into the imaging device PM, first remove the chip assembly B20 from the joint B131 and install the chip assembly B20 into the connecting part B32, then attach the assembled developing cartridge B100 to the drum holder / drum box B900, and finally install it into the imaging device PM; or, first install the developing cartridge body B10 into the imaging device PM, and then install the chip assembly B20 into the imaging device PM.
[0142] When the developing cartridge B100 needs to be removed from the imaging device PM, the chip assembly B20 will be removed from the imaging device PM along with the developing cartridge body B10 through the connection with the connecting part B32. After the chip assembly B20 is taken out by the developing cartridge body B10, there is no need to operate other parts of the developing cartridge body B10. The user can hold the chip assembly B20 to disengage it from the connecting part B323, thereby directly removing the chip assembly B20 from the developing cartridge body B10.
[0143] In some embodiments, the developing cartridge body B10 does not have a joint portion B131, but only a connecting portion B32. That is, during transportation or before installation into the imaging device PM, the chip assembly B20 is separately set from the developing cartridge body B10 (the chip assembly B20 is independent of the developing cartridge body B10).
[0144] In addition to the benefits described in Example 5, this embodiment also has the following beneficial effects:
[0145] When it is necessary to disassemble / remove the developing cartridge B100, the chip assembly B20 can be disassembled / removed from the imaging device PM along with the developing cartridge body B10 via the connecting part B32, thus facilitating user operation.
[0146] [Example 7]
[0147] like Figure 17 and Figure 18As shown in Embodiment 5, in this embodiment, the bonding assembly includes a bonding portion B131 and a flexible member B132. Both the bonding portion B131 and the flexible member B132 are used to connect the chip assembly B20 and the developing cartridge body B10. Specifically, the flexible member B132 includes a first end B1321 and a second end B1322. The first end B1321 is used to connect with the developing cartridge body B10 / housing B1, and the second end B1322 is used to connect with the chip assembly B20. When the developing cartridge B100 is in transit or before being installed in the imaging device PM, the chip assembly B20 is bonded to the bonding portion B131 of the developing cartridge body B10.
[0148] When the developing cartridge B100 needs to be installed on the imaging device PM, after removing the chip assembly B20 from the joint B131, first attach the developing cartridge body B10 to the drum holder / drum box B900, then install the drum holder / drum box B900 and the developing cartridge body B10 on the imaging device PM, and finally install the chip assembly B20 on the imaging device PM.
[0149] When the developing cartridge B100 needs to be removed from the imaging device PM, the chip assembly B20 will be removed from the imaging device PM along with the developing cartridge body B10 through the flexible part B132 between the chip assembly B20 and the developing cartridge body B10.
[0150] Furthermore, the flexible component B132 can serve a connecting function. For example, the flexible component B132 can be, but is not limited to, straps, ropes, rubber bands, corrugated tubes, and spirals.
[0151] [Transformation 1]
[0152] like Figures 19-21 As shown, the first end B1321 of the flexible component B132 is used to connect with the developing cartridge body B10 / shell B1. Specifically, the first end B1321 is configured to connect with the connecting portion B131. The second end B1322 is used to connect with the chip assembly B20. Specifically, the second end B1322 is connected to the connector (not shown) provided on the chip assembly B20. Specifically, the connector is provided on the holding portion B223. The developing cartridge body B10 / shell B1 is also provided with a first blocking component B133 and a second blocking component B134. The first blocking component B133 and the second blocking component B134 are used to prevent the flexible component B132 from interfering with other components, thereby positioning the flexible component B132.
[0153] In some embodiments, the bonding assembly only includes the flexible element B132, that is, the developing cartridge body B10 does not have a bonding portion B131. During transportation or before installation into the imaging device PM, the chip assembly B20 is connected to the developing cartridge body B10 via the flexible element B132.
[0154] In this embodiment and its variations, when the developing cartridge B100 needs to be disassembled / removed from the imaging device PM, the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10 through the flexible member B132. After the chip assembly B20 is taken out, it remains connected to the developing cartridge body B10 through the flexible member B132.
[0155] It should be noted that in this embodiment and its variations, the chip assembly B20 is connected to the developing cartridge body B10 through the flexible component B132. After the chip assembly B20 is installed on the imaging device PM, the chip assembly B20 is not assembled on the developing cartridge body B10, that is, there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10.
[0156] The beneficial effects that can be obtained from this embodiment and its modifications are as follows:
[0157] 1. The chip assembly B20 is connected to the developing cartridge body B10 via the flexible component B132. When disassembling / removing, the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10, thus facilitating user operation.
[0158] 2. Before the chip assembly B20 is installed into the imaging device PM, the chip assembly B20 is connected to the developing cartridge body B10 at least through the joint B131. Due to the provision of the flexible member B132, even if the chip assembly B20 is disengaged from the joint B131, the chip assembly B20 can still be connected to the developing cartridge body B10 through the flexible member B132.
[0159] 3. After the chip assembly B20 is connected to the junction B131, the flexible component B132 is provided to prevent the chip assembly B20 from falling to the ground due to the chip assembly B20 not being properly connected to the junction B131, thus preventing damage to the chip assembly B20.
[0160] 4. After the chip assembly B20 is installed into the imaging device PM, the chip assembly B20 is connected to the developing cartridge body B10 through the flexible component B132, which can prevent the chip assembly B20 from falling off due to the vibration of the imaging device PM.
[0161] [Example 8]
[0162] like Figures 22-24As shown, similar to Embodiment Six, the connecting portion B32 is disposed on the cover / end cap B31. However, in this embodiment, the connecting portion B32 is provided with a first clearance portion B321 and a magnet portion B323. The first clearance portion B321 allows at least a portion of the chip assembly B20 to pass through, and the magnet portion B323 engages with the chip assembly B20, thereby allowing the chip assembly B20 to be joined with the connecting portion B32. This ultimately allows the chip assembly B20 to be disassembled / removed from the imaging device PM along with the developing cartridge body B10. The chip assembly B20 also has a grip portion B223 connected to the chip holder B22, which facilitates user handling of the chip assembly B20. In some embodiments, the connecting portion B32 is further provided with a reinforcing rib B324 to improve the strength of the connecting portion B32. In some embodiments, the connecting portion B32 may also be disposed on the housing B1.
[0163] Furthermore, the position of the connecting part B222 relative to the developing cartridge body B100 is different before and after the developing cartridge B100 is installed in the imaging device PM. Specifically, before the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in a non-installation position relative to the developing cartridge body B10, and after the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in an installation position relative to the developing cartridge body B10.
[0164] Furthermore, at least a portion of the chip assembly B20 is made of a magnetic material, and the chip assembly B20 includes a connected portion B222 disposed on the chip socket B22 for bonding with the magnet portion B323. The connected portion B222 is magnetic, and preferably, the entire chip socket B22 is made of a magnetic material.
[0165] In this embodiment, the developing cartridge body B10 may or may not have a connecting portion B131. When the developing cartridge body B10 does not have a connecting portion B131, the chip assembly B20 is separately disposed from the developing cartridge body B10 during transportation or before being installed in the imaging device PM (the chip assembly B20 is independent of the developing cartridge body B10). After the developing cartridge B100 is installed in the imaging device PM, the connected portion B222 of the chip assembly B20 is attracted by the magnet portion B323. At this time, the chip assembly B20 is located in the installation position relative to the developing cartridge body B10.
[0166] When the developing cartridge B100 needs to be installed into the imaging device PM, the developing cartridge body B10 is first installed into the imaging device PM, and then the chip assembly B20 is installed into the imaging device PM; or, the chip assembly B20 is first installed into the connecting part B32, and then the chip assembly B20 and the developing cartridge body B10 are installed together into the imaging device PM.
[0167] When it is necessary to disassemble / remove the developing cartridge B100, the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10 through the magnetic connection between the magnet part B323 and the connected part B222. After the chip assembly B20 is taken out by the developing cartridge body B10, there is no need to operate other parts of the developing cartridge body B10. The user can hold the chip assembly B20 to disengage it from the magnet part B323, thereby directly removing the chip assembly B20 from the developing cartridge body B10; or, the chip assembly B20 can be disassembled / removed first, and then the developing cartridge body B10 can be disassembled / removed.
[0168] It should be noted that in this embodiment, after the chip assembly B20 is installed into the imaging device PM, the chip assembly B20 and the developing cartridge body B10 are joined together by the magnetic connection between the magnet part B323 and the connected part B222. The chip assembly B20 is not assembled on the developing cartridge body B10, that is, there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10.
[0169] [Example 9]
[0170] like Figures 25-27 As shown in Embodiments 6 and 8, the connecting part B32 is disposed on the cover / end cap B31. The difference is that in this embodiment, the connecting part B32 is configured as a protrusion protruding from the cover / end cap B31 along the first direction toward the driving end C1 (away from the housing B1 / non-driving end C2). The connecting part / protrusion B32 is provided with a connecting protrusion B323 intersecting the first direction. The connecting protrusion B323 is used to engage with the chip assembly B20 so that when the developing cartridge B100 is disassembled / removed, the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10, which is convenient for user operation. The chip assembly B20 is also provided with a gripping part B223 connected to the chip holder B22. The gripping part B223 makes it easy for the user to pick up the chip assembly B20.
[0171] In some embodiments, the connecting portion B32 is further provided with a reinforcing rib B324, which is used to improve the strength of the connecting portion B32.
[0172] In some embodiments, the connecting part B32 may also be provided on the housing B1.
[0173] Furthermore, the position of the connecting part B222 relative to the developing cartridge body B100 is different before and after the developing cartridge B100 is installed in the imaging device PM. Specifically, before the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in a non-installation position relative to the developing cartridge body B10, and after the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in an installation position relative to the developing cartridge body B10.
[0174] Furthermore, the chip assembly B20 includes a connected portion B222 disposed on the chip holder B22. More specifically, the connected portion B222 is configured as a groove, which is used to engage with the connecting protrusion B323. When it is necessary to remove / take out the developing cartridge B100, the chip assembly B20 can be taken out of the imaging device PM together with the developing cartridge body B10. Alternatively, the chip assembly B20 can be removed / taken out first, and then the developing cartridge body B10 can be removed / taken out.
[0175] In this embodiment, the developing cartridge body B10 may or may not have a connecting portion B131. When the developing cartridge body B10 does not have a connecting portion B131, the chip assembly B20 is separately disposed from the developing cartridge body B10 during transportation or before being installed in the imaging device PM (the chip assembly B20 is independent of the developing cartridge body B10). After the developing cartridge B100 is installed in the imaging device PM, the connected portion / groove B222 of the chip assembly B20 engages with the connecting protrusion B323 / connecting portion B32. At this time, the chip assembly B20 is located in the installation position relative to the developing cartridge body B10. In some embodiments, after the developing cartridge B100 is installed into the imaging device PM, the connected portion / groove B222 of the chip assembly B20 does not contact the connecting protrusion B323. That is, there is a gap between the connected portion / groove B222 and the connecting protrusion B323 of the chip assembly B20, and the chip assembly B20 is not assembled onto the developing cartridge body B10. In other words, there is no assembly relationship between the chip assembly B20 and the developing cartridge body B10. When the developing cartridge B100 needs to be disassembled / removed, the connecting protrusion B323 will contact the connected portion / groove B222 during the process of disassembling / removing the developing cartridge body B10, so that the chip assembly B20 can be taken out of the imaging device PM by the developing cartridge body B10.
[0176] It should be noted that after the chip assembly B20 is installed into the imaging device PM, when the connected part / groove B222 of the chip assembly B20 engages with the connecting protrusion B323 / connecting part B32, the chip assembly B20 and the developing cartridge body B10 have an assembly relationship. When the connected part / groove B222 of the chip assembly B20 and the connecting protrusion B323 are not in contact, the chip assembly B20 and the developing cartridge body B10 do not have an assembly relationship.
[0177] When the developing cartridge B100 needs to be installed into the imaging device PM, first install the developing cartridge body B10 into the imaging device PM, and then install the chip assembly B20 into the imaging device PM.
[0178] When it is necessary to disassemble / remove the developing cartridge B100, the chip assembly B20 is engaged with the connecting part B32, and the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10. After the chip assembly B20 is taken out by the developing cartridge body B10, there is no need to operate other parts of the developing cartridge body B10. The user can hold the chip assembly B20 to disengage it from the connecting protrusion B323, thereby directly removing the chip assembly B20 from the developing cartridge body B10; or, the chip assembly B20 can be disassembled / removed first, and then the developing cartridge body B10 can be disassembled / removed.
[0179] [Example 10]
[0180] like Figure 28 and Figure 29 As shown, similar to Embodiments 6, 8, and 9, the connecting portion B32 is disposed on the cover / end cap B31. The difference is that in this embodiment, the connecting portion B32 is configured as a protrusion extending from the cover / end cap B31 along a first direction toward the driving end C1 (away from the housing B1 / non-driving end C2). The connecting portion / protrusion B32 has a recess B323 recessed along the first direction toward the non-driving end C2 (closer to the housing B1 / non-driving end C2). The recess B323 is used to interact with a portion of the chip assembly B20. The connecting part / protrusion B32 also has an abutment surface B321, which is used to interact with a portion of the chip assembly B20. Along the installation direction, the abutment surface B321 is located upstream of the recess B323. That is, when the developing cartridge body B10 is installed to the imaging device PM first, and then the chip assembly B20 is installed to the imaging device PM, during the installation of the chip assembly B20 along the installation direction, a portion of the chip assembly B20 first interacts with the abutment surface B321 and then with the recess B323.
[0181] In some embodiments, the connecting part B32 may also be provided on the housing B1.
[0182] Furthermore, the position of the connecting part B222 relative to the developing cartridge body B100 is different before and after the developing cartridge B100 is installed in the imaging device PM. Specifically, before the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in a non-installation position relative to the developing cartridge body B10, and after the developing cartridge B100 is installed in the imaging device PM, the connecting part B222 is in an installation position relative to the developing cartridge body B10.
[0183] Furthermore, the chip assembly B20 also includes a connected portion B222 disposed on the chip socket B22. At least a portion of the connected portion B222 is used to interact with the connecting portion B32. Specifically, the connected portion B222 is provided with a movable portion B222a and a spring portion B222b. At least a portion of the movable portion B222a is used to engage with the connecting portion B32 / recess B323. Specifically, the movable portion B222a is configured to move along a first direction, and the spring portion B222b is used to generate a spring force that causes the movable portion B222a to move in the first direction. Further still, the connected portion B222 has an inclined surface B222c disposed on the side of the movable portion B222a facing the non-driving end C2. The inclined surface B222c is used to abut against the abutting surface B321 of the connecting portion / protrusion B32.
[0184] Furthermore, the inclined plane B222c can have different tilt directions; specifically, the tilt direction can be towards the installation direction (e.g., Figure 29 As shown), it can also be tilted in the direction of disassembly / removal (e.g. Figure 30 (As shown). Depending on the tilt direction, the installation sequence of the developing cartridge body B10 and the chip assembly B20 is also different. Specifically, when the inclined surface B222c is tilted towards the installation direction, the developing cartridge body B10 is installed into the imaging device PM first, and then the chip assembly B20 is installed into the imaging device PM. When the inclined surface B222c is tilted towards the removal / removal direction, the abutment surface B321 is located downstream of the recess B323 along the installation direction. In this case, the chip assembly B20 is installed into the imaging device PM first, and then the developing cartridge body B10 is installed into the imaging device PM.
[0185] In some embodiments, the connecting portion B32 can be disposed on the chip assembly B20, that is, the recess B323 and the abutment surface B321 are disposed on the chip assembly B20, and the connected portion B222 is disposed on the cover / end cap B31 or the housing B1, that is, the movable portion B222a and the elastic portion B222b are disposed on the cover / end cap B31 / housing B1. Similarly, the inclined surface B222c can be inclined toward the installation direction or toward the disassembly / removal direction.
[0186] Depending on the tilt direction, the installation sequence of the developing cartridge body B10 and the chip assembly B20 is also different. Specifically, when the inclined surface B222c is tilted towards the installation direction, the chip assembly B20 is installed into the imaging device PM first, and then the developing cartridge body B10 is installed into the imaging device PM; when the inclined surface B222c is tilted towards the removal / removal direction, the developing cartridge body B10 is installed into the imaging device PM first, and then the chip assembly B20 is installed into the imaging device PM.
[0187] This embodiment uses the inclined surface B222c tilted towards the installation direction as an example. When the developing cartridge B100 needs to be installed into the imaging device PM, the developing cartridge body B10 is first attached to the drum frame / drum box B900, and then the developing cartridge body B10 together with the drum frame / drum box B900 is installed into the imaging device PM. Finally, the chip assembly B20 is installed into the imaging device PM. Furthermore, during the installation of the chip assembly B20, the inclined surface B222c abuts against the contact surface B321 of the connecting part / protrusion B32, so that the movable part B222a moves towards the drive end C1 along the first direction, thereby causing the elastic part B222b to undergo elastic deformation. As the chip assembly B20 continues to be installed, under the action of elasticity, the movable part B222a enters the recess B323 of the connecting part / protrusion B32 and is locked, and the chip assembly B20 is installed in the predetermined position. At this time, the chip assembly B20 is located in the installation position relative to the developing cartridge body B10.
[0188] In some embodiments, the contact surface B321 can be set as an inclined surface, and the movable part B222a can be set as a straight surface structure. When the developing cartridge B100 needs to be installed on the imaging device PM, the developing cartridge body B10 is first installed on the imaging device PM, and then the chip assembly B20 is installed on the imaging device PM.
[0189] In this embodiment, the developing cartridge body B10 may or may not have a connecting portion B131. When the developing cartridge body B10 does not have a connecting portion B131, the chip assembly B20 is separately disposed from the developing cartridge body B10 during transportation or before being installed in the imaging device PM (the chip assembly B20 is independent of the developing cartridge body B10). After the developing cartridge B100 is installed in the imaging device PM, the connected portion B222 / movable portion B222a of the chip assembly B20 engages with the recess B323. At this time, the chip assembly B20 is located in the installation position relative to the developing cartridge body B10.
[0190] When it is necessary to disassemble / remove the developing cartridge B100, the chip assembly B20 is held in place by the recess B323, and the chip assembly B20 can be taken out of the imaging device PM along with the developing cartridge body B10. After being taken out by the developing cartridge body B10, the chip assembly B20 falls directly from the developing cartridge body B10 under the elastic force of its own elastic part B222b.
[0191] Based on the above embodiments, when the developing cartridge B100 needs to be installed on the imaging device PM, the specific installation method is as follows:
[0192] 1. Open the packaging of chip assembly B20, developer cartridge body B10 and drum stand / drum box B900 separately.
[0193] 2. Attach the developer cartridge body B10 to the drum stand / drum box B900.
[0194] 3. Install the developing cartridge body B10, which is attached to the drum stand / drum box B900, into the imaging device PM.
[0195] 4. Install the chip assembly B20 into the imaging device PM.
[0196] In summary, by installing the chip assembly independently of the developing cartridge body into the imaging device, the interference between the developing cartridge body and the imaging device during installation can be avoided, thus preventing the chip assembly from being damaged by impact.
[0197] Based on the inventive concept of this utility model, this utility model also provides a developing cartridge as described below.
[0198] [Example 11]
[0199] In this embodiment, the developing cartridge C11 further includes a driving force receiver / driving head C18 and a driving force transmission assembly for transmitting the driving force received by the driving force receiver / driving head C18 to each component in the developing cartridge C11. In the longitudinal direction, the driving force receiver / driving head C18 is located at one end of the housing / first cartridge C111. The driving force receiver / driving head C18 is used to receive driving force from the imaging device to drive the developing roller C15 to rotate. The driving force transmission assembly includes a driving force transmission part C51, which is coaxially arranged with the driving force receiver / driving head C18.
[0200] like Figure 31A , Figure 31B , Figure 32A , Figure 32B , Figure 32C , Figure 33A , Figure 33B , Figure 33C , Figure 34A , Figure 34B As shown, in this embodiment, the chip component C300 is detachably installed into the imaging device independently of the developing cartridge body (all components of the developing cartridge C11 except for the chip component C300). That is, the chip component C300 is set separately from the developing cartridge body. The chip component C300 is used to establish a communication connection between the developing cartridge body and the imaging device. In other words, the developing cartridge body is recognized by the imaging device through the chip component C300.
[0201] Furthermore, the chip assembly C300 is detachably mounted in the chip assembly mounting section 401 of the imaging device, and the chip assembly mounting section 401 has a chip assembly accommodating space 4011 for accommodating the chip assembly C300.
[0202] Furthermore, chip C32 is detachably mounted on chip holder C31. Specifically, chip C32 has a first surface C32a and a second surface C32b, which are arranged opposite to each other. Chip C32 is provided with an electrical contact C321 for electrical connection with the contact pin 403. Specifically, the electrical contact C321 is located on the first surface C32a. Chip C32 is also provided with a storage part C322. In this embodiment, the storage part C322 is located on the second surface C32b. To prevent chip C32 from being installed incorrectly, chip C32 is also provided with a foolproof part C323. In this embodiment, the foolproof part C323 is located on the second surface C32b. Specifically, in the direction from the first surface C32a to the second surface C32b, the foolproof part C323 protrudes from the second surface C32b. In some embodiments, the foolproof part C323 can also be configured with other structures or other forms.
[0203] Furthermore, the chip holder C31 includes a first component C311 and a second component C312. The first component C311 is provided with a receiving portion C3111 and a reinforcing member C3112. When the chip assembly C300 and the developing cartridge body are both installed in the imaging device, the receiving portion C3111 can be used to accommodate the mating part C1117a provided in the developing cartridge C11, and the reinforcing member C3112 is used to strengthen the structural strength of the chip holder C31. The second component C312 is elastic, and the chip assembly C300 is installed into the imaging device. During the preparation process, the second component C312 can undergo elastic deformation after contacting the imaging device. Furthermore, the second component C312 is provided with a locking part C3121, which interacts with the locked part 4015 provided on the imaging device. After the chip assembly C300 is installed in place, the locking part C3121 engages with the locked part 4015, thereby fixing the chip assembly C300. When the chip assembly C300 is installed in place, a "click" sound can be heard to notify the user.
[0204] Furthermore, the first component C311 is made of a rigid material. In order to ensure that the chip C32 and the contact pin 403 maintain an elastic connection and a more stable electrical connection, the second component C312 is made of an elastic material with a deformable range. Specifically, the methods to achieve the elastic connection between the chip C32 and the contact pin 403 include: 1. setting an elastic element between the chip C32 and the chip holder C31; 2. setting an elastic element between the chip holder C31 and the imaging device; 3. the chip holder C31 or the chip C32 itself is elastic.
[0205] In some embodiments, the material of the first component C311 may also be a flexible material.
[0206] Furthermore, the chip assembly C300 can be configured to have one or more components. When the chip assembly C300 is configured to have one component, the elastic element can be placed between the chip C32 and the chip holder C31, or the elastic element can be placed between the chip assembly C300 and the imaging device, or the elastic element can be placed in both of the aforementioned positions simultaneously. When the chip assembly C300 is configured to have multiple components, the elastic element can be placed between the various components.
[0207] Furthermore, the elastic element can be a sponge, spring, rubber, felt, etc.
[0208] Furthermore, the chip holder C31 also includes a chip mounting portion C313 for mounting the chip C32. The chip mounting portion C313 is provided with a first fixing portion C3131, a second fixing portion C3132, a third fixing portion C3135, and a locking portion C3133. In the left-right direction, the first fixing portion C3131 and the second fixing portion C3132 are spaced apart and opposite to each other, with the first fixing portion C3131 located to the right of the second fixing portion C3132. The first fixing portion C3131 and the second fixing portion C3132 are used to prevent the chip C32 from moving in the left-right direction. In the front-back direction, the third fixing portion C3135 and the locking portion C3133... The chip holder C31 is spaced relatively apart. The third fixing part C3135 is used to prevent the chip C32 from moving backward. In addition, the locking part C3133 is also used to lock the chip C32 to prevent the chip C32 from moving forward. When unlocking is required, the user can press the locking part C3133 in the direction from the first surface C32a to the second surface C32b to unlock, and the chip C32 can be removed. The chip holder C31 also includes a second clearance part C3134 for matching with the foolproof part C323 to prevent the chip C32 from being installed incorrectly. Specifically, the second clearance part C3134 is set as a groove structure, and the foolproof part C323 is set as a protrusion structure. Further, the second clearance part C3134 is set as a groove structure. 134 is located between the first protrusion C3134a and the second protrusion C3134b, which are spaced apart from each other on the chip mounting portion C3133. In the left-right direction, the first protrusion C3134a is located to the right of the second protrusion C3134b. In the upward direction, the height of the second protrusion C3134b is lower than the height of the first protrusion C3134a. That is, in the upward direction, the end face of the second protrusion C3134b is further away from the end face of the first fixing portion C3131 than the end face of the first protrusion C3134a. Thus, the first protrusion C3134a is higher. During the chip C32 mounting process, the first protrusion C3134a... 4a can limit the rightward displacement of the misalignment part C323, preventing it from exceeding the first protrusion C3134a due to excessive force during installation. This allows the misalignment part C323 to accurately engage with the second clearance part C3134. Simultaneously, the second protrusion C3134b is low in height, ensuring it does not obstruct the installation of the chip C32 during installation. This allows the chip C32 to be smoothly installed onto the chip mounting part C313 / chip holder C31. In some embodiments, the second clearance part C3134 can be a protruding structure, and the misalignment part C323 can be a recessed structure. In some embodiments, the chip assembly C300 can also be positioned using other locations on the imaging device (e.g., slide rail 4013, positioning element 4014, etc.) and the drum box C12.
[0209] Furthermore, the chip assembly C300 is also provided with a first identification part C3113. For example, the first identification part C3113 can be set as a letter to match the developing cartridge body. The imaging device is provided with a second identification part 4012, which is aligned with the first identification part C3113 so that the user can better identify the installation position of the chip assembly C300. Furthermore, the second identification part 4012 is set as the same letter as the first identification part C3113.
[0210] Furthermore, the end cap C1117 located at the left end of the housing / first cartridge C111 is provided with a mating part C1117a. Specifically, the mating part C1117a is a protrusion extending in the front-rear direction. The mating part C1117a is used to allow the chip assembly C300 and the developing cartridge body to be disassembled simultaneously. When the developing cartridge body and the chip assembly C300 are both installed in the imaging device, the mating part C1117a is accommodated by the receiving part C3111 of the chip assembly C300. The chip assembly C300 does not contact the developing cartridge body, that is, the chip assembly C300 is not connected to the developing cartridge body. During the disassembly of the developing cartridge C11, the chip assembly C300 comes into contact with the developing cartridge body. Specifically, the chip assembly C300 is driven by the mating part C1117a and is carried out to the imaging device simultaneously with the developing cartridge body. After the developing cartridge C11 is disassembled, the chip assembly C300 can be easily removed from the developing cartridge body.
[0211] In some embodiments, when both the developing cartridge body and the chip assembly C300 are mounted to the imaging device, the chip assembly C300 may be configured to contact the developing cartridge body, or it may be configured to contact or not contact the drum cartridge C12.
[0212] Furthermore, the mating part C1117a is provided with a chamfered portion C1117b, which is used to ensure that the chip assembly C300 can be smoothly installed in place. The mating part C1117a is also provided with a connecting portion C1117c. During the disassembly of the developing cartridge C11, the connecting portion C1117c contacts the chip holder C31 and brings the chip assembly C300 out together to the imaging device.
[0213] Furthermore, the side where the first identifier C3113 is located is set as a plane. In addition, the door cover of the imaging device is provided with one or more protrusions (not shown). Preferably, the door cover is provided with two protrusions. When the chip assembly C300 is not installed in place, during the process of the user closing the door cover, the protrusions contact the side where the first identifier C3113 is located in the chip assembly C300. As the door cover is gradually closed, the chip assembly C300 is gradually pushed by the door cover and installed in place.
[0214] Furthermore, in this embodiment, the developing cartridge body and the drum cartridge C12 are first combined and then installed together into the imaging device, and then the chip assembly C300 is installed into the imaging device. When the developing cartridge C11 is disassembled, the developing cartridge body can take the chip assembly C300 out with it. In some embodiments, the chip assembly C300 can be installed first, and then the combination of the developing cartridge body and the drum cartridge C12 can be installed.
[0215] Furthermore, the shape of the chip component C300 is preferably a regular quadrilateral for drop protection. In some embodiments, the chip component C300 can also be set to other shapes, such as triangles, circles, etc.
[0216] Furthermore, the chip assembly C300 is designed with the developing cartridge body and the chip assembly C300 as separate units, which simplifies the structure of the developing cartridge C11 and avoids interference between the developing cartridge C11 and the imaging equipment during installation.
[0217] [Example Twelve]
[0218] like Figures 35A-35C , Figure 36A , Figure 36B , Figures 37A-37C , Figures 38A-38C As shown, the difference between this embodiment and embodiment eleven is that the chip assembly C300 is disposed on the end cap C1117 of the developing cartridge body, and the chip assembly C300 is movable relative to the developing cartridge body in the left-right direction.
[0219] The chip holder C31 includes a chip mounting part C313, a first engaging part C3141 and a second engaging part C3142. The chip C32 is mounted on the chip mounting part C313, and the first engaging part C3141 and the second engaging part C3142 are used to engage with the end cover C1117.
[0220] Furthermore, the chip holder C31 also includes a first fixing part C3131, a second fixing part C3132, a third fixing part C3135, and a locking part C3133 disposed in the chip mounting part C313. In the front-back direction, the first fixing part C3131 and the second fixing part C3132 are disposed opposite to each other, and the first fixing part C3131 and the second fixing part C3132 are used to prevent the chip C32 from moving in the front-back direction. In the left-right direction, the third fixing part C3135 and the locking part C3133 are disposed opposite to each other, and the third fixing part C3135 is used to prevent the chip C32 from moving to the left. In addition, the locking part C3133 is also used to lock the chip C32 to prevent the chip C32 from moving to the right.
[0221] Furthermore, an elastic element C1118 is provided between the housing / first cartridge C111 and the chip holder C31. When the developing roller C15 and the photosensitive drum C14 change from being close to each other to being separated from each other, the developing cartridge body moves to the left. That is, the chip holder C31 moves to the right relative to the developing cartridge body, but the chip holder C31 does not move relative to the imaging device, thereby ensuring the stability of the electrical connection between the contact pin 403 and the electrical contact part C321 of the chip C32. The elastic element C1118 undergoes elastic deformation. When the developing roller C15 and the photosensitive drum C14 change from being separated from each other to being close to each other, the developing cartridge body moves to the right and resets under the elastic force of the elastic element C1118.
[0222] Furthermore, the bottom surface C31b of the chip holder C31 is also provided with ribs C3143. The ribs C3143 are used to reduce the contact area between the bottom surface C31b of the chip holder C31 and the end cap C1117, thereby making the chip holder C31 move more smoothly in the left and right directions relative to the developing cartridge body.
[0223] Furthermore, when the imaging device's door is closed, the protrusion 402 on the door approaches the contact surface C1117d of the end cover C1117. In this embodiment, the contact surface C1117d is set as an inclined surface that is not parallel to the plane q1 where the electrical contact C321 is located. The inclined direction of the inclined surface C1117d is along the direction from front to back. The distance between the inclined surface C1117d and the rotation axis L of the developing roller C15 gradually decreases in the vertical direction. Preferably, when the imaging device's door is closed, the protrusion 402 does not contact the contact surface C1117d. More specifically, along the direction perpendicular to the plane q1 where the electrical contact C321 is located... In the direction d1, the distance s1 between the protrusion 402 (specifically, the point P3 of the protrusion 402 closest to the inclined surface C1117d) and the inclined surface C1117d is no greater than 5mm. Preferably, along the direction d1 perpendicular to the plane q1 where the electrical contact C321 is located, the distance s1 between the protrusion 402 and the inclined surface C1117d is no greater than 1mm. This ensures that when the developing cartridge body receives the driving force, the developing cartridge body has sufficient room for movement without affecting the printing / developing quality of the imaging device. In addition, it can limit the amount of movement of the chip holder C31 in the front-back direction, thereby ensuring that the electrical contact C321 of the chip C32 does not detach from the contact pin 403.
[0224] In some embodiments, the contact surface C1117d can also be configured as a non-inclined surface parallel to the plane q1 where the electrical contact portion C321 is located.
[0225] In some implementations, when the imaging device's door is closed, the protrusion 402 directly contacts the contact surface C1117d.
[0226] Furthermore, a separation member C13 is provided at the non-driving end of the developing cartridge body. The separation member C13 includes a force receiving member C131 and a first force applying part C1321. The force receiving member C131 includes a force receiving part C1311, which is used to abut against a force applying member (not shown) within the imaging device. The first force applying part C1321 is used to abut against a first abutting part C1211 provided on the drum cartridge C12. Specifically, the right pressing surface C1327R is an inclined surface provided on the first force applying part C1321, with its inclination direction from left to right. The distance between the right pressing surface C1327R and the rotation axis X of the photosensitive drum C14 gradually decreases in the front-to-back direction from left to right. In the direction, the distance between the right extrusion surface C1327R and the rotation axis L of the developing roller C15 gradually decreases in the front-to-back direction; the first abutment part C1211 is provided with a straight surface C1211a. When the force-applying component in the imaging device abuts against the force receiving part C1311 to perform the separation operation of the developing roller C15 and the photosensitive drum C14, the first force-applying part C1321 obtains a rearward component force and a leftward component force. The leftward component force causes the developing cartridge body to move to the left. The first force-applying part C1321 and the first abutment part C1211 begin to contact, and the right extrusion surface C1327R abuts against the straight surface C1211a, thereby causing the developing cartridge body to move backward, thereby realizing the separation of the developing roller C15 and the photosensitive drum C14 at the non-drive end.
[0227] Furthermore, the driving end of the developing cartridge body is provided with a second force-applying part C1326. Specifically, the second force-applying part C1326 is provided on the end cover C1117. The second force-applying part C1326 is used to abut against the second abutting part C1212 provided on the drum box C12. When the developing roller C15 and the photosensitive drum C14 are not separated, the second force-applying part C1326 and the second abutting part C1212 do not contact each other. Specifically, the left extrusion surface C1327L is provided on the second force-applying part C1326. The inclined surface on the upper part is inclined in the direction from left to right. The distance between the left extrusion surface C1327L and the rotation axis L of the developing roller C15 gradually increases in the front-to-back direction. When the developing roller C15 separates from the photosensitive drum C14, the developing cartridge body moves to the left, so that the left extrusion surface C1327L abuts against the straight surface C1211a of the second abutment part C1212, thereby causing the developing cartridge body to move backward, and thus realizing the separation of the developing roller C15 and the photosensitive drum C14 at the drive end.
[0228] Furthermore, the developing cartridge body is provided with a left positioning part C1116L and a right positioning part C1116R at the driving end and the non-driving end, respectively. The left positioning part C1116L and the right positioning part C1116R are used to realize the installation and positioning of the developing cartridge body. Specifically, during the installation of the developing cartridge body toward the drum box C12, the left positioning part C1116L and the right positioning part C1116R abut against the drum box C12 respectively. By continuing to press the developing cartridge body toward the drum box C12, the developing cartridge body can be successfully installed in place.
[0229] Furthermore, the chip C32 / chip assembly C300 is configured to move in the left and right directions relative to the developing cartridge body. When the developing cartridge body moves in the left and right directions, the chip C32 / chip assembly C300 does not move relative to the imaging device. This ensures the stability of the electrical connection between the chip C32 and the contact pin 403.
[0230] [Example Thirteen]
[0231] In this embodiment, the structure of the chip component C300 is similar to that of the chip component C300 in Embodiment Eleven. The chip component C300 is installed in the imaging device PM independently of the developing cartridge body (all components of the developing cartridge C11 except for the chip component C300).
[0232] like Figure 39 , Figure 40 , Figure 41A , Figure 41B , Figure 42A , Figure 42B As shown, the end cap C1117 on the drive end is provided with a first mating part C1117a and a second mating part C1117e. When the developing cartridge body and the drum cartridge C12 are installed on the imaging device PM, the chip assembly C300 is installed towards the imaging device PM. After the chip assembly C300 is installed in place, neither the first mating part C1117a nor the second mating part C1117e contacts the chip assembly C300. During the process of disassembling the developing cartridge body from the imaging device PM, the first mating part C1117a and the second mating part C1117e contact the chip assembly C300 and bring the chip assembly C300 out of the imaging device PM. Specifically, during the disassembly of the developing cartridge body, the first mating part C1117a contacts the receiving part C3111 of the chip holder C31, and the second mating part C1117e is used to prevent the chip assembly C300 from falling off during the process of being brought out, so as to limit the chip assembly C300.
[0233] In some embodiments, after the developing cartridge body and the drum cartridge C12 are installed into the imaging device PM, the chip assembly C300 is installed toward the imaging device PM. After the chip assembly C300 is installed in place, the first mating part C1117a and the second mating part C1117e can both be configured to contact the chip assembly C300.
[0234] In some embodiments, the first mating member C1117a and the second mating member C1117e may also be located at other positions on the drive end, such as the housing / first box C111.
[0235] Furthermore, the chip assembly C300 can not only engage with the locking part 4015 (such as the locking part 4015) provided in the imaging device PM via the locking part C3121, but also... Figure 32C (As shown) Positioning is achieved through engagement, or through interaction with the structure set in the drum housing C12. Specifically, a third mating part C1213 is provided on the drum frame / second housing C121. When the chip assembly C300 is installed in place, the third mating part C1213 engages with the chip assembly C300 to position the chip assembly C300. In addition, during the disassembly of the developing cartridge body, the third mating part C1213 is accommodated by the hollow part C3122 of the chip holder C31. The third mating part C1213 contacts the chip holder C31 / chip assembly C300 to limit the chip assembly and prevent it from falling off during the removal process.
[0236] Furthermore, on the side where the first marking portion C3113 of the chip assembly C300 is located, the part that abuts against the door cover 412 is set as a flat surface C3114. When the chip assembly C300 is not installed in place, during the process of the user closing the door cover 412 of the imaging device PM, the door cover 412 will also push the flat surface C3114 to install the chip assembly C300 in place. Specifically, during the closing process of the door cover 412, the top of the door cover 4122 and the bent portion of the door cover 412 are used to abut against the flat surface C3114. In actual use, such as Figure 39 As shown, the imaging device PM contains multiple developer cartridge bodies, each containing a different color of developer. Therefore, during the closing of the door cover 412, the top 4122 and the bent portion 4123 of the door cover abut against the plane C3114 of the multiple chip assemblies C300, so that the multiple chip assemblies C300 are installed in place; specifically, as... Figure 39As shown, along the direction from end A to end B of the imaging device PM, the first chip assembly (chip assembly of the yellow developing cartridge) C300-1 and the second chip assembly (chip assembly of the red developing cartridge) C300-2 are pushed by the top of the door cover 4122, and the third chip assembly (chip assembly of the blue developing cartridge) C300-3 and the fourth chip assembly (chip assembly of the black developing cartridge) C300-4 are pushed by the bending part of the door cover 4123.
[0237] Furthermore, in this embodiment, the separation component on the driving end of the developing cartridge body is removed, and the separation component C13 is only provided on the non-driving end. Specifically, the separation component C1313 can be provided on the end cap C1117, or on the housing / first cartridge C111, or on the bracket C1113 on the non-driving end.
[0238] In some embodiments, the separation member on the non-drive end of the developing cartridge body is omitted, and the separation member C13 is only provided on the drive end.
[0239] like Figure 42BAs shown, when viewed in the left-right direction, the driving force receiver / driving head C18 is located within the projection range of the driving force transmission part C51. The projected outline of the driving force transmission part C51 is the outermost part of the combination of the driving force receiver / driving head C18 and the driving force transmission part C51. In this embodiment, when viewed in the left-right direction, the separating member C1313 is located within the projection range of the driving force transmission part C51. A powder dispensing blade 153 is provided in the developing cartridge C11. The powder dispensing blade 153 includes a blade (not shown) and a mechanism for... A blade holder 1531 supports the blade and is fixedly mounted on the housing / first box C111. The blade is used to contact the developing roller C15. Specifically, the blade holder 1531 includes a first part 1531a and a second part 1531b. The blade is connected to the first part 1531a. A bent portion 1531c is formed between the first part 1531a and the second part 1531b. When viewed in the left-right direction, the bent portion 1531c is located outside the projection range of the driving force transmission part C51. In addition, the imaging device PM is equipped with a power output component C143 for contacting the power receiver C125 and supplying power to the power receiver C125. During the installation of the developing cartridge C11 into the imaging device PM, the power output component C143 is subjected to external force and rotates around the rotation point C143a in the direction shown by r3. After the developing cartridge C11 is installed in place, the power receiver C125, which is set on the bracket C1113, receives the power supplied by the imaging device PM. When viewed in the left and right direction, the contact point P4 when the power receiver C125 and the power output component C143 are electrically connected is located outside the projection range of the driving force transmission part C51. In this way, the contact point P4 is close to the rotation point C143a, which can maintain the stability of the electrical connection between the power receiver C125 and the power output component C143 and prevent the power receiver C125 and the power output component C143 from losing electrical connection. This ensures the stability of the power supply from the imaging device PM to the developing cartridge C11, and thus ensures the stability of the operation of the developing cartridge C11 and the imaging / developing / printing quality. In some embodiments, the power output component C143 may also contact the end face of the power receiver C125 in the left-right direction.
[0240] [Example Fourteen]
[0241] In this embodiment, the chip assembly C300 is detachably installed into the imaging device PM, independent of the developing cartridge body (all components of the developing cartridge C11 except for the chip assembly C300).
[0242] like Figure 43 , Figure 44A , Figure 44B , Figure 45 and Figure 46As shown, the chip assembly mounting section 401 in the imaging device PM has a device side wall 401a, a device upper wall 401b, and a device lower wall 401c. Furthermore, in the left-right direction, the device side wall 401a is located to the left of the developing cartridge C11, the device upper wall 401b and the device lower wall 401c are arranged opposite to each other, and the stylus 403 is disposed on the device upper wall 401b.
[0243] Furthermore, the chip rack C31 includes a first component C311 and a second component C312 connected to each other. The chip assembly C300 also includes a chip mounting portion C313 disposed in the first component C311. The chip mounting portion C313 is used to mount the chip C32, and the chip mounting portion C313 is movable relative to the first component C311. Specifically, the chip mounting portion C313 is provided with a hook portion C3136, which interacts with the guide groove C3115 provided in the first component C311 to limit the range of motion of the chip mounting portion C313 and prevent the chip mounting portion C313 from detaching from the first component C311. An elastic member C3137 is disposed between the chip mounting portion C313 and the first component C311. One end of the elastic member C3137 is connected to the chip mounting portion C313, and the other end of the elastic member C3137 is connected to the first component C311. During the installation of the chip assembly C300 from back to front, the chip mounting part C313 abuts against the lowest point 401b1 of the upper wall 401b of the device, causing the elastic member C3137 to undergo elastic deformation. The chip mounting part C313 moves towards the first component C311. As the chip assembly C300 is further installed forward, the chip mounting part C313 passes the lowest point 401b1 of the upper wall 401b of the device. Under the elastic force of the elastic member C3137, the chip mounting part C313 moves away from the first component C311, thereby making the electrical contact part C321 of the chip C32 electrically connected to the contact pin 403.
[0244] Furthermore, the second component C312 is provided with an engaging portion C3121, which engages with a engaged portion 4015 disposed on the lower wall 401c of the device to position the chip assembly C300. Specifically, the engaging portion C3121 has an engaging surface C3121a, a first stepped surface C3121b, and a second stepped surface C3121c. The engaging surface C3121a abuts against the engaged surface 4015a of the engaged portion 4015. In the left-right direction, the first stepped surface C3121b is closer to the developing cartridge body than the second stepped surface C3121c. The first stepped surface C3121b and the second stepped surface C3121c are connected by the engaging surface C3121a. The chip assembly C300 is installed forward onto the imaging device PM. When the chip assembly C300 is installed in place, the engaging surface C3121a abuts against the engaging surface 4015, thereby positioning the chip assembly C300.
[0245] Furthermore, during the process of removing the developing cartridge body from the imaging device PM, the chip assembly C300 can be taken out along with it. Specifically, the chip assembly C300 comes into contact with the third mating part C1213 set in the drum frame / second cartridge C121, and is thus taken out.
[0246] Furthermore, when the chip assembly C300 is not installed in place, during the process of the user closing the door cover 412 of the imaging device PM, the protrusion 4121 provided on the door cover 412 contacts the contact portion C3123a of the chip holder C31 / second component C312. As the door cover 412 is gradually closed, the chip assembly C300 is gradually pushed by the door cover 412 and installed in place.
Claims
1. A developing cartridge assembly, detachably mounted to an electrophotographic imaging device having a housing, said housing comprising a stylus, a receiving cavity, and a front side plate and a rear side plate spaced apart in a front-rear direction, said receiving cavity being located between the front side plate and the rear side plate, said stylus being disposed on the same side as the front side plate, said rear side plate having a rear surface facing the front side plate, characterized in that, The developing cartridge assembly includes: A housing for containing developer, the housing comprising a cartridge body and an end cap fixedly connected to the cartridge body; A developing roller, used to carry the developing agent, is rotatably disposed in the cartridge about a rotation axis parallel to the left and right directions; A driving force receiver is used to receive driving force from an imaging device and directly or indirectly transmit the driving force to the developing roller. In the left-right direction, the end where the driving force receiver and the end cap are located is the driving end, and at least a portion of the driving force receiver is exposed from the end cap. A chip assembly is mounted downwards into the receiving cavity along a vertical direction. The chip assembly is located at the driving end and includes: The chip includes an electrical contact portion that forms an electrical connection with a stylus; and A chip holder that supports a chip and has a rearward-facing end face; When the developing cartridge assembly is installed in the imaging device, the end face faces the rear surface in the front-back direction, and there is a gap between the end face and the rear surface. The front-back direction, the left-right direction, and the up-down direction are perpendicular to each other.
2. The developing cartridge assembly according to claim 1, characterized in that, The chip assembly is fixedly mounted on at least one of the housing and the end cap.
3. The developing cartridge assembly according to claim 1, characterized in that, The chip also includes a substrate and a storage unit electrically connected to an electrical contact portion. The electrical contact portion and the storage unit are respectively disposed on opposite sides of the substrate, and the electrical contact portion, the substrate, and the storage unit are integrally formed.
4. The developing cartridge assembly according to claim 1, characterized in that, The chip assembly also includes an adapter, through which the chip holder is connected to the housing.
5. The developing cartridge assembly according to claim 3, characterized in that, The chip assembly is also provided with an elastic element, which is disposed on the side of the substrate away from the electrical contact portion.
6. The developing cartridge assembly according to claim 5, characterized in that, The elastic element is made of sponge.
7. The developing cartridge assembly according to claim 1, characterized in that, The developing cartridge assembly is detachably connected to the drum housing which is provided with a photosensitive drum and a second abutment. The driving end of the developing cartridge assembly is provided with a second force-applying part, which abuts against the second abutment to separate the developing roller from the photosensitive drum. When the developing roller and the photosensitive drum are separated, there is a gap between the end face and the rear surface.
8. The developing cartridge assembly according to claim 1, characterized in that, The developing cartridge assembly includes a driving force transmission section coaxially arranged with the driving force receiver, a blade, and a blade holder supporting the blade. The blade holder includes a first part, a second part, and a bent part formed between the first part and the second part. When viewed in the left-right direction, the bent part is located outside the projection range of the driving force transmission section.
9. The developing cartridge assembly according to claim 8, characterized in that, The developing chamber is equipped with a power receiver, and the imaging device is equipped with a power output device for contacting the power receiver. When viewed from the left and right, the contact point between the power receiver and the power output device when electrically connected is located outside the projection range of the driving force transmission part.
10. The developing cartridge assembly according to any one of claims 1-9, characterized in that, The gap is 0.5mm-4mm.