host box

Abstract

The utility model relates to the technical field of cabinet heat dissipation provides a mainframe box, include: box, circuit board, first fan and second fan, the box has first air duct and second air duct, and the circuit board sets up in the box, to with first air duct and second air duct each other is isolated, the positive and negative of circuit board all are equipped with heat source, and the heat source of circuit board positive is placed in first air duct, and the heat source of circuit board negative is placed in second air duct, first fan is placed in first air duct to drive the airflow along first air duct flows and is cooled to the heat source of circuit board positive, and second fan is placed in second air duct to drive the airflow along second air duct flows and is cooled to the heat source of circuit board negative, the mainframe box of the utility model, on the heat dissipation design will the heat source layout on the circuit board and the air duct design in the box blend, both ensured better heat dissipation effect, and realized the compactness of whole mainframe box internal structure layout.

Description

Technical Field

[0001] This utility model relates to the field of cabinet heat dissipation technology, and in particular to a main unit chassis. Background Technology

[0002] Currently, for some low-power consumer electronics products, a simple heat dissipation layout using heat spreaders and / or fans is sufficient to meet their cooling needs. However, for some high-power devices, such as computer cases, the circuit boards of the case typically integrate multiple heat sources, and existing heat dissipation designs struggle to ensure effective heat dissipation of the circuit boards while also maintaining a compact layout of the heat dissipation structure within the computer case. Utility Model Content

[0003] This utility model provides a host chassis that at least solves or improves the problem that current host chassis circuit board heat dissipation designs struggle to balance heat dissipation performance and compact space layout.

[0004] This utility model provides a main unit chassis, comprising: The enclosure has a first air duct and a second air duct; A circuit board is disposed inside the housing to isolate the first air duct and the second air duct from each other; a heat source is provided on both the front and back of the circuit board, with the heat source on the front of the circuit board placed in the first air duct and the heat source on the back of the circuit board placed in the second air duct. A first fan and a second fan, wherein the first fan is placed in the first air duct to drive the airflow flowing along the first air duct to dissipate heat from the heat source on the front side of the circuit board, and the second fan is placed in the second air duct to drive the airflow flowing along the second air duct to dissipate heat from the heat source on the back side of the circuit board.

[0005] According to the main unit chassis provided by this utility model, it further includes: A heat sink is connected to the heat source and is disposed in at least one of the first air duct and the second air duct.

[0006] According to the present invention, a host chassis includes a heat sink comprising: A heat dissipation base plate, which is connected to the heat source; Multiple heat dissipation fins are arranged side by side on the heat dissipation base plate, and a flow guide channel is formed between two adjacent heat dissipation fins. The flow guide channel is arranged along the extension direction of the first air duct or the second air duct.

[0007] According to the present invention, the heating power of the heat source on the front side of the circuit board is less than the heating power of the heat source on the back side of the circuit board. Wherein, the power of the first fan is less than the power of the second fan, and / or, the ventilation cross-sectional area of ​​the first duct is less than the ventilation cross-sectional area of ​​the second duct.

[0008] According to the present invention, a main unit chassis is provided, wherein the circuit board is spaced out into a first cavity and a second cavity within the chassis. The housing is provided with a first air inlet and a first air outlet. The first air inlet, the first cavity and the first air outlet are sequentially connected in fluid communication to form the first air duct. The housing is also provided with a second air inlet and a second air outlet. The second air inlet, the second cavity and the second air outlet are sequentially connected in fluid communication to form the second air duct.

[0009] According to the present invention, in a main unit chassis, along the height direction of the chassis, the first cavity is located on the upper side of the circuit board, and the second cavity is located on the lower side of the circuit board.

[0010] According to the present invention, a main unit chassis has a top wall, and a first air inlet and a first air outlet are spaced apart on the top wall of the chassis.

[0011] According to the present invention, a main unit chassis is provided, wherein there are two first air inlets and the first air outlet is disposed between the two first air inlets; The first fan is an axial flow fan, which is placed inside the first cavity and is positioned opposite to the first air outlet.

[0012] According to the present invention, a main unit chassis is provided with two second air inlets, a second air outlet and one of the second air inlets are both provided on the side wall of the chassis, and the other second air inlet is provided on the bottom wall of the chassis. The second fan is a centrifugal fan, which is placed inside the second cavity and is positioned opposite to the second air outlet.

[0013] According to the present invention, at least a portion of the side wall of the chassis is provided with a concave corner structure, the concave corner structure extending circumferentially along the chassis and disposed near the bottom wall of the chassis; The enclosure has a first sidewall and a second sidewall that are opposite to each other. A second air inlet is provided at the inside corner of the first sidewall, and a second air outlet is provided at the inside corner of the second sidewall.

[0014] The present invention provides a host chassis, comprising a chassis body, a circuit board, a first fan, and a second fan. By distributing the heat sources on both sides of the circuit board, and based on the first and second air ducts spaced apart within the chassis, the heat sources on the front of the circuit board are placed in the first air duct, and the heat sources on the back of the circuit board are placed in the second air duct. Furthermore, based on the first fan installed in the first air duct and the second fan installed in the second air duct, airflow can be used to perform air convection cooling on the heat sources on both sides of the circuit board. This heat dissipation design integrates the heat source layout on the circuit board with the air duct design within the chassis, ensuring both good heat dissipation effect and compact internal structural layout of the entire host chassis. It solves the problem that existing heat dissipation designs for host chassis circuit boards are difficult to balance heat dissipation effect and compact spatial layout. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional structural diagram of the main unit chassis provided by this utility model.

[0017] Figure 2 This is a top view of the main unit chassis provided by this utility model.

[0018] Figure 3 This is a bottom view of the main unit chassis provided by this utility model.

[0019] Figure 4 This is a schematic diagram of the circuit board provided by this utility model, with its front facing the first cavity inside the housing.

[0020] Figure 5 This is a schematic diagram of the structure of the circuit board provided by this utility model, with the back side facing the second cavity inside the box.

[0021] Figure 6 This is a schematic diagram of the structure provided by this utility model, in which a first fan and a heat sink are installed in the first air duct of the main unit chassis.

[0022] Figure 7 This is a schematic diagram of the structure provided by this utility model, in which a second fan and heat sink are installed in the second air duct of the main unit chassis.

[0023] Figure label: 1. Housing; 101. Internal corner structure; 11. First air duct; 111. First air inlet; 112. First air outlet; 113. First cavity; 12. Second air duct; 121. Second air inlet; 122. Second air outlet; 123. Second cavity; 2. Circuit board; 201. Heat source; 3. First fan; 4. Second fan; 5. Heat sink; 51. Heat sink base plate; 52. Heat sink fins. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0025] The following is combined Figures 1-7 The main unit chassis provided in this utility model embodiment will be described in detail through specific embodiments and application scenarios.

[0026] like Figure 1 , Figure 4 and Figure 5 As shown, this utility model provides a main unit chassis, including: chassis 1, circuit board 2, first fan 3 and second fan 4; The housing 1 has a first air duct 11 and a second air duct 12. The circuit board 2 is disposed inside the housing 1 to isolate the first air duct 11 and the second air duct 12 from each other. The circuit board 2 has a heat source 201 on both the front and back. The heat source 201 on the front of the circuit board 2 is placed in the first air duct 11, and the heat source 201 on the back of the circuit board 2 is placed in the second air duct 12. The first fan 3 is placed in the first air duct 11 to drive the airflow flowing along the first air duct 11 to dissipate heat from the heat source 201 on the front side of the circuit board 2. The second fan 4 is placed in the second air duct 12 to drive the airflow flowing along the second air duct 12 to dissipate heat from the heat source 201 on the back side of the circuit board 2.

[0027] It is understandable that the circuit board 2 is usually a printed circuit board (PCB). Multiple heat sources 201 are usually set on the circuit board 2. By setting some heat sources 201 on the front of the circuit board 2 and setting other heat sources 201 on the back of the circuit board 2, the multiple heat sources 201 can be distributed in a dispersed manner, which avoids the situation of concentrated heat distribution and facilitates the heat dissipation design of each heat source 201.

[0028] The heat source 201 on the front of the circuit board 2 includes core chip modules such as the central processing unit (CPU), while the heat source 201 on the back of the circuit board 2 includes computing cards, memory, and other modules.

[0029] When the circuit board 2 is placed inside the housing 1, the circuit board 2 serves as a shared wall surface as part of the first air duct 11 and the second air duct 12. This allows the first air duct 11 and the second air duct 12 to be isolated based on the circuit board 2, while also placing the heat source 201 on the front of the circuit board 2 in the first air duct 11 and the heat source 201 on the back of the circuit board 2 in the second air duct 12. This design not only reduces the space layout and optimizes the design structure of the first air duct 11 and the second air duct 12, but also allows the heat source 201 on the front of the circuit board 2 to be cooled by the airflow flowing in the first air duct 11 and the heat source 201 on the back of the circuit board 2 to be cooled by the airflow flowing in the second air duct 12.

[0030] Depending on the different distributions of the circuit board 2 within the housing 1, the first air duct 11 and the second air duct 12 can be arranged vertically opposite each other along the height direction of the housing 1, or they can be arranged horizontally opposite each other along the length or width direction of the housing 1. No specific limitation is made in this regard.

[0031] The main unit chassis shown in this utility model includes a chassis 1, a circuit board 2, a first fan 3, and a second fan 4. By distributing the heat sources 201 on the front and back sides of the circuit board 2, and based on the first air duct 11 and the second air duct 12 spaced out in the chassis 1, the heat source 201 on the front side of the circuit board 2 is placed in the first air duct 11, and the heat source 201 on the back side of the circuit board 2 is placed in the second air duct 12. Based on the first fan 3 set in the first air duct 11 and the second fan 4 set in the second air duct 12, the heat source 201 on the front and back sides of the circuit board 2 can be cooled by air convection using the airflow. This heat dissipation design integrates the heat source layout on the circuit board 2 with the air duct design in the chassis 1, ensuring both good heat dissipation effect and compact internal structure of the entire main unit chassis. It solves the problem that existing heat dissipation designs for the circuit board 2 of main unit chassis are difficult to balance heat dissipation effect and compact space layout.

[0032] In some embodiments, such as Figure 1 , Figure 6 and Figure 7 As shown, the main unit also includes a heat sink 5, which is connected to the heat source 201 and is disposed in at least one of the first air duct 11 and the second air duct 12.

[0033] It is understandable that the heat sink 5 can be made of a material with a high thermal conductivity, such as a copper component, an aluminum component, or an aluminum alloy component.

[0034] When the heat sink 5 is installed, the heat sink 5 can be in contact with the surface of the heat source 201, or the heat sink 5 can be connected to the heat source 201 through thermally conductive adhesive, so as to realize the connection between the heat sink 5 and the heat source 201. This design is beneficial to utilize the good thermal conductivity and heat dissipation characteristics of the heat sink 5, increase the heat dissipation area of ​​the heat source 201, and achieve the purpose of accelerating the heat dissipation of the heat source 201.

[0035] Since the heat sink 5 is placed in the air duct (e.g., the first air duct 11 or the second air duct 12), while the heat source 201 is cooled by increasing the heat dissipation area based on the heat sink 5, the airflow in the air duct is also used to perform air convection cooling on the heat sink 5. The combination of these two cooling methods enhances the cooling effect on the heat source 201.

[0036] In practical applications, in terms of heat dissipation design, heat sink 5 can be set only in the first air duct 11 and configured to extend along the first air duct 11, while no heat sink 5 is set in the second air duct 12. Only the airflow in the second air duct 12 is used to dissipate heat from the heat source 201 on the back of the circuit board 2, thereby enhancing the heat dissipation effect on the heat source 201 on the front of the circuit board 2.

[0037] In terms of heat dissipation design, heat sink 5 can be set only in the second air duct 12 and configured to be set along the extension direction of the second air duct 12, while no heat sink 5 is set in the first air duct 11. Only the airflow in the first air duct 11 is used to dissipate heat from the heat source 201 on the front side of the circuit board 2, thereby enhancing the heat dissipation effect on the heat source 201 on the back side of the circuit board 2.

[0038] In terms of heat dissipation design, heat dissipation components 5 can be provided in both the first air duct 11 and the second air duct 12. The heat dissipation components 5 in the first air duct 11 are arranged along the extension direction of the first air duct 11, and the heat dissipation components 5 in the second air duct 12 are arranged along the extension direction of the second air duct 12, so as to ensure that the heat source 201 on both sides of the circuit board 2 achieves the best heat dissipation effect.

[0039] In some embodiments, such as Figure 1 As shown, the heat sink 5 includes: a heat sink base plate 51 and multiple heat sink fins 52; the heat sink base plate 51 is connected to the heat source 201, and the multiple heat sink fins 52 are arranged side by side on the heat sink base plate 51, and a flow channel is formed between two adjacent heat sink fins 52, and the flow channel is arranged along the extension direction of the first air duct 11 or the second air duct 12.

[0040] It is understandable that in practical applications, heat sink 5 with heat sink base plate 51 and multiple heat sink fins 52 can be prepared by casting or milling processes. For example, heat sink 5 is an aluminum casting.

[0041] By setting the heat sink 5, which includes a heat sink base plate 51 and multiple heat sink fins 52, the heat source 201 can be conducted to each heat sink fin 52 through the heat sink base plate 51, so that heat can be dissipated based on each heat sink fin 52. This heat dissipation design greatly increases the heat dissipation area of ​​the heat source 201 and ensures the heat dissipation effect of the heat source 201.

[0042] Meanwhile, since a flow channel is formed between any two adjacent heat dissipation fins 52, and the flow channel is set along the extension direction of the air duct (first air duct 11 or second air duct 12), this design ensures that the setting of the heat dissipation component 5 will not affect the flow of air in the air duct. Instead, it will guide the airflow to flow in the flow channel between two adjacent heat dissipation fins 52. When the airflow in the air duct flows through the heat dissipation component 5, it can ensure the contact area and contact time between the heat dissipation component 5 and the airflow in the air duct, thereby achieving a better convective heat dissipation effect.

[0043] In some embodiments, the heating power of the heat source 201 on the front side of the circuit board 2 is less than the heating power of the heat source 201 on the back side of the circuit board 2; wherein, the power of the first fan 3 is less than the power of the second fan 4, and / or, the ventilation cross-sectional area of ​​the first air duct 11 is less than the ventilation cross-sectional area of ​​the second air duct 12.

[0044] It is understandable that the heating power of the heat source 201 on the front of the circuit board 2 is less than that of the heat source 201 on the back of the circuit board 2. Therefore, the amount of heat accumulated by the heat source 201 on the front of the circuit board 2 per unit time is less than that accumulated by the heat source 201 on the back of the circuit board 2.

[0045] In practical applications, the power of the first fan 3 can be matched with the heat source 201 on the front of the circuit board 2, and the power of the second fan 4 can be matched with the heat source 201 on the back of the circuit board 2, so as to achieve targeted ventilation and heat dissipation of the heat source 201 on both sides of the circuit board 2.

[0046] Meanwhile, inside the housing 1, the first air duct 11 and the second air duct 12 are arranged side by side and extend in the same direction. For example, the first air duct 11 and the second air duct 12 both extend along the length direction of the housing 1, and the widths of the first air duct 11 and the second air duct 12 extending along the width direction of the housing 1 are the same. By setting the height of the first air duct 11 extending along the height direction of the housing 1 to be less than the height of the second air duct 12 extending along the height direction of the housing 1, the ventilation cross-sectional area of ​​the first air duct 11 can be smaller than the ventilation cross-sectional area of ​​the second air duct 12. This design can match the ventilation cross-sectional area of ​​the air duct (first air duct 11 or second air duct 12) with the power of the corresponding fan (first fan 3 or second fan 4) in the air duct, which is beneficial to reduce wind resistance while ensuring the ventilation volume in the air duct.

[0047] Based on the above design, by setting the power of the first fan 3 to be less than the power of the second fan 4, and / or setting the ventilation cross-sectional area of ​​the first air duct 11 to be less than the ventilation cross-sectional area of ​​the second air duct 12, it can be ensured in practical applications that the airflow rate in the second air duct 12 is greater than the airflow rate in the first air duct 11. This makes the air convection cooling effect on the heat source 201 on the back of the circuit board 2 stronger than the air convection cooling effect on the heat source 201 on the front of the circuit board 2. This achieves a match between the heat dissipation capacity of the first air duct 11 and the heat generation of the heat source, thus adapting to the uneven heat dissipation requirements on the front and back of the circuit board 2.

[0048] Based on the solutions described in the above embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the circuit board 2 is divided into a first cavity 113 and a second cavity 123 within the housing 1; The housing 1 is provided with a first air inlet 111 and a first air outlet 112. The first air inlet 111, the first cavity 113 and the first air outlet 112 are sequentially connected in fluid to form a first air duct 11. The housing 1 is also provided with a second air inlet 121 and a second air outlet 122. The second air inlet 121, the second cavity 123 and the second air outlet 122 are sequentially connected to form a second air duct 12.

[0049] In practical applications, both the first air inlet 111 and the second air inlet 121 can be set as a grille, and a filter screen can be set at the first air inlet 111 and the second air inlet 121. This design can not only evenly disperse the airflow entering the box 1, but also prevent large particles of foreign matter from entering the box 1 through the first air inlet 111 and the second air inlet 121.

[0050] Correspondingly, the first air outlet 112 and the second air outlet 122 can also be designed as a grille to prevent large particles of foreign matter from entering the housing 1 through the first air outlet 112 and the second air outlet 122.

[0051] In some embodiments, such as Figure 1 As shown, along the height direction of the housing 1, the first cavity 113 is located on the upper side of the circuit board 2, and the second cavity 123 is located on the lower side of the circuit board 2.

[0052] It is understandable that the circuit board 2 can be configured to be horizontally arranged inside the housing 1, that is, the circuit board 2 is perpendicular to the height direction of the housing 1, so as to realize the formation of a first cavity 113 and a second cavity 123 that are arranged vertically opposite to each other inside the housing 1 based on the circuit board 2.

[0053] In addition to forming an air duct structure, the first cavity 113 and the second cavity 123 can also house components other than the circuit board 2, as long as they do not affect the smooth flow of air in the air duct (first air duct 11 or second air duct 12).

[0054] In some embodiments, such as Figure 1 and Figure 2 As shown, the housing 1 has a top wall, and a first air inlet 111 and a first air outlet 112 are spaced apart on the top wall of the housing 1.

[0055] It is understandable that by setting the first air inlet 111 and the first air outlet 112 alternately on the top wall of the housing 1, the cold air located on the upper side of the housing 1, driven by the first fan 3 in the first air duct 11, enters the first cavity 113 from the first air inlet 111 in a direction perpendicular to the top wall of the housing 1, and then flows along the extension direction of the first cavity 113 (e.g., the length direction of the housing 1) across the front of the circuit board 2 to perform air convection heat dissipation on the heat source 201 set on the front of the circuit board 2. The airflow after air convection heat dissipation is discharged from the first air outlet 112.

[0056] like Figure 1 and Figure 6 As shown, when the heat sink 5 is installed in the first air duct 11, the heat sink base plate 51 of the heat sink 5 can be connected to the heat source 201 installed on the front of the circuit board 2, and each heat sink fin 52 of the heat sink 5 can be positioned towards the top wall of the housing 1.

[0057] In some embodiments, such as Figure 1 and Figure 2 As shown, in order to ensure the amount of cold air entering and enhance the heat dissipation effect on the heat source 201 located on the front of the circuit board 2, two first air inlets 111 can be provided, and the first air outlet 112 can be located between the two first air inlets 111; the first fan 3 is an axial fan, which is placed in the first cavity 113 and is positioned opposite to the first air outlet 112.

[0058] like Figure 1 and Figure 6 As shown, when a heat sink 5 is installed in the first air duct 11, one end of the heat sink base plate 51 of the heat sink 5 can be arranged opposite to one of the first air inlets 111, and the other end of the heat sink base plate 51 of the heat sink 5 can be arranged opposite to another first air inlet 111.

[0059] Meanwhile, the heat sink 5's heat sink fins 52 include a first heat sink section and a second heat sink section. The first heat sink section and the second heat sink section are spaced apart from each other to form a gap area between the first heat sink section and the second heat sink section. The air inlet of the axial fan faces the gap area between the first heat sink section and the second heat sink section, and the air outlet of the axial fan faces the first air outlet 112. This design arranges the heat sink 5 and the axial fan together compactly and does not affect the heat dissipation effect on the heat source 201 on the front of the circuit board 2.

[0060] In practical applications, the cold air introduced from one of the first air inlets 111 will flow through the various guide channels corresponding to the first heat dissipation section. The various guide channels corresponding to the first heat dissipation section will guide the heat-exchanged airflow to the interval area. The cold air introduced from the other first air inlet 111 will flow through the various guide channels corresponding to the second heat dissipation section. The various guide channels corresponding to the second heat dissipation section will guide the heat-exchanged airflow to the interval area. Both of these airflows are discharged from the housing 1 through the first air outlet 112 under the drive of the axial fan.

[0061] In some embodiments, such as Figure 1 and Figure 3 As shown, there are two second air inlets 121, and the second air outlet 122 and one of the second air inlets 121 are located on the side wall of the housing 1, while the other second air inlet 121 is located on the bottom wall of the housing 1; the second fan 4 is a centrifugal fan, which is placed inside the second cavity 123 and is positioned opposite to the second air outlet 122.

[0062] It is understandable that by setting the second fan 4 as a centrifugal fan, the large air volume of the centrifugal fan can be used to drive the airflow along the second air duct 12; wherein, the central axis of the centrifugal fan is set along the height direction of the housing 1, the centrifugal fan is set near the second air outlet 122, and the air outlet of the centrifugal fan is opposite to the second air outlet 122.

[0063] In practical applications, by setting two second air inlets 121, when the centrifugal fan in the second cavity 123 is started, the cold air located on the side of the box 1 enters the second cavity 123 through the second air inlet 121 located on the side of the box 1, and the cold air located on the bottom of the box 1 enters the second cavity 123 through the second air inlet 121 located at the bottom of the box 1. The two parts of cold air merge in the second cavity 123 and flow along the extension direction of the second cavity 123 (e.g., the length direction of the box 1) across the back of the circuit board 2 to perform air convection heat dissipation on the heat source 201 located on the back of the circuit board 2. The airflow after air convection heat dissipation is discharged from the second air outlet 122.

[0064] like Figure 7As shown, when a heat sink 5 is installed in the second air duct 12, one end of the heat sink base plate 51 of the heat sink 5 can be positioned opposite the second air inlet 121 located on the side wall of the housing 1, the other end of the heat sink base plate 51 of the heat sink 5 can be positioned opposite the centrifugal fan, and each heat sink fin 52 of the heat sink 5 can be positioned facing the bottom wall of the housing 1.

[0065] In some embodiments, to ensure the aesthetic appearance of the entire housing 1, such as Figure 1 As shown, at least part of the side wall of the box 1 is provided with a recessed corner structure 101. The recessed corner structure 101 is in the shape of a groove. The recessed corner structure 101 extends along the circumference of the box 1 and is located near the bottom wall of the box 1. The box 1 has a first side wall and a second side wall that are opposite to each other. A second air inlet 121 is provided at the recessed corner structure 101 of the first side wall, and a second air outlet 122 is provided at the recessed corner structure 101 of the second side wall.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A mainframe chassis, characterized in that, include: The enclosure has a first air duct and a second air duct; A circuit board is disposed inside the housing to isolate the first air duct and the second air duct from each other; a heat source is provided on both the front and back of the circuit board, with the heat source on the front of the circuit board placed in the first air duct and the heat source on the back of the circuit board placed in the second air duct. A first fan and a second fan, wherein the first fan is placed in the first air duct to drive the airflow flowing along the first air duct to dissipate heat from the heat source on the front side of the circuit board, and the second fan is placed in the second air duct to drive the airflow flowing along the second air duct to dissipate heat from the heat source on the back side of the circuit board.

2. The main unit chassis according to claim 1, characterized in that, Also includes: A heat sink is connected to the heat source and is disposed in at least one of the first air duct and the second air duct.

3. The main unit chassis according to claim 2, characterized in that, The heat sink includes: A heat dissipation base plate, which is connected to the heat source; Multiple heat dissipation fins are arranged side by side on the heat dissipation base plate, and a flow guide channel is formed between two adjacent heat dissipation fins. The flow guide channel is arranged along the extension direction of the first air duct or the second air duct.

4. The main unit chassis according to claim 1, characterized in that, The heating power of the heat source on the front side of the circuit board is less than the heating power of the heat source on the back side of the circuit board. Wherein, the power of the first fan is less than the power of the second fan, and / or, the ventilation cross-sectional area of ​​the first duct is less than the ventilation cross-sectional area of ​​the second duct.

5. The main unit chassis according to any one of claims 1 to 4, characterized in that, The circuit board is divided into a first cavity and a second cavity within the housing; The housing is provided with a first air inlet and a first air outlet. The first air inlet, the first cavity and the first air outlet are sequentially connected in fluid communication to form the first air duct. The housing is also provided with a second air inlet and a second air outlet. The second air inlet, the second cavity and the second air outlet are sequentially connected in fluid communication to form the second air duct.

6. The main unit chassis according to claim 5, characterized in that, Along the height direction of the housing, the first cavity is located on the upper side of the circuit board, and the second cavity is located on the lower side of the circuit board.

7. The main unit chassis according to claim 6, characterized in that, The enclosure has a top wall, and the first air inlet and the first air outlet are spaced apart on the top wall of the enclosure.

8. The main unit chassis according to claim 7, characterized in that, There are two first air inlets, and the first air outlet is located between the two first air inlets; The first fan is an axial flow fan, which is placed inside the first cavity and is positioned opposite to the first air outlet.

9. The main unit chassis according to claim 6, characterized in that, There are two second air inlets, and the second air outlet and one of the second air inlets are both located on the side wall of the housing, while the other second air inlet is located on the bottom wall of the housing. The second fan is a centrifugal fan, which is placed inside the second cavity and is positioned opposite to the second air outlet.

10. The main unit chassis according to claim 9, characterized in that, At least a portion of the sidewalls of the enclosure are provided with an inside corner structure, the inside corner structure extending circumferentially along the enclosure and located near the bottom wall of the enclosure; The enclosure has a first sidewall and a second sidewall that are opposite to each other. A second air inlet is provided at the inside corner of the first sidewall, and a second air outlet is provided at the inside corner of the second sidewall.

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