High heat dissipation computer mainboard gasket

Abstract

The utility model discloses a high heat dissipation computer mainboard gasket, include: a plurality of unequal size heat conduction silica gel, copper foil conductive double -sided adhesive, copper foil, single -sided tape, heat conduction silica gel, copper foil conductive double -sided adhesive, copper foil, single -sided tape are arranged from top to bottom in proper order. The utility model is used for the heat dissipation, buffering and conducting of computer mainboard, a plurality of unequal size heat conduction silica gel double -sided self -adhesive, have higher thermal conductivity, adopt 3.5mm's thickness design can play better buffering effect, the design of position block can better fill the gap, play better protection effect, copper foil conductive double -sided adhesive is super -thin, double -sided self -adhesive, and the adhesion is stronger, and the impedance is smaller, copper foil's X Y direction, Z direction impedance: 0.05 omega, has better support and good conductivity, whole structure is simple, and the design is reasonable, and the suitable industrialization popularization uses.

Description

Technical Field

[0001] This utility model belongs to the field of computer motherboard gasket technology, specifically relating to a high heat dissipation computer motherboard gasket. Background Technology

[0002] As one of the most important components of a computer, the motherboard houses the main circuitry. The quality of the motherboard largely determines a computer's overall performance, lifespan, and expandability. With rapid technological advancements, the internal structure of computers has become increasingly complex. Prolonged computer use generates significant heat, and currently, heatsinks are primarily used to dissipate this heat, offering only a limited solution.

[0003] Based on this, the present invention discloses a computer motherboard pad with high heat dissipation. Utility Model Content

[0004] To address the problems in the existing technology, the purpose of this utility model is to provide a computer motherboard pad with high heat dissipation.

[0005] To achieve the above objectives and technical effects, the technical solution adopted by this utility model is as follows: A high-heat-dissipation computer motherboard pad, comprising: Several pieces of thermally conductive silicone of varying sizes; Copper foil conductive double-sided adhesive; Copper foil; Single-sided tape; The thermally conductive silicone, copper foil conductive double-sided adhesive, copper foil, and single-sided adhesive tape are arranged in order from top to bottom.

[0006] Furthermore, the thermally conductive silicone is self-adhesive on both sides, has a thermal conductivity of 4 W / mK, and a thickness of 3.5 mm.

[0007] Furthermore, there are six pieces of the thermally conductive silicone.

[0008] Furthermore, of the six thermally conductive silicone pieces, one is the largest, while the remaining five are of the same size and are distributed around the largest thermally conductive silicone piece.

[0009] Furthermore, the copper foil conductive double-sided adhesive has a thickness of 0.02 mm, is self-adhesive on both sides, has an adhesion of ≥900 gf / inch, and a Z-direction impedance of ≤0.015 Ω.

[0010] Furthermore, the thickness of the copper foil is 0.05±0.005mm, and the impedance in the XY and Z directions is ≤0.05Ω.

[0011] Furthermore, the single-sided tape has a thickness of 15-20μm, an adhesion of >500g / 25mm, with the adhesive side facing upwards, and a gloss level of 0-2GU.

[0012] Furthermore, notches are provided at the same positions of the copper foil conductive double-sided adhesive, the copper foil, and the single-sided adhesive tape.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a high-heat-dissipation computer motherboard pad for heat dissipation, buffering, and conductivity of computer motherboards, offering richer functionality. Several pieces of thermally conductive silicone of varying sizes are self-adhesive on both sides, possessing high thermal conductivity. The 3.5mm thickness design provides better buffering, and the segmented design better fills gaps, providing better protection. The ultra-thin, self-adhesive copper foil double-sided adhesive is stronger and has lower impedance. The copper foil has XY and Z-axis impedances of ≤0.05Ω, providing good support and conductivity. The overall structure is simple, rationally designed, and suitable for industrial application. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of the present invention; Figure 3-4 These are schematic diagrams illustrating the use of this utility model. Detailed Implementation

[0015] The present invention will now be described in detail so that its advantages and features can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.

[0016] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0017] like Figure 1-4 As shown, this utility model discloses a high heat dissipation computer motherboard pad for heat dissipation, buffering, and conductivity of the computer motherboard, comprising: Several pieces of thermally conductive silicone 1 of varying sizes, model FSL-BS, are self-adhesive on both sides and have high thermal conductivity of 4W / mK. The 3.5mm thickness provides better cushioning, and the segmented design better fills gaps and provides better protection. Copper foil conductive double-sided adhesive 2, model 3M 9772-20, is 0.02mm thick, ultra-thin, with self-adhesive properties on both sides, adhesion ≥900gf / inch, and Z-direction resistance ≤0.015Ω. Compared with other existing conductive adhesives of the same thickness, it has stronger adhesion and lower resistance. Copper foil 3, model BYH-CU50-01, thickness 0.05±0.005mm, XY and Z direction impedance: ≤0.05Ω, with good support and good conductivity; Single-sided tape 4, using surface-printed MYLAR tape, model FTBFAP-15C, thickness 15-20μm, adhesion: >500g / 25mm, adhesive side up, gloss: 0-2GU; The thermally conductive silicone 1, copper foil conductive double-sided adhesive 2, copper foil 3, and single-sided adhesive tape 4 are arranged in the following order from top to bottom.

[0018] A notch 5 is set at the same position as the copper foil conductive double-sided adhesive tape 2, copper foil 3, and single-sided adhesive tape 4.

[0019] Because the thermally conductive silicone 1 is deformable under external force, the product is designed to be shipped inside a Part C carrier tape 6 with round holes 7, which facilitates automated use and placement by customers, improving production efficiency and yield. The Part C carrier tape 6 is made of a highly transparent material, making it easy for machines to check whether the thermally conductive silicone 1 is missing.

[0020] The method of using this utility model is as follows: Load the entire roll of high-heat-dissipating computer motherboard pads onto the automated placement equipment. The equipment is equipped with a black anti-static adhesive tray 9. Remove the tape 8 from Part G, and use a suction nozzle to pick up the product and attach it to the appropriate position. Automated placement maximizes the protection of the product surface and adhesive surface from contamination.

[0021] Example 1 like Figure 1-4 As shown, a high-heat-dissipation computer motherboard pad is used for heat dissipation, buffering, and electrical conductivity of a computer motherboard, comprising: Six pieces of thermally conductive silicone 1 of varying sizes, model FSL-BS, are self-adhesive on both sides and have high thermal conductivity of 4W / mK. The 3.5mm thickness provides better cushioning, and the segmented design better fills gaps and provides better protection. Copper foil conductive double-sided adhesive 2, model 3M 9772-20, thickness 0.02mm, ultra-thin, double-sided self-adhesive, adhesion: 900gf / inch, Z-direction resistance: 0.015Ω, compared with other existing conductive adhesives of the same thickness, it has stronger adhesion and lower resistance; Copper foil 3, model BYH-CU50-01, thickness 0.05mm, XY and Z direction impedance: 0.05Ω, has good support and good conductivity; Single-sided tape 4, using surface-printed MYLAR tape, model FTBFAP-15C, thickness 15μm, adhesion: 700g / 25mm, adhesive side up, gloss: 2GU; The thermally conductive silicone 1, copper foil conductive double-sided adhesive 2, copper foil 3, and single-sided adhesive tape 4 are arranged in the following order from top to bottom.

[0022] A notch 5 is set at the same position as the copper foil conductive double-sided adhesive tape 2, copper foil 3, and single-sided adhesive tape 4.

[0023] Of the six thermally conductive silicone pieces 1, one is the largest, and the remaining five are of the same size and are distributed around the largest thermally conductive silicone piece 1.

[0024] Because the thermally conductive silicone 1 is deformable under external force, the product is designed to be shipped inside a Part C carrier tape 6 with round holes 7, which facilitates automated use and placement by customers, improving production efficiency and yield. The Part C carrier tape 6 is made of a highly transparent material, making it easy for machines to check whether the thermally conductive silicone 1 is missing.

[0025] The method of using this utility model is as follows: Load the entire roll of high-heat-dissipating computer motherboard pads onto the automated placement equipment. The equipment is equipped with a black anti-static adhesive tray 9. Remove the tape 8 from Part G, and use a suction nozzle to pick up the product and attach it to the appropriate position. Automated placement maximizes the protection of the product surface and adhesive surface from contamination.

[0026] The parts or structures not specifically described in this utility model can be made using existing technology or existing products, and will not be elaborated here.

[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-heat-dissipation computer motherboard pad, characterized in that, include: Several pieces of thermally conductive silicone of varying sizes; Copper foil conductive double-sided adhesive; Copper foil; Single-sided tape; The thermally conductive silicone, copper foil conductive double-sided adhesive, copper foil, and single-sided adhesive tape are arranged in order from top to bottom.

2. The high heat dissipation computer motherboard pad according to claim 1, characterized in that, The thermally conductive silicone is self-adhesive on both sides, has a thermal conductivity of 4 W / mK, and a thickness of 3.5 mm.

3. A high heat dissipation computer motherboard pad according to claim 1, characterized in that, There are six pieces of thermally conductive silicone.

4. A high heat dissipation computer motherboard pad according to claim 3, characterized in that, Of the six thermally conductive silicone pieces, one is the largest, and the remaining five are of the same size, distributed around the largest thermally conductive silicone piece.

5. A high heat dissipation computer motherboard pad according to claim 1, characterized in that, The copper foil conductive double-sided adhesive has a thickness of 0.02mm, is self-adhesive on both sides, has an adhesion of ≥900gf / inch, and a Z-direction impedance of ≤0.015Ω.

6. A high heat dissipation computer motherboard pad according to claim 1, characterized in that, The copper foil has a thickness of 0.05±0.005mm and an XY and Z direction impedance of ≤0.05Ω.

7. A high heat dissipation computer motherboard pad according to claim 1, characterized in that, The single-sided tape has a thickness of 15-20μm, an adhesion of >500g / 25mm, with the adhesive side facing upwards, and a gloss level of 0-2GU.

8. A high heat dissipation computer motherboard pad according to claim 1, characterized in that, Notches are provided at the same positions on the copper foil conductive double-sided adhesive, copper foil, and single-sided adhesive tape.

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