Server cold plate heat dissipation structure

Abstract

The utility model discloses a kind of server cold plate heat dissipation structure, relate to server heat dissipation technical field, server cold plate heat dissipation structure includes liquid collecting box, multiple memory heat dissipation units, two processor heat dissipation units and pipeline structure, two liquid inlets and two liquid outlets of liquid collecting box are distributed in the center line of liquid collecting box two sides;The underside of each memory heat dissipation unit is used to contact with the memory stick of mainboard, the end of the fin of each memory heat dissipation unit is inserted into liquid collecting box, and immersed in coolant;Each processor heat dissipation unit has cooling cavity and the liquid cooling import and liquid cooling export of intercommunication cooling cavity, cooling cavity is filled with coolant, the underside of processor heat dissipation unit is used to contact with the central processing unit of mainboard;Coolant is guided to liquid collecting box along inlet pipe, after flowing through multiple memory heat dissipation units, enter two processor heat dissipation units by two connecting pipes, finally guided by two outlet pipes.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and in particular to a server cold plate heat dissipation structure. Background Technology

[0002] my country's requirements for data center power efficiency (PUE) are becoming increasingly stringent. Simultaneously, the rapid development of technologies such as artificial intelligence and big data is drastically increasing the power density requirements for equipment. Traditional air cooling is insufficient to meet these demands. Therefore, cold-plate servers are gradually gaining attention.

[0003] In existing cold plate structures, the flow path is typically arranged so that the coolant passes through one processor first and then another. With this flow path design, the coolant may carry a large amount of heat from the first processor to the second processor, thus affecting the heat dissipation effect. Utility Model Content

[0004] The main purpose of this invention is to propose a server cold plate heat dissipation structure, which adopts a symmetrical distribution and the coolant flows through the heat dissipation components in a specific order, thereby improving the heat dissipation capacity and ensuring the heat dissipation effect of multiple heat dissipation components.

[0005] To achieve the above objectives, this utility model proposes a server cold plate heat dissipation structure, comprising:

[0006] A liquid collection box has an inner cavity filled with coolant. The liquid collection box is provided with two liquid inlet and outlet groups. The liquid inlet and outlet groups include an inlet and an outlet that communicate with the inner cavity. The outlet and the inlet are staggered.

[0007] Multiple memory heat dissipation units are arranged at horizontal intervals and are all located on the same vertical side of the liquid collection box. The lower side of the memory heat dissipation unit is used to contact the memory module of the motherboard. The memory heat dissipation unit includes multiple heat sinks arranged at horizontal intervals. The ends of the heat sinks extend into the liquid collection box and are immersed in the coolant.

[0008] Two processor cooling units are respectively located on both sides of the centerline of the liquid collection box. Each processor cooling unit has a cooling cavity and a liquid cooling inlet and outlet communicating with the cooling cavity. The cooling cavity is filled with coolant. The lower side of each processor cooling unit is designed to contact the central processing unit (CPU) of the motherboard.

[0009] The pipeline structure includes an inlet pipe, two outlet pipes, and two connecting pipes. The inlet pipes are connected to the two inlets, the two outlet pipes are connected to the two liquid cooling outlets, and the connecting pipes connect adjacent outlets and liquid cooling inlets.

[0010] The coolant flows along the inlet pipe into the collection box, passes through multiple memory heat dissipation units, overflows from the outlet into the two connecting pipes, enters the two processor heat dissipation units, and is finally discharged through the two outlet pipes.

[0011] In one embodiment, the liquid collection box includes:

[0012] The first box has multiple liquid collection chambers arranged horizontally at intervals. Each of the multiple liquid collection chambers corresponds to one of the multiple memory heat dissipation units. The side walls of the liquid collection chambers have multiple mounting ports for the ends of the heat sinks to extend into. The bottom wall of the liquid collection chambers has a liquid inlet channel.

[0013] The second box is fixedly installed at the lower end of the first box. The second box has two liquid distribution chambers arranged horizontally at intervals. The liquid distribution chambers are connected to at least one of the liquid inlet channels. The two liquid distribution chambers and the multiple liquid collection chambers together form the inner cavity.

[0014] The two liquid inlet and outlet groups are distributed on both sides of the center line of the liquid collection box. The two liquid inlet and outlet groups are respectively connected to the two liquid distribution chambers. In each liquid inlet and outlet group, the liquid inlet is set higher than the liquid outlet, and the lower edge of the part of the heat sink extending into the liquid collection box is not set higher than the liquid outlet.

[0015] In one embodiment, the liquid separation chamber is arranged in a ring shape to form a first cavity segment and a second cavity segment arranged longitudinally;

[0016] The liquid collection box further includes multiple partition units, which are fixed to the lower end of the first box body. Each partition unit includes multiple partitions arranged longitudinally at intervals. The partitions are distributed in the first cavity and the second cavity. The lower end of each partition abuts against the lower wall of the first cavity or the second cavity, thereby defining a liquid distribution channel between two adjacent partitions. The liquid distribution channel extends upward through the liquid collection cavity. The multiple liquid distribution channels formed by each partition unit together form a liquid inlet channel.

[0017] In each of the aforementioned liquid inlet and outlet groups, the liquid inlet is connected to the first cavity section, and the liquid outlet is connected to the second cavity section.

[0018] In one embodiment, both liquid inlets are located on the upper surface of the first housing, and both liquid outlets are located on the side surface of the first housing; and / or,

[0019] The side surface of the first box is provided with a plurality of mounting slots, which are arranged to form a plurality of mounting groups. Each of the mounting groups corresponds to a plurality of memory heat dissipation units. In each mounting group, a connecting hole is provided on the side wall between two adjacent mounting slots. The plurality of mounting slots and the plurality of connecting holes in each mounting group together form a liquid collection chamber. The slot opening of the mounting slot forms the mounting port, and each liquid inlet channel connects to the plurality of connecting holes.

[0020] In one embodiment, the server cold plate heat dissipation structure further includes a drain box fixed to the outer side of the liquid collection box. The upper side of the drain box is open to form a drain groove. The drain groove is located below the connection between the memory heat dissipation unit and the liquid collection box, and the sidewall of the drain groove abuts against the plurality of heat sinks.

[0021] In one embodiment, the upper end of the sidewall of the leakage channel away from the collection box is recessed to form a plurality of slots, the plurality of slots being for engaging the plurality of heat sinks of the plurality of memory heat dissipation units; and / or,

[0022] The leakage trough is inclined outwards from the side wall away from the collection box; and / or,

[0023] The leakage channel is equipped with multiple reinforcing ribs.

[0024] In one embodiment, the server cold plate heat dissipation structure further includes a support frame, the support frame and the liquid collection box are longitudinally spaced apart, the support frame is provided with a plurality of positioning slots arranged at intervals, and the positioning slots are provided through two longitudinally opposite side walls;

[0025] The end of the heat sink that is away from the liquid collection box is located in the positioning groove.

[0026] In one embodiment, the support frame, the two processor heat dissipation units, and the liquid collection box are connected as a whole by multiple connectors.

[0027] In one embodiment, the processor heat dissipation unit includes:

[0028] The base has multiple fins arranged at intervals in the middle of the base in the horizontal or vertical direction, the gap between two adjacent fins forms a first flow channel, and the lower side of the base is used to contact the central processing unit.

[0029] A cover plate is disposed on the base. The upper wall of the cover plate abuts against the plurality of fins. The inner sidewall of the cover plate and the plurality of fins define an annular second flow channel. The second flow channel communicates with the plurality of first flow channels to jointly form the cooling chamber. The cover plate is provided with the liquid cooling inlet and the liquid cooling outlet; and...

[0030] The locking element is arranged in a ring shape and is sleeved on the outside of the cover plate for fixing to the main board.

[0031] In one embodiment, the upper end of the processor heat dissipation unit is provided with a liquid accumulation tank, and the bottom wall of the liquid accumulation tank is provided with the liquid cooling inlet and the liquid cooling outlet; and / or,

[0032] The pipeline structure is equipped with multiple leakage detection ropes.

[0033] In this invention, two inlets, two outlets, multiple memory cooling units, and two processor cooling units are distributed on both sides of the center line of the cooling box, forming a symmetrical heat dissipation path. During the entire heat dissipation process, the heat sink contacts the memory modules on the motherboard, dissipating heat through conduction. The heat sink itself also contacts the coolant for heat exchange, thus improving heat exchange efficiency. The processor cooling units contact the processor, and the coolant carries away heat during its flow, ensuring good heat dissipation efficiency. Compared to the memory modules, the processor generates more heat. Therefore, through the symmetrical arrangement and the design of the outlets, the coolant first exchanges heat with the memory modules, and only after reaching a certain height does it overflow from the outlets to exchange heat with the processor. This avoids the coolant carrying a large amount of heat after passing through the processor, thus preventing it from failing to effectively dissipate heat from the memory modules. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0035] Figure 1 A schematic diagram of an embodiment of the server cold plate heat dissipation structure provided by this utility model;

[0036] Figure 2 for Figure 1 Schematic diagram of coolant flow direction within the heat dissipation structure of a mid-range server cold plate;

[0037] Figure 3 for Figure 1 Exploded view of the heat dissipation structure of the cold plate in the server;

[0038] Figure 4 for Figure 1 Schematic diagram of the central liquid collection box;

[0039] Figure 5 for Figure 4A cross-sectional view along the AA direction;

[0040] Figure 6 for Figure 4 A cross-sectional view along the BB direction;

[0041] Figure 7 for Figure 4 Schematic diagram of the structure of the first box in the middle;

[0042] Figure 8 for Figure 4 A schematic diagram of the structure of the second box in the middle;

[0043] Figure 9 for Figure 1 A cross-sectional schematic diagram of the fit between the heat sink and the liquid collection chamber;

[0044] Figure 10 for Figure 1 A schematic diagram of the structure of the leakage box;

[0045] Figure 11 for Figure 1 A schematic diagram of the heat dissipation unit in the middle processing stage;

[0046] Figure 12 for Figure 11 An exploded view of the processor's heat dissipation unit;

[0047] Figure 13 for Figure 11 A cross-sectional view of the processor's heat dissipation unit.

[0048] Explanation of icon numbers:

[0049] 100. Server cold plate heat dissipation structure; 1. Liquid collection box; 11. First box body; 111. Liquid collection chamber; 111a. Mounting port; 1111. Mounting slot; 1112. Connecting hole; 12. Second box body; 121. Liquid distribution chamber; 121a. First cavity segment; 121b. Second cavity segment; 13. Partition unit; 131. Partition plate; 1a. Liquid inlet; 1b. Liquid outlet; 2. Memory heat dissipation unit; 21. Heat sink; 3. Processor heat dissipation unit; 31. Base; 32. Fins; 33. Cover plate; 34. Locking parts; 35. Liquid accumulation tank; 41. Liquid inlet pipe; 42. Liquid outlet pipe; 43. Connecting pipe; 5. Leakage box; 51. Leakage tank; 52. Slot; 6. Support frame; 61. Positioning slot; 7. Connecting parts; 8. Leakage detection rope.

[0050] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0051] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0052] It should be noted that if the embodiments of this utility model involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0053] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0054] The requirements for PUE (Power Usage Effectiveness) of data centers are becoming increasingly stringent. The power density of high-computing-power devices such as AI servers has exceeded 30kW / rack, while traditional air-cooling technology can only support cooling needs below 15kW. Against this backdrop, liquid cooling technology has become a key path to overcome the heat dissipation bottleneck. Among these solutions, cold plate liquid cooling has become the mainstream solution due to its compatibility with existing server architectures and lower retrofit costs.

[0055] In existing cold plate structures, the processor (CPU) heatsink and memory heatsink are integrated into a single design with a single-sided flow channel. The memory heatsink does not carry water and relies on heat conduction for cooling. This cooling method results in insufficient contact area, which affects the cooling effect. Furthermore, after the coolant enters through the inlet, its temperature rises significantly after passing through the first CPU, and it carries a large amount of heat to the second CPU, thus impacting the cooling performance.

[0056] In view of this, this utility model proposes a server cold plate heat dissipation structure, which adopts a symmetrical distribution and the coolant flow path is designed according to the order of heat dissipation needs, thereby improving heat dissipation capacity and ensuring the heat dissipation effect of multiple heat dissipation components.

[0057] Please refer to Figures 1 to 4 The server cooling plate heat dissipation structure 100 includes a coolant collection box 1, multiple memory heat dissipation units 2, two processor heat dissipation units 3, and a piping structure. The coolant collection box 1 has an inner cavity filled with coolant. The coolant collection box 1 is provided with two inlet and outlet groups, each including an inlet 1a and an outlet 1b communicating with the inner cavity. The outlet 1a and the inlet 1b are staggered. The multiple memory heat dissipation units 2 are arranged horizontally at intervals and are all located on the same vertical side of the coolant collection box 1. The lower side of the memory heat dissipation units 2 is used to contact the memory modules of the motherboard. The memory heat dissipation units 2 include multiple heat sinks 21 arranged horizontally at intervals. The ends of the heat sinks 21 extend into the coolant collection box 1 and are immersed in the coolant. The two processor heat dissipation units 3 are respectively located in the coolant collection box. On both sides of the center line of box 1, the processor heat dissipation unit 3 has a cooling cavity and a liquid cooling inlet and a liquid cooling outlet connecting the cooling cavity. The cooling cavity is filled with coolant. The lower side of the processor heat dissipation unit 3 is used to contact the CPU of the motherboard. The pipeline structure includes an inlet pipe 41, two outlet pipes 42 and two connecting pipes 43. The inlet pipe 41 is connected to two inlets 1a, the two outlet pipes 42 are connected to two liquid cooling outlets, and the connecting pipes 43 are connected to adjacent outlets 1b and each liquid cooling inlet. The coolant is guided along the inlet pipe 41 to the liquid collection box 1, flows through multiple memory heat dissipation units 2 and overflows from the outlets 1b into the two connecting pipes 43 to enter the two processor heat dissipation units 3, and finally exits through the two outlet pipes 42.

[0058] In this invention, two inlets 1a, two outlets 1b, multiple memory cooling units 2, and two processor cooling units 3 are distributed on both sides of the center line of the coolant collection box 1, forming a symmetrically distributed heat dissipation path. During the entire heat dissipation process, the heat sink 21 contacts the memory modules on the motherboard, dissipating heat through thermal conduction. The heat sink 21 itself also contacts the coolant for heat exchange, thus improving heat exchange efficiency. The processor cooling units 3 contact the CPU, and the coolant carries away heat during its flow, ensuring good heat dissipation efficiency. Compared to the memory modules, the CPU generates more heat. Therefore, through the symmetrical arrangement and the design of the outlet height 1b, the coolant first exchanges heat with the memory modules, and only after reaching a certain height does it overflow from the outlet 1b to exchange heat with the CPU. This avoids the coolant carrying a large amount of heat after passing through the CPU, thus preventing it from failing to effectively dissipate heat from the memory modules.

[0059] The coolant flow path is as follows: the coolant is introduced into the two inlet ports 1a along the inlet pipe 41, thereby filling the inner cavity of the collection box 1, so that the ends of each heat sink 21 can contact the coolant. Then the coolant flows out from the two outlet ports 1b simultaneously, and is introduced into the two processor heat dissipation units 3 through the two connecting pipes 43. After filling the two cooling cavities, it flows out from the two outlet pipes 42, passes through the external heat exchanger, and then flows back into the inlet pipe 41, thereby completing the coolant circulation.

[0060] Please refer to Figures 4 to 6 The liquid collection box 1 includes a first box body 11 and a second box body 12 arranged sequentially in the vertical direction. The first box body 11 has a plurality of liquid collection chambers 111 arranged laterally. The plurality of liquid collection chambers 111 are arranged one-to-one with a plurality of memory heat dissipation units 2. The plurality of liquid collection chambers 111 are independent of each other. The side wall of each liquid collection chamber 111 has a plurality of mounting ports 111a for the end of the heat sink 21 to extend into. The bottom wall of each liquid collection chamber 111 has a liquid inlet channel. The second box body 12 is fixedly installed at the lower end of the first box body 11. The two can be welded together to ensure a sealed fit. The second box body 12 forms two liquid distribution chambers 121 arranged laterally. Each liquid distribution chamber 121 is connected to at least one liquid inlet channel. The two liquid distribution chambers 121 and the plurality of liquid collection chambers 111 together form an inner cavity. Two inlet and outlet coolant groups are distributed on both sides of the centerline of the coolant collection box 1. Each group connects to one of the two distribution chambers 121. In each group, the inlet 1a is positioned higher than the outlet 1b, and the lower edge of the portion of the heat sink 21 extending into the coolant collection box 1 is not higher than the outlet 1b. This structure divides the coolant collection box 1 into upper and lower parts, allowing the coolant to flow within it, which helps increase the heat dissipation area and improve the heat dissipation effect.

[0061] Based on the above embodiments, the coolant enters the two distribution chambers 121 of the second housing 12 from the two inlets 1a. Since the outlet 1b is located on the first housing 11 and is lower than the inlet 1a, after the two distribution chambers 121 are filled, the coolant will flow into the multiple collection chambers 111 along the multiple inlet channels. By setting the flow rate of the inlet 1a to be greater than the flow rate of the outlet 1b, the coolant can first enter the collection chamber 111 and contact the heat sink 21, and then flow out from the outlet 1b after reaching a certain volume and be introduced into the processor heat dissipation unit 3.

[0062] It should be noted that the two dispensing chambers 121 are symmetrically distributed. When the number of collecting chambers 111 is even, they are distributed on both sides of the center line, with one dispensing chamber 121 corresponding to the other on the same side. When the number of collecting chambers 111 is odd, such as three, two collecting chambers 111 are located on both sides of the center line, corresponding to two dispensing chambers 121 respectively. The remaining collecting chamber 111 is located in the central area. This collecting chamber 111 spans over the two dispensing chambers 121, meaning that the sections of the two dispensing chambers 121 that are close to each other are connected to the same collecting chamber 111.

[0063] For further details, please refer to Figures 7 to 8Each liquid distribution chamber 121 is arranged in a ring to form a first chamber segment 121a and a second chamber segment 121b arranged longitudinally. The collection box 1 also includes multiple partition units 13, which are fixed to the lower end of the first box body 11. Each partition unit 13 includes multiple partition plates 131 arranged longitudinally at intervals. The partition plates 131 are distributed in the first chamber segment 121a and the second chamber segment 121b, that is, partition plates 131 are provided in both the first chamber segment 121a and the second chamber segment 121b. The lower end of each partition plate 131 abuts against the lower wall surface of the first chamber segment 121a or the second chamber segment 121b, so that a liquid distribution groove is defined between two adjacent partition plates 131. The liquid distribution groove extends upward through the collection chamber 111. The multiple liquid distribution grooves formed by the partition units 13 together form a liquid inlet channel. In each liquid inlet and outlet group, the liquid inlet 1a is connected to the first chamber segment 121a, and the liquid outlet 1b is connected to the second chamber segment 121b. Based on this structure, the coolant first enters the rear side of the distribution chamber 121 and then converges to the front side, that is, it flows through the internal flow channel of the first chamber section 121a to the second chamber section 121b. During the convergence process, it passes through the baffle unit 13. At this time, the coolant can only flow through the distribution tank, that is, the flow rate slows down. After entering the second chamber section 121b, it converges and flows through the baffle unit 13 again, and the flow rate slows down again. After the distribution chamber 121 is filled, the height of the coolant reaches the top of the distribution tank, so that it can flow into the collection chamber 111 along the upper end of the distribution tank, thereby achieving the filling of the collection chamber 111.

[0064] It should be noted that the number of baffle units 13 can correspond one-to-one with the number of liquid collection chambers 111. In this embodiment, four baffle units 13 are provided, with two baffle units 13 in each liquid distribution chamber 121, located near the two ends of the liquid distribution chamber 121 in the lateral direction. At this time, the inlet and outlet liquid groups are located in the middle of the two baffle units 13, so that the flow of coolant spreads from the middle of the first cavity section 121a to both sides, and after passing through the two baffle units 13, converges from both sides of the second cavity section 121b towards the middle.

[0065] Correspondingly, there are three liquid collection chambers 111. The liquid collection chamber 111 located on the side corresponds to one liquid inlet channel, and the liquid collection chamber 111 located in the middle corresponds to two liquid inlet channels.

[0066] In this embodiment, please refer again. Figure 4 Both inlet ports 1a are located on the upper surface of the first box 11, and both outlet ports 1b are located on the side of the first box 11. This arrangement not only ensures the height difference between the inlet ports 1a and the outlet ports 1b, but also facilitates their arrangement on the front and back sides.

[0067] In some embodiments, please refer to Figure 5 and Figure 9The side surface of the first housing 11 has multiple mounting slots 1111 corresponding to multiple heat sinks 21. These mounting slots 1111 are arranged to form multiple mounting groups, each corresponding to a memory heat dissipation unit 2. In each mounting group, a connecting hole 1112 is formed on the side wall between two adjacent mounting slots 1111. The multiple mounting slots 1111 and the multiple connecting holes 1112 in each mounting group together form a liquid collection chamber 111. The opening of the mounting slot 1111 forms a mounting port 111a, and the liquid inlet channel of the liquid collection chamber 111 connects to the multiple connecting holes 1112. The heat sinks 21 can be inserted and fixed within the mounting slots 1111, thus providing stable positioning. After the heat sinks 21 are inserted, the mounting slots 1111 are filled, and each heat sink 21 comes into contact with the coolant in the connecting hole 1112, thereby achieving heat exchange.

[0068] It should be understood that, in order to prevent coolant leakage, a sealing ring or other structure should be provided at the mating point between the heat sink 21 and the mounting port 111a to ensure a sealed fit. Alternatively, the heat sink 21 can be welded to the liquid collection box 1, which can also ensure a sealed fit. This utility model does not limit this.

[0069] Please refer to Figure 4 and Figure 10 The server cold plate heat dissipation structure 100 also includes a drain box 5 fixed to the outer side of the liquid collection box 1. The upper side of the drain box 5 is open to form a drain groove 51. The drain groove 51 is located below the connection between the memory heat dissipation unit 2 and the liquid collection box 1. The drain groove 51 extends laterally, and its sidewall abuts against multiple heat sinks 21. The design of the drain groove 51 reduces the application of drain lines and also provides support for the heat sinks 21 by abutting against them with its sidewall. In conjunction with the liquid collection box 1, it ensures the unilateral force balance of the heat sinks 21. When the liquid collection box 1 is combined with the first box body 11 and the second box body 12, the drain box 5 is fixed to the second box body 12.

[0070] Capillary action refers to the unintended penetration or leakage of coolant through microscopic pores, cracks, or interfacial gaps in cold plates or connecting components, under the influence of surface tension and material wettability. This phenomenon can cause liquid to overflow from the sealing system, threatening the safety and reliability of the equipment. When the heat sink 21 is welded to the liquid collection box 1, the support of the sidewall of the leakage groove 51 can increase the welding stability of the heat sink 21 and reduce leakage caused by capillary action.

[0071] In addition, to ensure the stability of subsequent testing, leakage detection ropes 8 can be installed around the liquid collection box 1.

[0072] For further details, please refer to Figure 10The upper end of the side wall of the leakage groove 51 away from the liquid collection box 1 is recessed to form multiple slots 52. The multiple slots 52 are used to attach multiple heat sinks 21 of multiple memory heat dissipation units 2. The slots 52 provide U-shaped support for the heat sinks 21.

[0073] This invention does not limit the shape of the leakage trough 51. In some embodiments, the side wall of the leakage trough 51 away from the collection box 1 is inclined outward; that is, the leakage trough 51 is a V-shaped groove, and the inclined side wall can play a certain guiding function. At the same time, it is beneficial to reduce the volume of the leakage box 5.

[0074] Since the drain box 5 also supports the heat sink 21, multiple reinforcing ribs are provided inside the drain groove 51 to increase the structural strength of the drain box 5. Specifically, the reinforcing ribs should be located in the part of the drain groove 51 corresponding to the memory heat dissipation unit 2.

[0075] To improve the support effect of heatsink 21, please refer to... Figures 1 to 3 The server cold plate heat dissipation structure 100 also includes a support frame 6, which is longitudinally spaced from the liquid collection box 1. The support frame 6 has multiple spaced positioning grooves 61, which are through-holes in two longitudinally opposite side walls. The ends of the heat sinks 21 furthest from the liquid collection box 1 are located within the positioning grooves 61. That is, one end of each heat sink 21 is inserted into the liquid collection box 1, and the other end is secured in the positioning groove 61, thus providing stable support for both sides of the heat sink 21. It should be noted that the heat sinks 21 can be connected by welding to improve structural strength.

[0076] For easier installation and assembly of the overall structure on the motherboard, please refer to... Figure 3 The support frame 6, two processor heat dissipation units 3, and liquid collection box 1 are connected as a whole by multiple connectors 7. The connectors 7 include screws, clamps, Z-shaped sheet metal parts, etc., mainly to adapt to the shape and connection requirements of different structures, so that the server cold plate heat dissipation structure 100 forms a whole.

[0077] Please refer to Figures 11 to 13The processor heat dissipation unit 3 includes a base 31, a cover plate 33, and a locking member 34. The base 31 has multiple fins 32 arranged at intervals along the horizontal or vertical direction in the middle. The gap between two adjacent fins 32 forms a first flow channel. The lower side of the base 31 is used to contact the CPU. The cover plate 33 is placed on the base 31. The upper wall of the cover plate 33 abuts against the multiple fins 32. The inner side wall of the cover plate 33 and the multiple fins 32 define a second flow channel arranged in an annular shape. The second flow channel is connected to the multiple first flow channels to form a cooling cavity. The cover plate 33 is provided with a liquid cooling inlet and a liquid cooling outlet. The locking member 34 is arranged in an annular shape and is sleeved on the outside of the cover plate 33 for fixing to the motherboard. The locking component 34 serves to connect and fix the components. The base 31 and the cover plate 33 together define the cooling cavity. In this structure, the heat on the CPU surface is carried away by the flow of coolant on one hand, and the heat on the CPU surface is carried away by the heat conduction through the fins 32 on the other hand. The fins 32 and the flow channel work together to increase the contact area, thereby enhancing the heat dissipation effect.

[0078] Specifically, the base 31 is made of copper, and the cover plate 33 is made of aluminum.

[0079] Please refer to Figure 12 In this embodiment, the multiple fins 32 are divided into two groups, and a gap is formed between the two groups of fins, so that the coolant can flow through the second flow channel, the multiple first flow channels and the gap formed between the two groups of fins.

[0080] Furthermore, the upper end of the processor heat dissipation unit 3 is provided with a liquid accumulation groove 35, and the bottom wall of the liquid accumulation groove 35 is provided with a liquid cooling inlet and a liquid cooling outlet, so as to play a certain role in liquid storage when the connector leaks. Based on the above embodiment, the upper end surface of the cover plate 33 is provided with a liquid accumulation groove 35, and the side wall of the liquid accumulation groove 35 protrudes from the upper end surface of the cover plate 33, thereby ensuring the wall thickness of the cover plate 33.

[0081] To facilitate leak detection, multiple leak detection ropes 8 are installed on the pipeline structure. The leak detection ropes 8 are fixed to the pipeline with tape. Specifically, leak detection ropes 8 can be installed on the inlet pipe 41, the outlet pipe 42, and the connecting pipe 43.

[0082] It should be noted that when connecting pipe 43 is fitted with liquid outlet 1b and liquid cooling inlet, it can be fixed by using pipe fittings and clamps.

[0083] Please refer to Figure 1 The specific working principle of the embodiment is as follows:

[0084] First, the relevant components are assembled. The pipe in the middle is the liquid inlet pipe 41, and the pipes on both sides are the liquid outlet pipes 42. The first box 11 and the second box 12 are welded together. At the same time, the leakage box 5 is welded to the second box 12. The two holes on the upper surface of the first box 11 are the liquid inlet 1a, and the two holes on the front wall are the liquid outlet 1b. The holes and internal flow paths are symmetrically distributed.

[0085] Coolant enters the rear of the distribution chamber 121 of the second housing 12 through the inlet 1a. The annular flow path of the distribution chamber 121 ensures smooth liquid flow, while the partition plate 131 increases the contact area and limits the flow velocity of the annular flow path. After the second housing 12 is fully loaded, the coolant flows through the inlet channel to the collection chamber 111, thus ensuring that the internal space of the first housing 11 is filled. The heat sink 21 is brazed onto the first housing 11, ensuring that one end of the heat sink 21 is fully covered by coolant. The design of the drain groove 51 reduces the use of drain lines, and its U-shaped support for the heat sink 21 ensures the unilateral force balance of the heat sink 21, increases the welding stability of the heat sink 21, and also reduces leakage caused by capillary action. Each heat sink 21 has a separate mounting port 111a, allowing for direct observation of which area of ​​the heat sink 21 is leaking during use. The positioning groove 61 area of ​​the support frame 6 is welded to the heat sink 21 to ensure that the heat sink 21 remains balanced. The processor heat dissipation unit 3 has fins 32 added inside to increase the heat dissipation area, and the CPU and the processor heat dissipation unit 3 are locked together by a locking component 34. In the entire flow process of the coolant, the memory modules are heat exchanged first and then the CPU. This is because the heat generated by the CPU is much higher than that generated by the memory modules. If the CPU is heat exchanged first, the coolant may overheat and lose its heat dissipation function for the memory modules.

[0086] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A server cold plate heat dissipation structure, characterized in that, include: A liquid collection box has an inner cavity filled with coolant. The liquid collection box is provided with two liquid inlet and outlet groups. The liquid inlet and outlet groups include an inlet and an outlet that communicate with the inner cavity. The outlet and the inlet are staggered. Multiple memory heat dissipation units are arranged at horizontal intervals and are all located on the same vertical side of the liquid collection box. The lower side of the memory heat dissipation unit is used to contact the memory module of the motherboard. The memory heat dissipation unit includes multiple heat sinks arranged at horizontal intervals. The ends of the heat sinks extend into the liquid collection box and are immersed in the coolant. Two processor cooling units are respectively located on both sides of the centerline of the liquid collection box. Each processor cooling unit has a cooling cavity and a liquid cooling inlet and outlet communicating with the cooling cavity. The cooling cavity is filled with coolant. The lower side of each processor cooling unit is designed to contact the central processing unit (CPU) of the motherboard. The pipeline structure includes an inlet pipe, two outlet pipes, and two connecting pipes. The inlet pipes are connected to the two inlets, the two outlet pipes are connected to the two liquid cooling outlets, and the connecting pipes connect adjacent outlets and liquid cooling inlets. The coolant flows along the inlet pipe into the collection box, passes through multiple memory heat dissipation units, overflows from the outlet into the two connecting pipes, enters the two processor heat dissipation units, and is finally discharged through the two outlet pipes.

2. The server cold plate heat dissipation structure as described in claim 1, characterized in that, The liquid collection box includes: The first box has multiple liquid collection chambers arranged horizontally at intervals. Each of the multiple liquid collection chambers corresponds to one of the multiple memory heat dissipation units. The side walls of the liquid collection chambers have multiple mounting ports for the ends of the heat sinks to extend into. The bottom wall of the liquid collection chambers has a liquid inlet channel. The second box is fixedly installed at the lower end of the first box. The second box has two liquid distribution chambers arranged horizontally at intervals. The liquid distribution chambers are connected to at least one of the liquid inlet channels. The two liquid distribution chambers and the multiple liquid collection chambers together form the inner cavity. The two liquid inlet and outlet groups are distributed on both sides of the center line of the liquid collection box. The two liquid inlet and outlet groups are respectively connected to the two liquid distribution chambers. In each liquid inlet and outlet group, the liquid inlet is set higher than the liquid outlet, and the lower edge of the part of the heat sink extending into the liquid collection box is not set higher than the liquid outlet.

3. The server cold plate heat dissipation structure as described in claim 2, characterized in that, The liquid separation chamber is arranged in a ring shape to form a first chamber segment and a second chamber segment arranged in the longitudinal direction; The liquid collection box further includes multiple partition units, which are fixed to the lower end of the first box body. Each partition unit includes multiple partitions arranged longitudinally at intervals. The partitions are distributed in the first cavity and the second cavity. The lower end of each partition abuts against the lower wall of the first cavity or the second cavity, thereby defining a liquid distribution channel between two adjacent partitions. The liquid distribution channel extends upward through the liquid collection cavity. The multiple liquid distribution channels formed by each partition unit together form a liquid inlet channel. In each of the aforementioned liquid inlet and outlet groups, the liquid inlet is connected to the first cavity section, and the liquid outlet is connected to the second cavity section.

4. The server cold plate heat dissipation structure as described in claim 3, characterized in that, Both liquid inlets are located on the upper surface of the first housing, and both liquid outlets are located on the side of the first housing; and / or, The side surface of the first box is provided with a plurality of mounting slots, which are arranged to form a plurality of mounting groups. Each of the mounting groups corresponds to a plurality of memory heat dissipation units. In each mounting group, a connecting hole is provided on the side wall between two adjacent mounting slots. The plurality of mounting slots and the plurality of connecting holes in each mounting group together form a liquid collection chamber. The slot opening of the mounting slot forms the mounting port, and each liquid inlet channel connects to the plurality of connecting holes.

5. The server cold plate heat dissipation structure as described in claim 1, characterized in that, The server cold plate heat dissipation structure also includes a drain box fixed to the outer side of the liquid collection box. The upper side of the drain box is open to form a drain groove. The drain groove is located below the connection between the memory heat dissipation unit and the liquid collection box, and the side wall of the drain groove abuts against the plurality of heat sinks.

6. The server cold plate heat dissipation structure as described in claim 5, characterized in that, The upper end of the side wall of the leakage channel away from the liquid collection box is recessed to form multiple slots, which are used to engage multiple heat sinks of multiple memory heat dissipation units; and / or, The leakage trough is inclined outwards from the side wall away from the collection box; and / or, The leakage channel is equipped with multiple reinforcing ribs.

7. The server cold plate heat dissipation structure as described in claim 1, characterized in that, The server cold plate heat dissipation structure also includes a support frame, which is longitudinally spaced from the liquid collection box. The support frame is provided with a plurality of positioning slots arranged at intervals, and the positioning slots are provided through two longitudinally opposite side walls. The end of the heat sink away from the liquid collection box is located in the positioning groove.

8. The server cold plate heat dissipation structure as described in claim 7, characterized in that, The support frame, the two processor heat dissipation units, and the liquid collection box are connected as one unit through multiple connectors.

9. The server cold plate heat dissipation structure as described in claim 1, characterized in that, The processor cooling unit includes: The base has multiple fins arranged at intervals in the middle of the base in the horizontal or vertical direction, the gap between two adjacent fins forms a first flow channel, and the lower side of the base is used to contact the central processing unit. A cover plate is disposed on the base. The upper wall of the cover plate abuts against the plurality of fins. The inner sidewall of the cover plate and the plurality of fins define an annular second flow channel. The second flow channel communicates with the plurality of first flow channels to jointly form the cooling chamber. The cover plate is provided with the liquid cooling inlet and the liquid cooling outlet; and... The locking element is arranged in a ring shape and is sleeved on the outside of the cover plate for fixing to the main board.

10. The server cold plate heat dissipation structure as described in claim 1, characterized in that, The upper end of the processor heat dissipation unit is provided with a liquid collection tank, and the bottom wall of the liquid collection tank is provided with the liquid cooling inlet and the liquid cooling outlet; and / or, The pipeline structure is equipped with multiple leakage detection ropes.

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