Heat dissipating armor and computer host

Abstract

The utility model discloses a kind of heat dissipation armors and computer host, it is related to computer parts technical field, heat dissipation armor includes heat dissipation main body and installation part, heat dissipation main body includes heat conduction part and heat dissipation part, heat conduction part is used to connect MOS chip on mainboard, heat dissipation part is located heat conduction part top, to dissipate heat absorbed by heat conduction part;Installation part is located the side of heat conduction part back to heat dissipation part, installation part is detachably connected with mainboard.

Description

Technical Field

[0001] This utility model relates to the field of computer component technology, and in particular to a heat dissipation armor and a computer host. Background Technology

[0002] To ensure high performance in desktop motherboards, effective heat dissipation is crucial. The motherboard needs not only a CPU (Central Processing Unit) heatsink but also heatsinks for the electronic components. During computer operation, the MOS (Metal-Oxide-Semiconductor) chips on the motherboard generate significant heat due to their high-frequency switching. Inadequate heat dissipation can lead to performance degradation or even damage to these chips.

[0003] The existing method for cooling heat-generating components such as MOS chips on the motherboard involves placing a thermally conductive pad under the heatsink, transferring heat to the heatsink, and then using a CPU fan for air cooling. Because this solution uses an interference fit between the thermal pad and the heatsink, the thermal pad can deform under prolonged CPU heat, and there is a risk of it detaching, thus affecting the overall cooling efficiency of the product. Utility Model Content

[0004] The main purpose of this invention is to propose a heat dissipation armor and a computer host, which aims to ensure the heat dissipation efficiency of the heat dissipation armor.

[0005] To achieve the above objectives, the heat dissipation armor proposed in this utility model includes:

[0006] The heat dissipation body includes a heat-conducting part and a heat dissipation part. The heat-conducting part is used to connect to the MOS chip on the motherboard, and the heat dissipation part is disposed above the heat-conducting part to dissipate the heat absorbed by the heat-conducting part.

[0007] The mounting part is located on the side of the heat-conducting part facing away from the heat dissipation part, and the mounting part is detachably connected to the motherboard.

[0008] In one embodiment, thermally conductive silicone is provided on the side of the thermally conductive portion facing the motherboard, and the side of the thermally conductive silicone facing away from the thermally conductive portion is connected to the MOS chip.

[0009] In one embodiment, the heat dissipation armor further includes a connecting stud, both ends of which are provided with external threads in the axial direction. The mounting part has a threaded hole on the side facing the motherboard. One end of the connecting stud is screwed into the threaded hole, and the other end of the connecting stud passes through the motherboard and is fixed by a nut.

[0010] In one embodiment, the heat dissipation armor further includes a raised portion that extends along the side of the heat-conducting portion facing the motherboard, the raised portion being flush with the mounting portion, and thermally conductive silicone being connected to the side of the raised portion facing the motherboard.

[0011] In one embodiment, the mounting portion includes at least two, and each mounting portion is spaced apart along the length direction of the heat dissipation armor.

[0012] In one embodiment, the heat dissipation part includes a connecting plate and heat dissipation fins. The connecting plate extends along the side of the heat-conducting part away from the mounting part, and the heat dissipation fins are horizontally connected to opposite sides of the connecting plate and arranged at intervals along the extending direction of the connecting plate.

[0013] In one embodiment, a wire-passing groove is formed on the side of the heat dissipation part facing away from the mounting part, and the wire-passing groove is provided through the width direction of the heat dissipation part.

[0014] In one embodiment, the heat dissipation armor is a one-piece structure.

[0015] This utility model also proposes a computer host, the computer host including a heat dissipation armor, the heat dissipation armor comprising:

[0016] The heat dissipation body includes a heat-conducting part and a heat dissipation part. The heat-conducting part is used to connect to the MOS chip on the motherboard, and the heat dissipation part is disposed above the heat-conducting part to dissipate the heat absorbed by the heat-conducting part.

[0017] The mounting part is located on the side of the heat-conducting part facing away from the heat dissipation part, and the mounting part is detachably connected to the motherboard.

[0018] This invention proposes a heat dissipation armor, comprising a heat-conducting part and a heat-dissipating part. The heat-conducting part, as the first stage of heat conduction, directly or indirectly contacts the MOS chip on its motherboard-facing side, rapidly absorbing the heat generated by the MOS chip. The heat-dissipating part, located above the heat-conducting part and made of thermally conductive material, dissipates the heat conducted by the heat-conducting part into the surrounding environment by increasing the contact area with the air, thus transferring heat outwards. A mounting part is located on the side of the heat-conducting part facing away from the heat-dissipating part, securing the heat dissipation armor firmly to the motherboard. The mounting part is detachably connected to the motherboard, ensuring close contact between the heat dissipation armor and the MOS chip while facilitating future maintenance or replacement. The heat-conducting part directly absorbs heat from the MOS chip and conducts it to the heat-dissipating part, which dissipates the heat through its structure. The mounting part, through its detachable connection, ensures stable assembly of the entire heat dissipation unit with the motherboard. These three elements work together to achieve a heat dissipation process of absorption-conduction-dissipation. This significantly improves the heat dissipation efficiency of the MOS chip and avoids the problem of heat accumulation. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a structural embodiment of the heat dissipation armor provided by this utility model;

[0021] Figure 2 for Figure 1 Another structural diagram of the heat dissipation armor;

[0022] Figure 3 This is a schematic diagram of the heat dissipation armor provided by this utility model installed on the motherboard.

[0023] Explanation of icon numbers:

[0024] 100. Heat dissipation armor; 1. Heat dissipation body; 11. Heat conduction part; 12. Heat dissipation part; 121. Connecting plate; 122. Heat dissipation fins; 123. Cable routing channel; 2. Mounting part; 3. Thermal conductive silicone; 4. Connecting studs; 5. Elevation part; 200. Motherboard.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] To ensure high performance in desktop motherboards, effective heat dissipation is crucial. The motherboard needs not only a CPU (Central Processing Unit) heatsink but also heatsinks for the electronic components. During computer operation, the MOS (Metal-Oxide-Semiconductor) chips on the motherboard generate significant heat due to their high-frequency switching. Inadequate heat dissipation can lead to performance degradation or even damage to these chips.

[0030] The existing method for cooling heat-generating components such as MOS chips on the motherboard involves placing a thermally conductive pad under the heatsink, transferring heat to the heatsink, and then using a CPU fan for air cooling. Because this solution uses an interference fit between the thermal pad and the heatsink, the thermal pad can deform under prolonged CPU heat, and there is a risk of it detaching, thus affecting the overall cooling efficiency of the product.

[0031] To solve the above problems, please refer to... Figures 1 to 3 This utility model proposes a heat dissipation armor 100, including a heat dissipation body 1 and a mounting part 2. The heat dissipation body 1 includes a heat-conducting part 11 and a heat dissipation part 12. The heat-conducting part 11 is used to connect to the MOS chip on the motherboard 200. The heat dissipation part 12 is located above the heat-conducting part 11 to dissipate the heat absorbed by the heat-conducting part 11. The mounting part 2 is located on the side of the heat-conducting part 11 facing away from the heat dissipation part 12. The mounting part 2 is detachably connected to the motherboard 200.

[0032] This utility model proposes a heat dissipation armor 100, including a heat-conducting part 11 and a heat dissipation part 12. The heat-conducting part 11, as the first link in heat conduction, directly or indirectly contacts the MOS chip on its side facing the motherboard 200, enabling it to quickly absorb the heat generated by the MOS chip. The heat dissipation part 12, located above the heat-conducting part 11 and made of thermally conductive material, dissipates the heat conducted by the heat-conducting part 11 into the surrounding environment by increasing the contact area with the air, thus achieving heat transfer outwards. The mounting part 2, located on the side of the heat-conducting part 11 facing away from the heat dissipation part 12, securely fixes the heat dissipation armor 100 to the motherboard 200. The mounting part 2 is detachably connected to the motherboard 200, ensuring close contact between the heat dissipation armor 100 and the MOS chip while facilitating future maintenance or replacement. The heat-conducting part 11 directly absorbs heat from the MOS chip and conducts it to the heat dissipation part 12, which dissipates the heat through its own structure. The mounting part 2, through its detachable connection, ensures stable assembly of the entire heat dissipation body 100 with the motherboard 200. These three components work together to achieve a heat dissipation process of absorption, conduction, and dissipation. This significantly improves the heat dissipation efficiency of the MOS chip and avoids the problem of heat accumulation.

[0033] In an optional embodiment, thermally conductive silicone 3 is provided on the side of the heat-conducting part 11 facing the motherboard 200, and the side of the thermally conductive silicone 3 facing away from the heat-conducting part 11 is connected to the MOS chip. Due to the microscopic unevenness between the surface of the MOS chip and the surface of the heat-conducting part 11, the thermally conductive silicone 3 can fill the gap between them, eliminating air at the contact surface, thus forming a tighter thermal connection between the heat-conducting part 11 and the MOS chip. This effectively reduces contact thermal resistance and further improves the heat conduction efficiency from the MOS chip to the heat-conducting part 11. Simultaneously, the thermally conductive silicone 3 has a certain degree of elasticity, which can buffer the pressure during installation and prevent damage to the MOS chip due to rigid contact, thus balancing heat dissipation performance and protection.

[0034] In an alternative embodiment, please refer to Figure 1 The heat sink 100 also includes a connecting stud 4. Both ends of the connecting stud 4 have external threads, and the mounting part 2 has a threaded hole on the side facing the motherboard 200. One end of the connecting stud 4 is screwed into the threaded hole, and the other end passes through the motherboard 200 and is secured by a nut. This threaded connection method features a stable connection and detachability. By adjusting the tightness of the nut, the pressure between the heat sink 100 and the MOS chip can be controlled, ensuring close contact between the thermal conductive silicone 3 or the thermal conductive part 11 and the chip. Simultaneously, by setting the connecting stud 4 to achieve a detachable connection between the mounting part 2 and the motherboard 200, it is also easy to adjust the thickness of the thermal conductive silicone 3 located below the thermal conductive part 11. When it is necessary to replace the thermal conductive silicone 3 with one of different thicknesses, only the connecting stud 4 of different lengths needs to be replaced, improving the versatility of the heat sink 100.

[0035] In another alternative embodiment, please refer to Figure 1 The heat sink 100 also includes a raised portion 5, which extends along the side of the heat-conducting portion 11 facing the motherboard 200. The raised portion 5 is flush with the mounting portion 2, and thermally conductive silicone 3 is connected to the side of the raised portion 5 facing the motherboard 200. The raised portion 5 mainly serves as an auxiliary support. When the heat sink 100 is long, relying solely on the mounting portion 2 for support may cause the middle of the heat-conducting portion 11 to sag, affecting the contact effect with the MOS chip. The raised portion 5 being flush with the mounting portion 2 allows the heat sink 100 to be placed stably on the motherboard 200, preventing the heat-conducting portion 11 from deforming under stress. At the same time, the thermally conductive silicone 3 of the raised portion 5 can contact the motherboard 200, conducting heat from the motherboard 200 to the heat sink 12 through the heat-conducting portion 11 for dissipation, achieving multi-component coordinated heat dissipation and improving the overall heat dissipation performance of the motherboard 200. In this embodiment, the raised portion 5 is elongated and extends along the length of the heat sink 100. Through the combined action of the raised part 5 and the mounting part 2, the heat dissipation armor 100 is kept stably mounted on the motherboard 200.

[0036] Further, please refer to Figure 1 The mounting section 2 includes at least two parts, each spaced apart along the length of the heat sink 100. The design of multiple mounting sections 2 disperses the pressure of the heat sink 100 on the motherboard 200, preventing excessive force at a single point from deforming the motherboard 200. The spaced arrangement along the length allows for even distribution of support points according to the size of the heat sink 100, ensuring consistent contact pressure between each area of ​​the heat-conducting section 11 and the MOS chip, thus guaranteeing uniform heat conduction. Simultaneously, the spaced mounting sections 2 avoid other components on the motherboard 200, adapting to the complex layout of the motherboard 200 and improving installation feasibility. In this embodiment, there are two mounting sections 2, located at opposite ends along the length of the heat-conducting section 11. In other embodiments, the number can be selected based on the actual length of the heat sink 100 and usage requirements.

[0037] In an alternative embodiment, please refer to Figure 1 and Figure 2The heat dissipation section 12 includes a connecting plate 121 and heat dissipation fins 122. The connecting plate 121 extends along the side of the heat-conducting section 11 away from the mounting section 2. The heat dissipation fins 122 are horizontally connected to opposite sides of the connecting plate 121 and spaced apart along the extending direction of the connecting plate 121. The connecting plate 121 extends along the side of the heat-conducting section 11 away from the mounting section 2 and serves as the mounting carrier for the heat dissipation fins 122, directly connected to the heat-conducting section 11 to receive heat. The heat dissipation fins 122 are horizontally connected to opposite sides of the connecting plate 121 and spaced apart along the extending direction of the connecting plate 121. The horizontally arranged fins increase the contact area between the heat dissipation section 12 and the air, while the spaced arrangement provides a channel for airflow, facilitating the flow of cool air between the fins and carrying away heat. The number and spacing of the heat dissipation fins 122 can be designed according to actual heat dissipation requirements. The connecting plate 121 and the fins can be integrally molded to reduce thermal resistance and ensure efficient heat conduction to each fin. Please refer to [further details omitted]. Figure 3 In this embodiment, a heat dissipation fin 122 located at the top of the connecting plate 121 extends outward and connects to components on the motherboard 200, and can be fixed by adhesive or screwing. This increases the heat dissipation area of ​​the heat dissipation fin 122 and improves the heat dissipation effect of the heat dissipation armor 100. On the other hand, this heat dissipation fin 122 can further improve the stability of the connection between the heat dissipation armor 100 and the motherboard 200, ensuring the normal operation of the heat dissipation armor 100.

[0038] In another embodiment, please refer to Figure 2 A cable routing groove 123 is formed on the side of the heat sink 12 facing away from the mounting part 2, and the cable routing groove 123 runs through the width of the heat sink 12. The computer motherboard 200 typically has various cables such as power cables and data cables that need to be routed. If the cables directly cover the surface of the heat sink 12, they can easily block the heat sink fins 122 and obstruct airflow, affecting the heat dissipation effect. The cable routing groove 123 provides a dedicated channel for the cables, allowing them to pass through it without contacting the surface of the heat sink 12, ensuring airflow space around the heat sink 12. At the same time, the through-running cable routing groove 123 facilitates cable routing from any direction, improving the flexibility of the internal layout of the host and reducing interference from internal cables on the heat dissipation effect.

[0039] Furthermore, the heat dissipation armor 100 is a one-piece structure. In actual production, the heat-conducting part 11, heat dissipation part 12, mounting part 2, and raised part 5 can be integrated into a single unit through die casting, extrusion, and CNC precision machining processes. Compared to an assembled structure, the one-piece structure eliminates the connection gaps between components, and air in these gaps increases thermal resistance and affects heat conduction. Therefore, the one-piece structure significantly reduces thermal resistance, making the heat conduction path from the MOS chip to the heat dissipation part 12 smoother. At the same time, the one-piece structure has higher overall strength, better resisting external forces during installation or use, reducing the risk of deformation, ensuring long-term stable operation of the heat dissipation armor 100, and extending its service life. In this embodiment, the heat dissipation armor 100 is an aluminum alloy profile integrally formed by extrusion. In other embodiments, the material and forming method of the heat dissipation armor 100 can also be selected according to actual needs.

[0040] This utility model also proposes a computer host, which includes the aforementioned heat dissipation armor 100. The specific structure of the heat dissipation armor 100 is as described in the above embodiments. Since this computer host adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here. As the core device for data processing and operation, the computer host experiences a sharp increase in heat generation from components such as MOS chips on the motherboard 200 under high loads, such as large games and video rendering. If the heat dissipation system is inadequate, it can lead to host lag, crashes, or even hardware damage. By assembling the aforementioned heat dissipation armor 100, the heat-conducting part 11 of the heat dissipation armor 100 quickly absorbs the heat from the MOS chip, which is then efficiently dissipated through the heat dissipation part 12. The mounting part 2 ensures stable assembly of the heat dissipation armor 100, and the optimized structure, such as the thermally conductive silicone 3, the raised part 5, and the wire channel 123, further improves heat dissipation efficiency and ease of use. The integrated structure and fin design of the heat dissipation armor 100 ensure rapid heat conduction and dissipation, allowing the MOS chip to maintain normal operating temperature under high loads. This ensures that the computer host has more reliable heat dissipation performance, can adapt to long-term high-load operation scenarios, improves the stability and lifespan of the computer host, and provides users with a smoother user experience.

[0041] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation armor, characterized in that, include: The heat dissipation body includes a heat-conducting part and a heat dissipation part. The heat-conducting part is used to connect to the MOS chip on the motherboard, and the heat dissipation part is disposed above the heat-conducting part to dissipate the heat absorbed by the heat-conducting part. The mounting part is located on the side of the heat-conducting part facing away from the heat dissipation part, and the mounting part is detachably connected to the motherboard.

2. The heat dissipation armor as described in claim 1, characterized in that, The side of the heat-conducting part facing the motherboard is provided with thermally conductive silicone, and the side of the thermally conductive silicone facing away from the heat-conducting part is connected to the MOS chip.

3. The heat dissipation armor as described in claim 2, characterized in that, The heat dissipation armor also includes a connecting stud, both ends of which are provided with external threads. The mounting part has a threaded hole on the side facing the motherboard. One end of the connecting stud is screwed into the threaded hole, and the other end of the connecting stud passes through the motherboard and is fixed by a nut.

4. The heat dissipation armor as described in any one of claims 1 to 3, characterized in that, The heat dissipation armor also includes a raised portion, which extends along the side of the heat-conducting portion facing the motherboard. The raised portion is flush with the mounting portion, and thermally conductive silicone is connected to the side of the raised portion facing the motherboard.

5. The heat dissipation armor as described in claim 4, characterized in that, The mounting portion includes at least two parts, and each mounting portion is spaced apart along the length direction of the heat dissipation armor.

6. The heat dissipation armor as described in claim 4, characterized in that, The heat dissipation part includes a connecting plate and heat dissipation fins. The connecting plate extends along the side of the heat-conducting part away from the mounting part. The heat dissipation fins are connected to opposite sides of the connecting plate in a horizontal direction and are arranged at intervals along the extension direction of the connecting plate.

7. The heat dissipation armor as described in claim 4, characterized in that, A wire-passing groove is formed on the side of the heat dissipation part facing away from the mounting part, and the wire-passing groove is provided through the width of the heat dissipation part.

8. The heat dissipation armor as described in claim 1, characterized in that, The heat dissipation armor is a one-piece structure.

9. A computer host, characterized in that, Includes the heat dissipation armor as described in any one of claims 1 to 8.

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