A heat dissipation device

Abstract

The utility model discloses a heat abstractor, including heat pipe, heat dissipation structure and clamping structure, and the at least partial embedding of heat pipe heat dissipation structure is used for setting heating device to one side of heat pipe away from heat dissipation structure, wherein, heat pipe includes contact area, condensing area and refrigerant, and contact area is communicated with condensing area, and the circulation flow of refrigerant is between contact area and condensing area. Contact area is used for contacting with heating device, and the refrigerant in contact area is used for absorbing the heat of heating device, and the at least partial of condensing area is located heating device outside, is used for cooling the refrigerant of heat absorption evaporation. Heat dissipation structure is used for with heating device detachable connection through clamping structure. Adopt the heat abstractor provided by the utility model, and the heat of heating device can be absorbed through heat pipe, and is quickly scattered through heat dissipation structure. And effectively simplify the connection mode of heat abstractor and heating device, increase the dismounting convenience between both, thereby effectively reduce the operation cost and maintenance cost of server.

Description

Technical Field

[0001] This utility model relates to the field of server technology, and in particular to a heat dissipation device. Background Technology

[0002] During operation, servers generate a significant amount of heat from their internal components. Currently, servers primarily employ air cooling or liquid cooling to ensure operational stability. However, to meet user demands for smaller, higher-performance servers, the internal space of server chassis is becoming increasingly compact. Continuing to use traditional air or liquid cooling systems would require increasing the number of airflow paths and fans within the chassis, or adding liquid cooling piping, to meet the server's cooling needs. This, in turn, increases the size of the server chassis. Furthermore, the connection between the cooling system and the heat-generating components becomes more complex, all of which contribute to increased operating and maintenance costs.

[0003] Therefore, how to effectively reduce the operating and maintenance costs of servers while meeting their heat dissipation efficiency requirements has become a pressing problem for those skilled in the art. Utility Model Content

[0004] This invention provides a heat dissipation device that effectively reduces the operating and maintenance costs of servers while meeting their heat dissipation efficiency requirements.

[0005] This invention provides a heat dissipation device, including a heat pipe, a heat dissipation structure, and a clamping structure. At least a portion of the heat pipe is embedded in the heat dissipation structure. A heating element is mounted on the side of the heat pipe facing away from the heat dissipation structure. The heat pipe includes a contact area, a condensation area, and a refrigerant, with the contact area and condensation area communicating with each other. The refrigerant circulates between the contact area and the condensation area. The contact area is used to contact the heating element, and the refrigerant within the contact area absorbs heat from the heating element. At least a portion of the condensation area is located outside the heating element and is used to cool the refrigerant that has absorbed heat and evaporated. The heat dissipation structure is detachably connected to the heating element via the clamping structure.

[0006] The heat dissipation device provided by this invention, because the heat-generating device is in contact with the heat pipe, and a heat dissipation structure is also provided on the side of the heat pipe away from the heat-generating device, and the heat dissipation structure and the heat-generating device are detachably connected via a clamping structure, allows the heat generated by the heat-generating device to be absorbed by the heat pipe and quickly dissipated through the heat dissipation structure. Furthermore, the detachable connection between the heat dissipation structure and the heat-generating device via the clamping structure effectively simplifies the connection method between the heat dissipation device and the heat-generating device, increasing the ease of assembly and disassembly, thereby effectively reducing the operating and maintenance costs of the server.

[0007] In one possible implementation of this invention, the clamping structure includes a connecting portion, a first bent portion, and a second bent portion. The connecting portion is located between and connected to the first and second bent portions. A heat dissipation structure and a heat-generating device are disposed between the first and second bent portions, and the first and second bent portions clamp the heat dissipation structure and the heat-generating device. This simplifies the clamping structure while achieving a reliable connection between the heat dissipation device and the heat-generating device. Furthermore, during server operation, this fixing method effectively reduces the risk of the heat dissipation device detaching from the heat-generating device due to vibration or shaking, thereby maintaining the stability of the heat dissipation device and ensuring that the heat generated by the heat-generating device can be promptly transferred to the heat dissipation structure and dissipated, thus improving the operational stability of the server.

[0008] In one possible implementation of this invention, a first limiting groove is provided on the side of the heat dissipation structure away from the heat pipe. At least a portion of the first bend or at least a portion of the second bend is embedded in the first limiting groove to improve the connection stability between the heat dissipation device and the heat-generating component.

[0009] In one possible implementation of this invention, the open end of the first bend has a first bend, and the first bend extends away from the second bend. The open end of the second bend has a second bend, and the second bend extends away from the first bend. When the clamping structure clamps the heat dissipation structure and the heat-generating device, the surfaces of the first and second bends away from the heat dissipation structure lift up. When the user needs to remove the clamping structure from the heat dissipation structure, the user does not need to use other tools; they only need to hold the bend at the open end and apply pulling force to quickly separate the clamping structure from the heat dissipation structure.

[0010] In one possible implementation of this invention, the heat dissipation device includes two heat pipes and two heat dissipation structures, with each heat pipe and structure corresponding to the other. A heating element is positioned between the two heat pipes. Understandably, one side of the heating element contacts the first heat pipe, and the other side contacts the second heat pipe, which helps to further improve the heat dissipation efficiency of the heating element.

[0011] In one possible implementation of this invention, the clamping structure includes a connecting portion, a first bent portion, and a second bent portion. The connecting portion is located between and connected to the first and second bent portions. Two heat dissipation structures are disposed between the first and second bent portions, and the first and second bent portions are used to clamp the two heat dissipation structures. This clamps the heat dissipation structures, heat pipes, and heating devices, thereby achieving a reliable connection between the heat dissipation device and the heating device.

[0012] In one possible implementation of this invention, a second limiting groove is provided on the side of the heat dissipation structure near the heat pipe, and at least a portion of the heat pipe is embedded in the second limiting groove. This further reduces the physical size of the heat dissipation device, improves its adaptability to the confined space within the server, and effectively reduces the server's volume and production costs. Furthermore, by positioning the heat dissipation structure within the second limiting groove, the connection stability between the heat pipe and the heat dissipation structure is improved, reducing the risk of misalignment between the heat pipe and the heat-generating device.

[0013] In one possible implementation of this invention, the surface of the heat dissipation structure facing away from the heat pipe has multiple grooves, which are spaced apart along the width of the grooves. On one hand, this further increases the heat dissipation surface area of ​​the heat dissipation structure; on the other hand, when air flows through the grooves, turbulence is generated, increasing the air velocity and further enhancing the thermal convection between the air and the heat generated by the heat-generating device. This promotes efficient heat transfer into the air, achieving effective heat dissipation for the heat-generating device.

[0014] In one possible implementation of this invention, the heat dissipation device further includes a thermally conductive patch, which is positioned between the heat-generating device and the heat pipe, and is used to contact the heat-generating device, the heat pipe, and the heat dissipation structure. Because the thermally conductive patch is relatively soft, it can effectively fill the gaps between the heat pipe and the heat-generating device, as well as between the heat dissipation structure and the heat-generating device, thus forming a stable contact between the thermally conductive patch and the heat-generating device, the heat pipe, and the heat dissipation structure, thereby increasing the contact area and improving heat dissipation efficiency.

[0015] In one possible implementation of this invention, the inner wall of the heat pipe is provided with a capillary structure, through which the liquid refrigerant in the condensation zone flows back to the contact zone. This effectively improves the adaptability of the heat dissipation device to confined spaces while simultaneously achieving refrigerant circulation between the contact zone and the condensation zone. Attached Figure Description

[0016] Figure 1 An exploded view of a structure of the heat dissipation device and heating element provided by this utility model;

[0017] Figure 2 for Figure 1 A schematic diagram showing the installation state of the provided heat dissipation device and the heat-generating component;

[0018] Figure 3 for Figure 1 A schematic diagram of a clamping structure for the provided heat dissipation device;

[0019] Figure 4 An exploded view of another structure of the heat dissipation device and heating element provided by this utility model;

[0020] Figure 5for Figure 4 A schematic diagram of the installation state of the provided heat dissipation device and heat-generating components.

[0021] Reference numerals: 01-Heating device; 011-Storage module; 1-Heat pipe; 11-Contact area; 12-Condensation area; 2-Heat dissipation structure; 21-First limiting groove; 22-Second limiting groove; 23-Groove; 3-Clamping structure; 31-Connecting part; 32-First bending part; 321-First bend; 33-Second bending part; 331-Second bend; 4-Thermal conductive patch. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this utility model are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the protection scope of this utility model. The accompanying drawings of the embodiments of this utility model are only for illustrating relative positional relationships and do not represent actual proportions.

[0023] It should be noted that specific details are set forth in the following description to facilitate understanding of this utility model. However, this utility model can be implemented in many ways other than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0024] During operation, servers generate a significant amount of heat from their internal components. Currently, servers primarily employ air cooling or liquid cooling to ensure operational stability. However, to meet user demands for smaller, higher-performance servers, the internal space of server chassis is becoming increasingly compact. Continuing to use traditional air or liquid cooling systems would require increasing the number of airflow paths and fans within the chassis, or adding liquid cooling piping, to meet the server's cooling needs. This, in turn, increases the size of the server chassis and complicates the connection between the cooling system and heat-generating components, both of which increase operating and maintenance costs.

[0025] In view of this, the heat dissipation device provided by this utility model dissipates heat from the server's heat-generating components through heat pipes without increasing the server's chassis size. The heat dissipation device with heat pipes is clamped to the heat-generating components to simplify the connection structure, thereby effectively reducing the server's operating and maintenance costs. To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe it in further detail with reference to the accompanying drawings and specific embodiments.

[0026] It should be noted that the heat dissipation device provided by this utility model can be used for heat dissipation of electronic devices. Taking a server as an example, this utility model provides a detailed description of the heat dissipation device. Specifically, this utility model does not limit the specific type of heat-generating device. For example, the heat-generating device can be a memory module, hard drive, central processing unit (CPU), graphics processing unit (GPU), etc.

[0027] Please refer to the above. Figure 1 and Figure 2 , Figure 1 An exploded view used to show a partial structure of the server; Figure 2 For display Figure 1 This is a schematic diagram illustrating the installation state of the heat dissipation device and the heat-generating device. The server includes a heat dissipation device and a heat-generating device 01. Specifically, the heat dissipation device includes a heat pipe 1, a heat dissipation structure 2, and a clamping structure 3. At least a portion of the heat pipe 1 is embedded in the heat dissipation structure 2, and the side of the heat pipe 1 facing away from the heat dissipation structure 2 is used to mount the heat-generating device 01, so that the heat pipe 1 can effectively absorb the heat generated by the heat-generating device 01. It should be noted that since the surface area of ​​the heat dissipation structure 2 is much larger than the surface area of ​​the heat pipe 1, placing the heat pipe 1 in the heat dissipation structure 2 helps to improve the heat dissipation efficiency of the device.

[0028] When specifically configuring heat pipe 1, such as Figure 1 As shown, heat pipe 1 is a sealed conduit comprising a contact area 11, a condensation area 12, and a refrigerant (not shown in the figure). The contact area 11 and the condensation area 12 are connected, and the refrigerant circulates between them. Specifically, the contact area 11 can be made to contact the heating surface of the heating element 01, allowing the refrigerant in the contact area 11 to evaporate by absorbing heat from the heating element 01. Furthermore, because the conduit is in a vacuum state, the boiling point of the refrigerant inside the pipe is lowered, which helps to improve the heat absorption efficiency of heat pipe 1.

[0029] At least a portion of the condensation zone 12 of the heat pipe 1 is located outside the heating element 01, meaning the condensation zone 12 is spaced apart from the heating surface of the heating element. Understandably, the temperature of the condensation zone 12, located outside the heating element 01, is lower than the temperature of the contact zone 11. Therefore, the evaporated gaseous refrigerant, due to its reduced density, will generate a pressure difference inside the heat pipe 1. Under this pressure difference, the gaseous refrigerant rapidly flows from the contact zone 11 to the condensation zone 12, and liquefies upon entering the condensation zone 12. The liquefied refrigerant can then continue flowing back to the contact zone 11 for use in the next round of evaporation and heat absorption.

[0030] Furthermore, in order to ensure that the liquid refrigerant flows smoothly back to the contact area 11, optionally, along the direction of gravity, the height of the condensation area 12 of the heat pipe 1 can be higher than the height of the contact area 11. Then, the liquid refrigerant in the condensation area 12 can flow back to the contact area 11 along the direction of gravity for the next round of evaporation and heat absorption.

[0031] Additionally, a capillary structure can be provided inside the heat pipe 1. An exemplary capillary structure can be a groove, located on the inner wall of the heat pipe 1, with its long side extending from the condensation zone 12 to the contact zone 11. The width and depth of the groove can be set according to the actual installation space and heat dissipation requirements, for example, a width of 30μm-100μm and a depth of 50μm-150μm. Alternatively, the capillary structure can be a wire mesh structure or a porous metal layer structure formed by high-temperature sintering. For example, the porosity of the porous metal layer structure is greater than or equal to 70%, and the pore size is less than 50μm. Thus, regardless of whether there is a height difference between the condensation zone 12 and the contact zone 11, the liquid refrigerant in the condensation zone 12 can flow back to the contact zone 11 under capillary force for the next round of evaporation and heat absorption. Furthermore, since no height difference is required between the condensation zone 12 and the contact zone 11, the space occupied by the heat pipe 1 can be effectively reduced, thereby effectively improving the adaptability of the heat dissipation device to confined spaces.

[0032] like Figure 2 As shown, the heat dissipation structure 2 is detachably connected to the heat-generating device 01 through the clamping structure 3, which can improve the connection stability between the heat dissipation device and the heat-generating device 01, while also improving the ease of disassembly and assembly of the heat dissipation device and the heat-generating device 01.

[0033] When specifically setting up clamping structure 3, such as Figure 3 As shown, Figure 3A schematic diagram illustrating the clamping structure 3. Optionally, the clamping structure 3 includes a connecting portion 31, a first bent portion 32, and a second bent portion 33. The connecting portion 31 is located between the first bent portion 32 and the second bent portion 33, and is connected to both. Specifically, the clamping structure 3 can be an integrally formed structure, such as a sheet metal structure, to improve overall strength. Furthermore, the open ends of the first bent portion 32 and the second bent portion 33 are close to each other, meaning the opening formed by the two open ends is smaller than the length of the connecting portion 31. Thus, after the heat dissipation structure 2 and the heat-generating device 01 are inserted between the first bent portion 32 and the second bent portion 33 through the opening, the open ends of both the first bent portion 32 and the second bent portion 33 apply pressure towards the heat dissipation structure 2 and the heat-generating device 01 to clamp them, thereby achieving a reliable connection between the heat dissipation device and the heat-generating device 01 while simplifying the clamping structure 3. In addition, during server operation, this fixing method can effectively reduce the risk of the heat dissipation device and the heat-generating device 01 becoming detached due to vibration and shaking, thereby maintaining the stability of the heat dissipation device and ensuring that the heat generated by the heat-generating device 01 can be transferred to the heat dissipation structure 2 in a timely manner and dissipated, so as to improve the operational stability of the server.

[0034] Understandably, when it is necessary to separate the heat dissipation device from the heat-generating device 01, only a pulling force needs to be applied to the clamping structure 3 to achieve quick separation of the clamping structure 3 from the heat dissipation device and the heat-generating device 01. This helps to improve the ease of disassembly and assembly of the heat dissipation device and the heat-generating device 01, thereby effectively reducing maintenance costs and shortening maintenance time.

[0035] In addition, continue to refer to Figure 3 The first bend 32 of the clamping structure 3 has a first bend 321 at its open end, and the first bend 321 extends away from the second bend 33; at the same time, the second bend 33 has a second bend 331 at its open end, and the second bend 331 extends away from the first bend 32. When the clamping structure 3 clamps the heat dissipation structure 2 and the heat-generating device 01, the first bend 321 and the second bend 331 lift up from the surface away from the heat dissipation structure 2. When the user needs to remove the clamping structure 3 from the heat dissipation structure 2, the user does not need to use other tools, but only needs to hold the bend at the open end and apply a pulling force to achieve quick separation of the clamping structure 3 from the heat dissipation structure 2.

[0036] It should be noted that the clamping structure 3 can be made of metal or plastic, as long as it meets the external force required for the connection between the heat dissipation device and the heat-generating device 01.

[0037] It is worth mentioning that, in one alternative implementation, reference is also made to... Figure 1 , Figure 2 and Figure 3The surface of the heat dissipation structure 2 facing away from the heat pipe 1 is provided with a first limiting groove 21. When the clamping structure 3 clamps the heat dissipation device and the heat-generating device 01, the first bending part 32 or the second bending part 33 of the clamping structure 3 can correspond to the first limiting groove 21 of the heat dissipation structure 2 and be embedded in the first limiting groove 21 to improve the connection stability between the heat dissipation device and the heat-generating device 01.

[0038] Please refer to the above. Figure 4 and Figure 5 , Figure 4 An exploded view used to show a partial structure of the server; Figure 5 For display Figure 4 This is a schematic diagram of the provided heat dissipation device and the installation state of the heat-generating device 01. In a specific embodiment, the heat dissipation device may further include two heat pipes 1 and two heat dissipation structures 2. For ease of explanation, the two heat pipes 1 can be defined as a first heat pipe 1 and a second heat pipe 1. It is understood that the outer contours of the first heat pipe 1 and the second heat pipe 1 may be the same or different. Furthermore, the two heat pipes 1 and the two heat dissipation structures 2 correspond one-to-one, that is, at least a portion of the first heat pipe 1 is embedded in a corresponding heat dissipation structure 2, and at least a portion of the second heat pipe 1 is embedded in a corresponding heat dissipation structure 2. The heat-generating device 01 is disposed between the two heat pipes 1. It is understood that one side of the heat-generating device 01 contacts the first heat pipe 1, and the other side of the heat-generating device 01 contacts the second heat pipe 1, which helps to further improve the heat dissipation efficiency of the heat-generating device 01.

[0039] Two heat dissipation structures 2 are disposed between the first bending portion 32 and the second bending portion 33. That is, after the two heat dissipation structures 2, the two heat pipes 1 and the heating device 01 are inserted between the first bending portion 32 and the second bending portion 33 through the opening, the open ends of the first bending portion 32 and the open ends of the second bending portion 33 apply pressure to the corresponding heat dissipation structure 2 to clamp the heat dissipation structure 2, the heat pipes 1 and the heating device 01, thereby realizing a reliable connection between the heat dissipation device and the heating device 01.

[0040] It is worth mentioning that at least a portion of the first bent portion 32 can be embedded in the first limiting groove 21 of a heat dissipation structure 2, while at least a portion of the second bent portion 33 can be embedded in the first limiting groove 21 of another heat dissipation structure 2, so as to improve the connection stability between the heat dissipation device and the heat-generating device 01.

[0041] Furthermore, this invention does not limit the shape of the heat pipe 1. When the heat-generating device 01 is exemplarily a memory module, multiple storage modules 011 may be disposed on the memory module, and the distribution positions of the multiple storage modules 011 are different, and the storage modules 011 generate heat. In addition, the memory module may also include capacitors and chips with different heights from the storage modules 011, and the heights of the multiple storage modules 011 may also differ. Therefore, when designing the shape of the heat pipe 1, it can be U-shaped, wavy, W-shaped, S-shaped, or grid-shaped, etc., so that the heat pipe 1 can cover all the storage modules 011 on the memory module as much as possible, and form a clearance with the capacitors and chips. This can effectively solve the assembly problem of easy interference between the heat dissipation device and capacitors and chips while meeting the heat dissipation requirements of the server, significantly improving the installation compatibility of the heat dissipation device in a compact space, that is, realizing the miniaturization design of the server and reducing the cost of the server.

[0042] like Figure 4 As shown, in one optional embodiment, a second limiting groove 22 is provided on the surface of the heat dissipation structure 2 near the heat pipe 1. At least a portion of the heat pipe 1 is embedded in the second limiting groove 22 to further compress the physical size of the heat dissipation device, improve the adaptability of the heat dissipation device to the narrow space inside the server, and effectively reduce the size of the server and lower production costs. In addition, by setting the heat dissipation structure 2 in the second limiting groove 22, the connection stability between the heat pipe 1 and the heat dissipation structure 2 can also be improved, reducing the risk of misalignment between the heat pipe 1 and the heat-generating device 01.

[0043] When the heat dissipation structure 2 is provided, for example, the heat dissipation structure 2 can be a plate structure, and the plate surface of the plate structure is provided with a second limiting groove 22, wherein the second limiting groove 22 can match the outer contour of the heat pipe 1 to further improve the stability of the heat pipe 1.

[0044] like Figure 5 As shown, since the surface of the heat dissipation structure 2 facing away from the heat pipe 1 is also provided with grooves 23, it can effectively increase the heat dissipation surface area of ​​the heat dissipation structure 2 and improve the heat dissipation efficiency.

[0045] It is worth mentioning that multiple grooves 23 can be provided on the surface of the heat dissipation structure 2 on the side opposite to the heat pipe 1, and along the width direction of the grooves 23 (e.g. Figure 5As shown in the Z-axis direction, multiple grooves 23 are arranged at intervals. For example, the grooves 23 can be elongated, and their length direction can be along the length of the heat pipe 1 or along its width; this invention does not impose specific limitations. Specifically, the depth of the grooves 23 can be set to h, the width to a, and the distance between two adjacent grooves 23 to d, where 0.4mm ≤ h ≤ 0.8mm, 1.5mm ≤ a ≤ 3mm, and 1mm ≤ d ≤ 2mm. Based on the principle of heat conduction, the above-mentioned microgroove 23 design can, on the one hand, increase the effective heat dissipation area of ​​the heat dissipation structure 2 by 40% compared to traditional heat dissipation plates; on the other hand, when air flows through the grooves 23, a stronger turbulence effect is generated, increasing the air velocity, which further enhances the thermal convection effect between the air and the heat generated by the heat-generating device 01, thus promoting efficient heat transfer to the air and achieving effective heat dissipation for the heat-generating device 01.

[0046] In one alternative implementation, reference is also made to Figure 1 or Figure 4 ,as well as Figure 5 The heat dissipation device may also include a thermally conductive pad 4, which may be made of thermally conductive silicone, thermally conductive graphite, or thermally conductive metal oxide, and is positioned between the heat-generating device 01 and the heat pipe 1. Because the thermally conductive pad 4 is relatively soft, this avoids a rigid connection between the heat pipe 1 and the heat-generating device 01, as well as between the heat dissipation structure 2 and the heat-generating device 01, thereby effectively improving the lifespan of the memory module and the heat dissipation device.

[0047] Furthermore, when the heat-generating device 01 is a memory module, due to the irregular height of the multiple storage modules 011 on the surface of the memory module, the thermal pad 4 can effectively fill the gaps between the heat pipe 1 and the memory module, as well as between the heat dissipation structure 2 and the memory module. This allows the thermal pad 4 to form a stable contact with the memory module, heat pipe 1, and heat dissipation structure 2, thereby increasing the contact area and improving heat dissipation efficiency. Specifically, when selecting the thermal pad 4, for example, it can be selected with a Shore hardness of Shore 00-30, a compression ratio greater than or equal to 30%, and a thermal conductivity of approximately 3 W / (mK). This ensures that the thermal conductivity of the thermal pad 4 is much higher than that of air, effectively reducing thermal resistance and allowing the heat generated by the memory module to be quickly transferred to the heat pipe 1, reducing the risk of heat accumulation at the memory module and thus improving the operational stability of the memory module.

[0048] In summary, the heat dissipation device provided by this utility model, since the heating surface of the heating element 01 is in contact with the heat pipe 1, and a heat dissipation structure 2 is also provided on the side of the heat pipe 1 away from the heating element 01, and the heat dissipation structure 2 is detachably connected to the heating element 01 through the clamping structure 3, can absorb the heat generated by the heating element 01 through the heat pipe 1 and quickly dissipate it through the heat dissipation structure 2. Furthermore, the detachable connection between the heat dissipation structure 2 and the heating element 01 through the clamping structure 3 effectively simplifies the connection method between the heat dissipation device and the heating element 01, increases the ease of assembly and disassembly, and thus effectively reduces the operating and maintenance costs of the server.

[0049] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A heat dissipation device, characterized in that, The system includes a heat pipe, a heat dissipation structure, and a clamping structure. At least a portion of the heat pipe is embedded in the heat dissipation structure. The side of the heat pipe facing away from the heat dissipation structure is used to mount a heat-generating device. The heat pipe includes a contact area, a condensation area, and a refrigerant, with the contact area and the condensation area connected; the refrigerant circulates between the contact area and the condensation area. The contact area is used to contact the heating element, and the refrigerant in the contact area is used to absorb the heat from the heating element; at least a portion of the condensation area is located outside the heating element and is used to cool the refrigerant that has absorbed heat and evaporated. The heat dissipation structure is used to detachably connect to the heat-generating device via the clamping structure.

2. The heat dissipation device according to claim 1, characterized in that, The clamping structure includes a connecting part, a first bending part, and a second bending part. The connecting part is located between the first bending part and the second bending part and is connected to the first bending part and the second bending part. The first bend and the second bend are used to arrange the heat dissipation structure and the heat-generating device, and the first bend and the second bend are used to clamp the heat dissipation structure and the heat-generating device.

3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation structure has a first limiting groove on the side away from the heat pipe; at least a portion of the first bend or at least a portion of the second bend is embedded in the first limiting groove.

4. The heat dissipation device according to claim 2, characterized in that, The open end of the first bend has a first bend, and the first bend extends away from the second bend; the open end of the second bend has a second bend, and the second bend extends away from the first bend.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device includes two heat pipes and two heat dissipation structures, and the two heat pipes and the two heat dissipation structures correspond one-to-one; the heat-generating device is disposed between the two heat pipes.

6. The heat dissipation device according to claim 5, characterized in that, The clamping structure includes a connecting part, a first bending part, and a second bending part. The connecting part is located between the first bending part and the second bending part and is connected to the first bending part and the second bending part. The two heat dissipation structures are disposed between the first bend and the second bend, and the first bend and the second bend are used to clamp the two heat dissipation structures.

7. The heat dissipation device according to claim 1, characterized in that, The heat dissipation structure has a second limiting groove on the side near the heat pipe, and at least a portion of the heat pipe is embedded in the second limiting groove.

8. The heat dissipation device according to claim 1, characterized in that, The surface of the heat dissipation structure opposite to the heat pipe is provided with multiple grooves, and the multiple grooves are arranged at intervals along the width direction of the grooves.

9. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device further includes a thermally conductive patch, which is positioned between the heat-generating device and the heat pipe, and is used to contact the heat-generating device, the heat pipe, and the heat dissipation structure.

10. The heat dissipation device according to claim 1, characterized in that, The inner wall of the heat pipe is provided with a capillary structure, through which the liquid refrigerant in the condensation zone flows back to the contact zone.

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