High-efficiency computer heat-conducting and radiating device

Abstract

The application belongs to the technical field of computers and discloses a high-efficiency computer heat-conducting and heat-dissipating device, which comprises a base plate, the bottom of the base plate is provided with an inner plate, the bottom of the inner plate is provided with a bottom plate, the bottom of the bottom plate is provided with multiple groups of fins at equal intervals, the bottom of the fins is provided with a copper plate, the top of the base plate is provided with multiple groups of outer copper pipes at equal intervals, and the top of the outer copper pipes is provided with a top plate. The combination of layered heat dissipation and precise heat transfer ensures that heat can be quickly and orderly transferred from a heat source to a heat-dissipating end, greatly improves heat-dissipating efficiency, effectively avoids the problem of computer performance decline caused by heat accumulation in the traditional heat-dissipating mode, and guarantees long-time stable operation of the computer.

Description

Technical Field

[0001] This application relates to the field of computer technology, and more specifically, to a high-efficiency computer heat dissipation device. Background Technology

[0002] Heat dissipation is a crucial aspect of computer operation. Various electronic components inside a computer, such as the CPU and GPU, generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, the component temperatures will continue to rise. High temperatures can severely impact the performance and lifespan of electronic components. For example, it may cause the CPU to throttle, resulting in slower computer operation, software lag, and even system instability, leading to crashes, blue screens, and other problems. Prolonged exposure to high temperatures also accelerates the aging of electronic components, shortening the overall lifespan of the computer. Therefore, to ensure stable and efficient computer operation, it is essential to equip the computer with high-performance heat dissipation devices that can effectively remove heat, maintain a suitable internal temperature environment, and ensure that all components operate within their normal temperature range, thereby guaranteeing the computer's performance and reliability.

[0003] However, traditional computer heat dissipation technologies have many drawbacks. First, their heat dissipation efficiency is low. Traditional cooling devices mostly use a simple combination of heat sinks and fans. The contact area between the heat sink and the heat-generating components is limited, making it impossible to quickly and fully absorb heat. Furthermore, the cooling capacity of the fans is relatively insufficient, making it difficult to cope with the ever-increasing heat generation of today's high-performance computers. Second, the heat dissipation structure design is not reasonable enough. Traditional designs often fail to fully consider the complex spatial layout and heat distribution inside the computer, leading to localized heat accumulation during transfer and preventing even and effective dissipation. In addition, traditional cooling devices are limited in their material selection, often using ordinary metals with limited thermal conductivity, which cannot meet the demands of rapid heat dissipation. These shortcomings cause the computer temperature to rise rapidly when running large programs or performing multitasking, severely impacting the computer's operating speed and stability.

[0004] Qualitatively, this also significantly shortens the lifespan of hardware, increases user maintenance costs and the frequency of equipment replacement, and restricts further improvement of computer performance and expansion of application scenarios. Therefore, this application proposes an efficient computer heat conduction and dissipation device to solve the above-mentioned problems. Utility Model Content

[0005] To address the aforementioned problems, this application provides a high-efficiency computer heat dissipation device.

[0006] The high-efficiency computer heat dissipation device provided in this application adopts the following technical solution:

[0007] A high-efficiency computer heat dissipation device, comprising:

[0008] A substrate, wherein an inner plate is mounted on the bottom of the substrate, a bottom plate is mounted on the bottom of the inner plate, a plurality of fins are equidistantly mounted on the bottom of the bottom plate, a copper plate is mounted on the bottom of the fins, a plurality of outer copper tubes are equidistantly mounted on the top of the substrate, and a top plate is mounted on the top of the outer copper tubes.

[0009] The top of the substrate is provided with multiple sets of through holes at equal intervals.

[0010] Furthermore, the inner plate has multiple sets of rectangular through holes equidistantly arranged inside, and the inner plate includes a copper foil layer, an insulating layer, and a covering layer.

[0011] Through the above technical solution, when heat is transferred from computer components to the inner board, these rectangular through-holes can guide airflow or liquid flow to be distributed more evenly, thereby enhancing the convective heat dissipation effect and allowing heat to be transferred more quickly to other heat dissipation components of the device. The inner board consists of a copper foil layer, an insulating layer, and a cover layer. This structural design further enhances the linkage between heat dissipation and electrical performance. The copper foil layer, with its excellent thermal conductivity, quickly absorbs heat from the computer components and transfers it to the insulating layer. The insulating layer not only prevents electrical interference between different circuits, ensuring the normal operation of the computer, but also controls the direction of heat transfer to a certain extent, guiding heat towards the cover layer. The cover layer protects the internal structure from external factors, ensuring the stability of the entire inner board structure and maintaining efficient heat dissipation performance. These three layers work together, synergistically with the rectangular through-holes, to achieve effective linkage between heat dissipation and electrical safety, ensuring stable operation of the computer while achieving efficient heat dissipation.

[0012] Furthermore, the base plate has two sets of side plates on both sides, and one end of the side plate is fixedly connected to the base plate and the inner plate.

[0013] Through the above technical solution, the side panel tightly connects the bottom plate, base plate, and inner plate together, ensuring that the components will not shift relative to each other due to vibration or other external forces during computer operation. This guarantees the stability of the entire heat dissipation device structure, allowing the heat dissipation process to continue stably. The side panel can guide the air blown by the fan to specific areas, making the air flow more concentrated over the fins and other heat dissipation components, enhancing the heat dissipation effect. Moreover, the side panel is tightly connected to the inner plate, allowing some of the heat absorbed by the inner plate to be transferred to the bottom plate through the side panel, increasing the heat transfer path. The fins installed on the bottom plate can then quickly dissipate the heat transferred from the inner plate and side panel. This tight connection between components and the linkage of heat transfer achieved through the side panel optimizes the heat dissipation efficiency of the entire heat dissipation device, ensuring that all heat dissipation components work together during long-term computer operation, effectively reducing the internal temperature of the computer.

[0014] Furthermore, the two ends of the fin are provided with two sets of side interfaces, and the inner side of the side interfaces adopts a trapezoidal structure. The front sides of the fin are provided with two sets of mounting holes, and the interior of the mounting holes adopts a threaded structure.

[0015] The aforementioned technical solution utilizes threaded mounting holes on both sides of the fins' front side, facilitating secure installation of the fins onto the base plate or other related components using screws and other connectors. This robust installation method ensures the stability of the fins during heat dissipation, preventing loosening due to vibration or other factors that could affect heat dissipation. Furthermore, the screw connection allows for flexible adjustment of the fin's mounting angle and spacing according to actual heat dissipation needs, optimizing airflow and heat dissipation efficiency. When air flows over the fins, adjusting the fin spacing and angle better utilizes aerodynamic principles, enhancing air convection and enabling the fins to more effectively dissipate heat into the surrounding environment. The fins, through side interfaces and mounting holes, are tightly integrated with other components, significantly improving the overall heat dissipation performance of the cooling system.

[0016] Furthermore, the bottom of the copper plate is provided with inwardly recessed grooves at equal intervals, and multiple sets of heat-conducting plates are installed on the bottom of the copper plate through the grooves, and the heat-conducting plates are made of aluminum.

[0017] Through the above technical solution, the heat-conducting plate is made of aluminum. Aluminum's excellent thermal conductivity and relatively light weight allow it to efficiently dissipate the heat transferred from the copper plate during the heat dissipation process. The larger surface area of ​​the aluminum heat-conducting plate increases the contact area with air, promoting air convection heat dissipation.

[0018] In the entire cooling system, heat is transferred sequentially from the computer components through the inner plate, base plate, and fins to the copper plate, then from the copper plate to the heatsink, and finally dissipated into the surrounding environment. This process, with the close cooperation between the copper plate and the heatsink, achieves highly efficient heat transfer. Furthermore, the lightweight design of the aluminum heatsink helps reduce the overall weight of the cooling system without compromising heat dissipation performance, making its installation inside the computer easier and contributing to the overall portability and stability of the computer.

[0019] Furthermore, the inner side of the outer copper tube is provided with a graphene coating, and the inner copper tube is provided inside the graphene coating.

[0020] Through the above technical solution, the inner copper pipe, acting as the initial heat receiving component, is in close contact with the computer's heat-generating components and is responsible for introducing heat into the outer copper pipe. The graphene coating then builds an efficient heat transfer bridge between the inner and outer copper pipes, allowing the heat absorbed by the inner copper pipe to be quickly transferred to a larger surface area of ​​the outer copper pipe, and then dissipated through the outer copper pipe. For example, when the computer's CPU generates a large amount of heat, the inner copper pipe absorbs the heat, and the graphene coating quickly transfers the heat to the outer copper pipe, which then transfers the heat to the top plate or surrounding air for heat dissipation. This structure, composed of the inner copper pipe, graphene coating, and outer copper pipe, achieves highly efficient linkage from heat collection to transfer to dissipation, greatly improving the heat dissipation speed and efficiency of the entire heat dissipation device, ensuring that the computer can dissipate heat effectively and promptly under high load, maintaining a stable operating temperature.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] (1) This device constructs a complex and orderly layered heat dissipation system. Starting from the substrate that is in contact with the computer's heat-generating components, the heat passes through the inner plate, bottom plate, fins, copper plate and heat-conducting plate in sequence. Each layer is optimized for heat transfer and heat dissipation. The fins are tightly connected to other components through a unique side interface trapezoidal structure to reduce thermal resistance and achieve precise heat transfer. This combination of layered heat dissipation and precise heat transfer ensures that heat can be transferred quickly and orderly from the heat source to the heat dissipation end, greatly improving heat dissipation efficiency and effectively avoiding the problem of computer performance degradation caused by heat accumulation in traditional heat dissipation methods, ensuring that the computer can operate stably for a long time.

[0023] (2) This device uses advanced materials in many places, which significantly improves the heat dissipation capacity. For example, the graphene coating on the inner side of the outer copper tube can quickly diffuse the heat absorbed by the inner copper tube along the inner wall of the outer copper tube by utilizing the ultra-high thermal conductivity of graphene, which greatly accelerates the heat transfer speed. The good thermal conductivity of the copper plate can quickly transfer the heat to the aluminum heat-conducting plate. The aluminum material not only has good thermal conductivity, but also has the advantages of light weight and low cost. Its large surface area can effectively promote air convection heat dissipation. The application of these advanced materials has optimized all aspects from heat conduction to heat dissipation. Compared with traditional heat dissipation technology, it can dissipate the heat generated by the computer more quickly and effectively, reduce the internal temperature of the computer, extend the service life of the computer hardware, and reduce the risk of system failure caused by high temperature, thereby improving the overall reliability and stability of the computer. Attached Figure Description

[0024] Figure 1 is a three-dimensional structural schematic diagram of this application;

[0025] Figure 2 is a schematic diagram of the three-dimensional structure of the outer copper tube in this application;

[0026] Figure 3 is a schematic diagram of the external copper tube structure of this application;

[0027] Figure 4 is a schematic diagram of the three-dimensional structure of the fins in this application.

[0028] Explanation of the labels in the diagram: 1. Substrate; 2. Inner plate; 3. Bottom plate; 4. Side plate; 5. Fin; 501. Side interface; 502. Mounting hole; 6. Copper plate; 7. Heat-conducting plate; 8. Outer copper tube; 801. Graphene coating;

[0029] 802. Inner copper tube; 9. Top plate. Detailed Implementation

[0030] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must be...

[0032] It must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] Example:

[0035] The present application will be further described in detail below with reference to Figures 1-2.

[0036] This application discloses a high-efficiency computer heat dissipation device, comprising:

[0037] A substrate 1 has an inner plate 2 installed at its bottom, a bottom plate 3 installed at its bottom, multiple sets of fins 5 installed at equal intervals at the bottom of the bottom plate 3, a copper plate 6 installed at the bottom of the fins 5, multiple sets of outer copper tubes 8 installed at equal intervals at the top of the substrate 1, and a top plate 9 installed at the top of the outer copper tubes 8.

[0038] Multiple sets of through holes are provided at equal intervals on the top of the substrate 1.

[0039] Referring to Figure 1, the inner plate 2 has multiple sets of rectangular through holes arranged at equal intervals inside, and the inner plate 2 includes a copper foil layer, an insulating layer and a covering layer.

[0040] Referring to Figure 1, the base plate 3 has two sets of side plates 4 on both sides, and one end of the side plate 4 is connected to the base plate 1 and the inner plate.

[0041] 2. Fixed connection.

[0042] See Figure 4 Two sets of side interfaces 501 are provided at both ends of the fin 5, and the inner side of the side interface 501 adopts a trapezoidal structure. Two sets of mounting holes 502 are provided on both sides of the front of the fin 5, and the interior of the mounting holes 502 adopts a threaded structure.

[0043] Referring to Figure 1, the bottom of the copper plate 6 is provided with inwardly recessed grooves at equal intervals. Multiple sets of heat-conducting plates 7 are installed on the bottom of the copper plate 6 through the grooves, and the heat-conducting plates 7 are made of aluminum.

[0044] See Figure 2 and Figure 3 The inner side of the outer copper tube 8 is provided with a graphene coating 801, and the inner copper tube 802 is provided inside the graphene coating 801.

[0045] The implementation principle of the high-efficiency computer heat dissipation device in this application embodiment is as follows: The heat generated by the computer operation is first transferred to the substrate 1, which is in close contact with the heat-generating components. Multiple sets of through holes equidistantly arranged on the top of the substrate 1 can initially promote air circulation and remove some heat. At the same time, the substrate 1 conducts most of the heat downward to the inner plate 2. Multiple sets of rectangular through holes equidistantly arranged inside the inner plate 2 play an important role in the heat dissipation process. Through these rectangular through holes, air or coolant can flow more smoothly in the inner plate 2 if the device adopts liquid cooling, enhancing the convective heat dissipation effect. The inner plate 2 is composed of a copper foil layer, an insulating layer, and a cover layer. The copper foil layer quickly absorbs the heat transferred from the substrate 1 due to its good thermal conductivity and transfers it to the insulating layer. The insulating layer prevents electrical interference between circuits to ensure the normal operation of the computer and guides the heat to the cover layer. The cover layer protects the internal structure of the inner plate 2 and ensures efficient heat transfer. Through this structural linkage, the inner plate 2 stably transfers heat downward to the bottom plate 3. One end of the side plates 4 on both sides of the bottom plate 3 is connected to the substrate 1 and the inner plate 2. The fixed connection forms a stable frame structure. The side plate 4 not only provides structural support for the entire device, ensuring that components do not shift due to vibration during operation, but also guides heat dissipation. For example, in air-cooled conditions, the side plate 4 can guide the airflow from the fan to flow more concentratedly across the fins 5, enhancing heat dissipation. Simultaneously, some of the heat transferred by the inner plate 2 is conducted through the side plate 4 to the base plate 3, and then from the base plate 3 to the fins 5, which are equidistantly mounted at their bottom. The side interfaces 501 at both ends of the fins 5 adopt a trapezoidal structure, facilitating tight connection with the side plate 4 or other heat dissipation channels for efficient heat transfer. The trapezoidal structure provides a larger contact area, reducing thermal resistance and allowing heat to be smoothly transferred from the base plate 3 to the fins 5. The fins 5 have threaded mounting holes 502 on both sides of their front, allowing them to be securely mounted on the base plate 3 using screws or other connectors, ensuring the stability of the fins 5 during heat dissipation. With a large surface area, it can fully exchange heat with the air when air flows through it, dissipating heat into the surrounding environment. The fins 5 transfer heat to the copper plate 6 at the bottom. The equidistant, inwardly recessed grooves on the bottom of the copper plate 6 provide precise positioning for the heat-conducting plate 7, ensuring a tight fit between the heat-conducting plate 7 and the copper plate 6, reducing thermal resistance and improving heat transfer efficiency.

[0046] The excellent thermal conductivity allows heat to be quickly transferred to the aluminum heat-conducting plate 7. Due to its large surface area and good thermal conductivity, the aluminum heat-conducting plate 7 further increases the contact area with the air, promotes air convection heat dissipation, and efficiently dissipates the heat. At the top of the device, the inner side of the outer copper tube 8 is provided with a graphene coating 801, and an inner copper tube 802 is provided inside. The inner copper tube 802 is in close contact with the computer's heat-generating components, such as through a heat pipe connection. After absorbing heat, it is transferred to the graphene coating 801. With its ultra-high thermal conductivity, the graphene coating 801 quickly diffuses the heat along the inner wall of the outer copper tube 8, allowing the heat to be quickly transferred to a larger surface area of ​​the outer copper tube 8, and then transferred to the top plate 9 through the outer copper tube 8, and finally dissipated into the surrounding environment.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-efficiency computer heat dissipation device, characterized in that, include: A substrate (1) has an inner plate (2) installed at the bottom of the substrate (1), a bottom plate (3) installed at the bottom of the inner plate (2), a plurality of fins (5) are installed at equal intervals at the bottom of the bottom plate (3), a copper plate (6) is installed at the bottom of the fins (5), a plurality of outer copper tubes (8) are installed at equal intervals at the top of the substrate (1), and a top plate (9) is installed at the top of the outer copper tubes (8). The top of the substrate (1) is provided with multiple sets of through holes at equal intervals; The two ends of the fin (5) are provided with two sets of side interfaces (501), and the inner side of the side interface (501) adopts a trapezoidal structure. The two sides of the front of the fin (5) are provided with two sets of mounting holes (502), and the interior of the mounting holes (502) adopts a threaded structure. The bottom of the copper plate (6) is provided with inwardly recessed grooves at equal intervals. Multiple sets of heat-conducting plates (7) are installed on the bottom of the copper plate (6) through the grooves, and the heat-conducting plates (7) are made of aluminum.

2. The high-efficiency computer heat dissipation device according to claim 1, characterized in that: The inner plate (2) has multiple sets of rectangular through holes arranged at equal intervals inside, and the inner plate (2) includes a copper foil layer, an insulating layer and a covering layer.

3. The high-efficiency computer heat dissipation device according to claim 1, characterized in that: The base plate (3) has two sets of side plates (4) on both sides, and one end of the side plate (4) is fixedly connected to the base plate (1) and the inner plate (2).

4. The high-efficiency computer heat dissipation device according to claim 1, characterized in that: The inner side of the outer copper tube (8) is provided with a graphene coating (801), and the inner copper tube (802) is provided inside the graphene coating (801).

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