A structure for preventing tin leakage of a heat sink

Abstract

This utility model relates to the technical field of graphics card heat dissipation devices, and in particular to a heat sink anti-solder leakage structure, including a plurality of fins fixedly connected by a bracket; heat pipe holes and solder injection holes are opened on the end faces of the plurality of fins along their length direction, the solder injection holes are connected above the heat pipe holes, an upper flange is installed inside the heat pipe holes, and a heat pipe is installed inside the upper flange; wherein, a solder storage structure is also provided on the end face of the fins below the upper flange. In this utility model, by adding a lower flange to the traditional single flange, some solder paste flows out during soldering, and the solder paste flows outward along the opening of the upper flange, and finally overflows into the lower flange for collection. This design achieves that all the solder balls flowing out from the upper flange are collected inside the lower flange and will not flow outward into the fins.

Description

Technical Field

[0001] This utility model relates to the technical field of graphics card heat dissipation devices, and in particular to a heat sink structure to prevent solder leakage. Background Technology

[0002] With the continuous increase in power consumption and heat generation of high-performance chips, efficient heat dissipation has become crucial for ensuring the stable operation of computer graphics cards and other devices. Heat pipe coolers, with their excellent thermal conductivity, have become the mainstream cooling solution. Their core technology involves soldering heat pipes to densely packed heat sink fins using solder paste to achieve efficient heat conduction.

[0003] In existing technologies, heat sink fins typically employ a single-sided flange structure, meaning only one side of the metal sheet is bent to wrap around the heat pipe. However, this structure presents a significant drawback during soldering. After soldering, the molten solder paste easily overflows from the gap on the other side of the flange where it contacts the heat pipe, under the influence of gravity. The overflowing solder cools and solidifies between adjacent fins, forming irregular solder beads. These solder beads not only block crucial airflow channels between the heat sink fins, severely weakening air convection and significantly reducing heat dissipation efficiency, but also result in poor product appearance, impacting market competitiveness.

[0004] Therefore, in order to further reduce solder leakage during solder paste soldering, we propose a heat sink structure to prevent solder leakage. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a structure for preventing solder leakage in a heat sink.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: Design a heat sink structure to prevent solder leakage, comprising several fins fixedly connected by a bracket; A heat pipe hole and a solder injection hole are provided on the end face of a plurality of the fins along their length direction. The solder injection hole is connected above the heat pipe hole. An upper flange is installed inside the heat pipe hole, and a heat pipe is installed inside the upper flange. A tin storage structure is also provided on the end face of the fin below the upper flange.

[0007] Furthermore, the tin storage structure includes a lower flange, and mounting holes are provided on the end faces of several fins along the length direction, and the lower flange is fixedly installed in the mounting holes.

[0008] Furthermore, the lower flange, the upper flange, and the plurality of fins together form a plurality of tin storage spaces.

[0009] Furthermore, both the upper and lower flanges are arc-shaped and concentrically arranged, and the inner diameter of the lower flange is a multiple of the inner diameter of the upper flange.

[0010] Furthermore, the mounting hole is configured as an arc-shaped hole, and the width of the arc-shaped hole is greater than the thickness of the lower flange.

[0011] Furthermore, the upper flange has an opening at its top, which is opposite to and communicates with the solder injection hole.

[0012] The present invention proposes a heat sink anti-solder leakage structure, the beneficial effect of which is that, in addition to the traditional single flange design, a lower flange is added. During soldering, some solder paste flows out and flows outward along the opening of the upper flange, finally overflowing into the lower flange for collection. This design ensures that all the solder balls flowing out from the upper flange are collected inside the lower flange, preventing them from flowing outward into the fins. This solves the problem in the prior art where solder paste flows out and accumulates between the fins, forming solder balls that block the airflow and affect the appearance. Attached Figure Description

[0013] Figure 1 This is a perspective view of the present utility model; Figure 2 for Figure 1 A magnified structural diagram of area A; Figure 3 This is a schematic diagram of the solder injection hole structure of this utility model; Figure 4 This is a schematic cross-sectional view of the heat pipe structure of this utility model; Figure 5 for Figure 4 A magnified structural diagram of region B.

[0014] In the diagram: 1. Fin; 10. Support; 11. Heat pipe hole; 12. Solder filling hole; 13. Mounting hole; 2. Upper flange; 21. Opening; 3. Heat pipe; 4. Solder storage structure; 41. Lower flange; 42. Solder storage space. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Reference Figure 1-5As one embodiment of this utility model, it discloses a structure for preventing solder leakage in a heat sink. Specifically, the heat sink includes a plurality of fins 1 fixedly connected by a bracket 10. A heat-conducting copper plate can be fixedly installed between the bottoms of the plurality of fins 1. The heat-conducting copper plate contacts heat-generating components such as GPUs on the PCB, thereby transferring heat to the space between the fins 1. This method is a conventional approach for those skilled in the art and will not be described in detail here. Heat pipe holes 11 and solder injection holes 12 are provided on the end faces of several fins 1 along their length direction. The solder injection holes 12 are connected above the heat pipe holes 11. An upturned edge 2 is installed inside the heat pipe holes 11. The upturned edge 2 passes through the space between multiple fins 1. A heat pipe 3 is installed inside the upturned edge 2. The heat pipe 3 is in contact with the heat-conducting copper plate to achieve uniform heat transfer. Among them, a tin storage structure 4 is also provided on the end face of the fin 1 below the upper flange 2.

[0017] In some embodiments, the tin storage structure 4 of the present invention includes a lower flange 41, and mounting holes 13 are provided on the end faces of a plurality of fins 1 along the distributed length direction. The lower flange 41 is fixedly installed in the mounting holes 13. That is, the lower flange 41 in this embodiment also penetrates through a plurality of fins 1. In addition, the lower flange 41 in this embodiment is located below the upper flange 2.

[0018] Specifically, when soldering fin 1 and heat pipe 3 with solder paste, the solder injection hole 12 is opened for the solder injection tube to enter. After the solder injection is completed, the fin 1 and heat pipe 3 are soldered and fixed by heating. Of course, some solder paste will flow out after the soldering is completed. The solder paste will flow outward along the opening of the upper flange 2 and finally overflow into the lower flange 41 for collection. This design ensures that all the solder balls flowing out from the upper flange 2 are collected inside the lower flange 41 and will not flow outward into the fins 1. This solves the problem in the prior art where solder paste flows out and accumulates between the fins 1, forming solder balls, causing airflow blockage and affecting the appearance.

[0019] Based on the above embodiments, in this embodiment, the lower flange 41, the upper flange 2, and the fins 1 form a plurality of solder storage spaces 42. Through the design of the solder storage spaces 42, the solder paste can be conveniently stored, greatly reducing the possibility of its flow.

[0020] Furthermore, in this embodiment, both the upper flange 2 and the lower flange 41 are arc-shaped and concentrically arranged, and the inner diameter of the lower flange 41 is 1.5 times the inner diameter of the upper flange 2.

[0021] In an optional embodiment, the inner diameter of the upper flange 2 is 6mm, and the inner diameter of the lower flange 41 is required to be set to 9mm. The larger inner diameter design can meet the solder storage space requirements, and at the same time effectively ensure that the solder paste flows smoothly into the solder storage space 42 along the upper opening of the upper flange 2. In some embodiments, the mounting hole 13 in this invention is configured as an arc-shaped hole, the width of which is greater than the thickness of the lower flange 41. The design of a larger width mounting hole 13 facilitates the installation of the lower flange 41.

[0022] Furthermore, the upper flange 2 of this utility model has an opening 21 on its upper side. The opening 21 and the solder injection hole 12 are arranged opposite to each other and communicate with each other. Preferably, in this embodiment, the width of the opening 21 is the same as the bottom opening width of the solder injection hole 12, so as to ensure that the solder paste can smoothly contact the heat pipe along the opening 21. Moreover, the lower flange 41 of this utility model is set as a semi-circular structure.

[0023] In summary, this invention adds a lower flange 41 to the traditional single flange design. During soldering, some solder paste flows out and flows outward along the opening of the upper flange 2, eventually overflowing into the lower flange 41 for collection. This design ensures that all solder balls flowing out from the upper flange 2 are collected inside the lower flange 41, preventing them from flowing outward into the fins 1. This solves the problem in the prior art where solder paste flows out and accumulates between the fins 1, forming solder balls that block the air duct and affect the appearance.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A structure for preventing solder leakage in a heat sink, characterized in that, Includes several fins (1) fixedly connected by a bracket (10); A heat pipe hole (11) and a solder injection hole (12) are provided on the end face of a plurality of fins (1) along the length direction of their distribution. The solder injection hole (12) is connected above the heat pipe hole (11). An upper flange (2) is installed inside the heat pipe hole (11). A heat pipe (3) is installed inside the upper flange (2). Among them, a tin storage structure (4) is provided on the end face of the fin (1) below the upper flange (2).

2. The structure for preventing solder leakage in a heat sink according to claim 1, characterized in that: The tin storage structure (4) includes a lower flange (41), and mounting holes (13) are provided on the end faces of a plurality of fins (1) along the length direction of the distribution. The lower flange (41) is fixedly installed in the mounting holes (13).

3. The structure for preventing solder leakage in a heat sink according to claim 2, characterized in that: The lower flange (41), the upper flange (2), and the fins (1) together form a plurality of tin storage spaces (42).

4. The structure for preventing solder leakage in a heat sink according to claim 2, characterized in that: The upper flange (2) and the lower flange (41) are both arc-shaped and concentrically arranged, and the inner diameter of the lower flange (41) is 1.5 times the inner diameter of the upper flange (2).

5. A heat sink anti-solder leakage structure according to claim 2, characterized in that: The mounting hole (13) is configured as an arc-shaped hole, and the width of the arc-shaped hole is greater than the thickness of the lower flange (41).

6. The structure for preventing solder leakage in a heat sink according to claim 1, characterized in that: The upper flange (2) has an opening (21) on its upper surface, and the opening (21) and the solder injection hole (12) are arranged opposite to each other and connected.

Images