Liquid cooling plate high thermal conductivity structure

Abstract

This invention discloses a high thermal conductivity structure for a liquid cooling plate, comprising: a liquid cooling plate body and several heat-conducting components. The liquid cooling plate body has a non-communicating heat-conducting inner cavity and a heat-conducting outer cavity. The heat-conducting outer cavity surrounds the heat-conducting inner cavity, and the heat-conducting inner cavity is used to store a first coolant. The heat-conducting outer cavity includes a liquid inlet channel with a liquid inlet. The liquid inlet channel is connected to one side of the heat-conducting inner cavity but not interconnected. The heat-conducting components are transversely disposed within the liquid inlet channel, and one end of the heat-conducting component passes through the side wall of the heat-conducting inner cavity into the heat-conducting inner cavity. This invention can rapidly melt the second coolant that has frozen due to residue in the heat-conducting outer cavity under extremely cold conditions. Under high-temperature conditions, it can allow the heat from the GPU to be rapidly diffused to the entire liquid cooling plate through the heat-conducting components, allowing the overall temperature of the liquid cooling plate to rise rapidly, thereby evaporating the water vapor on the surface of the liquid cooling plate and preventing the formation of residual water droplets.

Description

Technical Field

[0001] This utility model relates to the field of server technology, specifically to a liquid cooling plate with high thermal conductivity structure. Background Technology

[0002] Graphics Processing Units (GPUs) consume more power due to their massively parallel computing capabilities. As GPU power consumption continues to rise, efficient heat dissipation solutions become crucial. Therefore, current GPU cooling methods typically employ liquid cooling. Liquid cooling primarily achieves heat transfer through the circulation of coolant. For example, in patent document CN120568687A, the method involves a liquid working fluid entering the cooling chamber through an inlet and fully combining with the micro ribs to carry away heat transferred from the GPU core to the micro ribs and then to the working fluid. During the heat transfer process, the working fluid reaches its boiling point and transforms into a gaseous state before being discharged from the cooling device through an outlet. The heat from the memory module is conducted to the bottom ribs through thermally conductive materials and is ultimately carried away by the air.

[0003] Therefore, the inventors discovered in their research that in extremely cold environments, when the GPU is not running, the cooling water remaining in the liquid cooling plate will freeze into ice. When the GPU starts running, it generates a large amount of heat that is difficult to melt in a short time, making it difficult for the water to dissipate heat quickly. In addition, the instantaneous high temperature will also vaporize the ice inside, causing the pressure inside the liquid cooling plate to increase instantly and causing safety issues. In high-temperature environments, the coolant is usually around 6°-7°C. The temperature difference between the coolant and the environment will cause water droplets to easily condense on the surface of the liquid cooling plate, causing short circuits or other hidden dangers. Utility Model Content

[0004] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this utility model is to provide a high thermal conductivity liquid-cooled plate structure, comprising:

[0005] The liquid cooling plate has a non-communicating heat-conducting inner cavity and a heat-conducting outer cavity, the heat-conducting outer cavity surrounds the heat-conducting inner cavity, and the heat-conducting inner cavity is used to store a first coolant.

[0006] The heat-conducting outer cavity includes a liquid inlet channel, which is provided with a liquid inlet. The liquid inlet channel is connected to one side of the heat-conducting inner cavity but not interconnected.

[0007] Several heat-conducting components are provided, which are arranged transversely in the liquid inlet channel, and one end of the heat-conducting component passes through the side wall of the heat-conducting inner cavity into the heat-conducting inner cavity.

[0008] Preferably, the adjacent heat-conducting elements are inclined to each other and arranged in a cross pattern.

[0009] Preferably, the heat-conducting component is provided with at least two heat-conducting branches, one end of each heat-conducting branch is connected to and connected to one end of the heat-conducting component extending into the liquid inlet channel, and the other end of each heat-conducting branch is a free end distributed in the liquid inlet channel.

[0010] Preferably, the heat-conducting component has at least two layers in the height direction of the liquid-cooled plate, and is aligned or staggered with each other in the height direction. A plurality of heat-conducting branches are interlaced to form an intersecting grid structure that fills the liquid inlet channel.

[0011] Preferably, the liquid-cooled plate includes an outer peripheral wall and an inner peripheral wall, the inner peripheral wall enclosing the heat-conducting inner cavity, and the outer peripheral wall and the inner peripheral wall together enclosing the heat-conducting outer cavity.

[0012] Preferably, the heat-conducting component further includes a heat-conducting main stem, which is connected to at least two heat-conducting branches. The heat-conducting main stem passes through the inner peripheral wall and protrudes from the heat-conducting inner cavity, while the at least two heat-conducting branches are connected to the outer peripheral wall.

[0013] Preferably, the heat-conducting cavity has a first input channel and a first output channel, the first ends of the first input channel and the first output channel are connected to the heat-conducting cavity, and the second ends extend out of the liquid cooling plate.

[0014] Preferably, the first ends of the first input channel and the first output channel are higher than the inner bottom surface of the heat-conducting cavity.

[0015] Preferably, the heat-conducting outer cavity further includes a liquid outlet, which is connected to the heat-conducting outer cavity and located on the side of the liquid-cooled plate.

[0016] Preferably, the included angle between at least two of the heat-conducting branches is 10°-45°.

[0017] The above-described solution of this utility model has at least the following beneficial effects:

[0018] The high thermal conductivity liquid cooling plate structure provided by this utility model stores a first coolant with a low freezing point and a high boiling point in the heat-conducting inner cavity. In extremely cold environments, the heat generated after the GPU starts up can be quickly transferred to the heat-conducting inner cavity, forcing the temperature of the heat-conducting inner cavity to rise rapidly. This heat is then conducted to the heat-conducting outer cavity through a heat-conducting component that runs through the liquid inlet channel. This allows the second coolant that has frozen due to residue in the liquid inlet channel to melt quickly. In high-temperature environments, the heat can be quickly conducted to the coolant in the heat-conducting inner cavity through the heat-conducting component. At the same time, the heat from the GPU can also be quickly diffused to the entire liquid cooling plate through the heat-conducting component, allowing the overall temperature of the liquid cooling plate to rise rapidly. This evaporates the water vapor on the surface of the liquid cooling plate, preventing the formation of residual water droplets.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the liquid cooling plate provided in the embodiment of this utility model;

[0022] Figure 2 This is a cross-sectional view of the liquid cooling plate provided in the embodiment of this utility model;

[0023] Figure 3 yes Figure 2 The enlarged view of part A shown;

[0024] Figure 4 This is another cross-sectional view of the liquid cooling plate body provided in this embodiment of the utility model;

[0025] Explanation of icon numbers:

[0026] 10. Liquid-cooled plate; 101. Thermally conductive inner cavity; 102. Thermally conductive outer cavity; 1021. Liquid inlet channel; 103. Outer peripheral wall; 104. Inner peripheral wall; 105. Input channel; 106. Output channel; 107. Liquid inlet; 108. Liquid outlet; 20. Thermally conductive component; 201. Thermally conductive branch; 202. Thermally conductive main trunk.

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] The high thermal conductivity liquid cooling plate structure of this utility model embodiment is described in detail below with reference to the accompanying drawings.

[0034] like Figures 1 to 3As shown, the liquid-cooled plate high thermal conductivity structure provided in this embodiment of the present invention includes: a liquid-cooled plate body 10 and a plurality of heat-conducting components 20. The liquid-cooled plate body 10 has a heat-conducting inner cavity 101 and a heat-conducting outer cavity 102 that are not interconnected. The heat-conducting outer cavity 102 surrounds the heat-conducting inner cavity 101, and the heat-conducting inner cavity 101 is used to store a first coolant. The heat-conducting outer cavity 102 includes a liquid inlet channel 1021, and the liquid inlet channel 1021 is provided with a liquid inlet 107. The liquid inlet channel 1021 is connected to one side of the heat-conducting inner cavity 101 but not interconnected. The heat-conducting components 20 are transversely disposed in the liquid inlet channel 1021, and one end of the heat-conducting component 20 passes through the side wall of the heat-conducting inner cavity 101 into the heat-conducting inner cavity 101.

[0035] Specifically, the first coolant can be a coolant with a low freezing point and a high boiling point, such as an aqueous solution of ethylene glycol, a fluorinated liquid, or a synthetic heat transfer oil. The heat transfer outer cavity uses a common second coolant, such as deionized water. When the supply of the second coolant stops, the second coolant in the heat transfer outer cavity 102 will remain. Therefore, in extremely cold environments, since the GPU is not running, the second coolant in the heat transfer outer cavity 102 will freeze into ice. The GPU is usually located on the heat transfer inner cavity 101. When the GPU starts up, heat is preferentially conducted to the heat transfer inner cavity 101. This allows the heat transfer inner cavity 101 to heat up quickly in extremely cold environments, and the heat can be quickly conducted to the heat transfer outer cavity 102 through the heat transfer component 20 to quickly melt the frozen second coolant. In high-temperature environments, the heat of the GPU can be quickly diffused to the entire liquid cooling plate 10 through the heat transfer component 20 to evaporate the water vapor on the surface of the liquid cooling plate and avoid the formation of residual water droplets.

[0036] like Figure 2 and 3 As shown, the heat-conducting component is provided with at least two heat-conducting branches 201. One end of each heat-conducting branch 201 is connected to and connected to one end of the heat-conducting component 20 extending into the liquid inlet channel 1021. The other end of each heat-conducting branch 201 is a free end distributed within the liquid inlet channel 1021.

[0037] In this embodiment, the heat-conducting component 20 includes a heat-conducting main trunk 202, which can be connected to the heat-conducting inner cavity 101 or to the liquid inlet channel 1021. At least two heat-conducting branches 201 are connected at one end to the heat-conducting inner cavity 101. Preferably, at least two heat-conducting branches 201 are connected to the liquid inlet channel 1021, so that the residual second coolant in the liquid inlet channel 1021 is dispersed by the heat-conducting branches 201. When the outer heat-conducting cavity 102 is de-iced by heat, the heat from the heat-conducting branches 201 can quickly diffuse, allowing the frozen second coolant in the outer heat-conducting cavity 102 to melt quickly, thereby quickly opening the liquid inlet 107. Optionally, the number of heat-conducting branches 201 can be greater than two, resulting in higher heat conduction efficiency between the heat-conducting component 20 and the outer heat-conducting cavity 101. Adjacent heat-conducting components 20 are inclined and intersected, for example, they can be formed in a tree-branch shape. Preferably, the included angle between at least two heat-conducting branches 201 is 10°-45°, for example, 20°. The included angle between at least two heat-conducting branches 201 should ensure more efficient heat transfer while maintaining the highest possible density. As an alternative, the heat-conducting element 20 can also adopt a mesh shape, etc., and the radial cross-sectional structure of the heat-conducting element 20 can be formed as a circle, ellipse, or rectangle, or an irregular shape, etc. The heat-conducting main stem 202 penetrates through the inner peripheral wall 104 and protrudes from the heat-conducting inner cavity 101, so that after the heat-conducting main stem 202 is connected to the inner peripheral wall 104, the heat of the inner peripheral wall 104 can be quickly transferred to the heat-conducting main stem 202. Since the heat-conducting main stem 202 is connected to at least two heat-conducting branches 201, and at least two heat-conducting branches 201 are connected to the outer peripheral wall 103, the at least two heat-conducting branches 201 can be rapidly heated, thereby achieving the ice-breaking effect in extremely cold environments.

[0038] Furthermore, multiple heat-conducting elements 20 are provided and spaced apart along a predetermined direction of the inner heat-conducting cavity 101 and / or the outer heat-conducting cavity 102. The predetermined direction can be the length direction, width direction, or height direction of the liquid cooling plate 10. Preferably, the heat-conducting elements 20 are spaced apart along the length direction of the outer heat-conducting cavity 102, making the connection and support between the outer heat-conducting cavity 102 and the inner heat-conducting cavity 101 more stable, and allowing the heat-conducting element 20 to have a larger heat-conducting range between the outer heat-conducting cavity 102 and the inner heat-conducting cavity 101, resulting in faster heat diffusion. Figure 4As shown, more preferably, the heat-conducting component 20 has at least two layers in the height direction of the liquid cooling plate 10, and they are aligned or staggered with each other in the height direction. Several heat-conducting branches 201 are interlaced to form a cross-grid structure that fills the liquid inlet channel 1021, which makes the heat transfer between the heat-conducting inner cavity 101 and the heat-conducting outer cavity 102 more efficient. It can melt the second coolant frozen in the heat-conducting outer cavity 102 more quickly in extremely cold environments, and can also evaporate the water vapor on the surface of the liquid cooling plate more quickly in high-temperature environments.

[0039] like Figure 2 As shown, it can be understood that the liquid cooling plate 10 includes an outer peripheral wall 103 and an inner peripheral wall 104. The inner peripheral wall 104 encloses and forms a heat-conducting inner cavity 101, and the outer peripheral wall 103 and the inner peripheral wall 104 together enclose and form a heat-conducting outer cavity 102. The heat-conducting outer cavity 102 and the heat-conducting inner cavity 101 are separated by the inner peripheral wall 104, so that the heat-conducting outer cavity 102 and the heat-conducting inner cavity 101 are not interconnected. This allows the first coolant to be stored separately in the heat-conducting inner cavity 101, and when the GPU starts up, the second coolant entering the heat-conducting outer cavity 102 and the first coolant entering the heat-conducting inner cavity 101 can be circulated separately, making the liquid cooling plate have a better heat dissipation effect on the GPU.

[0040] like Figure 4 As shown, the heat-conducting inner cavity 101 has an input channel 105 and an output channel 106. The first ends of the input channel 105 and the output channel 106 are connected to the inside of the heat-conducting inner cavity 101, and the second ends extend to the outside of the liquid cooling plate. The input channel 105 can be used to input the first coolant into the heat-conducting inner cavity 101, and the output channel 106 can be used to output the first coolant from the heat-conducting inner cavity 101, so that the first coolant can circulate in the heat-conducting inner cavity 101. Preferably, the first ends of the input channel 105 and the output channel 106 are higher than the inner bottom surface of the heat-conducting inner cavity 101. More preferably, the first end of the input channel 105 is close to the inner top surface of the heat-conducting inner cavity 101, so that when the first coolant is delivered into and stored from the input channel 105, the first coolant can fill the heat-conducting inner cavity 101 to a height close to the inner top surface, so that the first coolant can fill the heat-conducting inner cavity 101 to the maximum extent.

[0041] Preferably, the heat-conducting outer cavity 102 further includes a liquid outlet 108, which is connected to the heat-conducting outer cavity 102. Both the liquid inlet 107 and the liquid outlet 108 are located on the side of the liquid cooling plate 10. The second coolant can be separately supplied into the heat-conducting outer cavity 102 through the input channel 107 and output from the heat-conducting outer cavity 102 through the liquid outlet 108. This allows the heat-conducting outer cavity 102 to circulate and conduct heat independently through the second coolant during the heat dissipation process, thereby improving the overall heat dissipation efficiency.

[0042] The high thermal conductivity liquid cooling plate structure provided by this utility model stores a first coolant with a low freezing point and a high boiling point in the thermally conductive inner cavity 101. In extremely cold environments, the heat generated after the GPU starts up can be quickly transferred to the thermally conductive inner cavity 101, forcing the temperature of the thermally conductive inner cavity 101 to rise rapidly and be conducted to the thermally conductive outer cavity 102 through the thermally conductive element 20 arranged across the liquid inlet channel 1021. This allows the second coolant that has frozen due to residue in the liquid inlet channel 1021 to melt quickly. In high-temperature environments, the temperature can be quickly conducted to the entire liquid cooling plate through the thermally conductive element 20, allowing the overall temperature of the liquid cooling plate to rise rapidly, thereby evaporating the water vapor on the surface of the liquid cooling plate and avoiding the formation of residual water droplets.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A liquid-cooled plate high thermal conductivity structure, characterized in that, include: The liquid cooling plate has a non-communicating heat-conducting inner cavity and a heat-conducting outer cavity, the heat-conducting outer cavity surrounds the heat-conducting inner cavity, and the heat-conducting inner cavity is used to store a first coolant. The heat-conducting outer cavity includes a liquid inlet channel, which is provided with a liquid inlet. The liquid inlet channel is connected to one side of the heat-conducting inner cavity but not interconnected. Several heat-conducting components are provided, which are arranged transversely in the liquid inlet channel, and one end of the heat-conducting component passes through the side wall of the heat-conducting inner cavity into the heat-conducting inner cavity.

2. The high thermal conductivity liquid-cooled plate structure according to claim 1, characterized in that, The adjacent heat-conducting components are inclined to each other and arranged in a cross pattern.

3. The high thermal conductivity liquid-cooled plate structure according to claim 1, characterized in that, The heat-conducting component is provided with at least two heat-conducting branches. One end of each heat-conducting branch is connected to and connected to one end of the heat-conducting component that extends into the liquid inlet channel. The other end of each heat-conducting branch is a free end distributed within the liquid inlet channel.

4. The high thermal conductivity liquid-cooled plate structure according to claim 3, characterized in that, The heat-conducting component has at least two layers in the height direction of the liquid-cooled plate, and is aligned or staggered with each other in the height direction. Several heat-conducting branches are interlaced to form an intersecting grid structure that fills the liquid inlet channel.

5. The high thermal conductivity liquid-cooled plate structure according to claim 3, characterized in that, The liquid-cooled plate includes an outer peripheral wall and an inner peripheral wall. The inner peripheral wall encloses and forms the heat-conducting inner cavity, and the outer peripheral wall and the inner peripheral wall together enclose and form the heat-conducting outer cavity.

6. The high thermal conductivity liquid-cooled plate structure according to claim 5, characterized in that, The heat-conducting component further includes a heat-conducting main trunk, which is connected to at least two heat-conducting branches. The heat-conducting main trunk passes through the inner peripheral wall and protrudes from the heat-conducting inner cavity, while the at least two heat-conducting branches are connected to the outer peripheral wall.

7. The high thermal conductivity liquid-cooled plate structure according to claim 1, characterized in that, The heat-conducting inner cavity has an input channel and an output channel. The first ends of the input channel and the output channel are connected to the heat-conducting inner cavity, and the second ends extend out of the liquid cooling plate.

8. The high thermal conductivity liquid-cooled plate structure according to claim 7, characterized in that, The first ends of the input channel and the output channel are higher than the inner bottom surface of the heat-conducting cavity.

9. The high thermal conductivity liquid-cooled plate structure according to claim 1, characterized in that, The heat-conducting outer cavity also includes a liquid outlet, which is connected to the heat-conducting outer cavity and located on the side of the liquid-cooled plate.

10. The high thermal conductivity liquid-cooled plate structure according to claim 3 or 4, characterized in that, The included angle between at least two of the heat-conducting branches is 10°-45°.

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