Multi-channel directional heat dissipation module for tablet computer

Abstract

The utility model relates to the technical field of tablet computer, concretely to a multi -passage directional heat dissipation module for tablet computer, including heat conduction board, heat dissipation element, connecting element and power element, heat dissipation element is equipped in heat conduction board and carries out heat dissipation, connecting element is equipped in both sides of heat conduction board, and connecting element is used for heat conduction board connection to form multiple heat dissipation area for the directional heat dissipation of tablet computer, and power element is equipped in one side of heat conduction board and is used for heat dissipation element to heat dissipation in heat conduction board, and power element includes treater, and the treater is used for the heat dissipation area on heat conduction board to carry out directional heat dissipation processing, and through heat conduction board effectively collect the heat that different parts of tablet computer generates, and heat dissipation element is placed in heat conduction board, and directly to the heat absorbed fast emission, guarantee and timeliness, through connecting element to form multiple heat dissipation area with heat conduction board connection, realize computer directional heat dissipation, improve heat dissipation efficiency, solve the problem of local overheating, prolong the service life of each component, and the practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of tablet computer technology, specifically a multi-channel directional heat dissipation module for tablet computers. Background Technology

[0002] A tablet computer is a small, portable personal computer that uses a touchscreen as its primary input device. Its touchscreen (also known as digitizer technology) allows users to perform tasks using a stylus or digital pen instead of a traditional keyboard or mouse.

[0003] As tablet performance gradually improves, the chips in some tablets are also getting increasingly hot. Once the chip overheats, the tablet is prone to lag, which affects the user experience and also affects the lifespan of the tablet. Utility Model Content

[0004] To address the aforementioned issues, this invention provides a multi-channel directional heat dissipation module for tablet computers. This module solves the problem that as tablet computer performance gradually improves, the chips in some tablet computers are also overheating. Once the chips overheat, the tablet computer is prone to lag, which affects the user experience and also impacts the lifespan of the tablet computer.

[0005] The technical solution adopted in this utility model is: a multi-channel directional heat dissipation module for a tablet computer, including a heat conduction plate, a heat dissipation element, a connecting element, and a power-conducting element; multiple heat conduction plates are provided, and the heat dissipation element is disposed within the heat conduction plate for heat dissipation by the heat conduction plate; the connecting element is disposed on both sides of the heat conduction plate for connecting multiple heat conduction plates to form multiple heat dissipation areas, which are used for directional heat dissipation of the tablet computer; the power-conducting element is disposed on one side of the heat conduction plate for heat dissipation by the heat dissipation element within the heat conduction plate; The energized component includes a processor, a connecting wire, and a power plug. The processor is mounted on a heat conduction plate, the connecting wire is mounted on the processor, and one end of the power plug is mounted on the connecting wire. The processor is used to perform directional heat dissipation in the heat dissipation area on the heat conduction plate.

[0006] A further improvement to the above scheme is that the heat conduction plate includes an end plate, a mounting plate, and a bottom plate, the end plate and the bottom plate are respectively installed at both ends of the mounting plate to form a heat dissipation cavity in the mounting plate, and the heat dissipation element is disposed in the heat dissipation cavity.

[0007] A further improvement to the above solution is that the end plate is provided with heat-conducting holes, and there are multiple heat-conducting holes, which are arranged in a honeycomb pattern and are not located on the end plate.

[0008] A further improvement to the above solution is that an end mounting hole is provided at the diagonal of the end plate near the heat conduction hole, and an end mounting nut is provided on the end plate near the end mounting hole. One end of the end mounting nut passes through the end mounting hole and is used to fix the end plate above the mounting plate for guiding heat dissipation of the heat dissipation element.

[0009] A further improvement to the above solution is that a heat dissipation hole is provided below the base plate, and multiple heat dissipation holes are provided, which are arranged in a honeycomb pattern and are not located below the base plate.

[0010] A further improvement to the above solution is that a bottom mounting hole is provided at the diagonal position of the base plate near the heat dissipation hole, and a bottom mounting nut is provided on the base plate near the bottom mounting hole. One end of the bottom mounting nut passes through the bottom mounting hole and is used to fix the base plate under the mounting plate for external heat dissipation of the heat dissipation element.

[0011] A further improvement to the above solution is that a mounting baffle is provided on the mounting plate, the mounting baffle surrounds the top of the mounting plate to form a mounting groove on the mounting plate, the mounting groove being used to mount the end plate, heat dissipation element and base plate on the mounting plate.

[0012] A further improvement to the above solution is that a connecting groove is provided on the side of the mounting plate near the mounting groove, the connecting element is disposed in the connecting groove, a mounting bracket is mounted on the mounting plate near the mounting groove, and through holes are provided at the four ends of the mounting plate near the mounting bracket. The through holes are used for mounting nuts at the ends and mounting nuts at the bottom for installation and fixation.

[0013] A further improvement to the above solution is that a clearance groove is provided at one end of the mounting plate near the connecting groove, and a connecting block is provided on the side of the mounting plate near the clearance groove. The connecting groove is perpendicular to the clearance groove. The mounting plate is used to connect multiple heat conduction plates through the connecting groove and the clearance groove.

[0014] A further improvement to the above solution is that the heat dissipation element includes an assembly frame, a rotating ring, and heat dissipation blades; the rotating ring is movably mounted on the assembly frame, and multiple heat dissipation blades are provided, with the multiple heat dissipation blades arranged in a ring around the outer periphery of the rotating ring.

[0015] The beneficial effects of this utility model are: Compared to existing heat dissipation devices, this invention provides a broader foundation for heat conduction through the arrangement of multiple heat conduction plates, effectively collecting heat generated from different parts of the tablet computer. The heat dissipation element is placed inside the heat conduction plates, which can directly and quickly dissipate the absorbed heat, ensuring timely heat dissipation. By connecting multiple heat conduction plates with connecting elements to form multiple heat dissipation zones, targeted heat dissipation of the tablet computer is achieved. Based on the differences in the heat generation of different components inside the tablet computer, targeted heat dissipation can be applied to specific areas, improving heat dissipation efficiency, accurately solving the problem of local overheating, and helping to extend the service life of various components of the tablet computer. It is highly practical. Attached Figure Description

[0016] Figure 1 This is a perspective view of the multi-channel directional heat dissipation module for tablet computers according to this utility model; Figure 2 This is a top view of the multi-channel directional heat dissipation module for tablet computers according to this utility model; Figure 3 This is an exploded view of the multi-channel directional heat dissipation module for tablet computers according to this utility model.

[0017] Explanation of reference numerals in the attached drawings: Heat conduction plate 10, end plate 11, heat conduction hole 112, end mounting hole 113, end mounting nut 114, mounting plate 12, heat dissipation cavity 121, mounting baffle 122, mounting groove 123, connecting groove 124, mounting bracket 125, through hole 126, clearance groove 127, connecting block 128, bottom plate 13, heat exhaust hole 131, bottom mounting hole 132, bottom mounting nut 133; Heat dissipation element 20, mounting bracket 21, rotating ring 22, heat dissipation blade 23; Connecting element 30, heat dissipation area 31; Powered component 40, processor 41, connecting wire 42, power plug 43. Detailed Implementation

[0018] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0019] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0021] like Figure 1-3 As shown in the embodiment of this utility model, a multi-channel directional heat dissipation module for a tablet computer includes a heat conduction plate 10, a heat dissipation element 20, a connecting element 30, and a power supply element 40. Multiple heat conduction plates 10 are provided, and the heat dissipation element 20 is disposed within the heat conduction plate 10 for heat dissipation. The connecting element 30 is disposed on both sides of the heat conduction plate 10 and is used to connect multiple heat conduction plates 10 to form multiple heat dissipation areas 31, which are used for directional heat dissipation of the tablet computer. The power supply element 40 is disposed on one side of the heat conduction plate 10 for heat dissipation of the heat dissipation element 20 within the heat conduction plate 10. The power supply element 40 includes a processor 41, a connecting wire 42, and a power plug 43. The processor 41 is disposed on the heat conduction plate 10, the connecting wire 42 is disposed on the processor 41, and one end of the power plug 43 is disposed on the connecting wire 42. The processor 41 is used for directional heat dissipation processing in the heat dissipation areas on the heat conduction plate 10. In this embodiment, the arrangement of multiple heat conduction plates 10 provides a broader foundation for heat conduction, effectively collecting heat generated from different parts of the tablet computer. The heat dissipation element 20 is placed inside the heat conduction plate 10, which can directly and quickly dissipate the absorbed heat, ensuring timely heat dissipation. The multiple heat conduction plates 10 are connected by the connecting element 30 to form multiple heat dissipation zones 31, realizing directional heat dissipation of the tablet computer. According to the difference in the degree of heat generation of different components inside the tablet computer, heat dissipation can be targeted to specific areas, improving heat dissipation efficiency, accurately solving the problem of local overheating, and helping to extend the service life of various components of the tablet computer, making it highly practical.

[0022] like Figure 3As shown, the heat conduction plate 10 includes an end plate 11, a mounting plate 12, and a base plate 13. The end plate 11 and the base plate 13 are respectively mounted at both ends of the mounting plate 12 to form a heat dissipation cavity 121 within the mounting plate 12. The heat dissipation element 20 is disposed within the heat dissipation cavity 121. In this embodiment, the layout of the end plate 11, the mounting plate 12, and the base plate 13 successfully constructs a heat dissipation cavity 121 within the mounting plate 12, providing a stable placement space for the heat dissipation element 20. The presence of the heat dissipation cavity 121 effectively concentrates heat and allows for orderly heat conduction. With the heat dissipation element 20 located within this cavity, it can efficiently absorb the heat generated by the tablet computer and quickly disperse the heat with the help of the structure of the heat conduction plate 10. This avoids problems such as performance degradation and accelerated component aging caused by overheating, extends the lifespan of the tablet computer, and improves the user experience.

[0023] The end plate 11 is provided with heat-conducting holes 112, and there are multiple heat-conducting holes 112 arranged in a honeycomb pattern and not located on the end plate 11. In this embodiment, by providing multiple heat-conducting holes 112 arranged in a honeycomb pattern on the end plate 11, the heat conduction area is greatly increased, and heat can be conducted away from the end plate 11 more efficiently, thereby improving heat dissipation efficiency.

[0024] An end mounting hole 113 is provided at a diagonal position near the heat conduction hole 112 on the end plate 11. An end mounting nut 114 is provided on the end plate 11 near the end mounting hole 113. One end of the end mounting nut 114 passes through the end mounting hole 113 and is used to fix the end plate 11 above the mounting plate 12 for guiding heat dissipation of the heat dissipation element 20. In this embodiment, by providing end mounting holes 113 at the diagonal position of the end plate 11 and cooperating with end mounting nuts 114, the end plate 11 can be firmly fixed above the mounting plate 12, ensuring the stability of the heat dissipation module structure. It will not easily loosen even when the tablet computer vibrates during operation. It can accurately guide the heat dissipation path, allowing heat to be dissipated according to the preset channel, improving heat dissipation efficiency, and effectively avoiding problems such as performance degradation and component damage caused by heat accumulation in the tablet computer.

[0025] A plurality of heat dissipation holes 131 are provided below the base plate 13. These heat dissipation holes 131 are arranged in a honeycomb pattern and are not located below the base plate 13. In this embodiment, by providing a plurality of honeycomb-shaped heat dissipation holes 131 below the base plate 13, the number of heat dissipation holes 131 is greatly increased. At the same time, the space below the base plate 13 is effectively utilized, improving space utilization. It forms an efficient heat dissipation channel, which can quickly dissipate the heat generated inside the tablet computer, prevent heat accumulation, and reduce the risk of performance degradation and component damage due to overheating.

[0026] A bottom mounting hole 132 is provided at a diagonal position near the heat dissipation hole 131 on the base plate 13. A bottom mounting nut 133 is provided on the base plate 13 near the bottom mounting hole 132. One end of the bottom mounting nut 133 passes through the bottom mounting hole 132 and is used to fix the base plate 13 below the mounting plate 12 for external heat dissipation of the heat dissipation element 20. In this embodiment, the bottom mounting hole 132 and the bottom mounting nut 133 can securely fix the base plate 13 below the mounting plate 12, ensuring the stability of the entire heat dissipation module structure and enabling the heat dissipation element 20 to work efficiently in a suitable position. The heat dissipation element 20 can then perform external heat dissipation, effectively and promptly expelling the heat generated by the tablet computer from the outside of the device, preventing heat accumulation inside, thereby reducing the device temperature and improving operational stability.

[0027] A mounting baffle 122 is provided on the mounting plate 12, and the mounting baffle 122 surrounds the top of the mounting plate 12 to form a mounting groove 123 on the mounting plate 12. The mounting groove 123 is used to mount the end plate 11, the heat dissipation element 20, and the base plate 13 on the mounting plate 12. In this embodiment, by providing the mounting groove 123 formed by the mounting baffle 122 on the mounting plate 12, the end plate 11, the heat dissipation element 20, and the base plate 13 can be accurately positioned, ensuring the accuracy of their installation positions and improving the overall assembly precision.

[0028] A connecting groove 124 is provided on the side of the mounting plate 12 near the mounting groove 123. The connecting element 30 is disposed in the connecting groove 124. A mounting bracket 125 is mounted on the mounting plate 12 near the mounting groove 123. Through holes 126 are provided at the four ends of the mounting plate 12 near the mounting bracket 125. The through holes 126 are used for mounting nuts 114 at the ends and nut 133 at the bottom for installation and fixation. In this embodiment, the connecting groove 124 is provided on the side of the mounting plate 12 near the mounting groove 123, providing a stable mounting position for the connecting element 30, ensuring a solid connection and facilitating the coordinated operation of various components. The mounting bracket 125 is mounted on the mounting plate 12 near the mounting groove 123, enhancing the stability of the structure and providing better support for related components. The through holes 126 at the four ends of the mounting plate 12 near the mounting bracket 125 are used for installation and fixation by the end nuts 114 and the bottom nuts 133, which facilitates the installation of the module and ensures that the module is firmly installed and not easily loosened.

[0029] The mounting plate 12 has a clearance groove 127 at one end near the connecting groove 124, and a connecting block 128 is provided on the side of the mounting plate 12 near the clearance groove 127. The connecting groove 124 is perpendicular to the clearance groove 127. The mounting plate 12 is used to connect multiple heat conduction plates 10 through the connecting groove 124 and the clearance groove 127. In this embodiment, the clearance groove 127 provides the necessary space for the connection process, avoiding interference between components during the connection process and making the connection smoother. Furthermore, the connecting block 128 cooperates with the connecting groove 124, and combined with the unique design of the clearance groove 127, it can stably connect multiple heat conduction plates 10 to the mounting plate 12, ensuring that the heat generated by the tablet computer during operation can be efficiently transferred away through the heat conduction plates 10, realizing multi-channel directional heat dissipation, thereby reducing the device temperature and improving the stability and reliability of the tablet computer operation.

[0030] The heat dissipation element 20 includes an assembly frame 21, a rotating ring 22, and heat dissipation blades 23. The rotating ring 22 is movably mounted on the assembly frame 21, and multiple heat dissipation blades 23 are arranged in a ring around the outer periphery of the rotating ring 22. In this embodiment, the assembly frame 21 provides stable support for the entire heat dissipation structure, ensuring the orderly installation and coordinated operation of each component. The rotating ring 22, movably mounted on the assembly frame 21, can rotate flexibly, allowing the heat dissipation blades 23 to generate dynamic airflow. Furthermore, the multiple heat dissipation blades 23 arranged in a ring around the outer periphery of the rotating ring 22 accelerate air circulation under the influence of the rotating ring 22, more effectively removing the heat generated by the tablet computer, achieving efficient heat dissipation, and improving the comprehensiveness and specificity of heat dissipation.

[0031] A multi-channel directional heat dissipation module for a tablet computer includes a heat conduction plate 10, a heat dissipation element 20, a connecting element 30, and a power supply element 40. Multiple heat conduction plates 10 are provided, and the heat dissipation elements 20 are disposed within the heat conduction plates 10 for heat dissipation. The connecting elements 30 are disposed on both sides of the heat conduction plates 10 and are used to connect multiple heat conduction plates 10 to form multiple heat dissipation zones, which are used for directional heat dissipation of the tablet computer. The power supply element 40 is disposed on one side of the heat conduction plate 10 for heat dissipation of the heat dissipation elements 20 within the heat conduction plate 10. The power supply element 40 includes a processor 41, a connecting wire 42, and a power plug 43. The processor 41 is disposed on the heat conduction plate 10, the connecting wire 42 is disposed on the processor 41, and one end of the power plug 43 is disposed on the connecting wire 42. The processor 41 is used for directional heat dissipation in the heat dissipation zones on the heat conduction plate 10. In this embodiment, the arrangement of multiple heat conduction plates 10 provides a broader foundation for heat conduction, effectively collecting heat generated from different parts of the tablet computer. The heat dissipation element 20 is placed inside the heat conduction plate 10, which can directly and quickly dissipate the absorbed heat, ensuring timely heat dissipation. The multiple heat conduction plates 10 are connected by the connecting element 30 to form multiple heat dissipation zones, realizing directional heat dissipation of the tablet computer. Based on the difference in the degree of heat generation of different components inside the tablet computer, heat dissipation can be targeted to specific areas, improving heat dissipation efficiency, accurately solving the problem of local overheating, and helping to extend the service life of various components of the tablet computer, making it highly practical.

[0032] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A multi-channel directional heat dissipation module for tablet computers, characterized in that: The device includes heat conduction plates, heat dissipation elements, connecting elements, and power-conducting elements. Multiple heat conduction plates are provided, and the heat dissipation elements are disposed within the heat conduction plates for heat dissipation. Connecting elements are located on both sides of the heat conduction plates and are used to connect multiple heat conduction plates to form multiple heat dissipation zones, which are used for directional heat dissipation of the tablet computer. Power-conducting elements are located on one side of the heat conduction plates to facilitate heat dissipation by the heat dissipation elements within the heat conduction plates. The energized component includes a processor, a connecting wire, and a power plug. The processor is mounted on a heat conduction plate, the connecting wire is mounted on the processor, and one end of the power plug is mounted on the connecting wire. The processor is used to perform directional heat dissipation in the heat dissipation area on the heat conduction plate.

2. The multi-channel directional heat dissipation module for tablet computers according to claim 1, characterized in that: The heat conduction plate includes an end plate, a mounting plate, and a base plate. The end plate and the base plate are respectively installed at both ends of the mounting plate to form a heat dissipation cavity within the mounting plate. The heat dissipation element is disposed within the heat dissipation cavity.

3. The multi-channel directional heat dissipation module for tablet computers according to claim 2, characterized in that: The end plate is provided with heat-conducting holes, and there are multiple heat-conducting holes, which are arranged in a honeycomb pattern and are not located on the end plate.

4. The multi-channel directional heat dissipation module for tablet computers according to claim 3, characterized in that: An end mounting hole is provided at the diagonal position of the end plate near the heat conduction hole. An end mounting nut is provided on the end plate near the end mounting hole. One end of the end mounting nut passes through the end mounting hole and is used to fix the end plate above the mounting plate for guiding heat dissipation of the heat dissipation element.

5. The multi-channel directional heat dissipation module for tablet computers according to claim 4, characterized in that: The bottom of the base plate is provided with heat dissipation holes, and there are multiple heat dissipation holes. The multiple heat dissipation holes are honeycomb-shaped and are not located on the bottom of the base plate.

6. The multi-channel directional heat dissipation module for tablet computers according to claim 5, characterized in that: The base plate has a bottom mounting hole at a diagonal position near the heat dissipation hole. A bottom mounting nut is provided on the base plate near the bottom mounting hole. One end of the bottom mounting nut passes through the bottom mounting hole and is used to fix the base plate under the mounting plate for external heat dissipation of the heat dissipation element.

7. The multi-channel directional heat dissipation module for tablet computers according to claim 6, characterized in that: The mounting plate is provided with a mounting baffle, which surrounds the top of the mounting plate to form a mounting groove on the mounting plate. The mounting groove is used to mount the end plate, heat dissipation element and base plate on the mounting plate.

8. The multi-channel directional heat dissipation module for tablet computers according to claim 7, characterized in that: The mounting plate has a connecting groove on the side near the mounting slot, and the connecting element is disposed in the connecting groove. The mounting plate is supported by a mounting bracket near the mounting slot. The mounting plate has through holes at its four ends near the mounting bracket. The through holes are used for mounting nuts at the ends and at the bottom for installation and fixation.

9. The multi-channel directional heat dissipation module for tablet computers according to claim 8, characterized in that: The mounting plate has a clearance groove at one end near the connecting groove, and a connecting block is provided on the side of the mounting plate near the clearance groove. The connecting groove is perpendicular to the clearance groove. The mounting plate is used to connect multiple heat conduction plates through the connecting groove and the clearance groove.

10. The multi-channel directional heat dissipation module for tablet computers according to claim 1, characterized in that: The heat dissipation element includes an assembly frame, a rotating ring, and heat dissipation blades; the rotating ring is movably mounted on the assembly frame, and multiple heat dissipation blades are provided, which are arranged in a ring around the outer periphery of the rotating ring.

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