Flip-top water collection cold plate

Abstract

The utility model discloses a kind of flip type water collection cold plates, flip type water collection cold plate includes cover, support and mainboard;Cover includes upper cover and lower cover, upper cover and the lower cover are enclosed to form intermediate water chamber and two edge water chambers after sealing connection, water inlet pipe is provided on intermediate water chamber, water outlet pipe is provided on edge water chamber;Two processor water chambers are provided below lower cover, the side of processor water chamber close to intermediate water chamber is communicated with the intermediate water chamber, to receive the refrigerant of intermediate water chamber, the side of processor water chamber away from intermediate water chamber is communicated with corresponding edge water chamber respectively, to deliver refrigerant to corresponding edge water chamber;Mainboard is provided with several memories and several processors, memory is corresponding with the position of intermediate water chamber, processor is corresponding with the position of processor water chamber.The utility model passes through the refrigerant path of "first memory heat exchange, processor heat exchange later", can effectively guarantee element stable operation and improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a flip-top water-cooling plate. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence and big data, the power density of server equipment has increased dramatically. Traditional air cooling methods, due to their limited heat dissipation capacity, can no longer meet the heat dissipation needs of high power density equipment. Liquid cooling technology, especially cold plate servers, has gradually become the focus of research and application.

[0003] In the design of cold plate servers, leak-proof sealing performance and coolant circulation efficiency are key factors determining their heat dissipation effect and operational stability. However, the structural design of existing cold plate servers still has significant shortcomings: for example, some designs use an integrated CPU and memory design with only a single-sided flow channel, and the memory cold plate does not circulate coolant, but instead achieves heat conduction by welding to the side supports, resulting in insufficient heat exchange contact area and low heat dissipation efficiency; in other designs, the coolant flows from the inlet through a single CPU before flowing into another CPU, making the later-flowing CPU susceptible to residual heat from the preceding CPU, failing to achieve efficient heat dissipation and severely restricting the overall heat dissipation performance of the cold plate server. Therefore, existing cold plate servers suffer from low heat dissipation efficiency. Utility Model Content

[0004] This invention provides a flip-top water-cooled plate, which aims to solve the problem of low heat dissipation efficiency in existing cold plate servers.

[0005] To solve the above-mentioned technical problems, this utility model provides a flip-top water-cooling plate, which includes a cover plate, a bracket and a main board. The cover plate is rotatably connected to the bracket and the bracket is fixedly connected to the main board. The cover plate includes an upper cover plate and a lower cover plate. After the upper cover plate and the lower cover plate are sealed together, they enclose a middle water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the middle water chamber. A water inlet pipe is provided on the middle water chamber, and a water outlet pipe is provided on each of the edge water chambers. Two processor water chambers are provided below the lower cover plate. The side of each processor water chamber closest to the middle water chamber is connected to the middle water chamber to receive the refrigerant from the middle water chamber. The side of each processor water chamber furthest from the middle water chamber is connected to the corresponding edge water chamber to deliver the refrigerant to the corresponding edge water chamber. The motherboard is equipped with several memory modules and several processors. The memory modules are located in the same position as the intermediate water chamber, and the processors are located in the same position as the processor water chamber.

[0006] Furthermore, the highest point of the intermediate water chamber is consistent with the highest point of the edge water chamber.

[0007] Furthermore, the lowest point of the intermediate water chamber is higher than the lowest point of the edge water chamber.

[0008] Furthermore, the processor water chamber is provided with multiple water channels on the side near the intermediate water chamber, through which the refrigerant of the intermediate water chamber flows to the processor water chamber.

[0009] Furthermore, each of the processor water chambers is provided with a connecting groove on the side away from the intermediate water chamber, through which the processor water chamber supplies refrigerant to the corresponding edge water chamber.

[0010] Furthermore, the bottom of each of the edge water chambers is inclined in a direction away from the middle water chamber.

[0011] Furthermore, the upper cover plate is provided with a first central recess and two first edge recesses, and the lower cover plate is provided with a second central recess and two second edge recesses. The first central recess corresponds to the second central recess and has the same shape, and the first edge recess corresponds to the second edge recess one by one and has the same shape. After the upper cover plate and the lower cover plate are sealed together, the first intermediate recess and the second intermediate recess form the intermediate water chamber, and the first edge recess and the corresponding second edge recess form the corresponding edge water chamber.

[0012] Furthermore, the cover plate is rotatably connected to the bracket via a hinge.

[0013] Furthermore, the bracket is fixedly connected to the motherboard by screws.

[0014] Furthermore, the cover plate is elongated.

[0015] This utility model discloses a flip-top type water-cooling plate, which includes a cover plate, a bracket, and a main board. The cover plate is rotatably connected to the bracket, and the bracket is fixedly connected to the main board. The cover plate includes an upper cover plate and a lower cover plate. After being sealed together, the upper cover plate and the lower cover plate enclose a central water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the central water chamber. The central water chamber is provided with an inlet pipe, and each edge water chamber is provided with an outlet pipe. Two processor water chambers are arranged below the lower cover plate. The side of each processor water chamber closest to the central water chamber is connected to the central water chamber to receive the refrigerant from the central water chamber. The side of each processor water chamber furthest from the central water chamber is connected to the corresponding edge water chamber to deliver the refrigerant to the corresponding edge water chamber. The main board is provided with several memory modules and several processors. The memory modules are all located in the central water chamber, and the processors are all located in the processor water chamber. In this embodiment of the invention, the refrigerant enters the middle water chamber through the inlet pipe, completes heat exchange with the memory, and then flows downward into the processor water chamber to dissipate heat from the processor. After the processor water chamber is full, the refrigerant is heated and rises to the edge water chamber, and finally flows out through the outlet pipe. This refrigerant path of "heat exchange with the memory first, then with the processor" can avoid the memory from overheating and failing due to high heat from the processor, effectively ensuring the stable operation of the components and improving heat dissipation efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is an exploded view of the flip-type water-cooling plate provided in this embodiment of the utility model; Figure 2 This is a structural diagram of the flip-type water-cooling plate provided in this embodiment of the utility model; Figure 3 This is a schematic diagram of the upper cover plate provided in an embodiment of the present utility model; Figure 4 This is a schematic diagram of the lower cover plate provided in an embodiment of the present utility model; The labels for the attached figures are as follows: 10. Flip-top water-cooling plate; 11. Cover plate; 111. Upper cover plate; 112. Lower cover plate; 113. Water inlet pipe; 114. Water outlet pipe; 12. Bracket; 13. Motherboard; 14. Processor water chamber; 141. Water channel; 142. Connecting groove; 15. Hinge; 161. First intermediate recess; 162. First edge recess; 163. Second intermediate recess; 164. Second edge recess. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0020] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0021] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0022] Please see Figures 1 to 4This utility model proposes a flip-top type water-cooling plate 10, which includes a cover plate 11, a bracket 12, and a main plate 13. The cover plate 11 is rotatably connected to the bracket 12, and the bracket 12 is fixedly connected to the main plate 13. The cover plate 11 includes an upper cover plate 111 and a lower cover plate 112. After being sealed together, the upper cover plate 111 and the lower cover plate 112 enclose a central water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the central water chamber. A water inlet pipe 113 is provided on the central water chamber, and the edge water chambers are... Each is equipped with a water outlet pipe 114; two processor water chambers 14 are provided below the lower cover plate 112. The side of each processor water chamber 14 closest to the middle water chamber is connected to the middle water chamber to receive the refrigerant from the middle water chamber, and the side of each processor water chamber 14 furthest from the middle water chamber is connected to the corresponding edge water chamber to deliver the refrigerant to the corresponding edge water chamber; the motherboard 13 is provided with several memory modules and several processors. The memory modules are all located in the middle water chamber, and the processors are all located in the processor water chambers 14.

[0023] In this embodiment, the cover plate 11 is rotatably connected to the bracket 12, and the bracket 12 is fixedly connected to the motherboard 13. The memory and processor on the motherboard 13 can be replaced by opening the cover plate 11, facilitating installation / removal. The cover plate 11 includes an upper cover plate 111 and a lower cover plate 112. After being sealed together, the upper cover plate 111 and the lower cover plate 112 enclose a central water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the central water chamber. A water inlet pipe 1 is provided on the central water chamber. 13. Each of the edge water chambers is provided with an outlet pipe 114. The refrigerant enters the middle water chamber through the inlet pipe 113, completes heat exchange with the memory, and then flows downward into the processor water chambers 14 on both sides to dissipate heat from the processor. After the processor water chambers 14 are full, the refrigerant rises to the edge water chambers due to heat and finally flows out through the outlet pipe 114. This refrigerant path of "heat exchange with memory first, then heat exchange with processor" can avoid the memory from overheating and failing due to the high heat of the processor, effectively ensuring the stable operation of the components and improving heat dissipation efficiency.

[0024] In one embodiment, such as Figure 1 As shown, the highest point of the intermediate water chamber is consistent with the highest point of the edge water chamber.

[0025] In this embodiment, the highest point of the intermediate water chamber is consistent with the highest point of the edge water chamber, ensuring that the refrigerant in the intermediate water chamber can flow evenly and without obstruction along the preset refrigerant flow path to the processor water chamber 14, and then smoothly enter the edge water chamber.

[0026] In one embodiment, such as Figure 1 As shown, the lowest point of the intermediate water chamber is higher than the lowest point of the edge water chamber.

[0027] In this embodiment, the lowest point of the intermediate water chamber is higher than the lowest point of the edge water chamber, forming a height gradient from the middle to both sides. Combined with gravity and thermal convection, the refrigerant can flow directionally to the edge water chamber, avoiding stagnation and ensuring smooth flow to both sides. The two edge water chambers are symmetrically arranged on both sides of the intermediate water chamber. The symmetrical layout achieves uniform flow distribution and improves heat dissipation stability.

[0028] In one embodiment, such as Figure 1 and Figure 4 As shown, the processor water chamber 14 is provided with multiple water channels 141 on the side near the intermediate water chamber, and the refrigerant of the intermediate water chamber flows to the processor water chamber 14 through the water channels 141 respectively.

[0029] In this embodiment, each of the processor water chambers 14 is provided with a plurality of water channels 141 on the side near the intermediate water chamber. Each water channel 141 is a cylindrical structure. The refrigerant in the intermediate water chamber is diverted to each of the processor water chambers 14 through the water channels 141, thereby increasing the heat exchange contact area and improving the heat dissipation efficiency.

[0030] In one embodiment, such as Figure 1 and Figure 4 As shown, each of the processor water chambers 14 is provided with a connecting groove 142 on the side away from the intermediate water chamber, and the processor water chamber 14 delivers refrigerant to the corresponding edge water chamber through the connecting groove 142.

[0031] In this embodiment, a connecting groove 142 is provided on the side of the processor water chamber 14 away from the middle water chamber. The connecting groove 142 has a rectangular structure. After the processor water chamber 14 is filled, the refrigerant is transported to the corresponding edge water chamber through the connecting groove 142.

[0032] In one embodiment, such as Figure 1 and Figure 3 As shown, the bottom of each of the edge water chambers slopes away from the middle water chamber.

[0033] In this embodiment, the bottom of each of the edge water chambers is inclined away from the middle water chamber, which can guide the refrigerant to converge towards the outlet pipe 114, accelerate discharge, and reduce stagnation.

[0034] In one embodiment, such as Figure 3 and Figure 4As shown, the upper cover plate 111 is provided with a first intermediate recess 161 and two first edge recesses 162, and the lower cover plate 112 is provided with a second intermediate recess 163 and two second edge recesses 164. The first intermediate recess 161 and the second intermediate recess 163 correspond to each other and have the same shape, and the first edge recesses 162 and the second edge recesses 164 correspond to each other and have the same shape. After the upper cover plate 111 and the lower cover plate 112 are sealed together, the first intermediate recess 161 and the second intermediate recess 163 enclose each other to form the intermediate water chamber, and the first edge recesses 162 and the corresponding second edge recesses 164 enclose each other to form the corresponding edge water chamber.

[0035] In this embodiment, the upper cover plate 111 is provided with a first intermediate recess 161 and two first edge recesses 162, and the lower cover plate 112 is provided with a second intermediate recess 163 and two second edge recesses 164. The first intermediate recess 161 and the second intermediate recess 163 correspond to each other and have the same shape, and the first edge recesses 162 and the second edge recesses 164 correspond one-to-one and have the same shape, ensuring that the refrigerant in the intermediate water chamber can flow evenly and without obstruction along the preset refrigerant flow path to the processor water chamber 14, and then smoothly enter the edge water chamber; wherein, the upper cover plate 111 is sealed to the lower cover plate 112 by welding.

[0036] In one embodiment, such as Figure 1 As shown, the cover plate 11 is rotatably connected to the bracket 12 via a hinge 15.

[0037] In this embodiment, the cover plate 11 is rotatably connected to the bracket 12 via the hinge 15, which allows the cover plate 11 to be flexibly flipped relative to the bracket 12. This facilitates quick opening of the cover plate 11 to inspect or replace internal components such as memory and processor, while also ensuring precise alignment of the cover plate 11 and the bracket 12 when closed by the limiting effect of the hinge 15.

[0038] In one embodiment, such as Figure 1 As shown, the bracket 12 is fixedly connected to the motherboard 13 by screws.

[0039] In this embodiment, the bracket 12 is fixedly connected to the motherboard 13 by screws, which facilitates quick disassembly and assembly of the bracket 12 and the motherboard 13 during subsequent maintenance.

[0040] In one embodiment, such as Figure 1 As shown, the cover plate 11 is elongated.

[0041] In this embodiment, the cover plate 11 is elongated and adapts to the arrangement of several memory modules and several processors on the motherboard 13, which can efficiently cover the core heat-generating components and optimize space utilization.

[0042] This utility model discloses a flip-top type water-cooling plate, which includes a cover plate, a bracket, and a main board. The cover plate is rotatably connected to the bracket, and the bracket is fixedly connected to the main board. The cover plate includes an upper cover plate and a lower cover plate. After being sealed together, the upper cover plate and the lower cover plate enclose a central water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the central water chamber. The central water chamber is provided with an inlet pipe, and each edge water chamber is provided with an outlet pipe. Two processor water chambers are arranged below the lower cover plate. The side of each processor water chamber closest to the central water chamber is connected to the central water chamber to receive the refrigerant from the central water chamber. The side of each processor water chamber furthest from the central water chamber is connected to the corresponding edge water chamber to deliver the refrigerant to the corresponding edge water chamber. The main board is provided with several memory modules and several processors. The memory modules are all located in the central water chamber, and the processors are all located in the processor water chamber. In this embodiment of the invention, the refrigerant enters the middle water chamber through the inlet pipe, completes heat exchange with the memory, and then flows downward into the processor water chamber to dissipate heat from the processor. After the processor water chamber is full, the refrigerant is heated and rises to the edge water chamber, and finally flows out through the outlet pipe. This refrigerant path of "heat exchange with the memory first, then with the processor" can avoid the memory from overheating and failing due to high heat from the processor, effectively ensuring the stable operation of the components and improving heat dissipation efficiency.

[0043] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A flip-top type water-cooling plate, characterized in that, The flip-type water-cooling plate includes a cover plate, a bracket, and a main board. The cover plate is rotatably connected to the bracket, and the bracket is fixedly connected to the main board. The cover plate includes an upper cover plate and a lower cover plate. After the upper cover plate and the lower cover plate are sealed together, they enclose a middle water chamber and two edge water chambers. The two edge water chambers are symmetrically arranged on both sides of the middle water chamber. A water inlet pipe is provided on the middle water chamber, and a water outlet pipe is provided on each of the edge water chambers. Two processor water chambers are provided below the lower cover plate. The side of each processor water chamber closest to the middle water chamber is connected to the middle water chamber to receive the refrigerant from the middle water chamber. The side of each processor water chamber furthest from the middle water chamber is connected to the corresponding edge water chamber to deliver the refrigerant to the corresponding edge water chamber. The motherboard is equipped with several memory modules and several processors. The memory modules are located in the same position as the intermediate water chamber, and the processors are located in the same position as the processor water chamber.

2. The flip-type water-cooling plate according to claim 1, characterized in that, The highest point of the intermediate water chamber is consistent with the highest point of the edge water chamber.

3. The flip-type water-cooling plate according to claim 1, characterized in that, The lowest point of the intermediate water chamber is higher than the lowest point of the edge water chamber.

4. The flip-type water-cooling plate according to claim 1, characterized in that, The processor water chamber is provided with multiple water channels on the side near the intermediate water chamber, and the refrigerant in the intermediate water chamber flows to the processor water chamber through the multiple water channels respectively.

5. The flip-type water-cooling plate according to claim 1, characterized in that, Each of the processor water chambers has a connecting groove on the side away from the intermediate water chamber, through which the processor water chamber supplies refrigerant to the corresponding edge water chamber.

6. The flip-type water-cooling plate according to claim 1, characterized in that, The bottoms of the edge water chambers each slope away from the middle water chamber.

7. The flip-type water-cooling plate according to claim 1, characterized in that, The upper cover plate is provided with a first central recess and two first edge recesses, and the lower cover plate is provided with a second central recess and two second edge recesses. The first central recess corresponds to the second central recess and has the same shape, and the first edge recess corresponds to the second edge recess one by one and has the same shape. After the upper cover plate and the lower cover plate are sealed together, the first intermediate recess and the second intermediate recess form the intermediate water chamber, and the first edge recess and the corresponding second edge recess form the corresponding edge water chamber.

8. The flip-type water-cooling plate according to claim 1, characterized in that, The cover plate is rotatably connected to the bracket via a hinge.

9. The flip-type water-cooling plate according to claim 1, characterized in that, The bracket is fixedly connected to the motherboard by screws.

10. The flip-type water-cooling plate according to claim 1, characterized in that, The cover plate is long and narrow.

Images