A high-efficiency heat dissipation case

Abstract

The utility model belongs to the technical field of case, and disclose a high -efficient heat dissipation's case, including the box, the upper surface of box is equipped with heat abstractor, one side of box is equipped with cooling mechanism, cooling mechanism includes the mounting panel, and the one side fixed connection of mounting panel and box, the one side of mounting panel is equipped with a plurality of cooling fins that is perpendicular distribution fixedly, the inside fixed of one side of box is equipped with mounting bracket, the inside fixed of mounting bracket is equipped with a plurality of heat conduction strip, and one side of heat conduction strip is fixedly connected with one side of mounting panel, and one end of a plurality of heat conduction strips is commonly fixed with the connecting frame, the utility model discloses a cooling mechanism, can fast conduct away the heat that electronic equipment produced, utilizes cooling fin to increase the heat dissipation area, effectively reduces the temperature in the case, and through heat abstractor, the air flow of operating cooling fan accelerates to export the heat effectively from the case, guarantees the stable operation of electronic equipment in the case.

Description

Technical Field

[0001] This utility model belongs to the field of chassis technology, specifically a chassis with high-efficiency heat dissipation. Background Technology

[0002] Highly efficient heat dissipation chassis are particularly suitable for scenarios with extremely high requirements for equipment operational stability and those prone to generating large amounts of heat, such as large data centers where numerous servers operate day and night, generating massive amounts of heat. This chassis can quickly dissipate heat, preventing servers from crashing due to overheating. In gaming studios, multiple high-performance gaming PCs run demanding games simultaneously, generating significant heat. This chassis can effectively dissipate heat, ensuring stable operation of the PCs and preventing lag or crashes due to high temperatures, thus ensuring a smooth gaming experience. In the field of industrial control, some high-precision industrial control computers need to operate continuously for extended periods. The chassis's efficient heat dissipation capabilities can maintain stable computer operation, reduce failures caused by overheating, and ensure the normal operation of industrial production.

[0003] However, the following problems were found in the implementation of the relevant technologies: In existing technologies, many computer cases suffer from inadequate heat dissipation designs and lack effective heat conduction mechanisms. This makes it difficult to quickly dissipate the heat generated by electronic devices during operation, leading to heat buildup and a rapid increase in temperature inside the case. High-temperature environments not only accelerate the aging of electronic components and reduce their lifespan, but can also cause performance degradation, lag, or even system crashes due to overheating, severely impacting normal operation and efficiency. Furthermore, some computer cases have poor airflow designs, failing to create effective air convection and expel hot air promptly. This keeps the inside of the case at a consistently high temperature, increasing the probability of malfunctions and potentially creating safety hazards. Utility Model Content

[0004] To address the problems mentioned in the background section, this invention provides a high-efficiency heat dissipation chassis with the advantages of rapid heat conduction and effective heat dissipation. This invention utilizes a cooling mechanism to quickly conduct heat generated by electronic devices, increases the heat dissipation area using cooling fins to effectively reduce the internal temperature of the chassis, and further accelerates airflow through the cooling fan, thereby effectively expelling heat from the chassis and ensuring the stable operation of the electronic devices inside.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation chassis, including a chassis body, a heat dissipation mechanism on the upper surface of the chassis body, a cooling mechanism on one side of the chassis body, the cooling mechanism including a mounting plate, the mounting plate being fixedly connected to one side of the chassis body, a plurality of vertically distributed cooling fins being fixedly provided on one side of the mounting plate, a mounting bracket being fixedly provided inside one side of the chassis body, a plurality of heat-conducting strips being fixedly provided on the inner side of the mounting bracket, one side of the heat-conducting strips being fixedly connected to one side of the mounting plate, a connecting bracket being fixedly provided at one end of the plurality of heat-conducting strips, and an electronic device being provided on the lower inner wall of the chassis body, the upper surface of the electronic device being fixedly engaged with the connecting bracket.

[0006] Preferably, the heat dissipation mechanism includes a ventilation plate, the lower surface of which is fixedly fitted to the housing, a heat dissipation plate on the upper surface of the ventilation plate, heat dissipation grooves on the upper surface of the heat dissipation plate, and two mounting brackets fixedly mounted on the lower surface of the heat dissipation plate, with a cooling fan fixedly mounted inside the mounting brackets.

[0007] Preferably, the box body is provided with fixing frames on both sides.

[0008] Preferably, a cooling opening is provided on one side of the housing, and the inner side of the cooling opening is in contact with the heat-conducting strip.

[0009] Preferably, one side of the housing has multiple connection ports.

[0010] Preferably, the upper surface of the ventilation plate is provided with a plurality of fixing bolts arranged in a rectangular array, and the fixing bolts are fixedly engaged with the housing.

[0011] Preferably, the upper surface of the ventilation plate and the lower surface of the box are provided with multiple ventilation slots.

[0012] Preferably, the upper surface of the ventilation plate has two assembly openings, and the inner side of the assembly opening is in contact with the outer side of the assembly frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. This utility model can quickly conduct away the heat generated by electronic equipment through a cooling mechanism, and increase the heat dissipation area by using cooling fins to effectively reduce the internal temperature of the chassis.

[0014] 2. This utility model uses a heat dissipation mechanism and a cooling fan to accelerate airflow, thereby effectively dissipating heat from the chassis and ensuring the stable operation of electronic equipment inside the chassis. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the internal structure of this utility model; Figure 3 This is a schematic diagram of the cooling mechanism of this utility model; Figure 4 This is a schematic diagram of the heat dissipation mechanism of this utility model.

[0016] In the diagram: 1. Housing; 2. Cooling mechanism; 3. Heat dissipation mechanism; 4. Fixing bracket; 20. Mounting plate; 21. Cooling fins; 22. Cooling opening; 23. Connection port; 24. Electronic equipment; 25. Connecting bracket; 26. Mounting bracket; 27. Heat conduction strip; 30. Ventilation plate; 31. Assembly opening; 32. Assembly bracket; 33. Cooling fan; 34. Heat dissipation plate; 35. Heat dissipation groove; 36. Ventilation groove; 37. Fixing bolt. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] like Figures 1 to 4 As shown, this utility model provides a high-efficiency heat dissipation chassis, including a chassis 1. A heat dissipation mechanism 3 is provided on the upper surface of the chassis 1, and a cooling mechanism 2 is provided on one side of the chassis 1. The cooling mechanism 2 includes a mounting plate 20, which is fixedly connected to one side of the chassis 1. Multiple vertically distributed cooling fins 21 are fixedly provided on one side of the mounting plate 20. A mounting bracket 26 is fixedly provided inside one side of the chassis 1, and multiple heat-conducting strips 27 are fixedly provided on the inner side of the mounting bracket 26. One side of the heat-conducting strips 27 is fixedly connected to one side of the mounting plate 20. A connecting bracket 25 is fixedly provided at one end of each of the multiple heat-conducting strips 27. An electronic device 24 is provided on the lower inner wall of the chassis 1, and the upper surface of the electronic device 24 is fixedly fitted to the connecting bracket 25. When the chassis is working, the electronic device 24 on the lower inner wall of the chassis 1 generates a large amount of heat. This heat is conducted to the multiple heat-conducting strips 27 through the connecting bracket 25. The heat-conducting strips 27 transfer the heat to the mounting plate 20, which is fixedly connected to them. The multiple vertically distributed cooling fins 21 on one side of the mounting plate 20 increase the heat dissipation area. When air flows outside the chassis, it exchanges heat with the cooling fins 21, carrying away the heat from the cooling fins 21. At the same time, the cooling opening 22 on one side of the chassis 1 is in close contact with the heat conduction strip 27, which helps the heat to dissipate from the heat conduction strip 27, thereby quickly reducing the internal temperature of the chassis.

[0019] Specifically, the heat dissipation mechanism 3 includes a ventilation plate 30, the lower surface of which is fixedly fitted to the chassis 1. A heat dissipation plate 34 is provided on the upper surface of the ventilation plate 30, and heat dissipation grooves 35 are formed on the upper surface of the heat dissipation plate 34. Two mounting brackets 32 are fixedly mounted on the lower surface of the heat dissipation plate 34, and cooling fans 33 are fixedly mounted inside the mounting brackets 32. When the chassis is in operation, the ventilation plate 30 and the multiple ventilation grooves 36 on the lower surface of the chassis 1 form an airflow channel, allowing external air to enter the chassis through the ventilation grooves 36. At this time, the cooling fans 33 inside the mounting brackets 32 on the lower surface of the heat dissipation plate 34 begin to operate, accelerating the airflow speed within the chassis. As the air flows through the heat dissipation grooves 35 on the upper surface of the heat dissipation plate 34, it carries away the heat from the chassis and exhausts it outside the chassis through the ventilation grooves 36, achieving effective heat dissipation and ensuring the stable operation of the electronic equipment 24 inside the chassis.

[0020] Furthermore, the mounting brackets 4 on both sides of the enclosure 1 provide stable support and installation position for the enclosure, making it easy to fix the enclosure in various working environments, such as cabinets and workbenches, thereby enhancing the stability and applicability of the enclosure and preventing the enclosure from shaking or shifting and affecting the normal operation of the internal electronic equipment 24.

[0021] Furthermore, the cooling opening 22 on one side of the enclosure 1 is in contact with the heat conduction strip 27, providing a channel for the heat conduction strip 27 to directly contact the outside air, so that the heat on the heat conduction strip 27 can be dissipated to the outside of the enclosure more quickly and efficiently, further improving the heat dissipation efficiency of the cooling mechanism 2 and effectively reducing the internal temperature of the enclosure.

[0022] It is worth noting that the multiple connection ports 23 on one side of the chassis 1 facilitate data transmission, power connection, and other operations between the chassis and external devices. Different types of connection ports 23 can meet the connection needs of various devices, improving the chassis's compatibility and expandability, and allowing users to connect various external devices according to their actual needs.

[0023] It is worth noting that the multiple fixing bolts 37 arranged in a rectangular array on the upper surface of the ventilation plate 30 are fixedly engaged with the housing 1, which can firmly install the ventilation plate 30 on the housing 1, ensuring that the ventilation plate 30 will not loosen or shift during operation, thus ensuring the stability and reliability of the heat dissipation mechanism 3 and thus continuously and effectively playing its heat dissipation role.

[0024] It is worth mentioning that multiple ventilation slots 36 are formed on the upper surface of the ventilation plate 30 and the lower surface of the chassis 1, creating a good air circulation channel. Under the action of the cooling fan 33, the air can circulate smoothly inside and outside the chassis, accelerating the exchange and dissipation of heat, improving the heat dissipation effect of the heat dissipation mechanism 3, and helping to maintain a suitable operating temperature inside the chassis.

[0025] It is worth emphasizing that the two mounting openings 31 on the upper surface of the ventilation plate 30 fit snugly against the outer side of the mounting bracket 32, providing precise positioning and stable support for the installation of the cooling fan 33. This design allows the cooling fan 33 to be easily and quickly installed on the ventilation plate 30, while ensuring the stability of the cooling fan 33 during operation, reducing noise caused by vibration, and improving the overall performance of the heat dissipation mechanism 3.

[0026] The cooling fan 33 and electronic device 24 are existing technologies and will not be described in detail. Additionally, this utility model also includes a power supply, controller, and switch, which are not the main technical points of this patent and will not be described in detail. The "front, back, left, and right" views of this device are... Figure 1 The direction shown in the diagram is the reference.

[0027] Working principle: When the chassis is in operation, the electronic equipment 24 on the lower inner wall of the chassis 1 generates a large amount of heat. This heat is conducted through the connecting bracket 25 to multiple heat-conducting strips 27. The heat-conducting strips 27 transfer the heat to the mounting plate 20, which is fixedly connected to them. Multiple cooling fins 21 vertically distributed on one side of the mounting plate 20 increase the heat dissipation area. When air flows outside the chassis, it exchanges heat with the cooling fins 21, carrying away the heat from the cooling fins 21. At the same time, the cooling opening 22 on one side of the chassis 1 is in close contact with the heat-conducting strips 27, which facilitates the dissipation of heat from the heat-conducting strips 27, thereby quickly reducing the internal temperature of the chassis.

[0028] When the chassis is in operation, the ventilation plate 30 and the multiple ventilation slots 36 on the lower surface of the chassis 1 form an airflow channel, allowing external air to enter the chassis through the ventilation slots 36. At this time, the cooling fan 33 inside the mounting bracket 32 ​​on the lower surface of the heat sink 34 starts operating, accelerating the airflow speed within the chassis. As the air flows through the heat sink slots 35 on the upper surface of the heat sink 34, it carries away the heat from inside the chassis and exhausts it outside the chassis through the ventilation slots 36, achieving effective heat dissipation and ensuring the stable operation of the electronic equipment 24 inside the chassis.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation chassis, comprising a chassis (1), wherein a heat dissipation mechanism (3) is provided on the upper surface of the chassis (1), and a cooling mechanism (2) is provided on one side of the chassis (1); characterized in that: The cooling mechanism (2) includes a mounting plate (20), which is fixedly connected to one side of the housing (1). A plurality of vertically distributed cooling fins (21) are fixedly provided on one side of the mounting plate (20). A mounting bracket (26) is fixedly provided inside one side of the housing (1). A plurality of heat-conducting strips (27) are fixedly provided on the inner side of the mounting bracket (26). One side of the heat-conducting strips (27) is fixedly connected to one side of the mounting plate (20). One end of the plurality of heat-conducting strips (27) is fixedly provided with a connecting bracket (25). An electronic device (24) is provided on the lower inner wall of the housing (1). The upper surface of the electronic device (24) is fixedly engaged with the connecting bracket (25).

2. The high-efficiency heat dissipation chassis according to claim 1, characterized in that: The heat dissipation mechanism (3) includes a ventilation plate (30), the lower surface of which is fixedly fitted with the housing (1), the upper surface of which is provided with a heat dissipation plate (34), the upper surface of which is provided with a heat dissipation groove (35), the lower surface of which is fixedly provided with two mounting brackets (32), and the interior of which is fixedly provided with a cooling fan (33).

3. The high-efficiency heat dissipation chassis according to claim 1, characterized in that: The box (1) is equipped with a fixing frame (4) on both sides.

4. The high-efficiency heat dissipation chassis according to claim 1, characterized in that: A cooling opening (22) is provided on one side of the box (1), and the inner side of the cooling opening (22) is in contact with the heat-conducting strip (27).

5. The high-efficiency heat dissipation chassis according to claim 1, characterized in that: The box (1) has multiple connection ports (23) on one side.

6. The high-efficiency heat dissipation chassis according to claim 2, characterized in that: The upper surface of the ventilation plate (30) is provided with a plurality of fixing bolts (37) arranged in a rectangular array, and the fixing bolts (37) are fixedly engaged with the box body (1).

7. The high-efficiency heat dissipation chassis according to claim 2, characterized in that: Multiple ventilation slots (36) are provided on the upper surface of the ventilation plate (30) and the lower surface of the box (1).

8. The high-efficiency heat dissipation chassis according to claim 2, characterized in that: The upper surface of the ventilation plate (30) has two assembly openings (31), and the inner side of the assembly opening (31) is in contact with the outer side of the assembly frame (32).

Images